JP2013510224A5 - - Google Patents
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- Publication number
- JP2013510224A5 JP2013510224A5 JP2012537890A JP2012537890A JP2013510224A5 JP 2013510224 A5 JP2013510224 A5 JP 2013510224A5 JP 2012537890 A JP2012537890 A JP 2012537890A JP 2012537890 A JP2012537890 A JP 2012537890A JP 2013510224 A5 JP2013510224 A5 JP 2013510224A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- composition
- varnish
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims 9
- 229920000647 polyepoxide Polymers 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims 3
- 239000002966 varnish Substances 0.000 claims 3
- 239000002904 solvent Substances 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000004843 novolac epoxy resin Substances 0.000 claims 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25885809P | 2009-11-06 | 2009-11-06 | |
| US61/258,858 | 2009-11-06 | ||
| PCT/US2010/052023 WO2011056352A1 (en) | 2009-11-06 | 2010-10-08 | Storage stable epoxy resin compositions for electrical laminates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013510224A JP2013510224A (ja) | 2013-03-21 |
| JP2013510224A5 true JP2013510224A5 (OSRAM) | 2013-11-28 |
| JP5798566B2 JP5798566B2 (ja) | 2015-10-21 |
Family
ID=43707754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012537890A Expired - Fee Related JP5798566B2 (ja) | 2009-11-06 | 2010-10-08 | 電気用積層板用の貯蔵安定性エポキシ樹脂組成物関連出願の相互参照本出願は、２００９年１１月６日付で出願された米国特許出願第６１／２５８，８５８号の優先権を主張し、その全内容は、参照により本明細書に組み込まれる。 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8980376B2 (OSRAM) |
| EP (1) | EP2496632B1 (OSRAM) |
| JP (1) | JP5798566B2 (OSRAM) |
| KR (1) | KR20120115247A (OSRAM) |
| CN (2) | CN106751517A (OSRAM) |
| TW (1) | TWI496834B (OSRAM) |
| WO (1) | WO2011056352A1 (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892302A (zh) * | 2010-05-13 | 2013-01-23 | 农业基因遗传学有限公司 | 褐色中脉玉米青贮饲料在肉牛中替换玉米的用途 |
| CN103045043A (zh) * | 2012-12-11 | 2013-04-17 | 金继典 | 一种酒瓶透明光亮面油及其制备工艺 |
| JP6447557B2 (ja) * | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038421A (ja) | 1983-08-11 | 1985-02-28 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂組成物 |
| US4550128A (en) | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
| MY131084A (en) | 1991-04-03 | 2007-07-31 | Dow Chemical Co | Epoxy resin compositions for use in electrical laminates. |
| US5670250A (en) | 1995-02-24 | 1997-09-23 | Polyclad Laminates, Inc. | Circuit board prepreg with reduced dielectric constant |
| JPH10168287A (ja) | 1996-12-06 | 1998-06-23 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| JP4080546B2 (ja) * | 1997-01-21 | 2008-04-23 | ダウ グローバル テクノロジーズ インコーポレイティド | エポキシ硬化系のための潜触媒 |
| GB9817799D0 (en) | 1998-08-14 | 1998-10-14 | Dow Deutschland Inc | Viscosity modifier for thermosetting resin compositioning |
| WO2000076764A1 (en) * | 1999-06-10 | 2000-12-21 | Isola Laminate Systems Corp. | Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer |
| US6245696B1 (en) * | 1999-06-25 | 2001-06-12 | Honeywell International Inc. | Lasable bond-ply materials for high density printed wiring boards |
| US6361923B1 (en) * | 1999-08-17 | 2002-03-26 | International Business Machines Corporation | Laser ablatable material and its use |
| WO2001042359A1 (en) | 1999-12-13 | 2001-06-14 | Dow Global Technologies Inc. | Flame retardant phosphorus element-containing epoxy resin compositions |
| DE50201326D1 (de) * | 2002-10-19 | 2004-11-18 | Leuna Harze Gmbh | Härtbare Epoxidharzzusammensetzung |
| US6855738B2 (en) | 2003-06-06 | 2005-02-15 | Dow Global Technologies Inc. | Nanoporous laminates |
| TWI290945B (en) * | 2005-11-09 | 2007-12-11 | Taiwan Union Technology Corp | Application of electrical material in high frequency and manufacturing method of the same |
| CN101341181B (zh) | 2005-12-22 | 2013-09-04 | 陶氏环球技术有限责任公司 | 可固化环氧树脂组合物及由其制造的层压材料 |
| EP2084206A2 (en) * | 2006-10-19 | 2009-08-05 | Dow Global Technologies Inc. | Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same |
| US8313571B2 (en) | 2007-09-21 | 2012-11-20 | Microchem Corp. | Compositions and processes for manufacturing printed electronics |
| JP5235155B2 (ja) * | 2009-04-08 | 2013-07-10 | パナソニック株式会社 | 微細樹脂構造体及び光電回路基板の製造方法、微細樹脂構造体及び光電回路基板 |
-
2010
- 2010-10-08 EP EP20100766197 patent/EP2496632B1/en not_active Not-in-force
- 2010-10-08 KR KR20127014586A patent/KR20120115247A/ko not_active Ceased
- 2010-10-08 CN CN201611176356.6A patent/CN106751517A/zh active Pending
- 2010-10-08 JP JP2012537890A patent/JP5798566B2/ja not_active Expired - Fee Related
- 2010-10-08 CN CN2010800604266A patent/CN102695744A/zh active Pending
- 2010-10-08 US US13/505,126 patent/US8980376B2/en not_active Expired - Fee Related
- 2010-10-08 WO PCT/US2010/052023 patent/WO2011056352A1/en not_active Ceased
- 2010-10-14 TW TW099135049A patent/TWI496834B/zh not_active IP Right Cessation
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