JP2013236098A - Wafer processing sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a mounter, a peeling adhesive tape, and the like from adhering to a wafer processing sheet in a semiconductor manufacturing process.SOLUTION: The wafer processing sheet of the present invention, which comprises a dicing sheet in which an adhesive layer is laminated on a base material and a ring-shaped double-sided adhesive sheet, is characterized in that: an adhesion part is provided at the center on a surface of the base material; and a non-adhesion part is provided therearound. It is preferable that the ring-shaped double-sided adhesive sheet is laminated on the outer edge of the same surface of the base material where the adhesion part is provided.

Description

  The present invention relates to a wafer processing sheet. More specifically, the present invention relates to a wafer processing sheet comprising a dicing sheet having an adhesive layer laminated on a substrate and a ring-shaped double-sided pressure-sensitive adhesive sheet.

One of the manufacturing processes of a semiconductor device is a dicing process of cutting and separating a semiconductor wafer on which a circuit is formed through a required pretreatment into a plurality of chips.
As a wafer processing sheet used in this process, a wafer in which a ring-shaped adhesion preventing adhesive sheet is laminated on a dicing sheet having an adhesive layer that performs dicing processing (wafer fixation) and die bonding processing functions. Processing sheets have been developed (see Patent Document 1). More specifically, in the wafer processing sheet 800, a dicing sheet 803 in which an adhesive layer 802 is provided on a base material 801 and a pressure-sensitive adhesive layer (adhesive layer) 805 on a base film 804 are provided. The provided adhesion preventing pressure-sensitive adhesive sheet 806 is laminated via an adhesive layer 802 and a base film 804 (see FIG. 8).

  When the wafer processing sheet 800 is used, the wafer processing sheet 800 is attached to the ring frame 300 via the pressure-sensitive adhesive layer 805 of the adhesion preventing adhesive sheet 806 prior to the dicing process. A wafer 807 is attached to the dicing sheet 803 of the sheet 800. Thereafter, the wafer is diced for each circuit to manufacture a chip.

  The wafer processing sheet 800 is fixed to the ring frame 300 until the chip is picked up after the wafer is attached, but is manually peeled off from the ring frame 300 when the pickup is completed. The ring frame 300 from which the wafer processing sheet 800 has been peeled can be cleaned and reused as necessary.

  The wafer processing sheet 800 is attached to the ring frame 300 not via the adhesive layer 802 but via the pressure-sensitive adhesive layer 805, so that when the wafer processing sheet 800 is peeled from the ring frame 300, the ring frame 300 is removed. Therefore, there is an advantage that the adhesive layer 802 does not remain and is not contaminated.

JP-A-8-213349

  When attaching the wafer 807 to the wafer processing sheet 800, a mounter 808 as shown in FIG. 8 is used. At this time, since the wafer processing sheet 800 is affixed so as to be pressed against the wafer 807 and the ring frame 300, the adhesive layer 802 of the wafer processing sheet 800 adheres to the mounter 808 (dotted line portion in FIG. 8). It was sometimes contaminated. In the case where the mounter 808 sucks and holds the wafer 807, the adhesive layer 802 in the dotted line portion of FIG. 8 is also sucked, and the adhesive layer 802 and the mounter 808 adhere (see the dotted line in FIG. 8). Part), the mounter 808 was sometimes contaminated.

  In some cases, a surface protective sheet is attached to the surface of a semiconductor wafer on which a circuit is formed, and then the back surface is ground to reduce the thickness of the wafer. Also in the case of the wafer 807 to which such a surface protection sheet 901 is attached, prior to the dicing process, the wafer is fixed to the ring frame 300 by the mounter 808 via the wafer processing sheet 800 (see FIG. 9). Thereafter, before dicing, a heat-sensitive adhesive type peeling adhesive tape 902 is applied to the surface protective sheet 901 as shown in FIG. 9, and the peeling adhesive tape 902 is moved in the peeling direction together with the peeling adhesive tape 902. The surface protection sheet 901 is peeled off.

  However, when the peeling adhesive tape 902 is applied to the surface protective sheet 901, the peeling adhesive tape 902 may adhere to the adhesive layer 802 at the dotted line portion in FIG. 9, and the surface protective sheet 901 may not be peeled off. Further, when the surface protective sheet 901 is peeled off together with the peeling adhesive tape 902, the peeling adhesive tape 902 may peel off the adhesive layer 802 from the substrate 801.

In particular, as the thickness of the wafer becomes thinner in recent years, the above-mentioned problems have become serious.
Accordingly, an object of the present invention is to prevent a mounter, a peeling adhesive tape, and the like from adhering to a wafer processing sheet.

As a result of intensive studies, the present inventors have found that the above problems can be solved by a wafer processing sheet having a specific structure, and have completed the present invention.
That is, the wafer processing sheet according to the present invention,
A wafer processing sheet comprising a dicing sheet in which an adhesive layer is laminated on a base material and a ring-shaped double-sided pressure-sensitive adhesive sheet, and having an adhesive portion at the center on the surface of the base material, It has a non-adhesive part around it.

It is preferable that a ring-shaped double-sided pressure-sensitive adhesive sheet is laminated on the outer edge portion on the same surface of the substrate having the adhesive portion.
The adhesive layer preferably has a diameter substantially the same as the diameter of the wafer.

  According to the wafer processing sheet of the present invention, it is possible to prevent the mounter, the peeling adhesive tape, and the like from adhering to the wafer processing sheet. Specifically, when a wafer is attached to a wafer processing sheet using the mounter, the adhesive layer and the mounter of the wafer processing sheet do not adhere and the mounter is not contaminated. In addition, when the surface protection sheet is peeled off with the peeling adhesive tape for the wafer fixed to the ring frame via the wafer processing sheet and the surface protection sheet is affixed, the adhesive for the wafer processing sheet The layer and the adhesive tape for peeling do not adhere, and the surface protective sheet can be easily peeled off.

FIG. 1 is a perspective view of a wafer processing sheet of the present invention. 2 is a cross-sectional view taken along line XX of FIG. FIG. 3 is a perspective view of the ring frame. FIG. 4 is a view for explaining the wafer processing sheet of the present invention. FIG. 5 is a view for explaining the wafer processing sheet of the present invention. FIG. 6 is a perspective view of the wafer processing sheet of the present invention. 7 is a cross-sectional view taken along line XX of FIG. FIG. 8 is a view for explaining a conventional wafer processing sheet. FIG. 9 is a view for explaining a conventional wafer processing sheet.

Hereinafter, an embodiment of the present invention will be specifically described.
FIG. 1 is a perspective view of the wafer processing sheet of the present invention, and FIG. 2 is a sectional view taken along line XX. As shown in FIGS. 1 and 2, the wafer processing sheet of the present invention is a wafer processing sheet 100 comprising a dicing sheet 103 in which an adhesive layer 102 is laminated on a substrate 101 and a ring-shaped double-sided pressure-sensitive adhesive sheet 107. The adhesive layer 102 is laminated at the central portion on the surface of the base material 101 to form an adhesive portion, and the base material 101 is exposed around the adhesive layer 102 to be non-adhered. It is characterized by being part. And the ring-shaped double-sided adhesive sheet 107 is laminated | stacked on the outer edge part (outer edge part on the same surface of the base material which has an adhesion part) on the same surface of the base material 101 with which the said adhesive bond layer 102 was laminated | stacked. ing. That is, in the base material 101, the ring-shaped double-sided pressure-sensitive adhesive sheet 107 is laminated on the same surface as the surface on which the adhesive layer 102 is laminated, and on the outer edge thereof. The adhesive layer 102 has a diameter substantially the same as the diameter of the wafer 807 (see FIGS. 4 and 5 described later). This is because when the diameter of the adhesive layer 102 is larger than necessary than the diameter of the wafer 807, the mounter or the peeling adhesive tape and the adhesive layer 102 exposed around the wafer 807 may adhere. If the diameter of the layer 102 is smaller than necessary than the diameter of the wafer 807, the wafer 807 may not be stably held or the adhesive layer 102 may not be present on a necessary portion of the back surface of the wafer 807, thus avoiding these problems. It is to do. Further, when the diameters of the adhesive layer 102 and the wafer 807 are substantially the same, there is an advantage that the amount of the adhesive constituting the adhesive layer can be reduced as compared with the conventional wafer processing sheet 800.

  In the wafer processing sheet 100 of the present invention, the adhesive layer 102 of the dicing sheet 103 is formed so as to exhibit dicing processing and die bonding processing functions. That is, as the dicing sheet 103, a dicing sheet (also referred to as a “dicing / die bonding sheet” in this specification) that exhibits dicing and die bonding functions is used. First, such a dicing sheet 103 will be described. In the dicing sheet 103, the adhesive layer 102 is detachably laminated on the substrate 101. Specifically, examples of the base material and adhesive used for the dicing sheet 103 include the same dicing sheets as described in JP-A-60-35531 and JP-A-2-32181.

  Examples of the substrate 101 include general-purpose single-layer films such as polyolefin and laminated films. The thickness of the base material 101 is 10-300 micrometers normally, Preferably it is 50-200 micrometers.

  The surface tension of the substrate 101 is preferably 40 dyn / cm or less, more preferably 35 dyn / cm or less. When the surface tension is in the above range, the peelability from the adhesive layer 102 is improved, and the pickup suitability of the chip with the adhesive layer can be improved. Such a base material having a low surface tension can be obtained by appropriately selecting a material, or can be obtained by performing a mold release treatment by applying a silicone resin or the like on the surface of the base material 101.

  Since the adhesive layer 102 is sticky at room temperature or becomes sticky by heating, it can be attached to a semiconductor wafer during the dicing process, and the chip and lead frame can be attached to the chip mounting process. Can be glued. Further, it can be firmly fixed by subsequent heat curing. The adhesive layer 102 may be composed of a B-stage (semi-cured) thermosetting adhesive component, or may be composed of a low molecular weight thermosetting adhesive component and a polymer component. Further, an ultraviolet curable component may be further blended as a constituent component of the adhesive layer 102. Such an adhesive layer 102 has improved peelability from the base material 101 by irradiation of ultraviolet rays, so that the chip with the adhesive layer can be easily picked up at the time of picking up after dicing.

The thickness of the adhesive layer 102 is usually 5 to 200 μm, preferably 10 to 100 μm.
In the wafer processing sheet 100 of the present invention, as the dicing sheet 103, a dicing sheet that exhibits a function of only dicing processing (also referred to as “dicing sheet dedicated to dicing processing” in this specification) may be used. In order to form an adhesive layer for dicing sheets exclusively for dicing, a low-adhesive-type adhesive that always shows low adhesive strength, an energy-ray-curable adhesive that decreases in adhesive strength by irradiation with energy rays before pick-up An agent is used.

  The low pressure-sensitive adhesive is a pressure-sensitive adhesive adjusted to have a low adhesive strength, and has a constituent component such as an acrylic, rubber-based, or silicone-based polymer. In the present invention, an acrylic pressure-sensitive adhesive is suitably used in consideration of versatility, ease of control of pressure-sensitive adhesive properties, and the like.

  The thickness of the adhesive layer in the dicing sheet dedicated to dicing is usually 1 to 100 μm, preferably 5 to 30 μm. As the base material of the dicing sheet dedicated to the dicing process, the same base material as that of the dicing die bonding sheet is used. Since the peelability of the adhesive layer from the substrate is not required, the low surface tension of the substrate is not required.

  Next, the ring-shaped double-sided pressure-sensitive adhesive sheet 107 constituting the wafer processing sheet 100 of the present invention will be described. The ring-shaped double-sided pressure-sensitive adhesive sheet 107 includes a core material film 104, a laminating pressure-sensitive adhesive layer 105 formed on one surface thereof, and a fixing pressure-sensitive adhesive layer 106 formed on the other surface (see FIGS. 1 and 2). That is, a core film 104 having a ring shape, a laminating pressure-sensitive adhesive layer 105 formed on the surface of the film 104 to be affixed to the dicing sheet 103, and a side of the film 104 to be affixed to the ring frame It consists of a fixing adhesive layer 106 formed on the surface.

  The ring-shaped double-sided pressure-sensitive adhesive sheet 107 has a size that can be fixed to the ring frame. The ring frame 300 is usually a molded body made of metal or plastic (see FIG. 3). The inner diameter of the inner opening 301 of the ring frame 300 is larger than the diameter of the wafer to be diced. For example, as shown in FIGS. 4 and 5, the inner opening 301 has a diameter substantially the same as the inner diameter of the ring-shaped double-sided pressure-sensitive adhesive sheet 107. When using the wafer processing sheet 100 according to the present invention, such a ring frame 300 has a lower surface attached to the fixing adhesive layer 106 of the ring-shaped double-sided pressure-sensitive adhesive sheet 107 as will be described later. It becomes the structure affixed on the dicing sheet 103 via the adhesive sheet 107 (refer FIG. 4 and 5 mentioned later).

  Examples of the core film 104 include a polyethylene film, a polypropylene film, an ethylene-vinyl acetate copolymer film, an ethylene- (meth) acrylic acid copolymer film, an ethylene- (meth) acrylic acid ester copolymer film, and an ionomer resin. A polyolefin film such as a film, a polyvinyl chloride film, a polyethylene terephthalate film, or the like is used. Among these, from the viewpoint of expandability, a polyolefin film and a plasticized polyvinyl chloride film are preferable, and a polyolefin film is particularly preferable because the adhesive that is laminated on both sides is not affected by the adhesive force of the plasticizer.

  The thickness of the core material film 104 is usually 15 to 200 μm, preferably 30 to 150 μm, and more preferably 40 to 100 μm. If the thickness is less than 15 μm, the shape cannot be maintained when the ring-shaped double-sided pressure-sensitive adhesive sheet 107 is bonded to the dicing sheet 103 and may be deformed and stacked. When the thickness exceeds 200 μm, when the wafer processing sheet 100 is stored in a roll shape or the like, a winding mark may be formed due to a large step.

  The laminating pressure-sensitive adhesive layer 105 and the fixing pressure-sensitive adhesive layer 106 only need to have pressure-sensitive adhesive properties, and may be a layer made of the same pressure-sensitive adhesive or a layer made of different pressure-sensitive adhesives. Examples of such an adhesive include acrylic, rubber, and silicone adhesive. More preferably, a pressure-sensitive adhesive that can make the adhesive force between the fixing pressure-sensitive adhesive layer 106 and the ring frame 300 smaller than the adhesive force between the adhesive layer 102 and the laminating pressure-sensitive adhesive layer 105 is appropriately selected. Among these, as the pressure-sensitive adhesive layer 106 for fixation, an acrylic pressure-sensitive adhesive is preferable in consideration of removability from the ring frame 300. The pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer 106 may be used alone or in combination of two or more. The same applies to the adhesive layer 105 for lamination.

  The thickness of the laminating pressure-sensitive adhesive layer 105 and the fixing pressure-sensitive adhesive layer 106 is usually 2 to 20 μm, preferably 3 to 15 μm, and more preferably 4 to 10 μm. If it is less than 2 μm, sufficient adhesive strength may not be exhibited. If it exceeds 20 μm, the pressure-sensitive adhesive remains on the ring frame 300 and may be contaminated.

   The wafer processing sheet 100 of the present invention shown in FIGS. 1 and 2 is produced, for example, as follows. First, the dicing sheet and the double-sided pressure-sensitive adhesive sheet before being formed into a predetermined shape are each produced based on a known coating method. A release film is laminated on the surface of the adhesive layer of the dicing sheet and the surface of the adhesive layer (laminating adhesive layer and fixing adhesive layer) of the double-sided pressure-sensitive adhesive sheet to protect the adhesive layer. .

  The double-sided PSA sheet is punched to form a ring-shaped inner shape, leaving the release film on the adhesive layer for fixing, from the release film on the adhesive layer for lamination to the layer of the adhesive layer for fixing. . The inner part of the punched double-sided pressure-sensitive adhesive sheet is removed. The dicing sheet is punched in accordance with the shape of the wafer so as to leave the substrate from the release film on the adhesive layer to the layer of the adhesive layer. The outer portion of the punched dicing sheet is removed. The release film on the adhesive layer of the dicing sheet is peeled off, then the release film on the adhesive layer for laminating the double-sided pressure-sensitive adhesive sheet is peeled off, and the adhesive layer for laminating the double-sided pressure-sensitive adhesive sheet is bonded to the base material of the dicing sheet It laminates | stacks so that the adhesive layer for lamination | stacking and a base material may contact | connect the surface where the agent layer was laminated | stacked. Next, punching is performed in a ring shape to leave the release film on the fixing adhesive layer from the base material of the dicing sheet to the fixing adhesive layer.

As described above, the wafer processing sheet 100 of the present invention protected by the release film is obtained.
The wafer processing sheet 100 of the present invention thus obtained is suitably used in the semiconductor device manufacturing process.

  Specifically, when the wafer processing sheet 100 is used, the wafer processing sheet 100 is attached to the ring frame 300 via the fixing adhesive layer 106 of the ring-shaped double-sided pressure-sensitive adhesive sheet 107 prior to the dicing process. Then, the wafer processing sheet 100 is attached to the wafer 807 through the adhesive layer 102 of the dicing sheet 103. When the wafer processing sheet 100 is attached to the wafer 807, a mounter 808 as shown in FIG. 4 is used. The mounting with the mounter is performed by holding the ring frame 300 and the wafer 807 on the mounter 808 and pressing the wafer processing sheet 100 from which the release film has been peeled off with a rubber roller or the like. At this time, the wafer processing sheet 100 shown by the dotted line in FIG. 4 may come into contact with the mounter 808. In particular, as the thickness of the wafer becomes thinner in recent years, it often comes into contact. However, since the base material 101 is exposed in this contactable part (FIG. 4, a dotted line part), both do not adhere. Further, the ring frame 300 and the wafer 807 may be held by suction from the mounter 808. In this case, the wafer processing sheet 100 in the dotted line portion of FIG. 4 can also be sucked. In particular, as the wafer becomes thinner in recent years, it is often attracted strongly. However, since the base material 101 is exposed at the portion that can be sucked (FIG. 4, the dotted line portion), even if the wafer processing sheet 100 of the present invention and the mounter 808 come into contact with each other by suction, both adhere to each other. There is nothing. Therefore, the mounter 808 is not contaminated. Thereafter, the wafer 807 held on the ring frame 300 by the wafer processing sheet 100 is diced for each circuit to manufacture a chip.

  In some cases, a surface protective sheet is attached to the surface of a semiconductor wafer on which a circuit is formed, and then the back surface is ground to reduce the thickness of the wafer. Also in the case of the wafer 807 to which such a surface protection sheet 901 is attached, the wafer is ground to the ring frame 300 via the wafer processing sheet 100 by the mounter 808 prior to the dicing process after the backside grinding of the wafer ( (See FIG. 5). Then, before dicing, as shown in 5, the adhesive tape 902 for peeling is stuck to the surface protective sheet 901, and the surface protective sheet 901 is peeled using the heat-sensitive adhesive type adhesive tape 902 for peeling. At this time, the peeling adhesive tape 902 may come into contact with the wafer processing sheet 100 at the dotted line portion in FIG. In particular, as the thickness of the wafer becomes thinner in recent years, it often comes into contact. However, since the base material 101 is exposed in the contactable part (FIG. 5, dotted line part), both adhere to each other even if the wafer processing sheet 100 of the present invention and the peeling adhesive tape 902 are in contact with each other. There is nothing to do. Therefore, the surface protection sheet 901 can be easily peeled off. Thereafter, the wafer 807 held on the ring frame 300 by the wafer processing sheet 100 is diced for each circuit to manufacture a chip.

  The wafer processing sheet of the present invention may be a wafer processing sheet 600 as shown in FIG. 6 in a perspective view and in FIG. In this wafer processing sheet 600, a ring-shaped double-sided pressure-sensitive adhesive sheet 107 is laminated on the outer edge portion on the opposite surface of the base material 101 on which the adhesive layer 102 is laminated. That is, the ring-shaped double-sided pressure-sensitive adhesive sheet 107 is laminated on the outer edge of the base material 101 on a different surface from the surface on which the adhesive layer 102 is laminated. Even if it is a thing of such a structure, the effect similar to the above is acquired.

  In addition, a groove (kerf) having a predetermined depth smaller than the thickness of the wafer is formed from the wafer surface on which the semiconductor circuit is formed, a surface protection sheet is attached to the circuit surface, and the back surface of the wafer is ground, In addition to reducing the thickness of the wafer, it may be divided into individual chips (this method is also referred to as a pre-dicing method). In this case, the wafer processing sheet of the present invention may be attached to the back surface of the plurality of chips while keeping the obtained plurality of chips attached to the surface protective sheet, and then stored, transported, etc. If necessary, the surface protective sheets on the plurality of chips are peeled off. Even when such a tip dicing method is performed, according to the wafer processing sheet of the present invention, when the wafer processing sheet of the present invention is applied to the back surface of a plurality of chips and when the surface protection sheet is peeled off, As in the case described above, there is an advantage that the mounter and the peeling adhesive tape do not adhere to the adhesive layer of the wafer processing sheet.

  Further, the shape of the wafer processing sheet of the present invention may be other than a circle as shown in FIGS. Specifically, the shape of the ring-shaped double-sided pressure-sensitive adhesive sheet, the adhesive layer and the substrate may be a shape other than a circle as shown in FIGS. 1 and 2, and specifically, an ellipse, a quadrangle, etc. It may be a polygon. For example, as the shape of the ring frame and its internal opening, shapes other than the circle shown in FIG. 3 (ellipses, polygons, etc.) can be adopted, and accordingly the shape of the wafer processing sheet is appropriately selected. do it.

  As another embodiment of the present invention, a non-adhesive layer (non-adhesive portion) is provided around the center portion (adhesive portion) of the adhesive layer of the dicing sheet, and the adhesive layer is laminated. It may be a wafer processing sheet in which a ring-shaped double-sided PSA sheet is laminated on the outer edge portion on the same surface of the material. Moreover, the adhesive layer of the dicing sheet is made of an energy ray curable adhesive, and a cured portion (non-adhesive portion) formed by irradiation of energy rays is formed around the central portion (adhesive portion) of the adhesive layer. It may be a wafer processing sheet in which a ring-shaped double-sided PSA sheet is laminated on the outer edge portion on the same surface of the base material on which the adhesive layer is laminated. In the second and third embodiments, a ring-shaped double-sided PSA sheet may be laminated on the outer edge portion on the opposite surface of the substrate on which the adhesive layer is laminated. In any form, the effects as described above can be obtained. That is, a wafer processing sheet comprising a dicing sheet in which an adhesive layer is laminated on a base material and a ring-shaped double-sided pressure-sensitive adhesive sheet, and has an adhesive portion in the center on the surface of the base material If the wafer processing sheet has a non-bonded portion around it, the above-described effects can be obtained.

100: Wafer processing sheet 101: Base material 102: Adhesive layer 103: Dicing sheet 104: Core film 105: Laminating adhesive layer 106: Fixing adhesive layer 107: Ring-shaped double-sided adhesive sheet 300: Ring frame 301 : Internal opening 600: Wafer processing sheet 800: Wafer processing sheet 801: Base material 802: Adhesive layer 803: Dicing sheet 804: Base film 805: Pressure sensitive adhesive layer 806: Adhesion prevention adhesive sheet 807: Wafer 808: Mounter 901: Surface protective sheet 902: Peeling adhesive tape

Claims (4)

The adhesive layer is peelably laminated on the base material, and is a wafer processing sheet comprising a dicing sheet that exhibits the functions of dicing processing and die bonding processing, and a ring-shaped double-sided adhesive sheet,
It has an adhesive part at the center on the surface of the substrate, and has a non-adhesive part around it,
A wafer processing sheet, wherein a ring-shaped double-sided pressure-sensitive adhesive sheet is laminated on an outer edge portion on the same surface of a substrate having the adhesive portion.   The adhesive layer is obtained from an energy ray curable adhesive, and the non-adhesive portion on the surface of the base material is formed by irradiating the adhesive with an energy ray and curing. Item 2. A wafer processing sheet according to Item 1.   The wafer processing sheet according to claim 1, wherein the adhesive layer has a diameter substantially the same as a diameter of the wafer. After pasting the surface protection sheet on the surface of the semiconductor wafer on which the circuit is formed, the back surface grinding step of performing the back surface grinding to reduce the thickness of the wafer,
After the backside grinding process of the wafer, the wafer is fixed to a ring frame via a wafer processing sheet, and then a peeling adhesive tape is attached to the surface protection sheet, and the surface protection sheet is attached together with the peeling adhesive tape. Peeling process of the surface protection sheet to peel off,
A chip manufacturing process for manufacturing a chip by dicing the wafer after the surface protection sheet peeling process,
The wafer processing sheet is a wafer processing sheet comprising a dicing sheet that exhibits a dicing process and a die bonding function, and a ring-shaped double-sided pressure-sensitive adhesive sheet, wherein the adhesive layer is detachably laminated on the substrate. Because
It has an adhesive part at the center on the surface of the substrate, and has a non-adhesive part around it,
A method for manufacturing a semiconductor device, comprising: a wafer processing sheet in which a ring-shaped double-sided pressure-sensitive adhesive sheet is laminated on an outer edge portion on the same surface of a base material having the adhesive portion.

Images