JP2013529258A - Side emission type linear evaporation source, manufacturing method thereof, and linear evaporator - Google Patents

Abstract

The present invention relates to a side-emitting linear evaporation source, its manufacture and a linear evaporator. A linear evaporation source having a discharge port formed on a side surface of an evaporation source, which is composed of a crucible and a heat generating part in an evaporation system using a method of heating a crucible in vacuum and depositing a material discharged from the crucible on a substrate. The present invention relates to a method for manufacturing the linear evaporation source and a linear evaporator. In the present invention, a line including a PBN emitting portion for an evaporation device, a heat generating portion deposited on the outer surface of the emitting portion and patterned so as to be heated, and a plurality of emitting ports formed on a side surface of the emitting portion. A vaporized evaporation source, a method for its production and a linear evaporator are presented.
[Selection] Figure 3

Description

The present invention relates to a crucible and a heat generating part in an evaporation system such as an organic light emitting diode (OLED) vapor deposition apparatus using a method in which a crucible is heated from a vacuum and a material emitted from the crucible is deposited on a substrate. A linear effusion cell with side orifice array, a method of manufacturing linear effusion cell with side orifice array, and a linear evaporator (evaporator) About.
More specifically, a heat-generating substance is deposited on the outer surface of the discharge portion and is patterned so as to be suitable for heating. The heat-generation portion has a plurality of discharge openings on the side surface of the discharge portion. A linear evaporation source in which a source material is discharged to the side surface of the crucible through a plurality of discharge ports formed on the side surface of the discharge portion that is in direct contact with the heat generating portion by injecting current into the portion, a manufacturing method thereof, and Relates to a linear evaporator.

Common methods for forming thin films on substrates include physical vapor deposition (PVD) methods such as vacuum evaporation, ion plating, and sputtering, and gas reactions. There is a chemical vapor deposition (CVD) method. The organic light emitting diode thin film growth apparatus grows a thin film by depositing an organic substance constituting the organic light emitting diode on a substrate by a vacuum deposition method.
In addition, a metal such as aluminum is deposited using a vacuum deposition method for forming an electrode in an organic light emitting diode.

As described above, in a general vapor deposition apparatus for vapor-depositing an organic film and a metal film using a vacuum vapor deposition method, a substrate is mounted on the upper part of the vapor deposition chamber, and an evaporation source is disposed on the lower part of the vapor deposition chamber. The evaporation source includes a crucible containing a vapor deposition material and a heat generating unit that is installed outside the crucible and acts as a heat source for evaporating the vapor deposition material. When a power source is applied to the heat generating part of the evaporation source described above, the crucible and the material substance inside the crucible are heated, and the evaporated material substance is discharged to the upper opening of the crucible and applied to the substrate mounted on the inner upper part of the chamber. By vapor deposition, an organic film or a metal film is formed on the substrate.
Regarding the above-mentioned evaporation source, there is an invention of “a molecular beam evaporation source for heat generating part integrated vacuum thin film deposition, its manufacturing method and an evaporator” of Korean Patent Application No. 10-2009-1114068 filed by the present applicant. The invention of the above-mentioned patent application is a crucible made of PBN for putting the material used in a vapor deposition system for vapor-depositing a material such as an organic substance on a sample in a vacuum, and a heating part directly on the outer surface of the PBN crucible. The present invention relates to a heat generating part integrated evaporation source that heats a crucible by conduction and increases thermal efficiency by heating by vapor deposition and simplifies the structure.

  However, when the size of the organic light emitting diode substrate is increased and the substrate is mounted on the upper portion, there is a problem that bending becomes severe and the uniformity of the deposited material is lowered, which makes it difficult to handle. Therefore, if the large substrate is mounted at an angle of about 20 degrees or less from the vertical (hereinafter, the vertical and inclined at an angle of about 20 degrees or less is also referred to as vertical) or mounted at the bottom, it is handled without bending. Easy to do. The evaporation source has a problem in that the material substance cannot be deposited on the substrate mounted vertically or below because the material substance is discharged through the upper opening.

  Accordingly, there is a need for the development of a side emission linear evaporation source that can efficiently supply a source material to a substrate mounted vertically or mounted on a lower portion.

  The present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is to provide a material on a side surface that can be used in a system in which a substrate is mounted vertically and a thin film is deposited in-line. It is to provide a linear evaporation source for discharge, a method of manufacturing the linear evaporation source, and a linear evaporator.

  As a technical solution for achieving the above object of the present invention, the first aspect of the present invention is to provide a PBN for containing the above materials used in a vapor deposition system for vapor depositing materials such as organic substances and metals on a sample in a vacuum. A crucible manufactured in the above, a first heat generating part composed of a PG patterned and deposited on the outer surface of the PBN crucible, and passing through the PBN crucible and the PG first heat generating part. A side emission type linear evaporation source including a plurality of emission ports formed on a side surface of a crucible is presented.

  The second aspect of the present invention is suitable for heating a crucible made of PBN for putting the material used in a vapor deposition system for depositing a material such as an organic substance on a sample in vacuum, and an external surface of the PBN crucible. The first heat generating part composed of PG patterned and deposited as described above, and deposited to protect the crucible from a sample deposited on the inner surface of the PBN crucible and well adhered to PBN such as aluminum. A first protective film made of PG; an insulating part for electrically insulating the first heat generating part and the first protective film; the PBN crucible; the PG first heat generating part; and the first protective film. A side emission type linear evaporation source including a plurality of emission ports formed on the side surface of the crucible through the crucible is presented. Some materials, such as aluminum, are attached to the PBN crucible while changing from a liquid state to a solid state during cooling, and the crucible is damaged due to the difference in thermal expansion coefficient between the sample and the crucible when the crucible is cooled. There is. Since such a sample does not adhere well to PG, the problem of crucible breakage can be solved by forming a protective film made of PG inside the crucible.

  A third aspect of the present invention is the invention according to the first aspect of the present invention, wherein the PBN lid for covering the opening of the PBN crucible and the outer surface of the PBN lid are patterned so as to be suitable for heating. A side emission type linear evaporation source including a second heat generating part composed of vapor-deposited PG is presented.

  A fourth aspect of the present invention is the invention according to the second aspect of the present invention, wherein the PBN lid for covering the opening of the PBN crucible and the outer surface of the PBN lid are patterned so as to be suitable for heating. A second heat generating part composed of vapor-deposited PG and a second heat-generating part composed of PG for protecting the crucible from a sample which is vapor-deposited on the inner surface of the PBN lid and adheres well to PBN such as aluminum. A side emission linear evaporation source including a protective film and an insulating part for electrically insulating the second heat generating part and the second protective film is presented.

  According to a fifth aspect of the present invention, there is provided an evaporating unit including a first heat generating unit composed of a crucible made of PBN, a PG patterned and deposited on the external surface of the PBN crucible to be heated, and a PBN. A second heat generating part composed of a PG deposited on the outer surface of the PBN emitting part and deposited on the outer surface of the PBN emitting part, and the PBN emitting part and the PG second heat generating part. A side emission type linear evaporation source composed of an emission part including a plurality of emission ports penetrating through and formed on a side surface of the emission part is presented.

  A sixth aspect of the present invention is the invention of the fifth aspect of the present invention, wherein the crucible is protected from a sample which is vapor-deposited on the inner surfaces of the PBN crucible and the PBN discharge part and adheres well to PBN such as aluminum. A side emission linear evaporation source including a protective film made of PG is provided.

According to a seventh aspect of the present invention, there is provided a method for manufacturing the side emission linear evaporation source according to the first to sixth aspects of the present invention.

  According to an eighth aspect of the present invention, there is provided a linear evaporator that utilizes a power supply electrode in a support when the side emission linear evaporation source is mounted on a vacuum flange.

  According to a ninth aspect of the present invention, the contact area is minimized in order to prevent the linear evaporation source from being moved or damaged by force when the side emission linear evaporation source is mounted on the vacuum flange. A linear evaporator is further provided that further includes a spacing device (spacer) designed to be such.

  According to a tenth aspect of the present invention, when the side-emission linear evaporation source is mounted on a vacuum flange, the current is distributed while the force is distributed while the linear evaporation source and the electrode are fixed, and a uniform current is generated in the heat generating portion. A linear evaporator is further included that further includes a spreader for supplying the water.

  According to the side emission type linear evaporation source of the present invention, a material substance can be uniformly distributed even to a large substrate by efficiently discharging the material substance in the side direction by a system in which the substrate is vertically mounted and vacuum-deposited in-line. There exists an effect which can be vapor-deposited easily.

It is a schematic block diagram regarding the 1st Example of the side emission type linear evaporation source of this invention. It is a schematic block diagram regarding 2nd Example of the side emission type | mold linear evaporation source of this invention. It is a schematic block diagram regarding the 3rd Example of the side emission type linear evaporation source of this invention. It is a schematic block diagram regarding the 4th Example of the side emission type linear evaporation source of this invention. It is a block diagram regarding the conventional evaporator. It is a schematic block diagram regarding the Example of the linear evaporator using the side emission type | mold linear evaporation source of this invention. It is a schematic block diagram regarding the Example of the linear evaporator using the side emission type linear evaporation source of this invention, making a vacuum flange located in the upper part. It is a figure explaining 1st Example of the manufacturing method of the side emission type linear evaporation source of this invention. It is a figure explaining 2nd Example of the manufacturing method of the side emission type | mold linear evaporation source of this invention. It is a figure explaining the 3rd Example of the manufacturing method of the side emission type linear evaporation source of the present invention. It is a figure explaining the 4th Example of the manufacturing method of the side emission type linear evaporation source of the present invention.

  Hereinafter, the configuration of the invention relating to the embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 5 is a schematic configuration diagram of an existing general evaporator.
As shown in FIG. 5, the conventional evaporation source is a crucible 1, a heat blocking film 2, a heater 3 installed between the crucible 1 and the heat blocking film 2, a thermocouple 4, a lower heat blocking film 5, a vacuum flange. 6 includes a power supply electrode 7 and a power connector 8. The heat generating part of an existing general evaporation source surrounds the side surface of the crucible while being isolated from the crucible, so that a discharge port cannot be formed on the side surface of the crucible, and the material substance passes through the upper opening. Released.

  FIG. 1 is a schematic configuration diagram relating to a first embodiment of a side emission type linear evaporation source according to the present invention.

  As shown in FIG. 1A, in a vapor deposition system for depositing materials such as organic substances and metals on a sample in a vacuum, it was made of PBN (Pyrolytic Boron Nitride) for containing the material 30. A crucible 10, a first heating unit 20 composed of PG (Pyrolytic Graphite) patterned and deposited on the outer surface of the PBN crucible 10 to suit heating, the PBN crucible 10 and the PBN crucible 10 a plurality of discharge ports 40 formed on the side surface through the PG 20 deposited on the external surface, a lid body 50 made of PBN covering the opening of the PBN crucible 10, and the PBN lid body 50. The second heat generating portion 60 is formed of PG deposited by patterning (for example, a symmetric pattern) so as to be suitable for heating on the outer surface of the substrate.

  When the voltage is applied to the first heat generating unit 20 and the second heat generating unit 60, the PBN cover 50 is maintained so that the temperature of the PBN cover 50 is higher than or equal to the temperature of the PBN crucible 10. The ratio of the PG thickness of the second heat generating part 60 deposited on 50 to the PG thickness of the first heat generating part 20 deposited on the PBN crucible 10 and the pattern of the first and second heat generating parts are adjusted. It is preferable.

FIG. 1B is a schematic view of a cross section taken along line AA ′ of FIG. 1A.
An example of the form of the first heat generating part is as shown in the schematic diagram of the AA ′ cross section, about the width from the bottom of the side to the top of the side in the direction perpendicular to the discharge port in the side of the crucible. It can be formed by removing a part of the heat generating part composed of PG of 0.5 mm or less. In such a structure, the resistance near the discharge port is increased, thereby obtaining a temperature distribution having the highest temperature in the vicinity of the discharge port as compared with other portions, and thus a preferable temperature distribution can be easily obtained with a simple symmetrical pattern. can get.

  As in the first embodiment of the present invention, by directly depositing PG on the outer surface of the PBN crucible 10, an integrated linear evaporation source having the first heat generating part 20 and the PBN crucible 10 is realized. The plurality of discharge ports 40 can be easily formed on the side surface of the linear evaporation source.

  Since the pressure decreases as it goes to the upper part of the crucible, the thickness of the material deposited on the substrate can be made uniform by narrowing the interval between the upper discharge ports or increasing the holes of the upper discharge ports. it can.

  It is preferable that the height of the portion where the discharge port is formed is slightly higher than the height of the substrate as the deposition is performed on the entire surface of the facing substrate deposited in-line.

FIG. 2 is a schematic configuration diagram of a second embodiment of the side emission type linear evaporation source according to the present invention.
As shown in FIG. 2, in the second embodiment of the present invention, the PG is deposited on the inner surface of the PBN crucible 10 and the PBN lid 50 and the surface of the discharge port 40 in the first embodiment. A protective film is formed. The second embodiment of the present invention is based on the PG deposited on the inner surface of the PBN crucible 10 and the surface of the discharge port 40 in order to protect the PBN crucible 10 from a sample well adhered to PBN such as aluminum. In order to electrically insulate the first heat generating part 20 and the first protective film 70 around the first protective film 70 and the discharge port 40, the first insulating part 80 from which PG is removed. And a second insulating part 100 from which PG is removed in order to electrically insulate the first heat generating part 20 and the first protective film 70 at the upper end of the PBN crucible 10, and the PBN lid 50 A second protective film 90 made of PG deposited on the inner surface of the second insulating film 110, and a third insulating part 110 from which PG is removed to electrically insulate the second heat generating part 60 and the second protective film 90 from each other. It is the structure containing.

The first insulating part 80 and the second insulating part 100 are formed by, for example, forming a side discharge port 40 in the PBN crucible 10 and then depositing PG on the inside and outside of the PBN crucible 10 to form the first heat generation. The first insulating part 80 and the second insulating part 100 can be formed by removing a part of the deposited PG so that the part 20 and the first protective film 70 are electrically insulated.
In another example, after forming the heat generating portion as in the first embodiment, the portion excluding the electrode contact portion is deposited on the PBN, and then the PG protective film is formed on the inner surface of the crucible and the discharge port. You can also

  The third insulating part 110 may be formed by, for example, depositing PG on the inside and outside of the PBN lid 50 so that the second heat generating part 60 and the second protective film 90 are electrically insulated. It can be formed by removing a part of the deposited PG.

  The second embodiment of the present invention can prevent the PBN crucible 10 from being damaged due to the difference in thermal expansion coefficient when cooling the material 30 adhered to the PBN such as aluminum. Can be frozen. For example, when there is no protective film in a crucible of 500 cc or more, it takes 8 hours or more to cool to 100 degrees Celsius at a temperature higher than 660 degrees Celsius, which is the melting point of aluminum. Cooling can be done in a short period of time.

  FIG. 3 is a schematic diagram showing a third embodiment of the side emission type linear evaporation source according to the present invention.

  As shown in FIG. 3, in a vapor deposition system for depositing materials such as organic substances and metals on a sample in a vacuum, it was made of PBN (Pyrolytic Boron Nitride) for containing the material 30. A crucible 10, a first heating part 20 composed of PG (Pyrolytic Graphite) patterned and deposited on the outer surface of the PBN crucible 10 to be heated, and an opening of the PBN crucible 10 A discharge part 200 made of PBN covering, and a second heating part 220 made of PG deposited on the outer surface of the PBN discharge part 200 by patterning (for example, symmetrical pattern) so as to be suitable for heating, The PBN discharge unit 200 and a plurality of discharge ports 240 formed on the side surface through the PG 220 are deposited on the outer surface of the PBN discharge unit 200. That.

  When the voltage is applied to the first heat generating unit 20 and the second heat generating unit 220, the PBN discharging unit 200 is maintained such that the temperature of the PBN discharging unit 200 is higher than or equal to the temperature of the PBN crucible 10. It is preferable to adjust the ratio of the thickness of the second heat generating part 220PG deposited on the first heat generating part 20PG deposited on the PBN crucible 10 and the pattern of the first and second heat generating parts.

  Since the pressure becomes lower toward the upper part of the discharge part, the thickness of the substance deposited on the substrate is made uniform by narrowing the interval between the upper discharge holes or increasing the hole of the upper discharge hole. Can do.

  It is preferable that the height of the portion where the discharge port is formed is slightly higher than the height of the substrate so that vapor deposition can be performed on the entire surface of the facing substrate deposited in-line.

  FIG. 4 is a schematic configuration diagram of a fourth embodiment of the side emission type linear evaporation source according to the present invention.

  As shown in FIG. 4, the fourth embodiment of the present invention includes the second embodiment on the inner surface of the PBN crucible 10 and the PBN discharge part 200 and the surface of the discharge port 240 in the third embodiment. Thus, the protective films 70 and 270 are formed by vapor-depositing the PG.

FIG. 6 is a schematic diagram of a fifth embodiment of the linear evaporator using the side emission type linear evaporation source disclosed in the fourth embodiment of the present invention.
As shown in FIG. 6A, the side emission linear evaporation source of the present invention can be mounted on a vacuum flange 400 on which a power supply electrode 600 and a thermocouple (T / C) electrode 300 are mounted. it can. At this time, the power supply electrode 600 is connected so that power can be supplied to the first heat generating unit 20 and the second heat generating unit 220, and the thermocouple electrode 300 can measure the temperature of the linear evaporation source. Connected.
The structure can be simplified by using the power supply electrode 600 on a support base. The electrodes are arranged so that the side discharge port 240 is located far from the two electrodes so that the power supply electrode 600 does not interfere with the side discharge port 240.

  The linear evaporator is brought into contact with the spacers 500a and 500b installed on the lower side and the upper side of the side emission type linear evaporation source of the present invention and the bottom surface first heating unit 20 of the linear evaporation source. A thermocouple (T / C) electrode 300 to be installed, a vacuum flange 400 installed at a predetermined distance from the lower side of the linear evaporation source, and an outlet of the linear evaporation source A pair of power supply electrodes 600 installed so as to be in contact with the first heat generating unit 20 and the second heat generating unit 220 through the spacers 500a and 500b with a 240 therebetween, and a first heat generation The disperser 700a is located below the electrode contact part of the part 20, and the disperser 700b is located above the electrode contact part of the second heat generating part 220.

  FIG. 6B is a schematic view of the spacer of FIG. 6A.

  The spacers 500a and 500b serve to fix the linear evaporation source so that the linear evaporation source does not move, and contact with a structure that minimizes contact with the linear evaporation source in order to minimize the heat loss chamber. Part 520 and through hole 511-514 through which power supply electrode 600 passes.

  FIG. 6C is a schematic diagram of the disperser of FIG. 6A.

  The dispersers 700a and 700b serve to disperse the force by preventing the weight of the linear evaporation source from concentrating on the electrode contact portion. In addition, the current is prevented from being concentrated at one place, so that heat is uniformly generated from the heat generating portion. The dispersers 700a and 700b include through holes 711-714 through which the power supply electrode 600 passes, as shown in FIG. 6C.

  The disperser is preferably made of graphite. However, it can be made of a metal such as molybdenum having excellent high temperature characteristics.

  FIG. 7 is a schematic diagram showing a sixth embodiment of the linear evaporator using the side emission type linear evaporation source posted in the fourth embodiment of the present invention.

  As shown in FIG. 7A, unlike the fifth embodiment, it is a configuration of a linear evaporator in which a vacuum flange is mounted on an upper portion of a linear evaporation source. Accordingly, as shown in FIG. 7B, a through hole 530 through which a thermocouple (T / C) electrode 300 can pass, a through hole 511-514 through which a power supply electrode 600 on both sides can pass, and a contact portion 520 are included. Yes.

  FIG. 7C is a schematic configuration diagram relating to the dispersers 700a and 700b having a purpose as shown in FIG. 6C. As shown in FIG. 7C, the dispersers 700a and 700b include a through hole 730 through which a thermocouple (T / C) electrode 300 can penetrate, and a through hole 711 through which the power supply electrodes 600 on both sides can penetrate. 714 is included.

FIG. 8 is a diagram for explaining a first embodiment relating to a method for manufacturing a side emission type linear evaporation source according to the present invention.
As shown in FIG. 8, the method for manufacturing a side-emission type linear evaporation source according to the present invention includes a step of preparing a PBN crucible (S100) in manufacturing a linear evaporation source of a vacuum deposition system, and an outside of the PBN crucible. Forming a first heat generating layer by depositing PG on the surface (S110), and forming a plurality of discharge holes of a predetermined size on the side surface of the PBN crucible in the length direction of the PBN crucible (S120). And a step (S130) of forming a pattern (for example, a symmetrical pattern) suitable for heating on the first heat generating layer formed on the outer surface of the PBN crucible.

  The method for manufacturing a side emission type linear evaporation source according to the present invention includes a step of preparing a PBN lid for covering the upper opening of the PBN crucible (S140), and PG on the outer surface of the PBN lid. A step of forming a second heat generating layer by vapor deposition (S150) and a step of forming a pattern suitable for heating (for example, a symmetrical pattern) on the second heat generating layer formed on the outer surface of the PBN lid (S160). ). The second heat generating layer is preferably deposited by PG having a thickness of 1000 micrometers or less.

FIG. 9 is a diagram for explaining a second embodiment relating to the method for manufacturing a side emission type linear evaporation source of the present invention.
As shown in FIG. 9, the second embodiment relating to the production of the side emission type linear evaporation source according to the present invention is the first embodiment described above, and the PG is formed on the inner surface of the PBN crucible and the lower surface of the PBN lid. The protective film is further formed by vapor deposition.

  A second embodiment of the method for manufacturing a side emission type linear evaporation source according to the present invention includes a step of preparing a PBN crucible (S200) in manufacturing a linear evaporation source of a vacuum deposition system, and a predetermined size on a side surface of the PBN crucible. Forming a plurality of discharge ports in the length direction of the PBN crucible (S210), and depositing PG on the inside and outside surfaces of the PBN crucible to form the first heat generating layer and the inside on the outside surface of the PBN crucible. Forming a first protective film on the surface (S220), forming a pattern suitable for heating (for example, a symmetrical pattern) on the first heat generating layer formed on the outer surface of the PBN crucible (S230); Forming an insulating part that electrically insulates the first heat generating layer from the first protective film (S240).

  The method of manufacturing a side-emission type linear evaporation source according to the present invention includes a step (S250) of preparing a PBN lid body that covers the PBN crucible and has an outlet for evaporation (S250); PG is deposited on the inner and outer surfaces to form a second heat generating layer on the outer surface of the PBN lid and a second protective film on the inner surface (S260); and formed on the outer surface of the PBN lid. Forming a pattern suitable for heating (for example, a symmetrical pattern) on the second heat generating layer (S270), and an insulating portion for electrically insulating the second heat generating layer from the second protective film. Forming (S280).

FIG. 10 is a diagram for explaining a third embodiment relating to the method for manufacturing a side emission type linear evaporation source according to the present invention.
As shown in FIG. 10, the third embodiment of the method for manufacturing a side-emission type linear evaporation source according to the present invention includes a step of preparing a PBN crucible (S300), and depositing PG on the outer surface of the PBN crucible. Forming a first heat generating layer (S310), forming a pattern suitable for heating on the first heat generating layer formed on the outer surface of the PBN crucible (S320), and preparing a PBN discharge portion (S330), PG is deposited on the outer surface of the PBN emitting part to form a second heating layer (S340), and the second heating layer formed on the outer surface of the PBN emitting part is adapted for heating. Forming a pattern to be formed (S350), and forming a plurality of discharge ports of a predetermined size on the side surface of the PBN discharge part (S360).

FIG. 11 is a diagram for explaining a fourth embodiment relating to the method for manufacturing a side emission type linear evaporation source according to the present invention.
As shown in FIG. 11, the fourth embodiment of the method for manufacturing a side emission type linear evaporation source according to the present invention includes a step of preparing a PBN crucible (S400), and deposits PG on the inner and outer surfaces of the PBN crucible. Forming a first heat generating layer and a first protective film (S410), forming a pattern suitable for heating on the first heat generating layer formed on the outer surface of the PBN crucible (S420), and Forming an insulating part for electrical insulation between the first heat generating layer and the first protective film (S430), preparing a PBN discharge part covering the PBN crucible (S440), and the PBN; Forming a discharge port on a side surface of the emission part (S450), depositing PG on the inside and outside surfaces of the PBN emission part, and forming a second heat generating layer on the outer surface of the PBN emission part and a second on the inner surface; Step of forming a protective film ( 460), forming a pattern suitable for heating on the second heat generating layer formed on the outer surface of the PBN emitting part (S470), electrically connecting the second heat generating layer and the second protective film. Forming an insulating part for insulation (S480).

  The technical scope of the invention relating to the side emission type linear evaporation source and the manufacturing method thereof according to the present invention described above is not limited to the above-described embodiments and the like, and is included in the technical idea of the present invention. Naturally, it includes a variety of predictable examples. For example, in order to protect the heat generating part applied to the above-described embodiment of the present invention, PBN can be additionally deposited outside the first heat generating part and the second heat generating part. At this time, PBN is not deposited on the portion for connection with the power supply electrode. Further, instead of PG used for the heat generating part, a substance such as tungsten (W), molybdenum (Mo), titanium (Ti), etc., capable of generating heat at high temperature can be used. Further, in order to minimize the release of heat to the vacuum system with the above-described linear evaporator, a heat shielding film can be attached to the outside of the linear evaporator.

  DESCRIPTION OF SYMBOLS 10 ... PBN crucible, 20 ... 1st heat generating part, 30 ... Material (sample), 40, 240 ... Release port, 50 ... PBN cover body, 60, 220 ... 2nd Heat generating part, 70 ... first protective film, 90, 270 ... second protective film, 80, 100, 110 ... insulating part, 300 ... thermocouple electrode, 500a, 500b ... spacer 600 ... Power supply electrodes, 700a, 700b ... spreaders.

Claims (20)

In linear evaporation sources used in vacuum deposition systems,
A PBN (pyrolytic boron nitride) crucible with an open top to contain the material;
A first heat generating part deposited on the outer surface of the PBN crucible and formed with a pattern suitable for heating;
A side emission type linear evaporation source including a plurality of side emission ports formed through the side surface of the PBN crucible and the first heat generating portion. In claim 1,
A first protective film formed on the inner surface of the PBN crucible and the surface of the discharge port;
The side emission type linear evaporation source further comprising an insulating part for electrically insulating the first heat generating part and the first protective film. In claim 1,
A PBN lid that covers the opening of the PBN crucible;
A side-emission linear evaporation source further comprising a second heat generating part deposited on the outer surface of the PBN lid and formed with a pattern suitable for heating. In claim 3,
A first protective film deposited on the inner surfaces of the PBN crucible and the discharge port and electrically insulated from the first heat generating part;
A side emission linear evaporation source further comprising a second protective film deposited on the lower surface of the PBN lid and electrically insulated from the second heat generating part. In linear evaporation sources used in vacuum deposition systems,
PBN (pyrolytic boron nitride) crucible for containing materials,
A first heat generating part deposited on the outer surface of the PBN crucible and formed with a pattern suitable for heating;
An emission part composed of PBN;
A second heat generating part deposited on the outer surface of the PBN emitting part and formed with a pattern suitable for heating;
A side emission type linear evaporation source including a side emission port formed through a side surface of the PBN emission unit and the second heat generation unit. In claim 5,
A first protective film deposited on the inner surface of the PBN crucible and electrically insulated from the first heating part;
A side emission type linear evaporation source further comprising a second protective film deposited on the inner surface of the PBN emission part and the surface of the emission port and electrically insulated from the second heat generating part. In any one of Claims 3 thru | or 6,
The side-emission type linear evaporation characterized in that the temperature of the second heat generating part is maintained higher than the temperature of the first heat generating part when current is applied to the first and second heat generating parts. source. In any one of Claims 1 thru | or 6,
The side emission linear evaporation source, wherein the heat generating part and the protective film are made of pyrolytic graphite (PG) having a thickness of 1000 micrometers or less. In any one of Claims 1 thru | or 6,
A side-emission type linear evaporation source characterized in that the pattern of the heat generating part is symmetrical. In claim 1 or claim 5,
A side-emission type linear evaporation source characterized in that, in order to maintain the same deposition rate between the upper part and the lower part, the interval between the upper emission ports is narrower than the interval between the lower emission ports. In claim 1 or claim 5,
Side emission line characterized in that the size of the upper outlet is larger than the size of the lower outlet while keeping the distance between the upper and lower outlets constant to maintain the same upper and lower deposition rates. Vapor source. In the linear evaporation source manufacturing method of the vacuum deposition system,
Preparing a PBN crucible;
Depositing PG on the outer surface of the PBN crucible to form a first heat generating layer;
Forming a plurality of discharge ports of a predetermined size on the side surface of the PBN crucible;
A side-emission type linear evaporation source manufacturing method including a step of forming a pattern suitable for heating on the first heat generating layer formed on the outer surface of the PBN crucible. In claim 12,
Preparing a PBN lid for covering the upper opening of the PBN crucible;
Depositing PG on the outer surface of the PBN lid to form a second heat generating layer;
A method for manufacturing a side emission type linear evaporation source, further comprising the step of forming a pattern suitable for heating on a second heat generating layer formed on the outer surface of the PBN lid. In the linear evaporation source manufacturing method of the vacuum deposition system,
Preparing a PBN crucible;
Forming a plurality of discharge ports of a predetermined size on the side surface of the PBN crucible;
Depositing PG on the inside and outside surfaces of the PBN crucible to form a first heat generating layer on the outside surface of the PBN crucible and a first protective film on the inside surface;
Forming a pattern suitable for heating on the first exothermic layer formed on the outer surface of the PBN crucible;
A side-emission type linear evaporation source manufacturing method including a step of forming an insulating portion that electrically insulates the first heat generating layer from the first protective film. In claim 14,
Providing a PBN lid that covers the PBN crucible and has an outlet for evaporation;
Depositing PG on the inside and outside surfaces of the PBN lid and forming a second heat generating layer on the outside surface of the PBN lid and a second protective film on the inside surface;
Forming a pattern suitable for heating on the second heat generating layer formed on the outer surface of the PBN lid;
A method of manufacturing a side-emission linear evaporation source, further comprising forming an insulating part for electrically insulating the second heat generating layer and the second protective film. In the linear evaporation source manufacturing method of the vacuum deposition system,
Preparing a PBN crucible;
Depositing PG on the outer surface of the PBN crucible to form a first heat generating layer;
Forming a pattern suitable for heating on the first heat generating layer formed on the outer surface of the PBN crucible;
Preparing a PBN discharge section;
Depositing PG on the outer surface of the PBN emitting portion to form a second heat generating layer;
Forming a pattern suitable for heating on the second heat generating layer formed on the outer surface of the PBN emitting portion;
A side emission type linear evaporation source manufacturing method including a step of forming an emission port of a predetermined size on a side surface of the PBN emission part. In claim 16,
Depositing PG on the inside and outside surfaces of the PBN emitting portion to form a second heat generating layer on the outside surface of the PBN emitting portion and a second protective film on the inside surface;
Forming a pattern suitable for heating on the second heat generating layer formed on the outer surface of the PBN emitting portion;
A method of manufacturing a side-emission linear evaporation source, further comprising forming an insulating part for electrically insulating the second heat generating layer and the second protective film.   12. A linear evaporator comprising any one of the side emission type linear evaporation sources according to claim 1. In claim 18,
The linear evaporator includes a vacuum flange and a power supply electrode, and the linear evaporation source is attached to the vacuum flange with the power supply electrode as a support base. . In claim 19,
The linear evaporator according to claim 1, wherein the power supply electrode is disposed at a position spaced apart from a side discharge port formed in the PBN crucible.

Images