JP2013511813A5 - - Google Patents

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Publication number
JP2013511813A5
JP2013511813A5 JP2012540084A JP2012540084A JP2013511813A5 JP 2013511813 A5 JP2013511813 A5 JP 2013511813A5 JP 2012540084 A JP2012540084 A JP 2012540084A JP 2012540084 A JP2012540084 A JP 2012540084A JP 2013511813 A5 JP2013511813 A5 JP 2013511813A5
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JP
Japan
Prior art keywords
composition
conductive particle
conductive
covalently bonded
modified nanoparticles
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JP2012540084A
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English (en)
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JP2013511813A (ja
JP5690352B2 (ja
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Priority claimed from PCT/US2010/057399 external-priority patent/WO2011063217A2/en
Publication of JP2013511813A publication Critical patent/JP2013511813A/ja
Publication of JP2013511813A5 publication Critical patent/JP2013511813A5/ja
Application granted granted Critical
Publication of JP5690352B2 publication Critical patent/JP5690352B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

  1. 複数の導電性粒子を含む組成物であって、
    各導電性粒子が、前記導電性粒子の表面に共有結合した複数の表面修飾ナノ粒子を含む、組成物。
JP2012540084A 2009-11-20 2010-11-19 表面修飾ナノ粒子が共有結合した導電性粒子を含む組成物及びその製造方法 Expired - Fee Related JP5690352B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26293409P 2009-11-20 2009-11-20
US61/262,934 2009-11-20
PCT/US2010/057399 WO2011063217A2 (en) 2009-11-20 2010-11-19 Compositions comprising conductive particles with surface-modified nanoparticles covalently attached thereto, and methods of making

Publications (3)

Publication Number Publication Date
JP2013511813A JP2013511813A (ja) 2013-04-04
JP2013511813A5 true JP2013511813A5 (ja) 2013-09-05
JP5690352B2 JP5690352B2 (ja) 2015-03-25

Family

ID=44060360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012540084A Expired - Fee Related JP5690352B2 (ja) 2009-11-20 2010-11-19 表面修飾ナノ粒子が共有結合した導電性粒子を含む組成物及びその製造方法

Country Status (5)

Country Link
US (1) US9153354B2 (ja)
EP (1) EP2502239A4 (ja)
JP (1) JP5690352B2 (ja)
CN (1) CN102714071A (ja)
WO (1) WO2011063217A2 (ja)

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CN102741338B (zh) 2010-02-11 2015-04-15 3M创新有限公司 包括分散的多峰表面改性纳米粒子的树脂体系
WO2011133518A1 (en) * 2010-04-20 2011-10-27 3M Innovative Properties Company Pressure sensitive adhesives containing polymeric surface-modified nanoparticles
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WO2013178692A1 (en) 2012-05-29 2013-12-05 Conpart As Isotropic conductive adhesive
US20140170427A1 (en) * 2012-12-13 2014-06-19 Carestream Health, Inc. Anticorrosion agents for transparent conductive film
JP2017066407A (ja) * 2013-11-27 2017-04-06 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤
JP6106148B2 (ja) * 2013-11-27 2017-03-29 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤
CN104951156A (zh) * 2014-03-31 2015-09-30 宸盛光电有限公司 电容式触控装置
EP2991079B1 (en) * 2014-08-29 2017-10-04 Heraeus Deutschland GmbH & Co. KG Electrically conductive composition
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CN104845548B (zh) * 2015-04-24 2017-05-03 京东方科技集团股份有限公司 一种导电胶组合物及其制备方法、封框胶、显示面板
KR102339086B1 (ko) * 2016-03-31 2021-12-14 닛산 가가쿠 가부시키가이샤 양친매성의 유기실란 화합물이 결합한 무기산화물 미립자, 그 유기용매 분산액 및 피막형성용 조성물
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CN110300780A (zh) * 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体
US11168235B2 (en) 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
US10434704B2 (en) 2017-08-18 2019-10-08 Ppg Industries Ohio, Inc. Additive manufacturing using polyurea materials
WO2020070806A1 (ja) * 2018-10-02 2020-04-09 日立化成株式会社 樹脂組成物、硬化物及び半導体部品
WO2020198673A1 (en) * 2019-03-28 2020-10-01 Carbo Ceramics Inc. Composition and process for pelletizing carbon-based materials for proppant and industrial applications

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