JP2021005695A - Component mounting device and manufacturing method of component mounting board using the same - Google Patents

Abstract

To provide a component mounting device and a manufacturing method of a component mounting board using the same that allows a wide range of components to be mounted on a board.SOLUTION: A component mounting device includes a first component holding unit having a posture changing mechanism that picks up and holds a component with a lead in the first posture and changes the held component from the first posture to a second posture, a second component holding unit that delivers the component in the second posture from the first component holding unit, and holds the component, and a third component holding unit that picks up and hold the component held by the second component holding unit, and inserts the lead of the held component into an insertion hole of a board.SELECTED DRAWING: Figure 1

Description

The present invention relates to a component mounting device and a method for manufacturing a component mounting board using the component mounting device.

In the component mounting line where electronic components are mounted on a board to produce an electronic board, various types of components are mounted on the board. In addition to surface-mounted parts such as small chip-type parts and QFPs that are solder-bonded to the electrode surface of the circuit board, these parts also have protruding leads for connection such as power transistors and connector parts, and the circuit board. There is an insertion component that is mounted by inserting a lead into the mounting hole formed in. The supply form of such an inserted component varies depending on the type of component. The supply posture of parts differs depending on the type of parts, such as when the parts are stored in a tray and supplied in a sideways posture, or when a plurality of electronic parts are connected by taping and supplied in a vertical posture.

When the inserted parts are supplied in the sideways posture, it is necessary to change the inserted parts to the upright posture prior to mounting on the board. Therefore, a component mounting device having a function of changing an inserted component in a sideways posture to an upright posture has been proposed (see, for example, Patent Document 1).

The component mounting device described in Patent Document 1 includes a mounting head for mounting the component on a substrate, and the mounting head has a nozzle for sucking and holding the component and a swing mechanism for swinging the nozzle. The part in the sideways posture is held by the nozzle, and the nozzle is swung to change the part to the upright posture. After that, by moving the mounting head, the lead of the component changed to the standing posture is aligned with the insertion hole of the substrate into which the lead is inserted. Then, the upright component is pushed toward the board to insert the lead into the insertion hole of the board.

JP-A-2017-34048

However, according to the above method, when the nozzle itself for adsorbing the component is turned sideways and brought close to the surface of the substrate, the nozzle and the component interfere with each other in the area where the component is already on the substrate, so that the component is mounted. I can't. As described above, there is a problem that the area on which the component can be mounted is limited.

Therefore, an object of the present invention is to provide a component mounting device capable of mounting a component on a wide range on a substrate and a method for manufacturing a component mounting substrate using the component mounting device in order to solve the above problems. ..

In order to achieve the above object, the component mounting device of the present invention picks up and holds the leaded component in the first posture, and changes the held component from the first posture to the second posture. A first component holding unit having a posture changing mechanism, a second component holding unit that receives the component in the second posture from the first component holding unit and holds the component, and the second component holding unit. The component holding unit includes a third component holding unit that picks up and holds the component held by the component holding unit and inserts the lead of the held component into the insertion hole of the substrate.

Further, the method for manufacturing a component mounting board of the present invention includes a first component holding step of picking up and holding a leaded component in a first posture by a first component holding unit, and the first component holding unit. The posture changing step of changing the part held in the first component holding step from the first posture to the second posture by the posture changing mechanism, and the second posture by the first component holding portion. The second component holding step of delivering and holding the component to the second component holding portion and the third component holding section pick up and hold the component held by the second component holding section. The three component holding step includes an insertion step of inserting the lead of the component held in the third component holding step into the insertion hole of the substrate by the third component holding portion.

According to the present invention, components can be mounted on a wide range on a substrate.

Schematic perspective view of the component mounting device of the first embodiment Schematic perspective of the anvil unit Schematic perspective view of the anvil body Schematic perspective view (standby position, non-cutting position) for explaining the method of cutting and clinching the lead by the anvil unit. Schematic perspective view (operating position, cutting position) for explaining the method of cutting and clinching the lead by the anvil unit. Schematic perspective view (standby position, non-cutting position) for explaining the method of cutting and clinching the lead by the anvil unit. Schematic perspective view (operating position, cutting position) for explaining the method of cutting and clinching the lead by the anvil unit. A flowchart showing an example of a method of manufacturing a component mounting board using the component mounting device of the first embodiment. Schematic diagram showing each process in order when the component mounting board is manufactured according to the flowchart of FIG. Schematic diagram showing each process in order when the component mounting board is manufactured according to the flowchart of FIG. Schematic diagram showing each process in order when the component mounting board is manufactured according to the flowchart of FIG. Schematic diagram showing each process in order when the component mounting board is manufactured according to the flowchart of FIG. Schematic plan view showing a pair of anvil sections and blocks Schematic plan view showing the anvil unit of the second embodiment Schematic side view showing the anvil unit of the second embodiment Schematic perspective view of the component mounting device according to the third embodiment Schematic diagram of the opening / closing part provided in the component mounting device of the third embodiment. Schematic perspective view of the tray supply unit and the tray plate of the fourth embodiment. Schematic diagram of the tray plate of the fourth embodiment The figure which shows the state which delivered and held the part to the part holding part of the tray plate of Embodiment 4. Schematic perspective view of the nozzle changer of the fifth embodiment The figure which shows the state which arranged the component in the hole of the nozzle changer of Embodiment 5.

According to the first aspect of the present invention, there is a posture changing mechanism for picking up and holding a leaded component in a first posture and changing the held component from the first posture to a second posture. The part holding part 1 and the part in the second posture are delivered from the first part holding part, and the second part holding part holding the part and the second part holding part hold the part. Provided is a component mounting device including a third component holding portion for picking up and holding the component, and inserting a lead of the held component into an insertion hole of a substrate.

According to such a configuration, by switching from the first component holding unit to another component holding unit and then mounting the component on the board, it is possible to avoid space restrictions due to the posture changing mechanism. , Parts can be mounted over a wide range on the board.

According to the second aspect of the present invention, the second component holding unit provides the component mounting device according to the first aspect, which is an anvil unit that clinches the lead inserted into the substrate. According to such a configuration, by using the anvil unit as the second component holding unit, it is not necessary to provide a dedicated configuration as the second component holding unit, and the manufacturing cost of the component mounting device can be reduced. ..

According to a third aspect of the present invention, the anvil unit has a first cutting blade that clinches and cuts a first lead of the part and a second cutting blade that clinches and cuts a second lead of the part. A cutting blade, and an interval adjusting unit for adjusting the interval between the first cutting blade and the second cutting blade are provided, and the interval is reduced by the interval adjusting unit to hold the first component. The component mounting device according to a second aspect, wherein the component held in the unit is sandwiched between the anvil units and the component is held. According to such a configuration, by making the distance between the first cutting blade and the second cutting blade adjustable, the leads can be cut at an appropriate position according to the distance between the two leads. In addition, the parts can be easily held by sandwiching the parts by adjusting the intervals by the interval adjusting unit.

According to a fourth aspect of the present invention, the anvil unit further comprises a first block attached to the first cutting blade side and a second block attached to the second cutting blade side. The first block and the second block each have facing surfaces facing each other, and both the first cutting blade and the second cutting blade move relative to each other on the facing surfaces. The component mounting apparatus according to a third aspect, which has a plane perpendicular to the direction, is provided. By providing a block having such a facing surface, the parts can be more reliably sandwiched and held.

According to the fifth aspect of the present invention, the first posture is a posture in which the leads of the parts extend laterally, and the second posture is a posture in which the leads of the parts extend downward. A component mounting device according to any one of aspects 4 to 4 is provided. According to such a configuration, the component can be mounted on the substrate after changing the posture in which the lead of the component cannot be inserted into the insertion hole of the substrate to the posture in which the component can be inserted.

According to the sixth aspect of the present invention, the component according to any one of the first to fifth aspects, wherein the posture changing mechanism of the first component holding portion is a swing mechanism for swinging the component. A mounting device is provided. According to such a configuration, the posture of the component can be easily changed.

According to the seventh aspect of the present invention, the first component holding step picks up and holds the leaded component in the first posture by the first component holding portion, and the posture change of the first component holding portion. The posture changing step of changing the part held in the first component holding step from the first posture to the second posture by the mechanism, and the posture changing portion in the second posture by the first component holding portion. A third component holding step in which a component is delivered to and held by a second component holding portion and a third component holding section that picks up and holds the component held by the second component holding portion by the third component holding portion. Provided is a method for manufacturing a component mounting substrate, which includes a step and an insertion step of inserting a lead of the component held in the third component holding step into an insertion hole of the substrate by the third component holding unit.

According to such a method, the same effect as that of the component mounting device of the first aspect can be obtained.

According to an eighth aspect of the present invention, the seventh aspect includes a clinch step in which the lead of the component inserted by the insertion step is clinched by the anvil unit, and the anvil unit is the second component holding portion. A method for manufacturing a component mounting substrate according to an embodiment is provided. According to such a method, the same effect as that of the component mounting device of the second aspect can be obtained.

According to the ninth aspect of the present invention, the clinch step clinches and cuts the first lead of the part by the first cutting blade of the anvil unit, and by the second cutting blade of the anvil unit. , The second lead of the part is clinched and cut, and the second part holding step reduces the distance between the first cutting blade and the second cutting blade to cut the part into the anvil unit. The method for manufacturing a component mounting substrate according to an eighth aspect is provided, wherein the component is delivered to and held by the anvil unit by being sandwiched between the two. According to such a method, the same effect as that of the component mounting device of the third aspect can be obtained.

According to the tenth aspect of the present invention, in the second component holding step, the component is delivered to the anvil unit by sandwiching the component between facing surfaces of a pair of blocks provided in the anvil unit, and the component is delivered to the anvil unit. The method for manufacturing a component mounting substrate according to a ninth aspect is provided, wherein the surface has a surface perpendicular to the direction in which the first cutting blade and the second cutting blade move relatively. According to such a method, the same effect as that of the component mounting device of the fourth aspect can be obtained.

According to the eleventh aspect of the present invention, the first posture is a posture in which the lead of the component extends laterally, and the second posture is a posture in which the lead of the component extends downward. A method for manufacturing a component mounting substrate according to any one of aspects 10 to 10. According to such a method, the same effect as that of the component mounting device of the fifth aspect can be obtained.

According to the twelfth aspect of the present invention, the posture changing step changes the posture of the component by swinging the component, according to any one of the seventh to eleventh aspects of the component mounting substrate. Provide a manufacturing method. According to such a method, the same effect as that of the component mounting device of the sixth aspect can be obtained.

Hereinafter, an exemplary embodiment of the component mounting apparatus according to the present invention and the method for manufacturing a component mounting substrate using the same will be described with reference to the accompanying drawings. The present invention is not limited to the specific configuration of the following embodiments, and the present invention includes configurations based on the same technical idea.

(Embodiment 1)
First, the component mounting device according to the first embodiment of the present invention will be described with reference to FIG.

The component mounting device 1 shown in FIG. 1 is a device for mounting and mounting a component 2 with a lead having two leads 2L extending downward on a substrate 3. The board 3 on which the component 2 is mounted becomes a "component mounting board". Hereinafter, the horizontal direction, which is the transport direction of the substrate 3, is defined as the X direction, the direction orthogonal to the X direction in the horizontal plane is defined as the Y direction, and the direction perpendicular to the XY plane, that is, the vertical direction is defined as the Z direction. The X direction and the Y direction are not limited to orthogonal directions, and may be directions that intersect each other.

The component mounting device 1 includes a board positioning unit 10, a first moving mechanism 11, a swing head 12, a body chuck 13, a second moving mechanism 14, an anvil unit 15, and a control unit 21.

The board positioning unit 10 is a member that positions the board 3 at a predetermined mounting position. The mounting position of the board 3 is programmed in the control unit 21 in advance. The substrate positioning unit 10 of the first embodiment is composed of a pair of conveyor mechanisms, supports both ends of the substrate 3 from below, conveys them in the X direction, and positions them at the mounting position. The substrate 3 is provided with an insertion hole 3a for inserting the lead 2L of the component 2.

The first moving mechanism 11 is a mechanism for integrally moving the swing head 12 and the body chuck 13. The first moving mechanism 11 of the first embodiment integrally moves the swing head 12 and the body chuck 13 in the X direction and the Y direction as indicated by arrows X1 and Y1. The swing head 12 and the body chuck 13 are not limited to moving integrally, and may move independently of each other.

The swing head 12 is a member having a swing nozzle 12A for sucking and holding the component 2. The swing nozzle 12A is a suction nozzle that sucks the component 2 by a negative pressure. The swing head 12 has a built-in swing mechanism (not shown) that swings the swing nozzle 12A in, for example, the R direction. The swing mechanism changes the posture of the component 2 attracted by the swing nozzle 12A by swinging the swing nozzle 12A. The swing mechanism is an example of a posture changing mechanism that changes the posture of the component 2 from the first posture to the second posture.

The body chuck 13 is a member including a pair of pickup claws 13a for sandwiching and holding the component 2. As shown by the arrow Z1, the body chuck 13 has a built-in drive mechanism (not shown) for moving the pickup claw 13a in the Z direction.

The swing head 12 and the body chuck 13 described above are arranged above the substrate positioning portion 10.

The second moving mechanism 14 is a mechanism for moving the anvil unit 15. The second moving mechanism 14 of the first embodiment is composed of an orthogonal coordinate table, and moves the attachment member 14T for attaching the anvil unit 15 in the horizontal direction and the vertical direction. The configuration of the second moving mechanism 14 and the attachment member 14T is shown in a greatly simplified manner.

The anvil unit 15 is a mechanism for cutting and clinching the lead 2L protruding from the insertion hole 3a of the substrate 3 toward the lower surface side of the substrate 3. The anvil unit 15 is arranged below the substrate positioning unit 10. The anvil unit 15 is moved in the X direction, the Y direction, and the Z direction by the second moving mechanism 14, as indicated by arrows X2, Y2, and Z2.

As shown in FIG. 1, the anvil unit 15 includes an anvil main body 23 and a lead waste collecting container 24. An enlarged perspective view of the anvil unit 15 is shown in FIG.

The anvil main body 23 shown in FIG. 2 is a unit that cuts the lower end of the lead 2L protruding toward the lower surface side of the substrate 3 and clinches the remaining lead. The anvil main body 23 is provided with a cutting blade 80 (not shown), which will be described later. The anvil body 23 is attached to the attachment member 14T described above (not shown). The lead waste collecting container 24 is a container for collecting lead waste which is the lower end portion of the lead 2L cut by the anvil main body 23. The lead waste collecting container 24 is fixed to the anvil main body 23 by a fixing means such as a screw (not shown).

A lead waste guide pipe 73 is provided in the anvil main body 23. The lead waste guiding pipe 73 is a pipe that guides the lead waste generated in the anvil main body 23 to the lead waste collecting container 24. The upstream opening (not shown) of the lead waste guiding pipe 73 is arranged inside the anvil main body 23, and the downstream opening 74 of the lead waste guiding pipe 73 is arranged above the lead waste collecting container 24. The lead waste guiding pipe 73 is fixed to the anvil main body 23 in the same manner as the lead waste collecting container 24.

Returning to FIG. 1, the control unit 21 is a member that controls the operation of each component of the component mounting device 1. The control unit 21 is electrically connected to each component of the component mounting device 1 via wiring or the like. The control unit 21 is composed of, for example, a microcomputer.

Next, FIG. 3 shows a configuration in which the lead 2L is cut and clinched in the anvil unit 15 shown in FIGS. 1 and 2.

FIG. 3 is a schematic perspective view of the anvil main body 23. As shown in FIG. 3, the anvil main body portion 23 of the first embodiment is composed of a pair of anvil portions 52. Each of the anvil portions 52 includes an anvil base 51, a mount portion 51a, a fixed blade holding portion 54, a movable blade holding portion 55, a swing shaft 55J, an anvil operating rod 56, a lower end roller 57, and an upper end. It is provided with a side roller 58. A through hole 75 is formed in the mount portion 51a, and the through hole 75 is a hole for inserting and holding the lead waste guide pipe 73 (not shown) described above.

A method of cutting and clinching the lead 2L using such a configuration will be described with reference to FIGS. 4A, 4B, 5A, and 5B. 4A, 4B, 5A, and 5B are schematic perspective views for explaining a method of cutting and clinching the lead 2L by the anvil main body 23, respectively.

4A and 5A correspond to the "standby position" and "non-cutting position" described later, and FIGS. 4B and 5B correspond to the "operating position" and "cutting position" described later. In FIGS. 4A, 4B, 5A, and 5B, the configuration is simplified by omitting the illustration of the through hole 75 for holding the lead waste guide pipe 73.

In FIGS. 4A, 4B, 5A, and 5B, the anvil base 51 is supported in a horizontal posture by a support column (not shown) and is located above the operation plate 43. The operation plate 43 is a plate-shaped member that supports the lower end side roller 57, and can be moved in the vertical direction by a drive source (not shown). The operation plate 43 is attached to the attachment member 14T described above (not shown). The anvil base 51 includes a fixed side base 51A and a movable side base 51B. The fixed-side base 51A has a structure in which it is fixed without moving in the horizontal direction, whereas the movable-side base 51B is movable in the horizontal direction along the movement guide 53. The movement guide 53 is also attached to the attachment member 14T in the same manner as the operation plate 43 (not shown). When the movable base 51B moves along the movement guide 53, the distance between the movable base 51B and the fixed base 51A changes.

In FIGS. 4A, 4B, 5A, and 5B, the fixed side base 51A and the movable side base 51B each have a mounting portion 51a protruding upward. Anvil portion 52 is provided on each mount portion 51a. In FIGS. 5A and 5B, each anvil portion 52 includes a fixed blade holding portion 54 and a movable blade holding portion 55. The fixed blade holding portion 54 is fixedly provided to the mount portion 51a. The movable blade holding portion 55 is provided swingably around the swing shaft 55J with respect to the mount portion 51a. The fixed blade 54a is held by the fixed blade holding portion 54, and the movable blade 55a is held by the movable blade holding portion 55. The fixed blade 54a and the movable blade 55a are collectively referred to as a "cutting blade 80".

In FIGS. 4A and 4B, an anvil operation rod 56 is provided on each of the fixed side base 51A and the movable side base 51B of the anvil base 51 (the anvil operation rod 56 on the movable side base 51B side is not shown). The anvil operation rod 56 provided on the fixed side base 51A penetrates the fixed side base 51A in the vertical direction and is movable in the vertical direction. The anvil operation rod 56 provided on the movable base 51B penetrates the movable base 51B in the vertical direction and is movable in the vertical direction. Each anvil operation rod 56 has a lower end side roller 57 on the lower end side and an upper end side roller 58 on the upper end side. The lower end side roller 57 of each anvil operation rod 56 is located above the operation plate 43.

When the operation plate 43 is located in the lower "non-operation position", the lower end side roller 57 is not in contact with the operation plate 43, and each anvil operation rod 56 is located in the "lower position" by its own weight (FIG. 4A). On the other hand, when the operation plate 43 is located at the upper "operation position", the anvil operation rod 56 is pushed up by the operation plate 43 via the lower end side roller 57 (arrow F2 shown in FIG. 4B), and "upward". It is located in "position" (Fig. 4B).

In FIGS. 4A and 4B, the movable blade holding portion 55 of each anvil portion 52 is in contact with the upper end side roller 58 of the anvil operation rod 56 on the lower surface of the end portion opposite to the swing shaft 55J. Each movable blade holding portion 55 is pressed against the upper end side roller 58 by an urging member such as a spring (not shown), and the movable blade holding portion 55 and the upper end side roller 58 are always maintained in contact with each other.

When the anvil operating rod 56 is located in the "lower position", the movable blade holding portion 55 is not pushed up by the anvil operating rod 56 and is positioned in the "standby position" in which the movable blade 55a is separated from the fixed blade 54a. (Positions shown in FIGS. 4A and 5A). On the other hand, the movable blade holding portion 55 receives the push-up from the anvil operating rod 56 (arrow F3 shown in FIG. 5B) when the anvil operating rod 56 is positioned in the “upper position”, and the movable blade 55a is fixed to the fixed blade 54a. It moves (swings) to the "cut position" (position shown in FIGS. 4B and 5B) positioned above (arrow F4 shown in FIG. 5B).

By the above operation, the anvil main body 23 can cut the lower end of the lead 2L and clinch the remaining lead.

The pair of anvil portions 52 described above are configured to be relatively movable as shown by an arrow A in FIG. As a result, the distance between the cutting blade 80 of one anvil portion 52 and the cutting blade 80 of the other anvil portion 52 can be adjusted. That is, the anvil unit 15 is relative to the first cutting blade 80 that clinches and cuts one lead 2L of the part 2 and the second cutting blade 80 that clinches and cuts the other lead 2L of the part 2. It has an interval adjusting unit (not shown) for adjusting a specific interval.

The lead waste, which is the lower end of the cut lead 2L, enters the lead waste guide pipe 73 (FIG. 2) described above. Although not shown in FIGS. 4A, 4B, 5A, and 5B, an opening on the upstream side of the lead waste guide pipe 73 is arranged directly below the cutting portion by the fixed blade 54a and the movable blade 55a. The reed waste is then guided to the reed waste collecting container 24 via the reed waste guiding pipe 73. The reed waste collected in the reed waste collection container 24 is then discharged to the outside by the movement of the anvil unit 15.

An example of a method of manufacturing a component mounting board in which the component 2 is mounted on the board 3 by using the component mounting device 1 having the above-described configuration will be described with reference to FIGS. 6 and 7 to 10. FIG. 6 is a flowchart showing an example of a method of manufacturing a component mounting board. 7 to 10 are schematic views showing in order each process in the case of manufacturing a component mounting substrate according to the flowchart of FIG.

As shown in FIG. 6, first, the substrate 3 is positioned (step S1: “board positioning step”). Specifically, the substrate positioning unit 10 shown in FIG. 1 is used to position the substrate 3 at a predetermined mounting position. FIG. 1 shows a state in which the substrate 3 is positioned at the mounting position.

Next, the swing head 12 picks up and holds the component 2 (step S2: “first component holding step”). Specifically, as shown in FIGS. 7A to 7C, when the radial type component 2 is supplied in a sideways posture, the side surface of the main body 2A of the component 2 is a swing nozzle of the swing head 12. Adsorbed by 12A. The swing head 12 holds the component 2 while maintaining the sideways posture of the component 2. In this way, the swing head 12 functions as a "first component holding portion" that picks up and holds the component 2 in the sideways posture.

Next, the swing nozzle 12A is swung (step S3: "swing step"). Specifically, as shown in FIG. 7D, the swing nozzle 12A is rotated in the R direction. As a result, the component 2 attracted and held by the swing nozzle 12A is swung in the R direction. By the swing, the posture of the component 2 is changed from the sideways posture (first posture) to the standing posture (second posture). In the sideways posture, the lead 2L of the component 2 extends in the lateral direction, whereas in the standing posture, the lead 2L of the component 2 extends downward. The swing step S3 is an example of a posture changing step of changing the posture of the component 2 from the first posture to the second posture.

Next, the component 2 is delivered to the anvil unit 15 (step S4: “delivery step”, “second component holding step”). Specifically, as shown in FIG. 8A, the swing nozzle 12A holding the component 2 in the standing posture is XY-moved above the anvil unit 15. The anvil unit 15 has been moved in advance to a position distant from the mounting position of the substrate 3 in the XY directions, and the swing nozzle 12A can be accessed from above. By widening the distance between the pair of anvil portions 52 by the interval adjusting portion of the anvil unit 15, the component 2 can be arranged between the pair of anvil portions 52.

After that, as shown in FIG. 8B, the swing nozzle 12A is lowered while maintaining the standing posture of the component 2, and the main body portion 2A of the component 2 is lowered to a position between the pair of anvil portions 52.

After that, as shown in FIG. 8C, by narrowing the distance between the pair of anvil portions 52 by the spacing adjusting portion of the anvil unit 15, the pair of anvil portions 52 sandwich the side surface of the main body portion 2A of the component 2. Hold.

After that, as shown in FIG. 8D, the suction of the component 2 by the swing nozzle 12A is released, and the swing head 12 is raised and retracted.

In this way, the component 2 in the standing posture can be delivered from the swing head 12 to the anvil unit 15. The anvil unit 15 functions as a "second component holding unit" that holds the component 2 in the standing posture, which is the second posture.

Next, the body chuck 13 picks up and holds the component 2 (step S5: “third component holding step”). Specifically, as shown in FIG. 9A, the body chuck 13 is XY-moved above the anvil unit 15 holding the component 2. After that, as shown in FIG. 9B, the body chuck 13 is lowered. After that, as shown in FIG. 9C, the side surface of the main body 2A of the component 2 is sandwiched between the body chucks 13 by reducing the distance between the body chucks 13. After that, as shown in FIG. 9D, the interval adjusting portion of the anvil unit 15 widens the interval between the pair of anvil portions 52, whereby the holding of the component 2 by the anvil unit 15 is released.

In this way, the component 2 in the standing posture can be delivered from the anvil unit 15 to the body chuck 13. The body chuck 13 functions as a "third component holding portion" that holds the component 2 in the standing posture, which is the second posture.

Next, the component 2 is inserted into the substrate 3 by the body chuck 13 (step S6: “insertion step”). Specifically, as shown in FIG. 10A, the body chuck 13 holding the component 2 in the upright posture is XY-moved to above the substrate 3 at the mounting position. After that, as shown in FIG. 10B, the body chuck 13 is lowered to insert the lead 2L of the component 2 into the insertion hole 3a of the substrate 3.

Next, the anvil unit 15 clinches and cuts the lead 2L of the component 2 (step S7: “clinch step”). Specifically, the anvil unit 15 is XY-moved to the lower part of the substrate 3 at the mounting position, and the two leads of the component 2 are clinched and cut by the cutting blade 80 of the anvil unit 15. One of the leads 2L is clinched and cut by the first cutting blade 80, and the other lead 2L is clinched and cut by the second cutting blade 80. Since the specific method is as described with reference to FIGS. 4A to 5B, the description thereof will be omitted.

By executing steps S1 to S7 described above, a component mounting board in which the component 2 is mounted on the board 3 can be manufactured. Mass production of component mounting boards can be performed by sequentially executing steps S1 to S7 on each of the plurality of boards 3.

According to the method for manufacturing the component mounting device 1 and the component mounting board of the first embodiment described above, the component 2 can be mounted on the board 3 in a wide range. Specifically, when the component 2 is mounted on the substrate 3 as it is by using the swing head 12, in the region where the component 2 is already mounted due to the space limitation of the swing nozzle 12A holding the component 2. It may not be possible to mount component 2. On the other hand, by switching the component 2 from the swing head 12 to the anvil unit 15 and then mounting the component 2 on the substrate 3, it is possible to avoid the space limitation due to the swing nozzle 12A, and a wide range on the substrate 3 The component 2 can be mounted with.

In the first embodiment, the anvil unit 15 is used as the second component holding unit. As a result, it is not necessary to separately provide a dedicated configuration as a second component holding portion that is a relay point for delivering the component 2 from the swing head 12, and the manufacturing cost of the component mounting device 1 can be reduced.

Further, in the first embodiment, when the component 2 is delivered to the anvil unit 15 in the second component holding step S4, the distance between the first cutting blade 80 and the second cutting blade 80 is reduced to reduce the distance between the pair of anvil portions 52. By sandwiching the part 2 with, the part 2 is delivered. In this way, the component 2 can be easily held by sandwiching the component 2 by adjusting the interval of the cutting blade 80 by the interval adjusting unit.

In FIG. 8, the configuration in which the component 2 is sandwiched between the pair of anvil portions 52 is shown in a simplified manner, but a specific configuration will be described with reference to FIG.

FIG. 11 is a schematic plan view showing a pair of anvil portions 52 and blocks 60A and 60B. As shown in FIG. 11, blocks 60A and 60B are attached to the anvil portions 52, respectively. The block 60A is a block attached to the anvil portion 52 having the first cutting blade 80 (here, the first cutting blade 80A). The block 60B is a block attached to the anvil portion 52 having the second cutting blade 80 (here, the second cutting blade 80B). Each of the blocks 60A and 60B has facing surfaces 62A and 62B facing each other. The component 2 is held by sandwiching the component 2 between the facing surface 62A and the facing surface 62B.

As shown in FIG. 11, in a plan view, the B direction in which the movable blade 55a moves with respect to the fixed blade 54a intersects the A direction in which the pair of anvil portions 52 relatively move. In such a configuration, both the facing surfaces 62A and 62B are configured as surfaces perpendicular to the A direction. According to such a configuration, the component 2 can be sandwiched and held with higher accuracy than the case where the component 2 is sandwiched and held by the main body side of the anvil portion 52. It should be noted that the entire facing surfaces 62A and 62B do not have to be surfaces perpendicular to the A direction, and at least a part thereof may be a surface perpendicular to the A direction.

(Embodiment 2)
The component mounting apparatus according to the second embodiment of the present invention will be described. In the second embodiment, the points different from the first embodiment will be mainly described, and the description overlapping with the first embodiment will be omitted.

In the first embodiment, the component 2 is sandwiched and held by the anvil unit 15, whereas in the second embodiment, the component 2 is held by placing the component 2 on the anvil unit. Is different from Form 1.

12A and 12B are a schematic plan view and a schematic side view showing the anvil unit 102 in the component mounting apparatus of the second embodiment, respectively.

As shown in FIGS. 12A and 12B, the anvil unit 102 includes a pair of anvil portions 52 and blocks 104A and 104B attached to the anvil portions 52, respectively.

The blocks 104A and 104B have the same shape as the blocks 60A and 60B shown in FIG. 11, and have lead holding holes 106A and 106B on the upper surface. The lead holding holes 106A and 106B are holes for accommodating and holding the lead 2L of the component 2. As shown in FIG. 12B, the swing head 12 holding the component 2 in the upright posture is lowered, and the lead 2L of the component 2 is inserted into the lead holding holes 106A and 106B. As a result, the component 2 can be placed and held on the blocks 104A and 104B in a positioned state. The component 2 placed on the blocks 104A and 104B is then picked up by the body chuck 13 which is a third component holding portion and mounted on the substrate 3.

The lead holding holes 106A and 106B are not limited to being provided in the blocks 104A and 104B, but may be provided on the main body side of the anvil portion 52 or may be provided in a configuration other than the anvil unit 15.

(Embodiment 3)
The component mounting device according to the third embodiment of the present invention will be described. In the third embodiment, the differences from the first and second embodiments will be mainly described, and the description overlapping with the first and second embodiments will be omitted.

In the first and second embodiments, the anvil unit 15 is used as the second component holding unit, whereas in the third embodiment, the feeder installation unit is used as the second component holding unit. Different from forms 1 and 2.

FIG. 13A is a schematic perspective view of the component mounting device 202 according to the third embodiment. FIG. 13B is a schematic view of an opening / closing portion 204 provided in the component mounting device 202.

As shown in FIG. 13A, the component mounting device 202 is provided with a feeder installation portion 204. The feeder installation portion 204 is a portion on which a feeder (not shown) containing a plurality of parts 2 can be installed. The feeder installation portion 204 is provided with an opening / closing portion 206 that can be opened / closed to receive and hold the component 2 in the standing posture from the swing head 12.

As shown in FIG. 13B, the opening / closing portion 206 is connected to the air cylinder 208, and is configured to be openable / closable in the C direction by driving the air cylinder 208. In such a configuration, with the opening / closing portion 206 open, the swing head 12 which is the first component holding portion descends while holding the component 2 in the upright posture, and the component 2 is arranged between the opening / closing portions 206. Let me. After that, the air cylinder 208 is driven to narrow the interval between the opening / closing portions 206, so that the opening / closing portion 206 sandwiches the component 2. After that, the suction by the swing head 12 is released, and the swing head 12 is raised and retracted. The component 2 held by the opening / closing portion 206 is picked up by the body chuck 13 which is the third component holding portion and mounted on the substrate 3.

In this way, in addition to the anvil unit 15, the feeder installation unit 204 can be used as a second component holding unit that holds the component 2 in the standing posture.

(Embodiment 4)
The component mounting device according to the fourth embodiment of the present invention will be described. In the fourth embodiment, the points different from the first to third embodiments will be mainly described, and the description overlapping with the first to third embodiments will be omitted.

In the first and second embodiments, the anvil unit 15 is used as the second component holding portion, whereas in the fourth embodiment, the tray plate is used as the second component holding portion. Different from 1 and 2.

FIG. 14A is a schematic perspective view of the tray supply unit 302 and the tray plate 304 of the fourth embodiment. FIG. 14B is a schematic view of the tray plate 304.

The tray supply unit 302 shown in FIG. 14A is a unit for supplying the component 2 by the tray plate 304. The tray plate 304 is a plate on which a plurality of parts 2 can be arranged. On the upper surface of the tray plate 304, a plurality of parts 2 in a sideways posture that cannot stand on their own are placed (not shown).

As shown in FIG. 14A, by moving the tray plate 304 in the storage position in the D1 direction and then in the D2 direction, the tray plate 304 is exposed to the outside. The configuration of the component mounting device such as the swing head 12 becomes accessible to the plurality of components 2 placed on the upper surface of the tray plate 304, and the components 2 can be supplied.

As shown in FIG. 14B, the tray plate 304 is provided with a component holding portion 306. The component holding unit 306 is a member that serves as a relay point for temporarily delivering and holding the component 2 from the swing head 12, which is the first component holding unit. In the example shown in FIG. 14B, the component holding portion 306 is a tubular member that opens upward on the upper surface of the tray plate 304.

FIG. 14C shows a state in which the component 2 is arranged and held by the component holding portion 306. As shown in FIG. 14C, the swing head 12 holding the component 2 in the upright posture is lowered, and the component 2 is arranged in the component holding portion 306. As a result, the component 2 can be held in the state where the component 2 is positioned in the component holding portion 306. The component 2 held by the component holding unit 306 is then picked up by the body chuck 13 which is the third component holding unit and mounted on the substrate 3.

In this way, in addition to the anvil unit 15, the tray plate 304 can be used as a second component holding portion for holding the component 2 in the standing posture.

(Embodiment 5)
The component mounting device according to the fifth embodiment of the present invention will be described. In the fifth embodiment, the points different from the first to fourth embodiments will be mainly described, and the description overlapping with the first to fourth embodiments will be omitted.

In the first and second embodiments, the anvil unit 15 is used as the second component holding portion, whereas in the fifth embodiment, the nozzle changer 402 is used as the second component holding portion. It is different from the first and second forms.

FIG. 15A is a schematic perspective view of the nozzle changer 402 of the fifth embodiment. The nozzle changer 402 shown in FIG. 15A is a member for replacing a nozzle used in a component mounting device, such as the suction nozzle at the tip of the swing nozzle 12A described above. As shown in FIG. 15A, the nozzle changer 402 includes a fixed plate 404 and a movable plate 406.

The fixing plate 404 is a plate for accommodating a plurality of nozzles 412. A plurality of holes 408 are formed on the upper surface of the fixing plate 404. FIG. 15A shows a state in which a plurality of nozzles 412 are housed in a part of the plurality of holes 408. The movable plate 406 is a plate arranged on the fixed plate 404 so as to be movable laterally with respect to the fixed plate 404.

Of the plurality of holes 408 provided in the fixed plate 404, the hole 410 located at the end as shown in FIG. 15A is not used as a holding hole for the nozzle 412, and the nozzle 412 is not arranged. In the fifth embodiment, such a hole 410 is used as a second component holding portion for passing the component 2 from the swing head 12.

Specifically, FIG. 15B shows a state in which the component 2 is arranged in the hole 410. As shown in FIG. 15B, the swing head 12 holding the component 2 in the upright posture is lowered to arrange the component 2 in the hole 410. In this state, the movable plate 406 is moved laterally with respect to the fixed plate 404, and the component 2 is held by the movable plate 406. In this way, the component 2 can be held in the state of being arranged in the hole 410.

As described above, in addition to the anvil unit 15, the nozzle changer 402 can be used as a second component holding portion for holding the component 2 in the standing posture.

Although the present invention has been described above with reference to the above-described embodiments 1 to 5, the present invention is not limited to the above-described embodiments 1 to 5. For example, in the first to fifth embodiments, the case where the swing nozzle 12A is used as the swing mechanism of the swing head 12 has been described, but the case is not limited to such a case. Any swing mechanism such as a swing chuck that sandwiches and grips the component 2 may be used. Alternatively, not limited to the swing mechanism, any mechanism may be used as long as it is a posture changing mechanism capable of changing the posture of the component 2. By using the swing mechanism, the posture of the component 2 can be easily changed.

Further, in the first to fifth embodiments, the case where the third component holding portion is the body chuck 13 has been described, but the case is not limited to such a case. Any configuration may be used as long as the component 2 in the standing posture can be picked up and held and mounted on the substrate 3. Further, as the third component holding portion, the same swing head 12 as the first component holding portion may be used. That is, the first component holding portion and the third component holding portion may be the same.

Further, in the first to fifth embodiments, the case where the radial type component is used as the component 2 has been described, but the case is not limited to such a case. Any type of component may be used as long as it is supplied in a sideways position.

Although the present disclosure has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various modifications and modifications are obvious to those skilled in the art. It should be understood that such modifications and amendments are included within the scope of the present disclosure by the appended claims. In addition, changes in the combination and order of elements in each embodiment can be realized without departing from the scope and ideas of the present disclosure.

By appropriately combining any of the various modified examples of the above-described embodiment, the effects of each can be achieved.

The present invention is applicable as long as it is a component mounting device and a method for manufacturing a component mounting board using the component mounting device.

1 Parts mounting device 2 Parts 2A Parts body 2L Lead 3 Board 3a Insertion hole 10 Board positioning part 11 1st moving mechanism 12 Swing head 12A Swing nozzle 13 Body chuck 13a Pickup claw 14 2nd moving mechanism 15 Anvil unit 16 Display 21 Control unit 23 Anvil body 24 Lead waste collection container 51 Anvil base 51a Mount 51A Fixed side base 51B Movable side base 52 Anvil part 54 Fixed blade holding part 54a Fixed blade 55 Movable blade holding part 55a Movable blade 55J Swing shaft 56 Anvil Operation rod 57 Lower end roller 58 Upper end roller 60A, 60B Block 62A, 62B Facing surface 73 Lead waste guide pipe 74 Downstream opening 75 Through hole 80, 80A, 80B Cutting blade 102 Anvil unit 104A, 104B Block 106A, 106B Lead holding Hole 202 Parts mounting device 204 Feeder installation part 206 Opening and closing part 208 Air cylinder 302 Tray supply unit 304 Tray plate 306 Parts holding part 402 Nozzle changer 404 Fixed plate 406 Movable plate 408 Hole 410 Hole 412 Nozzle

Claims (12)

A first component holding portion having a posture changing mechanism for picking up and holding a leaded component in the first posture and changing the held component from the first posture to the second posture.
The part in the second posture is delivered from the first part holding part, and the second part holding part for holding the part and the second part holding part
A component mounting device including a third component holding unit that picks up and holds the component held by the second component holding unit, and inserts a lead of the held component into an insertion hole of a substrate. The component mounting device according to claim 1, wherein the second component holding unit is an anvil unit that clinches the leads inserted into the substrate. The anvil unit includes a first cutting blade that clinches and cuts a first lead of the part, a second cutting blade that clinches and cuts a second lead of the part, and the first cutting. A spacing adjusting unit for adjusting the spacing between the blade and the second cutting blade is provided.
The component mounting device according to claim 2, wherein the component held by the first component holding unit is sandwiched between the anvil units and the component is held by reducing the interval by the interval adjusting unit. The anvil unit further includes a first block attached to the first cutting blade side and a second block attached to the second cutting blade side.
The first block and the second block each have facing surfaces facing each other, and both of the facing surfaces are in a direction in which the first cutting blade and the second cutting blade move relative to each other. The component mounting device according to claim 3, which has a vertical surface. The first posture is a posture in which the lead of the component extends laterally, and the second posture is a posture in which the lead of the component extends downward, according to any one of claims 1 to 4. Parts mounting equipment. The component mounting device according to any one of claims 1 to 5, wherein the posture changing mechanism of the first component holding portion is a swing mechanism that swings the component. A first component holding step of picking up and holding a leaded component in the first posture by the first component holding unit,
A posture changing step of changing the part held in the first part holding step from the first posture to a second posture by the posture changing mechanism of the first part holding portion.
A second component holding step of passing and holding the component in the second posture to the second component holding section by the first component holding section.
A third component holding step of picking up and holding the component held by the second component holding section by the third component holding section,
A method for manufacturing a component mounting board, comprising an insertion step of inserting a lead of the component held in the third component holding step into an insertion hole of the substrate by the third component holding portion. A clinch step is further included in which the lead of the part inserted by the insertion step is clinched by the anvil unit.
The method for manufacturing a component mounting board according to claim 7, wherein the anvil unit is the second component holding unit. The clinch step clinches and cuts the first lead of the part with the first cutting blade of the anvil unit, and clinches the second lead of the part with the second cutting blade of the anvil unit. And disconnect
In the second component holding step, the distance between the first cutting blade and the second cutting blade is reduced, the component is sandwiched between the anvil units, and the component is delivered to and held by the anvil unit. The method for manufacturing a component mounting board according to claim 8. In the second component holding step, the component is delivered to the anvil unit by sandwiching the component between facing surfaces of a pair of blocks provided in the anvil unit.
The method for manufacturing a component mounting substrate according to claim 9, wherein the facing surface has a surface perpendicular to the direction in which the first cutting blade and the second cutting blade move relatively. The first posture is a posture in which the lead of the component extends laterally, and the second posture is a posture in which the lead of the component extends downward, according to any one of claims 7 to 10. Manufacturing method of component mounting board. The method for manufacturing a component mounting substrate according to any one of claims 7 to 11, wherein the posture changing step changes the posture of the component by swinging the component.