KR20130115153A - Electronic component determining apparatus, rate of automation determining unit and electronic component determining method - Google Patents

Abstract

PURPOSE: An electronic component determining device, an automation rate determining unit, and an electronic component determining method thereof are provided to effectively detect electronic components with high accuracy by using an electronic component mounting device. CONSTITUTION: A component database (DB) (144f) maintains the identification information of an electronic component and an insertion type electronic component and includes the information of a mounting state for an electronic component mounting device (10). An information acquisition unit acquires the information of the insertion type electronic component which is a determination target. A control unit (142) determines whether the insertion type electronic component corresponding to the information acquired by the information acquisition unit is mounted on a circuit board. The control unit compares the information of the insertion type electronic component with the identification information, determines the insertion type electronic component of the component DB, and determines the mounting state of the insertion type electronic component. [Reference numerals] (104) Manufacturer terminal; (104a) Control unit; (104b) Memory unit; (104c) Manipulation unit; (104d) Display unit; (104e) Communication unit; (106) Server; (108) Shared server; (110A,110B,110C) Agency terminal; (112) Relevant company terminal; (120) User terminal

Description

ELECTRONIC COMPONENT DETERMINING APPARATUS, RATE OF AUTOMATION DETERMINING UNIT AND ELECTRONIC COMPONENT DETERMINING METHOD}

TECHNICAL FIELD The present invention relates to an electronic component determination apparatus, an automation factor determination unit, and an electronic component determination method for determining an electronic component used in an electronic component mounting apparatus.

The electronic component mounting apparatus which mounts an electronic component on a board | substrate has a head provided with a nozzle, and mounts on a board | substrate holding an electronic component with the said nozzle. The electronic component mounting apparatus adsorbs the components in the electronic component supply apparatus by moving the nozzle of the head in the direction orthogonal to the surface of the substrate, and then moves the head relatively in the direction parallel to the surface of the substrate, thereby adsorbing. Upon arriving at the mounting position of the component, the nozzle of the head is moved in a direction orthogonal to the surface of the substrate to approach the substrate, whereby the adsorbed electronic component is mounted on the substrate.

Here, as electronic components to be mounted on a substrate, besides the mounted electronic components to be mounted on the substrate, there is an insertion type electronic component that includes a main body and leads connected to the main body and is mounted by inserting a lead into an insertion hole. In this case, an insertion type electronic component is mounted by inserting a lead into the hole formed in the board | substrate. In addition, in this case, the electronic component mounted on a board | substrate, for example, SOP, QFP, etc., not inserted into an insertion hole (substrate hole) is set as a mounting type electronic component. As an electronic component mounting apparatus which mounts an insertion type electronic component on a board | substrate, the apparatus described in patent document 1 and 2 is mentioned, for example. Patent Literature 1 describes an electronic component mounter including a mounting type electronic component that is sucked by an adsorption head and a component mounter that mounts both of the insertion type electronic components that are clamped by the insertion head and inserted into the substrate and then clinched. have. Patent Literature 2 describes an electronic component mounting apparatus in which a mounting head for mounting a mounted electronic component and an insertion head for mounting an insertable electronic component are integrally formed. By using the apparatus of patent documents 1 and 2, an insertion type electronic component can be mounted in a board | substrate.

Japanese Patent Laid-Open No. H05-335782 Japanese Patent Laid-Open No. H09-83121

The apparatuses described in Patent Documents 1 and 2 hold the main body and the lead of the insertable electronic component, and the holding member is configured to insert the gripped inserted electronic component into the substrate hole. In addition to the above, as a method of holding the insert-type electronic component as the holding member, it is also conceivable to hold only the component body as the suction nozzle or the gripping nozzle and insert the free lead into the substrate.

However, in the electronic component to be inserted into the substrate, there is a possibility that an embedded electronic component having various body shapes and sizes, the number and length of leads is mounted. In addition, the kind and number of insertion-type electronic components to be mounted depend on the board | substrate to manufacture. Therefore, when mounting a new insert-type electronic component on a substrate by the electronic component mounting apparatus, can the insert-type electronic component be reliably held, or can a plurality of leads be aligned and inserted into a plurality of substrate holes, If it is not considered in advance whether there is an advantage in terms of the cost of preparing the holding member, it becomes a problem because the board cannot be produced using the electronic component mounting apparatus.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an electronic part determination device, an automation rate determination unit, and an electronic part determination method capable of detecting with high efficiency and high accuracy whether an electronic part that can be mounted on a substrate by an electronic part mounting apparatus are provided. It aims to provide.

The present invention relates to an electronic part determination device comprising: a parts database having identification information of an insertable electronic part, information on whether or not the electronic component mounting apparatus holds the inserted electronic part and inserts it into a substrate hole; An information acquiring unit for acquiring information of the insertable electronic component, and a control unit for determining whether the target inserting electronic component corresponding to the information of the target inserting electronic component acquired by the information acquiring unit can be mounted on a substrate by the electronic component mounting apparatus, The control unit compares the information of the target insertion-type electronic component with the identification information, specifies the insertion-type electronic component of the parts database corresponding to the information of the target insertion-type electronic component, and has a record of mounting on the target insertion-type electronic component. In this case, the corresponding insertable electronic component is determined as mountable. And that is characterized.

In addition, the parts database includes information of an insertable electronic component similar to an insertable electronic component, and the control unit is based on the information of a similar insertable electronic component of the component database when the target insertable electronic component does not have the loading history. Thus, it is preferable to determine whether there is an insertable electronic component similar to the target insertable electronic component, and if there is a similar insertable electronic component, it is determined that the target insertable electronic component is mountable.

The component database may include at least one of a size and a shape of a corresponding insertable electronic component main body, a number and length of lead wires, and the control unit may be configured to include the case where the target insertion type electronic component does not have the mounting history. It is preferable to determine whether there is an insertable electronic component similar to the target embedded electronic component on the basis of the item in the parts database, and if the similar embedded electronic component is present, it is determined that the target inserted electronic component is mountable.

The control unit may extract a difference between the target insertion type electronic component and the similar insertion type electronic component and output the extracted difference point.

The apparatus further includes a feeder database having performance information of the electronic component supplying device for supplying the insertable electronic component, wherein the parts database further includes information of a feeder capable of supplying the insertable electronic component. It is preferable to extract the electronic component supply apparatus which can supply the said target insertion type electronic component judged as mountable based on the said component database and the said feeder database.

The control unit may further include at least one of a size and a shape of the main body of the target insertion type electronic component, the number and length of lead wires in the information acquisition unit, when there is no insertion type electronic component similar to the target insertion type electronic component. It is preferable to extract the feeder capable of supplying the target insertion-type electronic component based on the performance information of the electronic component supply apparatus of the feeder database.

The apparatus further includes a nozzle database having performance information of a nozzle holding the insertable electronic component, wherein the parts database further includes information of the nozzle capable of holding the insertable electronic component, and the control unit includes the component database. And a nozzle capable of holding the target insertion-type electronic component determined to be mountable based on the nozzle database.

The control unit may further include at least one of a size and a shape of the main body of the target insertion type electronic component, the number and length of lead wires in the information acquisition unit, when there is no insertion type electronic component similar to the target insertion type electronic component. It is preferable to extract the nozzle capable of holding the target insertion-type electronic component on the basis of acquiring the data, and based on the performance information of the nozzle in the nozzle database.

The present invention provides, as an automation rate determination unit, an electronic part determination device according to any one of the above and an insertion type electronic part to be mounted on the board by detecting by the electronic part determination device whether the target insertion type electronic part can be mounted. An automation rate determination device for calculating the ratio of the embedded electronic component that can be mounted by the electronic part determination device and determining the automation rate is provided.

The present invention relates to a method for determining an electronic component, comprising: a reading step of reading a parts database having identification information of an insertable electronic component and information on whether or not the electronic component mounting apparatus is mounted with the inserted electronic component, and a target to be determined; An acquiring step of acquiring information of the insertable electronic component, and a determining step of determining whether a target insertable electronic component corresponding to the acquired information of the target insertable electronic component can be mounted on a substrate by the electronic component mounting apparatus, and the determination The step may be performed by comparing the information of the target insertion-type electronic component with the identification information, specifying the insertion-type electronic component of the parts database corresponding to the information of the target insertion-type electronic component, and when the target insertion-type electronic component has a record of mounting. In particular, it is determined that the corresponding insertable electronic component is mountable. It shall be.

The present invention exhibits the effect of being able to detect efficiently and with high accuracy whether an inserted electronic component to be a target is an electronic component that can be mounted on a substrate by an electronic component mounting apparatus.

1 is a schematic diagram showing a schematic configuration of a mounting apparatus related information management system.
2 is a schematic diagram showing a schematic configuration of a shared server.
3 is a schematic diagram illustrating an example of a data configuration of a feeder database.
4 is a schematic diagram illustrating an example of a data configuration of a nozzle database.
5 is a schematic diagram illustrating an example of a data configuration of a parts database.
6 is a flowchart illustrating an example of a processing operation executed by a shared server.
7 is a flowchart illustrating an example of a processing operation performed by a shared server.
8 is a flowchart illustrating an example of a processing operation performed by a shared server.
9 is a flowchart illustrating an example of a processing operation executed by a shared server.
10 is a flowchart illustrating an example of a processing operation performed by a shared server.
It is a schematic diagram which shows schematic structure of the factory provided with a production line.
12 is a schematic diagram illustrating a schematic configuration of an electronic component mounting apparatus.
13 is a perspective view showing a schematic configuration of a housing of an electronic component mounting apparatus.
14 is a schematic diagram illustrating a schematic configuration of an electronic component mounting apparatus.
FIG. 15: is a schematic diagram which shows schematic structure of the other example of the component supply unit of a rear side.
16 is a schematic diagram illustrating a schematic configuration of a head of an electronic component mounting apparatus.
17 is a schematic diagram illustrating a schematic configuration of a head of an electronic component mounting apparatus.
18 is an explanatory diagram showing an example of a nozzle.
19 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape.
20 is a perspective view showing a schematic configuration of an electronic component supply device of a component supply unit on the rear side.
21 is a perspective view showing a schematic configuration of the bowl feeder assembly.
22 is a side view illustrating another example of the component supply unit.
23 is a top view illustrating another example of the component supply unit.
24 is a flowchart showing an example of the operation of the electronic component mounting apparatus.
25 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus.
26 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus.
27 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail, referring drawings. For reference, the present invention is not limited to the embodiment for carrying out the following invention (hereinafter, referred to as "embodiment"). In addition, the component in the following embodiment includes what is easily conceivable by a person skilled in the art, what is substantially the same, what is called a range of equality. In addition, the component disclosed in the following embodiment can be combined suitably.

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of the electronic component determination apparatus, automation ratio determination unit, and electronic component determination method which concern on this invention is demonstrated in detail based on drawing, this invention is not limited by such embodiment. For reference, in the following embodiment, the case where the mounting apparatus related information management system has an electronic component determination apparatus and an automation ratio determination unit is demonstrated.

1 is a schematic diagram showing a schematic configuration of a mounting apparatus related information management system. The mounting apparatus related information management system (henceforth simply a "management system") 100 is a system which manages the information regarding an electronic component mounting apparatus. Specifically, the management system 100 includes a manufacturing company which is a manufacturer of an electronic component mounting apparatus, a distributor and a related company that sells and repairs electronic component mounting apparatus in various places by consignment from a manufacturing company or the like, and an electronic component. It is a system for managing information related to an electronic component mounting apparatus among users who produce a substrate using the mounting apparatus.

The management system 100 includes a manufacturer's terminal 104, a server 106, a shared server 108, an agency terminal 110A, 110B, 110C, an affiliated company terminal 112, and a user terminal ( 120 and a gateway 130. For reference, the manufacturer terminal 104, the server 106, the sharing server 108, the agency terminals 110A, 110B, 110C, the affiliated company terminal 112, and the plurality of user terminals 120. The number of gateways 130 is not limited to this embodiment.

The manufacturer terminal 104 of the management system 100, the server 106, the shared server 108, the agency terminals 110A, 110B, 110C, and the affiliated company terminal 112 are the networks 102. Through wired and wireless connection. The network 102 is a communication line network such as a public line network, and transmits and receives data between connected communication devices.

The manufacturing company terminal 104 is arrange | positioned at a manufacturing company. The manufacturer's terminal 104 is an arithmetic device such as a personal computer, and has a control unit 104a which performs arithmetic processing with a CPU or the like, and stores a control program or data with a recording device such as a ROM or a RAM. A display section 104d having a storage section 104b, a keyboard, a mouse, etc., an operation section 104c to which an operation is input by a user, a liquid crystal display, etc., for displaying an operation screen or a calculation result, and a gateway 130; It is connected to the network 102 via the network, and has a communication unit 104e for transmitting and receiving data.

The server 106 is a device owned by the manufacturer, and stores various kinds of information about the electronic component mounting apparatus. The server 106 is connected to the manufacturer's terminal 104. For reference, the server 106 is not directly connected to the network 102. The server 106 is set so that access is not possible from the network 102 side than the gateway 130. That is, the server 106 can read the stored data in the manufacturer's terminal 104, but cannot read in the agency's terminals 110A, 110B, 110C and the affiliated company's terminal 112.

The shared server 108 is connected to the network 102 via the gateway 130. The shared server 108 is a device which stores the information supplied from each part of the management system 100, analyzes the inputted information, and outputs the analysis result. The configuration of the shared server 108 will be described later.

The distributor terminals 110A, 110B, and 110C are computing devices such as personal computers arranged at respective distributors in various places, and have respective parts as in the manufacturer terminal 104. The agency terminals 110A, 110B, and 110C are connected to the network 102 and can communicate with the shared server 108. The agency terminals 110A, 110B, and 110C transmit and receive information to and from the shared server 108.

The affiliated company terminal 112 is an arithmetic device such as a personal computer arranged in the affiliated company, and has respective parts as in the manufacturer's terminal 104. The affiliated company terminal 112 is connected to the network 102 and can communicate with the shared server 108. The affiliated company terminal 112 transmits and receives information to and from the shared server 108.

In the management system 100, a plurality of user terminals 120 are disposed for each of the agency terminals 110A, 110B, 110C and the affiliated company terminal 112. Here, the user terminal 120 included in the dealership 111A of the agency that owns the agency terminal 110A transmits and receives data with the agency terminal 110A. The user terminal 120 included in the dealership 111B of the agency that owns the agency terminal 110B transmits and receives data to and from the agency terminal 110B. The user terminal 120 included in the dealership 111C of the agency that owns the agency terminal 110C transmits and receives data with the agency terminal 110C. The user terminal 120 included in the commercial rights 111D of the affiliated company owning the affiliated company terminal 112 transmits and receives data with the associated company terminal 112. For reference, the number of employees belonging to an agency and a related company is in the commercial rights 111A to 111D of the company, respectively, and the electronic component mounting apparatus is sold or sold to the owner of the user terminal 120. Repair the mounting device. Therefore, the owner of the user terminal 120 is equipped with the electronic component mounting apparatus in a factory or a facility. The user terminal 120 controls the operation of the electronic component mounting apparatus or collects operation information.

The user terminal 120 transmits and receives data by sending and receiving data to and from the dealership terminals 110A to 110C and the related company terminal 112 in the commercial area included. As a method of exchanging data between the user terminal 120, the agency terminals 110A to 110C, and the related company terminal 112, various methods can be used. The user terminal 120 is connected to the network 102, connects to the agency terminals 110A to 110C and the affiliated company terminal 112 via the network 102, and gives data via the network 102. You may accept it. The user terminal 120 may communicate with the shared server 108 when connected to the network 102. In addition, the user terminal 120 may be connected to the agency terminals 110A to 110C and the affiliated company terminal 112 by a dedicated communication line, and may exchange data via a dedicated communication line. In addition, the user terminal 120 may exchange data with the agency terminals 110A to 110C and the related company terminal 112 via a recording medium without using a communication line.

The gateway 130 is arranged in the communication line which connects the network 102 and the manufacturer terminal 104. The other gateway 130 is disposed in the communication line connecting the network 102 and the shared server 108. The gateway 130 is a device for connecting the communication. The gateway 130 monitors the communication between the network 102 and the manufacturer's terminal 104 and the communication between the network 102 and the sharing server 108 and blocks communication as necessary. . Specifically, the gateway 130 analyzes the data passing through the communication line and suppresses unauthorized access to the manufacturer's terminal 104 or the shared server 108. For reference, although not illustrated in FIG. 1, the agency terminals 110A, 110B, 110C, the affiliated company terminal 112, and the user terminal 120 connected to the network 102 of the management system 100 are manufactured by the manufacturer. Like the terminal 104 and the shared server 108 is connected via a gateway 130.

The management system 100 is comprised as mentioned above. The management system 100 supplies various types of information to the shared server 108 from each terminal. As a result, the sharing server 108 can aggregate various types of information related to the electronic component mounting apparatus. For example, the manufacturer supplies information of the main body of the electronic component mounting apparatus stored in the server 106 from the manufacturer terminal 104, the information of the manufactured feeder, the information of the measured electronic component, and the like. The agency and associated company supplies the shared server 108 with information acquired from the user terminal 120 in its commercial rights 111A to 111D. The management system 100 may supply the information to the sharing server 108 via the user terminal 120 directly through the network 102. In addition, the management system 100 can process the information stored in the shared server 108 as needed, and can supply it to each terminal. This point will be described later.

By providing the shared server 108, the management system 100 can share the necessary information, with the manufacturing company holding the confidential information on the server 106. Similarly, agents, affiliated companies, and users can share only the information that can be supplied to the shared server 108, and the confidential information can be stored separately. As a result, security of confidential information can be maintained. In addition, the management system 100 should just be a network structure (refer FIG. 1) similar to this embodiment, and the installation place of the supply server 108 is not specifically limited. That is, the shared server 108 should just be connected to the network 102 independently through the gateway 130, and may be provided in the site of a manufacturing company, an agency, a related company, or inside a building. Regardless of the installation location, the supply server 108 can maintain the security of confidential information if the network configuration is the same as in the present embodiment.

Next, the shared server 108 will be described with reference to FIG. 2. 2 is a schematic diagram showing a schematic configuration of a shared server. As shown in FIG. 2, the shared server 108 includes a communication unit 140, a control unit 142, and a storage unit 144. The communication unit 140 is connected to the network 102 via the gateway 130, and transmits and receives data with other communication devices via the network 102.

The control unit 142 performs various operations to control the processing of the data exchanged. The control part 142 has the automation rate calculation part 142a and the electronic component determination part 142b. The automation factor calculation unit 142a calculates the proportion of electronic components that can be mounted by the electronic component mounting apparatus among the objects to be mounted on the substrate. The electronic component determination unit 142b determines whether the electronic component, mainly the insertable electronic component, is an electronic component that can be mounted on a substrate by the electronic component mounting apparatus. In addition, the control unit 142 also performs control such as a process of storing the data received via the network in the storage unit 144, a deletion process of the data stored in the storage unit 144, and the like.

The storage unit 144 includes a store database 144a, a user database 144b, a main body database 144c, a feeder database 144d, a nozzle database 144e, and a parts database 144f.

The retailer database 144a has information of a dealership and a related company corresponding to the agency terminals 110A, 110B and 110C and the related company terminal 112. Specifically, it has information on the location of the dealership, the company concerned, the personnel composition, the information of the user who sold the electronic component mounting device, the company and the facility that may be purchased. In addition, the retailer database 144a also stores information on the processes that can be executed for the electronic component mounting apparatus in each of the dealership and the related company. Specifically, the level of adaptation and repair, the level of production program creation, and the possibility of assembling the electronic component mounting apparatus can be performed.

The user database 144b has information related to a user who uses the electronic component mounting apparatus, that is, a company that purchased the electronic component mounting apparatus. Specifically, the user's position information, the number of electronic component mounting devices purchased, the model number, the number of operating electronic component mounting devices, the model number, the information of the purchased electronic component supply device (feeder), and the electronic component to the board. Information on the machine used before and after mounting, failure information on the electronic component mounting device in operation, and the like.

The main body database 144c is information of the main body of the electronic component mounting apparatus, that is, parts other than the replaceable feeder and the nozzle. Specifically, it contains information on the performance and device configuration of the electronic component mounting apparatus of each model handled by the manufacturer.

3 is a schematic diagram illustrating an example of a data configuration of a feeder database. The feeder database 144d has various information of the electronic component supply apparatus attached to the electronic component mounting apparatus. Here, the electronic component supply apparatus (feeder) is a device which supplies a predetermined position, specifically, to the position where the nozzle of the head which conveys an electronic component can adsorb | suck an electronic component. The feeder database 144d stores various information of the electronic component supply apparatus used by the user, which is managed by the management system 100, and the electronic component supply apparatus developed and sold by the manufacturer. The feeder database 144d is, for example, as shown in Fig. 3, the model number of the electronic component supply device, the type (any of a radial feeder, bowl feeder, tray feeder, axial feeder, etc.), The main body width (maximum width of the main body of the supplyable electronic component), the lead wire length (the maximum length of the lead wire at the supply position), and the like. The feeder database 144d also stores information as to whether or not it can be mounted on each model of the electronic component mounting apparatus as shown in FIG. For reference, the number of items stored in the feeder database 144d and the number of feeders is not limited to FIG. 3.

4 is a schematic diagram illustrating an example of a data configuration of a nozzle database. The nozzle database 144e has various types of nozzles used in the electronic component mounting apparatus. Here, the nozzle holds the electronic component supplied to the suction position by the feeder, and when the nozzle is conveyed to the mounting position of the substrate by the head on which the nozzle is mounted, the nozzle is released and mounted on the substrate. The nozzle database 144e stores various types of nozzles used by a user, which is managed by the management system 100, and nozzles developed and sold by a manufacturer. The nozzle database 144e includes, for example, the model number of the nozzle, the type (either the suction nozzle or the gripping nozzle), the main body width (the maximum width of the main body that can be held), and the like, as shown in FIG. 4. The nozzle database 144e also stores information as to whether or not it can be mounted on each model of the electronic component mounting apparatus as shown in FIG. The nozzle database 144e may further store information on the limitation of the shape of the maintainable electronic component, weight information, and the like. For reference, the number of items and nozzles stored in the nozzle database 144e is not limited to FIG. 4.

5 is a schematic diagram illustrating an example of a data configuration of a parts database. The parts database 144f stores information on electronic parts that are mounted by the electronic part mounting apparatus, electronic parts that cannot be mounted, and electronic parts that may be mounted (for example, information on the presence or absence of mounting performance and insertion-type electronic parts). Information on whether or not the electronic component mounting apparatus is held and inserted into the substrate hole. In other words, the component database 144f has information on various electronic components that may be mounted on a substrate. For example, as shown in FIG. 5, the parts database 144f stores a product type, a model number, a manufacturer, a body width, a length of lead wires, the number of lead wires, and the like. In addition, the parts database 144f also stores information as to whether or not it can be supplied by each model of the electronic component mounting apparatus as shown in FIG. For reference, the number of items and parts stored in the parts database 144f is not limited to FIG. 5. The parts database 144f also stores information on whether or not each electronic component can be supplied by each nozzle. Also, the parts database 144f stores identification information of electronic parts corresponding to items of similar electronic parts, for example, model numbers, and the like for electronic parts similar to electronic parts and electronic parts that can be regarded as almost identical.

For reference, various kinds of information stored in the storage unit 144 can be updated at any time. As a result, information of the store, the user, the main body of the electronic component mounting apparatus, the feeder, and the electronic component can be accumulated in a comprehensive manner, and newer information can be stored. In addition, the storage unit 144 stores data for specifying the hierarchy of accessible information, that is, each terminal or user, agency, affiliated company, based on the information, login name, password, etc. of the terminal accessible to the shared server 108. You may store the access authority for every manufacturer and the data of an access restriction. The shared server 108 is configured as described above.

Hereinafter, an example of the process performed by a shared server is demonstrated using FIGS. 6-10. 6-10 is a flowchart which shows an example of the process operation | movement performed by a shared server, respectively. For reference, the management system of the present embodiment is assumed to execute processing in the shared server, but may acquire necessary information from the shared server and execute the processing operation in each terminal.

First, the process performed by the electronic component determination part 142b of the control part 142 is demonstrated using FIG. For reference, the input or output of the process shown in FIG. 6 is any one of each terminal (manufacturer terminal 104, agency terminal 110A, 110B, 110C, affiliated company terminal 112, user terminal 120). You can also run This point also applies to the following processes.

If the control part 142 detects input of the part number (model number) of an electronic component as step S12, it determines whether there is a loading record as step S14. Specifically, the control unit 142 reads the parts database 144f and compares the model number detected in step S12 with the model numbers of the electronic parts in the parts database 144f to determine whether there is a matching electronic part. . If there is an electronic component that matches the parts database 144f, the control unit 142 determines whether the item has a loading record. The control unit 142 determines that there is a loading record in the case where there is an electronic component supply apparatus that can mount the electronic component. For reference, an item relating to the presence or absence of a loading result may be provided in the parts database 144f.

When it is determined in step S14 that the mounting part is yes (Yes), the control unit 142 extracts information of the corresponding electronic component supply apparatus and the nozzle as step S16, and extracts the extracted electronic component supply apparatus and the nozzle as step S18. After this information is outputted, this process ends. The control part 142 can acquire the information of the electronic component supply apparatus and nozzle which can respond to the said electronic component from the item of the electronic component of the components database 144f.

When the control unit 142 determines that there is no mounting record (No) in step S14, the control unit 142 outputs that there is no mounting record in step S20. That is, the input electronic component is notified of the electronic component which has never been mounted by the electronic component mounting apparatus or the electronic component which has abandoned the mounting.

When the output is performed in step S20, the control unit 142 determines whether there is a request for individual determination in step S22. Here, the individual judgment is a more detailed judgment in which information other than the model number is added. If the control unit 142 determines in step S22 that there is no request for individual determination (No), the control unit 142 ends this process.

When it is determined in step S22 that the individual determination is requested (Yes), the control unit 142 displays the detailed condition input screen of the electronic component as step S24. Here, detailed conditions are the shape, size, number of lead wires, length, etc. of an electronic component. The control unit 142 transmits the data of the input screen to the corresponding terminal. The control unit 142 determines whether the input is terminated at step S26, that is, whether there is information input to each item of the input screen, for example, whether the input result is output from the terminal. If it is determined in step S26 that the input is not finished (No), the control unit 142 proceeds to step S26. If it is determined in step S26 that the input is completed (Yes), the control unit 142 executes individual determination processing based on the detailed conditions of the electronic component in step S28, and ends this processing.

Next, individual determination processing will be described with reference to FIG. 7. In step S30, the control unit 142 determines whether there is a similar component having a loading record, that is, whether there is an electronic component similar to the target electronic component, and whether the similar electronic component has a loading record.

8, the determination process of step S30 is demonstrated. The control unit 142 reads the parts database in step S50, and determines whether there is an electronic part similar to the target part in step S52. That is, the control unit 142 determines whether a part having a content similar to the target part is registered in the parts database as a part having a history of being inserted into the board by the electronic parts mounting apparatus. It is determined whether the items enumerating the electronic parts in the parts database include information on electronic parts having similar shapes and sizes, the number, arrangement, and length of the target electronic parts and the main body of the parts. The control part 142 can make a determination by extracting the information of the item which registers similar electronic parts of a parts database. For reference, in this embodiment, the process of step S52 is performed for the electronic component which has the experience of mounting. If it is determined in step S52 that the target part is present (Yes), the control unit 142 proceeds to step S58.

If it is determined in step S52 that there is no target component (No), the control unit 142 determines whether there is an electronic component whose shape difference is within an allowable range as step S54. That is, it is determined whether there is an electronic component which can be regarded as the same electronic component in the shape difference with the target electronic component within the allowable range, that is, in the mounting operation. The control unit 142 proceeds to step S59 when it is determined in step S54 that there are no electronic components within the allowable range (No).

When it is determined in step S54 that there are electronic components within the allowable range (Yes), the control unit 142 determines whether the extracted electronic component has a loading history in step S56. The control unit 142 proceeds to step S58 when it is determined that there is a loading record (Yes), and proceeds to step S59 when it is determined that there is no loading record (No). For reference, as described above, the object to be extracted in step S54 may only be an electronic component having a loading experience, and the processing of step S56 may be omitted.

When it determines with Yes in step S52 and step S56, the control part 142 detects this electronic component as a similar electronic component in step S58, and complete | finishes this process. When it determines with No in step S54 and step S56, the control part 142 determines that there is no similar electronic component in step S59, and complete | finishes this process.

Referring to Fig. 7 again, the description of the individual determination processing is continued. When it is determined in step S30 that there are similar parts (Yes), the control unit 142 extracts the information of the electronic component supply apparatus and the nozzles corresponding to the similar parts in step S32, and extracts the extracted electronic parts in step S34. The information of the supply device and the nozzle is output, and in step S36, the difference information with the similar parts is output, and then the present process ends. Thereby, the control part 142 can provide the information of the electronic component supply apparatus and nozzle which are likely to be usable for mounting the corresponding electronic component. In addition, by outputting the difference information between the electronic component and the similar electronic component, the adjustment necessary at the time of mounting can also be performed.

In addition, in the case where it is determined in step S30 that there are no similar parts (No), the control unit 142 outputs the effect of the absence of similar electronic parts in step S38. That is, it is notified that there is no electronic component similar to the input electronic component and that has a mounting record.

If the output is performed in step S38, the control unit 142 determines, as step S40, whether the shape is within a range that can be handled. Specifically, it is determined whether there is an electronic component supply device whose input shape falls within the allowable range, and whether there is a nozzle. For reference, in this case, it is preferable to make the determination based on the information including the range which can be handled by the design change. If it is determined in step S40 that the control unit 142 is out of the allowable range (No), the control unit 142 outputs a message indicating that it cannot be responded as step S42, and terminates the present process. In the shape of the corresponding electronic component, a notification indicating that the correspondence is not possible even if the current electronic component mounting apparatus is modified is output.

If it is determined in step S40 that the controller 142 is in the range that can be handled, the control unit 142 displays the detailed condition input screen of the electronic component as step S44. Here, the detailed conditions of step S44 are more detailed conditions than the detailed conditions of step S24 described above. The control unit 142 displays the detailed condition input screen of the electronic component in step S44, and if an input is detected, executes individual determination processing based on the detailed condition of the electronic component in step S46, and terminates this process. .

Next, the individual determination process performed in step S46 is demonstrated using FIG. In step S60, the control unit 142 extracts an electronic component supply apparatus and a nozzle that may be corresponding to each other based on the detailed information of the electronic component. Here, the control unit 142 performs the extraction process based on various information of the database including the allowable range of the electronic component supply device and the nozzle.

If the extraction is performed in step S60, the control unit 142 displays the extraction result in step S62. Here, the screen of the extraction result is a screen which can input the operation | movement which selects the electronic component supply apparatus and nozzle which are objects to which a determination process is performed.

If the extraction result is displayed in step S62, the control part 142 determines whether there exists a selection of an electronic component supply apparatus and a nozzle as step S64. If the control part 142 determines in step S64 that there is no selection (No), it will progress to step S72. If it is determined in step 64 that the selection is Yes (Yes), the control unit 142 determines whether there is a design change instruction for the electronic component supply device and the nozzle as step S66. Here, the design change instruction may be made only by the manufacturer's terminal 104. The design change instruction may be selected only when the manufacturer terminal 104 permits the design change. Thereby, the process can be advanced by the design of the electronic component supply apparatus and nozzle which can be actually mounted.

The control unit 142 proceeds to step S72 when it is determined in step S66 that there is no instruction (No). When it determines with yes (Yes) in step S66, the control part 142 calculates preparation cost of an electronic component supply apparatus and a nozzle at the time of design change as step S68. Although the control part 142 calculated the cost in this embodiment, you may detect the preparation cost input by the manufacturer terminal. When the cost is calculated in step S68, the control unit 142 displays the calculated creation cost as step S70 and proceeds to step S72.

When it determines with No in step S64 and S66, or when the process of step S70 is performed, the control part 142 determines whether it is the process end as step S72. If it is determined in step S72 that the processing is not finished (No), the control unit 142 proceeds to step S64. The control unit 142 ends the present process when it is determined in step S72 that the process is completed (Yes).

The management system 100 can determine whether the target electronic component can be mounted by performing the above process by using each part including the electronic component determination unit 142b as the electronic component determination apparatus. In addition, by performing the processing of Figs. 7 and 8, determination of similar electronic parts can also be automatically performed. In addition, by performing the process shown in FIG. 7, the effect can be output to the electronic component which cannot be respond | corresponded in the apparatus structure. Moreover, by performing the process shown in FIG. 9, the production cost at the time of special order or design change of at least one of an electronic component supply apparatus or a nozzle can also be determined.

Accordingly, the management system 100 can easily determine whether the desired electronic component can be mounted by the electronic component mounting apparatus when mounting various kinds of electronic components, particularly insert-type electronic components on the substrate by the electronic component mounting apparatus. have.

Next, an example of the process performed by the automation rate calculation part 142a is demonstrated using FIG. For reference, the processing shown in FIG. 10 can be efficiently judged by performing the processing using the above-described determination result of the electronic component determination unit 142b.

In step S80, the control unit 142 acquires the schematic data of the substrate, extracts information of the electronic component to be mounted from the schematic diagram in step S82, and further extracts the lead-type electronic component (step S84) from the extracted electronic component. Insertion type electronic component) is extracted. For reference, since the mountable electronic component can be mounted by the electronic component mounting apparatus, it may be determined that the mountable electronic component can be mounted.

If the lead-type electronic component is extracted in step S84, the control unit 142 determines whether the lead-type electronic component to be mounted is mountable in step S86. Here, the control part 142 can perform the process of step S86 by performing the above-mentioned electronic component determination process with respect to the lead-type electronic component of interest. The control unit 142 determines whether the target lead-type electronic component can be mounted. Here, although the control part 142 may add up to the design change of an electronic component mounting apparatus and a nozzle like said embodiment, it does not need to add it. In addition, it is also possible to adjust whether or not it is determined that mounting is possible when there are similar electronic components by setting.

If it is determined in step S86 whether it is mountable, the control part 142 determines in step S88 whether the determination of all the lead-type electronic components is complete. If it is determined in step S88 that the determination of the lead type electronic component is not finished (No), the control unit 142 proceeds to step S86 to execute the processing of step S86 for the lead type electronic component that has not been determined.

When it is determined in step S88 that the determination of all the lead-type electronic components is completed (Yes), the control unit 142 calculates the proportion of the electronic components that can be mounted by the mounting apparatus in step S90. For example, the number may be calculated as (the number of electronic components determined to be mountable) / (the number of electronic components to be mounted on the substrate).

Next, the control unit 142 executes a production process simulation when the mounting apparatus is used as the step S92, that is, when the mounting apparatus is used for mounting the lead-type electronic component, and the step S94 does not use the mounting apparatus. In this case, that is, a production process simulation when the mounting apparatus is not used to mount the lead-type electronic component is executed. In this case, as the simulation, simulations may be performed on costs, time required for production (tact), production efficiency, yield, and the like. When the mounting apparatus is not used, the analysis may be performed assuming a case where an operator of standard capability mounts the electronic component manually at the factory.

If the control part 142 performed simulation in step S94, it outputs a calculation result and a simulation result as step S96, and complete | finishes this process.

As shown in FIG. 10, the management system 100 detects a lead-type electronic component that can be mounted by the electronic component mounting apparatus from the design diagram of the substrate, and outputs the detection result, thereby providing the electronic component mounting apparatus of the present embodiment. By using it, it is possible to recognize that the mountable electronic component increases. For reference, the comparison of the simulation results and the calculation of the ratio of the mountable electronic components may be performed by only one of them. In addition, when calculating the ratio of the mountable electronic component, when mounting a lead type electronic component manually, you may calculate the ratio of the electronic component mountable by an electronic component mounting apparatus for a comparison.

In addition, the management system 100 may actually test and produce, so that when the electronic component can be mounted at a certain ratio or more, for example, 70% or more, it may be able to be mounted in a database. In addition, when the probability that the management system 100 can be mounted is changed by the combination of the nozzle and the feeder, the management system 100 preferably stores the combination data as a reference for the determination.

It is a schematic diagram which shows schematic structure of the factory provided with a production line. In the factory 170, a production line including an electronic component mounting apparatus that is a management target of the user terminal 120 is disposed. The factory 170 includes a user terminal 120, a management apparatus 172, a plurality of electronic component mounting apparatus 174, a plurality of electronic component mounting apparatus 10, a pattern forming apparatus 176, It has the reflow processing apparatus 178. The factory 170 includes a plurality of electronic component mounting apparatuses 174, a plurality of electronic component mounting apparatuses 10, a pattern forming apparatus 176, and a reflow processing apparatus 178 in one production line. The plurality of electronic component mounting apparatuses 174 and the pattern forming apparatus 176 and the reflow processing apparatus 178 are arrange | positioned so that the both ends of the several electronic component mounting apparatus 10 may be interposed between them. have.

The management apparatus 172 is a control apparatus which manages the operation | movement of the electronic component mounting apparatus 174 and the electronic component mounting apparatus 10 collectively. The management apparatus 172 can produce a board | substrate by supplying a production program to the several electronic component mounting apparatus 174 and the electronic component mounting apparatus 10, and controlling an operation | movement.

The electronic component mounting apparatus 174 is a device which mounts a mounting type electronic component on a board | substrate. The electronic component mounting apparatus 10 mounts an electronic component on a board | substrate. Here, the electronic component mounting apparatus 10 can mount a lead type electronic component as an electronic component. In addition, the electronic component mounting apparatus 10 can mount both a lead type electronic component and a mounting type electronic component as an electronic component. The electronic component mounting apparatus 10 will be described later.

The pattern forming apparatus 176 is a device which forms a pattern of solder paste on the surface of a board | substrate, and fills a solder paste in the insertion hole of a board | substrate. The reflow processing apparatus 178 heats the substrate to a predetermined temperature and temporarily melts the solder paste of the substrate to bond the substrate and the electronic component in contact with the solder paste. That is, the reflow processing apparatus 178 adheres the mounted electronic component mounted on the pattern of the solder paste formed on the surface of the substrate and the substrate by the solder paste of the pattern, and the lead type electrons in which the leads are inserted into the insertion holes. The lead insertion hole of the component (insertion-type electronic component) and the lead of the lead-type electronic component are bonded by solder paste filled in the insertion hole.

The production line of the factory 170 forms the pattern of the solder paste on the surface of the substrate by the pattern forming apparatus 176, and fills the solder paste in the insertion hole. The production line carries the board | substrate which printed the solder paste into the electronic component mounting apparatus 174 on a line, and mounts a mountable electronic component on a board | substrate with the electronic component mounting apparatus 174. The board | substrate with which the electronic component was mounted is carried out from the electronic component mounting apparatus 174. Every time the board | substrate passes through the electronic component mounting apparatus 174, an electronic component is mounted on a board | substrate. Next, the production line is carried into the electronic component mounting apparatus 10 on the line, and the lead type electronic component and the mounted electronic component are mounted on the substrate by the electronic component mounting apparatus 10. The board | substrate with which the electronic component was mounted is carried out from the electronic component mounting apparatus 10. Every time the board | substrate passes through the electronic component mounting apparatus 10, an electronic component is mounted on a board | substrate. A production line carries in the board | substrate with which the electronic component was mounted by the electronic component mounting apparatus 10 to the reflow processing apparatus 178, and performs a reflow process. The production line produces the substrate by the above process.

Next, the electronic component mounting apparatus 10 which can mount both the mounting type electronic component and the insertion type electronic component of this embodiment is demonstrated using FIGS. 12-27. The electronic component mounting apparatus 10 is a device capable of mounting both a mounted electronic component mounted by placing it on a substrate and a lead type electronic component (insertable electronic component) mounted by inserting a lead into an insertion hole of a substrate. to be. The electronic component mounting apparatus 10 can mount both a mounting type electronic component and a lead type electronic component by one, and can mount only one one. That is, the electronic component mounting apparatus 10 can mount both a mounted electronic component and a lead-type electronic component, and can be used for various uses according to the layout of the board | substrate to be manufactured and the other electronic component mounting apparatus.

12 is a schematic diagram illustrating a schematic configuration of an electronic component mounting apparatus. The electronic component mounting apparatus 10 shown in FIG. 12 is an apparatus which mounts an electronic component on the board | substrate 8. As shown in FIG. The electronic component mounting apparatus 10 includes a housing 11, a substrate conveying unit 12, component supply units 14f and 14r, a head 15, an XY moving mechanism 16, and a VCS unit ( 17, an exchange nozzle holding mechanism 18, a component storage unit 19, a control device 20, an operation unit 40, and a display unit 42. For reference, the XY moving mechanism 16 includes an X axis driver 22 and a Y axis driver 24. Here, the electronic component mounting apparatus 10 of this embodiment is equipped with the component supply unit 14f, 14r in the front side and the back side centering on the board | substrate conveyance part 12 as shown in FIG. In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side of the electronic component mounting apparatus 10, and a component supply unit 14r is disposed on the rear side of the electronic component mounting apparatus 10. . In addition, below, it describes as the component supply unit 14, unless two component supply units 14f and 14r are distinguished in particular.

13 is a perspective view showing a schematic configuration of a housing of an electronic component mounting apparatus. The housing 11 has a main body 11a and covers 11bf and 11br. The main body 11a is a box which accommodates each part which comprises the electronic component mounting apparatus 10. In the main body 11a, the cover 11bf, the operation part 40, and the display part 42 are arrange | positioned at the front side. As for the main body 11a, the opening 11c which carries in the board | substrate 8 into an apparatus, and discharges is formed in two side surfaces, respectively. The operation part 40 of this embodiment has the keyboard 40a and the mouse 40b. The display part 42 of this embodiment has the touch panel 42a and the vision monitor 42b. For reference, the touch panel 42a is also a part of the operation unit 40. The electronic component mounting apparatus 10 is provided with the component supply units 14f and 14r and the wiring of each part in the housing 11. Here, as the wiring, there are a wiring for transmitting an electric signal and a tube for supplying air.

The cover 11bf is a cover provided in a part of the front side of the main body 11a, and is disposed above the vertical direction. The cover 11br is a cover provided in the rear part of the main body 11a, and is arrange | positioned at the vertical direction upper side. The covers 11bf and 11br are shaped to cover a part of the front surface or the rear surface of the main body 11a and a part of the upper surface, and the cross section is L-shaped. The covers 11bf and 11br can be opened and closed with respect to the main body 11a. By opening the covers 11bf and 11br, it is possible to work on the respective portions arranged inside the main body 11a.

The board | substrate 8 may be a member which mounts an electronic component, and the structure is not specifically limited. The board | substrate 8 of this embodiment is a plate-shaped member, and the wiring pattern is provided in the surface. On the surface of the wiring pattern provided in the board | substrate 8, the solder which is a joining member which joins the wiring pattern of an plate-shaped member and an electronic component by reflow is affixed. In the substrate 8, through holes (insertion holes, substrate holes) into which electronic components are inserted are also formed.

The board | substrate conveyance part 12 is a conveyance mechanism which conveys the board | substrate 8 to an X-axis direction in a figure. The board | substrate conveyance part 12 has the rail extended in the X-axis direction, and the conveyance mechanism which supports the board | substrate 8 and moves the board | substrate 8 along a rail. The board | substrate conveyance part 12 faces the direction in which the mounting target surface of the board | substrate 8 faces the head 15, and moves the board | substrate 8 along a rail by a conveyance mechanism, and makes the board | substrate 8 X-axis. Convey in the direction. The board | substrate conveyance part 12 conveys the board | substrate 8 supplied from the apparatus supplied to the electronic component mounting apparatus 10 to the predetermined position on a rail. The head 15 mounts the electronic component on the surface of the substrate 8 at the predetermined position. The board | substrate conveyance part 12 conveys the board | substrate 8 to the apparatus to perform a next process, when an electronic component is mounted on the board | substrate 8 which conveyed to the said predetermined position. For reference, as the conveyance mechanism of the board | substrate conveyance part 12, various structures can be used. For example, the conveyance mechanism which combines the rail arrange | positioned along the conveyance direction of the board | substrate 8, and the endless belt which rotates along the said rail, and conveys in the state which mounted the board | substrate 8 to the said endless belt is carried out. The conveyance mechanism of the integrated belt system can be used.

14 is a schematic diagram illustrating a schematic configuration of an electronic component mounting apparatus. In the electronic component mounting apparatus 10, as shown in FIG. 14, the component supply unit 14f is arrange | positioned at the front side, and the component supply unit 14r is arrange | positioned at the rear side. The component supply unit 14f on the front side and the component supply unit 14r on the rear side hold a large number of electronic components to be mounted on the substrate 8, respectively, and as shown in FIG. An electronic component supply device for supplying to a holding position in a state capable of being supplied, that is, capable of being held (adsorbed or held) by the head 15 is provided. The component supply units 14f and 14r of the present embodiment all supply a lead type electronic component having a main body and a lead connected to the main body.

The component supply unit 14f on the front side has two bowl feeder assemblies 92. The bowl feeder assembly 92 is provided with a plurality of component supply apparatuses that are bowl feeders, and supplies electronic components from the respective component supply apparatuses to the holding positions (suction positions, gripping positions). The electronic components supplied by the respective component supply apparatuses to the holding positions are mounted on the substrate 8 by the head 15. The bowl feeder assembly 92 will be described later. Two bowl feeder assemblies 92 of the component supply unit 14f are provided in the front bank 44.

The component supply unit 14r on the rear side has a plurality of electronic component supply devices (hereinafter, simply referred to as "component supply devices") 90. The electronic component supply apparatus 90 is a radial feeder, and supplies an electronic component to a holding position (adsorption position, a grip position). The electronic components supplied by the component supply apparatuses 90 to the holding position are mounted on the substrate 8 by the head 15.

The component supply apparatus 90 supplies a radial lead type electronic component to the head 15 using the electronic component holding tape comprised by attaching the lead of several radial lead type electronic components to a tape. The component supply device 90 holds the electronic component holding tape, transfers the holding electronic component holding tape, and can hold the radial lead type electronic component held by the nozzle of the head 15. It is a tape feeder which moves to a holding | maintenance area | region (suction position, a holding position, and a holding position). The component supply device 90 can cut the lead of the radial lead type electronic component moved to the holding area and separate the lead so that the radial lead type electronic component having the lead fixed by the tape can be held in a predetermined position. The radial lead electronic component can be held (adsorbed and held) by the nozzle of the head 15. The component supply apparatus 90 is mentioned later. For reference, the plurality of component supply devices 90 may supply different kinds of electronic components, or may supply separate electronic components.

FIG. 15: is a schematic diagram which shows schematic structure of the other example of a back side component supply unit. FIG. The component supply unit 14 mounts an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and is held by the electronic component holding tape. The electronic component supply apparatus 90 which cut | disconnects the lead of an electronic component in a holding position (2nd holding position), and is able to hold | maintain the lead-type electronic component in the said holding position with the suction nozzle or the holding nozzle provided in the head is plural. In addition to the mounting, a holding position (first holding) of the mounted electronic component held by the electronic component holding tape is mounted by mounting an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body. Position), and the mounted electronic component at the holding position is transferred to the suction nozzle or the grip nozzle provided in the head. It is optionally provided with an electronic component feeding device (90a) that is possible. In addition, the component supply unit 14 may provide a stick feeder and a tray feeder to the rear bank 46 as the electronic component supply device 90a. The some component supply apparatuses 90 and 90a shown in FIG. 15 are hold | maintained in the support stand (bank) 96. As shown in FIG. In addition, the support base 96 can mount another apparatus (for example, a measuring apparatus, a camera, etc.) of the component supply apparatuses 90 and 90a.

The component supply unit 14 includes a plurality of components of which the plurality of component supply apparatuses 90 and 90a held by the support stand 96 differ in the type of electronic component to be mounted, the mechanism for holding the electronic component, or the supply mechanism. It consists of supply apparatuses 90 and 90a. In addition, the component supply unit 14 may be provided with the plural component supply apparatuses 90 and 90a of the same kind. It is preferable that the component supply unit 14 be detachably attachable to the apparatus main body.

The electronic component supply apparatus 90a supplies an electronic component to the head 15 using the electronic component holding tape comprised by attaching the chip-shaped electronic component to board | substrate to a tape. For reference, in the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 90a holds the electronic component holding tape, transfers the holding electronic component holding tape, and moves the storage chamber to the holding region where the electronic component can be adsorbed by the nozzle of the head 15. Feeder. For reference, by moving the storage compartment to the holding area, the electronic component housed in the compartment can be exposed to a predetermined position, and the electronic component can be sucked and held by the nozzle of the head 15. have. The electronic component supply apparatus 90a is not limited to a tape feeder, but can be various chip component feeders which supply a chip type electronic component. As the chip component feeder, for example, a stick feeder, a tape feeder, and a bulk feeder can be used.

The head 15 is an electronic component (lead-type electronic component held in the bowl feeder unit) held in the component supply unit 14f or an electronic component (electronic component supply apparatus 90) held in the component supply unit 14r. A substrate in which a radial lead type electronic component (lead type electronic component, insertion type electronic component) held in the holder is held (adsorbed or gripped) by a nozzle, and the held electronic component is moved to a predetermined position by the substrate transfer part 12. (8) It is a mechanism to be mounted on it. In addition, when the component supply unit 14r includes the electronic component supply device 90a, the head 15 includes a substrate (chip type electronic component) held by the electronic component supply device 90a. 8) It is a mechanism to mount (mount) on. For reference, the configuration of the head 15 will be described later. For reference, a chip type electronic component (mounting type electronic component) is a leadless electronic component having no lead to be inserted into an insertion hole (through hole) formed in a substrate. As the mounted electronic component, SOP, QFP, and the like are exemplified as described above. A chip type electronic component is mounted on a board | substrate without inserting a lead into an insertion hole.

The XY movement mechanism 16 is a movement mechanism which moves the head 15 on the X-axis direction and Y-axis direction, ie, the surface parallel to the surface of the board | substrate 8, in FIG. 12 and FIG. It has a drive unit 22 and a Y-axis drive unit 24. The X-axis drive unit 22 is connected to the head 15 to move the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22, and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. . The XY movement mechanism 16 moves the head 15 to the position which faces the board | substrate 8, or the position which faces the component supply units 14f and 14r by moving the head 15 to an XY-axis direction. You can. Further, the XY moving mechanism 16 adjusts the relative position between the head 15 and the substrate 8 by moving the head 15. Thereby, the electronic component hold | maintained by the head 15 can be moved to arbitrary positions on the surface of the board | substrate 8, and it becomes possible to mount an electronic component in arbitrary positions on the surface of the board | substrate 8. That is, the XY movement mechanism 16 moves the head 15 on a horizontal plane (XY plane), and moves the electronic component in the electronic component supply device of the component supply units 14f and 14r to a predetermined position ( It is a conveying means to convey to a mounting position, a mounting position. For reference, as the X-axis drive unit 22, various mechanisms for moving the head 15 in a predetermined direction can be used. As the Y-axis driving unit 24, various mechanisms for moving the X-axis driving unit 22 in a predetermined direction can be used. As a mechanism for moving an object in a predetermined direction, for example, a linear motor, a rack & pinion, a conveying mechanism using a ball screw, a conveying mechanism using a belt, or the like can be used.

The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage portion 19 are positions overlapping with the movable region of the head 15 in the XY plane, and the position in the Z direction is different. It is arrange | positioned at the position which becomes perpendicular lower side than the head 15. As shown in FIG. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent between the substrate transfer unit 12 and the component supply unit 14r.

The VCS unit (part state detection unit, state detection unit) 17 is an image recognition device, and has a camera for photographing the vicinity of the nozzle of the head 15 and an illumination unit for illuminating the photographing area. The VCS unit 17 recognizes the shape of the electronic component adsorbed by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to a position to face the VCS unit 17, the nozzle of the head 15 is photographed from the lower side in the vertical direction, and the captured image is analyzed by the nozzle. The shape of the electronic component and the holding state of the electronic component by the nozzle are recognized. The VCS unit 17 sends the acquired information to the control device 20.

The exchange nozzle holding mechanism 18 is a mechanism for holding a plurality of types of nozzles. The exchange nozzle holding mechanism 18 maintains a plurality of types of nozzles in a state in which the head 15 is detachable and replaceable. Here, the exchange nozzle holding mechanism 18 of this embodiment holds the suction nozzle which hold | maintains by sucking an electronic component, and the holding nozzle which hold | maintains by holding an electronic component. The head 15 can hold the electronic component to be maintained under suitable conditions (suction or gripping) by changing the nozzle to be mounted by the exchange nozzle holding mechanism 18 and supplying and driving air pressure to the mounted nozzle.

The component storage unit 19 is a box in which the head 15 is held by a nozzle but stores electronic components not mounted on the substrate 8. That is, in the electronic component mounting apparatus 10, it becomes a waste box which discards the electronic component which is not mounted on the board | substrate 8. In the electronic component mounting apparatus 10, when there are electronic components in the electronic component held by the head 15 that will not be mounted on the substrate 8, the electronic component mounting apparatus 10 faces the component storage portion 19. By moving and releasing the holding electronic component, the electronic component is introduced into the component storage unit 19.

The control apparatus 20 controls each part of the electronic component mounting apparatus 10. The control apparatus 20 is an aggregate of various control parts. The operation unit 40 is an input device through which an operator inputs an operation, and has a keyboard 40a, a mouse 40b, and a touch panel 42a. The operation unit 40 sends various detected inputs to the control device 20. The display part 42 is a screen which displays various information to an operator, and has the touch panel 42a and the vision monitor 42b. The display unit 42 causes the touch panel 42a and the vision monitor 42b to display various images based on the image signal input from the control device 20.

For reference, although the electronic component mounting apparatus 10 of this embodiment has one head, you may provide two heads corresponding to each of the component supply units 14f and 14r. In this case, two heads can be moved independently by providing two X-axis driving parts and moving the two heads in the XY direction, respectively. The electronic component mounting apparatus 10 can mount an electronic component alternately with respect to one board | substrate 8 by providing two heads. In this way, by mounting the electronic components alternately by the two heads, the other head can hold the electronic components in the component supply device while one head is mounting the electronic components on the substrate 8. . Thereby, the time which an electronic component is not mounted in the board | substrate 8 can be shortened more, and an electronic component can be mounted efficiently. In addition, it is also preferable that the electronic component mounting apparatus 10 arrange | positions two board | substrate conveyance parts 12 in parallel. When the electronic component mounting apparatus 10 alternately moves two board | substrates to the electronic component mounting position by the two board | substrate conveyance part 12, and mounts a component by the said two heads 15 alternately, The electronic component can be efficiently mounted on the board.

Next, the structure of the head 15 is demonstrated using FIG. 16 and FIG. 16 is a schematic diagram illustrating a schematic configuration of a head of an electronic component mounting apparatus. 17 is a schematic diagram illustrating a schematic configuration of a head of an electronic component mounting apparatus. For reference, FIG. 16 also shows various control parts for controlling the electronic component mounting apparatus 10 and the component supply apparatus 90 which is one of the component supply units 14r. As shown in Figs. 16 and 17, the head 15 includes a head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (part state). Detector (38).

The electronic component mounting apparatus 10 has the control part 60, the head control part 62, and the component supply control part 64, as shown in FIG. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control unit 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power supply, and supplies the electric power supplied from the power supply to each part using the control part 60, the head control part 62, the component supply control part 64, and various circuits. do. The control part 60, the head control part 62, and the component supply control part 64 are mentioned later.

As for the electronic component supply apparatus 90, the main body of the electronic component 80 in which the lead was hold | maintained on the electronic component holding tape (radial component tape) is exposed upward. For reference, as the electronic component 80, an aluminum electrolytic capacitor is illustrated. For reference, in addition to the aluminum electrolytic capacitor, various electronic components having leads can be used as the electronic component 80. The electronic component supply apparatus 90 pulls out and moves an electronic component holding tape, and moves the electronic component 80 hold | maintained by the electronic component holding tape to a holding area (adsorption area | region, a holding area). In this embodiment, the vicinity of the front end of the component supply apparatus 90 in the Y-axis direction becomes a holding | maintenance area | region which the nozzle of the head 15 holds the electronic component 80 hold | maintained by the electronic component holding tape. The structure of the electronic component supply apparatus 90 is mentioned later. Similarly, in the case of the electronic component supply apparatus 90a, the predetermined position is a holding region for holding the electronic component 80 held by the nozzle of the head 15 on the electronic component holding tape.

The head main body 30 has a head supporting body 31 for supporting the respective parts, a plurality of nozzles 32, and a nozzle driving part 34. As shown in FIG. 17, six nozzles 32 are arranged in a line in the head main body 30 of the present embodiment. Six nozzles 32 are arranged side by side in a direction parallel to the X axis. For reference, as for the nozzle 32 shown in FIG. 17, all the adsorption nozzles which hold | maintain and hold | maintain the electronic component 80 are arrange | positioned.

The head supporting body 31 is a supporting member connected to the X-axis driving part 22 and supports the nozzle 32 and the nozzle driving part 34. [ For reference, the head support 31 also supports the laser recognition device 38.

The nozzle 32 is an adsorption mechanism for sucking and holding the electronic component 80. The nozzle 32 has an opening 33 at the tip, and sucks air from the opening 33, thereby adsorbing and holding the electronic component 80 at the tip. For reference, the nozzle 32 has a shaft 32a in which an opening 33 is formed and connected to a tip portion for sucking the electronic component 80. The shaft 32a is a rod-shaped member that supports the tip portion, and is disposed to extend in the Z-axis direction. As for the shaft 32a, the air pipe (piping) which connects the suction mechanism of the opening 33 and the nozzle drive part 34 is arrange | positioned inside.

The nozzle driver 34 moves the nozzle 32 in the Z-axis direction to suck the electronic component 80 through the opening 33 of the nozzle 32. Here, the Z axis is an axis orthogonal to the XY plane. For reference, the Z axis is a direction orthogonal to the surface of the substrate. In addition, the nozzle drive part 34 rotates the nozzle 32 to (theta) direction, for example at the time of mounting an electronic component. (theta) direction is the direction parallel to the circumferential direction of the circle centering on the Z axis | shaft which is an axis parallel to the direction to which the Z-axis drive part moves the nozzle 32. FIG. For reference, the θ direction is the rotation direction of the nozzle 32.

The nozzle drive unit 34 is a mechanism for moving the nozzle 32 in the Z-axis direction. For example, there is a mechanism having a linear linear motor in which the Z-axis direction is the driving direction. The nozzle drive part 34 moves the opening part 33 of the tip part of the nozzle 32 to a Z-axis direction by moving the shaft 32a of the nozzle 32 to a Z-axis direction by a linear motion linear motor. Moreover, the nozzle drive part 34 is a mechanism which rotates the nozzle 32 in (theta) direction, for example, there exists a mechanism comprised by the motor and the transmission element connected to the shaft 32a. The nozzle driver 34 transmits the driving force output from the motor to the shaft 32a through the transmission element, and rotates the shaft 32a in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

The nozzle drive unit 34 is a mechanism for adsorbing the electronic component 80 to the opening 33 of the nozzle 32, that is, a suction mechanism, for example, an air pipe connected to the opening 33 of the nozzle 32, and the air pipe. There is a mechanism having a pump connected to and a solenoid valve for switching the opening and closing of an air pipe. The nozzle drive unit 34 sucks air from the air pipe by a pump, and switches suction / non-suction of air from the opening 33 by switching opening and closing of the solenoid valve. The nozzle driving unit 34 sucks (holds) the electronic component 80 into the opening 33 by opening the solenoid valve and sucking air from the opening 33, and closes the solenoid valve to suck air from the opening 33. By not doing so, the electronic component 80 adsorbed to the opening 33 is released, that is, the electronic component 80 is not adsorbed to the opening 33 (the state not to be maintained).

In addition, the head 15 of this embodiment uses the holding nozzle mentioned later, when the main body upper surface is a shape which cannot adsorb | suck by the nozzle (suction nozzle) 32, when holding the main body of an electronic component. The gripping nozzle can grasp and release the main body of the electronic component from above by opening and closing the movable piece with respect to the fixed piece as the suction nozzle releases air in the same manner as the suction nozzle. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing an exchange operation.

The imaging device 36 is fixed to the head support 31 of the head main body 30, and has a region facing the head 15, for example, a substrate 8 on which the substrate 8 or the electronic component 80 is mounted. Take a picture. The photographing device 36 has a camera and a lighting device, and acquires an image with the camera while illuminating the field of view with the lighting device. Thus, an image at a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter simply referred to as "BOC") or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

The height sensor 37 is fixed to the head support body 31 of the head main body 30, and the board | substrate 8 in which the area | region which faces the head 15, for example, the board | substrate 8 and the electronic component 80 is mounted Measure the distance to). The height sensor 37 has a light emitting element for irradiating laser light, and a light receiving element for receiving laser light reflected and returned from a facing position, and the portion facing in time after emitting the laser light is received. The laser sensor which measures the distance to can be used. In addition, the height sensor 37 detects the height of the facing part, specifically, the electronic component, by processing the distance between the facing part using its own position at the time of measurement and the position of the substrate. For reference, the process of detecting the height of the electronic component based on the measurement result of the distance with the electronic component may be performed by the control unit 60.

The laser recognition device 38 has a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 16, the bracket 50 is connected to the lower side of the head support body 31, the board | substrate 8, and the component supply apparatus 90 side. The laser recognition apparatus 38 is an apparatus which detects the state of the electronic component 80 by irradiating a laser beam with respect to the electronic component 80 adsorbed by the nozzle 32 of the head main body 30. Here, the state of the electronic component 80 is the shape of the electronic component 80, whether the electronic component 80 is attracted to the nozzle 32 in a correct posture, or the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b is a position in the Z-axis direction, that is, a position at the same height, and is disposed at a position opposite to the light source 38a. The shape recognition processing by the laser recognition device 38 will be described later.

Next, the control function of the apparatus structure of the electronic component mounting apparatus 10 is demonstrated. As shown in FIG. 16, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. Each of the various control units is constituted by a member having a CPU, an operation processing function such as ROM or RAM, and a storage function. In addition, in this embodiment, although it was set as the some control part for the convenience of description, you may make it one control part. In addition, when the control function of the electronic component mounting apparatus 10 is set as one control part, you may implement | achieve by one computing device or you may implement | achieve with a some computing device.

The control part 60 is connected with each part of the electronic component mounting apparatus 10, and executes the stored program based on the input operation signal and the information detected by each part of the electronic component mounting apparatus 10, , To control the operation of each part. The control part 60 controls the conveyance operation | movement of the board | substrate 8, the drive operation of the head 15 by the XY moving mechanism 16, the shape detection operation by the laser recognition apparatus 38, etc., for example. Moreover, the control part 60 sends various instructions to the head control part 62 as mentioned above, and also controls the control operation by the head control part 62. FIG. The control unit 60 also controls the control operation by the component supply control unit 64.

The head control part 62 is connected to the nozzle drive part 34 and the various sensors arrange | positioned at the head support body 31, and the control part 60, controls the nozzle drive part 34, and controls the operation | movement of the nozzle 32. FIG. do. The head control part 62 is based on the operation instruction supplied from the control part 60 and the detection result of various sensors (for example, distance sensors), and the electronic component adsorption (holding) / release operation | movement of the nozzle 32, and each nozzle ( 32) rotation movement and Z-axis movement control.

The component supply control unit 64 controls the supply operation of the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each component supply device 90 or the bowl feeder unit 240 or may control all the component supply devices 90 and the bowl feeder unit 240 with one. For example, the component supply control unit 64 controls the withdrawal operation (movement operation) of the electronic component holding tape, the cutting operation of the lead, and the holding operation of the radial lead type electronic component by the component supply device 90. In addition, the component supply control unit 64 controls the component supply operation by the bowl feeder unit 240. In addition, when the component supply unit 14r is equipped with the component supply apparatus 90a, the component supply control part 64 performs the drawing operation | movement (movement operation) of the electronic component holding tape by the component supply apparatus 90a, etc. To control. The component supply control unit 64 executes various operations based on the instructions given by the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

Here, although the case where the adsorption nozzle was used as a nozzle attached to a head was demonstrated, it is not limited to this. 18 is an explanatory diagram showing an example of a nozzle. FIG. 18 is a diagram illustrating an example of a grip nozzle (gripper nozzle). FIG. The nozzle 201 shown in FIG. 18 has a fixed arm 202 and a movable arm 204. The nozzle 201 is fixed in a state in which the support point 205 of the movable arm 204 is rotatable to the main body of the nozzle 201, and the movable arm 204 has the support point 205 as an axis. The portion facing the fixed arm 202 can move in a direction away from the direction close to the fixed arm 202. As for the movable arm 204, the drive part 206 is connected to the main body part of the nozzle 201, and the part which becomes near or away from the fixed arm 202 through the support point 205 on the opposite side. The drive part 206 is moved by the drive source (air pressure) which drives a suction nozzle. The movable arm 204 is moved in a direction away from the direction in which the portion facing the fixed arm 202 approaches the fixed arm 202 as the drive unit 206 moves.

The nozzle 201 narrows the distance between the fixed arm 202 and the movable arm 204 in the state where the electronic component 80 is between the fixed arm 202 and the movable arm 204. ) Can be held.

The holding nozzle is not limited to the nozzle 201 and can be made into various shapes. The holding nozzle can make the space | interval and movable range between a fixed arm and a movable arm, respectively, various values. Thus, the shape of the electronic component which can be gripped changes with each shape of a nozzle.

The electronic component mounting apparatus 10 can hold | maintain an electronic component suitably by selecting the kind of nozzle which will hold this electronic component according to the kind of electronic component to hold. Specifically, by selecting the adsorption nozzle or the gripping nozzle according to the electronic component to be retained, and further, by switching which nozzle is used among each type of nozzle, more types of electronic component mounting apparatuses can be used. Electronic components can be mounted.

Next, the component supply apparatus 90 is demonstrated using FIG. 19 and FIG. The component supply apparatus 90 is a radial feeder which supplies a radial lead type electronic component to a holding position as mentioned above. First, the electronic component holding tape will be described with reference to FIG. 19. 19 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape.

The electronic component holding tape (radical component tape) 70 shown in FIG. 19 includes a tape body 72 and a plurality of electronic components (radial lead type electronic components, radial lead components) held by the tape body 72. ) As for the tape main body 72, the 1st tape 74 and the 2nd tape 76 narrower than the 1st tape 74 are joined together. In addition, the tape main body 72 is provided with a hole 78 as a feed hole at regular intervals along the extending direction. That is, in the tape main body 72, the some hole 78 is formed in the column shape along an extension direction.

The electronic component 80 has an electronic component main body (hereinafter simply referred to as a 'body') 82 and two leads 84 arranged in the radial direction of the main body 82. In the electronic component 80, the lead 84 is sandwiched between the first tape 74 and the second tape 76 and fixed. Thereby, the electronic component 80 is fixed to the predetermined position of the tape main body 72 by clamping the lead 84 between the 1st tape 74 and the 2nd tape 76. In addition, the plurality of electronic components 80 are provided with holes 78 disposed between the two leads 84 and fixed at positions where the holes 78 of the tape main body 72 are formed. That is, the electronic component 80 is arrange | positioned in the space | interval of the conveyance pitch P same as the hole 78, and the position in the extending direction of a tape is the same. For reference, the electronic component 80 may be a shape having a lead wire sandwiched between the first tape 74 and the second tape 76 of the tape body 72. It is not specifically limited. In addition, the electronic component holding tape can set various relative positional relationships between the hole 78 and the electronic component 80 in the tape extending direction. For example, in the electronic component holding tape, the electronic component 80 may be disposed between the hole 78 and the hole 78.

Next, FIG. 20 is a perspective view showing a schematic configuration of the electronic component supply apparatus of the rear component supply unit. As shown in FIG. 20, the electronic component supply device (component supply device) 90 holds the other parts and clamps connected to the housing 210 for guiding the electronic component holding tape and the rear bank 46. The unit 212, the feed unit 214 which conveys an electronic component holding tape, and the cutting unit 216 which cut | disconnects the lead of the electronic component hold | maintained by the electronic component holding tape are provided. In the electronic component supply device 90, an air pressure adjusting unit is disposed inside the housing 210. The air pressure adjusting unit adjusts the air pressures of the drive unit of the feed unit 214 and the drive unit of the cutting unit 216 to control the driving of each unit.

The housing 210 is a hollow box vertically long and narrow, and holds the clamp unit 212, the feed unit 214, the cutting unit 216, and the air pressure adjusting unit inside. The housing 210 is provided with a guide groove 220, a guide part 222, a discharge part 226, and a grip part 228. The guide groove 220 has a shape in which one end portion of two straight lines formed along the longitudinal direction of the narrow and long surface of the vertical direction of the housing 210 is connected. That is, the guide groove 220 extends from one end of the housing 210 to the vicinity of the other end, is formed in a U shape extending back from the other end and extending to one end. The guide groove 220 is a groove for guiding the electronic component holding tape, and the electronic component holding tape is supplied from one end (supply side end) having a U shape. The guide groove 220 moves the supplied electronic component holding tape along the U shape, and discharges it from the other end (discharge side end) of the U shape. In addition, the guide groove 220 guides the electronic component holding tape with the tape main body 72 inside the housing 210 and the electronic components exposed to the outside of the housing 210.

The guide part 222 is connected to the supply side end part of the guide groove 220, and guides the electronic component holding tape in the state where the electronic component is held to the guide groove 220. The discharge part 226 is connected to the discharge side end portion of the guide groove 220, and moves inside the housing 210 to supply the electronic component to the head 15 to discharge the electronic component holding tape. The holding part 228 is a part which an operator takes in the case of conveyance of the electronic component supply apparatus 90, etc.

The clamp unit 212 is a mechanism connected with the support base 96. The clamp unit 212 is a mechanism that is fixed to the housing 210 and that can be switched between a state in which the clamp unit 212 is fixed in connection with the support 96 and a state in which the clamp unit 212 is released without connecting with the support 96. The operator can attach and detach the electronic component supply apparatus 90 with respect to the support 96 by operating the clamp unit 212.

The feed unit 214 is a mechanism for conveying the electronic component holding tape, that is, moving the electronic component holding tape guided along the guide groove 220. The feed unit 214 is provided with the projection part inserted into the hole of the electronic component holding tape, The electronic part holding tape is moved by moving the said projection part to a conveyance direction, in the state in which the projection part is inserted into the hole of the electronic component holding tape. Move it. The projection of the feed unit 214 is separated from the hole when moved in the side opposite to the conveying direction. As a result, the feed unit 214 can move the tape sequentially in the conveying direction by one pitch by reciprocating the protrusion in the conveying direction by one pitch of the hole of the tape main body 72.

The cutting unit 216 is arrange | positioned at the supply position which supplies an electronic component, and cuts the lead of the electronic component hold | maintained by the electronic component holding tape. In addition, the cutting unit 216 clamps, that is, holds, the electronic component whose lead was cut | disconnected, until the electronic component is attracted (held) by a nozzle. The cutting unit 216 is provided with the mechanism which adjusts the height which cuts a lead, the mechanism which adjusts the range which moves the clamping mechanism at the time of clamping of an electronic component, etc. By performing various adjustments with the above mechanism, the leads of various kinds of lead-type electronic components can be cut and clamped.

Here, the cutting position of the lead which the cutting unit 216 cut | disconnects is demonstrated. In a conventional mounting apparatus having a head for lead type electronic component for inserting a substrate, a lead which is considerably long is inserted into the substrate by cutting at the lead tip side close to the tape for fixing the lead. In the case of the conventional mounting apparatus, since the lead cutting part and the lead holding part are provided in the head side, the lower part was cut | disconnected after holding the root part of a lead by the lead holding part, and it cut | disconnected. This is because the lead is long. In addition, the conventional mounting apparatus guides and inserts the guide pin when the lead is inserted into the insertion hole. Therefore, even if the lead is long, there is no problem in inserting the substrate. Moreover, the conventional mounting apparatus is for removing the lead from the component tape in order to perform post-processing by a lead bending device which cuts and cuts the lead to the required length on the back surface of the substrate. This is because the cutting needs to be long.

On the other hand, the cutting unit 216 uses the length of the lead of the radial lead type electronic component to be equal to the thickness of the substrate, or the lead protruding to the back side of the substrate does not become poor in soldering and corresponds to the thickness of the substrate. It is set as the predetermined length which is length to say. The predetermined length is, for example, almost the same length as the insertion hole of the substrate. More specifically, it is a long length of 0 mm or more and 3 mm or less with respect to the length of the insertion hole of the substrate. Thus, the following effects can be obtained by setting it as the structure which cuts a part shortly from the beginning with the predetermined length from the beginning rather than cutting a part in a head like conventionally.

The electronic component mounting apparatus 10 improves the stability of the lead spacing when the cutting unit 216 cuts the lead shortly and holds the main body of the electronic component in the holding position of the component supply apparatus 90 with a nozzle. It is possible to increase the number of parts into which the lead can be inserted into the insertion hole, and it is possible to mount it with high efficiency and high precision.

In the conventional mounting apparatus, when a long lead is inserted into the solder paste previously filled or applied to the insertion hole, most of the solder paste is pushed toward the lead tip side, and the solder melted during reflow soldering is formed between the insertion hole and the lead. It may fail to rise due to a narrow gap and lead to soldering failure. On the other hand, in the electronic component mounting apparatus 10, the cutting unit 216 cuts a lead shortly, and the solder melt | dissolved in the said gap rises, and the most preferable soldering of the solder can be performed without a gap. In addition, since the mounted electronic component is also mounted on the solder paste coated on the upper surface of the substrate, the lead type electronic component and the mounted electronic component can be simultaneously performed by one reflow soldering process. In other words, if a lead that is too long is inserted into the solder paste previously filled or applied to the insertion hole, most of the solder paste is pushed toward the lead tip side, so that the melted solder does not rise to the substrate during reflow soldering, that is, the solder It may not reach this board | substrate, and it may become a soldering defect. On the other hand, in the electronic component mounting apparatus having the above-described configuration, when the lead is shortly cut to the predetermined length, a part of the solder pushed out of the insertion hole by the lead that has passed through the insertion hole becomes molten. It rises to the back side and can be soldered with the electrode on the back side of the substrate. In addition, when an electrode is also present in the insertion hole (substrate hole), the solder rises due to the gap between the lead and the electrode inside the substrate, whereby soldering is possible. In this way, soldering is possible mechanically and electrically.

In addition, by making the predetermined length equal to the thickness of the substrate, it is possible to prevent the lead from protruding from the substrate (back surface of the substrate) even when the radial lead type electronic component is mounted on the substrate. In addition, by setting the predetermined length so that the lead which protrudes to the back surface side of a board | substrate does not become a soldering defect, even if a lead is shortened, a lead can be suitably fixed to the insertion hole of a board | substrate by reflow process.

The electronic component supply apparatus 90 has the above structure, and is fixed to the predetermined position of the support stand 96 by the clamp unit 212. The electronic component supply apparatus 90 moves the electronic component holding tape by the feed unit 214. In addition, when the electronic component supply apparatus 90 cuts the lead of the electronic component in a supply position by the cutting unit 216, and the lead cut | disconnects the electronic component cut | disconnected by the nozzle 32 of the head 15, Keep up. Thereby, the electronic component conveyed by the electronic component holding tape can be made into the state which can be conveyed by a head.

Next, the component supply unit 14f will be described. Here, the component supply unit 14f has two bowl feeder assemblies 92. The two bowl feeder assemblies 92 are arranged in parallel and have essentially the same configuration. Hereinafter, one bowl feeder assembly 92 will be described.

21 is a perspective view showing a schematic configuration of the bowl feeder assembly. The bowl feeder assembly 92 has two bowl feeder units 240 and a support mechanism 241 as shown in FIG. 21. In the present embodiment, the bowl feeder unit 240 and the bowl feeder assembly 92 are controlled by the control unit. The bowl feeder unit 240 and the bowl feeder assembly 92 may use the control apparatus 20 which the electronic component mounting apparatus 10 has as a control part, and the bowl feeder unit 240 and the bowl feeder assembly 92 may be used as a control part. You may have a control part.

The support mechanism 241 is a mechanism for supporting the two bowl feeder units 240. The support mechanism 241 has the support plate 241, the support rod 252, and the connection part 253. The support plate 241 is a plate-shaped member, and two bowl feeder units 240 are installed and fixed. As for the support plate 241, the front-end | tip of the side which supplies a component is connected with the front side bank 44. As shown in FIG. The support rod 252 is connected to the side far from the front bank 44 of the support plate 241 via the connection part 253. The support bar 252 is supported by the mounting surface (bottom) in which the edge part of the perpendicular lower side mounts the electronic component mounting apparatus 10. As for the support mechanism 241, the support plate 241 in which the two bowl feeder units 240 were installed is supported by the front side bank 44 and the support rod 252. The support mechanism 241 can suppress the support plate 241 from bending by supporting the support plate 241 at two places of the front bank 44 and the support bar 252 spaced apart from the front bank 44. have. Thereby, it can suppress that the vibration of the bowl feeder unit 240 becomes the vibration of the support plate 241, and can drive the bowl feeder unit 240 preferably.

One bowl feeder unit 240 of the bowl feeder assembly 92 has two rows in a vertical direction with the bowl of the bowl feeder unit 240, which is described later, and the holding position (the tip of the rail 282, suction). Position) is shifted back and forth. That is, in the bowl feeder assembly 92, the bowl mentioned later of the two bowl feeder units 240 is arrange | positioned in the front-back position in the Y direction. Then, in the X direction (direction perpendicular to the extension direction of the rail to be described later, the conveying direction of the substrate), the bowl of the bowl feeder unit 240 in the first row and the bowl feeder unit 240 in the second row At least part of the placement area overlaps. That is, the bowl feeder assembly 92 is arranged so that the bowl positions described later of the two bowl feeder units 240 are overlapped in the X direction. Further, in the bowl feeder assembly 92, the bowls described later of the two bowl feeder units 240 are disposed at the front and rear positions in the Y direction. Thereby, the bowl feeder assembly 92 can arrange | position the bowl feeder unit 240 efficiently. Specifically, the width in the X direction can be narrowed, and more component supply apparatuses can be arranged in the component supplyable region of the electronic component mounting apparatus 10.

In the present embodiment, the bowl of the bowl feeder unit 240 in the first row and the bowl feeder unit 240 in the second row (which are disposed at a position farther from the holding position than the bowl feeder unit 240 in the first row) have The bowl is disposed in an area within twice the outer diameter of the bowl in the direction orthogonal to the extending direction of the rail (the X direction, the conveying direction of the substrate). By doing in this way, the width | variety of the X direction can be narrowed certainly, and more component supply apparatuses can be arrange | positioned in the component supplyable area | region of the electronic component mounting apparatus 10. FIG.

Next, the bowl feeder unit 240 of the bowl feeder assembly 92 of the component supply unit 14f is demonstrated using FIG. 22 and FIG. The bowl feeder unit 240 shown in FIG. 22 and FIG. 23 uses the bowl feeder as an electronic component supply apparatus. First, the overall configuration of the bowl feeder unit 240 will be described with reference to FIGS. 22 and 23. 22 is a side view illustrating another example of the component supply unit. 23 is a top view illustrating another example of the component supply unit.

The bowl feeder unit 240 includes an electronic component supply device (bowl feeder) 262, 264, and 266, a drive device 268, and a fixing part 270. That is, the bowl feeder unit 240 is provided with three electronic component supply apparatuses 262, 264, and 266, and is a mechanism which can supply components at three places. In the bowl feeder unit 240, one drive device 268 serves as a drive unit of the electronic component supply devices 262, 264, and 266. In the bowl feeder unit 240, the fixing unit 270 supports the electronic component supply devices 262, 264, and 266 and the drive device 268. The fixed part 270 has a frame-shaped support part 296 extending in the vertical direction, a support part 298, and has an electronic component supply device 262, 264, 266, and a drive device 268 at the top and bottom thereof. Is supported by. In addition, the support part 296 and the support part 298 extend to the rotating shaft of the drive apparatus 268 mentioned later, and the drive apparatus 268 centers the target part of the electronic component supply apparatuses 262, 264, and 266 on the rotating shaft center. It is supported in a state where it can rotate.

The electronic component supply apparatus 262 has the bowl 280a, the rail 282a, and the support mechanism 284a. The electronic component supply apparatus 264 has a bowl 280b, a rail 282b, and a support mechanism 284b. The electronic component supply device 266 has a bowl 280c, a rail 282c, and a support mechanism 284c. The electronic component supply devices 262, 264, and 266 are arranged by stacking the bowls 280a, 280b, and 280c at positions where the positions in the horizontal direction overlap, and sequentially the bowls 280a, 280b, and 280c from the vertical direction. It is arranged in order. In the electronic component supply apparatuses 262, 264, and 266, the support mechanisms 284a, 284b, and 284c are arrange | positioned in parallel on the same plane. That is, each holding position of the some rail 282a, 282b, 282c is arrange | positioned at the same plane.

The electronic component supply apparatuses 262, 264, and 266 are basically the same structure only in the shape of the rails 282a, 282b, and 282c which differ in arrangement | positioning position and the said arrangement position. Hereinafter, the points common to the bowls 280a, 280b, and 280c of the electronic component supply devices 262, 264, and 266 will be described as the bowl 280. Similarly, the points common to the rails 282a, 282b, and 282c will be described as the rails 282. In addition, the point common in the support mechanisms 284a, 284b, and 284c is demonstrated as the support mechanism 284. FIG.

The bowl 280 is a container in which a plurality of electronic components are put. The rail 282 becomes a guide member for guiding the electronic component put into the bowl 280 to the suction position. The support mechanism 284 is a mechanism for supporting the electronic component guided by the rail 282 at the suction position. The electronic component supply devices 262, 264, and 266 are connected to the excitation portion of the bowl 280 and the driving device 268, and transmit vibrations from the driving device 268 to the bowl 280. It has an additional connection part. For reference, in the present embodiment, in the electronic component supply apparatuses 262, 264, and 266, the drive device 268 is a vibrating portion.

The drive part 268 has the motor 290, the shaft 292, and the attachment block part 294. The motor 290 is a drive source of the drive device 408. The shaft 292 is fixed to the fixed portion and is supported in a rotatable state. The shaft 292 is connected to the attachment block portion 294. The attachment block portion 294 is connected to the bowls 280a, 280b, and 280c, and rotates integrally with the shaft 432 as the rotation axis. The driving unit 268 transmits the driving force of the motor 290 to the bowls 280a, 280b, and 280c through the connecting portion of the shaft 292, the attachment block portion 294, and the electronic component supply devices 262, 264, and 266. By vibrating the bowls 280a, 280b, and 280c, the electronic components held by the bowls 280a, 280b, and 280c are conveyed to the rails 282a, 282b, and 282c. The drive unit 268 also vibrates the rails 282a, 282b, and 282c in one direction.

As described above, the bowl feeder unit 240 stacks the bowls of the component supply devices 262, 264, and 266 in the vertical direction so that the bowl feeder unit 240 can effectively utilize a horizontal area, thereby saving space for the plurality of component supply devices. Can be placed. As a result, the bowl feeder unit 240 can supply a plurality of electronic components to the suction position. Moreover, the bowl feeder unit 240 can arrange | position the support mechanism 284 closely in a horizontal direction by laminating | stacking the bowl of the component supply apparatuses 262,264 and 266 in a perpendicular direction as mentioned above. As a result, the suction position of the electronic component can be made close, and the moving distance of the head at the time of suction of the component can be shortened. In addition, the bowl feeder unit 240 can reduce the drive source by using one drive device 268 as a drive part of the three component supply devices 262, 264, and 266, thereby simplifying the device configuration. . In addition, by supporting the rotating shafts of the component supply devices 262, 264, and 266 with the fixing part 270, each part can be stably vibrated. In addition, although the bowl feeder unit 240 of the said embodiment made three parts supply apparatuses, the number of parts supply apparatuses is not limited to this.

In addition, in this embodiment, although the drive mechanism which vibrates the bowl 280 was used as a drive part of the bowl feeder unit 240, it is not limited to this. The electronic component supply apparatus (bowl feeder) which comprises the bowl feeder unit 240 only needs to be able to supply the electronic component 80 to the rail 282 by vibrating the bowl 280. For example, you may use the drive part which oscillates the bowl 280 as a drive part.

Next, operation | movement of each part of an electronic component mounting apparatus is demonstrated. For reference, the operation of each part of the electronic component described below can be executed by controlling the operation of each part based on the control device 20.

24 is a flowchart showing an example of the operation of the electronic component mounting apparatus. 24, the overall processing operation of the electronic component mounting apparatus 10 is outlined. For reference, the process shown in FIG. 24 is executed by the control apparatus 20 controlling each part. The electronic component mounting apparatus 10 reads a production program as step S252. The production program is created by a dedicated production program preparation device or by the control device 20 based on various input data.

If the electronic component mounting apparatus 10 has read the production program in step S252, it detects the state of an apparatus as step S254. Specifically, the configuration of the component supply units 14f and 14r, the type of charged electronic component, the type of the prepared nozzle, and the like are detected. The electronic component mounting apparatus 10 detects an apparatus state in step S254, and when preparation is completed, carries in a board | substrate as step S256. The electronic component mounting apparatus 10 mounts an electronic component on a board | substrate in step S258, when the board | substrate is carried in in step S256 and the board | substrate was arrange | positioned in the position to mount an electronic component. The electronic component mounting apparatus 10 carries out a board | substrate as step S260, if mounting of an electronic component is completed in step S258. If the electronic component mounting apparatus 10 carried out the board | substrate in step S260, it determines with step S262 whether it is production end. When it is determined in step S262 that it is not the end of production (No), the electronic component mounting apparatus 10 proceeds to step S256 to execute the processes of steps S256 to S260. That is, based on the production program, a process of mounting an electronic component on a substrate is executed. The electronic component mounting apparatus 10 complete | finishes this process, when it determines with production completion (Yes) in step S262.

The electronic component mounting apparatus 10 can manufacture the board | substrate with which the electronic component was mounted by mounting a electronic component on a board | substrate after reading a production program and making various settings as mentioned above. In addition, the electronic component mounting apparatus 10 mounts a lead type electronic component having a main body and a lead connected to the main body as a electronic component on a substrate, specifically, inserting the lead into a hole (insertion hole) formed in the substrate. As a result, the electronic component can be mounted on a substrate.

25 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. For reference, the processing operation shown in FIG. 25 is an operation from loading the substrate to completion of mounting of the electronic component on the substrate. In addition, the process operation shown in FIG. 25 is performed by the control part 60 controlling the operation | movement of each part.

The control part 60 carries in a board | substrate as step S302. Specifically, the control part 60 conveys the board | substrate which is a target to mount an electronic component to the predetermined position by the board | substrate conveyance part 12. FIG. If the board | substrate was carried in in step S302, the control part 60 will carry out a maintenance movement as step S304. Here, the holding movement (adsorption movement) refers to a processing operation of moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding region of the component supply unit 14.

If the control part 60 performed the holding movement in step S304, the control part 60 will lower the nozzle 32 as step S306. That is, the control part 60 moves the nozzle 32 downward to the position which can hold | maintain (adsorb | suck, hold) the electronic component 80. FIG. When the control part 60 lowers the nozzle 32 in step S306, the control part 60 hold | maintains components by the nozzle 32 as step S308, and raises the nozzle 32 as step S310. If the control part 60 moved the nozzle to the predetermined position in step S310, specifically, if the electronic component 80 was moved to the measurement position of the laser recognition apparatus 38, it will be carried out to the nozzle 32 as step S312. Detects the shape of the electronic component being sucked. If the control part 60 detects the shape of an electronic component in step S312, it raises a nozzle as step S314. For reference, the controller 60 detects the shape of the component in step S312 as described above, and when it is determined that the electronic component being held is not mountable, the controller 60 discards the electronic component and adsorbs the electronic component again. If the control part 60 raises a nozzle to a predetermined position, as step S316, a mounting movement, ie, the electronic component adsorbed by the nozzle 32, will be moved to the position which opposes the mounting position (mounting position) of the board | substrate 8; A processing operation to cause the processing to be performed, and as a step S318, the nozzle 32 is lowered, and as a step S320, a processing operation for mounting the component (part mounting), that is, releasing the electronic component 80 from the nozzle 32, is performed. As a result, the nozzle 32 is raised. That is, the control part 60 performs the above-mentioned mounting process in the process operation of step S312-step S320.

When the nozzle is raised in step S322, the control unit 60 determines whether or not the mounting of all components is completed in step S324, that is, whether the mounting process of the electronic component that is to be mounted on the substrate 8 is completed. The control unit 60 proceeds to step S304 when it is determined in step S324 that the mounting of all components is not completed (No), that is, the electronic component to be mounted remains, and the next electronic component is mounted on the board 8. Execute the processing operation. Thus, the control part 60 repeats the said process operation | movement until mounting of all components to a board | substrate is completed. If it is determined in step S324 that the mounting of all parts is completed (Yes), the control unit 60 ends this process.

Next, the process shown in FIG. 26 is a process before mounting of an electronic component, specifically, the determination process based on the shape measurement process of an electronic component, and a measurement result. For reference, the control part 60 performs the process of FIG. 26 with respect to all the electronic components which hold | maintain. The control unit 60 acquires data of the electronic component to be held in step S420. Here, the data of an electronic component that is a holding target (adsorption target, a holding target) refers to various kinds of information necessary for mounting the electronic component on a substrate. The data of the electronic component to be held includes the position of the component supply device 90 in which the electronic component is held, the shape data of the electronic component, the adsorption height (holding height) of the electronic component, and the electronic component with the laser recognition device 38. Information of the measurement position to be measured.

If the control part 60 acquired the data in step S420, it determines a measurement position as step S422. That is, the control part 60 determines the position which will detect the shape of an electronic component, ie, the position of the electronic component in the Z-axis direction based on the data acquired by step S420. For reference, the control part 60 may perform the process of step S420 and step S422 before adsorption | suction of an electronic component.

The control unit 60 determines the measurement position in step S422 and adjusts the Z-axis position of the electronic component in step S424 when the electronic component is sucked by the nozzle. That is, the control part 60 moves the measurement position determined in step S422 of an electronic component to the measurement area of the laser recognition apparatus 38 by moving a nozzle to a Z-axis direction. If the Z-axis position of the electronic component was adjusted in step S424, the control unit 60 measures the shape of the electronic component in step S426. That is, the control part 60 detects the shape in the measurement position of an electronic component using the laser recognition apparatus 38. As shown in FIG.

If the control part 60 detected the shape in the measurement position of an electronic component in step S426, it determines with step S428 whether it is completion of measurement. That is, the control part 60 determines whether the shape measurement in the measurement position determined in step S422 was complete | finished. If it is determined in step S428 that the measurement is not finished (No), the control unit 60 proceeds to step S424 and executes the processes of step S424 and step S426 again, thereby determining the shape of the measurement position where the measurement is not finished. Measure it. The control part 60 detects the shape of the set measurement position by repeating position adjustment and shape measurement of an electronic component in this way.

When it is determined in step S428 that the measurement ends (Yes), the control unit 60 compares the measurement result with the reference data as step S430. Here, the reference data is the shape data of the electronic component that is the adsorption target (holding target) acquired in step S420. By comparing the measurement result with the reference data, the control unit 60 determines whether or not the electronic component being sucked has a shape that matches the reference data, whether the direction of the electronic component matches the direction of the reference data, or the like.

If the control part 60 has compared in step S430, it determines with step S432 whether a component is appropriate. Specifically, the control part 60 determines whether the electronic component is adsorb | sucked in the state which can be mounted in step S432. When it is determined in step S432 that the component is not appropriate (No), the control unit 60 discards the electronic component adsorbed by the nozzle in step S434, and ends the present process. The control part 60 disposes an electronic component by moving a head and a nozzle to the position which faces the component storage part 19, and throws in the component storage part 19 the electronic component hold | maintained by the said nozzle. For reference, the control part 60 performs the process which mounts the same kind of electronic component in the same mounting position (mounting position) of a board | substrate again.

When it is determined in step S432 that the component is appropriate (Yes), the control unit 60 determines whether the component direction (direction in the rotational direction of the nozzle) is appropriate as step S436. That is, it is determined whether the electronic component under suction is the same as the reference direction. For reference, the control unit 60 of the present embodiment determines whether the electronic component is reversed in step S436. If it is determined in step S436 that the direction is not appropriate (No), that is, the electronic component is inverted, the controller 60 inverts the electronic component in step S438 and then proceeds to step S440.

The control unit 60 finely adjusts the mounting position (mounting position) of the electronic component on the basis of the holding position in step S440 when it is determined to be Yes in step S436 or when the processing in step S438 is executed. For example, based on the shape detection result of the electronic component, the position at which the nozzle adsorbs the electronic component is detected, and the relative position of the nozzle and the substrate at the time of mounting is determined based on the deviation (deviation) of the holding position relative to the reference position. Adjust The control part 60 complete | finishes this process, after having performed the process of step S440. In addition, when the process of step S440 of FIG. 26 is performed, the control part 60 mounts the determined electronic component on the board | substrate with the result of step S440.

The electronic component mounting apparatus 10 can mount an electronic component more appropriately on a board | substrate by detecting the shape of an electronic component using the laser recognition apparatus 38 in this way, and performing various processes based on the result. have.

Although the electronic component mounting apparatus 10 discarded the electronic component in step S434 of the flowchart shown in FIG. 26, when it is determined that the shape of the lead of the electronic component is inappropriate, the electronic component mounting apparatus 10 may execute a process of correcting the shape of the lead. . In other words, instead of discarding the electronic component in step S434, the lead of the electronic component may be corrected (processed) into an insertable shape and mounted at the mounting position (mounting position). The electronic component mounting apparatus 10 may fix the lead of an electronic component with the mechanism which clamps the electronic component of the cutting unit of the electronic component supply apparatus 90, or may fix the lead of an electronic component with the correction mechanism provided separately. do. Thus, as a processing means which processes the shape of a lead, various means, such as a mechanism which clamps the main body or lead of an electronic component, the correction mechanism provided separately, can be used.

Next, an example of the processing operation at the time of mounting the electronic component will be described with reference to FIG. 27. 27 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The electronic component mounting apparatus 10 performs the process of FIG. 27 for every operation | movement which hold | maintains an electronic component with the nozzle of a head. For reference, the processing in FIG. 27 is basically a process in which both a lead type electronic component and a mounting type electronic component are mounted on a substrate as an electronic component. The electronic component mounting apparatus 10 specifies the electronic component to be held in step S510, and determines in step S512 whether the component to be held is a lead type electronic component.

When it is determined in step S512 that the electronic component mounting apparatus 10 is a lead type electronic component (Yes), the electronic component mounting apparatus 10 holds the lead type electronic component of the electronic component supply apparatus as a nozzle in step S514. That is, the electronic component mounting apparatus 10 holds the lead type electronic component supplied to the holding position (second holding position) of the electronic component supply apparatus 90 with a nozzle. If the electronic component mounting apparatus 10 held the lead-type electronic component as the nozzle in step S514, in step S516, the lead of the lead-type electronic component is inserted into the insertion hole and mounted on the substrate.

When it is determined in step S512 that the electronic component mounting apparatus 10 is not a lead type electronic component (No), the electronic component mounting apparatus 10 holds the mounted electronic component of the electronic component supply apparatus as a nozzle in step S517. That is, the electronic component mounting apparatus 10 holds the mounted electronic component to be supplied to the holding position (first holding position) of the electronic component supply apparatus 90a with a nozzle. The electronic component mounting apparatus 10 mounts a mounted electronic component on a board | substrate in step S518, if the mounted electronic component was hold | maintained with the nozzle in step S517. That is, the electronic component mounting apparatus 10 mounts a mounting type electronic component on a board | substrate, without inserting into an insertion hole.

If the electronic component mounting apparatus 10 has executed the processing of step S516 or S518, that is, the electronic component is mounted, it determines whether the mounting of all the electronic components is completed in step S519. If it is determined in step S519 that the mounting is not completed (No), the electronic component mounting apparatus 10 proceeds to step S510 to specify an electronic component to be mounted next, and to process the specified electronic component. Run The electronic component mounting apparatus 10 ends this process, if it is determined in step S519 that mounting is complete (Yes).

As shown in FIG. 27, the electronic component mounting apparatus 10 can mount a mounting type electronic component and a lead type electronic component on a board | substrate with one head. In addition, the electronic component mounting apparatus 10 can mount both a mounting type electronic component and a lead type electronic component with the same nozzle. Here, the electronic component mounting apparatus 10 can be mounted and conveyed by the same nozzle as a mounting type electronic component by holding | maintaining (adsorption or gripping) the main body of a lead-type electronic component. In addition, the electronic component mounting apparatus 10 determines whether the electronic component is a mounted electronic component or a lead-type electronic component and switches whether or not to insert the lead into the insertion hole in correspondence with each other, thereby mounting with the same head or the same nozzle. Even in this case, it can be mounted on a substrate under conditions suitable for each electronic component. As a result, the mounted electronic component and the leaded electronic component can be mounted without replacing the nozzle. In addition, since the mounting type electronic component and the lead type electronic component can be mixed and mounted without being divided, the limitation of the mounting order is further reduced, and the mounting efficiency can be further improved.

Here, the electronic component mounting apparatus 10 can obtain the said effect more preferably by using the radial lead type electronic component supplied by the electronic component supply apparatus 90 as mentioned above as a lead type electronic component. The electronic component mounting apparatus 10 holds the radial lead type electronic component whose lead was cut | disconnected to predetermined length by the electronic component supply apparatus 90, and more specifically, hold | maintains a main body with a nozzle, and conveys Then, the lead is inserted into the insertion hole and mounted on the substrate. Thus, the electronic component mounting apparatus 10 can shorten a lead length in order to hold the main body of an electronic component. Moreover, since the electronic component mounting apparatus 10 is a structure which cut | disconnects a lead before conveying by a tape main body and holding it, in the state which removed the part hold | maintained with tape for conveyance of the lead of a radial lead type electronic component. It can be mounted on a substrate. Thereby, the lead of a radial lead type electronic component can be shortened and it can mount to a board | substrate, and an electronic component can be mounted to a board | substrate in a stable state. Specifically, since the lead of the radial lead type electronic component can be shortened and mounted on a board | substrate, the vibration which a lead and an insertion hole come into contact with at the time of mounting a board | substrate can be reduced. Accordingly, even if the radial lead type electronic component and the mounted electronic component are mounted in the same process, the effects on the mutual mounting can be reduced, so that even if they are mounted in the same process, that is, with the same head or the same nozzle in succession, both Electronic components can be mounted.

Here, the electronic component mounting apparatus 10 of the said embodiment is equipped with the bowl feeder assembly 92 which used the bowl feeder as a component supply unit 14f, and the electronic component of a radial feeder as a component supply unit 14r. Although it was set as the structure provided with the supply apparatus 90, it is not limited to this. The electronic component mounting apparatus 10 can make a component supply unit into various combinations. For example, the electronic component supply apparatus of a bowl feeder may be provided in the component supply unit of both before and after, and the electronic component supply apparatus of a radial feeder may be provided in both the component supply unit of before and after. In addition, as described above, the component supply unit may include an electronic component supply device (chip component feeder) 90a that supplies the mounted electronic component with the electronic component holding tape. Moreover, you may make the electronic component supply apparatus (chip component feeder) 90a all the electronic component supply apparatuses of one component supply unit among front and rear. In other words, one of the front and rear parts supply units may supply lead-type electronic components (electronic components inserted into the substrate), and the other may supply leadless electronic components (electronic components mounted on the substrate). In addition, what is called a tray feeder can also be used for an electronic component mounting apparatus as an electronic component supply apparatus. In addition, the electronic component mounting apparatus cuts the lead of the axial electronic component held on the tape as the electronic component supplying device to be shortly below the substrate as described above, and is bent in a 'co' shape. It is also possible to use an axial feeder supplied to the feeder. In this case, the electronic component mounting apparatus holds the axial type electronic component main body at the holding position of the axial feeder with a nozzle, and then determines whether the lead spacing is good, and inserts the axial type electronic component determined to be good into the insertion hole ( Into the substrate hole). The electronic component mounting apparatus 10 can be mounted or inserted into a board | substrate by attracting or holding an electronic component, even if it is an electronic component supplied to any electronic component supply apparatus. For reference, in the electronic component supply device for supplying a lead-type electronic component, the lead-type electronic component is disposed by a nozzle in a direction in which the main body is disposed above the vertical direction of the lead, that is, in a direction in which the lead is disposed below the vertical direction of the main body. Supply to the holding position to be maintained. Here, the electronic component mounting apparatus 10 is a component supply unit provided with a bowl feeder like this embodiment, and other types of electronic component supply apparatuses, for example, the said radial feeder, the axial feeder, and the mounted electronic component. It is preferable to arrange component supply units, such as a tape feeder, a stick feeder, and a tray feeder, in the front side and back side which are positions which oppose via the board | substrate conveyance part 12. As shown in FIG. As a result, the influence of the vibration of the bowl feeder on other kinds of component supply units can be suppressed, so that the nozzle holding action for the electronic components supplied by the other kinds of electronic component supply apparatuses in the holding position can be stabilized. .

In addition, in this embodiment, although the component supply unit was demonstrated with two of the component supply unit 14f, 14r, the number is not limited. In addition, the two component supply units 14f and 14r may be regarded as one component supply unit, and each of the component supply units 14f and 14r may be regarded as the first component supply unit and the second component supply unit. For example, it can be regarded as a configuration in which one component supply unit includes a bowl feeder (part supply unit 14f) and a radial feeder (part supply unit 14r) as in the above embodiment. In this case, the 1st component supply part and the 2nd component supply part are arrange | positioned in the opposing position across the position where the board | substrate is arrange | positioned. In addition, it can also be considered that one component supply unit 14f includes the first component supply portion and the second component supply portion. For example, as above-mentioned, one component supply unit 14f can be regarded as a structure provided with a radial feeder (1st component supply part) and a chip component feeder (2nd component supply part). Thus, the electronic component mounting apparatus 10 can be set as the structure provided with the some kind of electronic component supply apparatus irrespective of a combination.

Here, as an electronic component supplied by the electronic component supply apparatus 90 which is a radial feeder, there exist various radial lead type electronic components which can hold a lead with a tape. The electronic component supply apparatus 90 can supply an aluminum electrolytic capacitor, an inductor, a ceramic capacitor, a film capacitor, etc., for example. Moreover, as an electronic component supplied by the electronic component supply apparatuses 262,264 and 266 which are bowl feeders, there are various lead-type electronic components of a package component. The electronic component supply apparatuses 262, 264, and 266 can supply a solid state relay, a DIP electronic component, a SIP electronic component, a connector, a transformer, etc., for example.

In addition, when the head 15 of this embodiment is equipped with several nozzles in order to be able to mount more types of electronic components by one head, the said nozzle automatic exchange apparatus (in this embodiment, The head exchange operation realized by the combination of the replacement nozzle holding mechanism and the head body) allows each nozzle to be replaced with various suction nozzles and gripping nozzles during mounting production. The electronic component mounting apparatus 10 is adapted to the component conditions such as the size, weight, and whether the upper surface of the component main body has an adsorbable surface for the mounted electronic component and the lead-type electronic component, and whether the component main body can be gripped. Accordingly, a suction nozzle having an appropriate suction hole diameter or a grip nozzle having a grip member having an appropriate shape is designated for each component and stored in the production program. The electronic component mounting apparatus 10 changes the nozzle attached to a head or determines the nozzle which hold | maintains the said electronic component in a head based on the correspondence relationship between the electronic component and the nozzle stored in the production program.

As a result, the electronic component mounting apparatus 10 holds a lead-type electronic component for holding the mounted electronic component when, for example, the electronic component held by the nozzle is changed from the mounted electronic component to the lead-type electronic component during board mounting. The case of holding by the nozzle different from the case of holding by the same nozzle as a nozzle may arise. When the nozzles are different, the electronic component mounting apparatus 10 automatically replaces the nozzles by the nozzle automatic exchange apparatus when the electronic components to be mounted are changed, either in advance preparation or during production. That is, when the electronic component to be mounted on the board during production is, for example, a mounted electronic component, a nozzle (adsorption nozzle or gripping nozzle) suitable for the electronic component is selected, and the mounting component is placed at the holding position of the electronic component supply device to supply the electronic component. After moving the nozzle to the type electronic component to hold the electronic component, the electronic component is moved to a predetermined position on the substrate, and the mounting of the electronic component is continued while controlling the descending speed. The electronic component mounting apparatus 10 determines whether the nozzles are the same or different when the mounting of the electronic component for a predetermined number of times is completed and the electronic component to be mounted next is changed to a lead type electronic component. When it is determined that the nozzles are the same, the electronic component mounting apparatus 10 uses the same nozzle as the lead type electronic component nozzle because no replacement of the nozzle is necessary. Further, when it is determined that the nozzles are different, the electronic component mounting apparatus 10 uses the nozzle for the lead-type electronic component when any of the other nozzles mounted on the head is usable, and is available among other nozzles. If there is no nozzle, the nozzle automatic replacement device automatically replaces the nozzle for the lead type electronic component. When the lead-type electronic component nozzle is prepared in this manner, the electronic component mounting apparatus 10 moves the head to move the nozzle to the holding position of the lead-type electronic component supply apparatus. The electronic component mounting apparatus 10 is cut | disconnected shortly to predetermined length from the electronic component tape (electronic component holding tape) by the built-in cutting device (cutting unit) by the electronic component supply apparatus which supplies a lead-type electronic component. The lead type electronic component with a lead is set in a holding position. The electronic component mounting apparatus 10 holds the lead-type electronic components with the nozzles and holds them, and holds the lead-type electronic components with the nozzle, and detects the lead interval by the detection means (laser recognition device 38) and determines the positional deviation. Selecting the electronic components to be moved and inserted into the insertion hole (substrate hole), correcting the positional deviation of the lead when inserting it into the insertion hole, and controlling switching of the descending speed at the time of insertion to the cutting length of the lead sequentially Mount it.

In addition, when the head 15 is provided with a plurality of nozzles, the head 15 may be provided with at least one nozzle capable of holding and mounting a lead-type electronic component (insertable electronic component), and the configuration of the nozzle can be configured in various configurations. . For example, the head 15 may be a nozzle for holding some of the nozzles for holding the lead-type electronic components, and the remaining nozzles for nozzles for holding the mounted electronic components. In this case, when the nozzle holds the mounted electronic component, the electronic component mounting apparatus performs mounting control on which the mounted electronic component is mounted on the substrate, and when the lead electronic component is held, the lead electronic component. The mounting control is performed to insert the plug into the insertion hole (substrate hole). In addition, the head 15 may use all the nozzles as a nozzle which holds a lead-type electronic component. In addition, the electronic component mounting apparatus 10 holds the electronic component according to the type of the electronic component when determining the adsorption nozzle (or the holding nozzle to be held) to adsorb the electronic component to be mounted based on the production program. Determine the nozzle to be mounted. The electronic component mounting apparatus 10 prepares a plurality of nozzles that can be attached to one head in this way, and operates the nozzle automatic changer during production by a command based on a production program to produce a nozzle to be mounted on the head next. By attaching and detaching and replacing with a nozzle in accordance with the electronic component (electronic component to be mounted), the lead-type electronic component can be held and inserted with respect to the substrate, and the substrate mounted can be sequentially mounted by mounting the mounted electronic component on the substrate.

The management system 100, like the electronic component mounting apparatus 10, aims at an apparatus which mounts both an insert-type electronic component and a mounting-type electronic component while exchanging a nozzle to be used by one head according to a use purpose, The electronic component mounting apparatus 10 can be used more efficiently by determining whether the electronic component to which the electronic component mounting apparatus 10 can target, especially an insertion type electronic component, can be mounted on a board | substrate.

8: substrate
10: Electronic component mounting device
11: Housing
11a: main body
11bf, 11br: cover
11c: opening
12:
14, 14f, 14r: component supply unit
15: head
16: XY moving mechanism
17: VCS unit
18: replacement nozzle holding mechanism
19: parts storage
20: controller
22: X axis drive part
24: Y-axis driving part
30: Head body
31: head support
32: Nozzle
34:
38: Laser recognition device
40: control panel
42:
60:
62: head control unit
64: parts supply control unit
70: electronic component holding tape
72: tape body
80: electronic components
82: main body (electronic component main body)
84: lead
92: Bowl Feeder Assembly
90, 90a, 262, 264, 266: Electronic component supply device
96: support
100: mounting device related information management system (management system)
102: network
104: manufacturer terminal
104a:
104b: memory
104c: control panel
104d: display unit
104e: communication unit
106: server
108: shared server
110A, 110B, 110C: Dealer terminal
111A, 111B, 111C, 111D
112: terminal of the related company
120: user terminal
130: gateway
140:
142: control unit
142a: automation rate calculator
142b: electronic component determination unit
144: memory
144a: Store Database
144b: user database
144c: body database
144d: Feeder Database
144e: Nozzle Database
144f: Parts Database
210: Housing
212: Clamp Unit
214: feed unit
216: cutting unit
220: Information Home
240: bowl feeder unit
268: driving device
270 fixing part
Bowl: 280, 280a, 280b, 280c
282, 282a, 282b, 282c: rail
422964a, 284b, 284c

Claims (10)

A parts database having identification information of an insertable electronic component and information on whether the electronic component mounting apparatus holds and inserts the inserted electronic component into a substrate hole;
An information acquisition unit for acquiring information of the target insertion-type electronic component to be determined;
It has a control part which determines whether the target insertion type electronic component corresponding to the information of the said target insertion type electronic component acquired by the said information acquisition part can be mounted on a board | substrate by an electronic component mounting apparatus,
The control unit compares the information of the target insertion-type electronic component with the identification information, specifies the insertion-type electronic component of the parts database corresponding to the information of the target insertion-type electronic component, and has a record of mounting on the target insertion-type electronic component. In this case, it is determined that the target insertion type electronic component is mountable. The method of claim 1,
The parts database includes information of embedded electronic components similar to embedded electronic components,
If the target insertion-type electronic component has no mounting history, the controller determines whether there is an insertion-type electronic component similar to the target insertion-type electronic component on the basis of the information of the similar insertion-type electronic component in the parts database. The electronic component determination device characterized in that the electronic component is determined to be mountable when there is an electronic component. The method of claim 1,
The information of the parts database includes at least one of the size and shape of the corresponding embedded electronic component body, the number and length of lead wires,
If the target insertion-type electronic component has no mounting history, the controller determines whether there is an insertion-type electronic component similar to the target insertion-type electronic component based on an item of the parts database, and if there is a similar insertion-type electronic component. And the target insertion type electronic component is determined to be mountable. 4. The method according to claim 2 or 3,
And the control unit extracts a difference between the target insertion type electronic component and the similar insertion type electronic component, and outputs the extracted difference point. 4. The method according to any one of claims 1 to 3,
It further has a feeder database having the performance information of the electronic component supply device for supplying the embedded electronic component,
The parts database further has information of a feeder capable of supplying the corresponding embedded electronic component,
And the control unit extracts an electronic component supply apparatus capable of supplying the target embedded electronic component that is determined to be mountable based on the component database and the feeder database. 6. The method of claim 5,
The control unit acquires detailed information including at least one of the size and shape of the main body of the target insertion type electronic component, the number and length of lead wires, when there is no insertion type electronic component similar to the target insertion type electronic component. And a feeder capable of supplying the target embedded electronic component based on the performance information of the electronic component supply apparatus of the feeder database. 4. The method according to any one of claims 1 to 3,
It further has a nozzle database having the performance information of the nozzle for holding the embedded electronic component,
The parts database further has information of the nozzle capable of holding the inserted electronic component,
The control unit extracts a nozzle capable of holding the target insertion-type electronic component that is determined to be mountable based on the parts database and the nozzle database. 8. The method of claim 7,
The control unit acquires detailed information including at least one of the size and shape of the main body of the target insertion type electronic component, the number and length of lead wires, when there is no insertion type electronic component similar to the target insertion type electronic component. And extracting a nozzle capable of holding the target insertion-type electronic component based on the performance information of the nozzle in the nozzle database. The electronic component judging device according to any one of claims 1 to 3,
The electronic component judging device detects whether the target insertable electronic component can be mounted, and calculates the ratio of the insertable electronic component that can be mounted by the electronic component judging device among the insertable electronic components to be mounted on the substrate, thereby determining the automation ratio. An automation rate determination unit having an automation rate determination device. A reading step of reading out a parts database having identification information of the insertable electronic component and information on whether the electronic component mounting apparatus is mounted with the inserted electronic component;
An acquisition step of acquiring information of the target insertion-type electronic component to be determined;
A determination step of determining whether the object insertion-type electronic component corresponding to the obtained information of the object insertion-type electronic component can be mounted on the substrate by the electronic component mounting apparatus,
The determining step compares the information of the target insertion-type electronic component with the identification information, specifies the insertion-type electronic component of the parts database corresponding to the information of the target insertion-type electronic component, and records the placement on the target insertion-type electronic component. And if so, the target insertion type electronic component is determined to be mountable.

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