JP5878082B2 - Clinch device, component mounting device - Google Patents

Description

  The present invention relates to a clinching technique for bending a lead of a lead component inserted into an insertion hole formed in a substrate and attaching the lead component to the substrate.

  Patent Document 1 describes a clinch mechanism for attaching a lead component to a substrate by inserting the lead of the lead component into an attachment hole (insertion hole) formed in the substrate and bending the tip of the lead protruding from the substrate. Has been. The clinching mechanism includes a head unit disposed above the substrate and a clinching unit disposed below the substrate. When the head unit inserts the lead of the lead component into the mounting hole from above the substrate, the tip of the lead protruding downward from the substrate comes into contact with the clinch unit. The clinch unit has an inclined surface that is cut obliquely, and the tip of the lead that contacts the clinch unit is bent along the inclined surface. The tip of the bent lead is engaged with the mounting hole, and the lead component is attached to the substrate.

Japanese Patent Laid-Open No. 06-112692

  By the way, when it is necessary to additionally process the lead inserted into the insertion hole of the board, an additional process different from the process of bending along the inclined portion (inclined surface) of the clinching device (clinch unit). was there. In this case, it is conceivable to separately provide a device for performing this additional processing in the substrate production line, but such a response is not always appropriate from the viewpoint of cost and the like.

  The present invention has been made in view of the above-described problem, and further performs an additional process different from the process of bending the lead of the lead component along the inclined portion on the lead inserted into the insertion hole of the substrate. It is an object of the present invention to provide a clinch device that can be used and a component mounting device including the clinch device.

In order to achieve the above object, the clinching apparatus according to the present invention is arranged such that the other main part of the substrate is connected to the lead of the lead component inserted into the insertion hole of the substrate from the component mounting direction from the one main surface to the other main surface of the substrate. A lead receiving member that has an inclined portion that is inclined with respect to the component mounting direction and that contacts the surface side, bends the lead inserted into the insertion hole along the inclined portion, and is inserted into the insertion hole of the board. The lead that is bent along the inclined part moves from the opposite direction of the component mounting direction and hits the lead, and an outer cylinder that processes the lead, a shaft connected to the outer cylinder, and an internal space in which the shaft is arranged And a base member fitted with an outer cylinder on the outside, the base member is provided with a press-fitting hole communicating with the internal space, and by raising the shaft by the air press-fitted into the internal space from the press-fitting hole, To raise the cylinder is characterized by abutting the lead.

In order to achieve the above object, the component mounting apparatus according to the present invention is a substrate fixing means for fixing a substrate in which an insertion hole for inserting a lead of a lead component is formed at a mounting position of the lead component at a work position. And a component supply means for supplying the lead components, and a component that transports the lead components supplied from the component supply means to the mounting location on the board fixed at the work position, and goes from one main surface to the other main surface of the board. A work head that performs a part mounting process that pushes the lead part in the part mounting direction while inserting a lead into the insertion hole from the mounting direction, and a lead that is inserted into the insertion hole by the component mounting process and protrudes from the other main surface of the board contact with a support member for supporting the clinch device for bending the leads, clinch device contacts the leads have been inserted into the insertion hole of the board, tilting to the component mounting direction And an inclined portion is, component mounting a lead which has been inserted into the insertion hole and the receiving lead bend along a sloped section member, the bent lead along the inclined portion is inserted into the insertion hole of the substrate An outer cylinder that moves from the opposite direction of the direction and abuts to process the lead, a shaft connected to the outer cylinder, a base member that has an internal space in which the shaft is arranged and the outer cylinder is fitted to the outside The base member is provided with a press-fitting hole communicating with the internal space, and the shaft is lifted by the air press-fitted into the internal space from the press-fitting hole, so that the outer cylinder is raised and abuts against the lead. It is said.

According to the invention thus configured (clinch device, component mounting device), the lead of the lead component is inserted into the insertion hole of the substrate from the component mounting direction from the one main surface of the substrate toward the other main surface. Components can be attached to the substrate. Specifically, the lead inserted into the insertion hole is bent in contact with the clinching device on the other main surface side of the substrate, whereby the lead component is attached to the substrate. Furthermore, the clinching device has an outer cylinder that moves from the opposite direction of the component mounting direction to a lead that is inserted into the insertion hole of the board and bent along the inclined portion, and processes the lead. . In this way, the clinch device according to the present invention can further perform an additional process different from the process of bending the lead of the lead component along the inclined portion on the lead inserted into the insertion hole of the substrate. It has become.

In this case, the clinching device may be configured so that the outer cylinder abuts against the lead and performs a process of pushing and bending the lead. By configuring in this way, even if the lead is not bent enough just to be along the inclined part, the lead is bent further by the outer cylinder to bend the lead firmly, and the lead component is attached to the substrate. It becomes possible to attach securely.

Or you may comprise a clinch apparatus so that an outer cylinder may contact | abut a lead | read | reed and may perform the process which cut | disconnects a lead | read | reed. In such a configuration, both the bending of the lead and the cutting of the lead can be performed with a single clinching apparatus. Therefore, it is not necessary to separately provide a device for cutting the leads in the substrate production line, which is advantageous in terms of cost and the like.

At this time, a protective member for protecting the substrate from the outer cylinder is further provided between the lead bent along the inclined portion and the substrate, and the outer cylinder abuts the lead and sandwiches the lead between the protective member and the substrate. The clinch device may be configured so as to perform a process of cutting the lead. In such a configuration, since the protective member is provided, without damaging the substrate by the outer tube, it is possible to perform additional processing by the outer tube.

At this time, the clinching device may be configured such that at least one of the protection member and the outer cylinder is formed with a blade in contact with the lead. As a result, the lead can be reliably cut, and the accuracy of the lead cutting process is improved.

  As described above, the clinch device according to the present invention further performs an additional process different from the process of bending the lead of the lead component along the inclined portion on the lead inserted into the insertion hole of the substrate. Is possible.

It is a top view which shows schematic structure of the component attachment apparatus which can apply this invention. It is a partial front view of the component attachment apparatus shown in FIG. It is a block diagram which shows the main electrical structures of the component attachment apparatus shown in FIG. It is a perspective view which shows the structure of an example of a clinch pin roughly. FIG. 5 is a partial cross-sectional view schematically showing the configuration and operation of the clinch pin shown in FIG. 4. FIG. 5 is a partial cross-sectional view schematically showing the configuration and operation of the clinch pin shown in FIG. 4. It is a flowchart which shows an example of the operation | movement performed with the components attachment apparatus of FIG. It is a figure which shows an example of the display mode of the board | substrate data on a display. It is the top view which showed typically an example of the arrangement | positioning aspect of the clinch pin to a backup plate.

  FIG. 1 is a plan view showing a schematic configuration of a component mounting apparatus to which the present invention is applicable. FIG. 2 is a partial front view of the component mounting apparatus shown in FIG. FIG. 3 is a block diagram showing the main electrical configuration of the component mounting apparatus shown in FIG. The component mounting apparatus 1 shown in these drawings has a configuration capable of mounting both the surface mount component Ps and the lead component Pl to the substrate S. In FIG. 1 and FIG. 2 and the drawings shown below, XYZ orthogonal coordinate axes with the Z-axis direction as the vertical direction are shown as appropriate in order to clarify the directional relationship between the drawings.

  In the component mounting apparatus 1, the substrate transport mechanism 2 is disposed on the base 11, and the substrate S can be transported in a predetermined transport direction X. More specifically, the substrate transport mechanism 2 has a pair of conveyors 21 and 21 that transport the substrate S from the right side to the left side of FIG. And the conveyors 21 and 21 perform conveyance of the board | substrate S according to the command from the drive control part 210 of the control unit 200. FIG. Specifically, the conveyors 21 and 21 stop the substrate S carried in from the outside of the apparatus at a predetermined work position L (the position of the substrate S shown in FIGS. 1 and 2) and fix it by a fixing means (not shown). Hold. When the mounting of the electronic component P (surface mount component Ps, lead component Pl) to the substrate S on which the head unit 6 described later is fixed at the work position L is completed, the conveyors 21 and 21 carry the substrate S out of the apparatus. To do.

  On the base 11, a backup unit 3 that supports the substrate S fixed at the work position L from below is provided. The backup unit 3 supports the substrate S by abutting the plurality of clinch pins 100 detachably disposed on the upper surface of a flat backup plate 31 (push-up plate) from below. The reason why such clinch pin 100 is used is as follows.

  In the component mounting apparatus 1, the surface mount component Ps and the lead component Pl are mounted on the substrate S. Of these, the lead component Pl is attached by inserting the lead of the lead component Pl into the substrate S while applying a certain load to the lead component Pl. Therefore, the substrate S may be bent by the load accompanying the attachment of the lead component Pl only by the holding by the conveyors 21 and 21. Accordingly, the clinch pin 100 is arranged at an arrangement location corresponding to the attachment location of the lead component Pl, and the attachment location is supported by the clinch pin 100, thereby suppressing the bending of the substrate S due to the attachment of the lead component Pl. Further, in order to attach the lead component Pl to the substrate S, it is necessary to clinch the lead l of the lead component Pl. Therefore, the clinch pin 100 has not only a function of suppressing the bending of the substrate S but also a function of clinching the lead 1 of the lead component Pl attached to the substrate S. In addition, if the kind of the board | substrate S to produce differs, the attachment location of the lead components Pl will also differ. Therefore, the arrangement location of the clinch pin 100 can be changed according to the arrangement location of the lead component Pl.

  A specific example of the clinch pin 100 will be described in detail with reference to FIGS. Here, FIG. 4 is a perspective view schematically showing a configuration of an example of the clinch pin. 5 and 6 are partial cross-sectional views schematically showing the configuration and operation of the clinch pin shown in FIG. The clinch pin 100 is disposed on the backup plate 31 in order to attach a lead component Pl such as a resistor or a capacitor to the substrate S. In FIGS. A backup plate 31 is also shown. In FIG. 4, the configuration hidden by the substrate S is shown through the substrate S.

  A predetermined number (two in the illustrated example) of wire-like leads 1 is extended from the lead component Pl. The lead l performs a function of connecting the lead component Pl to the substrate S and a function of electrically connecting the lead component Pl to the pattern of the substrate S. On the other hand, the board S is provided with an insertion hole h for inserting the lead 1 of the lead component Pl with respect to the attachment location Wa of the component P. The insertion hole h penetrates the substrate S and is inserted from the component mounting direction D (direction parallel to the Z-axis direction) from the front surface Sf (one main surface) of the substrate S to the back surface Sb (the other main surface). The lead component Pl is attached to the substrate S by bending the lead l inserted into h and projecting below the substrate S.

  As shown in FIGS. 4 to 6, the clinch pin 100 has a cylindrical shape extending in the Z-axis direction. More specifically, the clinch pin 100 has a schematic configuration in which a lead receiving member 120 having a rotationally symmetric shape with respect to the Z axis is fixed to an upper end of a cylindrical base member 110 extending in the Z axis direction. On the upper surface of the lead receiving member 120, a predetermined number (two in the example shown) of lead receiving grooves 123 cut in the radial direction of the lead receiving member 120 and opened upward and laterally are formed. These lead receiving grooves 123 are provided corresponding to the leads 1 of the lead component Pl, and are formed to be rotationally symmetric (180 degrees symmetrical in the example in the figure) with respect to the center line (rotation symmetry axis) of the lead receiving member 120. Has been. The lead receiving groove 123 is formed from a slightly outer side of the center line of the lead receiving member 120 to the peripheral surface, and has a slope shape that descends toward the peripheral surface of the lead receiving member 120. More specifically, the lead receiving groove 123 has a shape in which a steep slope and a gentle slope having a smaller inclination angle than that of the steep slope are rounded and smoothly connected, and is loosened from the steep slope from the center line of the lead receiving member 120 toward the peripheral surface. It is formed to reach the slope. That is, in this embodiment, the lead receiving groove 123 functions as an inclined portion inclined with respect to the component mounting direction D.

  When the lead component Pl is clinched to the substrate S, the clinch pin 100 is disposed at the disposition location Wb below the substrate S so that the lead receiving groove 123 of the clinch pin 100 is located below the insertion hole h of the substrate S. The Then, the lead component Pl is pushed downward from the state where the lead l of the lead component Pl is inserted into the insertion hole h. As a result, the lead 1 projecting downward from the substrate S is further pushed in after contacting the lead receiving groove 123 and bent along the shape of the lead receiving groove 123. Thus, the lead l is bent and the lead component Pl is attached to the substrate S. At this time, as shown in FIG. 5, the end of the lead l protrudes outward from the peripheral surface of the lead receiving member 120.

  Further, a support protrusion 124 is formed on the upper surface of the lead receiving member 120, and the clinch pin 100 contacts the back surface Sb of the substrate S with the support protrusion 124 to support the substrate S. As a result, the substrate S is supported by the clinch pin 100 against the load that is applied when the lead component Pl is attached, and the bending of the substrate S is suppressed. A magnet 135 is screwed to the lower end of the base member 110, and the clinch pin 100 is attached to the backup plate 31 by magnetic force. Accordingly, the clinch pin 100 can be firmly erected on the backup plate 31 against the force from the substrate S.

  The clinch pin 100 includes an additional processing mechanism 140 that performs additional processing on the lead l that is bent along the lead receiving groove 123 and protrudes from the peripheral surface of the lead receiving member 120. The additional processing mechanism 140 performs processing for cutting the lead l using a blade 141 a formed at the upper end of the outer cylinder 141. Specifically, the additional processing mechanism 140 includes a hollow outer cylinder 141 having a cylindrical shape extending in the Z-axis direction, and a bridge 142 that spans the inner wall of the outer cylinder 141 so as to cross the hollow portion of the outer cylinder 141. The shaft 143 extends downward from the bridge 142 and has an outward flange 143a at the lower end. The additional processing mechanism 140 is attached to the base member 110 as follows.

  As shown in FIGS. 5 and 6, an internal space 150 extending in the Z-axis direction is formed inside the base member 110. The internal space 150 is closed at the upper end by the lead receiving member 120 and closed at the lower end by the lid member 160. The lid member 160 has a convex portion 161 that protrudes upward into the internal space 150. An inward flange 110a is provided on the inner wall of the base member 110 surrounding the inner space 150. The inner space 150 includes a lower space 150a below the inward flange 110a and an upper space 150b above the inward flange 110a. It is roughly divided into

  The shaft 143 of the additional processing mechanism 140 is disposed in the internal space 150 of the base member 110 and is movable in the Z-axis direction. Specifically, the upper end of the shaft 143 is inserted from below into the hole surrounded by the inward flange 110a. The flange 143a at the lower end of the shaft 143 is positioned in the lower space 150a, and the upper end of the shaft 143 protrudes from the flange 143a to the upper space 150b. As a result, the shaft 143 is Z-axis between a lower position (position in FIG. 5) where the flange 143a hits the convex portion 161 of the lid member 160 and an upper position (position in FIG. 6) where the flange 143a hits the flange 110a. Can move in the direction.

  The bridge 142 of the additional processing mechanism 140 is disposed in a lateral hole 151 provided in the base member 110. The lateral hole 151 communicates with the upper space 150b while penetrating the base member 110 in the horizontal direction, and is provided with a predetermined width in the Z-axis direction in order to ensure a movable range of the bridge 142. The bridge 142 can move in the Z-axis direction along with the shaft 143 without interfering with the base member 110 by moving in the horizontal hole 151.

  The outer cylinder 141 of the additional processing mechanism 140 is fitted to the outside of the base member 110 and the lead receiving member 120 and is supported at both ends of the bridge 142 protruding from the lateral hole 151. Thus, the outer cylinder 141 is connected to the shaft 143 via the bridge 142 and can move in the Z-axis direction along with the shaft 143.

  As described above, the additional processing mechanism 140 including the outer cylinder 141, the bridge 142, and the shaft 143 is movable in the Z-axis direction. The movement of the additional processing mechanism 140 is executed by a press-fitting hole 171 and a compression spring 172 provided in the clinch pin 100. That is, the press-fitting hole 171 passing through the base member 110 communicates with the lower space 150a, and the air press-fitted from the press-fitting hole 171 into the lower space 150a pushes up the shaft 143 from the lower surface. On the other hand, the compression spring 172 is provided between the lead receiving member 120 and the bridge 142 in the upper space 150 b and pushes down the shaft 143 via the bridge 142. Since such a configuration is provided, the outer cylinder 141 can be raised along with the shaft 143 by press-fitting air from the press-fitting hole 171, while the shaft 143 is opened by opening the press-fitting hole 171 to atmospheric pressure. Accordingly, the outer cylinder 141 can be lowered. Specifically, the press-fitting hole 171 is connected to the pressure adjusting mechanism 93 (FIG. 3) via a tube. Release to is performed.

  Further, the additional processing mechanism 140 further includes a ring-shaped substrate protection member 144 fitted on the outside of the lead receiving member 120 above the outer cylinder 141. The substrate protection member 144 is located slightly above the lower end of the inclined surface of the lead receiving groove 123. 5 and 6, the lead 1 bent along the lead receiving groove 123 protrudes outward from between the inclined surface of the lead receiving groove 123 and the substrate protection member 144. Therefore, by raising the outer cylinder 141 to the position of FIG. 6, the lead l is sandwiched between the outer cylinder 141 (the blade 141 a) that abuts the lead l from the reverse direction of the component mounting direction D and the board protection member 144. The lead l can be cut. In this way, the clinch pin 100 can cut the lead 1 bent along the lead receiving groove 123.

  The above is the details of the specific example of the clinch pin 100. Returning to FIGS. 1 to 3, the description of the component mounting device 1 will be continued. The backup unit 3 in which the clinch pin 100 as described above is disposed includes an elevating mechanism 35 that elevates and lowers the backup plate 31 in response to a command from the drive control unit 210. Specifically, when the conveyors 21 and 21 are fixing the substrate S to the working position L, the lifting mechanism 35 positions the upper surface of the backup plate 31 at the initial height z0 and the substrate at the upper end of the clinch pin 100. S is supported from below. On the other hand, when the conveyors 21 and 21 convey the substrate S, the elevating mechanism 35 lowers the upper surface of the backup plate 31 from the initial height z0 to prevent interference between the substrate S being conveyed and the clinch pin 100.

  On the front side (+ Y axis direction side) and the rear side (−Y axis direction side) of the conveyors 21, the component supply unit 4 is arranged. The component supply unit 4 includes a surface mount component supply unit 4s and a lead component supply unit 4l. The surface mount component supply unit 4s has a configuration in which a large number of feeders 41s for supplying a surface mount component Ps as the electronic component P are arranged in the X-axis direction. Each feeder 41 s is a tape feeder provided with a reel (not shown) around which a tape storing and holding the surface-mounted component Ps is wound, and the surface-mounted component Ps can be supplied to the head unit 6. Specifically, on the tape, small chip electronic components Ps such as an integrated circuit (IC), a transistor, and a capacitor are stored and held at predetermined intervals. Then, the feeder 41s feeds the tape from the reel toward the head unit 6 to intermittently feed the surface-mounted component Ps in the tape to the component suction position. As a result, the surface-mounted component Ps can be picked up by the suction nozzle 62 mounted on the mounting head 61 of the head unit 6.

  On the other hand, the lead component supply unit 4l has a configuration in which a large number of feeders 41l for supplying the lead component Pl as the electronic component P are arranged in the X-axis direction. Each feeder 41l is provided with a carrier tape (not shown) for holding a plurality of lead parts Pl at predetermined intervals, as in the feeder described in, for example, Japanese Patent Laid-Open No. 2007-180280. By sending it out to the head unit 6 side, the lead part Pl is intermittently sent out to the part suction position. As a result, the lead component Pl can be picked up by the suction nozzle 62 mounted on the mounting head 61 of the head unit 6.

  The head unit 6 transports the electronic component P sucked and held by the suction nozzle 62 of the mounting head 61 to the substrate S and transfers it to the mounting location designated by the user. Specifically, the head unit 6 includes six mounting heads 61F arranged in a line in the X axis direction on the front side and six mounting heads 61R arranged in a line in the X axis direction on the rear side. A total of 12 mounting heads 61 are provided. That is, as shown in FIGS. 1 and 2, in the head unit 6, six mounting heads 61F extending in the vertical direction Z are provided in a row at an equal pitch in the X-axis direction. Further, a rear row that is configured in the same manner as the front row is also provided on the rear side (−Y-axis direction side) with respect to the mounting head 61F. That is, six mounting heads 61R extending in the vertical direction Z are provided in a row at an equal pitch in the X-axis direction. The mounting head 61F and the mounting head 61R are arranged with a half-pitch shift in the X-axis direction, and are arranged in a zigzag shape in plan view as shown in FIG. Therefore, when viewed from the Y-axis direction, as shown in FIG. 2, the twelve mounting heads 61 are arranged in a line in the X-axis direction without overlapping each other.

  The tip of each mounting head 61 to which the suction nozzle 62 is attached can communicate with any of the negative pressure generator, the positive pressure generator, and the atmosphere via the pressure switching mechanism 7. The grip controller 220 of the control unit 200 can switch the pressure applied to the tip of the mounting head 61 by controlling the pressure switching mechanism 7. Therefore, when a negative pressure suction force from the negative pressure generator is applied to the tip portion of the mounting head 61 by pressure switching, the suction nozzle 62 attached to the tip portion sucks and holds the electronic component P. Conversely, when positive pressure from the positive pressure generator is applied to the tip of the mounting head 61, the suction holding of the electronic component P by the suction nozzle 62 is released, and the electronic component P is attached to the substrate S. After the electronic component P is attached, the suction nozzle 62 is opened to the atmosphere. Thus, in the head unit 6, the electronic component P can be attached and detached by controlling the negative pressure adsorption force and the positive pressure supply by the grip control unit 220.

  Each mounting head 61 can be moved up and down (moved in the Z-axis direction) with respect to the head unit 6 by a nozzle lifting drive mechanism (not shown) and rotated around the nozzle center axis by a nozzle rotation driving mechanism (not shown). Direction rotation). Among these drive mechanisms, the nozzle raising / lowering drive mechanism is mounted between a lowered position (lower end) when the electronic component P is attracted or attached and an elevated position (upward end) when the electronic component P is conveyed. The head 61 is moved up and down. On the other hand, the nozzle rotation drive mechanism is a mechanism for rotating the suction nozzle 62 as necessary, and the electronic component P can be positioned in a predetermined R direction during attachment by rotation drive. These drive mechanisms are each composed of a Z-axis servo motor Mz, an R-axis servo motor Mr, and a predetermined power transmission mechanism. The drive control unit 210 controls the Z-axis servo motor Mz and the R-axis servo motor Mr. By controlling the drive, each mounting head 61 can be moved in the Z-axis direction and the R direction.

  The head unit 6 that holds these mounting heads 61 is movable in the X-axis direction and the Y-axis direction (directions orthogonal to the X-axis and Z-axis directions) over a predetermined range of the base 11. That is, the head unit 6 is supported so as to be movable along the X axis with respect to the mounting head support member 63 extending in the X axis direction. Further, both ends of the mounting head support member 63 are supported by a fixed rail 64 in the Y-axis direction, and are movable along the fixed rail 64 in the Y-axis direction. The head unit 6 is driven in the X-axis direction by the X-axis servo motor Mx via the ball screw 66, and the mounting head support member 63 is driven in the Y-axis direction by the Y-axis servo motor My via the ball screw 68. Is done. Therefore, the drive control unit 210 can drive the X-axis servomotor Mx and the Y-axis servomotor My to move the head unit 6 to a predetermined position in the XY plane. As a result, the head unit 6 can be moved as appropriate, and the electronic component P attracted by the mounting head 61 can be transported from the component supply unit 4 to the mounting location.

  The component mounting apparatus 1 is provided with two types of cameras (component recognition camera C1 and component inspection camera C2) that image the electronic component P. The component recognition camera C1 is composed of an illumination unit, a CCD (Charge Coupled Device) camera, and the like, and is arranged on the base 11, and confirms the suction state of the electronic component P by the suction nozzle 62 of each mounting head 61. Mainly used for. Specifically, the drive control unit 210 moves the head unit 6 as appropriate, thereby moving the electronic component P attracted by the suction nozzle 62 above the component recognition camera C1. In this state, the image of the electronic component P captured by the component recognition camera C1 is transferred to the control unit 200 (the image processing unit 230). The control unit 200 controls the R-axis servo motor Mr by the drive control unit 210 based on this image, thereby appropriately rotating the mounting head 61 in the R direction to appropriately adjust the angle of the electronic component P mounted on the substrate S. Adjust to.

  On the other hand, the component inspection camera C2 includes an illumination unit and a CCD camera and is mounted on the head unit 6 and is mainly used for inspecting the mounting state of the electronic component P attached to the substrate S. Specifically, the drive control unit 210 moves the head unit 6 as appropriate, thereby moving the component inspection camera C2 above the attachment location of the electronic component P. In this state, the image of the electronic component P captured by the component inspection camera C 2 is transferred to the image processing unit 230. The image processing unit 230 determines whether the electronic component P is attached or not from the transferred image of the electronic component P.

  As will be described in detail later, in this embodiment, the clinch pins 100 are disposed at predetermined positions on the backup plate 31 by the mounting head 61 of the head unit 6. In other words, in the autonozzle changer 81 arranged on the rear side (−Y-axis direction side) of the backup unit 3, the suction nozzle 62 p for the electronic component P and the clinch pin are used as the suction nozzle 62 that can be attached to the tip of the mounting head 61. The suction nozzle 62c for 100 is prepared, and the suction nozzle 62 attached to the mounting head 61 can be exchanged between them. In addition, a stocker 82 that houses a plurality of clinch pins 100 is disposed on the front side (+ Y-axis direction side) of the backup unit 3. The clinch pin 100 is sucked and conveyed from the stocker 82 to the backup plate 31 by using the mounting head 61 to which the suction nozzle 62c for the clinch pin 100 is attached, so that the clinch pin 100 is placed at a predetermined position of the backup plate 31. Can be arranged. Note that the movement of the mounting head 61 at this time is controlled by the drive control unit 210 in the same manner as the conveyance of the electronic component P described above.

  As shown in FIG. 3, the component mounting apparatus 1 includes a display 91 and an input device 92 that function as an interface with a user. The display 91 has a function as an input terminal that is configured with a touch panel and receives an input from a user, in addition to a function of displaying an operation state or the like of the component mounting device 1. The input device 92 includes a mouse and a keyboard, and fulfills a function of receiving input from the user. The input / output control for the display 91 and the input device 92 is executed by the input / output control unit 240 of the control unit 200.

  Further, as described above, the clinch pin 100 according to this embodiment includes the additional processing mechanism 140 that performs the cutting process on the lead l bent along the lead receiving groove 123. Therefore, the control unit 200 has an additional machining control unit 245 for controlling the operation of the additional machining mechanism 140. The additional processing control unit 245 controls the pressure adjustment by the pressure adjusting mechanism 93 and moves the outer cylinder 141 of the additional processing mechanism 140 in the Z-axis direction, thereby performing additional processing (cutting processing) on the lead l. ). Specifically, the additional machining control unit 245 opens the press-fitting hole 171 to atmospheric pressure while cutting is not being performed, and lowers the outer cylinder 141 to a lower position (position shown in FIG. 5). On the other hand, the additional process control unit 245 pressurizes air into the press-fitting hole 171 when performing the cutting process, and raises the outer cylinder 141 to the upper position (position shown in FIG. 6).

  The overall operation of the component mounting apparatus 1 configured as described above is comprehensively controlled by the main control unit 250. That is, the main control unit 250 controls the entire apparatus 1 by exchanging signals with each unit of the control unit 200 via the bus 270 based on programs and data stored in the storage unit 260. Specifically, the storage unit 260 stores a pin arrangement program 261 and an attachment program 262 (production program). The pin placement program 261 is a program for controlling the mounting head 61 and the like in order to place the clinch pin 100 at the place where the backup plate 31 is placed. The attachment program 262 is a program for controlling the attachment head 61 and the like in order to attach the electronic component P to the attachment location of the substrate S. In addition to the position and angle for attaching the electronic component P to the substrate S, Information such as installation procedures is incorporated. Subsequently, an example of an operation executed under the control of the main control unit 250 will be described.

  FIG. 7 is a flowchart showing an example of an operation executed by the component mounting apparatus of FIG. In the figure, a flowchart when the type of the production substrate is switched is shown. That is, when the user instructs switching of the board type via the user interfaces 91 and 92, the flowchart of FIG. In step S <b> 101, substrate data indicating the position and angle at which the electronic component P is attached to the substrate S is read from the attachment program 262 stored in the storage unit 260. The board data is displayed as a list on the display 91 (FIG. 5).

  FIG. 8 is a diagram illustrating an example of how the substrate data is displayed on the display. As shown in FIG. 8, in the display 91, for each of the electronic components P1, P2,..., A position (X coordinate, Y coordinate) where the electronic component is attached and an angle (R angle) where the electronic component is attached are shown. Further, the display 91 shows a lead component check box for designating whether or not each of the electronic components P1, P2,... Is the lead component Pl. Then, the user checks the lead component check box of the electronic component P, which is the lead component Pl, using the touch panel function of the display 91 or the input device 92 (step S102). Incidentally, in the example of FIG. 8, the lead component check boxes of the electronic components P2 and P6 are checked.

  In step S103, the mounting information of the lead component Pl is extracted based on the user input result in step S102. Specifically, in this step, the position (X coordinate, Y coordinate) of the attachment location of the electronic components P2, P6 designated by the user as the lead component Pl is extracted. And the position of the arrangement | positioning location of the clinch pin 100 is calculated | required from the position of the attachment location of lead components P2 and P6. Note that the location where the lead component Pl is attached and the location where the clinch pin 100 is disposed differ only in the position in the Z-axis direction. Therefore, the position (X coordinate, Y coordinate) of the attachment location of the lead parts P2, P6 is obtained as the position (X coordinate, Y coordinate) of the arrangement location of the clinch pin 100.

  In step S103, the mounting angle (R direction) of the electronic components P2 and P6 designated as the lead component Pl by the user is extracted and obtained as the arrangement angle of the clinch pin 100. That is, the clinch pin 100 receives the lead 1 of the lead component Pl in the lead receiving groove 123 and clinches the lead l. Therefore, if the lead receiving groove 123 is inclined with respect to the lead l, the lead l cannot be properly received by the lead receiving groove 123, and the lead l may not be clinched reliably. Therefore, in order to accurately receive the lead 1 by the lead receiving groove 123 by adjusting the arrangement angle of the clinch pin 100 to the mounting angle of the lead component Pl, in step S103, the mounting angle (R direction) of the lead component Pl is the clinch pin 100. It is obtained as the arrangement angle (R direction).

  Subsequently, when the suction nozzle 62 of the mounting head 61 is replaced with the clinch pin suction nozzle 62c in step S104, the clinch pin arrangement process in step S105 is executed. In this clinch pin placement process, the clinch pin 100 is placed on the backup plate 31 based on the placement position and angle obtained in step S103. More specifically, the main controller 250 captures the angle of the clinch pin 100 by imaging the clinch pin 100 to be arranged housed in the stocker 82 with the component inspection camera C2. Specifically, the angle of the clinch pin 100 is grasped based on the result of recognizing the lead receiving groove 123 of the clinch pin 100 or the marker attached to the clinch pin 100. Then, the arrangement of the clinch pin 100 on the backup plate 31 is executed based on the arrangement position and angle obtained in step S103 and the angle of the clinch pin 100 recognized by the component inspection camera C2 (FIG. 9). Here, FIG. 9 is a plan view schematically showing an example of an arrangement mode of clinch pins on the backup plate. As shown in FIG. 9, the clinch pin 100 is arranged on the backup plate 31 according to the position and angle at which the lead component Pl specified by the user is attached.

  In the clinch pin placement process, the height of the upper surface of the backup plate 31 is changed from the initial height z0. The reason for this is as follows. That is, when the electronic component P is attached to the substrate S fixed at the work position L, the attachment head 61 performs the operation on the surface Sf of the substrate S at the component attachment height zf. On the other hand, when the clinch pin 100 is arranged, the mounting head 61 works on the upper surface of the backup plate 31. Therefore, the mounting head 61 needs to have a movement range that can access both the surface Sf of the substrate S at the component mounting height zf and the upper surface of the backup plate 31. Therefore, if the height of the upper surface of the backup plate 31 at the time of clinch pin placement processing is significantly different from the component mounting height zf, it is necessary to secure a wide movement range of the mounting head 61. Not always easy.

  In order to cope with this, when executing the clinch pin arrangement process, the height of the upper surface of the backup plate 31 is raised to the component mounting height zf side from the initial height z0. In such a configuration, the range in which the mounting head 61 moves to mount the electronic component P on the substrate S and the range in which the mounting head 61 moves to place the clinch pin 100 can be brought close to each other. Therefore, it is not necessary to secure a wide movement range of the mounting head 61, and the configuration of the device 1 can be simplified.

  In step S105, when all the clinch pins 100 necessary for mounting the lead component Pl are arranged and the clinch pin arrangement processing is completed, the suction nozzle 62 of the mounting head 61 is replaced with a suction nozzle 62p for electronic components (step S105). S106), the substrate S is loaded and fixed at the work position L (step S107). In this way, preparation for starting attachment of the electronic component P is completed.

  In the surface mounting component mounting process in step S108, mounting of the surface mounting component Ps to the substrate S is executed. Specifically, the mounting head 61 sucks and holds the surface mounting component Ps supplied by the surface mounting component supply unit 4s by the suction nozzle 62p, and conveys the surface mounting component Ps to the mounting position on the surface Sf of the substrate S. Then, a positive pressure is applied to the suction nozzle 62p, and the surface mount component Ps is attached from the suction nozzle 62p to the attachment location of the substrate S. When this attachment operation is executed for all the surface-mounted components Ps, step S109 is executed.

  In the lead component attachment processing in step S109, attachment of the lead component Pl to the substrate S is executed. Specifically, the lead component Pl supplied by the lead component supply unit 4l is sucked and held by the mounting head 61 with the suction nozzle 62p, and is transported to the mounting location on the surface Sf of the substrate S. Then, the lead of the lead component Pl is inserted into the insertion hole provided at the mounting location while applying a certain load to the lead component Pl downward from the Z-axis direction by the mounting head 61. At this time, the load applied to the lead component Pl is adjusted by controlling the drive current of the Z-axis servomotor Mz. Further, since the clinch pin 100 is disposed below the mounting position of the lead component Pl, the lead of the lead component Pl protruding from the back surface Sb of the substrate S is bent along the lead receiving groove 123 of the clinch pin 100. As a result, the lead component Pl is attached to the substrate S. When this mounting operation is executed for all the lead parts Pl, step S110 is executed.

  In step S <b> 110, a cutting process is performed on the lead l bent along the lead receiving groove 123. Specifically, the outer cylinder 141 of the additional processing mechanism 140 is raised, and the lead l is cut between the substrate protection member 144 and the lead l. Thus, the lead 1 of the lead component Pl attached to the substrate S can be cut to an appropriate length.

  In subsequent step S111, the substrate S is unloaded from the work position L, and in step S112, it is determined whether or not the production of all the substrates S has been completed. If the production is incomplete (in the case of “NO” in step S112), the process returns to step S107 and the production of the substrate S is continued. On the other hand, when the production is completed (in the case of “YES” in step S112), the production substrate is terminated.

  As described above, according to this embodiment, the lead component Pl is inserted into the insertion hole h of the substrate S from the component mounting direction D from the front surface Sf to the back surface Sb of the substrate S. Pl can be attached to the substrate S. Specifically, the lead component Pl is attached to the substrate S by bending the lead 1 inserted into the insertion hole h in contact with the clinch pin 100 on the back surface Sb side of the substrate S. Further, the clinch pin 100 is moved from the opposite direction of the component mounting direction D to the lead l inserted into the insertion hole h of the substrate S and bent along the lead receiving groove 123, and is processed into the lead l. An outer cylinder 141 is provided. In this way, the clinch pin 100 according to this embodiment has the lead inserted into the insertion hole h of the substrate S, which is different from the process of bending the lead 1 of the lead component Pl along the lead receiving groove 123. l can be further applied.

  In this embodiment, a cutting process for cutting the lead l is performed by the outer cylinder 141 that abuts the lead l. In such a configuration, both the bending process of the lead l and the cutting process of the lead l can be performed by one clinch pin 100. Therefore, in the production line of the substrate S, it is not necessary to separately provide a device for cutting the lead l, which is advantageous in terms of cost and the like.

  In particular, in this embodiment, the substrate protection member 144 that protects the substrate S from the outer cylinder 141 that performs additional processing on the substrate S between the lead bent along the lead receiving groove 123 and the substrate S is provided. Is provided. Accordingly, the lead l can be cut by the outer cylinder 141 without damaging the substrate S by the outer cylinder 141.

  Furthermore, in this embodiment, a blade 141 a that contacts the lead 1 is formed at the upper end of the outer cylinder 141. As a result, the lead l can be reliably cut, and the accuracy of the cutting process of the lead l can be improved. The formation position of the blade 141a is not limited to the upper end of the outer cylinder 141. For example, even if the blade 141a that contacts the lead l is provided at the lower end of the substrate protection member 144, the accuracy of the cutting process of the lead l can be improved similarly. it can.

Others As described above, in the above embodiment, the component mounting device 1 corresponds to an example of the “component mounting device” of the present invention, and the conveyors 21 and 21 correspond to an example of the “board fixing means” of the present invention. The component supply unit 4l corresponds to an example of the “component supply unit” of the present invention, the mounting head 61 corresponds to an example of the “working head” of the present invention, and the backup plate 31 corresponds to an example of the “support member” of the present invention. The clinch pin 100 corresponds to an example of the “clinch device” of the present invention, the lead receiving member 120 corresponds to an example of the “lead receiving member” of the present invention, and the lead receiving groove 123 corresponds to the “inclined portion” of the present invention. The outer cylinder 141 corresponds to an example of the “ outer cylinder ” of the present invention, and the substrate protection member 144 corresponds to the “protection member” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, the additional processing performed using the outer cylinder 141 for the lead l bent along the lead receiving groove 123 is not limited to the above-described cutting processing. For example, when the bending of the lead 1 is insufficient only by being along the lead receiving groove 123, it is preferable that the process of further bending the lead 1 can be additionally performed. Therefore, as described below, this bending process may be performed by the outer cylinder 141.

  That is, by raising the outer cylinder 141 from the state shown in FIG. 5, the lead l protruding outward from the lead receiving groove 123 can be pushed upward by the outer cylinder 141 and the lead l can be bent. As a result, the lead l bent along the lead receiving groove 123 can be further bent, and the lead l can be securely bent and the lead component Pl can be securely attached to the substrate S. It becomes.

  Incidentally, in the configuration shown in FIG. 5 and the like, when the lead l is sandwiched between the outer cylinder 141 and the substrate protection member 144, the lead l is cut. Therefore, when the lead l is not cut, the blade 141a at the upper end of the outer cylinder 141 and the substrate protection member 144 may be eliminated. As a result, only the additional bending process can be performed on the lead l without cutting the lead l. In addition, since the board protection member 144 is eliminated, the upper end of the outer cylinder 141 can be moved further upward, so that the lead l can be bent more firmly in the additional bending process, and the lead component Pl Attachment to the board | substrate S can be performed more reliably.

  As a specific configuration for raising and lowering the outer cylinder 141, various types can be adopted in addition to those using the press-fitting hole 171 and the compression spring 172.

  Moreover, in the said embodiment, the holding | grip of the clinch pin 100 was performed by adsorption | suction. However, the grip mode of the clinch pin 100 is not limited to adsorption. Specifically, the gripping may be performed using a chuck capable of opening and closing the claws with air pressure. Further, the same deformation can be made with respect to the grip mode of the surface-mounted component Ps or the lead component Pl.

  In the above-described embodiment, the case where the present invention is applied to the component mounting apparatus 1 that can mount both the surface mount component Ps and the lead component Pl to the substrate S has been described. However, for example, the present invention can be applied to the component mounting apparatus 1 that does not mount the surface mount component Ps on the substrate S.

  Moreover, in the said embodiment, the electronic component P was attached toward the downward direction from the upper direction of the perpendicular direction, in other words, the component attachment direction D faced the perpendicular downward direction. However, the component mounting direction D is not limited to this, and may be, for example, a direction facing vertically upward.

  In the above embodiment, the attachment of the electronic component P and the arrangement of the clinch pin 100 are executed by the common attachment head 61. However, a mechanism for arranging the clinch pins 100 may be provided separately from the attachment head 61 for attaching the electronic component P.

  Moreover, in the said embodiment, the clinch pin arrangement | positioning process was automatically performed irrespective of the operator's hand. However, the arrangement of the clinch pin 100 may be executed by the operator's hand.

  Moreover, in the said embodiment, the clinch pin 100 was comprised so that the arrangement | positioning location could be changed. However, as in Patent Document 1, the present invention can also be applied to the clinch pin 100 whose location is fixed.

DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus 3 ... Backup part 31 ... Backup plate 61 ... Mounting head 100 ... Clinch pin 110 ... Base member 120 ... Lead receiving member 123 ... Lead receiving groove 140 ... Additional processing mechanism 141 ... Outer cylinder 141a ... Blade 144 ... Board protection Member 171 ... Press-fit hole 172 ... Compression spring D ... Part mounting direction L ... Working position Pl ... Lead part 1 ... Lead S ... Substrate Sb ... Back side (of substrate) Sf ... (Substrate) surface h ... Insertion hole Wa ... Installation Location Wb ... Location

Claims (6)

With respect to the component mounting direction, the lead of the lead component inserted into the insertion hole of the substrate from the component mounting direction from one main surface of the substrate to the other main surface contacts the other main surface side of the substrate. A lead receiving member that has an inclined portion that is inclined and bends the lead that has been inserted into the insertion hole along the inclined portion;
An outer cylinder that moves from the opposite direction of the component mounting direction to the lead inserted into the insertion hole of the substrate and bent along the inclined portion, and processes the lead ; and
A shaft connected to the outer cylinder;
A base member having an internal space in which the shaft is disposed and having the outer cylinder fitted to the outside;
With
The base member is provided with a press-fitting hole communicating with the inner space, and the shaft is lifted by air press-fitted into the inner space from the press-fitting hole, so that the outer cylinder is lifted and abutted against the lead. A clinch device characterized by that. The clinching device according to claim 1, wherein the outer cylinder performs a process of abutting the lead and pushing the lead to bend. The clinching device according to claim 1, wherein the outer cylinder performs a process of abutting the lead and cutting the lead. A protective member for protecting the substrate from the outer cylinder between the lead bent along the inclined portion and the substrate is further provided, and the outer cylinder abuts on the lead and is interposed between the protective member and the substrate. The clinching apparatus according to claim 3, wherein a process of cutting the lead by sandwiching the lead is performed. The clinch device according to claim 4, wherein a blade in contact with the lead is formed on at least one of the protective member and the outer cylinder . A board fixing means for fixing the board in which the insertion hole for inserting the lead of the lead part is formed with respect to the mounting position of the lead part at a working position;
Component supply means for supplying the lead component;
The lead component supplied from the component supply means is transported to the mounting location on the substrate fixed at the work position, and the plug is inserted from a component mounting direction from one main surface of the substrate toward the other main surface. A work head for performing a component mounting process for pushing the lead component in the component mounting direction while inserting the lead into the hole;
A support member for supporting a clinch device that bends the lead in contact with the lead that is inserted into the insertion hole and protrudes from the other main surface of the substrate in the component mounting process;
The clinch device,
An inclined portion that is in contact with the lead inserted into the insertion hole of the substrate and that is inclined with respect to the component mounting direction, and the lead inserted into the insertion hole extends along the inclined portion. and the lead receiving member bend Te Align,
An outer cylinder that moves from the opposite direction of the component mounting direction to the lead inserted into the insertion hole of the substrate and bent along the inclined portion, and processes the lead ; and
A shaft connected to the outer cylinder;
A base member having an internal space in which the shaft is disposed and having the outer cylinder fitted to the outside;
Have
The base member is provided with a press-fitting hole communicating with the inner space, and the shaft is lifted by air press-fitted into the inner space from the press-fitting hole, so that the outer cylinder is lifted and abutted against the lead. A component mounting device characterized by that.

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