JP2013518971A - 防湿ポッティングコンパウンド - Google Patents

防湿ポッティングコンパウンド Download PDF

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Publication number
JP2013518971A
JP2013518971A JP2012551969A JP2012551969A JP2013518971A JP 2013518971 A JP2013518971 A JP 2013518971A JP 2012551969 A JP2012551969 A JP 2012551969A JP 2012551969 A JP2012551969 A JP 2012551969A JP 2013518971 A JP2013518971 A JP 2013518971A
Authority
JP
Japan
Prior art keywords
potting compound
amount
weight
compound
formulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012551969A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013518971A5 (enExample
Inventor
ワード，サミュエル
ウーム，ヘウォン・エル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adco Products Inc
Original Assignee
Adco Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adco Products Inc filed Critical Adco Products Inc
Publication of JP2013518971A publication Critical patent/JP2013518971A/ja
Publication of JP2013518971A5 publication Critical patent/JP2013518971A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/804—Materials of encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photovoltaic Devices (AREA)
JP2012551969A 2010-02-02 2010-12-14 防湿ポッティングコンパウンド Pending JP2013518971A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US30059510P 2010-02-02 2010-02-02
US61/300,595 2010-02-02
PCT/US2010/060297 WO2011096986A1 (en) 2010-02-02 2010-12-14 Moisture barrier potting compound

Publications (2)

Publication Number Publication Date
JP2013518971A true JP2013518971A (ja) 2013-05-23
JP2013518971A5 JP2013518971A5 (enExample) 2013-09-26

Family

ID=44355710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012551969A Pending JP2013518971A (ja) 2010-02-02 2010-12-14 防湿ポッティングコンパウンド

Country Status (6)

Country Link
US (1) US20120302685A1 (enExample)
EP (1) EP2532025A4 (enExample)
JP (1) JP2013518971A (enExample)
KR (1) KR20120114395A (enExample)
CN (1) CN102939651A (enExample)
WO (1) WO2011096986A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089098A (ja) * 2014-11-07 2016-05-23 アイカ工業株式会社 耐黄変性ホットメルトシール組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8894754B2 (en) * 2011-08-10 2014-11-25 Semprius, Inc. Breathing and desiccant regenerating cycle for reducing condensation in concentrator photovoltaic modules
JP2014212313A (ja) * 2013-04-05 2014-11-13 日東電工株式会社 太陽電池パネル端部シール用組成物、太陽電池パネル端部シール用シートおよび太陽電池パネル
DE102016003487B4 (de) * 2016-03-24 2020-03-12 Azur Space Solar Power Gmbh Solarzelleneinheit und Solarzellenmodul
US20210082634A1 (en) * 2018-02-14 2021-03-18 Lg Electronics Inc. Solar cell module comprising perovskite solar cell and manufacturing method thereof
KR102543008B1 (ko) * 2018-05-30 2023-06-14 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 페로브스카이트 태양전지를 포함하는 태양전지 모듈 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002037948A (ja) * 2000-07-25 2002-02-06 Mitsui Chemicals Inc 硬化性組成物およびその用途
US20030162882A1 (en) * 2000-03-28 2003-08-28 Stefan Grimm Reactive hot-melt-type adhesive granulate for insulating glass
WO2008005214A2 (en) * 2006-07-03 2008-01-10 Dow Corning Corporation Chemically curing all-in-one warm edge spacer and seal

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPH11317475A (ja) * 1998-02-27 1999-11-16 Canon Inc 半導体用封止材樹脂および半導体素子
CN100480324C (zh) * 2000-07-25 2009-04-22 三井化学株式会社 可固化组合物及其用途
US6544596B2 (en) * 2000-11-29 2003-04-08 Pacific Northwest Coatings Method of coating a substrate using a thermosetting basecoat composition and a thermoplastic top coat composition
TW200726784A (en) * 2003-04-07 2007-07-16 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
FR2859814A1 (fr) 2003-09-12 2005-03-18 Nexans Composition electriquement isolante et thermiquement resistante
US8263722B2 (en) 2004-03-24 2012-09-11 Exxonmobil Chemical Patents Inc. Process for making ethylene interpolymers and interpolymers made thereby; compositions and electrical devices containing such interpolymers
CN101138095B (zh) * 2005-03-08 2010-10-06 三井-杜邦聚合化学株式会社 太阳能电池密封材料
US8089062B2 (en) * 2005-03-23 2012-01-03 Xerox Corporation Wax encapsulated electronic devices
KR101036728B1 (ko) * 2005-03-25 2011-05-24 스미토모 베이클라이트 가부시키가이샤 반도체장치, 버퍼 코트용 수지 조성물, 다이 본딩용 수지 조성물 및 봉지용 수지 조성물
JP2008019403A (ja) * 2006-07-14 2008-01-31 Jsr Corp 酸化物微粒子含有樹脂組成物およびその製造方法
US20090159117A1 (en) * 2007-12-20 2009-06-25 Truseal Technologies, Inc. Hot melt sealant containing desiccant for use in photovoltaic modules

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030162882A1 (en) * 2000-03-28 2003-08-28 Stefan Grimm Reactive hot-melt-type adhesive granulate for insulating glass
JP2002037948A (ja) * 2000-07-25 2002-02-06 Mitsui Chemicals Inc 硬化性組成物およびその用途
WO2008005214A2 (en) * 2006-07-03 2008-01-10 Dow Corning Corporation Chemically curing all-in-one warm edge spacer and seal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089098A (ja) * 2014-11-07 2016-05-23 アイカ工業株式会社 耐黄変性ホットメルトシール組成物

Also Published As

Publication number Publication date
US20120302685A1 (en) 2012-11-29
EP2532025A1 (en) 2012-12-12
KR20120114395A (ko) 2012-10-16
EP2532025A4 (en) 2013-07-17
WO2011096986A1 (en) 2011-08-11
CN102939651A (zh) 2013-02-20

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