JP2013518971A5 - - Google Patents

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Publication number
JP2013518971A5
JP2013518971A5 JP2012551969A JP2012551969A JP2013518971A5 JP 2013518971 A5 JP2013518971 A5 JP 2013518971A5 JP 2012551969 A JP2012551969 A JP 2012551969A JP 2012551969 A JP2012551969 A JP 2012551969A JP 2013518971 A5 JP2013518971 A5 JP 2013518971A5
Authority
JP
Japan
Prior art keywords
potting compound
compound according
amount
formulated
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012551969A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013518971A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2010/060297 external-priority patent/WO2011096986A1/en
Publication of JP2013518971A publication Critical patent/JP2013518971A/ja
Publication of JP2013518971A5 publication Critical patent/JP2013518971A5/ja
Pending legal-status Critical Current

Links

JP2012551969A 2010-02-02 2010-12-14 防湿ポッティングコンパウンド Pending JP2013518971A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US30059510P 2010-02-02 2010-02-02
US61/300,595 2010-02-02
PCT/US2010/060297 WO2011096986A1 (en) 2010-02-02 2010-12-14 Moisture barrier potting compound

Publications (2)

Publication Number Publication Date
JP2013518971A JP2013518971A (ja) 2013-05-23
JP2013518971A5 true JP2013518971A5 (enExample) 2013-09-26

Family

ID=44355710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012551969A Pending JP2013518971A (ja) 2010-02-02 2010-12-14 防湿ポッティングコンパウンド

Country Status (6)

Country Link
US (1) US20120302685A1 (enExample)
EP (1) EP2532025A4 (enExample)
JP (1) JP2013518971A (enExample)
KR (1) KR20120114395A (enExample)
CN (1) CN102939651A (enExample)
WO (1) WO2011096986A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8894754B2 (en) * 2011-08-10 2014-11-25 Semprius, Inc. Breathing and desiccant regenerating cycle for reducing condensation in concentrator photovoltaic modules
JP2014212313A (ja) * 2013-04-05 2014-11-13 日東電工株式会社 太陽電池パネル端部シール用組成物、太陽電池パネル端部シール用シートおよび太陽電池パネル
JP6370197B2 (ja) * 2014-11-07 2018-08-08 アイカ工業株式会社 耐黄変性ホットメルトシール組成物
DE102016003487B4 (de) * 2016-03-24 2020-03-12 Azur Space Solar Power Gmbh Solarzelleneinheit und Solarzellenmodul
US20210082634A1 (en) * 2018-02-14 2021-03-18 Lg Electronics Inc. Solar cell module comprising perovskite solar cell and manufacturing method thereof
KR102543008B1 (ko) * 2018-05-30 2023-06-14 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 페로브스카이트 태양전지를 포함하는 태양전지 모듈 및 그 제조 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPH11317475A (ja) * 1998-02-27 1999-11-16 Canon Inc 半導体用封止材樹脂および半導体素子
DE10015290A1 (de) * 2000-03-28 2001-10-11 Henkel Teroson Gmbh Reaktives Schmelzstoff-Granulat für Isoliergals
CN100480324C (zh) * 2000-07-25 2009-04-22 三井化学株式会社 可固化组合物及其用途
JP2002037948A (ja) * 2000-07-25 2002-02-06 Mitsui Chemicals Inc 硬化性組成物およびその用途
US6544596B2 (en) * 2000-11-29 2003-04-08 Pacific Northwest Coatings Method of coating a substrate using a thermosetting basecoat composition and a thermoplastic top coat composition
TW200726784A (en) * 2003-04-07 2007-07-16 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
FR2859814A1 (fr) 2003-09-12 2005-03-18 Nexans Composition electriquement isolante et thermiquement resistante
US8263722B2 (en) 2004-03-24 2012-09-11 Exxonmobil Chemical Patents Inc. Process for making ethylene interpolymers and interpolymers made thereby; compositions and electrical devices containing such interpolymers
CN101138095B (zh) * 2005-03-08 2010-10-06 三井-杜邦聚合化学株式会社 太阳能电池密封材料
US8089062B2 (en) * 2005-03-23 2012-01-03 Xerox Corporation Wax encapsulated electronic devices
KR101036728B1 (ko) * 2005-03-25 2011-05-24 스미토모 베이클라이트 가부시키가이샤 반도체장치, 버퍼 코트용 수지 조성물, 다이 본딩용 수지 조성물 및 봉지용 수지 조성물
JP5143835B2 (ja) * 2006-07-03 2013-02-13 ダウ・コーニング・コーポレイション 化学的硬化性一体型ウォームエッジスペーサー及びシール
JP2008019403A (ja) * 2006-07-14 2008-01-31 Jsr Corp 酸化物微粒子含有樹脂組成物およびその製造方法
US20090159117A1 (en) * 2007-12-20 2009-06-25 Truseal Technologies, Inc. Hot melt sealant containing desiccant for use in photovoltaic modules

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