JP2013219254A - Electronic component determination device, automation rate determination unit and electronic component determination method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently and highly accurately detect whether it is an electronic component which can be mounted on a substrate by an electronic component mounting device.SOLUTION: An electronic component determination device includes: a component database having identification information of an insertion type electronic component and information on past mounting records of an electronic component mounting device which holds and inserts the insertion type electronic component into a substrate hole; an information acquisition unit for acquiring information on an object insertion type electronic component which is an object of determination; and a control unit for determining whether the object insertion type electronic component acquired by the information acquisition unit can be mounted on a substrate by the electronic component mounting device. The control unit compares the object insertion type electronic component and the identification information, specifies the insertion type electronic component of the component database corresponding to the object insertion type electronic component and, if there is a past mounting record for the object insertion type electronic component, determines that the object insertion type electronic component can be mounted.

Description

  The present invention relates to an electronic component determination apparatus, an automation rate determination unit, and an electronic component determination method for determining an electronic component used in an electronic component mounting apparatus.

  An electronic component mounting apparatus for mounting an electronic component on a substrate has a head including a nozzle, holds the electronic component with the nozzle, and mounts the electronic component on the substrate. The electronic component mounting device picks up the components in the electronic component supply device by moving the head nozzle in a direction perpendicular to the surface of the substrate, and then moves the head relatively in a direction parallel to the surface of the substrate. When the picked-up component arrives at the mounting position, the picked electronic component is mounted on the substrate by moving the nozzle of the head in a direction orthogonal to the surface of the substrate and bringing it closer to the substrate.

  Here, as the electronic component to be mounted on the substrate, in addition to the mountable electronic component mounted on the substrate, the main body and the lead connected to the main body are provided, and the insertable electronic component mounted by inserting the lead into the insertion hole is is there. In this case, the insertion type electronic component is mounted by inserting a lead into a hole formed in the substrate. In this case, an electronic component that is mounted on the substrate without being inserted into the insertion hole (substrate hole), for example, SOP, QFP, and the like is a mountable electronic component. As an electronic component mounting apparatus for mounting an insertion type electronic component on a substrate, for example, there are apparatuses described in Patent Documents 1 and 2. Patent Document 1 describes an electronic component mounting machine including a component mounting machine that mounts both a mountable electronic component that is attracted by a suction head and an insertable electronic component that is sandwiched by a sandwiching head and then clinch after inserting a substrate. Patent Document 2 describes an electronic component mounting apparatus in which a mounting head for mounting a mountable electronic component and an insertion head for mounting an insertable electronic component are integrally formed. By using the apparatuses described in Patent Documents 1 and 2, the insertion type electronic component can be mounted on the substrate.

Japanese Patent Laid-Open No. 5-335582 JP-A-9-83121

  In the devices described in Patent Documents 1 and 2, the holding member grips the main body and the lead of the insertion type electronic component, and is configured so that the gripped insertion type electronic component can be inserted into the substrate hole. In addition to the above, as a method of holding the insertion type electronic component with the holding member, a method in which only the component main body is held by the suction nozzle or the gripping nozzle and the free lead is inserted into the substrate is also conceivable.

  However, electronic components to be inserted into the board may be mounted with various types of main body shapes and sizes, and the number and length of lead-type electronic components. Further, the type and number of insertion-type electronic components to be mounted vary depending on the substrate to be manufactured. For this reason, when a new insertion type electronic component is mounted on a substrate by the electronic component mounting apparatus, the insertion type electronic component can be securely held, or a plurality of leads are aligned with a plurality of substrate holes. This is a problem because it is impossible to produce a board using an electronic component mounting apparatus unless it is possible to examine in advance whether it can be inserted and whether there is a cost merit for creating a holding member.

  The present invention has been made in view of the above, and an electronic component determination apparatus, an automation rate determination unit, and an electronic component determination apparatus capable of efficiently and highly accurately detecting whether an electronic component can be mounted on a substrate with an electronic component mounting apparatus. An object is to provide an electronic component determination method.

  The present invention relates to an electronic component determination device, which includes a component database having identification information of an insertion-type electronic component and information indicating whether or not the electronic component mounting apparatus that holds the insertion-type electronic component and is inserted into a substrate hole is installed. And an information acquisition unit that acquires information on a target insertion type electronic component that is a determination target, and a control unit that determines whether the target insertion type electronic component acquired by the information acquisition unit can be mounted on a substrate by an electronic component mounting apparatus The control unit compares the target insertion type electronic component and the identification information to identify the insertion type electronic component in the component database corresponding to the target insertion type electronic component, and When the target insertion type electronic component has the mounting record, it is determined that the target insertion type electronic component can be mounted.

  The component database includes information on an insertion type electronic component similar to the insertion type electronic component, and the control unit inserts a similar insertion in the component database when the target insertion type electronic component does not have the mounting record. It is determined whether there is an insertion-type electronic component similar to the target insertion-type electronic component based on information on the mold-type electronic component. If there is the similar insertion-type electronic component, it is determined that the target insertion-type electronic component can be mounted. It is preferable to do.

  The component database includes at least one of the size and shape of the insertion-type electronic component main body, the number of lead wires, and the length, and the control unit has no record of mounting the target insertion-type electronic component. If there is an insertion type electronic component similar to the target insertion type electronic component based on the item of the component database, and if there is the similar insertion type electronic component, the target insertion type electronic component can be mounted Is preferably determined.

  Moreover, it is preferable that the said control part extracts the difference between the said object insertion type electronic component and the said similar insertion type electronic component, and outputs the extracted said difference.

  The feeder database further includes performance information of an electronic component supply device that supplies the insertion type electronic component, and the component database further includes information on the feeder that can supply the insertion type electronic component, Preferably, the control unit extracts an electronic component supply device capable of supplying the target insertion type electronic component determined to be mountable based on the component database and the feeder database.

  The control unit includes at least one of the size and shape of the target insertion type electronic component main body, the number of leads, and the length in the information acquisition unit when there is no similar insertion type electronic component. It is preferable to acquire information and extract a feeder capable of supplying the target insertion type electronic component based on the performance information of the electronic component supply device in the feeder database.

  Further, the apparatus further includes a nozzle database having performance information of nozzles holding the insertion type electronic component, the component database further including information on the nozzle capable of holding the insertion type electronic component, and the control unit includes: It is preferable to extract a nozzle capable of holding the target insertion type electronic component determined to be mountable based on the component database and the nozzle database.

  The control unit includes at least one of the size and shape of the target insertion type electronic component main body, the number of leads, and the length in the information acquisition unit when there is no similar insertion type electronic component. It is preferable to acquire information and extract a nozzle capable of holding the target insertion type electronic component based on the performance information of the nozzle in the nozzle database.

  The present invention is an automation rate determination unit, wherein the electronic component determination device according to any one of the above and an insertion that is mounted on the substrate after the electronic component determination device detects whether the target insertion type electronic component can be mounted. An automation rate determination device that calculates a ratio of insertion-type electronic components that can be mounted by the electronic component determination device among the mold electronic components and determines an automation rate.

  The present invention is an electronic component determination method, a reading step of reading a component database having identification information of an insertion type electronic component and information on presence / absence of mounting performance of an electronic component mounting apparatus mounted with the insertion type electronic component; The determination step includes an acquisition step of acquiring information of a target insertion type electronic component to be determined, and a determination step of determining whether the acquired target insertion type electronic component can be mounted on a substrate by an electronic component mounting apparatus. Compares the target insertion type electronic component with the identification information, identifies the insertion type electronic component in the component database corresponding to the target insertion type electronic component, and records the mounting result on the target insertion type electronic component. If there is, it is determined that the target insertion type electronic component can be mounted.

  The present invention has an effect that it can be detected efficiently and with high accuracy whether the target insertion type electronic component is an electronic component that can be mounted on a substrate by an electronic component mounting apparatus.

FIG. 1 is a schematic diagram showing a schematic configuration of a mounting apparatus related information management system. FIG. 2 is a schematic diagram illustrating a schematic configuration of the shared server. FIG. 3 is a schematic diagram illustrating an example of a data configuration of the feeder database. FIG. 4 is a schematic diagram illustrating an example of the data configuration of the nozzle database. FIG. 5 is a schematic diagram showing an example of the data structure of the parts database. FIG. 6 is a flowchart illustrating an example of processing operations executed by the shared server. FIG. 7 is a flowchart illustrating an example of processing operations executed by the shared server. FIG. 8 is a flowchart illustrating an example of processing operations executed in the shared server. FIG. 9 is a flowchart illustrating an example of processing operations executed by the shared server. FIG. 10 is a flowchart illustrating an example of processing operations executed by the shared server. FIG. 11 is a schematic diagram illustrating a schematic configuration of a factory including a production line. FIG. 12 is a schematic diagram illustrating a schematic configuration of the electronic component mounting apparatus. FIG. 13 is a perspective view illustrating a schematic configuration of a housing of the electronic component mounting apparatus. FIG. 14 is a schematic diagram illustrating a schematic configuration of the electronic component mounting apparatus. FIG. 15 is a schematic diagram illustrating a schematic configuration of another example of the rear-side component supply unit. FIG. 16 is a schematic diagram illustrating a schematic configuration of a head of the electronic component mounting apparatus. FIG. 17 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 18 is an explanatory diagram illustrating an example of a nozzle. FIG. 19 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape. FIG. 20 is a perspective view showing a schematic configuration of an electronic component supply device of a rear-side component supply unit. FIG. 21 is a perspective view showing a schematic configuration of the bowl feeder assembly. FIG. 22 is a side view showing another example of the component supply unit. FIG. 23 is a top view showing another example of the component supply unit. FIG. 24 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 25 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 26 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 27 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Hereinafter, embodiments of an electronic component determination device, an automation rate determination unit, and an electronic component determination method according to the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In the following embodiments, a case will be described where the mounting apparatus related information management system includes an electronic component determination apparatus and an automation rate determination unit.

  FIG. 1 is a schematic diagram showing a schematic configuration of a mounting apparatus related information management system. A mounting apparatus related information management system (hereinafter also simply referred to as a management system) 100 is a system that manages information related to an electronic component mounting apparatus. Specifically, the management system 100 is a manufacturer of an electronic component mounting apparatus, an agent and an affiliated company that sells and maintains the electronic component mounting apparatus in various places on consignment from the manufacturer, etc. This is a system for managing information related to an electronic component mounting apparatus between a user who produces a board using the mounting apparatus.

  The management system 100 includes a manufacturer terminal 104, a server 106, a shared server 108, agency terminals 110A, 110B, and 110C, an affiliated company terminal 112, a user terminal 120, and a gateway 130. Note that the numbers of the manufacturer terminal 104, the server 106, the shared server 108, the agency terminals 110A, 110B, and 110C, the affiliated company terminal 112, the many user terminals 120, and the gateways 130 are the same as those in the present embodiment. The form is not limited.

  The manufacturer terminal 104, the server 106, the shared server 108, the agency terminals 110 </ b> A, 110 </ b> B, 110 </ b> C, and the affiliated company terminal 112 of the management system 100 are connected via a network 102 by wire or wireless. The network 102 is a communication line network such as a public line network, and transmits and receives data between connected communication devices.

  The manufacturer terminal 104 is arranged at the manufacturer. The manufacturer terminal 104 is an arithmetic device such as a personal computer, and includes a control unit 104a that has a CPU and the like and performs arithmetic processing, and a recording device such as a ROM and a RAM, and stores control programs and data. A storage unit 104b, a keyboard, a mouse, and the like, an operation unit 104c to which an operation is input by a user, a liquid crystal display and the like, a display unit 104d that displays an operation screen and calculation results, and a network via the gateway 130 And a communication unit 104e that is connected to 102 and transmits / receives data.

  The server 106 is a device owned by the manufacturer, and stores various information related to the electronic component mounting apparatus. The server 106 is connected to the manufacturer terminal 104. The server 106 is not directly connected to the network 102. The server 106 is set so that it cannot be accessed from the network 102 side than the gateway 130. That is, the server 106 can browse the stored data on the manufacturing meter terminal 104, but cannot browse the data on the agency terminals 110A, 110B, 110C and the affiliated company terminal 112.

  The shared server 108 is connected to the network 102 via the gateway 130. The shared server 108 is a device that stores information supplied from each unit of the management system 100, analyzes the input information, and outputs an analysis result. The configuration of the shared server 108 will be described later.

  The agency terminals 110 </ b> A, 110 </ b> B, and 110 </ b> C are arithmetic devices such as personal computers respectively arranged at agencies in various places, and each unit is provided in the same manner as the manufacturer terminal 104. The agency terminals 110A, 110B, and 110C are connected to the network 102 and can communicate with the shared server 108. The agency terminals 110A, 110B, and 110C exchange information with the shared server 108.

  The affiliated company terminal 112 is a computing device such as a personal computer arranged in the affiliated company, and includes each unit as with the manufacturer terminal 104. The affiliated company terminal 112 is connected to the network 102 and can communicate with the shared server 108. The affiliated company terminal 112 transmits / receives information to / from the shared server 108.

  In the management system 100, a plurality of user terminals 120 are arranged for each of the agency terminals 110A, 110B, and 110C and the affiliated company terminal 112. Here, the user terminal 120 included in the trade area 111A of the agency that owns the agency terminal 110A exchanges data with the agency terminal 110A. The user terminal 120 included in the trade area 111B of the agency that owns the agency terminal 110B exchanges data with the agency terminal 110B. The user terminal 120 included in the trade area 111C of the agency that owns the agency terminal 110C exchanges data with the agency terminal 110C. The user terminal 120 included in the trade area 111D of the affiliated company that owns the affiliated company terminal 112 transmits and receives data to and from the affiliated company terminal 112. The personnel belonging to the agency and the affiliated company are in their own trade areas 111A to 111D, and sell the electronic component mounting device to the owner of the user terminal 120, or sell the sold electronic component mounting device. Or maintain. Therefore, the owner of the user terminal 120 has an electronic component mounting apparatus in a factory or facility. The user terminal 120 controls the operation of the electronic component mounting apparatus and collects operation information.

  The user terminal 120 exchanges data by exchanging data with the agency terminals 110 </ b> A to 110 </ b> C and the affiliated company terminal 112 in the included trade area. Various methods can be used as a method for exchanging data between the user terminal 120, the agency terminals 110A to 110C, and the affiliated company terminal 112. The user terminal 120 may be connected to the network 102, connected to the agency terminals 110 </ b> A to 110 </ b> C and the affiliated company terminal 112 via the network 102, and may exchange data via the network 102. The user terminal 120 can communicate with the shared server 108 when connected to the network 102. The user terminal 120 may be connected to the agency terminals 110A to 110C and the affiliated company terminal 112 via a dedicated communication line, and may exchange data via the dedicated communication line. In addition, the user terminal 120 may execute data exchange using a recording medium without being connected to the agency terminals 110A to 110C and the affiliated company terminal 112 via a communication line.

  The gateway 130 is disposed on a communication line that connects the network 102 and the manufacturer terminal 104. Another gateway 130 is arranged on a communication line connecting the network 102 and the shared server 108. The gateway 130 is a device that connects communications, monitors communications between the network 102 and the manufacturer terminal 104, communications between the network 102 and the shared server 108, and blocks communications as necessary. Specifically, the gateway 130 analyzes data passing through the communication line and suppresses unauthorized access to the manufacturer terminal 104 or the shared server 108. Although not shown in FIG. 1, the agency terminals 110A, 110B, 110C, the affiliated company terminal 112, and the user terminal 120 connected to the network 102 of the management system 100 are the manufacturer terminal 104 and the shared server 108. Similarly, connection is made via the gateway 130.

  The management system 100 is configured as described above. In the management system 100, various types of information are supplied from each terminal to the shared server 108. Accordingly, the shared server 108 can collect various information related to the electronic component mounting apparatus. For example, the manufacturer supplies information on the main body of the electronic component mounting apparatus, information on the manufactured feeder, information on the measured electronic component, and the like stored in the server 106 from the manufacturer terminal 104. The agency and the affiliated company supply the information acquired from the user terminals 120 in their trade areas 111A to 111D to the shared server 108. In the management system 100, the user terminal 120 can directly supply information to the shared server 108 via the network 102. In addition, the management system 100 can process the information stored in the shared server 108 as necessary and supply the information to each terminal. This point will be described later.

  By providing the shared server 108, the management system 100 can share necessary information while the manufacturer holds confidential information in the server 106. Similarly, agents, affiliates, and users can share only the information that can be supplied to the shared server 108, and the confidential information can be stored on their own. Thereby, the security of confidential information can be maintained. The management system 100 may have a network configuration (see FIG. 1) as in the present embodiment, and the installation location of the supply server 108 is not particularly limited. That is, the shared server 108 only needs to be independently connected to the network 102 via the gateway 130, and may be installed in the premises or buildings of manufacturers, agents, and affiliates. Regardless of the installation location, the supply server 108 can maintain the security of confidential information as long as the network configuration is as in this embodiment.

  Next, the shared server 108 will be described with reference to FIG. FIG. 2 is a schematic diagram illustrating a schematic configuration of the shared server. As illustrated in FIG. 2, the shared server 108 includes a communication unit 140, a control unit 142, and a storage unit 144. The communication unit 140 is connected to the network 102 via the gateway 130, and transmits / receives data to / from other communication devices via the network 102.

  The control unit 142 performs various calculations and controls processing of data to be exchanged. The control unit 142 includes an automation rate calculation unit 142a and an electronic component determination unit 142b. The automation rate calculation unit 142a calculates the proportion of electronic components that can be mounted by the electronic component mounting apparatus among the targets to be mounted on the board. The electronic component determination unit 142b determines whether an electronic component, mainly an insertion-type electronic component, can be mounted on a substrate by an electronic component mounting apparatus or is an electronic component. The control unit 142 also executes control such as processing for storing data received via the network in the storage unit 144 and processing for deleting data stored in the storage unit 144.

  The storage unit 144 includes a store database 144a, a user database 144b, a main body database 144c, a feeder database 144d, a nozzle database 144e, and a parts database 144f.

  The store database 144a includes information on agents and affiliates corresponding to the agent terminals 110A, 110B, and 110C and the affiliated company terminal 112. Specifically, it has information on agents, locations of affiliated companies, personnel composition, information on users who sold electronic component mounting apparatuses, companies that may be purchased, and information on facilities. In addition, the store database 144a also stores information about processing that can be executed on the electronic component mounting apparatus by each of the agency and the affiliated company. Specifically, the level of modification and repair that can be handled, the level of production program creation, and whether the assembly of the electronic component mounting apparatus can be executed.

  The user database 144b includes information related to a user who uses the electronic component mounting apparatus, that is, a company that purchased the electronic component mounting apparatus. Specifically, the location information of the user, the number of purchased electronic component mounting devices, the model number, the number of operating electronic component mounting devices, the model number, information of the purchased electronic component supply device (feeder), It has information on the machines used before and after mounting electronic components, failure information on the electronic component mounting apparatus in operation, and the like.

  The main body database 144c is information on a part other than the main body of the electronic component mounting apparatus, that is, the replaceable feeder and nozzle. Specifically, it has information on the performance and apparatus configuration of each type of electronic component mounting apparatus handled by the manufacturer.

  FIG. 3 is a schematic diagram illustrating an example of a data configuration of the feeder database. The feeder database 144d has various types of information on the electronic component supply device mounted on the electronic component mounting device. Here, the electronic component supply device (feeder) is a device that supplies a predetermined position, specifically, a position where a nozzle of a head that conveys the electronic component can adsorb the electronic component. The feeder database 144d stores various types of information on electronic component supply devices used by target users managed by the management system 100 and electronic component supply devices developed and sold by manufacturers. . The feeder database 144d includes, for example, as shown in FIG. 3, the model number and type of the electronic component supply device (radial feeder, bowl feeder, tray feeder, axial feeder, etc.), body width (the maximum of the main body of electronic components that can be supplied). Greatly), lead wire length (maximum lead wire length at the supply position), etc. The feeder database 144d also stores information as to whether or not it can be mounted on each mold of the electronic component mounting apparatus as shown in FIG. The items stored in the feeder database 144d and the number of feeders are not limited to those shown in FIG.

  FIG. 4 is a schematic diagram illustrating an example of the data configuration of the nozzle database. The nozzle database 144e has various information on nozzles used in the electronic component mounting apparatus. Here, the nozzle holds the electronic component supplied to the suction position by the feeder, and when the nozzle is transported to the mounting position of the substrate by the head mounted with the nozzle, the holding of the electronic component is released and mounted on the substrate. The nozzle database 144e stores various types of information on nozzles used by target users managed by the management system 100 and nozzles developed and sold by manufacturers. The nozzle database 144e includes, for example, as shown in FIG. 4, the nozzle model number, type (whether suction nozzle or gripping nozzle), main body width (maximum width of main body that can be held), and the like. In addition, the nozzle database 144e also stores information as to whether or not each type of electronic component mounting apparatus can be mounted as shown in FIG. The nozzle database 144e may further store information on restrictions on the shape of electronic components that can be held, weight information, and the like. The items stored in the nozzle database 144e and the number of nozzles are not limited to those shown in FIG.

  FIG. 5 is a schematic diagram showing an example of the data structure of the parts database. The component database 144f holds information on electronic components mounted on the electronic component mounting apparatus, electronic components that cannot be mounted, information on electronic components that may be mounted (for example, information on presence / absence of mounting, insertion type electronic components). Information on whether or not the electronic component mounting apparatus to be inserted into the board hole is installed). That is, the component database 144f includes information on various electronic components that may be mounted on the board. For example, as illustrated in FIG. 5, the component database 144 f stores a product type, a model number, a manufacturer, a main body width, a lead wire length, the number of lead wires, and the like. In addition, the component database 144f also stores information as to whether or not each type of electronic component mounting apparatus can be supplied as shown in FIG. The items and the number of parts stored in the parts database 144f are not limited to those shown in FIG. The component database 144f also stores information on whether each electronic component can be supplied by each nozzle. Furthermore, the electronic component identification information, for example, the model number, corresponding to the item of the similar electronic component is stored in the component database 144f for the electronic component similar to the electronic component and the electronic component that can be regarded as substantially the same.

  Various information stored in the storage unit 144 can be updated at any time. Thereby, the information of a store, a user, the electronic component mounting apparatus main body, a feeder, and an electronic component can be accumulated comprehensively, and newer information can be memorize | stored. In addition, the storage unit 144 is data that specifies a hierarchy of information that can be accessed based on information on a terminal that can access the shared server 108, a login name, a password, and the like, that is, each terminal or user, agent, affiliate, manufacturing Data of access rights and access restrictions for each manufacturer may be stored. The shared server 108 is configured as described above.

  Hereinafter, an example of processing executed in the shared server will be described with reference to FIGS. 6 to 10 are flowcharts showing an example of processing operations executed by the shared server. Although the management system according to the present embodiment is a process executed by the shared server, necessary information may be acquired from the shared server and a processing operation may be executed by each terminal.

  First, processing executed by the electronic component determination unit 142b of the control unit 142 will be described with reference to FIG. 6 may be executed at any of the terminals (manufacturer terminal 104, agency terminals 110A, 110B, 110C, affiliated company terminal 112, user terminal 120). This is the same for the following processing.

  If the control part 142 detects the input of the article number (model number) of an electronic component as step S12, it will determine whether there exists mounting performance as step S14. Specifically, the control unit 142 reads the component database 144f, compares the model number detected in step S12 with the model number of the electronic component in the component database 144f, and determines whether there is a matching electronic component. When there is an electronic component that matches the component database 144f, the control unit 142 determines whether the item has a mounting record. The control unit 142 determines that there is a mounting record when there is an electronic component supply apparatus capable of mounting the electronic component. In addition, you may provide the item of the presence or absence of mounting results in the components database 144f.

  If it is determined in step S14 that there is a mounting record (Yes), the control unit 142 extracts information on electronic component supply devices and nozzles that can be handled in step S16, and in step S18, extracts the electronic component supply devices and nozzles that have been extracted. Information is output and this processing is terminated. The control unit 142 can acquire information on electronic component supply devices and nozzles that can handle the electronic component from the electronic component item in the component database 144f.

  When it is determined in step S14 that there is no mounting record (No), the control unit 142 outputs that there is no mounting record in step S20. That is, it notifies that the input electronic component is an electronic component that has not been mounted by the electronic component mounting apparatus or an electronic component that has given up mounting.

  After outputting in step S20, the control unit 142 determines whether there is an individual determination request in step S22. Here, the individual determination is a more detailed determination that includes information other than the model number. If the control unit 142 determines in step S22 that there is no request for individual determination (No), the process ends.

  If it is determined in step S22 that there is a request for individual determination (Yes), the control unit 142 displays an input screen for detailed electronic component conditions in step S24. Here, the detailed conditions include the shape and size of the electronic component, the number of lead wires, the length, and the like. The control unit 142 transmits the input screen data to the corresponding terminal. In step S26, the control unit 142 determines whether input has been completed, that is, whether there is information input to each item on the input screen, for example, whether an input result has been output from the terminal. If the control unit 142 determines in step S26 that the input has not ended (No), the control unit 142 proceeds to step S26. If it is determined in step S26 that the input has been completed (Yes), the control unit 142 executes an individual determination process based on the detailed condition of the electronic component as step S28, and ends this process.

  Next, the individual determination process will be described with reference to FIG. In step S30, the control unit 142 determines whether there is a similar component with a mounting record, that is, whether there is an electronic component similar to the target electronic component and the similar electronic component has a mounting record.

  The determination process in step S30 will be described with reference to FIG. The control unit 142 reads the component database as step S50, and determines whether there is an electronic component similar to the target component as step S52. That is, the control unit 142 determines whether a component having similar content to the target component is already registered in the component database as a proven component that has been inserted into the board by the electronic component mounting apparatus. It is determined whether the item listing the electronic components in the component database includes information on electronic components that are similar in shape and size, number of leads, arrangement, length, and the like of the target electronic component and the component main body. The control unit 142 can make a determination by extracting information on items for registering similar electronic components in the component database. In the present embodiment, the process of step S52 is performed for an electronic component that has a track record of mounting. If the control unit 142 determines in step S52 that there is a target part (Yes), the control unit 142 proceeds to step S58.

  If it is determined in step S52 that there is no target component (No), the control unit 142 determines in step S54 whether there is an electronic component whose shape difference is within an allowable range. That is, it is determined whether there is an electronic component that can be regarded as the same electronic component in the tolerance range, that is, in the mounting operation. If the control unit 142 determines in step S54 that there is no electronic component within the allowable range (No), the control unit 142 proceeds to step S59.

  When it is determined in step S54 that there is an electronic component within the allowable range (Yes), the control unit 142 determines whether the electronic component extracted in step S56 has a track record of mounting. When it is determined that there is a mounting record (Yes), the control unit 142 proceeds to step S58, and when it is determined that there is no mounting record (No), the control unit 142 proceeds to step S59. Note that, as described above, the target to be extracted in step S54 may be only an electronic component with a mounting record, and the process of step S56 may be omitted.

  When it is determined Yes in step S52 and step S56, the control unit 142 detects the corresponding electronic component as a similar electronic component in step S58, and ends this process. When it is determined No in step S54 and step S56, the control unit 142 determines that there is no similar electronic component as step S59, and ends this process.

  Returning to FIG. 7, the description of the individual determination process will be continued. If it is determined in step S30 that there is a similar component (Yes), the control unit 142 extracts information on the electronic component supply device and the nozzle that can handle the similar component in step S32, and in step S34, the extracted electronic component supply device. And nozzle information are output. In step S36, information on differences from similar parts is output, and the process ends. Thereby, the control part 142 can provide the information of an electronic component supply apparatus and a nozzle with high possibility of being usable for mounting of an applicable electronic component. Further, by outputting information on the difference between the target electronic component and a similar electronic component, adjustments necessary for mounting can be performed.

  Further, when it is determined that there is no similar component (No) in step S30, the control unit 142 outputs that there is no similar electronic component as step S38. That is, it is notified that there is no electronic component similar to the input electronic component and having a track record of mounting.

  After performing the output in step S38, the control unit 142 determines in step S40 whether the shape is within a compatible range. Specifically, it is determined whether there is an electronic component supply apparatus in which the input shape is included in the allowable range, and whether there is a nozzle. In this case, it is preferable to make a determination based on information that includes an allowable range including a range that can be handled by a design change. If the control unit 142 determines in step S40 that it is not within the allowable range (No), the control unit 142 outputs that the response is not possible in step S42, and ends this process. With the shape of the corresponding electronic component, a notification indicating that the current electronic component mounting apparatus cannot be handled even if it is modified is output.

  When the control unit 142 determines in step S40 that it is within the range that can be handled (Yes), the control unit 142 displays an input screen of detailed conditions of the electronic component as step S44. Here, the detailed condition in step S44 is a more detailed condition than the detailed condition in step S24 described above. In step S44, the control unit 142 displays the input screen for the detailed condition of the electronic component. When the input is detected, the control unit 142 executes an individual determination process based on the detailed condition of the electronic component in step S46, and ends this process. .

  Next, the individual determination process executed in step S46 will be described with reference to FIG. In step S60, the control unit 142 extracts electronic component supply devices and nozzles that may be able to respond based on the detailed information of the electronic components. Here, the control unit 142 performs the extraction process based on various information in the database including the electronic component supply device and the allowable range of the nozzles.

  After performing the extraction in step S60, the control unit 142 displays the extraction result in step S62. Here, the extraction result screen is a screen on which an operation for selecting an electronic component supply device and a nozzle to be subjected to determination processing can be input.

  When the extraction result is displayed in step S62, the control unit 142 determines whether there is a selection of an electronic component supply device and a nozzle in step S64. If the control unit 142 determines that there is no selection (No) in step S64, the control unit 142 proceeds to step S72. When it is determined that there is selection (Yes) in step 64, the control unit 142 determines whether there is an instruction to change the design of the electronic component supply device and the nozzle as step S66. Here, the design change instruction may be created only by the manufacturer terminal 104. The design change instruction may be selectable only when the manufacturer terminal 104 permits it. Thereby, processing can be advanced by designing an electronic component supply device and a nozzle that can be actually mounted.

  When it is determined that there is no instruction (No) in Step S66, the control unit 142 proceeds to Step S72. If it is determined in step S66 that there is an instruction (Yes), the control unit 142 calculates the cost of creating the electronic component supply device and the nozzle when the design is changed as step S68. In this embodiment, the control unit 142 calculates the cost, but the creation cost input at the manufacturer terminal may be detected. When the cost is calculated in step S68, the control unit 142 displays the calculated creation cost as step S70, and proceeds to step S72.

  When it determines with No by step S64, S66, or when the process of step S70 is performed, the control part 142 determines whether a process is complete | finished as step S72. If the control unit 142 determines in step S72 that the process has not ended (No), the control unit 142 proceeds to step S64. If the control unit 142 determines in step S72 that the process has been completed (Yes), the process ends.

  The management system 100 can determine whether or not the target electronic component can be mounted by executing the above processing using each unit including the electronic component determination unit 142b as an electronic component determination device. In addition, by performing the processing of FIGS. 7 and 8, it is possible to automatically determine a similar electronic component. In addition, by performing the processing shown in FIG. 7, it is possible to output an electronic component that cannot be handled due to the device configuration. Further, by executing the processing shown in FIG. 9, it is possible to determine the production cost when at least one of the electronic component supply device and the nozzle is custom-made or a design change.

  Accordingly, the management system 100 easily determines whether or not a desired electronic component can be mounted on the electronic component mounting apparatus when a wide variety of electronic components, in particular, an insertion type electronic component is mounted on the substrate by the electronic component mounting apparatus. be able to.

  Next, an example of processing executed by the automation rate calculation unit 142a will be described with reference to FIG. Note that the processing shown in FIG. 10 can be efficiently performed by performing processing using the determination result of the electronic component determination unit 142b described above.

  In step S80, the control unit 142 acquires board design drawing data, and in step S82, extracts information on electronic components to be mounted from the design drawing. In step S84, the control unit 142 further extracts lead-type electronic components from the extracted electronic components. (Insertion type electronic component) is extracted. Since the mountable electronic component can be basically mounted by the electronic component mounting apparatus, it may be determined that the mountable electronic component can be mounted.

  When the lead-type electronic component is extracted in step S84, the control unit 142 determines in step S86 whether the lead-type electronic component to be mounted can be mounted. Here, the control part 142 can perform the process of step S86 by performing the electronic component determination process mentioned above with respect to the target lead type electronic component. The control unit 142 determines whether or not the target lead type electronic component can be mounted. Here, the control unit 142 may take into account the design change of the electronic component mounting apparatus and the nozzle as in the above embodiment, but may not take into account. In addition, whether or not it is determined that the electronic component can be mounted when there are similar electronic components may be adjustable by setting.

  When it is determined in step S86 that the mounting is possible, the control unit 142 determines in step S88 whether all lead-type electronic components have been determined. If it is determined in step S88 that the determination of the lead type electronic component has not been completed (No), the control unit 142 proceeds to step S86 and executes the process of step S86 on the lead type electronic component that has not been determined. To do.

  If it is determined in step S88 that all lead-type electronic components have been determined (Yes), the control unit 142 calculates the proportion of electronic components that can be mounted in the mounting apparatus in step S90. For example, it may be calculated by (number of electronic components determined to be mountable) / (number of electronic components mounted on the substrate).

  Next, the control unit 142 executes a simulation of the production process when the mounting apparatus is used as step S92, that is, when the mounting apparatus is used for mounting the lead type electronic component, and the mounting apparatus is used as step S94. If not, that is, the simulation of the production process is executed when the mounting apparatus is not used for mounting the lead type electronic component. Here, as the simulation, a simulation of cost, production time (tact), production efficiency, yield, etc. may be executed. When the mounting apparatus is not used, the analysis may be performed assuming that an electronic component is manually mounted by an operator having a standard ability at the factory.

  After executing the simulation in step S94, the control unit 142 outputs the calculation result and the simulation result in step S96, and ends this process.

  As shown in FIG. 10, the management system 100 detects the lead-type electronic component that can be mounted by the electronic component mounting apparatus from the design drawing of the board, and outputs the detection result, so that the electronic component mounting apparatus of this embodiment is It can be made to recognize suitably that the electronic component which can be mounted increases by using. Note that either one of the comparison of the simulation results and the calculation of the ratio of electronic components that can be mounted may be performed. When calculating the proportion of electronic components that can be mounted, the proportion of electronic components that can be mounted by the electronic component mounting apparatus may be calculated for comparison when the lead-type electronic components are mounted by hand mounting.

  In addition, the management system 100 may actually perform testing and production, and if electronic components can be mounted in a certain percentage or more, for example, 70% or more, the management system 100 may be registered in the database as being mountable. In addition, when the probability that mounting can be performed by the combination of the nozzle and the feeder changes, the management system 100 preferably stores the combination data together as a determination criterion.

  FIG. 11 is a schematic diagram illustrating a schematic configuration of a factory including a production line. In the factory 170, a production line including an electronic component mounting apparatus to be managed by the user terminal 120 is arranged. The factory 170 includes a user terminal 120, a management device 172, a plurality of electronic component mounting devices 174, a plurality of electronic component mounting devices 10, a pattern forming device 176, and a reflow processing device 178. In the factory 170, a plurality of electronic component mounting apparatuses 174, a plurality of electronic component mounting apparatuses 10, a pattern forming apparatus 176, and a reflow processing apparatus 178 form a single production line, and are arranged in an example. A pattern forming device 176 and a reflow processing device 178 are arranged so as to sandwich both ends of the plurality of electronic component mounting apparatuses 174 and the plurality of electronic component mounting apparatuses 10.

  The management device 172 is a control device that manages the operations of the electronic component mounting device 174 and the electronic component mounting device 10 in an integrated manner. The management device 172 can produce a substrate in conjunction with each other by supplying a production program to the plurality of electronic component mounting devices 174 and the electronic component mounting device 10 and controlling the operation.

  The electronic component mounting apparatus 174 is an apparatus for mounting a mountable electronic component on a substrate. The electronic component mounting apparatus 10 mounts electronic components on a substrate. Here, the electronic component mounting apparatus 10 can mount a lead-type electronic component as an electronic component. Moreover, the electronic component mounting apparatus 10 can also mount both a lead-type electronic component and a mountable electronic component as electronic components. The electronic component mounting apparatus 10 will be described later.

  The pattern forming device 176 is a device that forms a solder paste pattern on the surface of the substrate and fills the insertion hole of the substrate with the solder paste. The reflow processing apparatus 178 adheres the substrate in contact with the solder paste and the electronic component by heating the substrate to a predetermined temperature and temporarily melting the solder paste on the substrate. That is, the reflow processing apparatus 178 is a lead type in which a mounting type electronic component mounted on a solder paste pattern formed on the surface of a substrate and the substrate are bonded with the pattern solder paste, and a lead is inserted into the insertion hole. The lead insertion hole of the electronic component (insertion type electronic component) and the lead of the lead type electronic component are bonded together with a solder paste filled in the insertion hole.

  In the production line of the factory 170, a pattern forming apparatus 176 forms a solder paste pattern on the surface of the substrate and fills the insertion hole with the solder paste. In the production line, the board on which the solder paste is printed is carried into the electronic component mounting apparatus 174 on the line, and the electronic component mounting apparatus 174 mounts the mounted electronic component on the board. The board on which the electronic component is mounted is unloaded from the electronic component mounting apparatus 174. Each time the substrate passes through the electronic component mounting apparatus 174, the electronic component is mounted on the substrate. Next, the production line is carried into the electronic component mounting apparatus 10 on the line, and the electronic component mounting apparatus 10 mounts the lead type electronic component and the mounted electronic component on the substrate. The board on which the electronic component is mounted is unloaded from the electronic component mounting apparatus 10. Each time the substrate passes through the electronic component mounting apparatus 10, the electronic component is mounted on the substrate. The production line carries the substrate on which the electronic component is mounted by the electronic component mounting apparatus 10 into the reflow processing apparatus 178, and executes the reflow processing. The production line produces substrates by the above process.

  Next, an electronic component mounting apparatus 10 capable of mounting both the mountable electronic component and the insertable electronic component of this embodiment will be described with reference to FIGS. The electronic component mounting apparatus 10 can mount both a mountable electronic component to be mounted by placing it on a substrate and a lead type electronic component (insertable electronic component) to be mounted by inserting a lead into an insertion hole of the substrate. It is a device that can. The electronic component mounting apparatus 10 can mount both the mounted electronic component and the lead electronic component, or can mount only one of them. That is, the electronic component mounting apparatus 10 can mount both a mounted electronic component and a lead type electronic component, and can be used for various purposes depending on the board to be manufactured and the layout of other electronic component mounting apparatuses. Can do.

  FIG. 12 is a schematic diagram illustrating a schematic configuration of the electronic component mounting apparatus. An electronic component mounting apparatus 10 shown in FIG. 12 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. The unit 19, the control device 20, the operation unit 40, and the display unit 42 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 12, the electronic component mounting apparatus 10 of the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side centering on the board transfer unit 12. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  FIG. 13 is a perspective view illustrating a schematic configuration of a housing of the electronic component mounting apparatus. The housing 11 includes a main body 11a and covers 11bf and 11br. The main body 11 a is a box that accommodates each part constituting the electronic component mounting apparatus 10. The main body 11a is provided with a cover 11bf, an operation unit 40, and a display unit 42 on the front side. The main body 11a has openings 11c for carrying the substrate 8 into and out of the apparatus on two side surfaces, respectively. The operation unit 40 of this embodiment includes a keyboard 40a and a mouse 40b. The display unit 42 of this embodiment includes a touch panel 42a and a vision monitor 42b. The touch panel 42a also serves as a part of the operation unit 40. The electronic component mounting apparatus 10 includes component supply units 14 f and 14 r and wirings in respective parts of the housing 11. Here, as the wiring, there are a wiring for transmitting an electric signal and a tube for supplying air.

  The cover 11bf is an enclosure provided in a part on the front side of the main body 11a, and is disposed on the upper side in the vertical direction. The cover 11br is an enclosure provided in a part on the rear side of the main body 11a, and is disposed on the upper side in the vertical direction. The covers 11bf and 11br are shaped to cover a part of the front surface or the back surface and a part of the upper surface of the main body 11a and have a cross section of L. The covers 11bf and 11br can be opened and closed with respect to the main body 11a. When the covers 11bf and 11br are in the open state, it is possible to perform operations on the respective parts disposed inside the main body 11a.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at the predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  FIG. 14 is a schematic diagram illustrating a schematic configuration of the electronic component mounting apparatus. As shown in FIG. 14, the electronic component mounting apparatus 10 has a component supply unit 14f disposed on the front side and a component supply unit 14r disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8, and can be supplied to the head 15, as shown in FIG. An electronic component supply device that supplies the holding position in a state where the holding (suction or gripping) is possible is provided. Both the component supply units 14f and 14r of this embodiment supply lead-type electronic components having a main body and leads connected to the main body.

  The front-side component supply unit 14 f includes two bowl feeder assemblies 92. The bowl feeder assembly 92 includes a plurality of component feeders that are bowl feeders, and supplies electronic components from each component feeder to a holding position (suction position, gripping position). The electronic components supplied to the holding position by each component supply device are mounted on the substrate 8 by the head 15. The bowl feeder assembly 92 will be described later. The two bowl feeder assemblies 92 of the component supply unit 14 f are installed in the front side bank 44.

  The rear-side component supply unit 14 r includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 90. The electronic component supply device 90 is a radial feeder and supplies the electronic component to a holding position (suction position, gripping position). The electronic components supplied to the holding position by each component supply device 90 are mounted on the substrate 8 by the head 15.

  The component supply device 90 supplies a radial lead type electronic component to the head 15 using an electronic component holding tape configured by sticking a plurality of radial lead type electronic component leads to the tape. The component supply device 90 holds an electronic component holding tape, sends the held electronic component holding tape, and holds the radial lead type electronic component held by the nozzle of the head 15 (suction position) , Gripping position, holding position). The component supply device 90 cuts and separates the lead of the radial lead type electronic component moved to the holding region, so that the radial lead type electronic component with the lead fixed by the tape can be held in a predetermined position. The radial lead type electronic component can be held (adsorbed and gripped) by the nozzle of the head 15. The component supply device 90 will be described later. The plurality of component supply apparatuses 90 may supply different types of electronic components or separate electronic components.

  FIG. 15 is a schematic diagram illustrating a schematic configuration of another example of the rear-side component supply unit. The component supply unit 14 is mounted with an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and the lead type electronic component held by the electronic component holding tape is mounted. In addition to mounting a plurality of electronic component supply devices 90 that cut the lead at the holding position (second holding position) and can hold the lead-type electronic component at the holding position with the suction nozzle or the grip nozzle provided in the head. An electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape main body is mounted, and the tape main body at the holding position (first holding position) of the mounted electronic component held by the electronic component holding tape. Electronic component supply that allows the mounted electronic component at the holding position to be held by the suction nozzle or gripping nozzle provided in the head It may be provided with a location 90a. The component supply unit 14 may install a stick feeder or a tray feeder in the rear bank 46 as the other electronic component supply device 90a. A plurality of component supply devices 90 and 90 a shown in FIG. 15 are held by a support base (bank) 96. Further, the support table 96 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 90 and 90a.

  The component supply unit 14 includes a plurality of component supply devices 90, 90 a held by a support base 96, a plurality of types of component supply devices 90, different types of electronic components to be mounted, mechanisms for holding electronic components, or supply mechanisms. 90a. The component supply unit 14 may include a plurality of the same type of component supply devices 90 and 90a. The component supply unit 14 is preferably configured to be detachable from the apparatus main body.

  The electronic component supply device 90a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 90 a is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic components can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 90a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder, a tape feeder, or a bulk feeder can be used.

  The head 15 is an electronic component held by the component supply unit 14f (lead-type electronic component held by the bowl feeder unit) or an electronic component held by the component supply unit 14r (radial held by the electronic component supply device 90). A lead-type electronic component (lead-type electronic component, insertion-type electronic component)) is held (adsorbed or grasped) by a nozzle, and the held electronic component is mounted on the substrate 8 moved to a predetermined position by the substrate transport unit 12. Mechanism. Further, when the component supply unit 14r includes the electronic component supply device 90a, the head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 90a on the substrate 8. It is a mechanism to do. The configuration of the head 15 will be described later. The chip-type electronic component (mounted electronic component) is a leadless electronic component that does not include a lead that is inserted into an insertion hole (through hole) in which a substrate is formed. Examples of the on-board electronic component include SOP and QFP as described above. The chip-type electronic component is mounted on the substrate without inserting the lead into the insertion hole.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIGS. 12 and 13, that is, on a plane parallel to the surface of the substrate 8. Part 24. The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices of the component supply units 14f and 14r on the substrate 8 at predetermined positions (mounting position, mounting position). It becomes a transfer means to transfer to. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and includes a camera for photographing the vicinity of the nozzles of the head 15 and an illumination unit for illuminating the photographing region. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image so that it is adsorbed by the nozzle. Recognize the shape of the electronic component and the holding state of the electronic component by the nozzle. The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18, and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation, and includes a keyboard 40a, a mouse 40b, and a touch panel 42a. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker, and includes a touch panel 42a and a vision monitor 42b. The display unit 42 displays various images on the touch panel 42 a and the vision monitor 42 b based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of the present embodiment has one head, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two X-axis drive units are provided, and the two heads can be moved independently by moving the two heads in the XY directions, respectively. Since the electronic component mounting apparatus 10 includes two heads, electronic components can be alternately mounted on one substrate 8. Thus, by alternately mounting electronic components with two heads, while one head is mounting the electronic component on the substrate 8, the other head holds the electronic component in the component supply device. be able to. Thereby, the time when an electronic component is not mounted on the board | substrate 8 can be shortened more, and an electronic component can be mounted efficiently. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can more efficiently mount electronic components on the substrate by moving the two substrates alternately to the electronic component mounting position by the two substrate transfer units 12 and mounting the components alternately by the two heads 15. can do.

  Next, the configuration of the head 15 will be described with reference to FIGS. 16 and 17. FIG. 16 is a schematic diagram illustrating a schematic configuration of a head of the electronic component mounting apparatus. FIG. 17 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 16 also shows various control units that control the electronic component mounting apparatus 10 and one component supply device 90 of the component supply unit 14r. As shown in FIGS. 16 and 17, the head 15 includes a head body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (component state detection unit, state detection). Part) 38.

  As shown in FIG. 16, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  In the electronic component supply device 90, the main body of the electronic component 80 in which the leads are held by the electronic component holding tape (radial component tape) is exposed upward. The electronic component 80 is exemplified by an aluminum electrolytic capacitor. In addition to the aluminum electrolytic capacitor, various electronic components having leads can be used as the electronic component 80. The electronic component supply apparatus 90 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the component supply device 90 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape. The configuration of the electronic component supply device 90 will be described later. Similarly, in the case of the electronic component supply apparatus 90a, the predetermined position is a holding region for holding the electronic component 80 in which the nozzles of the head 15 are held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. In the head main body 30 of this embodiment, as shown in FIG. 17, six nozzles 32 are arranged in a row. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 17, the suction nozzle which each adsorbs and hold | maintains the electronic component 80 is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 33 at the tip, and sucks air from the opening 33 to suck and hold the electronic component 80 at the tip. The nozzle 32 has a shaft 32 a that is formed with an opening 33 and is connected to a tip portion that sucks the electronic component 80. The shaft 32a is a rod-like member that supports the tip, and is arranged extending in the Z-axis direction. The shaft 32 a has an air pipe (pipe) that connects the opening 33 and the suction mechanism of the nozzle drive unit 34 therein.

  The nozzle drive unit 34 moves the nozzle 32 in the Z-axis direction and sucks the electronic component 80 through the opening 33 of the nozzle 32. Here, the Z axis is an axis orthogonal to the XY plane. The Z axis is a direction orthogonal to the surface of the substrate. In addition, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction when mounting electronic components. That is, the θ direction is a direction parallel to the circumferential direction of a circle centering on the Z axis, which is an axis parallel to the direction in which the Z-axis drive unit moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32.

  As the mechanism for moving the nozzle 32 in the Z-axis direction, the nozzle driving unit 34 includes, for example, a mechanism having a linear motion linear motor in which the Z-axis direction is the driving direction. The nozzle driving unit 34 moves the opening 33 at the tip of the nozzle 32 in the Z-axis direction by moving the shaft 32a of the nozzle 32 in the Z-axis direction with a linear motion linear motor. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to the shaft 32a as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle drive unit 34 transmits the driving force output from the motor to the shaft 32a by a transmission element, and rotates the shaft 32a in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 33 of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 33 of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 switches whether to suck air from the opening 33 by sucking air from the air pipe with a pump and switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks air from the opening 33 to suck (hold) the electronic component 80 in the opening 33. The electronic component 80 that has been released is released, that is, the electronic component 80 is not picked up by the opening 33 (the state in which the electronic component 80 is not held).

  The head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component. As with the suction nozzle, the gripping nozzle can release and hold the air from the upper side by opening and closing the movable piece with respect to the fixed piece by sucking and releasing air. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. Further, the height sensor 37 detects the height of the facing part, specifically, the electronic component by processing the distance from the facing part using its own position at the time of measurement and the position of the substrate. . The process of detecting the height of the electronic component based on the measurement result of the distance to the electronic component may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 16, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 90 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a. The shape recognition processing by the laser recognition device 38 will be described later.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 16, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, ROM, and RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls the control operation by the component supply control unit 64.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the operation of sucking (holding) / releasing the electronic components of the nozzle 32 and the rotation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, distance sensors). Controls movement and movement in the Z-axis direction.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each component supply device 90 and the bowl feeder unit 240 or may control all the component supply devices 90 and the bowl feeder unit 240 by one. For example, the component supply control unit 64 controls the electronic component holding tape drawing operation (moving operation), lead cutting operation, and radial lead type electronic component holding operation by the component supply device 90. The component supply control unit 64 controls the component supply operation by the bowl feeder unit 240. In addition, when the component supply unit 14r includes the component supply device 90a, the component supply control unit 64 controls the operation (moving operation) of the electronic component holding tape by the component supply device 90a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

  Here, in the above embodiment, the case where the suction nozzle is used as the nozzle mounted on the head has been described, but the present invention is not limited to this. FIG. 18 is an explanatory diagram illustrating an example of a nozzle. FIG. 18 is a diagram illustrating an example of a gripping nozzle (gripper nozzle). A nozzle 201 illustrated in FIG. 18 includes a fixed arm 202 and a movable arm 204. The nozzle 201 is fixed in a state in which the fulcrum 205 of the movable arm 204 is rotatable on the main body of the nozzle 201, and the movable arm 204 has a portion facing the fixed arm 202 with the fulcrum 205 as an axis close to the fixed arm 202. It can move in a direction away from the direction. The movable arm 204 is connected to a drive unit 206 on a side opposite to a portion of the main body of the nozzle 201 and a portion approaching or moving away from the fixed arm 202 via a fulcrum 205. The drive unit 206 is moved by a drive source (air pressure) that drives the suction nozzle. The movable arm 204 moves in a direction away from the direction in which the portion facing the fixed arm 202 approaches the fixed arm 202 when the driving unit 206 moves.

  The nozzle 201 can grip the electronic component 80 by reducing the distance between the fixed arm 202 and the movable arm 204 in a state where the electronic component 80 is between the fixed arm 202 and the movable arm 204.

  The gripping nozzle is not limited to the nozzle 201 and can have various shapes. The gripping nozzle can have various values for the distance between the fixed arm and the movable arm and the movable range. As described above, the gripping nozzle has different shapes of electronic components that can be gripped for each shape of the nozzle.

  The electronic component mounting apparatus 10 can appropriately hold the electronic component by selecting the type of nozzle that holds the electronic component according to the type of electronic component to be held. Specifically, one electronic component can be mounted by selecting whether to use a suction nozzle or a gripping nozzle according to the electronic component to be held, and switching which nozzle to use among each type of nozzle. More kinds of electronic components can be mounted on the device.

  Next, the component supply apparatus 90 is demonstrated using FIG.19 and FIG.20. The component supply device 90 is a radial feeder that supplies radial lead type electronic components to the holding position as described above. First, the electronic component holding tape will be described with reference to FIG. FIG. 19 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape.

  An electronic component holding tape (radial component tape) 70 shown in FIG. 19 includes a tape main body 72 and a plurality of electronic components (radial lead type electronic components, radial lead components) 80 held by the tape main body 72. The tape main body 72 is bonded with a first tape 74 and a second tape 76 that is narrower than the first tape 74. The tape body 72 has holes 78 as feed holes formed at regular intervals in the extending direction. That is, the tape body 72 has a plurality of holes 78 formed in a row in the extending direction.

  The electronic component 80 includes an electronic component main body (hereinafter simply referred to as “main body”) 82 and two leads 84 arranged in the radial direction of the main body 82. In the electronic component 80, the lead 84 is sandwiched and fixed between the first tape 74 and the second tape 76. Accordingly, the electronic component 80 is fixed at a predetermined position of the tape main body 72 by the lead 84 being sandwiched and fixed between the first tape 74 and the second tape 76. Further, the plurality of electronic components 80 are each fixed at a position where a hole 78 is disposed between the two leads 84 and the hole 78 of the tape body 72 is formed. That is, the electronic component 80 is disposed at the same feed pitch P interval as the holes 78 and at the same position in the tape extending direction. The electronic component 80 may have any shape having a lead wire sandwiched between the first tape 74 and the second tape 76 of the tape body 72, and the shape and type of the lead wire and the body are not particularly limited. Moreover, the electronic component holding tape can set various relative positional relationships between the hole 78 and the electronic component 80 in the extending direction of the tape. For example, in the electronic component holding tape, the electronic component 80 may be disposed between the hole 78 and the hole 78.

  Next, FIG. 20 is a perspective view showing a schematic configuration of an electronic component supply device of a rear-side component supply unit. As shown in FIG. 20, the electronic component supply device (component supply device) 90 holds a housing 210 that holds the other parts and guides the electronic component holding tape, and a clamp unit 212 that is connected to the rear side bank 46. And a feed unit 214 for conveying the electronic component holding tape, and a cut unit 216 for cutting a lead of the electronic component held on the electronic component holding tape. In the electronic component supply device 90, an air pressure adjusting unit is disposed inside the housing 210. The air pressure adjusting unit adjusts the air pressure of the driving unit of the feed unit 214 and the driving unit of the cut unit 216, and controls the driving of each unit.

  The casing 210 is a vertically elongated hollow box, and holds the clamp unit 212, the feed unit 214, the cut unit 216, and the air pressure adjusting unit therein. The housing 210 is provided with a guide groove 220, a guide part 222, a discharge part 226, and a grip part 228. The guide groove 220 has a shape in which one end portions of two straight lines formed along the longitudinal direction of the elongated surface on the upper side in the vertical direction of the casing 210 are connected. That is, the guide groove 220 is formed in a U-shape that extends from one end of the housing 210 to the vicinity of the other end, is folded back in the vicinity of the other end, and extends to the one end. The guide groove 220 is a groove for guiding the electronic component holding tape, and the electronic component holding tape is supplied from one end (end on the supply side) of the U shape. The guide groove 220 moves the supplied electronic component holding tape along the U shape, and discharges it from the other end (end on the discharge side) of the U shape. The guide groove 220 guides the electronic component holding tape in a state where the tape main body 72 is inside the housing 210 and the electronic component is exposed to the outside of the housing 210.

  The guide portion 222 is connected to the supply-side end portion of the guide groove 220 and guides the electronic component holding tape in a state where the electronic component is held to the guide groove 220. The discharge portion 226 is connected to the discharge-side end portion of the guide groove 220, and the portion that moves through the housing 210 and supplies the electronic component to the head 15 discharges the electronic component holding tape. The gripping part 228 is a part held by the operator when the electronic component supply apparatus 90 is transported.

  The clamp unit 212 is a mechanism connected to the support base 96. The clamp unit 212 is fixed to the casing 210 and is a mechanism that can switch between a state in which it is connected and fixed to the support base 96 and a state in which it is released without being connected to the support base 96. . The operator can attach / detach the electronic component supply device 90 to / from the support base 96 by operating the clamp unit 212.

  The feed unit 214 is a mechanism for transporting the electronic component holding tape, that is, for moving the electronic component holding tape guided along the guide groove 220. The feed unit 214 includes a protrusion that is inserted into the hole of the electronic component holding tape, and the protrusion is moved in the transport direction in a state where the protrusion is inserted into the hole of the electronic component holding tape. Move the electronic component holding tape. The protrusion of the feed unit 214 is removed from the hole when moved in the direction opposite to the conveyance direction. Thus, the feed unit 214 can move the tape sequentially in the feed direction by one pitch by reciprocating the protrusion in the feed direction by one pitch of the hole of the tape body 72.

  The cut unit 216 is disposed at a supply position for supplying an electronic component, and cuts the lead of the electronic component held on the electronic component holding tape. Further, the cut unit 216 clamps, that is, holds the electronic component whose lead has been cut until the electronic component is sucked (held) by the nozzle. The cut unit 216 includes a mechanism for adjusting the height at which the lead is cut, a mechanism for adjusting a range in which a mechanism for clamping the electronic component is moved when clamping the electronic component, and the like. By making various adjustments with the mechanism, the leads of various lead-type electronic components can be cut and clamped.

  Here, the cutting position of the lead cut by the cutting unit 216 will be described. In a conventional mounting apparatus having a lead-type electronic component dedicated head for inserting a substrate, the lead is cut near the tip of the lead close to the tape for fixing the lead, and a very long lead is inserted into the substrate. This is because the conventional mounting apparatus has a lead cutting part and a lead gripping part on the head side, and the lead gripping part grips the root of the lead and then cuts the lower part (temporary cutting). This is because it becomes longer. In addition, since the conventional mounting apparatus guides and inserts into the guide pin when inserting the lead into the insertion hole, even if the lead is long, it does not interfere with the board insertion. In addition, the conventional mounting device uses a lead bending device that cuts the lead to the required length on the back side of the substrate (main cutting) and folds it. At the time of temporary cutting for separating the lead from the component tape in order to perform post-processing This is because it was necessary to keep it long.

  On the other hand, the cutting unit 216 has a cutting length of the lead of the radial lead type electronic component, the length equal to the thickness of the substrate or the lead protruding on the back side of the substrate does not cause a solder failure, and The predetermined length is a length corresponding to the thickness. The predetermined length is, for example, substantially the same length as the insertion hole of the substrate. More specifically, the length is 0 mm or more and 3 mm or less with respect to the length of the insertion hole of the substrate. Thus, the following effects can be obtained by using a configuration in which a component is not cut temporarily with a head as in the prior art, but is cut into a predetermined length from the beginning with a component supply device.

  The electronic component mounting apparatus 10 can improve the stability of the lead interval when the main body of the electronic component at the holding position of the component supply device 90 is held by the nozzle by the cut unit 216 cutting the lead short. It is possible to increase the number of parts in which the lead can be inserted into the insertion hole, and it can be mounted very efficiently and with high accuracy.

  Also, in the conventional mounting apparatus, when a long lead is inserted into the solder paste previously filled or applied in the insertion hole, most of the solder paste is pushed out to the lead tip side, and the melted solder during reflow soldering is inserted into the insertion hole. It may not be able to rise in the narrow gap between the lead and the lead, and soldering may be defective. On the other hand, in the electronic component mounting apparatus 10, the cut unit 216 cuts the leads short, so that the solder melted in the gap rises, and the best soldering can be performed so that the solder is filled with no gap. Furthermore, by mounting the mountable electronic component on the solder paste applied to the upper surface of the substrate, the lead type electronic component and the mountable electronic component can be simultaneously performed by a single reflow soldering process. In other words, when a lead that is too long for the solder paste previously filled or applied in the insertion hole is inserted, most of the solder paste is pushed to the lead tip side, and the solder melted during reflow soldering cannot rise to the substrate, That is, the solder may not reach the substrate and soldering may be defective. On the other hand, in the electronic component mounting apparatus having the above configuration, when the lead is cut into the predetermined length, a part of the solder pushed out of the insertion hole by the lead inserted through the insertion hole is melted. It rises to the back surface of the substrate and can be soldered to the electrode on the back surface of the substrate. Further, when there is an electrode inside the insertion hole (substrate hole), the solder can be raised and soldered in the gap between the lead and the electrode inside the substrate. In this way, mechanical and electrical soldering can be performed.

  In addition, by setting the predetermined length to be equal to the thickness of the substrate, it is possible to prevent the leads from protruding from the substrate (back surface of the substrate) even when the radial lead type electronic component is mounted on the substrate. Further, by setting the predetermined length to such a length that the lead protruding to the back side of the substrate does not cause a solder failure, the lead can be suitably fixed to the insertion hole of the substrate by reflow processing even if the lead is shortened.

  The electronic component supply device 90 is configured as described above, and is fixed to a predetermined position of the support base 96 by the clamp unit 212. The electronic component supply device 90 moves the electronic component holding tape by the feed unit 214. Further, the electronic component supply device 90 cuts the lead of the electronic component at the supply position by the cut unit 216 and holds the electronic component from which the lead has been cut until it is sucked by the nozzle 32 of the head 15. Thereby, the electronic component conveyed with an electronic component holding tape can be made into the state which can be conveyed with a head.

  Next, the component supply unit 14f will be described. Here, the component supply unit 14 f includes two bowl feeder assemblies 92. The two bowl feeder assemblies 92 are arranged in parallel and have basically the same configuration. Hereinafter, one bowl feeder assembly 92 will be described.

  FIG. 21 is a perspective view showing a schematic configuration of the bowl feeder assembly. As shown in FIG. 21, the bowl feeder assembly 92 includes two bowl feeder units 240 and a support mechanism 241. In the present embodiment, the operation of the bowl feeder unit 240 and the bowl feeder assembly 92 is controlled by the control unit. The bowl feeder unit 240 and the bowl feeder assembly 92 may use the control device 20 of the electronic component mounting apparatus 10 as a control unit, or the bowl feeder unit 240 and the bowl feeder assembly 92 may have a control unit. .

  The support mechanism 241 is a mechanism that supports the two bowl feeder units 240. The support mechanism 241 includes a support plate 241, a support bar 252, and a connecting portion 253. The support plate 241 is a plate-like member, and two bowl feeder units 240 are installed and fixed. The support plate 241 is connected to the front bank 44 at the tip on the component supply side. The support bar 252 is connected to the side of the support plate 241 far from the front bank 44 through the connecting portion 253. The support bar 252 has an end portion on the lower side in the vertical direction supported by an installation surface (floor) on which the electronic component mounting apparatus 10 is installed. In the support mechanism 241, a support plate 241 on which two bowl feeder units 240 are installed is supported by the front side bank 44 and the support bar 252. The support mechanism 241 can suppress the support plate 241 from being bent by supporting the support plate 241 at the two locations of the front side bank 44 and the support bar 252 away from the front side bank 44. Thereby, the vibration of the bowl feeder unit 240 can be suppressed from being absorbed as the vibration of the support plate 241, and the bowl feeder unit 240 can be suitably driven.

  One bowl feeder unit 240 included in the bowl feeder assembly 92 has two rows of bowls, which will be described later, perpendicular to the bowls of the other bowl feeder units 240, and front and rear with respect to the holding position (tip of the rail 282, suction position). Arranged in a staggered manner. That is, the bowl feeder assembly 92 is disposed at a position where the bowls described later of the two bowl feeder units 240 move back and forth in the Y direction. Then, in the X direction (a direction orthogonal to the rail extension direction, which will be described later, the substrate transport direction), the arrangement of the bowls included in the first row of bowl feeder units 240 and the bowls included in the second row of bowl feeder units 240 At least part of the area overlaps. In other words, the bowl feeder assembly 92 is disposed such that the positions of the bowls described later of the two bowl feeder units 240 overlap in the X direction. Moreover, the bowl feeder assembly 92 is arrange | positioned in the Y direction in the position where the bowl which the two bowl feeder units 240 mention later is back and forth. Thereby, the bowl feeder assembly 92 can arrange | position the bowl feeder unit 240 efficiently. Specifically, the width in the X direction can be reduced, and more component supply devices can be arranged in the component supply available area of the electronic component mounting apparatus 10.

  In this embodiment, the bowl of the first row of bowl feeder units 240 and the bowl of the second row of bowl feeder units 240 (disposed farther away from the holding position than the first row of bowl feeder units 240). Is arranged in a region within twice the outer diameter of the bowl in a direction (X direction, substrate transport direction) orthogonal to the rail extending direction. By doing in this way, the width | variety of a X direction can be narrowed reliably and many component supply apparatuses can be arrange | positioned to the component supply possible area | region of the electronic component mounting apparatus 10. FIG.

  Next, the bowl feeder unit 240 of the bowl feeder assembly 92 of the component supply unit 14f will be described with reference to FIGS. The bowl feeder unit 240 shown in FIGS. 22 and 23 uses a bowl feeder as an electronic component supply device. First, the whole structure of the bowl feeder unit 240 is demonstrated using FIG.22 and FIG.23. FIG. 22 is a side view showing another example of the component supply unit. FIG. 23 is a top view showing another example of the component supply unit.

  The bowl feeder unit 240 includes electronic component supply devices (bowl feeders) 262, 264, 266, a driving device 268, and a fixing portion 270. That is, the bowl feeder unit 240 includes three electronic component supply devices 262, 264, and 266, and is a mechanism that can supply components at three locations. In the bowl feeder unit 240, one driving device 268 serves as a driving unit for the electronic component supply devices 262, 264, and 266. In the bowl feeder unit 240, the fixing unit 270 supports the electronic component supply devices 262, 264, and 266 and the driving device 268. The fixing portion 270 includes a frame-shaped support portion 296 extending in the vertical direction and a support portion 298, and supports the electronic component supply devices 262, 264, 266 and the driving device 268 at the upper end and the lower end. Yes. Further, the support unit 296 and the support unit 298 extend to a rotation shaft of a drive device 268 described later, and the drive device 268 rotates the target portion of the electronic component supply device 262, 264, 266 around the rotation shaft. I support it in a movable state.

  The electronic component supply device 262 includes a bowl 280a, a rail 282a, and a support mechanism 284a. The electronic component supply device 264 includes a bowl 280b, a rail 282b, and a support mechanism 284b. The electronic component supply device 266 includes a bowl 280c, a rail 282c, and a support mechanism 284c. The electronic component supply devices 262, 264, and 266 are arranged in such a manner that the bowls 280a, 280b, and 280c are stacked at positions where the positions in the horizontal direction overlap with each other, and the bowls 280a, 280b, and 280c are arranged in this order from the vertical direction. . In the electronic component supply devices 262, 264, 266, support mechanisms 284a, 284b, 284c are arranged in parallel on the same plane. That is, the holding positions of the plurality of rails 282a, 282b, 282c are arranged on the same plane.

  The electronic component supply devices 262, 264, and 266 have basically the same configuration except that the shapes of the rails 282a, 282b, and 282c are different depending on the arrangement position and the relationship between the arrangement positions. Hereinafter, the points common to the bowls 280a, 280b, and 280c of the electronic component supply devices 262, 264, and 266 will be described as the bowl 280. Similarly, the points common to the rails 282a, 282b, and 282c will be described as the rail 282. Points common to the support mechanisms 284a, 284b, and 284c will be described as the support mechanism 284.

  The bowl 280 is a container in which a plurality of electronic components are placed. The rail 282 serves as a guide member that guides the electronic component put in the bowl 280 to the suction position. The support mechanism 284 is a mechanism that supports the electronic component guided by the rail 282 at the suction position. The electronic component supply devices 262, 264, and 266 are connected to the vibration units of the bowl 280 and the drive device 268, and further include a connection unit that transmits vibration from the drive device 268 to the bowl 280. In the present embodiment, in the electronic component supply devices 262, 264, and 266, the driving device 268 serves as a vibration unit.

  The drive unit 268 includes a motor 290, a shaft 292, and a mounting block unit 294. The motor 290 is a drive source of the drive device 408. The shaft 292 is fixed to the fixed portion and supported in a rotatable state. The shaft 292 is connected to the mounting block portion 294. The mounting block portion 294 is connected to the bowls 280a, 280b, 280c, and rotates integrally with the shaft 432 as a rotation axis. The driving unit 268 transmits the driving force of the motor 290 to the bowls 280a, 280b, and 280c through the connecting portions of the shaft 292, the mounting block unit 294, and the electronic component supply devices 262, 264, and 266, and the bowls 280a, 280b, and 280c. , The electronic components held by the bowls 280a, 280b, 280c are conveyed to the rails 282a, 282b, 282c. The drive unit 268 also vibrates the rails 282a, 282b, and 282c in one direction.

  The bowl feeder unit 240 can effectively utilize the horizontal region by stacking the bowls of the component supply devices 262, 264, and 266 in the vertical direction as described above, and saves a plurality of component supply devices. Can be arranged. Thereby, the bowl feeder unit 240 can supply a large number of electronic components to the suction position. Moreover, the bowl feeder unit 240 can arrange | position the support mechanism 284 close to a horizontal direction by laminating | stacking the bowl of the component supply apparatuses 262,264,266 in the vertical direction as mentioned above. Thereby, the suction position of the electronic component can be brought closer, and the moving distance of the head when sucking the component can be reduced. Further, the bowl feeder unit 240 can reduce the number of driving sources and simplify the apparatus configuration by using one driving device 268 as a driving unit of the three component supply devices 262, 264, and 266. it can. In addition, by supporting the rotating shafts of the component supply devices 262, 264, and 266 with the fixing unit 270, it is possible to stably vibrate each unit. Moreover, although the bowl feeder unit 240 of the said embodiment made three component supply apparatuses, it is not limited to this, The number of component supply apparatuses is not limited.

  In the present embodiment, a drive mechanism that vibrates the bowl 280 is used as the drive unit of the bowl feeder unit 240, but the present invention is not limited to this. The electronic component supply device (bowl feeder) constituting the bowl feeder unit 240 only needs to supply the electronic component 80 to the rail 282 by shaking the bowl 280. For example, a drive unit that swings the bowl 280 may be used as the drive unit.

  Next, the operation of each part of the electronic component mounting apparatus will be described. Note that the operation of each part of the electronic component described below can be executed by controlling the operation of each part based on the control device 20.

  FIG. 24 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The overall processing operation of the electronic component mounting apparatus 10 will be outlined with reference to FIG. Note that the processing illustrated in FIG. 24 is executed by the control device 20 controlling each unit. The electronic component mounting apparatus 10 reads a production program as step S252. The production program is created by a dedicated production program creation device, or created by the control device 20 based on various input data.

  After reading the production program in step S252, the electronic component mounting apparatus 10 detects the state of the apparatus in step S254. Specifically, the configuration of the component supply units 14f and 14r, the type of electronic component being filled, the type of nozzle prepared, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S254, and when preparation is completed, the board is loaded as step S256. The electronic component mounting apparatus 10 carries in the board in step S256, and when the board is placed at a position where the electronic component is mounted, the electronic component is mounted on the board in step S258. When the mounting of the electronic component is completed in step S258, the electronic component mounting apparatus 10 carries the board out in step S260. When the electronic component mounting apparatus 10 carries out the board in step S260, it is determined in step S262 whether the production is finished. If the electronic component mounting apparatus 10 determines that the production is not finished (No) in step S262, the electronic component mounting apparatus 10 proceeds to step S256, and executes the processing from step S256 to step S260. That is, processing for mounting electronic components on the board is executed based on the production program. If the electronic component mounting apparatus 10 determines that the production is finished (Yes) in step S262, the electronic component mounting apparatus 10 finishes this process.

  The electronic component mounting apparatus 10 can manufacture a board on which the electronic component is mounted by reading the production program and performing various settings as described above, and then mounting the electronic component on the board. In addition, the electronic component mounting apparatus 10 mounts a lead-type electronic component having a main body and leads connected to the main body on the substrate as an electronic component, specifically, a hole (insertion hole) formed on the substrate. ) Can be mounted on the substrate.

  FIG. 25 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. Note that the processing operation shown in FIG. 25 is an operation from the loading of the substrate to the completion of the mounting of the electronic component on the substrate. Further, the processing operation shown in FIG. 25 is executed by the control unit 60 controlling the operation of each unit.

  The control part 60 carries in a board | substrate as step S302. Specifically, the control unit 60 transports the substrate on which the electronic component is to be mounted to a predetermined position by the substrate transport unit 12. When the substrate is loaded in step S302, the control unit 60 performs holding movement in step S304. Here, the holding movement (suction movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding area of the component supply unit 14.

  After performing the holding movement in step S304, the control unit 60 lowers the nozzle 32 as step S306. That is, the control unit 60 moves the nozzle 32 downward to a position where the electronic component 80 can be held (sucked and gripped). After lowering the nozzle 32 in step S306, the control unit 60 holds the component with the nozzle 32 as step S308, and raises the nozzle 32 as step S310. When the control unit 60 raises the nozzle to a predetermined position in step S310, specifically, moves the electronic component 80 to the measurement position of the laser recognition device 38, the electronic component sucked by the nozzle 32 is set in step S312. Detect the shape. When detecting the shape of the electronic component in step S312, the control unit 60 raises the nozzle in step S314. As described above, the control unit 60 detects the part shape in step S312, and when it is determined that the held electronic part cannot be mounted, the electronic part is discarded and the electronic part is adsorbed again. When the control unit 60 raises the nozzle to a predetermined position, as step S316, the processing operation of moving the electronic component sucked by the nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8 is performed. In step S318, the nozzle 32 is lowered, and in step S320, component mounting (component mounting), that is, a processing operation for releasing the electronic component 80 from the nozzle 32 is performed. In step S322, the nozzle 32 is raised. That is, the control part 60 performs the mounting process mentioned above in the processing operation from step S312 to step S320.

  When the nozzle is raised in step S322, the control unit 60 determines in step S324 whether mounting of all components is completed, that is, whether mounting processing of the electronic components to be mounted on the board 8 is completed. If the control unit 60 determines in step S324 that the mounting of all the components has not been completed (No), that is, the electronic component to be mounted remains, the process proceeds to step S304, and the next electronic component is placed on the substrate 8. Execute the processing operation to be installed. In this way, the control unit 60 repeats the above processing operation until the mounting of all components on the board is completed. If the control unit 60 determines in step S324 that all parts have been mounted (Yes), the process ends.

  Next, the process shown in FIG. 26 is a process before mounting an electronic component, specifically, a measurement process of the shape of the electronic component and a determination process based on the measurement result. Note that the control unit 60 executes the processing of FIG. 26 for all electronic components that hold the processing. The control unit 60 acquires data of electronic components to be held as step S420. Here, the data of the electronic component to be held (suction target, grip target) is various pieces of information necessary for mounting the electronic component on the substrate. The electronic component data to be held includes the position of the component supply device 90 where the electronic component is held, the shape data of the electronic component, the suction height (holding height) of the electronic component, and the electronic component by the laser recognition device 38. Information on measurement positions to be measured.

  After acquiring data in step S420, the control unit 60 determines a measurement position as step S422. That is, the control unit 60 determines the position for detecting the shape of the electronic component based on the data acquired in step S420, that is, the position of the electronic component in the Z-axis direction. In addition, the control part 60 may perform the process of step S420 and step S422 before adsorption | suction of an electronic component.

  When determining the measurement position in step S422 and sucking the electronic component with the nozzle, the control unit 60 adjusts the Z-axis position of the electronic component in step S424. That is, the control unit 60 moves the measurement position determined in step S422 of the electronic component to the measurement region of the laser recognition device 38 by moving the nozzle in the Z-axis direction. After adjusting the Z-axis position of the electronic component in step S424, the control unit 60 measures the shape of the electronic component in step S426. That is, the control unit 60 uses the laser recognition device 38 to detect the shape of the electronic component at the measurement position.

  When detecting the shape of the electronic component at the measurement position in step S426, the control unit 60 determines in step S428 whether the measurement has been completed. That is, the control unit 60 determines whether the measurement of the shape at the measurement position determined in step S422 is completed. If it is determined in step S428 that the measurement is not completed (No), the control unit 60 proceeds to step S424, performs the processes in steps S424 and S426 again, and measures the shape of the measurement position where the measurement has not been completed. The controller 60 detects the shape of the set measurement position by repeating the adjustment of the position of the electronic component and the measurement of the shape as described above.

  When it is determined in step S428 that the measurement is completed (Yes), the control unit 60 compares the measurement result with the reference data in step S430. Here, the reference data is data on the shape of the electronic component to be attracted (held) acquired in step S420. The control unit 60 compares the measurement result with the reference data to determine whether the sucked electronic component has a shape that matches the reference data, or whether the direction of the electronic component matches the direction of the reference data, or the like. To do.

  After performing the comparison in step S430, the control unit 60 determines whether the component is appropriate in step S432. Specifically, the control unit 60 determines whether or not the electronic component is sucked in a state where it can be mounted in step S432. When the control unit 60 determines in step S432 that the component is not appropriate (No), in step S434, the control unit 60 discards the electronic component sucked by the nozzle, and ends this process. The control unit 60 moves the head and nozzle to a position facing the component storage unit 19, and throws the electronic component held by the nozzle into the component storage unit 19, thereby discarding the electronic component. In addition, the control part 60 performs again the process which mounts the electronic component of the same kind in the same mounting position (mounting position) of a board | substrate.

  When it is determined in step S432 that the component is appropriate (Yes), the control unit 60 determines whether the component direction (direction in the rotation direction of the nozzle) is appropriate in step S436. That is, it is determined whether the sucked electronic component is the same as the reference direction. In addition, the control part 60 of this embodiment determines whether the electronic component is reversed as step S436. When it is determined in step S436 that the direction is not appropriate (No), that is, the electronic component is in a reversed state, the control unit 60 reverses the electronic component in step S438, and then proceeds to step S440.

  When it determines with Yes by step S436, or when the process of step S438 is performed, the control part 60 finely adjusts the mounting position (mounting position) of an electronic component based on a holding position as step S440. For example, based on the detection result of the shape of the electronic component, the position where the nozzle is sucking the electronic component is detected, and the relative position between the nozzle and the substrate at the time of mounting is adjusted based on the displacement of the holding position with respect to the reference position. . The control part 60 will complete | finish this process, if the process of step S440 is performed. In addition, after performing the process of step S440 in FIG. 26, the control unit 60 mounts the determined electronic component on the board in consideration of the result of step S440.

  As described above, the electronic component mounting apparatus 10 can appropriately mount the electronic component on the board by detecting the shape of the electronic component using the laser recognition device 38 and performing various processes based on the result.

  The electronic component mounting apparatus 10 discards the electronic component in step S434 in the flowchart shown in FIG. 26. However, when it is determined that the lead shape of the electronic component is inappropriate, a process for correcting the lead shape is executed. Also good. That is, in step S434, the electronic component lead may be corrected (processed) into a shape that can be inserted without being discarded, and mounted at the mounting position (mounting position). Even if the electronic component mounting apparatus 10 corrects the lead of the electronic component by a mechanism for clamping the electronic component of the cut unit of the electronic component supply apparatus 90, the electronic component mounting apparatus 10 corrects the lead of the electronic component by a separately provided correction mechanism. May be. As the processing means for processing the shape of the lead in this way, various means such as a mechanism for clamping the main body of the electronic component or the lead, a correction mechanism provided separately, or the like can be used.

  Next, an example of a processing operation when electronic components are mounted will be described with reference to FIG. FIG. 27 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The electronic component mounting apparatus 10 executes the process of FIG. 27 every time the electronic component is held by the head nozzle. Note that the processing in FIG. 27 is basically processing when both lead-type electronic components and mounted electronic components are mounted on a substrate as electronic components. The electronic component mounting apparatus 10 identifies an electronic component to be held in step S510, and determines whether the component to be held is a lead type electronic component in step S512.

  If the electronic component mounting apparatus 10 determines that the electronic component mounting apparatus 10 is a lead type electronic component (Yes) in step S512, the electronic component mounting apparatus 10 holds the lead type electronic component of the electronic component supply apparatus with a nozzle in step S514. That is, the electronic component mounting apparatus 10 holds the lead-type electronic component supplied to the holding position (second holding position) of the electronic component supply apparatus 90 with the nozzle. When the electronic component mounting apparatus 10 holds the lead type electronic component with the nozzle in step S514, in step S516, the lead of the lead type electronic component is inserted into the insertion hole and mounted on the substrate.

  If the electronic component mounting apparatus 10 determines in step S512 that the electronic component mounting apparatus 10 is not a lead-type electronic component (No), the electronic component mounting apparatus 10 holds the mounted electronic component of the electronic component supply apparatus with a nozzle in step S517. That is, the electronic component mounting apparatus 10 holds the mounted electronic component supplied to the holding position (first holding position) of the electronic component supply apparatus 90a with the nozzle. After holding the mountable electronic component with the nozzle in step S517, the electronic component mounting apparatus 10 mounts the mountable electronic component on the substrate in step S518. That is, the electronic component mounting apparatus 10 mounts the mountable electronic component on the substrate without inserting it into the insertion hole.

  When the electronic component mounting apparatus 10 executes the process of step S516 or step S518, that is, when the electronic component is mounted, the electronic component mounting apparatus 10 determines whether mounting of all the electronic components is completed as step S519. If the electronic component mounting apparatus 10 determines in step S519 that the mounting is not completed (No), the electronic component mounting apparatus 10 proceeds to step S510, specifies the electronic component to be mounted next, and performs the above processing on the specified electronic component. Execute. If the electronic component mounting apparatus 10 determines in step S519 that the mounting has been completed (Yes), the electronic component mounting apparatus 10 ends this processing.

  As shown in FIG. 27, the electronic component mounting apparatus 10 can mount the mounted electronic component and the lead electronic component on the substrate with one head. Furthermore, the electronic component mounting apparatus 10 can mount both a mountable electronic component and a leaded electronic component with the same nozzle. Here, the electronic component mounting apparatus 10 can be transported and mounted by the same nozzle as the mounted electronic component by holding (sucking or gripping) the main body of the lead type electronic component. In addition, the electronic component mounting apparatus 10 performs mounting with the same head or the same nozzle by determining whether the electronic component mounting device or the lead electronic component is inserted and switching between inserting and not inserting the lead into the insertion hole in accordance with each. Even in this case, it can be mounted on a substrate under conditions suitable for each electronic component. Thereby, it is possible to mount the mountable electronic component and the leaded electronic component without replacing the nozzle. Further, the mounting type electronic component and the lead type electronic component can be mixed and mounted without being separated, so that the mounting order is less restricted and the mounting efficiency can be further improved.

  Here, the electronic component mounting apparatus 10 can obtain the above effect more suitably by using the radial lead type electronic component supplied by the electronic component supply device 90 as described above as the lead type electronic component. The electronic component mounting apparatus 10 holds the radial lead type electronic component whose lead has been cut to a predetermined length by the electronic component supply device 90 with a nozzle, more specifically, holds the main body with the nozzle, and transfers it. The leads are mounted on the board by inserting them into the insertion holes. Thus, since the electronic component mounting apparatus 10 holds the main body of the electronic component, the length of the lead can be shortened. Furthermore, since the electronic component mounting apparatus 10 is configured to cut the lead before being transported and held by the tape body, the portion of the radial lead type electronic component lead that has been held by the tape to be transported is removed. It can be mounted on the substrate in a removed state. As a result, the lead of the radial lead type electronic component can be shortened and mounted on the substrate, and the electronic component can be mounted on the substrate in a stable state. Specifically, since the lead of the radial lead type electronic component can be shortened and mounted on the substrate, the vibration applied to the substrate due to the contact between the lead and the insertion hole when the substrate is mounted can be reduced. As a result, even if the radial lead type electronic component and the mounting type electronic component are mounted in the same process, the influence on each other's mounting can be reduced. In the same process, that is, the same head and the same nozzle are continuously mounted. Even in this case, both electronic components can be preferably mounted.

  Here, the electronic component mounting apparatus 10 of the above embodiment includes a bowl feeder assembly 92 using a bowl feeder as the component supply unit 14f, and a configuration including an electronic component supply device 90 of a radial feeder as the component supply unit 14r. However, it is not limited to this. The electronic component mounting apparatus 10 can have various combinations of component supply units. For example, the bowl feeder electronic component supply device may be installed in both the front and rear component supply units, or the radial feeder electronic component supply device may be installed in both the front and rear component supply units. . Further, as described above, the component supply unit may include an electronic component supply device (chip component feeder) 90a that supplies the mounted electronic component with the electronic component holding tape. Further, the electronic component supply device of one of the front and rear component supply units may be an electronic component supply device (chip component feeder) 90a. That is, one of the front and rear component supply units supplies lead-type electronic components (electronic components inserted into the board), and the other supplies leadless electronic components (electronic components mounted on the board). It may be. The electronic component mounting apparatus can also use a so-called tray feeder as the electronic component supply apparatus. Further, the electronic component mounting apparatus is in the holding position in a state where the lead of the axial type electronic component held on the tape as the electronic component supply device is cut out so as to be short under the substrate as described above and bent into a U-shape. The supplied axial feeder can also be used. In this case, the electronic component mounting apparatus uses the nozzle to hold the axial electronic component main body at the holding position of the axial feeder, and then determines whether the lead interval is good or not, and inserts the axial electronic component that has been judged good. Insert into. The electronic component mounting apparatus 10 can be mounted on or inserted into a substrate by adsorbing or gripping the electronic component, regardless of the electronic component supplied by any electronic component supply device. In addition, the electronic component supply apparatus that supplies the lead-type electronic component nozzles the lead-type electronic component in the direction in which the main body is arranged on the upper side in the vertical direction of the lead, that is, in the direction in which the lead is arranged on the lower side in the vertical direction of the main body. To the holding position held by Here, the electronic component mounting apparatus 10 includes a component supply unit including a bowl feeder and other types of electronic component supply apparatuses, such as the radial feeder, the axial feeder, and the mountable electronic component tape, as in the present embodiment. It is preferable to dispose component supply units such as a feeder, a stick feeder, and a tray feeder on the front side and the rear side that are opposed to each other with the substrate transport unit 12 therebetween. As a result, it is possible to suppress the influence of vibration of the bowl feeder on other types of component supply units, so that the nozzle holding action for the electronic components supplied by the other types of electronic component supply devices at the holding position can be stabilized. Can be made.

  In the present embodiment, the component supply unit is described as two component supply units 14f and 14r, but the number is not limited. Further, the two component supply units 14f and 14r can be regarded as one component supply unit, and the component supply units 14f and 14r can be regarded as a first component supply unit and a second component supply unit, respectively. For example, it can be considered that one component supply unit includes a bowl feeder (component supply unit 14f) and a radial feeder (component supply unit 14r) as in the above embodiment. In this case, the first component supply unit and the second component supply unit are arranged at positions facing each other across the position where the substrate is arranged. Further, it can be considered that one component supply unit 14f includes a first component supply unit and a second component supply unit. For example, as described above, it can be considered that one component supply unit 14f includes a radial feeder (first component supply unit) and a chip component feeder (second component supply unit). Thus, the electronic component mounting apparatus 10 can be configured to include a plurality of types of electronic component supply apparatuses regardless of the combination.

  Here, there are various radial lead type electronic components that can hold a lead with a tape as an electronic component supplied by the electronic component supply device 90 that is a radial feeder. The electronic component supply device 90 can supply, for example, an aluminum electrolytic capacitor, an inductor, a ceramic capacitor, a film capacitor, and the like. In addition, as electronic components supplied by the electronic component supply devices 262, 264, and 266 that are bowl feeders, there are various lead-type electronic components of package components. The electronic component supply devices 262, 264, and 266 can supply, for example, solid state relays, DIP type electronic components, SIP type electronic components, connectors, transformers, and the like.

  Further, when the head 15 of this embodiment includes a plurality of nozzles so that more types of electronic components can be mounted by one head, the automatic nozzle changer (replacement in this embodiment) is performed. Each nozzle can be replaced with various suction nozzles and gripping nozzles during mounting production using a head holding operation realized by a combination of a nozzle holding mechanism and a head body. The electronic component mounting apparatus 10 is based on component conditions such as the size, weight, whether the upper surface of the component body has a suckable plane, and whether the component body can be gripped. A suction nozzle having an appropriate suction hole diameter or a gripping nozzle having a gripping member having an appropriate shape is designated for each part and stored in the production program. The electronic component mounting apparatus 10 switches the nozzle to be mounted on the head or determines the nozzle that holds the electronic component in the head based on the correspondence between the electronic component and the nozzle stored in the production program. .

  As a result, in the electronic component mounting apparatus 10, for example, when the electronic component held by the nozzle during board mounting is changed from the mounted electronic component to the lead electronic component, the nozzle and the lead electronic component that hold the mounted electronic component May be held by a nozzle different from the case where the nozzle is held by the same nozzle. When the nozzles are different, the electronic component mounting apparatus 10 automatically replaces the nozzles by the automatic nozzle replacement device when the electronic components to be mounted are changed during setup or during production. That is, when an electronic component to be mounted on a substrate during production is, for example, a mountable electronic component, a nozzle (suction nozzle or gripping nozzle) suitable for the electronic component is selected, and an electronic component supply apparatus that supplies the electronic component is selected. The nozzle is moved to the mounting type electronic component in the holding position to hold the electronic component and move to a predetermined position on the substrate, and the electronic component is continuously mounted while being controlled at the lowering speed. The electronic component mounting apparatus 10 determines whether the nozzles are the same or different when a predetermined number of electronic components have been mounted and the next electronic component to be mounted is changed to a lead-type electronic component. When it is determined that the nozzles are the same, the electronic component mounting apparatus 10 uses the same nozzle as the nozzle for the lead-type electronic component because it is not necessary to replace the nozzle. In addition, when it is determined that the nozzles are different, the electronic component mounting apparatus 10 uses the nozzle for the lead type electronic component as a nozzle for the lead type electronic component when there is a nozzle that can be used with the other nozzle mounted on the head. When there is no nozzle that can be used as a nozzle, the nozzle is automatically replaced with the lead type electronic component nozzle by the automatic nozzle changer. When the electronic component mounting apparatus 10 has prepared the nozzle for the lead type electronic component in this way, the head is moved to move the nozzle to the holding position of the lead type electronic component supply apparatus. The electronic component mounting apparatus 10 is a lead that is cut in advance to a predetermined length from an electronic component tape (electronic component holding tape) by a built-in cutting device (cut unit) by an electronic component supply device that supplies lead-type electronic components. A lead-type electronic component equipped with is set at a holding position. The electronic component mounting apparatus 10 holds and holds the lead-type electronic component by the nozzle, and moves to the substrate by determining the lead interval and determining the positional deviation by the detection means (laser recognition device 38). Switching control that sorts electronic parts to be inserted into the insertion hole (substrate hole) and corrects the positional deviation of the lead when inserting it into the insertion hole, and sequentially decelerates the descending speed when inserting it according to the cutting length of the lead While implementing.

  Further, when the head 15 includes a plurality of nozzles, it is sufficient that the head 15 includes at least one nozzle that can hold and mount a lead-type electronic component (insertion-type electronic component), and the configuration of the nozzles may be variously configured. Can do. For example, the head 15 may be a nozzle in which some of the nozzles hold lead-type electronic components and the remaining nozzles hold nozzles for mounting electronic components. In this case, the electronic component mounting apparatus performs mounting control for mounting the mounted electronic component on the board when the nozzle holds the mounted electronic component, and performs the mounting control for mounting the mounted electronic component on the substrate. Mounting control for inserting the electronic component into the insertion hole (substrate hole) is performed. Further, the head 15 may use all the nozzles as nozzles for holding lead-type electronic components. The electronic component mounting apparatus 10 holds and mounts an electronic component according to the type of electronic component when determining a suction nozzle (or a gripping nozzle for gripping) that attracts the electronic component to be mounted based on the production program. Determine the nozzle. In this way, the electronic component mounting apparatus 10 prepares a plurality of nozzles that can be mounted on a single head, operates the automatic nozzle changer during production according to a command based on the production program, and then selects the nozzle to be mounted on the head. By mounting / removing the nozzles in accordance with electronic components to be produced (electronic components to be mounted), the lead-type electronic components can be held and inserted into the substrate, and the mounted electronic components can be mounted on the substrate in sequence.

  The management system 100 targets an apparatus that mounts both an insertion-type electronic component and a mounting-type electronic component while exchanging nozzles used by one head according to the usage, such as the electronic component mounting apparatus 10. The electronic component mounting apparatus 10 can be used more efficiently by determining whether the electronic component mounting apparatus 10 can mount the target electronic component, particularly the insertion type electronic component, on the substrate.

  8 substrate, 10 electronic component mounting apparatus, 11 housing, 11a main body, 11bf, 11br cover, 11c opening, 12 substrate transport unit, 14, 14f, 14r component supply unit, 15 head, 16 XY moving mechanism, 17 VCS unit, 18 Replacement nozzle holding mechanism, 19 Component storage unit, 20 Control device, 22 X-axis drive unit, 24 Y-axis drive unit, 30 Head body, 31 Head support, 32 Nozzle, 34 Nozzle drive unit, 38 Laser recognition device, 40 Operation unit, 42 Display unit, 60 Control unit, 62 Head control unit, 64 Component supply control unit, 70 Electronic component holding tape, 72 Tape body, 80 Electronic component, 82 Body (electronic component body), 84 Lead, 92 Bowl feeder Assembly, 90, 90a, 262, 264, 266 Electronic component feeder, 96 supports 100, mounting device related information management system (management system), 102 network, 104 manufacturer terminal, 104a control unit, 104b storage unit, 104c operation unit, 104d display unit, 104e communication unit, 106 server, 108 shared server, 110A 110B, 110C agency terminal, 111A, 111B, 111C, 111D trade area, 112 affiliated company terminal, 120 user terminal, 130 gateway, 140 communication unit, 142 control unit, 142a automation rate calculation unit, 142b electronic component determination unit, 144 storage unit, 144a dealer database, 144b user database, 144c main body database, 144d feeder database, 144e nozzle database, 144f parts database, 210 housing, 212 Pump unit, 214 feed unit, 216 cut unit, 220 guide groove, 240 bowl feeder unit, 268 drive unit, 270 fixing part, 280, 280a, 280b, 280c bowl, 282, 282a, 282b, 282c rail, 422964a, 284b, 284c

Claims (10)

A component database having identification information of the insertion type electronic component and information on presence / absence of mounting of the electronic component mounting apparatus that holds the insertion type electronic component and inserts it into the board hole;
An information acquisition unit for acquiring information of a target insertion type electronic component to be determined;
A control unit that determines whether the target insertion type electronic component acquired by the information acquisition unit can be mounted on a substrate by an electronic component mounting apparatus;
The control unit compares the target insertion type electronic component with the identification information, identifies the insertion type electronic component in the component database corresponding to the target insertion type electronic component, and sets the target insertion type electronic component as the target insertion type electronic component. The electronic component determination apparatus according to claim 1, wherein when there is a mounting record, the target insertion type electronic component is determined to be mountable. The component database includes information on an insertion type electronic component similar to the insertion type electronic component,
The control unit has an insertion-type electronic component similar to the target insertion-type electronic component based on information on a similar insertion-type electronic component in the component database when the target insertion-type electronic component has no mounting record. The electronic component determination apparatus according to claim 1, wherein if there is the similar insertion type electronic component, the target insertion type electronic component is determined to be mountable. The component database includes at least one of the size and shape of the insertion-type electronic component main body, the number of lead wires, and the length,
The control unit determines whether there is an insertion-type electronic component similar to the target insertion-type electronic component based on an item in the component database when the target insertion-type electronic component does not have the mounting record, and is similar The electronic component determination apparatus according to claim 1, wherein when there is an insertion type electronic component, the target insertion type electronic component is determined to be mountable.   4. The electronic unit according to claim 2, wherein the control unit extracts a difference between the target insertion type electronic component and the similar insertion type electronic component, and outputs the extracted difference. Parts determination device. A feeder database having performance information of an electronic component supply device that supplies the insertion type electronic component;
The component database further includes information on the feeder capable of supplying the insertion type electronic component,
The said control part extracts the electronic component supply apparatus which can supply the said object insertion type | mold electronic component determined to be mountable based on the said component database and the said feeder database, The any one of Claim 1 to 4 characterized by the above-mentioned. The electronic component determination apparatus described.   When there is no similar insertion-type electronic component, the control unit obtains detailed information including at least one of the size and shape of the target insertion-type electronic component main body, the number of lead wires, and the length in the information acquisition unit. The electronic component determination apparatus according to claim 4, wherein a feeder capable of supplying the target insertion type electronic component is extracted based on the acquired performance information of the electronic component supply device in the feeder database. A nozzle database having performance information of nozzles for holding the insertion type electronic component;
The component database further includes information on the nozzle capable of holding the insertion type electronic component,
The said control part extracts the nozzle which can hold | maintain the said object insertion type | mold electronic component determined to be mountable based on the said component database and the said nozzle database, The any one of Claim 1 to 6 characterized by the above-mentioned. The electronic component determination apparatus described.   When there is no similar insertion-type electronic component, the control unit obtains detailed information including at least one of the size and shape of the target insertion-type electronic component main body, the number of lead wires, and the length in the information acquisition unit. The electronic component determination apparatus according to claim 7, wherein the electronic component determination device acquires and extracts a nozzle capable of holding the target insertion type electronic component based on performance information of the nozzle in the nozzle database. The electronic component determination apparatus according to any one of claims 1 to 8,
The electronic component determination device detects whether the target insertion type electronic component can be mounted, and calculates the ratio of the insertion type electronic component that can be mounted by the electronic component determination device out of the insertion type electronic components mounted on the substrate, An automation rate determination unit comprising: an automation rate determination device that determines an automation rate. A reading step of reading a component database having identification information of the insertion type electronic component and information on whether or not the electronic component mounting apparatus mounted with the insertion type electronic component is mounted;
An acquisition step of acquiring information on a target insertion type electronic component to be determined;
Determining whether the acquired target insertion type electronic component can be mounted on a board with an electronic component mounting apparatus; and
The determination step compares the target insertion type electronic component with the identification information, identifies the insertion type electronic component in the component database corresponding to the target insertion type electronic component, and sets the target insertion type electronic component as the target insertion type electronic component. The electronic component determination method according to claim 1, wherein when there is a mounting record, the target insertion type electronic component is determined to be mountable.

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