JP2013258300A - Chip mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip mounting device which allows for enhancement of various types of adjustment workability while avoiding hard work of a worker, by making the whole device compact.SOLUTION: The chip mounting device conveys a wafer ring holding a wafer sheet up to a pick-up position, and mounts the chips produced by individualizing the wafer sheet on a substrate. The chip mounting device includes an exchange stage for exchanging a wafer ring to be used and a used wafer ring, reciprocation means for reciprocating the wafer ring between the exchange stage and the pick-up position, and a drawer stage on which a ring magazine for housing the wafer rings in multiple stages is mounted, and which allows the ring magazine to be housed at a lower position of the exchange stage and to be drawn out forward.

Description

  The present invention relates to a chip mounting apparatus for bonding a chip (die) such as a semiconductor chip to a substrate such as a lead frame.

  As described in Patent Document 1 or the like, the chip mounting apparatus includes a substrate holding unit 101, a wafer ring holding unit 102, a wafer supply unit 103, and the like as shown in FIG. Is.

  The substrate holding unit 101 includes a substrate transport conveyor 101a disposed along the X direction, and transports the substrate 105 along the X direction. The wafer ring holding unit 102 holds the wafer ring 107 to which the wafer sheet 106 is attached. The wafer sheet 106 is singulated to form chips 108. The wafer supply unit 103 includes a magazine 110 that holds a plurality of stages of wafer rings 107 to which wafer sheets 106 are attached.

  In such an apparatus, the wafer ring 107 held in the magazine 110 is supplied to the wafer ring holder 102 by the transfer means, in this case, the transfer arm 111. In the wafer ring holding unit 102, the chip 108 of the wafer sheet 106 attached to the wafer ring 107 is sucked and pipped up by the mounting head 112 and mounted on the substrate 105 held by the substrate holding unit 101. The

  By the way, in such an apparatus, the substrate holding unit 101, the wafer ring holding unit 102, the wafer supply unit 103, and the like are arranged in a planar manner without being overlapped. For this reason, the arrangement space of the whole apparatus has become large.

  Further, when the chip 108 of the wafer sheet 106 of the wafer ring 107 in the wafer ring holding unit 102 is lost, it is necessary to supply a new wafer ring 107 to the wafer supply unit 103. For this reason, the transfer means provided with the transfer arm 111 constitutes a wafer ring exchanging means. As such replacement means, the used wafer ring 107 is taken out from the wafer ring holding unit 102 and returned to the magazine 110, and a new wafer ring 107 is taken out from the magazine 110 and supplied to the wafer ring holding unit 102. There is a need. For this reason, in order to replace the wafer ring, it is necessary to lift and lower the magazine 110 by elevator means as shown in Patent Document 2 and the like.

JP 2008-258524 A JP 2003-309165 A

  When the magazine 110 is moved up and down by the elevator means for exchanging the wafer ring, since the weight of the magazine 110 is large, it is necessary to increase the lifting force of the elevator means. It was.

  In the apparatus shown in FIG. 13, since the wafer ring holding unit 102 picks up an ejector pin, an expand ring, and the like. That is, during the pickup operation, tension is applied to the wafer sheet 106 by an expand ring, and in this state, the chip to be picked up is pushed up by the ejector pin.

  For this reason, as shown in FIG. 13, if the wafer ring replacement position and the pickup position are the same position, the pickup operation cannot be performed during the wafer ring replacement operation, and the wafer ring replacement operation is performed during the pickup operation. I can't. Therefore, the work time as a whole is long.

  Therefore, as shown in FIG. 14, it can be proposed to make the wafer ring replacement position different from the pickup position. That is, the chip mounting apparatus shown in FIG. 14 includes a wafer ring exchange stage 120, a ring elevator 123 for raising and lowering a magazine 122 that holds the wafer ring 121 in a plurality of stages, and a wafer ring exchange means 124. As the wafer ring exchanging means 124, the transfer arm 111 shown in FIG. 13 can be used.

  In this case, the elevator 123 and the wafer ring exchanging means 124 are disposed at 180 ° opposite positions with respect to the wafer ring exchanging position. The magazine 122 is moved up and down by the elevator 123, and the wafer ring 121 (wafer ring before use) having the chip to be picked up is chucked by the transfer arm 111, pulled out from the magazine 122 and placed on the wafer ring exchange stage 120. . Also, the wafer ring 121 (wafer ring after use) that has been picked up is returned to the wafer ring exchange stage 120, chucked by the transfer arm 111 on the exchange stage 120, moved as indicated by the arrow A, and magazine. 122.

  In this apparatus, the wafer ring 121 reciprocates between the pickup position and the exchange stage 120 as indicated by an arrow C. Further, the wafer ring 121 reciprocates between the elevator 123 and the exchange stage 120 as indicated by an arrow B.

  The pickup position is disposed obliquely behind the wafer ring replacement position. That is, the expander mechanism 125 reciprocates between the pickup position and the wafer ring replacement position. When the expander mechanism 125 is located at the wafer ring replacement position, the wafer ring 121 is replaced, and the expander mechanism 125 is expanded. When the panda mechanism 125 is located at the pickup position, the expander mechanism 125 applies tension to the wafer sheet, and in this state, the chip to be picked up is pushed up by the ejector pins.

  However, in the mounting apparatus as shown in FIG. 14, the magazine 122, the ring replacement position, and the wafer ring replacement means standby position are arranged on a straight line, and the overall width of the apparatus becomes large.

  Considering the configuration of each member, the center position PO at the pickup position needs to be arranged outside the apparatus with respect to the center position CO at the ring replacement position. For this reason, the overall width of the apparatus is large.

  By the way, such an implementation apparatus is provided with preform means for applying an adhesive to the island of the substrate and bonding means for mounting the chip on the island of the substrate. For this reason, adjustment of the preform operation by the preform means, adjustment of the bonding operation by the bonding means, and the like are required. The bonding operation includes a pickup operation for picking up a chip from the wafer sheet and a bonding operation for bonding the picked-up chip to the island of the substrate, and each operation needs to be adjusted.

  Therefore, in the apparatus shown in FIG. 14 that cannot be made compact as a whole, there are drawbacks in that various parts of the adjustment work are arranged at positions where it is difficult to work, and thus various kinds of work are difficult to perform. Further, the mounting table on which the magazine is mounted is disposed at a relatively high level. For this reason, the operation | work which mounts the magazine which is a heavy article on a high level mounting stand has become heavy labor for the operator.

  Therefore, in view of such a situation, the present invention provides a chip mounting apparatus that can reduce the overall size of the apparatus, improve various adjustment workability, and can avoid the labor of workers.

  A chip mounting apparatus according to the present invention is a chip mounting apparatus that transports a wafer ring holding a wafer sheet to a pickup position and mounts a chip on which the wafer sheet is separated into a substrate, and is a wafer before use. An exchange stage for exchanging the ring with the wafer ring after use, a reciprocating mechanism for reciprocating the wafer ring between the exchange stage and the pickup position, and a ring magazine for storing the wafer ring in multiple stages are mounted. And a drawer stage that enables storage at a lower position of the exchange stage of the ring magazine and pulling it forward.

  According to the chip mounting apparatus of the present invention, the drawer stage can be pulled forward, and the magazine can be positioned at the lower position of the replacement stage by storing the drawer stage at the lower position of the replacement stage. it can. For this reason, when the drawer stage is pulled forward, the drawer stage is positioned at a low position. Moreover, in this pulled out state, there is no other member above the pulling stage.

  The wafer ring before use exchanged at the exchange stage can be conveyed to the pickup position by the reciprocating mechanism. The chip can be picked up at this pickup position. Further, the wafer ring (used wafer ring) for which the chip has been picked up at the pickup position can be returned to the exchange stage by the reciprocating mechanism. Then, the used wafer ring on the replacement stage can be replaced with the pre-use wafer ring. For this reason, it is possible to carry the chip mounting work by sequentially transporting the pre-use wafer ring to the pickup.

  The center position of the wafer ring at the pick-up position is preferably arranged inside the apparatus with respect to the center position of the wafer ring on the exchange stage.

  A chip mounting apparatus including a ring changer for supplying a wafer ring before use of the ring magazine to an exchange stage and returning a wafer ring to the ring magazine after use of the exchange stage. A ring holder for holding the ring, a vertical movement mechanism for moving the ring holder up and down, chucking the wafer ring of the ring holder and supplying it to the exchange stage, and chucking the wafer ring of the exchange stage to hold the ring A chuck mechanism for returning to the body, and a switching mechanism for switching between an upper chuck position corresponding to the upper wafer ring of the ring holder in the chuck mechanism and a lower chuck position corresponding to the lower wafer ring of the ring holder. You can do it.

  In the apparatus provided with the ring changer, the wafer ring can be moved up and down in two stages by the lifting operation by the vertical movement mechanism. If the chuck mechanism is adapted to the upper wafer ring, the upper wafer ring can be chucked by the chuck mechanism, and the wafer ring supply operation to the exchange stage and the removal of the wafer ring from the exchange stage can be performed. . If the chuck mechanism corresponds to the lower wafer ring, the lower wafer ring can be chucked by the chuck mechanism, and the wafer ring supply operation to the replacement stage and the removal of the wafer ring from the replacement stage can be performed. In this way, the wafer ring replacement operation at each stage can be performed stably. In addition, since the vertical movement mechanism is provided, the ring holder can be lowered except during wafer ring replacement work.

  The chuck mechanism can chuck the wafer ring after use of the exchange stage at the lower chuck position and return it to the ring holder, and chuck the wafer ring before use of the ring holder at the upper chuck position and supply it to the exchange stage.

  The chuck mechanism can include a chuck portion with an opening / closing function that enables chucking of the wafer ring, and a transport mechanism that transports the wafer ring chucked by the chuck portion along the horizontal direction.

  The chuck mechanism chucks the wafer ring of the ring magazine housed at the lower position of the exchange stage and supplies it to the ring holder, and chucks the wafer ring of the ring holder and returns it to the ring magazine. Also good.

  The ring changer is preferably arranged on the side of the exchange stage and the ring magazine housed at a position below the exchange stage.

  A chip mounting apparatus provided with a bonding apparatus disposed on the rear side of the exchange stage, the bonding apparatus including a conveyance means for pitch-feeding the substrate from the upstream side to the downstream side along the conveyance direction; When the island of the substrate to which the adhesive is to be applied is conveyed to the preform position, the preform means for applying the adhesive to the island, and when the island to which the adhesive is applied is conveyed to the bonding position, It can be set to include a bonding means for bonding a chip to this island.

  In the case where the preform means and the bonding means are provided, the adhesive can be applied to the island in a state where the island of the substrate to which the adhesive is to be applied is conveyed to the preform position. Further, it is possible to bond the chip to the island in a state where the island to which the adhesive is applied is conveyed to the bonding position.

  In the present invention, in a state where the drawer stage is pulled forward, the stage is positioned at a low position, so that the work for placing the magazine on the stage can be reduced. In addition, if the drawer stage is stored, the magazine is stored below the replacement stage, and compactness can be achieved. For this reason, it is possible to improve various adjustments and maintainability of the apparatus. Further, in the pulled-out state of the drawer stage, there is no other member above the drawer stage, so that it is possible to facilitate the magazine placing operation and the removing operation.

  By disposing the center position of the wafer ring at the pickup position inside the apparatus relative to the center position of the wafer ring on the exchange stage, the entire apparatus can be made compact.

  In the raising / lowering operation by the vertical movement mechanism of the ring changer, it is only necessary to raise / lower the wafer ring in two stages, so that the vertical movement mechanism can be downsized. In the apparatus provided with the ring changer, the exchange operation of the wafer ring at each stage can be stably performed. Moreover, the ring holder can be lowered except during wafer ring replacement work, and various adjustments to the apparatus and further improvement in maintainability can be achieved.

  If the chuck mechanism includes a chuck portion with an opening / closing function and a transport mechanism, the wafer ring can be exchanged reliably. If it is possible to supply the wafer ring from the ring magazine to the ring holder and return the wafer ring from the ring holder to the ring magazine, the wafer ring can be exchanged between the ring magazine and the exchange stage. This contributes to improvement in workability and downsizing of the apparatus.

  If the ring changer is arranged on the side of the exchange stage and the ring magazine housed below the exchange stage, the entire apparatus can be made compact and the exchange time can be shortened.

  The apparatus having the preform means and the bonding means can perform the preforming operation and the bonding operation. If the magazine accommodated in the wafer ring is set on the drawer stage, the wafer ring accommodated in the magazine is Chips can be sequentially mounted on a substrate, and workability is excellent.

It is a simplified top view of the chip mounting apparatus of the embodiment of the present invention. FIG. 2 is a simplified overall plan view of the chip mounting apparatus shown in FIG. 1. FIG. 2 is a simplified diagram showing the operation of the ring changer of the chip mounting apparatus of FIG. 1. FIG. 2 is a simplified diagram showing the operation of the ring changer of the chip mounting apparatus of FIG. 1. FIG. 2 is a simplified diagram showing the operation of the ring changer of the chip mounting apparatus of FIG. 1. FIG. 2 is a simplified diagram showing the operation of the ring changer of the chip mounting apparatus of FIG. 1. FIG. 2 is a simplified diagram showing the operation of the ring changer of the chip mounting apparatus of FIG. 1. FIG. 2 is a simplified diagram showing the operation of the ring changer of the chip mounting apparatus of FIG. 1. FIG. 2 is a simplified diagram showing the operation of the ring changer of the chip mounting apparatus of FIG. 1. It is a simplified diagram showing preform means. It is a simplified diagram showing a bonding means. FIG. 12 is a perspective view of a chip bonded by the bonding means of FIG. 11. It is a simplified top view of the conventional chip mounting apparatus. It is a simplified top view of the other conventional chip mounting apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 is a simplified plan view of a chip mounting apparatus according to the present invention. This chip mounting apparatus is for bonding a chip (die) 3 such as a semiconductor chip to a substrate 1 such as a lead frame (see FIG. 10). A lead frame is a thin metal plate used as an internal wiring of a semiconductor package. For this reason, in the present invention, the board 1 includes a board generally called a lead frame and a board (for example, a printed board) on which various electronic components are arranged.

  In this chip mounting apparatus, the substrate 1 (see FIG. 10) on which a plurality of islands are formed at a predetermined pitch along the longitudinal direction is sequentially transferred to the substrate transport means 14 shown in FIG. 2 along the longitudinal direction. The adhesive 4 (see FIG. 11) is applied to the island of the substrate 1 at the upstream preform position, and then the chip 3 is bonded to the island of the substrate 1 at the downstream bonding position. It is.

  As shown in FIG. 2, the entire configuration of the chip mounting apparatus includes a preform unit 12 for applying the adhesive 4 to the island of the substrate 1, and the chip 3 on the island to which the adhesive 4 has been applied by the preform unit 12. The bonding means 13 for bonding, the substrate conveying means 14 for conveying the substrate 1, the ring changer 15 for exchanging the wafer ring 28 holding the wafer sheet 27 shown in FIG. 12 to be described later, and the wafer ring 28 in FIG. And a reciprocating means 16 for conveying from the exchange stage 30 shown to the pickup position.

  The preform unit 12, the bonding unit 13, the substrate transport unit 14, the ring changer 15, and the reciprocating unit 16 are controlled by the control unit 17. The control means 17 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The control means 17 is provided with a storage device as storage means. The storage device includes an HDD (Hard Disc Drive), a DVD (Digital Versatile Disk) drive, a CD-R (Compact Disc-Recordable) drive, an EEPROM (Electronically Erasable and Programmable Read Only Memory), and the like. The ROM stores programs executed by the CPU and data.

  The transport unit 14 includes, for example, a clamp mechanism that clamps the substrate 1 and a drive mechanism that moves the clamp portion of the clamp mechanism from the upstream side toward the downstream side. For example, a servo motor or the like can be used as the drive mechanism, and the substrate 1 can be sent to the downstream side at an arbitrary pitch (set pitch) under the control of the control means 17. That is, the island of the substrate 1 can be sequentially sent to the preform position and the bonding position.

  The conveying means 14 may be provided with a feeder such as a belt feeder including a driving wheel, a driven wheel, and a belt wound around these, and a driving mechanism for driving the feeder. . In this case, if the board | substrate 1 is supplied to a feeder, it will be arrange | positioned on a feeder in the state positioned by the positioning means (For example, the pin etc. which fit in the through-hole in which a board | substrate is formed). As the drive mechanism, for example, a servo motor or the like can be used. Under the control of the control means 17, the drive wheel of the feeder is driven to the set arbitrary rotation angle, and the substrate 1 is set to any pitch (set pitch). Can be sent downstream.

  At the preform position, a preform process (dispensing process) for applying the adhesive 4 to the island of the substrate 1 is performed. For this reason, as shown in FIG. 10, the preform means 12 includes an adhesive application syringe 21 having a nozzle 20 for discharging the adhesive 4 (see FIG. 11) and the syringe 21 in the X-axis direction (FIG. 1). And an XYZ stage 22 that is driven in the Y-axis direction (Y1, Y2 direction shown in FIG. 1) and the Z-axis direction (vertical direction). That is, the XYZ stage 22 includes an X stage 22a that is driven in the X axis direction, a Y stage 22b that is driven in the Y axis direction, and an X stage 22c that is driven in the Z axis direction.

  For this reason, the syringe 21 can move along the X-axis direction, move along the Y-axis direction, and move along the Z-axis direction. Thus, the adhesive 4 is discharged onto the island in a state where the nozzle 20 corresponds to the position of the island during preforming and the discharge amount (application amount) is controlled from the nozzle 20. Note that an island detection camera 23 is attached to the XYZ stage 22.

  At the bonding position, bonding is performed in which the chip (die) 3 is transported to the island to which the adhesive 4 has been applied and placed on the adhesive 4. For this reason, the bonding means 13 includes a bonding arm (not shown) having a collet 26 that attracts the chip 3 of the wafer ring 28 disposed at the pickup position 25, and a confirmation camera (not shown) that observes the chip 3 of the wafer ring 28. And a confirmation camera (not shown) for observing the island of the lead frame (substrate) 1 at the bonding position.

  The wafer sheet 27 is divided into a large number of chips 3. That is, the wafer sheet 27 is attached to an adhesive sheet (dicing sheet), and this dicing sheet is held by an annular frame. The wafer sheet 27 on the dicing sheet is separated into pieces using a circular blade (dicing saw) or the like to form the chips 3. Further, the bonding arm holding the collet 26 can be moved between the pickup position and the bonding position via a conveying means (not shown).

  Further, the chip 3 is vacuum-sucked through the suction hole opened in the lower end surface of the collet 26, and the chip 3 is adsorbed on the lower end surface of the collet 26. If this vacuum suction (evacuation) is released, the chip 3 is detached from the collet 26.

  Next, a bonding method using this bonding means will be described. First, the chip 3 to be picked up is observed with a confirmation camera arranged above the supply unit 25, the collet 26 is positioned above the chip 3 to be picked up, and then the collet 26 as indicated by an arrow Z1. Is lowered to pick up the chip 3. Thereafter, the collet 26 is raised as indicated by the arrow Z2.

  Next, the island of the lead frame 1 to be bonded is observed with a confirmation camera disposed above the bonding position, and the collet 26 is moved in the direction of the arrow Y3 to be positioned above the island. The collet 26 is moved downward as indicated by an arrow Z3 to supply the chip 3 to this island. After supplying the chip 3 to the island, the collet 26 is raised as indicated by the arrow Z4 and then returned to the standby position above the pip-up position as indicated by the arrow Y4.

  That is, by moving the collet 26 sequentially as indicated by arrows Z1, Z2, Y3, Z3, Z4, and Y4, the chip 3 positioned based on the observation of the pickup confirmation camera is picked up by the collet 26. The chip 3 is mounted on the island.

  By the way, the wafer ring 28 reciprocates between the exchange stage 30 and the pip-up position as indicated by an arrow C by the reciprocating means 16. For example, the reciprocating means 16 can be constituted by an XY table or the like. An expander 19 (see FIG. 3) having a pressure ring 18 is disposed on the XY table.

  Below the exchange stage 30, a drawer stage 32 on which a ring magazine 31 (see FIG. 3 and the like) in which the wafer rings 28 are accommodated in a plurality of stages is placed. The drawer stage 32 includes a substrate table 33 on which the ring magazine 31 is placed and fixed, and a guide mechanism for guiding the extraction and storage of the substrate table 33.

  For example, the guide mechanism can include a pair of left and right guide long recesses provided on the side surface of the substrate base 33 and a pair of guide rollers provided on the frame side of the apparatus and facing each other. In this case, each guide long recess extends in the front-rear direction of the substrate base 33, and each guide roller is fitted in each guide long recess. The guide mechanism may include a guide rail.

  For this reason, as shown by the phantom line in FIG. 1, if the substrate stage 33 is pulled out from the storage state in which the substrate stage 33 is stored in the lower position of the exchange stage 30, as shown by the solid line in FIG. It can be pulled forward from the exchange stage 30. Further, when the substrate stage 33 is pushed backward from this pulled out state, the substrate stage 33 is stored in a lower position of the exchange stage 30 as shown by a solid line in FIG.

  A ring exchanging device having a ring changer 15 is disposed on the side of the exchanging stage 30. As shown in FIG. 3, the ring changer 15 includes a ring holder 41 that holds the wafer ring 28 in two upper and lower stages, a vertical movement mechanism 42 that moves the ring holder 41 up and down, and a wafer ring of the ring holder 41. 28 is chucked and supplied to the replacement stage 30, and the chucking mechanism 43 for chucking the wafer ring 28 of the replacement stage 30 and returning it to the ring holder, and the upper wafer ring 28 of the ring holder 41 in the chuck mechanism. A switching mechanism 44 that switches between the upper chuck position and the lower chuck position corresponding to the lower wafer ring 28 of the ring holder 41 is provided.

  The ring holding body 41 includes a first cradle 41 a disposed above and a second cradle 41 b disposed below. The pair of upper and lower cradles 41 a and 41 b are moved up and down by the switching mechanism 44. To do. Therefore, the switching mechanism 44 can be configured by an existing reciprocating mechanism such as a cylinder mechanism, a ball / nut mechanism, or a linear guide mechanism.

  In this case, a reciprocating mechanism as the switching mechanism 44 is attached to the vertical movement mechanism 42, and the switching mechanism 44 and the ring holding body 41 are moved up and down (lifted) by driving the vertical movement mechanism 42. The vertical movement mechanism 42 can also be constituted by an existing reciprocating mechanism such as a cylinder mechanism, a ball / nut mechanism, or a linear guide mechanism.

  The chuck mechanism 43 has a chuck part 43a with an opening / closing function that enables chucking of the wafer ring 28, and the wafer ring 28 chucked by the chuck part 43a along the horizontal direction as indicated by an arrow B (see FIG. 1). It can comprise with the conveyance mechanism 43b to convey. The chuck portion 43a has a pair of swinging pieces 45 and 45 that swing about the base side, and a swinging mechanism (not shown) that swings the swinging pieces 45 and 45. As the swing mechanism, various existing mechanisms such as a gear mechanism, a link mechanism, and a toggle mechanism can be used. Then, by driving a drive source (motor) (not shown), the swinging pieces 45 and 45 are swung through the swinging mechanism to perform an opening / closing operation.

  The transport mechanism 43b can be configured by a reciprocating mechanism connected to the chuck portion 43a. Also in this case, it can be configured by an existing reciprocating mechanism such as a cylinder mechanism, a ball / nut mechanism, or a linear guide mechanism.

  By the way, in this apparatus, as shown in FIG. 1, the center position PO of the wafer ring 28 at the pickup position is arranged inside the apparatus with respect to the center position CO of the wafer ring 28 on the exchange stage 30. That is, the center position PO at the pickup position is set to be located closer to the ring changer 15 than the center position CO of the exchange stage 30.

  On the other hand, in the conventional apparatus shown in FIG. 14, if the configuration of each member is taken into consideration, the center position PO at the pickup position needs to be arranged outside the apparatus from the center position CO at the ring replacement position. there were. For this reason, the overall width of the apparatus is large.

  Next, using the ring changer 15 configured as described above, the exchange operation of the wafer ring 28 on the exchange stage 30 will be described with reference to FIGS. In the state shown in FIG. 3A, the uppermost wafer ring 28 (28a) of the magazine 31 is located at the pickup position, and the second wafer ring 28 (28b) from the top of the magazine 31 is This is a state in which the ring holder 41 of the changer 15 is placed on the first cradle 41a. In this state, the wafer ring 28 is not placed on the first cradle 41 b of the ring holder 41.

  As shown in FIG. 3B from the state shown in FIG. 3A, the wafer ring 28a located at the pickup position is driven on the exchange stage 30 by driving the reciprocating means 16, that is, the XY table. To be located. In this state, as shown in FIG. 3C, the pressure ring 18 on the XY table is raised in the direction of the arrow E1, and the ring holding body 41 is raised by the vertical movement mechanism 42 as shown by the arrow D1.

  Thereafter, as shown in FIG. 4A, the chuck is released from the wafer ring 28b received by the first receiving base 41a to the chuck mechanism 43, and the chuck portion 43a of the chuck mechanism 43 is moved as indicated by an arrow A2. Retreat to. This backward movement retracts the chuck mechanism 43 to the limit position (maximum backward position). Next, as shown in FIG. 4B, the holding mechanism 41 is raised as shown by the arrow D2 by the switching mechanism 44, and the chuck mechanism 43 is interposed between the first receiving table 41a and the second receiving table 41b. State Thereafter, as shown in FIG. 4C, the chuck mechanism 43 is advanced as indicated by an arrow A1 to escape from the limit position.

  Next, as shown by an arrow B <b> 1 in FIG. 5A, the chuck portion 43 a of the chuck mechanism 43 is positioned on the replacement stage 30. Then, the wafer ring 28a on the exchange stage 30 is chucked by the chuck portion 43a. Thereafter, the chuck portion 43a is retracted while being chucked, and is returned to the ring changer 15 side as indicated by an arrow B2 in FIG. 5B, and the switching mechanism 44 is adjusted to adjust the wafer on the second cradle 41b. The ring 28a is adjusted to the replaceable height position of the replacement stage 30 as indicated by an arrow D3 in FIG.

  Thereafter, as shown in FIG. 6A, the chuck portion 43a of the chuck mechanism 43 is opened and retracted to the limit position in the arrow A2 direction. Thereafter, the ring holder 41 is lowered as indicated by an arrow D4, and the height position of the wafer ring 28b on the first cradle 41a is changed to the replaceable height position of the exchange stage 30 as shown in FIG. 6B. Adjust to. Thereafter, as indicated by an arrow A1 in FIG. 6C, the chuck portion 43a is advanced to return to the origin.

  Next, as indicated by an arrow A1 in FIG. 7A, the chuck portion 43a is advanced to chuck the wafer ring 28b on the first cradle 41a. Thereafter, as indicated by an arrow B1 in FIG. 7B, the chuck portion 43a is advanced, and the wafer ring 28b is transferred onto the XY stage. Then, the chuck portion 43a is opened, and the chuck portion 43a shown in FIG. Retract as shown by arrow B2.

  Thereafter, as shown in FIG. 8A, the chuck portion 43a is retracted to the limit position in the direction of arrow A2, and the pressure ring 18 is lowered as shown by arrow E2 to obtain the state shown in FIG. 8B. Then, the ring holder 41 is raised as shown by the arrow D5. Next, as indicated by an arrow A1 in FIG. 8C, the chuck portion 43a is advanced to return to the origin.

  Thereafter, as indicated by an arrow A1 in FIG. 9A, the chuck portion 43a is advanced to chuck the wafer ring 28a on the second receiving base 41b of the ring holder 41, and then the arrow in FIG. 9B. As shown in D6, the ring holder 41 is lowered. Then, as shown in FIG. 9C, the wafer ring 28b on the XY table is transferred in the direction of the arrow C2 by the XY table and is conveyed to the pickup position.

  In this manner, on the exchange stage 30, the exchange operation between the wafer ring 28 (pipe wafer 28a after use) for which pip-up has been completed and the wafer ring 28 (peg wafer ring 28b before use) that has not been pip-up is completed. To do.

  In the present invention, the stage 32 is positioned at a low position in a state where the drawer stage 32 is pulled forward, so that the work of placing the magazine on the stage 32 can be reduced. In addition, if the drawer stage 32 is stored, the magazine 31 is stored below the replacement stage 30 and compactness can be achieved. For this reason, it is possible to improve various adjustments and maintainability of the apparatus. Further, in the pulled-out state of the drawer stage, there is no other member above the drawer stage, so that it is possible to facilitate the magazine placing operation and the removing operation.

  By disposing the center position PO of the wafer ring 28 at the pickup position inside the apparatus relative to the center position CO of the wafer ring 28 on the exchange stage 30, the entire apparatus can be made compact.

  In the raising / lowering operation by the vertical movement mechanism 42 of the ring changer 15, it is only necessary to raise / lower the wafer rings 28, 28 in two stages, so that the vertical movement mechanism 42 can be downsized. In the case where the ring changer 15 is provided, the exchange operation of the wafer rings 28 and 28 at each stage can be stably performed. In addition, the ring holder 41 can be lowered except during wafer ring replacement work, and various adjustments to the apparatus and further improved maintainability can be achieved.

  Since the chuck mechanism 43 includes the chuck portion 43a with an opening / closing function and the transport mechanism 43b, the wafer ring 28 can be reliably replaced. Since the supply of the wafer ring 28 from the ring magazine 31 to the ring holder 41 and the return of the wafer ring 28 from the ring holder 41 to the ring magazine 31 are possible, the space between the ring magazine 31 and the exchange stage 30 is possible. Thus, the wafer ring 28 can be replaced, which contributes to the improvement of workability and the compactness of the apparatus.

  If the ring changer 15 is arranged on the side of the exchange stage 30 and the ring magazine 31 stored below the exchange stage 30, the entire apparatus can be made compact and the exchange work time can be shortened. it can.

  Since the preform means 12 and the bonding means 13 are provided, the preform operation and the bonding operation can be performed. If the magazine 31 accommodated in the wafer ring 28 is set on the drawer stage 32, the magazine 31 The chips 3 of the accommodated wafer ring 28 can be sequentially mounted on the substrate, and the workability is excellent.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made. The wafer ring 28 of the first receiving table 41a is transferred to the exchange stage by returning to the table 41b. Conversely, the used wafer ring 28 is returned to the first receiving table 41a and the second receiving table 41b. The wafer ring 28 may be transferred onto an exchange stage. Moreover, in the said embodiment, although the ring changer 15 was arrange | positioned on the left side seeing from the front, the ring changer 15 may be arrange | positioned on the right side seeing from the front.

1 Board (lead frame)
3 Chip 12 Preform means 13 Bonding means 14 Substrate transport means 15 Ring changer 16 Reciprocating means 27 Wafer sheet 28 Wafer ring 30 Exchange stage 31 Ring magazine 32 Draw stage 41 Ring holder 42 Vertical movement mechanism 43 Chuck mechanism 43a Chuck part 43b Transport mechanism 44 switching mechanism

Claims (8)

A chip mounting apparatus for transporting a wafer ring holding a wafer sheet to a pickup position and mounting a chip obtained by dividing the wafer sheet on a substrate,
An exchange stage for exchanging the wafer ring before use and the wafer ring after use, reciprocating means for reciprocating the wafer ring between the exchange stage and the pickup position, and a ring magazine for storing the wafer rings in a plurality of stages A chip mounting apparatus comprising a drawer stage that is placed and allows the lower position of the exchange stage of the ring magazine to be stored and pulled forward.   2. The chip mounting apparatus according to claim 1, wherein the center position of the wafer ring at the pickup position is disposed inside the apparatus with respect to the center position of the wafer ring on the exchange stage. A chip mounting apparatus comprising a ring changer for supplying a wafer ring before use of the ring magazine to an exchange stage and returning the wafer ring to the ring magazine after use of the exchange stage,
The ring changer includes a ring holder that holds the wafer ring in two upper and lower stages, a vertical movement mechanism that moves the ring holder up and down, chucks the wafer ring of the ring holder, and supplies it to the exchange stage. A chuck mechanism for chucking the wafer ring back to the ring holder, an upper chuck position corresponding to the upper wafer ring of the ring holder in the chuck mechanism, and a lower chuck position corresponding to the lower wafer ring of the ring holder The chip mounting apparatus according to claim 1, further comprising: a switching mechanism that performs switching of   The chuck mechanism is characterized by chucking the wafer ring after use of the exchange stage at the lower chuck position and returning it to the ring holder, and chucking the wafer ring before use of the ring holder at the upper chuck position and supplying it to the exchange stage. The chip mounting apparatus according to claim 3.   The chuck mechanism includes: a chuck portion with an opening / closing function that enables chucking of the wafer ring; and a transport mechanism that transports the wafer ring chucked by the chuck portion along a horizontal direction. The chip mounting apparatus of Claim 3 or Claim 4.   The chuck mechanism is characterized in that the wafer ring of the ring magazine housed in the lower position of the exchange stage is chucked and supplied to the ring holder, and the wafer ring of the ring holder is chucked and returned to the ring magazine. The chip mounting apparatus according to any one of claims 3 to 5.   7. The chip mounting apparatus according to claim 3, wherein the ring changer is disposed on a side of the exchange stage and a ring magazine housed at a position below the exchange stage. 8. A chip mounting apparatus provided with a bonding apparatus disposed on the rear side of the exchange stage,
The bonding apparatus includes a conveyance means for pitch-feeding the substrate from the upstream side to the downstream side in the conveyance direction, and the island of the substrate to which the adhesive is to be applied when the island is conveyed to the preform position. And a bonding means for bonding a chip to the island when the island to which the adhesive is applied is conveyed to a bonding position. Item 8. The chip mounting apparatus according to any one of Items 7 above.

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