JP2013527484A - デジタル出力用レーザアレイを組み合わせるためのシステムおよび方法 - Google Patents
デジタル出力用レーザアレイを組み合わせるためのシステムおよび方法 Download PDFInfo
- Publication number
- JP2013527484A JP2013527484A JP2012544858A JP2012544858A JP2013527484A JP 2013527484 A JP2013527484 A JP 2013527484A JP 2012544858 A JP2012544858 A JP 2012544858A JP 2012544858 A JP2012544858 A JP 2012544858A JP 2013527484 A JP2013527484 A JP 2013527484A
- Authority
- JP
- Japan
- Prior art keywords
- subarray
- array
- light emitting
- subarrays
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003491 array Methods 0.000 title claims description 69
- 238000000034 method Methods 0.000 title description 44
- 239000004065 semiconductor Substances 0.000 claims description 41
- 230000003287 optical effect Effects 0.000 claims description 37
- 239000013078 crystal Substances 0.000 claims description 33
- 230000001427 coherent effect Effects 0.000 claims description 9
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 64
- 238000013461 design Methods 0.000 description 58
- 239000000758 substrate Substances 0.000 description 51
- 238000005516 engineering process Methods 0.000 description 19
- 239000003086 colorant Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000003384 imaging method Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000004891 communication Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002310 reflectometry Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 230000012010 growth Effects 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 241000252073 Anguilliformes Species 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012163 sequencing technique Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000007773 growth pattern Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000006225 natural substrate Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28826909P | 2009-12-19 | 2009-12-19 | |
| PCT/US2010/060897 WO2011075609A1 (en) | 2009-12-19 | 2010-12-16 | System and method for combining laser arrays for digital outputs |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016108933A Division JP6268224B2 (ja) | 2016-05-31 | 2016-05-31 | デジタル出力用レーザアレイを組み合わせるためのシステムおよび方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013527484A true JP2013527484A (ja) | 2013-06-27 |
| JP2013527484A5 JP2013527484A5 (https=) | 2014-12-11 |
Family
ID=44150084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012544858A Pending JP2013527484A (ja) | 2009-12-19 | 2011-01-19 | デジタル出力用レーザアレイを組み合わせるためのシステムおよび方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8613536B2 (https=) |
| EP (1) | EP2517321B1 (https=) |
| JP (1) | JP2013527484A (https=) |
| CN (1) | CN102959811B (https=) |
| CA (1) | CA2784958C (https=) |
| WO (1) | WO2011075609A1 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020004868A (ja) * | 2018-06-28 | 2020-01-09 | 富士ゼロックス株式会社 | 発光素子アレイ及び光計測システム |
| JP2020529128A (ja) * | 2017-07-25 | 2020-10-01 | トリルミナ コーポレーション | 単一チップ直列接続ｖｃｓｅｌアレイ |
| WO2021157431A1 (ja) * | 2020-02-07 | 2021-08-12 | ソニーセミコンダクタソリューションズ株式会社 | 発光デバイス |
| WO2021166661A1 (ja) * | 2020-02-18 | 2021-08-26 | ソニーセミコンダクタソリューションズ株式会社 | 発光デバイスおよび発光デバイスの製造方法 |
| WO2026028622A1 (ja) * | 2024-07-31 | 2026-02-05 | ソニーセミコンダクタソリューションズ株式会社 | 発光装置 |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8995493B2 (en) | 2009-02-17 | 2015-03-31 | Trilumina Corp. | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
| US8995485B2 (en) | 2009-02-17 | 2015-03-31 | Trilumina Corp. | High brightness pulsed VCSEL sources |
| US10244181B2 (en) * | 2009-02-17 | 2019-03-26 | Trilumina Corp. | Compact multi-zone infrared laser illuminator |
| US20130223846A1 (en) | 2009-02-17 | 2013-08-29 | Trilumina Corporation | High speed free-space optical communications |
| US10038304B2 (en) | 2009-02-17 | 2018-07-31 | Trilumina Corp. | Laser arrays for variable optical properties |
| US11095365B2 (en) | 2011-08-26 | 2021-08-17 | Lumentum Operations Llc | Wide-angle illuminator module |
| CN104185961B (zh) * | 2011-08-26 | 2017-09-08 | 三流明公司 | 高速自由空间光通信 |
| JP2013115257A (ja) * | 2011-11-29 | 2013-06-10 | Mitsubishi Electric Corp | 光モジュール |
| CN104220208B (zh) | 2012-04-17 | 2017-03-15 | 皇家飞利浦有限公司 | 照明装置 |
| CN104395827B (zh) | 2012-04-20 | 2017-09-12 | 皇家飞利浦有限公司 | 用于提供用于处理物体的光的照明装置 |
| US9735087B2 (en) * | 2012-09-20 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level embedded heat spreader |
| US20140139467A1 (en) * | 2012-11-21 | 2014-05-22 | Princeton Optronics Inc. | VCSEL Sourced Touch Screen Sensor Systems |
| JP6339665B2 (ja) * | 2013-04-22 | 2018-06-06 | トリルミナ コーポレーション | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
| WO2015077516A1 (en) | 2013-11-20 | 2015-05-28 | Trilumina Corp. | System for combining laser array outputs into a single beam carrying digital data |
| CN105874663B (zh) * | 2014-01-24 | 2019-05-17 | 株式会社藤仓 | 控制方法、控制装置以及光源装置 |
| WO2015143450A1 (en) | 2014-03-21 | 2015-09-24 | Lightwave International, Inc. | Laser arrays |
| JP6281174B2 (ja) * | 2014-03-25 | 2018-02-21 | スタンレー電気株式会社 | 車両用灯具及び結合分配器 |
| US10749312B2 (en) * | 2015-05-28 | 2020-08-18 | Vixar, Inc. | VCSELs and VCSEL arrays designed for improved performance as illumination sources and sensors |
| AU2016298390B2 (en) | 2015-07-30 | 2021-09-02 | Optipulse Inc. | Rigid high power and high speed lasing grid structures |
| US10630053B2 (en) * | 2015-07-30 | 2020-04-21 | Optipulse Inc. | High power laser grid structure |
| JP6414183B2 (ja) * | 2016-11-16 | 2018-10-31 | 富士ゼロックス株式会社 | 発光素子アレイ、および光伝送装置 |
| US10958350B2 (en) | 2017-08-11 | 2021-03-23 | Optipulse Inc. | Laser grid structures for wireless high speed data transfers |
| US10374705B2 (en) | 2017-09-06 | 2019-08-06 | Optipulse Inc. | Method and apparatus for alignment of a line-of-sight communications link |
| CN108923261B (zh) * | 2018-10-24 | 2019-01-29 | 常州纵慧芯光半导体科技有限公司 | 垂直腔面发射激光器的像素结构及其制作方法 |
| GB201807747D0 (en) | 2018-05-13 | 2018-06-27 | Optovate Ltd | Colour micro-LED display apparatus |
| US11769987B2 (en) * | 2018-08-21 | 2023-09-26 | Semiconductor Components Industries, Llc | Methods and systems of driving arrays of diodes |
| WO2020198261A1 (en) | 2019-03-25 | 2020-10-01 | Trilumina Corp. | Spatial multiplexing of lens arrays with surface-emitting lasers for multi-zone illumination |
| US12126145B2 (en) | 2020-04-23 | 2024-10-22 | Lumentum Operations Llc | Bottom-emitting vertical cavity surface emitting laser array with integrated directed beam diffuser |
| US11749964B2 (en) * | 2020-06-24 | 2023-09-05 | Meta Platforms Technologies, Llc | Monolithic light source with integrated optics based on nonlinear frequency conversion |
| US12334715B2 (en) | 2021-04-26 | 2025-06-17 | Meta Platforms Technologies, Llc | Visible light source including integrated VCSELs and integrated photonic cavities |
| TW202308245A (zh) * | 2021-04-26 | 2023-02-16 | 美商元平台技術有限公司 | 包括整合的垂直腔面射型雷射及整合的光子腔的多色可見光源 |
| TW202244551A (zh) * | 2021-04-26 | 2022-11-16 | 美商元平台技術有限公司 | 包含整合的垂直腔面射型雷射以及整合的光子空腔的可見光光源 |
| DE102022202090B4 (de) | 2022-03-01 | 2024-09-12 | Robert Bosch Gesellschaft mit beschränkter Haftung | VCSEL-Chip mit einer matrixförmigen Anordnung von VCSEL-Elementen und Verfahren zu seiner Herstellung |
| CN115189774B (zh) * | 2022-06-29 | 2023-05-23 | 武汉光迅科技股份有限公司 | 一种可编组光模块及使用方法 |
| US20250062597A1 (en) * | 2023-08-17 | 2025-02-20 | Ii-Vi Delaware, Inc. | Semiconductor Laser Assembly with Thin Film Lithium Compound Waveguide |
| CN119362160B (zh) * | 2024-12-23 | 2025-03-21 | 中国科学院长春光学精密机械与物理研究所 | 具有多角度光束调控功能的单片多波长半导体激光器 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63280568A (ja) * | 1987-05-13 | 1988-11-17 | Hitachi Ltd | 発光素子駆動回路 |
| JPH0592618A (ja) * | 1991-09-30 | 1993-04-16 | Kyocera Corp | 画像形成装置 |
| JPH0620051U (ja) * | 1992-08-17 | 1994-03-15 | 旭光学工業株式会社 | レーザ発光装置の光出力切替装置 |
| JPH06297764A (ja) * | 1993-04-12 | 1994-10-25 | Oki Electric Ind Co Ltd | 発光素子アレイの駆動回路 |
| JPH07506220A (ja) * | 1992-04-21 | 1995-07-06 | フオトニクス リサーチ インコーポレーテツド | 垂直キャビティ・面発光レーザアレイディスプレイシステム |
| JP2001246776A (ja) * | 2000-03-02 | 2001-09-11 | Canon Inc | 同期信号発生装置および画像形成装置 |
| JP2002002015A (ja) * | 2000-06-16 | 2002-01-08 | Canon Inc | 画像形成における同期信号発生方法及びその装置 |
| US20070153862A1 (en) * | 2004-07-30 | 2007-07-05 | Shchegrov Andrei V | Manufacturable vertical extended cavity surface emitting laser arrays |
| JP2008277615A (ja) * | 2007-05-01 | 2008-11-13 | Seiko Epson Corp | 面発光レーザアレイおよびその製造方法ならびに半導体装置 |
| JP2009286048A (ja) * | 2008-05-30 | 2009-12-10 | Fuji Xerox Co Ltd | 光源ヘッド、及び画像形成装置 |
Family Cites Families (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3590248A (en) * | 1965-04-13 | 1971-06-29 | Massachusetts Inst Technology | Laser arrays |
| US3805255A (en) * | 1972-09-21 | 1974-04-16 | Hewlett Packard Co | Scanning light emitting diode display of digital information |
| US4127322A (en) * | 1975-12-05 | 1978-11-28 | Hughes Aircraft Company | High brightness full color image light valve projection system |
| US4448491A (en) * | 1979-08-08 | 1984-05-15 | Canon Kabushiki Kaisha | Image display apparatus |
| US4850685A (en) * | 1984-10-22 | 1989-07-25 | Seiko Epson Corporation | Projection-type color display device |
| US4827482A (en) * | 1988-03-21 | 1989-05-02 | Massachusetts Institute Of Technology | Phase-locked semiconductor laser arrays |
| US4822755A (en) * | 1988-04-25 | 1989-04-18 | Xerox Corporation | Method of fabricating large area semiconductor arrays |
| US4870652A (en) * | 1988-07-08 | 1989-09-26 | Xerox Corporation | Monolithic high density arrays of independently addressable semiconductor laser sources |
| US4881237A (en) * | 1988-08-26 | 1989-11-14 | Massachusetts Institute Of Technology | Hybrid two-dimensional surface-emitting laser arrays |
| JPH0274903A (ja) * | 1988-09-12 | 1990-03-14 | Seiko Epson Corp | ダイクロイック光学素子及び投射型表示装置 |
| US4971927A (en) * | 1989-04-25 | 1990-11-20 | International Business Machines Corporation | Method of making embedded integrated laser arrays and support circuits |
| US5034344A (en) * | 1989-07-17 | 1991-07-23 | Bell Communications Research, Inc. | Method of making a surface emitting semiconductor laser |
| US5070399A (en) * | 1990-02-01 | 1991-12-03 | Alain Martel | Light color and intensity modulation system |
| US5258316A (en) * | 1992-03-26 | 1993-11-02 | Motorola, Inc. | Patterened mirror vertical cavity surface emitting laser |
| JP3462514B2 (ja) * | 1992-09-16 | 2003-11-05 | 住友電気工業株式会社 | 固体レーザ |
| US5640188A (en) * | 1992-12-18 | 1997-06-17 | Xerox Corporation | Multiple diode laser employing mating substrates |
| US5328854A (en) * | 1993-03-31 | 1994-07-12 | At&T Bell Laboratories | Fabrication of electronic devices with an internal window |
| US5422903A (en) * | 1993-04-15 | 1995-06-06 | Yamada; Norihide | Surface emitting second harmonic generating device |
| US5550081A (en) * | 1994-04-08 | 1996-08-27 | Board Of Trustees Of The University Of Illinois | Method of fabricating a semiconductor device by oxidizing aluminum-bearing 1H-V semiconductor in water vapor environment |
| US5557115A (en) * | 1994-08-11 | 1996-09-17 | Rohm Co. Ltd. | Light emitting semiconductor device with sub-mount |
| US5504767A (en) * | 1995-03-17 | 1996-04-02 | Si Diamond Technology, Inc. | Doped diamond laser |
| US5574738A (en) * | 1995-06-07 | 1996-11-12 | Honeywell Inc. | Multi-gigahertz frequency-modulated vertical-cavity surface emitting laser |
| US5707139A (en) * | 1995-11-01 | 1998-01-13 | Hewlett-Packard Company | Vertical cavity surface emitting laser arrays for illumination |
| US5825803A (en) * | 1995-12-14 | 1998-10-20 | Institut National D'optique | Multiple emitter laser diode assembly with graded-index fiber microlens |
| US5976905A (en) * | 1996-02-16 | 1999-11-02 | Cielo Communications, Inc. | Method of manufacturing VCSEL arrays using vapor phase epitaxy to achieve uniform device-to-device operating characteristics |
| RU2130221C1 (ru) * | 1996-04-23 | 1999-05-10 | Акционерное общество закрытого типа "Энергомаштехника" | Матрица лазерных диодов |
| US5724375A (en) * | 1996-07-17 | 1998-03-03 | W. L. Gore & Associates, Inc. | Vertical cavity surface emitting laser with enhanced second harmonic generation and method of making same |
| US5812571A (en) * | 1996-10-25 | 1998-09-22 | W. L. Gore & Associates, Inc. | High-power vertical cavity surface emitting laser cluster |
| AU7708598A (en) * | 1997-05-28 | 1998-12-30 | Lee Lanphier | Modular traditional staircase |
| US5896408A (en) * | 1997-08-15 | 1999-04-20 | Hewlett-Packard Company | Near planar native-oxide VCSEL devices and arrays using converging oxide ringlets |
| JP3684778B2 (ja) * | 1997-08-21 | 2005-08-17 | 富士ゼロックス株式会社 | 面発光型半導体レーザアレイ |
| US6154480A (en) * | 1997-10-02 | 2000-11-28 | Board Of Regents, The University Of Texas System | Vertical-cavity laser and laser array incorporating guided-mode resonance effects and method for making the same |
| US6128131A (en) * | 1997-11-13 | 2000-10-03 | Eastman Kodak Company | Scaleable tiled flat-panel projection color display |
| US6075804A (en) * | 1998-01-28 | 2000-06-13 | Picolight Incorporated | Semiconductor device having an oxide defined aperture |
| US6136623A (en) * | 1998-05-06 | 2000-10-24 | Xerox Corporation | Multiple wavelength laser arrays by flip-chip bonding |
| US6215598B1 (en) * | 1998-10-05 | 2001-04-10 | Ruey Jennifer Hwu | Apparatus and method for concentrating beams from broad area diode lasers, diode laser bars and/ or diode laser arrays |
| US5991318A (en) * | 1998-10-26 | 1999-11-23 | Coherent, Inc. | Intracavity frequency-converted optically-pumped semiconductor laser |
| US6212213B1 (en) | 1999-01-29 | 2001-04-03 | Agilent Technologies, Inc. | Projector light source utilizing a solid state green light source |
| US6947469B2 (en) * | 1999-05-07 | 2005-09-20 | Intel Corporation | Method and Apparatus for wireless spread spectrum communication with preamble processing period |
| US6493368B1 (en) * | 1999-07-21 | 2002-12-10 | Agere Systems Inc. | Lateral injection vertical cavity surface-emitting laser |
| US6393038B1 (en) * | 1999-10-04 | 2002-05-21 | Sandia Corporation | Frequency-doubled vertical-external-cavity surface-emitting laser |
| JP2002014427A (ja) * | 2000-06-29 | 2002-01-18 | Noritsu Koki Co Ltd | レーザ露光装置及び写真処理装置 |
| DE10061265A1 (de) * | 2000-12-06 | 2002-06-27 | Jenoptik Jena Gmbh | Diodenlaseranordnung |
| US6608849B2 (en) * | 2001-06-13 | 2003-08-19 | Wisconsin Alumni Research Foundation | Vertical-cavity surface-emitting semiconductor laser arrays |
| US6836321B2 (en) * | 2001-06-20 | 2004-12-28 | Lucent Technologies Inc. | Testing bottom-emitting VCSELs |
| US6775308B2 (en) * | 2001-06-29 | 2004-08-10 | Xanoptix, Inc. | Multi-wavelength semiconductor laser arrays and applications thereof |
| JP4537658B2 (ja) * | 2002-02-22 | 2010-09-01 | 株式会社リコー | 面発光レーザ素子、該面発光レーザ素子を用いた面発光レーザアレイ、電子写真システム、面発光レーザモジュール、光通信システム、光インターコネクションシステム、および面発光レーザ素子の製造方法 |
| US7016381B2 (en) * | 2002-10-11 | 2006-03-21 | Ziva, Inc. | Current-controlled polarization switching vertical cavity surface emitting laser |
| US6947459B2 (en) * | 2002-11-25 | 2005-09-20 | Eastman Kodak Company | Organic vertical cavity laser and imaging system |
| US7141828B2 (en) * | 2003-03-19 | 2006-11-28 | Gelcore, Llc | Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact |
| US7126974B1 (en) * | 2003-04-09 | 2006-10-24 | University Of Central Florida Research Foundation, Inc. | Ring geometry diode laser arrays and methods |
| JP2005116933A (ja) * | 2003-10-10 | 2005-04-28 | Sony Corp | 面発光レーザ素子アレイおよび面発光レーザ素子アレイの製造方法 |
| WO2005036211A2 (en) * | 2003-10-17 | 2005-04-21 | Explay Ltd. | Optical system and method for use in projection systems |
| US7262758B2 (en) * | 2004-06-09 | 2007-08-28 | Eastman Kodak Company | Display device using vertical cavity laser arrays |
| WO2006105259A2 (en) * | 2004-07-30 | 2006-10-05 | Novalux, Inc. | System and method for driving semiconductor laser sources for displays |
| US7322704B2 (en) * | 2004-07-30 | 2008-01-29 | Novalux, Inc. | Frequency stabilized vertical extended cavity surface emitting lasers |
| JP2008508559A (ja) * | 2004-07-30 | 2008-03-21 | ノバラックス，インコーポレイティド | 投射型ディスプレイ装置、システムおよび方法 |
| CN101558534A (zh) * | 2005-03-30 | 2009-10-14 | 诺瓦光电技术公司 | 可制造垂直扩充空腔表面发射激光器阵列 |
| US7430231B2 (en) * | 2005-04-29 | 2008-09-30 | Ningyi Luo | Vertical cavity surface emitting laser (VCSEL) arrays pumped solid-state lasers |
| US20070052660A1 (en) * | 2005-08-23 | 2007-03-08 | Eastman Kodak Company | Forming display color image |
| KR101100431B1 (ko) * | 2005-11-22 | 2011-12-30 | 삼성전자주식회사 | 고효율 2차 조화파 생성 외부 공진기형 면발광 레이저 |
| KR101217557B1 (ko) * | 2006-08-02 | 2013-01-02 | 삼성전자주식회사 | 직접 광변조가 가능한 레이저 모듈 및 이를 채용한 레이저디스플레이 장치 |
| US7871165B2 (en) * | 2007-11-30 | 2011-01-18 | Eastman Kodak Company | Stereo projection apparatus using polarized solid state light sources |
| US7959297B2 (en) * | 2008-05-15 | 2011-06-14 | Eastman Kodak Company | Uniform speckle reduced laser projection using spatial and temporal mixing |
-
2010
- 2010-12-16 WO PCT/US2010/060897 patent/WO2011075609A1/en not_active Ceased
- 2010-12-16 EP EP10838272.2A patent/EP2517321B1/en active Active
- 2010-12-16 CN CN201080064212.6A patent/CN102959811B/zh active Active
- 2010-12-16 US US12/970,880 patent/US8613536B2/en active Active
- 2010-12-16 CA CA2784958A patent/CA2784958C/en not_active Expired - Fee Related
-
2011
- 2011-01-19 JP JP2012544858A patent/JP2013527484A/ja active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63280568A (ja) * | 1987-05-13 | 1988-11-17 | Hitachi Ltd | 発光素子駆動回路 |
| JPH0592618A (ja) * | 1991-09-30 | 1993-04-16 | Kyocera Corp | 画像形成装置 |
| JPH07506220A (ja) * | 1992-04-21 | 1995-07-06 | フオトニクス リサーチ インコーポレーテツド | 垂直キャビティ・面発光レーザアレイディスプレイシステム |
| JPH0620051U (ja) * | 1992-08-17 | 1994-03-15 | 旭光学工業株式会社 | レーザ発光装置の光出力切替装置 |
| JPH06297764A (ja) * | 1993-04-12 | 1994-10-25 | Oki Electric Ind Co Ltd | 発光素子アレイの駆動回路 |
| JP2001246776A (ja) * | 2000-03-02 | 2001-09-11 | Canon Inc | 同期信号発生装置および画像形成装置 |
| JP2002002015A (ja) * | 2000-06-16 | 2002-01-08 | Canon Inc | 画像形成における同期信号発生方法及びその装置 |
| US20070153862A1 (en) * | 2004-07-30 | 2007-07-05 | Shchegrov Andrei V | Manufacturable vertical extended cavity surface emitting laser arrays |
| JP2008277615A (ja) * | 2007-05-01 | 2008-11-13 | Seiko Epson Corp | 面発光レーザアレイおよびその製造方法ならびに半導体装置 |
| JP2009286048A (ja) * | 2008-05-30 | 2009-12-10 | Fuji Xerox Co Ltd | 光源ヘッド、及び画像形成装置 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020529128A (ja) * | 2017-07-25 | 2020-10-01 | トリルミナ コーポレーション | 単一チップ直列接続ｖｃｓｅｌアレイ |
| JP7128259B2 (ja) | 2017-07-25 | 2022-08-30 | ルメンタム・オペレーションズ・リミテッド・ライアビリティ・カンパニー | 単一チップ直列接続ｖｃｓｅｌアレイ |
| JP2020004868A (ja) * | 2018-06-28 | 2020-01-09 | 富士ゼロックス株式会社 | 発光素子アレイ及び光計測システム |
| JP7180145B2 (ja) | 2018-06-28 | 2022-11-30 | 富士フイルムビジネスイノベーション株式会社 | 発光素子アレイ、及び光計測システム |
| WO2021157431A1 (ja) * | 2020-02-07 | 2021-08-12 | ソニーセミコンダクタソリューションズ株式会社 | 発光デバイス |
| JPWO2021157431A1 (https=) * | 2020-02-07 | 2021-08-12 | ||
| WO2021166661A1 (ja) * | 2020-02-18 | 2021-08-26 | ソニーセミコンダクタソリューションズ株式会社 | 発光デバイスおよび発光デバイスの製造方法 |
| JPWO2021166661A1 (https=) * | 2020-02-18 | 2021-08-26 | ||
| JP7660552B2 (ja) | 2020-02-18 | 2025-04-11 | ソニーセミコンダクタソリューションズ株式会社 | 発光デバイスおよび発光デバイスの製造方法 |
| WO2026028622A1 (ja) * | 2024-07-31 | 2026-02-05 | ソニーセミコンダクタソリューションズ株式会社 | 発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2517321A4 (en) | 2018-01-03 |
| EP2517321B1 (en) | 2021-04-14 |
| WO2011075609A1 (en) | 2011-06-23 |
| CA2784958A1 (en) | 2011-06-23 |
| US8613536B2 (en) | 2013-12-24 |
| CN102959811A (zh) | 2013-03-06 |
| EP2517321A1 (en) | 2012-10-31 |
| CN102959811B (zh) | 2016-06-29 |
| CA2784958C (en) | 2014-12-02 |
| US20110148328A1 (en) | 2011-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013527484A (ja) | デジタル出力用レーザアレイを組み合わせるためのシステムおよび方法 | |
| US8979338B2 (en) | System for combining laser array outputs into a single beam carrying digital data | |
| US10038304B2 (en) | Laser arrays for variable optical properties | |
| TWI692161B (zh) | 表面安裝相容的vcsel陣列 | |
| US8995493B2 (en) | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation | |
| CN105899870B (zh) | 用于将激光器阵列输出组合为携带数字数据的单个光束的系统 | |
| CA2910202C (en) | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation | |
| RU2623663C2 (ru) | Поверхностно-излучающий лазерный прибор с вертикальным внешним резонатором с оптической накачкой | |
| US10637211B2 (en) | Light-emitting semiconductor chip and method for producing a semiconductor light-emitting chip | |
| CN101304157B (zh) | 表面发射半导体激光器及其制造方法 | |
| US20170256915A1 (en) | High-Speed VCSEL Device | |
| JP2007508596A (ja) | 投影システムに使用する光学システムおよび方法 | |
| US20190006819A1 (en) | High Power Laser Grid Structure | |
| US20220368113A1 (en) | High speed narrow spectrum miniarray of vcsels and data transmission device based thereupon | |
| JP7418328B2 (ja) | ハイパワーのレーザグリッド構造 | |
| US20190386464A1 (en) | Opto-electronic device having a backside illuminating vcsel array with integrated diffractive optical elements (doe), diffuser and/or lens | |
| KR102623614B1 (ko) | 수직 캐비티 표면 방출 레이저 반도체 소자, 광 전송 모듈 및 광 전송 장치 | |
| JP6268224B2 (ja) | デジタル出力用レーザアレイを組み合わせるためのシステムおよび方法 | |
| JP6742182B2 (ja) | 発光装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131210 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140526 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140528 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140825 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140901 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140924 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20141001 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20141022 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150325 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150625 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150724 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150824 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150924 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20160201 |