JP2013514653A - ピンチャックで用いられる強化ピン、およびその強化ピンを用いるピンチャック - Google Patents
ピンチャックで用いられる強化ピン、およびその強化ピンを用いるピンチャック Download PDFInfo
- Publication number
- JP2013514653A JP2013514653A JP2012543940A JP2012543940A JP2013514653A JP 2013514653 A JP2013514653 A JP 2013514653A JP 2012543940 A JP2012543940 A JP 2012543940A JP 2012543940 A JP2012543940 A JP 2012543940A JP 2013514653 A JP2013514653 A JP 2013514653A
- Authority
- JP
- Japan
- Prior art keywords
- bulk material
- young
- modulus
- wafer
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000004033 plastic Substances 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims abstract description 5
- 239000013590 bulk material Substances 0.000 claims description 18
- 239000002033 PVDF binder Substances 0.000 claims description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 12
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 6
- 229920001774 Perfluoroether Polymers 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 6
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 6
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 6
- 229920002530 polyetherether ketone Polymers 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 229920007925 Ethylene chlorotrifluoroethylene (ECTFE) Polymers 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 claims description 3
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 claims description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 3
- 229920001519 homopolymer Polymers 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000011208 reinforced composite material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 15
- 239000007789 gas Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
【選択図】図2
Description
Claims (15)
- ウエハ状物品を処理するための装置であって、
前記物品に対して実行される処理動作中に前記ウエハ状物品を所定の位置に維持するよう構成されているホルダと、
前記ホルダと動作可能に係合され、前記物品のエッジの下方からまたは前記エッジから前記装置上で処理される前記ウエハ状物品を支持するように構成され、前記ホルダに対して配置されている複数の支持ピンと、
を備え、
前記支持ピンは、化学的に不活性なバルク材料で形成され空洞を規定する本体と、前記バルク材料よりも大きいヤング率を有する材料で形成され前記空洞内に配置されている挿入材とを備える、装置。 - 請求項1に記載の装置であって、前記ホルダは、半導体デバイスの枚葉式ウエハ湿式処理のための処理チャンバによって囲まれるスピンチャックである、装置。
- 請求項1に記載の装置であって、前記ピンは前記ウエハ状物品が配置される前記ホルダ上における領域を囲むように円形の列に配置されており、前記ピンは前記ウエハ状物品とエッジで接触することによって前記所定の位置から外れる側方移動を制限するよう適合されている、装置。
- 請求項1に記載の装置であって、前記バルク材料は、化学的に不活性なプラスチックである、装置。
- 請求項1に記載の装置であって、前記バルク材料は、ポリテトラフルオロエチレン(PTFE)、パーフルオロアルコキシ(PFA)、ポリフェニレンサルファイド(PPS)、ポリエーテルエーテルケトン(PEEK)、ポリスチレン/ポリエチルスチレン(PS/PES)、エチレンテトラフルオロエチレン(ETFE)、ポリビニリデンフルオライド(PVDF)、クロロトリフルオロエチレンのホモポリマ(PCTFE)、フッ化エチレンプロピレン(FEP)、および、エチレンクロロトリフルオロエチレン(ECTFE)からなる群より選択される、装置。
- 請求項5に記載の装置であって、前記バルク材料は、ポリテトラフルオロエチレン(PTFE)またはポリビニリデンフルオライド(PVDF)である、装置。
- 請求項1に記載の装置であって、前記挿入材は、炭素繊維強化複合材料である、装置。
- 請求項1に記載の装置であって、前記挿入材は、ステンレス鋼またはチタンである、装置。
- 請求項1に記載の装置であって、前記挿入材は、ヤング率をN/mm2で表した場合に、前記バルク材料よりも少なくとも1桁大きいヤング率を有する、装置。
- 請求項1に記載の装置であって、前記挿入材は、ヤング率をN/mm2で表した場合に、前記バルク材料よりも少なくとも2桁大きいヤング率を有する、装置。
- ウエハ状物品を処理するための装置で用いるピンであって、
化学的に不活性なバルク材料で形成され空洞を規定する本体と、
前記バルク材料よりも大きいヤング率を有する材料で形成され前記空洞内に配置されている挿入材とを備える、ピン。 - 請求項11に記載のピンであって、前記バルク材料は、ポリテトラフルオロエチレン(PTFE)、パーフルオロアルコキシ(PFA)、ポリフェニレンサルファイド(PPS)、ポリエーテルエーテルケトン(PEEK)、ポリスチレン/ポリエチルスチレン(PS/PES)、エチレンテトラフルオロエチレン(ETFE)、ポリビニリデンフルオライド(PVDF)、クロロトリフルオロエチレンのホモポリマ(PCTFE)、フッ化エチレンプロピレン(FEP)、および、エチレンクロロトリフルオロエチレン(ECTFE)からなる群より選択される、ピン。
- 請求項11に記載のピンであって、前記挿入材は、炭素繊維強化複合材料またはステンレス鋼またはチタンである、ピン。
- 請求項11に記載のピンであって、前記挿入材は、ヤング率をN/mm2で表した場合に、前記バルク材料よりも少なくとも1桁大きいヤング率を有する、ピン。
- 請求項14に記載のピンであって、前記挿入材は、ヤング率をN/mm2で表した場合に、前記バルク材料よりも少なくとも2桁大きいヤング率を有する、ピン。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/642,141 | 2009-12-18 | ||
US12/642,141 US8608146B2 (en) | 2009-12-18 | 2009-12-18 | Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin |
PCT/IB2010/055551 WO2011073841A2 (en) | 2009-12-18 | 2010-12-02 | Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013514653A true JP2013514653A (ja) | 2013-04-25 |
JP5916619B2 JP5916619B2 (ja) | 2016-05-11 |
Family
ID=44149946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012543940A Active JP5916619B2 (ja) | 2009-12-18 | 2010-12-02 | ピンチャックで用いられる強化ピン、およびその強化ピンを用いるピンチャック |
Country Status (8)
Country | Link |
---|---|
US (1) | US8608146B2 (ja) |
EP (1) | EP2513962B1 (ja) |
JP (1) | JP5916619B2 (ja) |
KR (1) | KR101807327B1 (ja) |
CN (1) | CN102656680B (ja) |
SG (1) | SG180878A1 (ja) |
TW (1) | TWI476851B (ja) |
WO (1) | WO2011073841A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101729125B1 (ko) | 2015-11-17 | 2017-04-24 | 세메스 주식회사 | 스핀 헤드와 이를 포함하는 기판 처리 설비 및 기판 처리 방법 |
KR20230102605A (ko) * | 2021-12-30 | 2023-07-07 | 주식회사 에이이엘코리아 | 매엽식 세정장치용 스핀척 장치 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9136155B2 (en) * | 2011-11-17 | 2015-09-15 | Lam Research Ag | Method and device for processing wafer shaped articles |
US9633890B2 (en) * | 2011-12-16 | 2017-04-25 | Lam Research Ag | Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device |
JP5606471B2 (ja) * | 2012-02-20 | 2014-10-15 | 株式会社東芝 | 基板回転保持装置および基板処理装置 |
KR101417346B1 (ko) | 2012-09-21 | 2014-07-08 | 기아자동차주식회사 | 차량의 공조시스템 조작장치 |
JP6053528B2 (ja) * | 2013-01-11 | 2016-12-27 | 株式会社荏原製作所 | 基板把持装置 |
US9418883B2 (en) * | 2013-07-03 | 2016-08-16 | Lam Research Ag | Device for holding wafer shaped articles |
US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
US9536770B2 (en) * | 2014-01-14 | 2017-01-03 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
TWI556878B (zh) * | 2014-02-26 | 2016-11-11 | 辛耘企業股份有限公司 | 流體加速裝置 |
US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
US20170140975A1 (en) * | 2015-11-17 | 2017-05-18 | Semes Co., Ltd. | Spin head, apparatus and method for treating a substrate including the spin head |
WO2018200398A1 (en) | 2017-04-25 | 2018-11-01 | Veeco Precision Surface Processing Llc | Semiconductor wafer processing chamber |
US10658221B2 (en) * | 2017-11-14 | 2020-05-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer cleaning apparatus and method for cleaning semiconductor wafer |
GB202012725D0 (en) * | 2020-08-14 | 2020-09-30 | Lam Res Ag | Apparatus for processing a wafer-shaped article |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4903717A (en) * | 1987-11-09 | 1990-02-27 | Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H | Support for slice-shaped articles and device for etching silicon wafers with such a support |
US5513668A (en) * | 1993-02-08 | 1996-05-07 | Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Gesellschaft M.B.H. | Support for disk-shaped articles |
JPH0917742A (ja) * | 1995-06-30 | 1997-01-17 | Hitachi Ltd | 熱処理装置 |
JPH09165290A (ja) * | 1995-12-15 | 1997-06-24 | Komatsu Electron Metals Co Ltd | 半導体単結晶引き上げ装置の黒鉛るつぼおよびるつぼのハンドリング方法 |
JPH1064874A (ja) * | 1996-08-23 | 1998-03-06 | Shibaura Eng Works Co Ltd | スピン処理装置 |
JP2003303816A (ja) * | 2002-03-29 | 2003-10-24 | Samsung Electronics Co Ltd | 半導体基板を加工するための電極組立体及びこれを有する加工装置 |
JP2004140163A (ja) * | 2002-10-17 | 2004-05-13 | Tatsumo Kk | 基板支持装置 |
JP2006093203A (ja) * | 2004-09-21 | 2006-04-06 | Nitto Denko Corp | 円形平面基板の吸着支持装置 |
US20060156981A1 (en) * | 2005-01-18 | 2006-07-20 | Kyle Fondurulia | Wafer support pin assembly |
JP2009295751A (ja) * | 2008-06-04 | 2009-12-17 | Ebara Corp | 基板把持機構および基板把持方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4213698A (en) * | 1978-12-01 | 1980-07-22 | Bell Telephone Laboratories, Incorporated | Apparatus and method for holding and planarizing thin workpieces |
US4357006A (en) * | 1980-11-28 | 1982-11-02 | International Business Machines Corporation | Distortion free 3 point vacuum fixture |
EP0456426B1 (en) | 1990-05-07 | 2004-09-15 | Canon Kabushiki Kaisha | Vacuum type wafer holder |
US5238499A (en) | 1990-07-16 | 1993-08-24 | Novellus Systems, Inc. | Gas-based substrate protection during processing |
US5439416A (en) * | 1990-12-24 | 1995-08-08 | Xerox Corporation | Composite shaft with integrally molded functional feature |
JPH0590238A (ja) * | 1991-09-27 | 1993-04-09 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置の基板回転保持具 |
US5207750A (en) * | 1992-06-24 | 1993-05-04 | Illinois Tool Works Inc. | Insert moldable ratchet rivet assembly |
US5690454A (en) * | 1992-11-23 | 1997-11-25 | Dry Dock Industries, Inc. | Anchoring retainer for threaded fasteners |
US5387389A (en) * | 1993-12-23 | 1995-02-07 | Roehr Tool Corporation | Injection molding method and system with expandable cavity element |
JP3398936B2 (ja) * | 1999-04-09 | 2003-04-21 | 日本エー・エス・エム株式会社 | 半導体処理装置 |
EP1052682B1 (de) * | 1999-04-28 | 2002-01-09 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Vorrichtung und Verfahren zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
JP2002093890A (ja) | 2000-09-19 | 2002-03-29 | Olympus Optical Co Ltd | リフトピン及びステージ装置 |
AU2002220001A1 (en) * | 2000-11-02 | 2002-05-15 | Airline Hydraulics Corp. | Compliant locking support fixture |
DE20022001U1 (de) * | 2000-12-27 | 2001-03-22 | Reichard Michael | Mehrteiliger Dübel |
US6513796B2 (en) * | 2001-02-23 | 2003-02-04 | International Business Machines Corporation | Wafer chuck having a removable insert |
WO2003006705A2 (en) | 2001-07-13 | 2003-01-23 | Newport Corporation | Wafer fabrication buffer station |
TWI261875B (en) * | 2002-01-30 | 2006-09-11 | Tokyo Electron Ltd | Processing apparatus and substrate processing method |
US6827789B2 (en) * | 2002-07-01 | 2004-12-07 | Semigear, Inc. | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
US7256132B2 (en) * | 2002-07-31 | 2007-08-14 | Applied Materials, Inc. | Substrate centering apparatus and method |
US7038441B2 (en) * | 2002-10-02 | 2006-05-02 | Suss Microtec Testsystems Gmbh | Test apparatus with loading device |
JP2006054289A (ja) | 2004-08-11 | 2006-02-23 | Nikon Corp | 基板保持装置、ステージ装置、露光装置、及びデバイスの製造方法 |
KR100642644B1 (ko) * | 2005-01-20 | 2006-11-10 | 삼성전자주식회사 | 웨이퍼 냉각장치 및 방법 |
US7419435B2 (en) * | 2006-03-09 | 2008-09-02 | Northrop Grumman Corporation | Composite torque tube captured end fitting |
US20080070707A1 (en) * | 2006-07-28 | 2008-03-20 | Nidec Sankyo Corporation | Rotor shaft and motor with rotor shaft |
US7311302B1 (en) * | 2006-09-25 | 2007-12-25 | Production Solutions, Inc. | Substrate support system |
JP4783762B2 (ja) * | 2007-08-31 | 2011-09-28 | 東京エレクトロン株式会社 | 基板載置台および基板処理装置 |
US7726637B2 (en) * | 2007-09-10 | 2010-06-01 | Gm Global Technology Operations, Inc. | Reconfigurable clamp and method of use thereof |
US20110097177A1 (en) * | 2009-10-28 | 2011-04-28 | Carnevali Jeffrey D | Ball mount having center fastener |
US9190310B2 (en) * | 2010-04-16 | 2015-11-17 | Lam Research Ag | Grounded chuck |
-
2009
- 2009-12-18 US US12/642,141 patent/US8608146B2/en active Active
-
2010
- 2010-12-02 SG SG2012035622A patent/SG180878A1/en unknown
- 2010-12-02 EP EP10837142.8A patent/EP2513962B1/en active Active
- 2010-12-02 CN CN201080056623.0A patent/CN102656680B/zh active Active
- 2010-12-02 JP JP2012543940A patent/JP5916619B2/ja active Active
- 2010-12-02 KR KR1020127015636A patent/KR101807327B1/ko active IP Right Grant
- 2010-12-02 WO PCT/IB2010/055551 patent/WO2011073841A2/en active Application Filing
- 2010-12-17 TW TW099144479A patent/TWI476851B/zh active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4903717A (en) * | 1987-11-09 | 1990-02-27 | Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H | Support for slice-shaped articles and device for etching silicon wafers with such a support |
US5513668A (en) * | 1993-02-08 | 1996-05-07 | Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Gesellschaft M.B.H. | Support for disk-shaped articles |
JPH0917742A (ja) * | 1995-06-30 | 1997-01-17 | Hitachi Ltd | 熱処理装置 |
JPH09165290A (ja) * | 1995-12-15 | 1997-06-24 | Komatsu Electron Metals Co Ltd | 半導体単結晶引き上げ装置の黒鉛るつぼおよびるつぼのハンドリング方法 |
JPH1064874A (ja) * | 1996-08-23 | 1998-03-06 | Shibaura Eng Works Co Ltd | スピン処理装置 |
JP2003303816A (ja) * | 2002-03-29 | 2003-10-24 | Samsung Electronics Co Ltd | 半導体基板を加工するための電極組立体及びこれを有する加工装置 |
JP2004140163A (ja) * | 2002-10-17 | 2004-05-13 | Tatsumo Kk | 基板支持装置 |
JP2006093203A (ja) * | 2004-09-21 | 2006-04-06 | Nitto Denko Corp | 円形平面基板の吸着支持装置 |
US20060156981A1 (en) * | 2005-01-18 | 2006-07-20 | Kyle Fondurulia | Wafer support pin assembly |
JP2009295751A (ja) * | 2008-06-04 | 2009-12-17 | Ebara Corp | 基板把持機構および基板把持方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101729125B1 (ko) | 2015-11-17 | 2017-04-24 | 세메스 주식회사 | 스핀 헤드와 이를 포함하는 기판 처리 설비 및 기판 처리 방법 |
KR101757813B1 (ko) * | 2015-11-17 | 2017-07-26 | 세메스 주식회사 | 스핀 헤드와 이를 포함하는 기판 처리 설비 및 기판 처리 방법 |
KR20230102605A (ko) * | 2021-12-30 | 2023-07-07 | 주식회사 에이이엘코리아 | 매엽식 세정장치용 스핀척 장치 |
KR102647933B1 (ko) | 2021-12-30 | 2024-03-14 | 주식회사 에이이엘코리아 | 매엽식 세정장치용 스핀척 장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2011073841A3 (en) | 2011-12-29 |
SG180878A1 (en) | 2012-07-30 |
WO2011073841A2 (en) | 2011-06-23 |
KR20120105474A (ko) | 2012-09-25 |
TW201145424A (en) | 2011-12-16 |
US8608146B2 (en) | 2013-12-17 |
TWI476851B (zh) | 2015-03-11 |
EP2513962A2 (en) | 2012-10-24 |
CN102656680B (zh) | 2016-06-22 |
JP5916619B2 (ja) | 2016-05-11 |
EP2513962B1 (en) | 2020-09-30 |
US20110148022A1 (en) | 2011-06-23 |
KR101807327B1 (ko) | 2017-12-08 |
EP2513962A4 (en) | 2013-11-27 |
CN102656680A (zh) | 2012-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5916619B2 (ja) | ピンチャックで用いられる強化ピン、およびその強化ピンを用いるピンチャック | |
KR102133658B1 (ko) | 접지식 척 | |
TWI677939B (zh) | 基板保持裝置 | |
KR102164657B1 (ko) | 웨이퍼 형상 아티클들의 액체 처리를 위한 장치 | |
KR102240851B1 (ko) | 웨이퍼 형상 물체를 홀딩하기 위한 디바이스 | |
JP6777985B2 (ja) | 基板保持装置 | |
TW201034791A (en) | Carrier head membrane | |
KR20140107492A (ko) | 웨이퍼 형상 물체의 표면을 처리하는 디바이스 및 이 디바이스에서 사용되는 그립핑 핀 | |
US20040231711A1 (en) | Spin chuck for wafer or LCD processing | |
CN104752281A (zh) | 用于处理晶片状物品的表面的装置 | |
KR101459271B1 (ko) | 기판 스피닝 장치의 접촉 지지체 | |
JP6422827B2 (ja) | 基板処理装置 | |
TWI649824B (zh) | 晶圓狀物件之表面的處理設備 | |
KR20150133967A (ko) | 기판 스피닝 장치의 회전 지지대 | |
US20230298928A1 (en) | Apparatus for processing a wafer-shaped article | |
JP6442361B2 (ja) | 基板処理装置 | |
US20170287768A1 (en) | Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving Process | |
JP2003234398A (ja) | 曲面ウェハー用吸着台 | |
KR20150087223A (ko) | 웨이퍼의 수용 및 장착을 위한 수용장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140805 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150421 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150715 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160322 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160405 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5916619 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |