JP2013239660A5 - - Google Patents

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Publication number
JP2013239660A5
JP2013239660A5 JP2012112990A JP2012112990A JP2013239660A5 JP 2013239660 A5 JP2013239660 A5 JP 2013239660A5 JP 2012112990 A JP2012112990 A JP 2012112990A JP 2012112990 A JP2012112990 A JP 2012112990A JP 2013239660 A5 JP2013239660 A5 JP 2013239660A5
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JP
Japan
Prior art keywords
semiconductor chip
resin
thermal expansion
wiring board
auxiliary member
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Application number
JP2012112990A
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English (en)
Japanese (ja)
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JP2013239660A (ja
JP5980566B2 (ja
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Priority to JP2012112990A priority Critical patent/JP5980566B2/ja
Priority claimed from JP2012112990A external-priority patent/JP5980566B2/ja
Priority to KR1020130049749A priority patent/KR101997548B1/ko
Priority to US13/892,483 priority patent/US9087781B2/en
Publication of JP2013239660A publication Critical patent/JP2013239660A/ja
Publication of JP2013239660A5 publication Critical patent/JP2013239660A5/ja
Application granted granted Critical
Publication of JP5980566B2 publication Critical patent/JP5980566B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012112990A 2012-05-17 2012-05-17 半導体装置及びその製造方法 Active JP5980566B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012112990A JP5980566B2 (ja) 2012-05-17 2012-05-17 半導体装置及びその製造方法
KR1020130049749A KR101997548B1 (ko) 2012-05-17 2013-05-03 반도체 장치 및 그 제조 방법
US13/892,483 US9087781B2 (en) 2012-05-17 2013-05-13 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012112990A JP5980566B2 (ja) 2012-05-17 2012-05-17 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013239660A JP2013239660A (ja) 2013-11-28
JP2013239660A5 true JP2013239660A5 (enrdf_load_stackoverflow) 2015-04-30
JP5980566B2 JP5980566B2 (ja) 2016-08-31

Family

ID=49580690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012112990A Active JP5980566B2 (ja) 2012-05-17 2012-05-17 半導体装置及びその製造方法

Country Status (3)

Country Link
US (1) US9087781B2 (enrdf_load_stackoverflow)
JP (1) JP5980566B2 (enrdf_load_stackoverflow)
KR (1) KR101997548B1 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9559064B2 (en) * 2013-12-04 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in package-on-package structures
KR102250997B1 (ko) * 2014-05-02 2021-05-12 삼성전자주식회사 반도체 패키지
JP2016046469A (ja) * 2014-08-26 2016-04-04 日東電工株式会社 半導体装置の製造方法及び封止用シート
CN106601629B (zh) * 2015-10-15 2018-11-30 力成科技股份有限公司 保护片服贴于芯片感应面的芯片封装构造
US10242927B2 (en) 2015-12-31 2019-03-26 Mediatek Inc. Semiconductor package, semiconductor device using the same and manufacturing method thereof
WO2018038134A1 (ja) * 2016-08-23 2018-03-01 株式会社村田製作所 回路モジュール
KR102144933B1 (ko) * 2017-08-04 2020-08-18 주식회사 네패스 칩 패키지 및 그 제조방법
US11264330B2 (en) 2017-08-04 2022-03-01 Nepes Co., Ltd. Chip package with connection portion that passes through an encapsulation portion
KR102790247B1 (ko) 2020-06-25 2025-04-03 에스케이하이닉스 주식회사 보강층을 가진 반도체 패키지

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3057130B2 (ja) * 1993-02-18 2000-06-26 三菱電機株式会社 樹脂封止型半導体パッケージおよびその製造方法
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US6104093A (en) * 1997-04-24 2000-08-15 International Business Machines Corporation Thermally enhanced and mechanically balanced flip chip package and method of forming
JP3565319B2 (ja) 1999-04-14 2004-09-15 シャープ株式会社 半導体装置及びその製造方法
JP3374812B2 (ja) * 1999-11-10 2003-02-10 日本電気株式会社 半導体装置
JP4390541B2 (ja) * 2003-02-03 2009-12-24 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP2007149931A (ja) * 2005-11-28 2007-06-14 Renesas Technology Corp 半導体装置およびその製造方法
JP4110189B2 (ja) * 2006-12-13 2008-07-02 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージ
JP2009230619A (ja) * 2008-03-25 2009-10-08 Fujitsu Ltd Ｉｃタグおよびその製造方法
JP2011135749A (ja) 2009-12-25 2011-07-07 Sony Corp 電力供給装置、電力受電装置及び情報通知方法
JP2012009655A (ja) * 2010-06-25 2012-01-12 Shinko Electric Ind Co Ltd 半導体パッケージおよび半導体パッケージの製造方法
JP2012009713A (ja) * 2010-06-25 2012-01-12 Shinko Electric Ind Co Ltd 半導体パッケージおよび半導体パッケージの製造方法
KR101719636B1 (ko) 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법

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