CA2784958C - System and method for combining laser arrays for digital outputs - Google Patents
System and method for combining laser arrays for digital outputs Download PDFInfo
- Publication number
- CA2784958C CA2784958C CA2784958A CA2784958A CA2784958C CA 2784958 C CA2784958 C CA 2784958C CA 2784958 A CA2784958 A CA 2784958A CA 2784958 A CA2784958 A CA 2784958A CA 2784958 C CA2784958 C CA 2784958C
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- array
- arrays
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- semiconductor light
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- 238000003491 array Methods 0.000 title claims description 193
- 238000000034 method Methods 0.000 title description 56
- 230000001427 coherent effect Effects 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims description 37
- 230000003287 optical effect Effects 0.000 claims description 33
- 239000013078 crystal Substances 0.000 claims description 31
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003086 colorant Substances 0.000 abstract description 24
- 230000000694 effects Effects 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 54
- 239000000758 substrate Substances 0.000 description 49
- 238000013461 design Methods 0.000 description 46
- 239000000463 material Substances 0.000 description 16
- 230000008569 process Effects 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 241000252073 Anguilliformes Species 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 230000012010 growth Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005430 electron energy loss spectroscopy Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012163 sequencing technique Methods 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000007773 growth pattern Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28826909P | 2009-12-19 | 2009-12-19 | |
| US61/288,269 | 2009-12-19 | ||
| PCT/US2010/060897 WO2011075609A1 (en) | 2009-12-19 | 2010-12-16 | System and method for combining laser arrays for digital outputs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2784958A1 CA2784958A1 (en) | 2011-06-23 |
| CA2784958C true CA2784958C (en) | 2014-12-02 |
Family
ID=44150084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2784958A Expired - Fee Related CA2784958C (en) | 2009-12-19 | 2010-12-16 | System and method for combining laser arrays for digital outputs |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8613536B2 (https=) |
| EP (1) | EP2517321B1 (https=) |
| JP (1) | JP2013527484A (https=) |
| CN (1) | CN102959811B (https=) |
| CA (1) | CA2784958C (https=) |
| WO (1) | WO2011075609A1 (https=) |
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| US8995493B2 (en) | 2009-02-17 | 2015-03-31 | Trilumina Corp. | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
| US8995485B2 (en) | 2009-02-17 | 2015-03-31 | Trilumina Corp. | High brightness pulsed VCSEL sources |
| US10244181B2 (en) * | 2009-02-17 | 2019-03-26 | Trilumina Corp. | Compact multi-zone infrared laser illuminator |
| US20130223846A1 (en) | 2009-02-17 | 2013-08-29 | Trilumina Corporation | High speed free-space optical communications |
| US10038304B2 (en) | 2009-02-17 | 2018-07-31 | Trilumina Corp. | Laser arrays for variable optical properties |
| US11095365B2 (en) | 2011-08-26 | 2021-08-17 | Lumentum Operations Llc | Wide-angle illuminator module |
| CN104185961B (zh) * | 2011-08-26 | 2017-09-08 | 三流明公司 | 高速自由空间光通信 |
| JP2013115257A (ja) * | 2011-11-29 | 2013-06-10 | Mitsubishi Electric Corp | 光モジュール |
| CN104220208B (zh) | 2012-04-17 | 2017-03-15 | 皇家飞利浦有限公司 | 照明装置 |
| CN104395827B (zh) | 2012-04-20 | 2017-09-12 | 皇家飞利浦有限公司 | 用于提供用于处理物体的光的照明装置 |
| US9735087B2 (en) * | 2012-09-20 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level embedded heat spreader |
| US20140139467A1 (en) * | 2012-11-21 | 2014-05-22 | Princeton Optronics Inc. | VCSEL Sourced Touch Screen Sensor Systems |
| JP6339665B2 (ja) * | 2013-04-22 | 2018-06-06 | トリルミナ コーポレーション | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
| WO2015077516A1 (en) | 2013-11-20 | 2015-05-28 | Trilumina Corp. | System for combining laser array outputs into a single beam carrying digital data |
| CN105874663B (zh) * | 2014-01-24 | 2019-05-17 | 株式会社藤仓 | 控制方法、控制装置以及光源装置 |
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| JP6281174B2 (ja) * | 2014-03-25 | 2018-02-21 | スタンレー電気株式会社 | 車両用灯具及び結合分配器 |
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| AU2016298390B2 (en) | 2015-07-30 | 2021-09-02 | Optipulse Inc. | Rigid high power and high speed lasing grid structures |
| US10630053B2 (en) * | 2015-07-30 | 2020-04-21 | Optipulse Inc. | High power laser grid structure |
| JP6414183B2 (ja) * | 2016-11-16 | 2018-10-31 | 富士ゼロックス株式会社 | 発光素子アレイ、および光伝送装置 |
| US10530128B2 (en) * | 2017-07-25 | 2020-01-07 | Trilumina Corp. | Single-chip series connected VCSEL array |
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| GB201807747D0 (en) | 2018-05-13 | 2018-06-27 | Optovate Ltd | Colour micro-LED display apparatus |
| JP7180145B2 (ja) | 2018-06-28 | 2022-11-30 | 富士フイルムビジネスイノベーション株式会社 | 発光素子アレイ、及び光計測システム |
| US11769987B2 (en) * | 2018-08-21 | 2023-09-26 | Semiconductor Components Industries, Llc | Methods and systems of driving arrays of diodes |
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| TWI890733B (zh) * | 2020-02-18 | 2025-07-21 | 日商索尼半導體解決方案公司 | 發光裝置及發光裝置之製造方法 |
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| US11749964B2 (en) * | 2020-06-24 | 2023-09-05 | Meta Platforms Technologies, Llc | Monolithic light source with integrated optics based on nonlinear frequency conversion |
| US12334715B2 (en) | 2021-04-26 | 2025-06-17 | Meta Platforms Technologies, Llc | Visible light source including integrated VCSELs and integrated photonic cavities |
| TW202308245A (zh) * | 2021-04-26 | 2023-02-16 | 美商元平台技術有限公司 | 包括整合的垂直腔面射型雷射及整合的光子腔的多色可見光源 |
| TW202244551A (zh) * | 2021-04-26 | 2022-11-16 | 美商元平台技術有限公司 | 包含整合的垂直腔面射型雷射以及整合的光子空腔的可見光光源 |
| DE102022202090B4 (de) | 2022-03-01 | 2024-09-12 | Robert Bosch Gesellschaft mit beschränkter Haftung | VCSEL-Chip mit einer matrixförmigen Anordnung von VCSEL-Elementen und Verfahren zu seiner Herstellung |
| CN115189774B (zh) * | 2022-06-29 | 2023-05-23 | 武汉光迅科技股份有限公司 | 一种可编组光模块及使用方法 |
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-
2010
- 2010-12-16 WO PCT/US2010/060897 patent/WO2011075609A1/en not_active Ceased
- 2010-12-16 EP EP10838272.2A patent/EP2517321B1/en active Active
- 2010-12-16 CN CN201080064212.6A patent/CN102959811B/zh active Active
- 2010-12-16 US US12/970,880 patent/US8613536B2/en active Active
- 2010-12-16 CA CA2784958A patent/CA2784958C/en not_active Expired - Fee Related
-
2011
- 2011-01-19 JP JP2012544858A patent/JP2013527484A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP2517321A4 (en) | 2018-01-03 |
| EP2517321B1 (en) | 2021-04-14 |
| WO2011075609A1 (en) | 2011-06-23 |
| CA2784958A1 (en) | 2011-06-23 |
| US8613536B2 (en) | 2013-12-24 |
| CN102959811A (zh) | 2013-03-06 |
| EP2517321A1 (en) | 2012-10-31 |
| JP2013527484A (ja) | 2013-06-27 |
| CN102959811B (zh) | 2016-06-29 |
| US20110148328A1 (en) | 2011-06-23 |
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