JP2013527965A5 - - Google Patents

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Publication number
JP2013527965A5
JP2013527965A5 JP2012556998A JP2012556998A JP2013527965A5 JP 2013527965 A5 JP2013527965 A5 JP 2013527965A5 JP 2012556998 A JP2012556998 A JP 2012556998A JP 2012556998 A JP2012556998 A JP 2012556998A JP 2013527965 A5 JP2013527965 A5 JP 2013527965A5
Authority
JP
Japan
Prior art keywords
lamination
structure prior
transverse conductors
optoelectric
optoelectric structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012556998A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013527965A (ja
JP6159929B2 (ja
Filing date
Publication date
Priority claimed from EP20100155599 external-priority patent/EP2363905A1/en
Application filed filed Critical
Publication of JP2013527965A publication Critical patent/JP2013527965A/ja
Publication of JP2013527965A5 publication Critical patent/JP2013527965A5/ja
Application granted granted Critical
Publication of JP6159929B2 publication Critical patent/JP6159929B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012556998A 2010-03-05 2011-03-01 光電気デバイスおよびその製造方法 Expired - Fee Related JP6159929B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10155599.3 2010-03-05
EP20100155599 EP2363905A1 (en) 2010-03-05 2010-03-05 Opto-electrical device and method for manufacturing thereof
PCT/NL2011/050141 WO2011108921A1 (en) 2010-03-05 2011-03-01 Opto-electrical device and method for manufacturing thereof

Publications (3)

Publication Number Publication Date
JP2013527965A JP2013527965A (ja) 2013-07-04
JP2013527965A5 true JP2013527965A5 (enExample) 2014-04-10
JP6159929B2 JP6159929B2 (ja) 2017-07-12

Family

ID=42320036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012556998A Expired - Fee Related JP6159929B2 (ja) 2010-03-05 2011-03-01 光電気デバイスおよびその製造方法

Country Status (5)

Country Link
US (1) US9437510B2 (enExample)
EP (2) EP2363905A1 (enExample)
JP (1) JP6159929B2 (enExample)
CN (1) CN102971882B (enExample)
WO (1) WO2011108921A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9219245B2 (en) * 2011-11-18 2015-12-22 Samsung Display Co., Ltd. Organic light emitting diode display and manufacturing method thereof
KR101903744B1 (ko) * 2012-01-10 2018-10-04 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP6223360B2 (ja) * 2012-02-03 2017-11-01 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． Ｏｌｅｄ素子及びその製造
EP2629347A1 (en) 2012-02-17 2013-08-21 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electric device and method for manufacturing the same
JP5907766B2 (ja) * 2012-03-14 2016-04-26 株式会社カネカ 発光デバイスおよび発光デバイスの製造方法
JP5907765B2 (ja) * 2012-03-14 2016-04-26 株式会社カネカ 発光デバイスおよび発光デバイスの製造方法
US20130248914A1 (en) * 2012-03-20 2013-09-26 General Electric Company Packaged optoelectronic device and process for manufacturing
JP6003332B2 (ja) * 2012-07-23 2016-10-05 株式会社リコー エレクトロクロミック装置及びその製造方法
JP6064761B2 (ja) * 2012-11-02 2017-01-25 株式会社リコー エレクトロクロミック装置及びその製造方法
EP2875402A4 (en) * 2012-07-23 2015-11-25 Ricoh Co Ltd ELECTROCHROMIC DEVICE AND METHOD FOR PRODUCING AN ELECTROCHROMIC DEVICE
JP6078295B2 (ja) * 2012-10-29 2017-02-08 株式会社カネカ 有機ｅｌ装置
DE102012220724B4 (de) 2012-11-14 2022-05-25 Pictiva Displays International Limited Optoelektronisches Bauelement
DE102012221191B4 (de) * 2012-11-20 2022-03-17 Pictiva Displays International Limited Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US20160111675A1 (en) * 2013-05-23 2016-04-21 Koninklijke Philips N.V. Organic light-emitting device
DE102014102255B4 (de) 2014-02-21 2021-10-28 Pictiva Displays International Limited Organisches lichtemittierendes Bauelement und Verfahren zum Herstellen eines organischen lichtemittierenden Bauelements
DE102014103747B4 (de) * 2014-03-19 2024-06-13 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102296915B1 (ko) * 2014-07-30 2021-09-02 삼성디스플레이 주식회사 유기 발광 표시 장치
DE102014111345B4 (de) * 2014-08-08 2023-05-04 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102014119539B4 (de) * 2014-12-23 2025-04-10 Pictiva Displays International Limited Organisches optoelektronisches Bauelement und Verfahren zum Herstellen eines organischen optoelektronischen Bauelements
US10483410B2 (en) * 2015-10-20 2019-11-19 Alta Devices, Inc. Forming front metal contact on solar cell with enhanced resistance to stress
JP6685122B2 (ja) * 2015-12-16 2020-04-22 住友化学株式会社 有機ｅｌ素子の製造方法及び有機ｅｌ素子
JP6817819B2 (ja) * 2017-01-11 2021-01-20 株式会社東海理化電機製作所 有機ｅｌ素子、及び有機ｅｌ素子の製造方法
US20220026705A1 (en) * 2018-11-26 2022-01-27 Corning Incorporated Methods for forming patterned insulating layers on conductive layers and devices manufactured using such methods
EP3671866A1 (en) * 2018-12-18 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Photovoltaic product and method of manufacturing the same
WO2021048240A1 (de) * 2019-09-10 2021-03-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Organisches leuchtdiodenmodul
CN113900308B (zh) * 2021-11-02 2025-04-08 浙江精一新材料科技有限公司 一种电极固定结构、调光膜及调光玻璃
CN116075080A (zh) * 2021-11-04 2023-05-05 光宝科技新加坡私人有限公司 功率模块

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JPH01142197A (ja) 1987-11-26 1989-06-05 Kuraray Co Ltd 止水シート
JPH01142197U (enExample) * 1988-03-24 1989-09-28
JPH09129369A (ja) * 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 電界発光素子及びその製造方法
US6506616B1 (en) 1999-11-18 2003-01-14 Texas Instruments Incorporated Photolithographic method for fabricating organic light-emitting diodes
US7052355B2 (en) * 2003-10-30 2006-05-30 General Electric Company Organic electro-optic device and method for making the same
US8405193B2 (en) 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US20060278965A1 (en) * 2005-06-10 2006-12-14 Foust Donald F Hermetically sealed package and methods of making the same
CN101228649B (zh) * 2005-07-27 2011-09-28 皇家飞利浦电子股份有限公司 具有密封的集成驱动电路的发光器件
JP2008103254A (ja) 2006-10-20 2008-05-01 Tokai Rubber Ind Ltd 有機ｅｌデバイス
JP5112707B2 (ja) * 2007-01-26 2013-01-09 パナソニック株式会社 有機エレクトロルミネッセンス発光装置
US7977877B2 (en) 2007-03-02 2011-07-12 Global Oled Technology Llc Flat panel OLED device having deformable substrate
US8016631B2 (en) 2007-11-16 2011-09-13 Global Oled Technology Llc Desiccant sealing arrangement for OLED devices
US8846169B2 (en) 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
EP2144290A1 (en) 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same

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