JP2013527590A5 - - Google Patents

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Publication number
JP2013527590A5
JP2013527590A5 JP2012518063A JP2012518063A JP2013527590A5 JP 2013527590 A5 JP2013527590 A5 JP 2013527590A5 JP 2012518063 A JP2012518063 A JP 2012518063A JP 2012518063 A JP2012518063 A JP 2012518063A JP 2013527590 A5 JP2013527590 A5 JP 2013527590A5
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JP
Japan
Prior art keywords
steps
electrostatic
converting
fixing
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012518063A
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English (en)
Japanese (ja)
Other versions
JP5646618B2 (ja
JP2013527590A (ja
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Publication date
Priority claimed from PCT/EP2010/058373 external-priority patent/WO2011000689A1/en
Application filed filed Critical
Publication of JP2013527590A publication Critical patent/JP2013527590A/ja
Publication of JP2013527590A5 publication Critical patent/JP2013527590A5/ja
Application granted granted Critical
Publication of JP5646618B2 publication Critical patent/JP5646618B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012518063A 2009-06-30 2010-07-19 像補正をするアドレス可能な静電チャックシステム Active JP5646618B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22185709P 2009-06-30 2009-06-30
PCT/EP2010/058373 WO2011000689A1 (en) 2009-06-30 2010-06-15 Image-compensating addressable electrostatic chuck system

Publications (3)

Publication Number Publication Date
JP2013527590A JP2013527590A (ja) 2013-06-27
JP2013527590A5 true JP2013527590A5 (https=) 2013-10-31
JP5646618B2 JP5646618B2 (ja) 2014-12-24

Family

ID=42670562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012518063A Active JP5646618B2 (ja) 2009-06-30 2010-07-19 像補正をするアドレス可能な静電チャックシステム

Country Status (7)

Country Link
US (1) US8477472B2 (https=)
JP (1) JP5646618B2 (https=)
KR (1) KR101407477B1 (https=)
CN (1) CN102473669B (https=)
NL (1) NL2004890A (https=)
TW (1) TWI420256B (https=)
WO (1) WO2011000689A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2490143B (en) * 2011-04-20 2013-03-13 Rolls Royce Plc Method of manufacturing a component
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP2018046179A (ja) * 2016-09-15 2018-03-22 株式会社東芝 静電チャック及び半導体製造装置
KR102584518B1 (ko) * 2018-07-04 2023-10-05 삼성디스플레이 주식회사 정전척 유닛 및 그것을 이용한 박막 증착 장치
TR201905624A2 (tr) * 2019-04-16 2019-07-22 Hidropar Hareket Kontrol Teknolojileri Merkezi Sanayi Ve Ticaret Anonim Sirketi İki cisim arasında kontrol edilebilir elektrostatik çekim kuvveti oluşturulması ve bu çekim kuvveti yardımı ile yapışma sağlanması yöntemi.
EP3809204A1 (en) * 2019-10-18 2021-04-21 ASML Netherlands B.V. Patterning device conditioning system and method
TW202243107A (zh) * 2021-03-18 2022-11-01 荷蘭商Ａｓｍｌ荷蘭公司 用於經改良疊對之夾具電極修改
US12550671B2 (en) 2022-09-14 2026-02-10 International Business Machines Corporation Pixelated chuck for retaining warped semiconductor wafers
CN120530485A (zh) * 2023-01-27 2025-08-22 Asml荷兰有限公司 用于光刻设备的逐步地被激励的静电夹具

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04336928A (ja) * 1991-05-14 1992-11-25 Toto Ltd 圧電ステージ
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
DE50114392D1 (de) * 2000-08-02 2008-11-20 Fraunhofer Ges Forschung Mobiler halter für einen wafer
US6493867B1 (en) * 2000-08-08 2002-12-10 Ball Semiconductor, Inc. Digital photolithography system for making smooth diagonal components
WO2002042825A1 (en) * 2000-11-22 2002-05-30 Ball Semiconductor, Inc. Light modulation device and system
US6433917B1 (en) * 2000-11-22 2002-08-13 Ball Semiconductor, Inc. Light modulation device and system
US6897940B2 (en) * 2002-06-21 2005-05-24 Nikon Corporation System for correcting aberrations and distortions in EUV lithography
US7199994B1 (en) * 2004-01-12 2007-04-03 Advanced Micro Devices Inc. Method and system for flattening a reticle within a lithography system
DE102004010002B4 (de) * 2004-03-01 2007-10-31 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Reflexionsmaske und Verfahren
DE112005000621B4 (de) * 2004-03-19 2019-01-31 Creative Technology Corporation Bipolare elektrostatische Haltevorrichtung
CN101326627B (zh) * 2005-12-06 2010-06-09 创意科技股份有限公司 静电卡盘用电极片以及静电卡盘
US20090068765A1 (en) * 2006-03-08 2009-03-12 Kenichi Murooka Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device
JP2007242893A (ja) * 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
US7576832B2 (en) * 2006-05-04 2009-08-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007319958A (ja) * 2006-05-31 2007-12-13 Tomoegawa Paper Co Ltd 静電チャック部材および静電チャック装置
NL1036511A1 (nl) * 2008-02-13 2009-08-14 Asml Netherlands Bv Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object.

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