JP2013500371A5 - - Google Patents
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- JP2013500371A5 JP2013500371A5 JP2012522164A JP2012522164A JP2013500371A5 JP 2013500371 A5 JP2013500371 A5 JP 2013500371A5 JP 2012522164 A JP2012522164 A JP 2012522164A JP 2012522164 A JP2012522164 A JP 2012522164A JP 2013500371 A5 JP2013500371 A5 JP 2013500371A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- viiia
- viii
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 150000001875 compounds Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009028100A DE102009028100A1 (de) | 2009-07-29 | 2009-07-29 | Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis |
| DE102009028100.2 | 2009-07-29 | ||
| PCT/EP2010/060958 WO2011012647A1 (de) | 2009-07-29 | 2010-07-28 | Schlagzähmodifizierte zusammensetzungen auf epoxidharzbasis |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013500371A JP2013500371A (ja) | 2013-01-07 |
| JP2013500371A5 true JP2013500371A5 (OSRAM) | 2013-09-12 |
Family
ID=43216902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012522164A Pending JP2013500371A (ja) | 2009-07-29 | 2010-07-28 | 耐衝撃性改良エポキシ樹脂系組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8541512B2 (OSRAM) |
| EP (1) | EP2459613B1 (OSRAM) |
| JP (1) | JP2013500371A (OSRAM) |
| CN (1) | CN102471459B (OSRAM) |
| DE (1) | DE102009028100A1 (OSRAM) |
| WO (1) | WO2011012647A1 (OSRAM) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009028099A1 (de) * | 2009-07-29 | 2011-02-03 | Henkel Ag & Co. Kgaa | Schlagzähmodifizierte Zusammensetzungen |
| JP5773201B2 (ja) * | 2011-08-15 | 2015-09-02 | Dic株式会社 | 感熱接着シート |
| DE102011114676A1 (de) * | 2011-09-30 | 2012-10-25 | Daimler Ag | FVK-Bauteil, Faser-Matrix-Halbzeug und Herstellungsverfahren |
| DE102012205057A1 (de) * | 2012-03-29 | 2013-10-02 | Henkel Ag & Co. Kgaa | Thermisch expandierbare Zubereitungen |
| WO2014062903A1 (en) * | 2012-10-19 | 2014-04-24 | Dow Global Technologies Llc | Polymer particle dispersions with polyols |
| CN104812849A (zh) * | 2012-12-04 | 2015-07-29 | 沙特基础全球技术有限公司 | 用于涂覆金属或聚合物管的涂覆系统 |
| WO2014100238A2 (en) * | 2012-12-21 | 2014-06-26 | Dow Global Technologies Llc | Phase-segmented non-isocyanate elastomers |
| US9309353B2 (en) | 2013-08-09 | 2016-04-12 | The Boeing Company | Formulation methodology for distortional thermosets |
| DE102013108645B4 (de) * | 2013-08-09 | 2021-05-06 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verfahren zum Herstellen eines Prüfkörpers und Verwendung des Prüfkörpers |
| WO2015094896A1 (en) * | 2013-12-18 | 2015-06-25 | Dow Global Technologies Llc | Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents |
| TWI563033B (en) * | 2016-01-13 | 2016-12-21 | Truetime Ind Corp | Impact-resistant toughness modifier and method of preparing its modified epoxy resin composition |
| EP3642292B2 (en) | 2017-06-23 | 2025-07-02 | DDP Specialty Electronic Materials US, LLC | High temperature epoxy adhesive formulations |
| CZ308202B6 (cs) * | 2017-09-11 | 2020-02-26 | TESORO Spin off, s.r.o. | Flexibilní kompozitní materiály a způsob jejich přípravy a využití |
| CN111491972B (zh) * | 2017-12-19 | 2022-06-28 | Sika技术股份公司 | 增韧剂用于增大单组分热固化环氧树脂组合物的最大线性膨胀的用途 |
| US20210221971A1 (en) * | 2018-08-21 | 2021-07-22 | Evonik Operations Gmbh | Fast curing epoxy system for producing rigid foam and use of the foam in composites or as insulation material |
| CN109233944A (zh) * | 2018-08-30 | 2019-01-18 | 重庆交通大学 | 隧道盾构机盾尾密封材料 |
| ES2976501T3 (es) | 2019-07-09 | 2024-08-02 | Henkel Ag & Co Kgaa | Composición de dos componentes (2K) a base de resinas epoxi modificadas |
| EP3798246B1 (en) * | 2019-09-27 | 2024-01-31 | Henkel AG & Co. KGaA | One component (1k) composition based on modified epoxy resin |
| EP3825355A1 (de) * | 2019-11-22 | 2021-05-26 | Henkel AG & Co. KGaA | Formulierungen mit hohen glasübergangstemperaturen für laminate |
| CN114075367A (zh) * | 2020-08-18 | 2022-02-22 | 金门化工有限公司 | 耐冲击环氧树脂组成物、耐冲击膜、及包含其的压力瓶 |
| CN115010410A (zh) * | 2022-06-23 | 2022-09-06 | 重庆市智翔铺道技术工程有限公司 | 一种改性环氧树脂混凝土及其制备方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3346532A (en) | 1962-09-11 | 1967-10-10 | Gen Tire & Rubber Co | Elastomeric copolymers from dihydric phenols and organic diepoxides, their preparation and cure |
| DE2829236A1 (de) | 1977-07-06 | 1979-01-25 | Ciba Geigy Ag | Lineare, glycidyl- und hydroxylgruppenhaltige polyaetherharze |
| US4581072A (en) | 1982-06-08 | 1986-04-08 | Courtaulds Plc | Polymer solutions |
| GB2129808B (en) * | 1982-06-10 | 1986-07-09 | Dow Chemical Co | Advanced epoxy resins and coating compositions containing the advanced epoxy resins |
| US4661539A (en) * | 1986-03-21 | 1987-04-28 | Ashland Oil, Inc. | Sag resistant two-component epoxy structural adhesive |
| EP0276716A3 (en) * | 1987-01-30 | 1989-07-26 | General Electric Company | Uv curable epoxy resin compositions with delayed cure |
| US4835225A (en) * | 1988-01-13 | 1989-05-30 | The Dow Chemical Company | Modified advanced epoxy resins |
| DE3827626A1 (de) * | 1988-08-10 | 1990-03-08 | Teroson Gmbh | Reaktiver schmelzklebstoff |
| CA2112410C (en) * | 1991-06-26 | 2003-12-09 | Norman E. Blank | Reactive hot-melt adhesive |
| JP3252168B2 (ja) * | 1992-11-11 | 2002-01-28 | ジャパンエポキシレジン株式会社 | 新規なポリエーテル樹脂及び該樹脂を必須成分とする樹脂塗料 |
| EP0754741B1 (en) * | 1995-07-19 | 2001-10-24 | Raytheon Company | Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
| EP0754742B1 (en) * | 1995-07-19 | 2001-10-24 | Raytheon Company | Room-temperature stable, one-component, flexible epoxy adhesives |
| JP2001213938A (ja) * | 2000-01-31 | 2001-08-07 | Nippon Paint Co Ltd | アミノポリエーテル変性エポキシおよびこれを含有するカチオン電着塗料組成物 |
| US20030192643A1 (en) * | 2002-03-15 | 2003-10-16 | Rainer Schoenfeld | Epoxy adhesive having improved impact resistance |
| EP1431325A1 (de) | 2002-12-17 | 2004-06-23 | Sika Technology AG | Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit |
| DE10302298A1 (de) | 2003-01-22 | 2004-08-05 | Henkel Kgaa | Hitzehärtbare, thermisch expandierbare Zusammensetzung mit hohem Expansionsgrad |
| EP1498441A1 (de) | 2003-07-16 | 2005-01-19 | Sika Technology AG | Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren |
| PL1666519T3 (pl) | 2003-09-18 | 2014-09-30 | Kaneka Corp | Sposób wytwarzania kauczukowych cząstek polimerowych i sposób wytwarzania kompozycji żywicznej zawierającej je |
| DE10357355A1 (de) * | 2003-12-09 | 2005-07-14 | Henkel Kgaa | 2 K Klebstoffe für den Fahrzeugbau |
| JP4636593B2 (ja) * | 2004-08-27 | 2011-02-23 | 阪本薬品工業株式会社 | 熱硬化性エポキシ樹脂組成物 |
| JP4815877B2 (ja) * | 2005-05-31 | 2011-11-16 | Ｄｉｃ株式会社 | エポキシ樹脂組成物、その硬化物、新規ヒドロキシ化合物、新規エポキシ樹脂及びそれらの製造方法 |
| MX2008000040A (es) | 2005-07-01 | 2008-04-04 | Sika Technology Ag | Material termicamente expansible solido. |
| KR101303246B1 (ko) * | 2005-08-24 | 2013-09-06 | 헨켈 아일랜드 리미티드 | 개선된 내충격성을 갖는 에폭시 조성물 |
| US20080051524A1 (en) * | 2006-08-28 | 2008-02-28 | Henkel Corporation | Epoxy-Based Compositions Having Improved Impact Resistance |
| EP2186842B1 (de) * | 2008-11-15 | 2013-01-23 | Cognis IP Management GmbH | Verwendung von nanoporösen Polymerschaumstoffen als Wärmedämm-Materialien |
| EP2404959A1 (de) * | 2010-07-08 | 2012-01-11 | Cognis IP Management GmbH | Makroporen enthaltende Polymerschaumstoffe als Akustikdämmungs-Materialien |
-
2009
- 2009-07-29 DE DE102009028100A patent/DE102009028100A1/de not_active Ceased
-
2010
- 2010-07-28 CN CN201080033611.6A patent/CN102471459B/zh active Active
- 2010-07-28 WO PCT/EP2010/060958 patent/WO2011012647A1/de not_active Ceased
- 2010-07-28 JP JP2012522164A patent/JP2013500371A/ja active Pending
- 2010-07-28 EP EP20100735017 patent/EP2459613B1/de not_active Not-in-force
-
2012
- 2012-01-30 US US13/361,061 patent/US8541512B2/en not_active Expired - Fee Related