JP2013239548A5 - - Google Patents

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Publication number
JP2013239548A5
JP2013239548A5 JP2012111168A JP2012111168A JP2013239548A5 JP 2013239548 A5 JP2013239548 A5 JP 2013239548A5 JP 2012111168 A JP2012111168 A JP 2012111168A JP 2012111168 A JP2012111168 A JP 2012111168A JP 2013239548 A5 JP2013239548 A5 JP 2013239548A5
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JP
Japan
Prior art keywords
substrate
regions
mounting
mounting electrode
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012111168A
Other languages
English (en)
Japanese (ja)
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JP2013239548A (ja
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Publication date
Application filed filed Critical
Priority to JP2012111168A priority Critical patent/JP2013239548A/ja
Priority claimed from JP2012111168A external-priority patent/JP2013239548A/ja
Priority to US13/892,541 priority patent/US20130307560A1/en
Priority to CN201310177698XA priority patent/CN103427787A/zh
Publication of JP2013239548A publication Critical patent/JP2013239548A/ja
Publication of JP2013239548A5 publication Critical patent/JP2013239548A5/ja
Withdrawn legal-status Critical Current

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JP2012111168A 2012-05-15 2012-05-15 シート基板、電子部品、電子機器、電子部品の検査方法、及び電子部品の製造方法 Withdrawn JP2013239548A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012111168A JP2013239548A (ja) 2012-05-15 2012-05-15 シート基板、電子部品、電子機器、電子部品の検査方法、及び電子部品の製造方法
US13/892,541 US20130307560A1 (en) 2012-05-15 2013-05-13 Sheet substrate, electronic part, electronic apparatus, method for testing electronic parts, and method for manufacturing electronic parts
CN201310177698XA CN103427787A (zh) 2012-05-15 2013-05-14 薄片基板、电子设备、电子部件及其检验方法与制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012111168A JP2013239548A (ja) 2012-05-15 2012-05-15 シート基板、電子部品、電子機器、電子部品の検査方法、及び電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP2013239548A JP2013239548A (ja) 2013-11-28
JP2013239548A5 true JP2013239548A5 (enExample) 2015-07-02

Family

ID=49580816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012111168A Withdrawn JP2013239548A (ja) 2012-05-15 2012-05-15 シート基板、電子部品、電子機器、電子部品の検査方法、及び電子部品の製造方法

Country Status (3)

Country Link
US (1) US20130307560A1 (enExample)
JP (1) JP2013239548A (enExample)
CN (1) CN103427787A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572090B (zh) * 2014-06-26 2017-02-21 仁寶電腦工業股份有限公司 電子裝置及測試系統
TWI620475B (zh) * 2015-01-12 2018-04-01 南亞電路板股份有限公司 印刷電路板及其製作方法
WO2016145522A1 (en) 2015-03-13 2016-09-22 Xinde Li Adaptive methods and systems for detecting signals from interference contaminated data
KR20160141279A (ko) * 2015-05-29 2016-12-08 에스케이하이닉스 주식회사 블라인드 비아를 구비하는 인쇄회로기판, 이의 검사 방법, 및 반도체 패키지의 제조 방법
US10312003B2 (en) * 2016-01-19 2019-06-04 Semiconductor Components Industries, Llc Circuit board with thermal paths for thermistor
CN107621602B (zh) * 2017-08-15 2020-04-03 大族激光科技产业集团股份有限公司 集成电路芯片载板的测试方法
KR20220121020A (ko) * 2021-02-24 2022-08-31 삼성전자주식회사 인쇄 회로 기판 어셈블리

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217625A (ja) * 1986-03-19 1987-09-25 Fujitsu Ltd ウエ−ハ集積回路のテスト方式
US5389556A (en) * 1992-07-02 1995-02-14 Lsi Logic Corporation Individually powering-up unsingulated dies on a wafer
US5532174A (en) * 1994-04-22 1996-07-02 Lsi Logic Corporation Wafer level integrated circuit testing with a sacrificial metal layer
JP2001210926A (ja) * 2000-01-25 2001-08-03 Murata Mfg Co Ltd 集合基板および回路基板、および集合基板を用いた回路基板の製造方法
US6548826B2 (en) * 2000-04-25 2003-04-15 Andreas A. Fenner Apparatus for wafer-level burn-in and testing of integrated circuits
JP4876356B2 (ja) * 2001-09-05 2012-02-15 ソニー株式会社 回路素子内蔵基板の製造方法、並びに電気回路装置の製造方法
JP3895206B2 (ja) * 2002-03-29 2007-03-22 日本電波工業株式会社 発振器用シート基板及びこれを用いた表面実装用水晶発振器の製造方法
US6630685B1 (en) * 2002-06-24 2003-10-07 Micron Technology, Inc. Probe look ahead: testing parts not currently under a probehead
US6972444B1 (en) * 2003-08-06 2005-12-06 National Semiconductor Corporation Wafer with saw street guide
JP4082400B2 (ja) * 2004-02-19 2008-04-30 セイコーエプソン株式会社 電気光学装置の製造方法、電気光学装置および電子機器
JP5546350B2 (ja) * 2010-05-26 2014-07-09 京セラ株式会社 多数個取り配線基板

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