JP2013522779A5 - - Google Patents

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Publication number
JP2013522779A5
JP2013522779A5 JP2013500288A JP2013500288A JP2013522779A5 JP 2013522779 A5 JP2013522779 A5 JP 2013522779A5 JP 2013500288 A JP2013500288 A JP 2013500288A JP 2013500288 A JP2013500288 A JP 2013500288A JP 2013522779 A5 JP2013522779 A5 JP 2013522779A5
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JP
Japan
Prior art keywords
memory device
composite semiconductor
semiconductor memory
interface
ecc engine
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Pending
Application number
JP2013500288A
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English (en)
Japanese (ja)
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JP2013522779A (ja
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Publication date
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Priority claimed from PCT/CA2011/000229 external-priority patent/WO2011116454A1/en
Publication of JP2013522779A publication Critical patent/JP2013522779A/ja
Publication of JP2013522779A5 publication Critical patent/JP2013522779A5/ja
Pending legal-status Critical Current

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JP2013500288A 2010-03-22 2011-03-02 誤り訂正を有する複合半導体メモリデバイス Pending JP2013522779A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31613810P 2010-03-22 2010-03-22
US61/316,138 2010-03-22
PCT/CA2011/000229 WO2011116454A1 (en) 2010-03-22 2011-03-02 Composite semiconductor memory device with error correction

Publications (2)

Publication Number Publication Date
JP2013522779A JP2013522779A (ja) 2013-06-13
JP2013522779A5 true JP2013522779A5 (enExample) 2014-03-27

Family

ID=44648192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013500288A Pending JP2013522779A (ja) 2010-03-22 2011-03-02 誤り訂正を有する複合半導体メモリデバイス

Country Status (8)

Country Link
US (2) US9098430B2 (enExample)
EP (1) EP2550661A4 (enExample)
JP (1) JP2013522779A (enExample)
KR (1) KR20120137416A (enExample)
CN (1) CN102812519A (enExample)
CA (1) CA2791931A1 (enExample)
TW (1) TW201201008A (enExample)
WO (1) WO2011116454A1 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201201008A (en) * 2010-03-22 2012-01-01 Mosaid Technologies Inc Composite semiconductor memory device with error correction
KR20130012737A (ko) * 2011-07-26 2013-02-05 에스케이하이닉스 주식회사 반도체 메모리 장치 및 이를 포함하는 반도체 시스템
US8922243B2 (en) 2012-12-23 2014-12-30 Advanced Micro Devices, Inc. Die-stacked memory device with reconfigurable logic
US9697147B2 (en) 2012-08-06 2017-07-04 Advanced Micro Devices, Inc. Stacked memory device with metadata management
US8972826B2 (en) 2012-10-24 2015-03-03 Western Digital Technologies, Inc. Adaptive error correction codes for data storage systems
US9021339B2 (en) 2012-11-29 2015-04-28 Western Digital Technologies, Inc. Data reliability schemes for data storage systems
US9059736B2 (en) 2012-12-03 2015-06-16 Western Digital Technologies, Inc. Methods, solid state drive controllers and data storage devices having a runtime variable raid protection scheme
US9026888B2 (en) * 2012-12-21 2015-05-05 Intel Corporation Method, system and apparatus for providing access to error correction information
US9214963B1 (en) 2012-12-21 2015-12-15 Western Digital Technologies, Inc. Method and system for monitoring data channel to enable use of dynamically adjustable LDPC coding parameters in a data storage system
US9135185B2 (en) 2012-12-23 2015-09-15 Advanced Micro Devices, Inc. Die-stacked memory device providing data translation
US9201777B2 (en) 2012-12-23 2015-12-01 Advanced Micro Devices, Inc. Quality of service support using stacked memory device with logic die
US9065722B2 (en) 2012-12-23 2015-06-23 Advanced Micro Devices, Inc. Die-stacked device with partitioned multi-hop network
US9170948B2 (en) 2012-12-23 2015-10-27 Advanced Micro Devices, Inc. Cache coherency using die-stacked memory device with logic die
KR102084553B1 (ko) * 2013-01-03 2020-03-04 삼성전자주식회사 메모리 시스템
EP2992435B1 (en) 2013-04-30 2020-12-30 Hewlett-Packard Enterprise Development LP Memory node error correction
US20150012801A1 (en) * 2013-07-03 2015-01-08 Chih-Nan YEN Method of detecting and correcting errors with bch and ldpc engines for flash storage systems
US9286948B2 (en) 2013-07-15 2016-03-15 Advanced Micro Devices, Inc. Query operations for stacked-die memory device
CN104750569A (zh) 2013-12-30 2015-07-01 深圳市中兴微电子技术有限公司 一种实现数据纠错的方法及装置
JP6131207B2 (ja) 2014-03-14 2017-05-17 ウィンボンド エレクトロニクス コーポレーション 半導体記憶装置
KR102221752B1 (ko) * 2014-03-20 2021-03-02 삼성전자주식회사 메모리 장치의 프로그램 방법 및 이를 포함하는 데이터 독출 방법
US20150311920A1 (en) * 2014-04-25 2015-10-29 Agency For Science, Technology And Research Decoder for a memory device, memory device and method of decoding a memory device
US10002043B2 (en) * 2014-08-19 2018-06-19 Samsung Electronics Co., Ltd. Memory devices and modules
KR102214556B1 (ko) * 2014-08-19 2021-02-09 삼성전자주식회사 메모리 장치 및 모듈
US10002044B2 (en) 2014-08-19 2018-06-19 Samsung Electronics Co., Ltd. Memory devices and modules
CN104217765B (zh) * 2014-09-09 2017-11-24 武汉新芯集成电路制造有限公司 闪存芯片操作时间的测量方法
KR102231441B1 (ko) * 2014-12-17 2021-03-25 에스케이하이닉스 주식회사 메모리 시스템 및 메모리 시스템의 동작 방법
US10209895B2 (en) 2016-02-18 2019-02-19 Toshiba Memory Corporation Memory system
CN106598499A (zh) * 2016-12-14 2017-04-26 深圳市中博睿存科技有限公司 一种基于fpga的分布式文件系统架构
KR102688433B1 (ko) * 2017-05-07 2024-07-26 에스케이하이닉스 주식회사 메모리 장치, 이를 포함하는 메모리 시스템 및 메모리 시스템의 동작 방법
KR102688423B1 (ko) * 2017-07-05 2024-07-26 에스케이하이닉스 주식회사 메모리 장치, 이를 포함하는 메모리 시스템 및 메모리 시스템의 동작 방법
US10545860B2 (en) * 2017-08-10 2020-01-28 Samsung Electronics Co., Ltd. Intelligent high bandwidth memory appliance
US10331345B2 (en) * 2017-09-29 2019-06-25 Intel Corporation Method and apparatus for reducing silent data errors in non-volatile memory systems
US10719394B2 (en) * 2017-10-25 2020-07-21 Innogrit Technologies Co., Ltd. Systems and methods for fast access of non-volatile storage devices
TWI680375B (zh) * 2018-08-23 2019-12-21 慧榮科技股份有限公司 具有分散式信箱架構的多處理器系統及其處理器錯誤檢查方法
KR102766573B1 (ko) * 2018-09-21 2025-02-12 삼성전자주식회사 복수의 에러 정정 기능을 갖는 메모리 장치 및 메모리 시스템과 그 동작 방법
US20200127685A1 (en) * 2018-10-19 2020-04-23 Nyquist Semiconductor Limited Systems and methods for a hybrid non-volatile storage system
JP7184632B2 (ja) * 2018-12-25 2022-12-06 ルネサスエレクトロニクス株式会社 半導体装置
US11210167B2 (en) * 2019-10-28 2021-12-28 Intel Corporation Memory wordline isolation for improvement in reliability, availability, and scalability (RAS)
US11537326B2 (en) 2020-09-10 2022-12-27 Western Digital Technologies, Inc. Relocation flow using CbA technology

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7206891B2 (en) * 2002-09-26 2007-04-17 Lsi Logic Corporation Multi-port memory controller having independent ECC encoders
JP3757204B2 (ja) * 2002-12-06 2006-03-22 ファナック株式会社 エラー検出/訂正方式及び該方式を用いた制御装置
US7904786B2 (en) * 2003-03-06 2011-03-08 Hewlett-Packard Development Company, L.P. Assisted memory system
US8291295B2 (en) * 2005-09-26 2012-10-16 Sandisk Il Ltd. NAND flash memory controller exporting a NAND interface
KR100681429B1 (ko) * 2005-10-24 2007-02-15 삼성전자주식회사 반도체 메모리 장치 및 그것의 비트 에러 검출 방법
CN101324867B (zh) 2007-06-16 2011-07-20 深圳市硅格半导体有限公司 基于半导体存储介质的数据管理装置及管理方法
TWI357733B (en) * 2008-03-25 2012-02-01 Ralink Technology Corp Method for error-correcting code selection for mim
WO2010013437A1 (ja) * 2008-07-30 2010-02-04 パナソニック株式会社 誤り訂正機能付きコントローラ、誤り訂正機能付き記憶装置、及び誤り訂正機能付きシステム
US8134852B2 (en) * 2008-10-14 2012-03-13 Mosaid Technologies Incorporated Bridge device architecture for connecting discrete memory devices to a system
CN101527171B (zh) 2009-04-17 2012-05-23 成都市华为赛门铁克科技有限公司 一种多通道并行纠错的闪存控制方法和装置
TW201201008A (en) * 2010-03-22 2012-01-01 Mosaid Technologies Inc Composite semiconductor memory device with error correction

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