JP7336734B2 - COMPONENT MOUNTING APPARATUS AND METHOD FOR MANUFACTURING COMPONENT MOUNTING BOARD USING IT - Google Patents

Description

The present invention relates to a component mounting apparatus and a method of manufacturing a component mounting board using the same.

2. Description of the Related Art In a component mounting line that mounts electronic components on boards to produce electronic boards, various types of components are mounted on the boards. In addition to surface mount components such as small chip type components and QFPs that are soldered to the electrode surface of the circuit board, these components include power transistors and connector components that have protruding leads for connection and are mounted on the circuit board. There is an insertion component that is mounted by inserting a lead into a mounting hole formed in the body. The supply form of such insert parts varies depending on the type of the parts. The component supply orientation varies depending on the type of component, such as when components are stored in a tray and supplied in a horizontal position, or when a plurality of electronic components are connected by taping and supplied in a vertical position.

If the inserted part is supplied in a lying position, it is necessary to change the inserted part to an upright position prior to mounting on the board. Therefore, there has been proposed a component mounting apparatus having a function of changing an insertion component in a lying posture to an upright posture (see, for example, Patent Document 1).

A component mounting apparatus described in Patent Document 1 includes a mounting head for mounting a component on a board, and the mounting head has a nozzle for sucking and holding the component and a swing mechanism for swinging the nozzle. A part lying down is held by a nozzle, and the nozzle is swung to change the part into an upright posture. After that, by moving the mounting head, the leads of the component changed to the standing posture are aligned with the insertion holes of the board into which the leads are to be inserted. After that, the component in the upright posture is pushed toward the board and the lead is inserted into the insertion hole of the board.

Japanese Unexamined Patent Application Publication No. 2017-34048

However, according to the above method, when the nozzle itself for picking up the component is turned sideways and brought close to the surface of the board, the nozzle interferes with the component in the area where the component is already present on the board, making it difficult to mount the component. can't In this way, there is a problem that the area on the substrate where components can be mounted is limited.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above problems and to provide a component mounting apparatus capable of mounting components over a wide area on a board and a method for manufacturing a component mounting board using the same. .

In order to achieve the above object, a component mounting apparatus of the present invention picks up and holds a component with leads in a first posture, and changes the held component from the first posture to a second posture. a first component holding unit having a posture changing mechanism; a second component holding unit that receives the component in the second posture from the first component holding unit and holds the component; a third component holding unit that picks up and holds the component held by the component holding unit, and inserts the lead of the held component into the insertion hole of the substrate.

A method of manufacturing a component-mounted board according to the present invention includes: a first component holding step of picking up and holding a component with leads in a first posture by a first component holding portion; a posture changing step of changing the component held in the first component holding step from the first posture to a second posture by the posture changing mechanism; a second component holding step of delivering and holding the component in the second component holding portion; and a third component holding portion picking up and holding the component held by the second component holding portion. and an inserting step of inserting the lead of the component held in the third component holding step into the insertion hole of the board by the third component holding section.

According to the present invention, components can be mounted over a wide area on the board.

1 is a schematic perspective view of a component mounting apparatus according to Embodiment 1; FIG. Schematic perspective view of the anvil unit Schematic perspective view of the anvil body Schematic perspective view (standby position, non-cutting position) for explaining the method of cutting and clinching the lead by the anvil unit Schematic perspective view (operating position, cutting position) for explaining the method of cutting and clinching the lead by the anvil unit Schematic perspective view (standby position, non-cutting position) for explaining the method of cutting and clinching the lead by the anvil unit Schematic perspective view (operating position, cutting position) for explaining the method of cutting and clinching the lead by the anvil unit 4 is a flow chart showing an example of a method for manufacturing a component-mounted board using the component-mounting apparatus of Embodiment 1; Schematic diagram showing each process in order when a component mounting board is manufactured along the flow chart of FIG. Schematic diagram showing each process in order when a component mounting board is manufactured along the flow chart of FIG. Schematic diagram showing each process in order when a component mounting board is manufactured along the flow chart of FIG. Schematic diagram showing each process in order when a component mounting board is manufactured along the flow chart of FIG. Schematic plan view showing a pair of anvil parts and blocks Schematic plan view showing an anvil unit according to Embodiment 2 Schematic side view showing an anvil unit according to Embodiment 2 Schematic perspective view of a component mounting apparatus according to Embodiment 3 Schematic diagram of an opening/closing section provided in a component mounting apparatus according to Embodiment 3 Schematic perspective view of tray supply unit and tray plate of Embodiment 4 Schematic diagram of the tray plate of Embodiment 4 FIG. 11 is a diagram showing a state in which a component is delivered to and held by the component holding portion of the tray plate according to the fourth embodiment; Schematic perspective view of a nozzle changer according to Embodiment 5 The figure which shows the state which has arrange|positioned components to the hole of the nozzle changer of Embodiment 5.

According to the first aspect of the present invention, there is provided a posture changing mechanism that picks up and holds a component with leads in a first posture, and changes the held component from the first posture to a second posture. one component holding unit, a second component holding unit that receives the component in the second posture from the first component holding unit and holds the component, and a second component holding unit that holds the component. and a third component holding section that picks up and holds the component mounted on the board, and inserts the lead of the held component into an insertion hole of a substrate.

According to such a configuration, by mounting the component on the board after switching from the first component holding portion to the other component holding portion, it is possible to avoid the space limitation caused by the attitude changing mechanism. , components can be mounted over a wide area on the board.

A second aspect of the present invention provides the component mounting apparatus according to the first aspect, wherein the second component holding section is an anvil unit that clinch the lead inserted into the substrate. According to such a configuration, by using the anvil unit as the second component holding section, it is not necessary to provide a dedicated configuration for the second component holding section, and the manufacturing cost of the component mounting apparatus can be reduced. .

According to the third aspect of the present invention, the anvil unit includes a first cutting blade for clinching and cutting a first lead of the component and a second cutting blade for clinching and cutting a second lead of the component. and a spacing adjustment unit that adjusts the spacing between the first cutting blade and the second cutting blade, and the spacing adjustment unit reduces the spacing to thereby hold the first component The component mounting apparatus according to the second aspect holds the component by sandwiching the component held by the anvil unit with the anvil unit. According to such a configuration, the lead can be cut at an appropriate position according to the distance between the two leads by making the distance between the first cutting blade and the second cutting blade adjustable. In addition, the parts can be easily held by sandwiching the parts by adjusting the gap by the gap adjusting section.

According to the fourth aspect of the present invention, the anvil unit further comprises a first block attached to the first cutting edge side and a second block attached to the second cutting edge side. wherein the first block and the second block each have a facing surface facing each other, and the facing surfaces together allow the first cutting blade and the second cutting blade to move relative to each other. Provide a component mounting apparatus according to the third aspect, having a plane perpendicular to the direction. By providing the blocks having such facing surfaces, the component can be sandwiched and held more reliably.

According to the fifth aspect of the present invention, the first posture is a posture in which the leads of the component extend sideways, and the second posture is a posture in which the leads of the component extend downward. A component mounting apparatus according to any one of the aspects to the fourth aspect is provided. According to such a configuration, the component can be mounted on the board after changing the posture from being unable to insert the lead of the component into the insertion hole of the board to being able to be inserted.

According to a sixth aspect of the present invention, the component according to any one of the first to fifth aspects, wherein the posture changing mechanism of the first component holding portion is a swing mechanism for swinging the component. Provide mounting equipment. With such a configuration, it is possible to easily change the orientation of the component.

According to the seventh aspect of the present invention, the first component holding step of picking up and holding the component with leads in the first posture by the first component holding portion, and changing the posture of the first component holding portion. a posture changing step of changing the component held in the first component holding step from the first posture to a second posture by a mechanism; a second component holding step of delivering and holding a component to a second component holding portion; and a third component holding step of picking up and holding the component held by the second component holding portion by a third component holding portion. and an inserting step of inserting the leads of the component held in the third component holding step by the third component holding portion into insertion holes of the board.

According to such a method, the same effects as those of the component mounting apparatus of the first aspect can be obtained.

According to the eighth aspect of the present invention, the seventh method further includes a clinching step of clinching the lead of the component inserted by the inserting step with an anvil unit, wherein the anvil unit is the second component holding portion. A method for manufacturing a component-mounted substrate according to the aspect is provided. According to such a method, the same effects as those of the component mounting apparatus of the second aspect can be obtained.

According to the ninth aspect of the present invention, the clinching step includes clinching and cutting the first lead of the component with a first cutting blade of the anvil unit, and cutting the first lead of the component with a second cutting blade of the anvil unit. and the second lead of the component is clinched and cut, and the second component holding step reduces the distance between the first cutting blade and the second cutting blade, thereby cutting the component into the anvil unit. The method for manufacturing a component-mounted board according to the eighth aspect, wherein the component is delivered to and held by the anvil unit by sandwiching the component between the two. According to such a method, the same effects as those of the component mounting apparatus of the third aspect can be obtained.

According to the 10th aspect of the present invention, the second component holding step transfers the component to the anvil unit by sandwiching the component between opposing surfaces of a pair of blocks provided in the anvil unit. The method of manufacturing a component mounting board according to the ninth aspect, wherein the surface has a surface perpendicular to the direction in which the first cutting blade and the second cutting blade move relative to each other. According to such a method, the same effects as those of the component mounting apparatus of the fourth aspect can be obtained.

According to the eleventh aspect of the present invention, the first posture is a posture in which the leads of the component extend sideways, and the second posture is a posture in which the leads of the component extend downward. Provided is a method for manufacturing a component mounting board according to any one of the tenth to tenth aspects. According to such a method, the same effects as those of the component mounting apparatus of the fifth aspect can be obtained.

According to the twelfth aspect of the present invention, the component mounting board according to any one of the seventh to eleventh aspects, wherein the attitude changing step changes the attitude of the component by swinging the component. A manufacturing method is provided. According to such a method, the same effects as those of the component mounting apparatus of the sixth aspect can be obtained.

DETAILED DESCRIPTION OF THE INVENTION Exemplary embodiments of a component mounting apparatus according to the present invention and a method of manufacturing a component mounting board using the apparatus will be described below with reference to the accompanying drawings. The present invention is not limited to the specific configurations of the following embodiments, and includes configurations based on similar technical ideas.

(Embodiment 1)
First, a component mounting apparatus according to Embodiment 1 of the present invention will be described with reference to FIG.

A component mounting apparatus 1 shown in FIG. 1 is an apparatus for mounting/mounting a lead-attached component 2 having two leads 2L extending downward on a substrate 3. As shown in FIG. The board 3 on which the component 2 is mounted becomes a "component-mounted board". Hereinafter, the horizontal direction that is the transport direction of the substrate 3 is defined as the X direction, the direction orthogonal to the X direction in the horizontal plane is defined as the Y direction, and the direction perpendicular to the XY plane, that is, the vertical direction is defined as the Z direction. The X direction and the Y direction are not limited to being perpendicular to each other, and may be directions that intersect each other.

The component mounting apparatus 1 includes a board positioning section 10 , a first moving mechanism 11 , a swing head 12 , a body chuck 13 , a second moving mechanism 14 , an anvil unit 15 and a control section 21 .

The board positioning part 10 is a member that positions the board 3 at a predetermined mounting position. The mounting position of the substrate 3 is programmed in the control section 21 in advance. The substrate positioning unit 10 of Embodiment 1 consists of a pair of conveyor mechanisms, supports both ends of the substrate 3 from below, transports the substrate 3 in the X direction, and positions it at the mounting position. The substrate 3 is provided with an insertion hole 3a for inserting the lead 2L of the component 2. As shown in FIG.

The first moving mechanism 11 is a mechanism for integrally moving the swing head 12 and the body chuck 13 . The first moving mechanism 11 of the first embodiment integrally moves the swing head 12 and the body chuck 13 in the X direction and the Y direction as indicated by arrows X1 and Y1. The swing head 12 and the body chuck 13 are not limited to moving integrally, and may move independently.

The swing head 12 is a member having a swing nozzle 12A for sucking and holding the component 2 . The swing nozzle 12A is a suction nozzle that sucks the component 2 with negative pressure. The swing head 12 incorporates a swing mechanism (not shown) that swings the swing nozzle 12A, for example, in the R direction. The swing mechanism swings the swing nozzle 12A to change the attitude of the component 2 sucked by the swing nozzle 12A. The swing mechanism is an example of a posture changing mechanism that changes the posture of the component 2 from the first posture to the second posture.

The body chuck 13 is a member provided with a pair of pick-up claws 13a for sandwiching and holding the component 2 . The body chuck 13 incorporates a drive mechanism (not shown) that moves the pick-up claw 13a in the Z direction as indicated by an arrow Z1.

The swing head 12 and the body chuck 13 described above are arranged above the substrate positioning section 10 .

The second moving mechanism 14 is a mechanism that moves the anvil unit 15 . The second moving mechanism 14 of Embodiment 1 consists of an orthogonal coordinate table, and moves an attachment member 14T for attaching the anvil unit 15 in the horizontal and vertical directions. The configurations of the second moving mechanism 14 and the attachment member 14T are greatly simplified and illustrated.

The anvil unit 15 is a mechanism for cutting and clinching the lead 2L projecting from the insertion hole 3a of the substrate 3 to the lower surface side of the substrate 3. As shown in FIG. The anvil unit 15 is arranged below the substrate positioning part 10 . The anvil unit 15 is moved in the X, Y and Z directions by the second moving mechanism 14 as indicated by arrows X2, Y2 and Z2.

As shown in FIG. 1 , the anvil unit 15 includes an anvil main body 23 and a lead waste collection container 24 . An enlarged perspective view of the anvil unit 15 is shown in FIG.

The anvil main body 23 shown in FIG. 2 is a unit that cuts off the lower ends of the leads 2L projecting to the lower surface side of the substrate 3 and clinch the remaining leads. The anvil main body 23 is provided with a cutting blade 80 (not shown), which will be described later. The anvil body portion 23 is attached to the attachment member 14T described above (not shown). The lead waste collection container 24 is a container for collecting lead waste, which is the lower end portion of the lead 2L cut by the anvil body portion 23 . The lead scrap collection container 24 is fixed to the anvil body 23 by fixing means such as screws (not shown).

A lead scrap guide pipe 73 is provided in the anvil main body 23 . The lead waste guide pipe 73 is a pipe that guides the lead waste generated in the anvil body 23 to the lead waste collection container 24 . An upstream opening (not shown) of the lead scrap guide pipe 73 is arranged inside the anvil body 23 , and a downstream opening 74 of the lead scrap guide pipe 73 is arranged above the lead scrap collection container 24 . The lead waste guide pipe 73 is fixed to the anvil body 23 in the same manner as the lead waste collection container 24 .

Returning to FIG. 1 , the control section 21 is a member that controls the operation of each component of the component mounting apparatus 1 . The control unit 21 is electrically connected to each component of the component mounting apparatus 1 via wiring or the like. The control unit 21 is composed of, for example, a microcomputer.

Next, FIG. 3 shows a configuration for cutting and clinching the lead 2L in the anvil unit 15 shown in FIGS.

FIG. 3 is a schematic perspective view of the anvil main body 23. FIG. As shown in FIG. 3 , the anvil main body 23 of Embodiment 1 is composed of a pair of anvil portions 52 . Each anvil portion 52 includes an anvil base 51, a mount portion 51a, a fixed blade holding portion 54, a movable blade holding portion 55, a swing shaft 55J, an anvil operating rod 56, a lower end roller 57, and an upper end. and side rollers 58 . A through-hole 75 is formed in the mount portion 51a, and the through-hole 75 is a hole for inserting and holding the above-described lead waste guide pipe 73 (not shown).

A method of cutting and clinching the lead 2L using such a configuration will be described with reference to FIGS. 4A, 4B, 5A, and 5B. 4A, 4B, 5A, and 5B are schematic perspective views for explaining a method of cutting and clinching the lead 2L by the anvil main body 23, respectively.

4A and 5A correspond to "standby position" and "non-cutting position" which will be described later, and FIGS. 4B and 5B correspond to "operating position" and "cutting position" which will be described later. In FIGS. 4A, 4B, 5A, and 5B, the configuration is simplified by omitting illustration of the through hole 75 for holding the lead waste guide pipe 73, and the like.

4A, 4B, 5A, and 5B, the anvil base 51 is horizontally supported by a column (not shown) and positioned above the operation plate 43. As shown in FIG. The operation plate 43 is a plate-like member that supports the lower end roller 57, and can be vertically moved by a drive source (not shown). The operation plate 43 is attached to the attachment member 14T described above (not shown). The anvil base 51 has a fixed side base 51A and a movable side base 51B. The fixed side base 51A is fixed without moving in the horizontal direction, whereas the movable side base 51B is horizontally movable along the movement guide 53. As shown in FIG. Like the operation plate 43, the movement guide 53 is also attached to the attachment member 14T (not shown). When the movable base 51B moves along the movement guide 53, the distance between the movable base 51B and the fixed base 51A changes.

4A, 4B, 5A, and 5B, the fixed side base 51A and the movable side base 51B each have a mount portion 51a protruding upward. An anvil portion 52 is provided on each mount portion 51a. 5A and 5B, each anvil portion 52 has a fixed blade holding portion 54 and a movable blade holding portion 55. As shown in FIG. The fixed blade holding portion 54 is fixed to the mount portion 51a. The movable blade holding portion 55 is provided swingably around a swing shaft 55J with respect to the mount portion 51a. The fixed blade holding portion 54 holds a fixed blade 54a, and the movable blade holding portion 55 holds a movable blade 55a. The fixed blade 54a and the movable blade 55a are collectively referred to as a "cutting blade 80".

4A and 4B, an anvil operation rod 56 is provided on each of the fixed side base 51A and the movable side base 51B of the anvil base 51 (the anvil operation rod 56 on the side of the movable side base 51B is not shown). An anvil operation rod 56 provided on the fixed base 51A vertically penetrates the fixed base 51A and is vertically movable. An anvil operating rod 56 provided on the movable base 51B vertically penetrates the movable base 51B and is vertically movable. Each anvil operating rod 56 has a lower end roller 57 on the lower end side and an upper end roller 58 on the upper end side. A lower end roller 57 of each anvil operating rod 56 is positioned above the operating plate 43 .

Each anvil operating rod 56 is positioned at the "lower position" by its own weight because the lower end roller 57 is not in contact with the operating plate 43 when the operating plate 43 is positioned at the lower "non-operating position" (Fig. 4A). On the other hand, when the operating plate 43 is positioned at the upper "operating position", the anvil operating rod 56 is pushed up by the operating plate 43 via the lower end roller 57 (arrow F2 shown in FIG. position” (Fig. 4B).

4A and 4B, the movable blade holding portion 55 of each anvil portion 52 is in contact with the upper end side roller 58 of the anvil operating rod 56 on the lower surface of the end opposite to the swing shaft 55J. Each movable blade holding portion 55 is pressed against the upper end roller 58 by an urging member such as a spring (not shown), and the movable blade holding portion 55 and the upper end roller 58 are always maintained in contact.

The movable blade holding part 55 is not pushed up by the anvil operating rod 56 when the anvil operating rod 56 is positioned at the "lower position", and is positioned at the "standby position" where the movable blade 55a is separated from the fixed blade 54a. (position shown in FIGS. 4A and 5A). On the other hand, when the anvil operating rod 56 is positioned at the "upper position", the movable blade holding portion 55 receives a push-up from the anvil operating rod 56 (arrow F3 shown in FIG. 5B), and moves the movable blade 55a over the fixed blade 54a. It moves (swings) to the "cutting position" positioned upward (the position shown in FIGS. 4B and 5B) (arrow F4 shown in FIG. 5B).

By the above operation, the anvil main body 23 can cut the lower end of the lead 2L and clinch the remaining lead.

The pair of anvil portions 52 described above are configured to be relatively movable as indicated by arrow A in FIG. Thereby, the distance between the cutting blade 80 of one anvil portion 52 and the cutting blade 80 of the other anvil portion 52 can be adjusted. That is, the anvil unit 15 has a first cutting blade 80 for clinching and cutting one lead 2L of the component 2 and a second cutting blade 80 for clinching and cutting the other lead 2L of the component 2. It has an interval adjuster (not shown) that adjusts the effective interval.

Lead scraps, which are the lower ends of the cut leads 2L, enter the aforementioned lead scrap guide pipe 73 (FIG. 2). Although not shown in FIGS. 4A, 4B, 5A, and 5B, an upstream opening of the lead waste guide pipe 73 is arranged directly below the cutting location by the fixed blade 54a and the movable blade 55a. The lead scraps are then guided to the lead scrap collection container 24 via the lead scrap guide pipe 73 . The lead scraps collected in the lead scrap collection container 24 are then discharged to the outside by the movement of the anvil unit 15 .

An example of a method of manufacturing a component-mounted board in which the component 2 is mounted on the board 3 using the component-mounting apparatus 1 having the configuration described above will be described with reference to FIGS. 6 and 7 to 10. FIG. FIG. 6 is a flow chart showing an example of a method for manufacturing a component-mounted board. 7 to 10 are schematic diagrams sequentially showing steps in manufacturing a component-mounted board according to the flow chart of FIG.

As shown in FIG. 6, first, the substrate 3 is positioned (step S1: "substrate positioning step"). Specifically, the substrate positioning part 10 shown in FIG. 1 is used to position the substrate 3 at a predetermined mounting position. FIG. 1 shows a state in which the board 3 is positioned at the mounting position.

Next, the swing head 12 picks up and holds the component 2 (step S2: "first component holding step"). Specifically, as shown in (a) to (c) of FIG. 7, when the radial type component 2 is supplied in a sideways posture, the side surface of the main body portion 2A of the component 2 is pushed into the swing nozzle of the swing head 12. Adsorption by 12A. The swing head 12 holds the part 2 while maintaining the sideways attitude of the part 2. - 特許庁In this way, the swing head 12 functions as a "first component holding section" that picks up and holds the component 2 lying sideways.

Next, the swing nozzle 12A is swung (step S3: "swing step"). Specifically, as shown in (d) of FIG. 7, the swing nozzle 12A is rotated in the R direction. As a result, the component 2 sucked and held by the swing nozzle 12A is swung in the R direction. This swing changes the posture of the component 2 from the lying posture (first posture) to the standing posture (second posture). In the lying posture, the leads 2L of the component 2 extend laterally, whereas in the standing posture, the leads 2L of the component 2 extend downward. Note that the swing step S3 is an example of a posture change step for changing the posture of the component 2 from the first posture to the second posture.

Next, the component 2 is delivered to the anvil unit 15 (step S4: "delivery step", "second component holding step"). Specifically, as shown in (a) of FIG. 8, the swing nozzle 12A holding the component 2 in the upright posture is moved above the anvil unit 15 in the XY direction. The anvil unit 15 is previously moved to a position away from the mounting position of the substrate 3 in the XY direction, so that the swing nozzle 12A can be accessed from above. The component 2 can be arranged between the pair of anvil portions 52 by widening the interval between the pair of anvil portions 52 by the interval adjusting portion of the anvil unit 15 .

After that, as shown in FIG. 8B, the swing nozzle 12A is lowered while the component 2 is maintained in the upright posture, and the body portion 2A of the component 2 is lowered to a position between the pair of anvil portions 52. As shown in FIG.

After that, as shown in (c) of FIG. 8, the gap between the pair of anvil parts 52 is narrowed by the gap adjusting part of the anvil unit 15, so that the side surface of the main body part 2A of the component 2 is sandwiched between the pair of anvil parts 52. Hold.

Thereafter, as shown in (d) of FIG. 8, the suction of the component 2 by the swing nozzle 12A is released, and the swing head 12 is raised and retracted.

In this way, the part 2 in the upright posture can be transferred from the swing head 12 to the anvil unit 15 . The anvil unit 15 functions as a "second component holding section" that holds the component 2 in the standing posture, which is the second posture.

Next, the body chuck 13 picks up and holds the component 2 (step S5: "third component holding step"). Specifically, as shown in (a) of FIG. 9 , the body chuck 13 is XY moved to above the anvil unit 15 holding the component 2 . After that, as shown in FIG. 9B, the body chuck 13 is lowered. After that, as shown in (c) of FIG. 9 , the body chuck 13 sandwiches the side surface of the main body 2A of the component 2 by reducing the interval between the body chucks 13 . After that, as shown in (d) of FIG. 9 , the gap between the pair of anvil parts 52 is widened by the gap adjusting part of the anvil unit 15 to release the component 2 from being held by the anvil unit 15 .

In this way, the part 2 in the upright posture can be transferred from the anvil unit 15 to the body chuck 13 . The body chuck 13 functions as a "third component holding section" that holds the component 2 in the standing posture, which is the second posture.

Next, the body chuck 13 inserts the component 2 into the board 3 (step S6: "insertion step"). Specifically, as shown in FIG. 10(a), the body chuck 13 holding the component 2 in the upright posture is XY moved to above the substrate 3 at the mounting position. After that, as shown in FIG. 10(b), the body chuck 13 is lowered and the leads 2L of the component 2 are inserted into the insertion holes 3a of the substrate 3. Then, as shown in FIG.

Next, the leads 2L of the component 2 are clinched and cut by the anvil unit 15 (step S7: "clinching step"). Specifically, the anvil unit 15 is moved in the XY direction to below the substrate 3 at the mounting position, and the two leads of the component 2 are clinched and cut by the cutting blade 80 of the anvil unit 15 . One of the leads 2L is clinched and cut by the first cutting blade 80, and the other lead 2L is clinched and cut by the second cutting blade 80. - 特許庁The specific method is the same as described with reference to FIGS. 4A to 5B, so the description is omitted.

By executing the steps S1 to S7 described above, a component-mounted board in which the component 2 is mounted on the board 3 can be manufactured. By sequentially executing steps S1 to S7 for each of the plurality of boards 3, component-mounted boards can be mass-produced.

According to the component mounting apparatus 1 and the component mounting board manufacturing method of the first embodiment described above, the component 2 can be mounted over a wide range on the board 3 . Specifically, when trying to mount the component 2 as it is on the substrate 3 using the swing head 12, due to the space constraint of the swing nozzle 12A holding the component 2, the area where the component 2 is already mounted may not be Part 2 may not be mounted. On the other hand, by changing the holding of the component 2 from the swing head 12 to the anvil unit 15 and then mounting it on the substrate 3, it is possible to avoid the space restriction due to the swing nozzle 12A, and the wide area on the substrate 3 can be removed. Component 2 can be mounted with

In Embodiment 1, the anvil unit 15 is used as the second component holding portion. As a result, there is no need to separately provide a dedicated configuration as the second component holding portion, which is a relay point for transferring the component 2 from the swing head 12, and the manufacturing cost of the component mounting apparatus 1 can be reduced.

Further, in Embodiment 1, when the component 2 is transferred to the anvil unit 15 in the second component holding step S4, the distance between the first cutting blade 80 and the second cutting blade 80 is reduced so that the pair of anvil portions 52 are separated. The part 2 is delivered by sandwiching the part 2 between the two. In this way, the part 2 can be easily held by sandwiching the part 2 by adjusting the gap between the cutting blades 80 by the gap adjusting section.

In FIG. 8 , the configuration in which the component 2 is sandwiched between the pair of anvil portions 52 is illustrated in a simplified manner, but a specific configuration will be described using FIG. 11 .

FIG. 11 is a schematic plan view showing a pair of anvil portions 52 and blocks 60A and 60B. As shown in FIG. 11, blocks 60A and 60B are attached to each of the anvil sections 52. As shown in FIG. Block 60A is a block attached to anvil portion 52 having first cutting edge 80 (here, referred to as first cutting edge 80A). The block 60B is a block attached to the anvil portion 52 having a second cutting edge 80 (here, referred to as a second cutting edge 80B). Each of the blocks 60A, 60B has opposing surfaces 62A, 62B facing each other. The component 2 is held by sandwiching the component 2 between the opposing surface 62A and the opposing surface 62B.

As shown in FIG. 11, in plan view, the B direction in which the movable blade 55a moves relative to the fixed blade 54a intersects with the A direction in which the pair of anvil portions 52 move relative to each other. In such a configuration, the facing surfaces 62A and 62B are both perpendicular to the A direction. According to such a configuration, compared to the case where the component 2 is sandwiched and held on the main body side of the anvil portion 52, the component 2 can be sandwiched and held with high accuracy. It should be noted that the opposing surfaces 62A and 62B do not need to be entirely perpendicular to the A direction, and at least a portion thereof may be perpendicular to the A direction.

(Embodiment 2)
A component mounting apparatus according to Embodiment 2 of the present invention will be described. Note that in the second embodiment, differences from the first embodiment will be mainly described, and descriptions overlapping with the first embodiment will be omitted.

In the first embodiment, the anvil unit 15 sandwiches and holds the part 2. In the second embodiment, the part 2 is held by placing it on the anvil unit. different from form 1 of

12A and 12B are respectively a schematic plan view and a schematic side view showing the anvil unit 102 in the component mounting apparatus of Embodiment 2. FIG.

As shown in FIGS. 12A and 12B, the anvil unit 102 includes a pair of anvil portions 52 and blocks 104A and 104B attached to each anvil portion 52. As shown in FIGS.

Blocks 104A and 104B have the same shape as blocks 60A and 60B shown in FIG. 11, and have lead holding holes 106A and 106B on the upper surface. The lead holding holes 106A and 106B are holes for accommodating and holding the leads 2L of the component 2. As shown in FIG. As shown in FIG. 12B, the swing head 12 holding the upright component 2 is lowered to insert the leads 2L of the component 2 into the lead holding holes 106A and 106B. As a result, the part 2 can be positioned and held on the blocks 104A and 104B. The component 2 placed on the blocks 104A and 104B is then picked up by the body chuck 13, which is the third component holding section, and mounted on the board 3. FIG.

The lead holding holes 106A and 106B are not limited to being provided in the blocks 104A and 104B.

(Embodiment 3)
A component mounting apparatus according to Embodiment 3 of the present invention will be described. It should be noted that in the third embodiment, differences from the first and second embodiments will be mainly described, and descriptions overlapping those of the first and second embodiments will be omitted.

In Embodiments 1 and 2, the anvil unit 15 is used as the second component holding portion, whereas in Embodiment 3, the feeder installation portion is used as the second component holding portion. Different from forms 1 and 2.

FIG. 13A is a schematic perspective view of a component mounting apparatus 202 according to Embodiment 3. FIG. FIG. 13B is a schematic diagram of the opening/closing section 204 provided in the component mounting apparatus 202. As shown in FIG.

As shown in FIG. 13A, the component mounting apparatus 202 is provided with a feeder installation section 204 . The feeder installation part 204 is a part in which a feeder (not shown) containing a plurality of components 2 can be installed. The feeder installation section 204 is provided with an opening/closing section 206 that can be opened and closed to receive and hold the component 2 in the standing posture from the swing head 12 .

As shown in FIG. 13B, the opening/closing portion 206 is connected to an air cylinder 208 and configured to be openable and closable in the C direction by driving the air cylinder 208 . In such a configuration, with the opening/closing portion 206 opened, the swing head 12 as the first component holding portion descends while holding the component 2 in the standing posture, and the component 2 is placed between the opening/closing portions 206. Let After that, the air cylinder 208 is driven to narrow the gap between the opening/closing parts 206 , so that the parts 2 are sandwiched between the opening/closing parts 206 . Thereafter, the suction by the swing head 12 is released, and the swing head 12 is raised and retracted. The component 2 held by the opening/closing portion 206 is picked up by the body chuck 13 as the third component holding portion and mounted on the substrate 3 .

In this manner, the feeder installation section 204 can be used as a second component holding section for holding the component 2 in the upright posture, in addition to the anvil unit 15 .

(Embodiment 4)
A component mounting apparatus according to Embodiment 4 of the present invention will be described. It should be noted that in the fourth embodiment, differences from the first to third embodiments will be mainly described, and descriptions overlapping those of the first to third embodiments will be omitted.

In Embodiments 1 and 2, the anvil unit 15 is used as the second component holding portion, whereas in Embodiment 4, a tray plate is used as the second component holding portion. Different from 1 and 2.

FIG. 14A is a schematic perspective view of tray supply unit 302 and tray plate 304 of Embodiment 4. FIG. FIG. 14B is a schematic diagram of tray plate 304 .

A tray supply unit 302 shown in FIG. 14A is a unit for supplying components 2 by a tray plate 304 . The tray plate 304 is a plate on which a plurality of components 2 can be arranged. On the upper surface of the tray plate 304, a plurality of parts 2 in a sideways posture that cannot stand on their own are placed (not shown).

As shown in FIG. 14A, the tray plate 304 is exposed to the outside by moving the tray plate 304 in the retracted position in the direction D1 and then in the direction D2. A configuration of a component mounting apparatus such as the swing head 12 becomes accessible to the plurality of components 2 placed on the upper surface of the tray plate 304, and the components 2 can be supplied.

As shown in FIG. 14B, the tray plate 304 is provided with a component holding portion 306 . The component holding portion 306 is a member that serves as a relay point for temporarily transferring and holding the component 2 from the swing head 12 that is the first component holding portion. In the example shown in FIG. 14B, the component holding portion 306 is a cylindrical member that opens upward on the upper surface of the tray plate 304 .

FIG. 14C shows a state in which the component 2 is arranged and held in the component holding portion 306 . As shown in FIG. 14C , the swing head 12 holding the component 2 in the upright posture is lowered to place the component 2 in the component holding portion 306 . Thereby, the component 2 can be held in a state where the component 2 is positioned in the component holding portion 306 . The component 2 held by the component holding section 306 is then picked up by the body chuck 13 as the third component holding section and mounted on the board 3 .

In this manner, the tray plate 304 can be used as a second component holding portion for holding the component 2 in the upright posture in addition to the anvil unit 15 .

(Embodiment 5)
A component mounting apparatus according to Embodiment 5 of the present invention will be described. In the fifth embodiment, differences from the first to fourth embodiments will be mainly described, and descriptions duplicated with the first to fourth embodiments will be omitted.

In Embodiments 1 and 2, the anvil unit 15 is used as the second component holding portion, whereas in Embodiment 5, the nozzle changer 402 is used as the second component holding portion. Different from forms 1 and 2.

FIG. 15A is a schematic perspective view of the nozzle changer 402 of Embodiment 5. FIG. A nozzle changer 402 shown in FIG. 15A is a member for exchanging nozzles used in a component mounting apparatus, such as the suction nozzle at the tip of the swing nozzle 12A described above. As shown in FIG. 15A, nozzle changer 402 includes fixed plate 404 and movable plate 406 .

A fixed plate 404 is a plate for accommodating a plurality of nozzles 412 . A plurality of holes 408 are formed in the upper surface of the fixing plate 404 . FIG. 15A shows a state in which a plurality of nozzles 412 are accommodated in a portion of the plurality of holes 408. FIG. Movable plate 406 is a plate disposed above fixed plate 404 in a laterally movable manner relative to fixed plate 404 .

Of the plurality of holes 408 provided in the fixed plate 404, the hole 410 located at the end as shown in FIG. 15A is not used as a holding hole for the nozzle 412, and the nozzle 412 is not arranged. In Embodiment 5, such a hole 410 is used as a second component holding portion for transferring the component 2 from the swing head 12. As shown in FIG.

Specifically, FIG. 15B shows a state where the component 2 is placed in the hole 410 . As shown in FIG. 15B, the swing head 12 holding the component 2 in the standing posture is lowered to place the component 2 in the hole 410 . In this state, the movable plate 406 is moved laterally with respect to the fixed plate 404 to hold the component 2 by the movable plate 406 . In this way the part 2 can be held in place in the hole 410 .

As described above, in addition to the anvil unit 15, the nozzle changer 402 can be used as a second component holder that holds the component 2 in the standing posture.

Although the present invention has been described above with reference to the first to fifth embodiments, the present invention is not limited to the first to fifth embodiments. For example, in Embodiments 1 to 5, the case where the swing nozzle 12A is used as the swing mechanism of the swing head 12 has been described, but the present invention is not limited to such a case. Any swing mechanism, such as a swing chuck that clamps and grips the component 2, may be used. Alternatively, any mechanism other than the swing mechanism may be used as long as it can change the orientation of the component 2 . By using the swing mechanism, the posture of the component 2 can be easily changed.

Further, in Embodiments 1 to 5, the case where the third component holding portion is the body chuck 13 has been described, but the present invention is not limited to such a case. Any configuration may be used as long as the components 2 in the upright posture can be picked up, held, and mounted on the substrate 3 . Also, the same swing head 12 as that of the first component holding portion may be used as the third component holding portion. That is, the first component holding portion and the third component holding portion may be the same.

Further, in Embodiments 1 to 5, the case where a radial type component is used as the component 2 has been described, but the present invention is not limited to such a case. Any type of component may be used as long as it is supplied in a lying position.

Although the present disclosure has been fully described in connection with preferred embodiments and with reference to the accompanying drawings, various variations and modifications will become apparent to those skilled in the art. Such variations and modifications are to be included therein insofar as they do not depart from the scope of the present disclosure by the appended claims. Also, combinations and order changes of elements in each embodiment can be implemented without departing from the scope and spirit of the present disclosure.

By appropriately combining any of the various modifications of the above-described embodiment, it is possible to obtain the respective effects.

INDUSTRIAL APPLICABILITY The present invention is applicable to a component mounting apparatus and a manufacturing method of a component mounting board using the same.

1 component mounting apparatus 2 component 2A component main body 2L lead 3 substrate 3a insertion hole 10 substrate positioning unit 11 first moving mechanism 12 swing head 12A swing nozzle 13 body chuck 13a pickup claw 14 second moving mechanism 15 anvil unit 16 display unit 21 Control unit 23 Anvil main unit 24 Lead waste collection container 51 Anvil base 51a Mount unit 51A Fixed side base 51B Movable side base 52 Anvil portion 54 Fixed blade holding portion 54a Fixed blade 55 Movable blade holding portion 55a Movable blade 55J Swing shaft 56 Anvil Operating rod 57 Lower end roller 58 Upper end roller 60A, 60B Blocks 62A, 62B Opposing surface 73 Lead scrap guide pipe 74 Downstream opening 75 Through holes 80, 80A, 80B Cutting blade 102 Anvil unit 104A, 104B Blocks 106A, 106B Lead holding Hole 202 Component mounting device 204 Feeder installation section 206 Opening/closing section 208 Air cylinder 302 Tray supply unit 304 Tray plate 306 Component holding section 402 Nozzle changer 404 Fixed plate 406 Movable plate 408 Hole 410 Hole 412 Nozzle

Claims (10)

a first component holding unit having a posture changing mechanism that picks up and holds a component with leads in a first posture and changes the held component from the first posture to a second posture;
a second component holding unit that receives the component in the second posture from the first component holding unit and holds the component;
a third component holding unit that picks up and holds the component held by the second component holding unit and inserts the lead of the held component into an insertion hole of a substrate ;
The component mounting apparatus according to claim 1, wherein the second component holding section is an anvil unit for clinching the lead inserted into the substrate . The anvil unit includes a first cutting blade for clinching and cutting a first lead of the component, a second cutting blade for clinching and cutting a second lead of the component, and the first cutting. A spacing adjustment unit that adjusts the spacing between the blade and the second cutting blade,
2. The component mounting apparatus according to claim 1 , wherein said component held by said first component holding portion is held by said anvil unit by reducing said space by said space adjusting portion. The anvil unit further comprises a first block attached to the first cutting edge side and a second block attached to the second cutting edge side,
The first block and the second block each have opposing surfaces that face each other, and the opposing surfaces are aligned in a direction in which the first cutting blade and the second cutting blade move relative to each other. 3. The component mounting apparatus according to claim 2 , having a vertical surface. 4. The apparatus according to any one of claims 1 to 3 , wherein said first posture is a posture in which leads of said component extend sideways, and said second posture is a posture in which leads of said component extend downward. component mounting equipment. 5. The component mounting apparatus according to any one of claims 1 to 4 , wherein said posture changing mechanism of said first component holding section is a swing mechanism for swinging said component. a first component holding step of picking up and holding a component with leads in a first posture by a first component holding section;
a posture changing step of changing the component held in the first component holding step from the first posture to a second posture by a posture changing mechanism of the first component holding section;
a second component holding step of transferring and holding the component in the second posture to the second component holding portion by the first component holding portion;
a third component holding step of picking up and holding the component held by the second component holding portion by a third component holding portion;
an inserting step of inserting the lead of the component held in the third component holding step into an insertion hole of a substrate by the third component holding portion;
a clinching step of clinching the lead of the component inserted by the inserting step with an anvil unit ;
The method of manufacturing a component-mounted board, wherein the anvil unit is the second component holding portion . In the clinching step, the first cutting blade of the anvil unit clinch and cut the first lead of the component, and the second cutting blade of the anvil unit clinch the second lead of the component. to disconnect,
In the second component holding step, the component is sandwiched between the anvil unit by reducing the distance between the first cutting blade and the second cutting blade, so that the component is delivered to and held by the anvil unit. 7. The method of manufacturing a component mounting board according to claim 6 , wherein The second component holding step includes transferring the component to the anvil unit by sandwiching the component between opposing surfaces of a pair of blocks provided on the anvil unit,
8. The method of manufacturing a component mounting board according to claim 7 , wherein said facing surface has a surface perpendicular to a direction in which said first cutting blade and said second cutting blade move relative to each other. 9. A device according to any one of claims 6 to 8 , wherein said first posture is a posture in which leads of said component extend sideways, and said second posture is a posture in which leads of said component extend downward. manufacturing method of the component mounting board. 10. The method of manufacturing a component-mounted board according to claim 6 , wherein said posture changing step changes the posture of said component by swinging said component.

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