JP6027778B2 - Component mounting device, component mounting method - Google Patents

Description

  The present invention relates to a component mounting technique for bending a lead of a lead component inserted into an insertion hole formed in a substrate and attaching the lead component to a substrate.

  Patent Document 1 describes a clinch mechanism for attaching a lead component to a substrate by inserting the lead of the lead component into an attachment hole (insertion hole) formed in the substrate and bending the tip of the lead protruding from the substrate. Has been. The clinching mechanism includes a head unit disposed above the substrate and a clinching unit disposed below the substrate. When the head unit inserts the lead of the lead component into the mounting hole from above the substrate, the tip of the lead protruding downward from the substrate comes into contact with the clinch unit. The clinch unit has an inclined surface that is cut obliquely, and the tip of the lead that contacts the clinch unit is bent along the inclined surface. The tip of the bent lead is engaged with the mounting hole, and the lead component is attached to the substrate.

Japanese Patent Laid-Open No. 06-112692

  By the way, the positional relationship between the mounting location of the lead component and the substrate is not always the same. For example, when the type of board to be produced has changed, it is necessary to change the positional relationship between the lead component mounting location and the board according to the board type. In such a case, according to the clinching mechanism as described above, the positional relationship between the substrate and the clinching unit is changed by appropriately moving the substrate, and the positional relationship between the mounting location of the lead component and the substrate is changed. be able to.

  However, it is not always possible to ensure the range of movement of the substrate with a wide enough area to change the positional relationship between the lead component mounting location and the substrate. For example, when the size of the apparatus is reduced, the movement range of the substrate is naturally limited. Therefore, in the configuration in which the positional relationship between the substrate and the clinch unit is changed only by the movement of the substrate, there is a limit to the range in which the positional relationship between the lead part attachment location and the substrate can be changed.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of changing the positional relationship between a mounting location of a lead component and a substrate without requiring a wide movement range of the substrate.

  In order to achieve the above object, the component mounting apparatus according to the present invention is a substrate fixing means for fixing a substrate in which an insertion hole for inserting a lead of a lead component is formed at a mounting position of the lead component at a work position. And a lead supplying part for supplying the lead part, and the lead part supplied from the part supplying means is transported to the mounting position on the board fixed at the work position, and the lead of the lead part is inserted into the insertion hole of the mounting position. Remove and attach the work head that performs the component mounting process to be inserted from one main surface side of the board, and the clinch device that bends the lead by contacting the lead that is inserted into the insertion hole and protrudes from the other main surface of the board by the component mounting process The clinching device and the support member are configured so that the location of the clinch device can be changed according to the mounting location of the lead component. It is characterized by performing the clinch device arrangement processes for arranging clinch instrument arrangement position before the start of the component mounting process.

  In order to achieve the above object, the component mounting method according to the present invention is a substrate fixing step for fixing a substrate in which an insertion hole for inserting a lead of a lead component is formed at a mounting position of the lead component at a work position. The lead component supplied to the component supply position is transported to the mounting position on the board fixed at the work position, and the lead of the lead component is inserted into the insertion hole of the mounting position from the one main surface side of the board. And a component mounting step of bending the lead by bringing the clinch tool into contact with the lead protruding from the other main surface of the board, and a clinch tool whose placement location can be changed according to the mounting location of the lead component is attached to the mounting location. It is characterized in that the clinch instrument placement step to be placed at the corresponding placement location is executed before the start of the component mounting step.

  In the invention configured as described above (component mounting apparatus, component mounting method), the board in which the insertion hole for inserting the lead of the lead component is formed with respect to the mounting location of the lead component is fixed at the working position. . Subsequently, the lead component is transported to the mounting location of the board, and the lead of this lead component is inserted into the insertion hole of the mounting location from one main surface side of the board (component mounting processing, component mounting process). Then, the clinching instrument comes into contact with the lead that is inserted into the insertion hole and protrudes from the other main surface of the substrate in the component attachment process (process), and bends the lead. The lead bent in this way engages with the insertion hole, and the lead component is attached to the substrate.

  In particular, in this invention, it is comprised so that the arrangement | positioning location of a clinching instrument can be changed according to the attachment location of lead components. And the clinch instrument arrangement | positioning process (process) which arrange | positions a clinching instrument in the arrangement | positioning location according to an attachment location is performed before the start of a component attachment process (process). In such a configuration, when it is necessary to change the positional relationship between the mounting location of the lead component and the substrate, the location of the clinch device is changed accordingly, and the clinch device is changed to the location after the change. With this arrangement, it is possible to cope with a change in the positional relationship between the mounting location of the lead component and the board without moving the board. Therefore, it is possible to change the positional relationship between the mounting location of the lead component and the substrate without requiring a wide movement range of the substrate.

  By the way, the attachment location of the lead component is not limited to one, and a plurality of attachment locations may be provided on the substrate. In such a case, according to the clinching mechanism as in Patent Document 1, the operation of moving the substrate so that the attachment location is located above the clinching unit and attaching the lead component to the attachment location is performed at each attachment location. It is possible to attach a lead component to each of a plurality of attachment locations by repeatedly performing the above. However, it is not always possible to ensure the range of movement of the substrate with a sufficient width to move the substrate until the mounting location is located above the clinch unit. Therefore, such a method involving the movement of the substrate is not necessarily appropriate.

  Therefore, it is conceivable to apply the present invention. Specifically, a plurality of mounting locations are provided on the substrate, and the component mounting apparatus is arranged so that the clinch fixture is disposed at each of the plurality of placement locations corresponding to the plurality of mounting locations in the clinch fixture placement processing. May be configured. In such a configuration, the clinching instrument is arranged at each of a plurality of arrangement locations corresponding to the plurality of attachment locations. Therefore, the lead component can be attached to each of the plurality of attachment locations without moving the substrate, which is preferable.

  Further, the component mounting apparatus may be configured to further mount the surface mount component on the substrate fixed at the work position. In such a configuration, both the lead component and the surface mount component can be attached to the substrate, and the versatility of the component attachment device can be improved.

  In a configuration in which both a lead component and a surface mount component can be attached, it may not be possible to grasp which component is a lead component among a plurality of components attached to the substrate. In such a case, it is also conceivable to arrange clinching devices for all parts regardless of the type of the parts. However, it is originally a wasteful operation to dispose the clinching instrument even on a surface-mounted component that does not require a clinching instrument for attachment, and is not appropriate.

  Therefore, a user interface that allows the user to specify a lead component from among a plurality of components that are attached to the board is further provided. In the clinch instrument arrangement process, an arrangement location corresponding to the attachment location of the lead component set by the user on the user interface The component attachment device may be configured such that the clinch device is disposed on the device. In such a configuration, since the lead component is designated by the user, it is possible to grasp which component is the lead component among the plurality of components attached to the board. In the clinching instrument arrangement process, the clinching instrument can be appropriately arranged at the arrangement location corresponding to the attachment location of the lead component thus grasped. As a result, generation | occurrence | production of the useless operation | movement which arrange | positions a clinching instrument with respect to a surface mounting component can be suppressed.

  In addition, based on the result of obtaining the position of the arrangement location where the clinch instrument is arranged from the data indicating the position of the attachment location where the lead component is attached, the component is controlled so as to control the position where the clinch instrument is arranged in the clinch instrument arrangement process. An attachment device may be configured. In such a configuration, it is possible to appropriately control the position of the clinch instrument placement location according to the location of the lead component attachment location. Therefore, the lead inserted into the insertion hole provided at the attachment location can be brought into contact with the clinching device placed at the placement location accurately and bent, and the lead component can be securely attached to the attachment location. it can.

  Further, based on the result of obtaining the angle at which the clinch instrument is arranged at the arrangement location from the data indicating the angle at which the lead component is attached at the attachment location, the component is controlled so as to control the angle at which the clinch instrument is arranged in the clinch instrument arrangement process. An attachment device may be configured. In such a configuration, it is possible to appropriately control the angle at which the clinch instrument is disposed in accordance with the angle at which the lead component is attached. Therefore, the lead inserted into the insertion hole provided at the attachment location can be brought into contact with the clinching device placed at the placement location accurately and bent, and the lead component can be securely attached to the attachment location. it can.

  The component mounting apparatus may be configured to further include a housing member that houses the clinching instrument, and the work head carries the clinching instrument placement process by carrying the clinching instrument from the housing member to the placement location. In such a configuration, the transport of both the lead component and the clinching instrument can be performed with a common working head. Therefore, it is not necessary to provide a structure for transporting each of the lead component and the clinching instrument, and it is possible to reduce the size and cost of the apparatus.

  At this time, the position of the support member at the time of executing the clinch instrument arrangement process is located closer to the position of the one main surface of the substrate at the time of executing the component mounting process than the position of the support member at the time of executing the component mounting process. Moreover, you may comprise a component attachment apparatus. In such a configuration, the range in which the work head moves for the component mounting process and the range in which the work head moves for the clinch instrument arrangement process can be brought close to each other. Therefore, it is not necessary to ensure a wide movement range of the work head, and the apparatus configuration can be simplified.

  Further, the apparatus further includes a substrate transport unit that transports the substrate to the work position, and the substrate fixing unit transports the substrate to the work position in the component mounting apparatus that fixes the substrate transported to the work position by the substrate transport unit. Prior to this, the component mounting apparatus may be configured to execute the clinch instrument arrangement process. In such a configuration, when the clinch instrument arrangement process is executed, there is no substrate at the work position, and therefore, the access to the mounting member is facilitated. As a result, it is possible to easily execute the clinching instrument arrangement process for arranging the clinching instrument on the attachment member.

  As described above, according to the present invention, it is possible to change the positional relationship between the attachment location of the lead component and the substrate without requiring a wide movement range of the substrate.

It is a top view which shows schematic structure of the component attachment apparatus which can apply this invention. It is a partial front view of the component attachment apparatus shown in FIG. It is a block diagram which shows the main electrical structures of the component attachment apparatus shown in FIG. It is a flowchart which shows an example of the operation | movement performed with the components attachment apparatus of FIG. It is a figure which shows an example of the display mode of the board | substrate data on a display. It is the top view which showed typically an example of the arrangement | positioning aspect of the clinch pin to a backup plate. It is a perspective view which shows an example of a clinch pin roughly. It is sectional drawing which shows the partial cross section of the clinch pin of FIG. 7 roughly. It is a perspective view which shows roughly the structure concerning the modification of a clinch pin. FIG. 10 is a partial cross-sectional view schematically showing the configuration and operation of the clinch pin shown in FIG. 9. FIG. 10 is a partial cross-sectional view schematically showing the configuration and operation of the clinch pin shown in FIG. 9.

  FIG. 1 is a plan view showing a schematic configuration of a component mounting apparatus to which the present invention is applicable. FIG. 2 is a partial front view of the component mounting apparatus shown in FIG. FIG. 3 is a block diagram showing the main electrical configuration of the component mounting apparatus shown in FIG. The component mounting apparatus 1 shown in these drawings has a configuration capable of mounting both the surface mount component Ps and the lead component Pl to the substrate S. In FIG. 1 and FIG. 2 and the drawings shown below, XYZ orthogonal coordinate axes with the Z-axis direction as the vertical direction are shown as appropriate in order to clarify the directional relationship between the drawings.

  In the component mounting apparatus 1, the substrate transport mechanism 2 is disposed on the base 11, and the substrate S can be transported in a predetermined transport direction X. More specifically, the substrate transport mechanism 2 has a pair of conveyors 21 and 21 that transport the substrate S from the right side to the left side of FIG. And the conveyors 21 and 21 perform conveyance of the board | substrate S according to the command from the drive control part 210 of the control unit 200. FIG. Specifically, the conveyors 21 and 21 stop the substrate S carried in from the outside of the apparatus at a predetermined work position L (the position of the substrate S shown in FIGS. 1 and 2) and fix it by a fixing means (not shown). Hold. When the mounting of the electronic component P (surface mount component Ps, lead component Pl) to the substrate S on which the head unit 6 described later is fixed at the work position L is completed, the conveyors 21 and 21 carry the substrate S out of the apparatus. To do.

  On the base 11, a backup unit 3 that supports the substrate S fixed at the work position L from below is provided. The backup unit 3 supports the substrate S by abutting the plurality of clinch pins 100 detachably disposed on the upper surface of a flat backup plate 31 (push-up plate) from below. The reason why such clinch pin 100 is used is as follows.

  In the component mounting apparatus 1, the surface mount component Ps and the lead component Pl are mounted on the substrate S. Of these, the lead component Pl is attached by inserting the lead of the lead component Pl into the substrate S while applying a certain load to the lead component Pl. Therefore, the substrate S may be bent by the load accompanying the attachment of the lead component Pl only by the holding by the conveyors 21 and 21. Accordingly, the clinch pin 100 is arranged at an arrangement location corresponding to the attachment location of the lead component Pl, and the attachment location is supported by the clinch pin 100, thereby suppressing the bending of the substrate S due to the attachment of the lead component Pl. Further, in order to attach the lead component Pl to the substrate S, it is necessary to clinch the lead l of the lead component Pl. Therefore, the clinch pin 100 has not only a function of suppressing the bending of the substrate S but also a function of clinching the lead 1 of the lead component Pl attached to the substrate S. In addition, if the kind of the board | substrate S to produce differs, the attachment location of the lead components Pl will also differ. Therefore, the arrangement location of the clinch pin 100 can be changed according to the arrangement location of the lead component Pl.

  Further, the backup unit 3 includes an elevating mechanism 35 that elevates and lowers the backup plate 31 in response to a command from the drive control unit 210. Specifically, when the conveyors 21 and 21 are fixing the substrate S to the working position L, the lifting mechanism 35 positions the upper surface of the backup plate 31 at the initial height z0 and the substrate at the upper end of the clinch pin 100. S is supported from below. On the other hand, when the conveyors 21 and 21 convey the substrate S, the elevating mechanism 35 lowers the upper surface of the backup plate 31 from the initial height z0 to prevent interference between the substrate S being conveyed and the clinch pin 100.

  On the front side (+ Y axis direction side) and the rear side (−Y axis direction side) of the conveyors 21, the component supply unit 4 is arranged. The component supply unit 4 includes a surface mount component supply unit 4s and a lead component supply unit 4l. The surface mount component supply unit 4s has a configuration in which a large number of feeders 41s for supplying a surface mount component Ps as the electronic component P are arranged in the X-axis direction. Each feeder 41 s is a tape feeder provided with a reel (not shown) around which a tape storing and holding the surface-mounted component Ps is wound, and the surface-mounted component Ps can be supplied to the head unit 6. Specifically, on the tape, small chip electronic components Ps such as an integrated circuit (IC), a transistor, and a capacitor are stored and held at predetermined intervals. Then, the feeder 41s feeds the tape from the reel toward the head unit 6 to intermittently feed the surface-mounted component Ps in the tape to the component suction position. As a result, the surface-mounted component Ps can be picked up by the suction nozzle 62 mounted on the mounting head 61 of the head unit 6.

  On the other hand, the lead component supply unit 4l has a configuration in which a large number of feeders 41l for supplying the lead component Pl as the electronic component P are arranged in the X-axis direction. Each feeder 41l is provided with a carrier tape (not shown) for holding a plurality of lead parts Pl at predetermined intervals, as in the feeder described in, for example, Japanese Patent Laid-Open No. 2007-180280. By sending it out to the head unit 6 side, the lead part Pl is intermittently sent out to the part suction position. As a result, the lead component Pl can be picked up by the suction nozzle 62 mounted on the mounting head 61 of the head unit 6.

  The head unit 6 transports the electronic component P sucked and held by the suction nozzle 62 of the mounting head 61 to the substrate S and transfers it to the mounting location designated by the user. Specifically, the head unit 6 includes six mounting heads 61F arranged in a line in the X axis direction on the front side and six mounting heads 61R arranged in a line in the X axis direction on the rear side. A total of 12 mounting heads 61 are provided. That is, as shown in FIGS. 1 and 2, in the head unit 6, six mounting heads 61F extending in the vertical direction Z are provided in a row at an equal pitch in the X-axis direction. Further, a rear row that is configured in the same manner as the front row is also provided on the rear side (−Y-axis direction side) with respect to the mounting head 61F. That is, six mounting heads 61R extending in the vertical direction Z are provided in a row at an equal pitch in the X-axis direction. The mounting head 61F and the mounting head 61R are arranged with a half-pitch shift in the X-axis direction, and are arranged in a zigzag shape in plan view as shown in FIG. Therefore, when viewed from the Y-axis direction, as shown in FIG. 2, the twelve mounting heads 61 are arranged in a line in the X-axis direction without overlapping each other.

  The tip of each mounting head 61 to which the suction nozzle 62 is attached can communicate with any of the negative pressure generator, the positive pressure generator, and the atmosphere via the pressure switching mechanism 7. The grip controller 220 of the control unit 200 can switch the pressure applied to the tip of the mounting head 61 by controlling the pressure switching mechanism 7. Therefore, when a negative pressure suction force from the negative pressure generator is applied to the tip portion of the mounting head 61 by pressure switching, the suction nozzle 62 attached to the tip portion sucks and holds the electronic component P. Conversely, when positive pressure from the positive pressure generator is applied to the tip of the mounting head 61, the suction holding of the electronic component P by the suction nozzle 62 is released, and the electronic component P is attached to the substrate S. After the electronic component P is attached, the suction nozzle 62 is opened to the atmosphere. Thus, in the head unit 6, the electronic component P can be attached and detached by controlling the negative pressure adsorption force and the positive pressure supply by the grip control unit 220.

  Each mounting head 61 can be moved up and down (moved in the Z-axis direction) with respect to the head unit 6 by a nozzle lifting drive mechanism (not shown) and rotated around the nozzle center axis by a nozzle rotation driving mechanism (not shown). Direction rotation). Among these drive mechanisms, the nozzle raising / lowering drive mechanism is mounted between a lowered position (lower end) when the electronic component P is attracted or attached and an elevated position (upward end) when the electronic component P is conveyed. The head 61 is moved up and down. On the other hand, the nozzle rotation drive mechanism is a mechanism for rotating the suction nozzle 62 as necessary, and the electronic component P can be positioned in a predetermined R direction during attachment by rotation drive. These drive mechanisms are each composed of a Z-axis servo motor Mz, an R-axis servo motor Mr, and a predetermined power transmission mechanism. The drive control unit 210 controls the Z-axis servo motor Mz and the R-axis servo motor Mr. By controlling the drive, each mounting head 61 can be moved in the Z-axis direction and the R direction.

  The head unit 6 that holds these mounting heads 61 is movable in the X-axis direction and the Y-axis direction (directions orthogonal to the X-axis and Z-axis directions) over a predetermined range of the base 11. That is, the head unit 6 is supported so as to be movable along the X axis with respect to the mounting head support member 63 extending in the X axis direction. Further, both ends of the mounting head support member 63 are supported by a fixed rail 64 in the Y-axis direction, and are movable along the fixed rail 64 in the Y-axis direction. The head unit 6 is driven in the X-axis direction by the X-axis servo motor Mx via the ball screw 66, and the mounting head support member 63 is driven in the Y-axis direction by the Y-axis servo motor My via the ball screw 68. Is done. Therefore, the drive control unit 210 can drive the X-axis servomotor Mx and the Y-axis servomotor My to move the head unit 6 to a predetermined position in the XY plane. As a result, the head unit 6 can be moved as appropriate, and the electronic component P attracted by the mounting head 61 can be transported from the component supply unit 4 to the mounting location.

  The component mounting apparatus 1 is provided with two types of cameras (component recognition camera C1 and component inspection camera C2) that image the electronic component P. The component recognition camera C1 is composed of an illumination unit, a CCD (Charge Coupled Device) camera, and the like, and is arranged on the base 11, and confirms the suction state of the electronic component P by the suction nozzle 62 of each mounting head 61. Mainly used for. Specifically, the drive control unit 210 moves the head unit 6 as appropriate, thereby moving the electronic component P attracted by the suction nozzle 62 above the component recognition camera C1. In this state, the image of the electronic component P captured by the component recognition camera C1 is transferred to the control unit 200 (the image processing unit 230). The control unit 200 controls the R-axis servo motor Mr by the drive control unit 210 based on this image, thereby appropriately rotating the mounting head 61 in the R direction to appropriately adjust the angle of the electronic component P mounted on the substrate S. Adjust to.

  On the other hand, the component inspection camera C2 includes an illumination unit and a CCD camera and is mounted on the head unit 6 and is mainly used for inspecting the mounting state of the electronic component P attached to the substrate S. Specifically, the drive control unit 210 moves the head unit 6 as appropriate, thereby moving the component inspection camera C2 above the attachment location of the electronic component P. In this state, the image of the electronic component P captured by the component inspection camera C 2 is transferred to the image processing unit 230. The image processing unit 230 determines whether the electronic component P is attached or not from the transferred image of the electronic component P.

  As will be described in detail later, in this embodiment, the clinch pins 100 are disposed at predetermined positions on the backup plate 31 by the mounting head 61 of the head unit 6. In other words, in the autonozzle changer 81 arranged on the rear side (−Y-axis direction side) of the backup unit 3, the suction nozzle 62 p for the electronic component P and the clinch pin are used as the suction nozzle 62 that can be attached to the tip of the mounting head 61. The suction nozzle 62c for 100 is prepared, and the suction nozzle 62 attached to the mounting head 61 can be exchanged between them. In addition, a stocker 82 that houses a plurality of clinch pins 100 is disposed on the front side (+ Y-axis direction side) of the backup unit 3. The clinch pin 100 is sucked and conveyed from the stocker 82 to the backup plate 31 by using the mounting head 61 to which the suction nozzle 62c for the clinch pin 100 is attached, so that the clinch pin 100 is placed at a predetermined position of the backup plate 31. Can be arranged. Note that the movement of the mounting head 61 at this time is controlled by the drive control unit 210 in the same manner as the conveyance of the electronic component P described above.

  As shown in FIG. 3, the component mounting apparatus 1 includes a display 91 and an input device 92 that function as an interface with a user. The display 91 has a function as an input terminal that is configured with a touch panel and receives an input from a user, in addition to a function of displaying an operation state or the like of the component mounting device 1. The input device 92 includes a mouse and a keyboard, and fulfills a function of receiving input from the user. The input / output control for the display 91 and the input device 92 is executed by the input / output control unit 240 of the control unit 200.

  The overall operation of the component mounting apparatus 1 configured as described above is comprehensively controlled by the main control unit 250. That is, the main control unit 250 controls the entire apparatus 1 by exchanging signals with each unit of the control unit 200 via the bus 270 based on programs and data stored in the storage unit 260. Specifically, the storage unit 260 stores a pin arrangement program 261 and an attachment program 262 (production program). The pin placement program 261 is a program for controlling the mounting head 61 and the like in order to place the clinch pin 100 at the place where the backup plate 31 is placed. The attachment program 262 is a program for controlling the attachment head 61 and the like in order to attach the electronic component P to the attachment location of the substrate S. In addition to the position and angle for attaching the electronic component P to the substrate S, Information such as installation procedures is incorporated. Subsequently, an example of an operation executed under the control of the main control unit 250 will be described.

  FIG. 4 is a flowchart showing an example of an operation executed by the component mounting apparatus of FIG. In the figure, a flowchart when the type of the production substrate is switched is shown. That is, when the user instructs switching of the board type via the user interfaces 91 and 92, the flowchart of FIG. In step S <b> 101, substrate data indicating the position and angle at which the electronic component P is attached to the substrate S is read from the attachment program 262 stored in the storage unit 260. The board data is displayed as a list on the display 91 (FIG. 5).

  FIG. 5 is a diagram illustrating an example of how the substrate data is displayed on the display. As shown in FIG. 5, in the display 91, for each of the electronic components P1, P2,..., A position (X coordinate, Y coordinate) for mounting the electronic component and an angle (R angle) for mounting the electronic component are shown. Further, the display 91 shows a lead component check box for designating whether or not each of the electronic components P1, P2,... Is the lead component Pl. Then, the user checks the lead component check box of the electronic component P, which is the lead component Pl, using the touch panel function of the display 91 or the input device 92 (step S102). Incidentally, in the example of FIG. 5, the lead component check boxes for the electronic components P2 and P6 are checked.

  In step S103, the mounting information of the lead component Pl is extracted based on the user input result in step S102. Specifically, in this step, the position (X coordinate, Y coordinate) of the attachment location of the electronic components P2, P6 designated by the user as the lead component Pl is extracted. And the position of the arrangement | positioning location of the clinch pin 100 is calculated | required from the position of the attachment location of lead components P2 and P6. Note that the location where the lead component Pl is attached and the location where the clinch pin 100 is disposed differ only in the position in the Z-axis direction. Therefore, the position (X coordinate, Y coordinate) of the attachment location of the lead parts P2, P6 is obtained as the position (X coordinate, Y coordinate) of the arrangement location of the clinch pin 100.

  In step S103, the mounting angle (R direction) of the electronic components P2 and P6 designated as the lead component Pl by the user is extracted and obtained as the arrangement angle of the clinch pin 100. That is, as will be described in detail later with reference to FIG. 7 and the like, the clinch pin 100 receives the lead 1 of the lead component Pl in the lead receiving groove 123 and clinches the lead l. Therefore, if the lead receiving groove 123 is inclined with respect to the lead l, the lead l cannot be properly received by the lead receiving groove 123, and the lead l may not be clinched reliably. Therefore, in order to accurately receive the lead 1 by the lead receiving groove 123 by adjusting the arrangement angle of the clinch pin 100 to the mounting angle of the lead component Pl, in step S103, the mounting angle (R direction) of the lead component Pl is the clinch pin 100. It is obtained as the arrangement angle (R direction).

  Subsequently, when the suction nozzle 62 of the mounting head 61 is replaced with the clinch pin suction nozzle 62c in step S104, the clinch pin arrangement process in step S105 is executed. In this clinch pin placement process, the clinch pin 100 is placed on the backup plate 31 based on the placement position and angle obtained in step S103. More specifically, the main controller 250 captures the angle of the clinch pin 100 by imaging the clinch pin 100 to be arranged housed in the stocker 82 with the component inspection camera C2. Specifically, the angle of the clinch pin 100 is grasped based on the result of recognizing the marker attached to the lead receiving groove 123 (FIG. 7) of the clinch pin 100 or the clinch pin 100. Then, the arrangement of the clinch pin 100 on the backup plate 31 is executed based on the arrangement position and angle obtained in step S103 and the angle of the clinch pin 100 recognized by the component inspection camera C2 (FIG. 6). Here, FIG. 6 is a plan view schematically showing an example of an arrangement mode of clinch pins on the backup plate. As shown in FIG. 6, the clinch pin 100 is arranged on the backup plate 31 according to the position and angle at which the lead component Pl specified by the user is attached.

  In the clinch pin placement process, the height of the upper surface of the backup plate 31 is changed from the initial height z0. The reason for this is as follows. That is, when the electronic component P is attached to the substrate S fixed at the work position L, the attachment head 61 performs the operation on the surface Sf of the substrate S at the component attachment height zf. On the other hand, when the clinch pin 100 is arranged, the mounting head 61 works on the upper surface of the backup plate 31. Therefore, the mounting head 61 needs to have a movement range that can access both the surface Sf of the substrate S at the component mounting height zf and the upper surface of the backup plate 31. Therefore, if the height of the upper surface of the backup plate 31 at the time of clinch pin placement processing is significantly different from the component mounting height zf, it is necessary to secure a wide movement range of the mounting head 61. Not always easy.

  In order to cope with this, when executing the clinch pin arrangement process, the height of the upper surface of the backup plate 31 is raised to the component mounting height zf side from the initial height z0. In such a configuration, the range in which the mounting head 61 moves to mount the electronic component P on the substrate S and the range in which the mounting head 61 moves to place the clinch pin 100 can be brought close to each other. Therefore, it is not necessary to secure a wide movement range of the mounting head 61, and the configuration of the device 1 can be simplified.

  In step S105, when all the clinch pins 100 necessary for mounting the lead component Pl are arranged and the clinch pin arrangement processing is completed, the suction nozzle 62 of the mounting head 61 is replaced with a suction nozzle 62p for electronic components (step S105). S106), the substrate S is loaded and fixed at the work position L (step S107). In this way, preparation for starting attachment of the electronic component P is completed.

  In the surface mounting component mounting process in step S108, mounting of the surface mounting component Ps to the substrate S is executed. Specifically, the mounting head 61 sucks and holds the surface mounting component Ps supplied by the surface mounting component supply unit 4s by the suction nozzle 62p, and conveys the surface mounting component Ps to the mounting position on the surface Sf of the substrate S. Then, a positive pressure is applied to the suction nozzle 62p, and the surface mount component Ps is attached from the suction nozzle 62p to the attachment location of the substrate S. When this attachment operation is executed for all the surface-mounted components Ps, step S109 is executed.

  In the lead component attachment processing in step S109, attachment of the lead component Pl to the substrate S is executed. Specifically, the lead component Pl supplied by the lead component supply unit 4l is sucked and held by the mounting head 61 with the suction nozzle 62p, and is transported to the mounting location on the surface Sf of the substrate S. Then, the lead of the lead component Pl is inserted into the insertion hole provided at the mounting location while applying a certain load to the lead component Pl downward from the Z-axis direction by the mounting head 61. At this time, the load applied to the lead component Pl is adjusted by controlling the drive current of the Z-axis servomotor Mz. Further, since the clinch pin 100 is disposed below the mounting position of the lead component Pl, the lead of the lead component Pl protruding from the back surface Sb of the substrate S is clinched by the clinch pin 100. Thus, the lead component Pl is attached to the substrate S. When this mounting operation is executed for all the lead parts Pl, step S110 is executed.

  In step S110, the substrate S is unloaded from the work position L, and in the subsequent step S111, it is determined whether or not the production of all the substrates S has been completed. If the production is incomplete (in the case of “NO” in step S111), the process returns to step S107 and the production of the substrate S is continued. On the other hand, when production is completed (in the case of “YES” in step S111), the production substrate is terminated.

  The above is the details of the configuration and operation of the component mounting device 1. Next, the configuration and operation details of the clinch pin 100 used in the component mounting apparatus 1 will be described. FIG. 7 is a perspective view schematically showing an example of a clinch pin. FIG. 8 is a cross-sectional view schematically showing a partial cross section of the clinch pin of FIG. The clinch pin 100 is disposed on the backup plate 31 in order to attach a lead component Pl such as a resistor or a capacitor to the substrate S. In FIG. 7 and FIG. 8, the lead component Pl that is the work target of the clinch pin 100, the substrate S A backup plate 31 is also shown. In FIG. 7, the structure hidden behind the substrate S is also shown through the substrate S.

  A predetermined number (two in the illustrated example) of wire-like leads 1 is extended from the lead component Pl. The lead l performs a function of connecting the lead component Pl to the substrate S and a function of electrically connecting the lead component Pl to the pattern of the substrate S. On the other hand, the board S is provided with an insertion hole h for inserting the lead 1 of the lead component Pl with respect to the attachment location Wa of the component P. The insertion hole h penetrates the substrate S and is inserted from the component mounting direction D (direction parallel to the Z-axis direction) from the front surface Sf (one main surface) of the substrate S to the back surface Sb (the other main surface). The lead component Pl is attached to the substrate S by bending the lead l inserted into h and projecting below the substrate S.

  As shown in FIGS. 7 and 8, the clinch pin 100 has a cylindrical shape extending in the Z-axis direction. More specifically, the clinch pin 100 has a schematic configuration in which a lead receiving member 120 is attached to the upper end of a cylindrical base member 110 extending in the Z-axis direction. At the upper end of the base member 110, a fitting hole 111 having a rotationally symmetric shape with respect to the Z axis and opening upward is formed. On the other hand, the lead receiving member 120 includes a disk-shaped head 121 and a rod-shaped fitting protrusion 122 protruding downward from the head 121, and has a rotationally symmetric shape with respect to the Z axis. . The lead receiving member 120 is supported by the base member 110 in a state where the fitting protrusion 122 of the lead receiving member 120 is fitted into the fitting hole 111 of the base member 110 from above.

  The diameter of the fitting protrusion 122 is smaller than the diameter of the fitting hole 111. Therefore, the fitting protrusion 122 is fitted to the fitting hole 111 with a gap. Therefore, the lead receiving member 120 can be displaced with respect to the base member 110 in a plane orthogonal to the component mounting direction D (in the XY plane). A ball bearing 130 composed of a plurality of balls arranged so as to surround the fitting protrusion 122 is disposed between the lower surface of the head 121 of the lead receiving member 120 and the upper surface of the base member 110. Therefore, the lead receiving member 120 can be smoothly displaced with respect to the base member 110 by the function of the ball bearing 130.

  Specifically, the lead receiving member 120 can be translated in a plane orthogonal to the component mounting direction D, or can be rotated about an axis extending in the component mounting direction D. Incidentally, the parallel movement of the lead receiving member 120 is restricted to the range of the gap between the fitting protrusion 122 and the fitting hole 111. Further, the rotational movement of the lead receiving member 120 is regulated by the rotation regulating member 190.

  The rotation restricting member 190 has a hollow cylindrical shape, is covered on the lead receiving member 120 from the component mounting direction D, and is fixed to the base member 110 by a rod-shaped fixing member 195. A slit 191 is formed at the head of the rotation restricting member 190, and a protrusion 121 a formed at the head 121 of the lead receiving member 120 protrudes upward from the slit 191. The width of the protruding portion 121a is narrower than the width of the slit 191, and a gap is provided between the slit 191 and the protruding portion 121a. As a result, the lead receiving member 120 can rotate in the range of the gap between the slit 191 and the protruding portion 121a.

  On the upper surface of the head portion 121 of the lead receiving member 120, a predetermined number of lead receiving grooves 123 (in the drawing) are formed so as to overlap the protruding portion 121a and are cut in the radial direction of the lead receiving member 120 and open upward and laterally. In the example, two are formed). These lead receiving grooves 123 are provided corresponding to the leads 1 of the lead component Pl, and are formed so as to be rotationally symmetric (180 degrees symmetrical in the example in the figure) with respect to the center line (rotation symmetry axis) of the lead receiving member 120. Has been. The lead receiving groove 123 is formed from a slightly outer side of the center line of the lead receiving member 120 to the peripheral surface, and has a slope shape that descends toward the peripheral surface of the lead receiving member 120. More specifically, the lead receiving groove 123 has a shape in which a steep slope and a gentle slope having a smaller inclination angle than that of the steep slope are rounded and smoothly connected, and is loosened from the steep slope from the center line of the lead receiving member 120 toward the peripheral surface. It is formed to reach the slope.

  When the lead component Pl is clinched to the substrate S, the clinch pin 100 is disposed at the disposition location Wb below the substrate S so that the lead receiving groove 123 of the clinch pin 100 is located below the insertion hole h of the substrate S. The Then, the lead component Pl is pushed downward from the state where the lead l of the lead component Pl is inserted into the insertion hole h. As a result, the lead 1 projecting downward from the substrate S is further pushed in after contacting the lead receiving groove 123 and bent along the shape of the lead receiving groove 123. Thus, the lead l is clinched and the lead component Pl is attached to the substrate S. At this time, as shown in FIG. 8, the end of the lead l protrudes outward from the peripheral surface of the lead receiving member 120.

  Further, a support protrusion 124 is formed on the upper surface of the head 121 of the lead receiving member 120, and the clinch pin 100 contacts the back surface Sb of the substrate S with the support protrusion 124 to support the substrate S. As a result, the substrate S is supported by the clinch pin 100 against the load that is applied when the lead component Pl is attached, and the bending of the substrate S is suppressed. A magnet 135 is screwed to the lower end of the base member 110, and the clinch pin 100 is attached to the backup plate 31 by magnetic force. Accordingly, the clinch pin 100 can be firmly erected on the backup plate 31 against the force from the substrate S.

  As described above, in this embodiment, the substrate S in which the insertion hole h for inserting the lead 1 of the lead component Pl is formed in the attachment location Wa of the lead component Pl is fixed to the working position L. The Subsequently, the lead component Pl is transported to the attachment location Wa of the substrate S, and the lead 1 of this lead component Pl is inserted into the insertion hole h of the attachment location Wa from the surface Sf side of the substrate S (lead component attachment processing). Is executed. Then, the clinch pin 100 contacts the lead 1 that is inserted into the insertion hole h and protrudes from the back surface Sb of the substrate S in the lead component attaching process, and bends the lead l. The lead 1 bent in this manner engages with the insertion hole h, and the lead component Pl is attached to the substrate.

  In particular, in this embodiment, the arrangement location Wb of the clinch pin 100 can be changed according to the attachment location Wa of the lead component Pl. Then, the clinch pin placement process for placing the clinch pin 100 at the placement location Wb corresponding to the attachment location Wa is executed before the start of the lead component attachment processing. In such a configuration, when it is necessary to change the positional relationship between the attachment location Wa of the lead component Pl and the substrate S, the arrangement location Wb of the clinch pin 100 is changed accordingly, and the arrangement after the change is made. By arranging the clinch pin 100 at the location Wb, it is possible to cope with a change in the positional relationship between the mounting location Wa of the lead component Pl and the substrate S without moving the substrate S (the working position L). Therefore, the positional relationship between the attachment location Wa of the lead component Pl and the substrate S can be changed without requiring a wide movement range of the substrate S.

  By the way, the attachment location Wa of the lead component Pl is not limited to one, and a plurality of attachment locations Wa may be provided on the substrate S as described above. In such a case, according to the clinching mechanism as in Patent Document 1, the operation of moving the substrate S so that the attachment location Wa is located above the clinching unit and attaching the lead component Pl to the attachment location Wa is performed. By repeatedly executing each attachment location Wa, the lead component Pl can be attached to each of the plurality of attachment locations Wa. However, it is not always possible to ensure the movement range of the substrate S with a wide enough area to move the substrate S until the attachment location Wa is located above the clinch unit. Therefore, such a method involving the movement of the substrate S is not necessarily appropriate.

  On the other hand, according to this embodiment, the clinch pin 100 is arrange | positioned at each of the some arrangement | positioning location Wb corresponding to the some attachment location Wa by performing a clinching pin arrangement | positioning process. For this reason, the lead component attachment process is particularly suitable because the lead component Pl can be attached to each of the plurality of attachment locations Wa while the substrate S is not moved and fixed to the work position L.

  In this embodiment, a surface-mounted component Ps is also attached to the substrate S fixed at the work position L in addition to the lead component Pl. In such a configuration, both the lead component Pl and the surface mount component Ps can be attached to the substrate S, and the versatility of the component attachment device 1 can be improved.

  In addition, in the configuration in which both the lead component Pl and the surface mount component Ps can be attached in this way, it is not possible to grasp which electronic component among the plurality of electronic components P attached to the substrate S is the lead component Pl. There is. In such a case, it is possible to arrange the clinch pins 100 for all the electronic components P regardless of the type of the electronic component P. However, it is originally a wasteful operation to dispose the clinch pin 100 with respect to the surface-mounted component Ps that does not require the clinch pin 100 at the time of attachment, and cannot be said to be appropriate.

  On the other hand, in this embodiment, the user can designate the lead component Pl from among the plurality of electronic components P attached to the substrate S. In the clinch pin placement process, the clinch pin 100 is placed at the placement location Wb corresponding to the attachment location Wa of the lead component Pl set by the user. In such a configuration, since the lead component Pl is designated by the user, it is possible to grasp which electronic component among the plurality of electronic components P attached to the substrate S is the lead component Pl. In the clinch pin arrangement process, the clinch pin 100 can be appropriately arranged at the arrangement location Wb corresponding to the attachment location Wa of the lead component Pl thus grasped. As a result, it is possible to suppress the occurrence of useless operations such as disposing the clinch pin 100 with respect to the surface mount component Ps.

  In this embodiment, the position of the arrangement location Wb of the clinch pin 100 is obtained from data indicating the position of the attachment location Wa of the lead component Pl. Based on this result, the position where the clinch pin 100 is arranged is controlled by the clinch pin arrangement process. Therefore, the position of the arrangement location Wb of the clinch pin 100 can be appropriately controlled according to the position of the attachment location Wa of the lead component Pl. Therefore, the lead l inserted into the insertion hole h provided in the attachment location Wa can be brought into precise contact with the clinch pin 100 arranged in the arrangement location Wb and bent firmly, and the lead part Pl can be bent firmly. Can be securely attached.

  Furthermore, in this embodiment, the angle at which the clinch pin 100 is disposed is obtained from data indicating the angle at which the lead component Pl is attached. Based on this result, the angle at which the clinch pin 100 is arranged is controlled by the clinch pin arrangement process. Therefore, the angle at which the clinch pin 100 is arranged can be appropriately controlled according to the angle at which the lead component Pl is attached. Therefore, the lead l inserted into the insertion hole h provided in the attachment location Wa can be brought into precise contact with the clinch pin 100 arranged in the arrangement location Wb and bent firmly, and the lead part Pl can be bent firmly. Can be securely attached.

  Further, in this embodiment, the mounting head 61 carries the clinch pin 100 from the stocker 82 to the placement location Wb and executes clinch pin placement processing. In such a configuration, it is possible to carry both the lead component Pl and the clinch pin 100 with the common mounting head 61. Therefore, it is not necessary to provide a configuration for transporting each of the lead component Pl and the clinch pin 100, and the device 1 can be reduced in size and cost.

  Moreover, in this embodiment, before the conveyors 21 and 21 convey the board | substrate S to the working position L, the clinch pin arrangement | positioning process is performed. In such a configuration, when the clinch pin placement process is executed, the substrate S is not present at the work position L, so that the backup plate 31 can be easily accessed. As a result, the clinch pin 100 can be easily arranged on the backup plate 31.

Others As described above, in the above-described embodiment, the component mounting device 1 corresponds to an example of the “component mounting device” of the present invention, and the conveyors 21 and 21 are the “substrate fixing unit” and “substrate transport unit” of the present invention. The lead component supply unit 4l corresponds to an example of “component supply means” of the present invention, the mounting head 61 corresponds to an example of “work head” of the present invention, and the backup plate 31 corresponds to “ The clinch pin 100 corresponds to an example of the “clinch device” of the present invention, the step S109 corresponds to an example of the “component attachment process” of the present invention, and the clinch pin placement process S105 corresponds to an example of the “support member”. The display 91 or the input device 92 corresponds to an example of the “user interface” of the present invention, and the stocker 82 corresponds to an example of the “accommodating member” of the present invention. It corresponds to an example of. Further, step S107 corresponds to an example of the “board fixing process” of the present invention, step S109 corresponds to an example of the “component mounting process” of the present invention, and step S105 is an example of the “clinching instrument arrangement process” of the present invention. It corresponds to.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, the specific configuration of the clinch pin 100 is not limited to that described above, and any configuration can be used as long as the arrangement location Wb on the backup plate 31 can be changed as appropriate. Therefore, for example, the clinch pin 100 may be configured as follows.

  FIG. 9 is a perspective view schematically showing a configuration according to a modification of the clinch pin. 10 and 11 are partial cross-sectional views schematically showing the configuration and operation of the clinch pin shown in FIG. The configuration of the clinch pin 100 shown in FIGS. 9 to 11 is partially in common with that shown in FIGS. Therefore, hereinafter, different configurations will be mainly described, and common portions are denoted by corresponding reference numerals, and description thereof will be omitted as appropriate.

  The clinch pin 100 according to the modification includes a schematic configuration in which the clinch pin 100 has a lead receiving member 120 fixed to the upper end of a cylindrical base member 110 extending in the Z-axis direction. On the upper surface of the lead receiving member 120, a predetermined number (two in the example shown) of lead receiving grooves 123 cut in the radial direction of the lead receiving member 120 having a rotationally symmetric shape and opened upward and laterally are formed. ing. Then, in the same manner as described with reference to FIGS. 7 and 8, the clinch pin 100 clinches the lead 1 of the lead component Pl.

  In particular, the clinch pin 100 includes an additional processing mechanism 140 that performs additional processing on the lead l that is clinched and protrudes from the peripheral surface of the lead receiving member 120. The additional processing mechanism 140 includes a hollow outer cylinder 141 having a cylindrical shape extending in the Z-axis direction, a bridge 142 that spans the inner wall of the outer cylinder 141 so as to cross the hollow portion of the outer cylinder 141, and a lower side from the bridge 142. And a shaft 143 having an outward flange 143a at the lower end. The additional processing mechanism 140 is attached to the base member 110 as follows.

  As shown in FIGS. 10 and 11, an internal space 150 extending in the Z-axis direction is formed inside the base member 110. The internal space 150 is closed at the upper end by the lead receiving member 120 and closed at the lower end by the lid member 160. The lid member 160 has a convex portion 161 that protrudes upward into the internal space 150. An inward flange 110a is provided on the inner wall of the base member 110 surrounding the inner space 150. The inner space 150 includes a lower space 150a below the inward flange 110a and an upper space 150b above the inward flange 110a. It is roughly divided into

  The shaft 143 of the additional processing mechanism 140 is disposed in the internal space 150 of the base member 110 and is movable in the Z-axis direction. Specifically, the upper end of the shaft 143 is inserted from below into the hole surrounded by the inward flange 110a. The flange 143a at the lower end of the shaft 143 is located in the lower space 150a, and the upper end of the shaft 143 protrudes from the flange 143a to the upper space b. As a result, the shaft 143 is Z-axis between a lower position (position in FIG. 10) where the flange 143a hits the convex portion 161 of the lid member 160 and an upper position (position in FIG. 11) where the flange 143a hits the flange 110a. Can move in the direction.

  The bridge 142 of the additional processing mechanism 140 is disposed in a lateral hole 151 provided in the base member 110. The lateral hole 151 communicates with the upper space 150b while penetrating the base member 110 in the horizontal direction, and is provided with a predetermined width in the Z-axis direction in order to ensure a movable range of the bridge 142. The bridge 142 can move in the Z-axis direction along with the shaft 143 without interfering with the base member 110 by moving in the horizontal hole 151.

  The outer cylinder 141 of the additional processing mechanism 140 is fitted to the outside of the base member 110 and the lead receiving member 120 and is supported at both ends of the bridge 142 protruding from the lateral hole 151. Thus, the outer cylinder 141 is connected to the shaft 143 via the bridge 142 and can move in the Z-axis direction along with the shaft 143.

  As described above, the additional processing mechanism 140 including the outer cylinder 141, the bridge 142, and the shaft 143 is movable in the Z-axis direction. The movement of the additional processing mechanism 140 is executed by a press-fitting hole 171 and a compression spring 172 provided in the clinch pin 100. That is, the press-fitting hole 171 passing through the base member 110 communicates with the lower space 150a, and the air press-fitted from the press-fitting hole 171 into the lower space 150a pushes up the shaft 143 from the lower surface. On the other hand, the compression spring 172 is provided between the lead receiving member 120 and the bridge 142 in the upper space 150 b and pushes down the shaft 143 via the bridge 142. Since such a configuration is provided, the outer cylinder 141 can be raised along with the shaft 143 by press-fitting air from the press-fitting hole 171, while the shaft 143 is opened by opening the press-fitting hole 171 to atmospheric pressure. Accordingly, the outer cylinder 141 can be lowered. Specifically, the press-fitting hole 171 is connected to a pressure adjusting mechanism (not shown) via a tube. By this pressure adjusting mechanism, air is pressed into the press-fitting hole 171 and the pressure of the press-fitting hole 171 is increased to the atmospheric pressure. Is released.

  Further, the additional processing mechanism 140 further includes a ring-shaped substrate protection member 144 fitted on the outside of the lead receiving member 120 above the outer cylinder 141. The substrate protection member 144 is located slightly above the lower end of the inclined surface of the lead receiving groove 123. Accordingly, in the state of FIG. 10, the lead 1 bent along the lead receiving groove 123 protrudes outward from between the inclined surface of the lead receiving groove 123 and the substrate protection member 144. Therefore, by raising the outer cylinder 141 to the position of FIG. 11, the lead l can be cut by sandwiching the lead l between the blade 141 a formed at the upper end of the outer cylinder 141 and the substrate protection member 144. As described above, the clinch pin 100 according to the modified example can cut the clinched lead l. The above is description of the structure and operation | movement concerning the modification of the clinch pin 100. FIG.

  Thus, the clinch pin 100 according to the modified example additionally performs the cutting process of the lead l. However, the processing to be additionally performed on the lead l is not limited to the cutting processing. Specifically, when the bending of the lead l is insufficient only by being along the lead receiving groove 123, it is preferable that the process of further bending the lead l can be additionally performed. Therefore, for example, the following changes may be made to the clinch pin 100 according to the modification.

  Specifically, the blade at the upper end of the outer cylinder 141 and the substrate protection member 144 are preferably excluded. In such a configuration, instead of cutting the lead l by the outer cylinder 141, the lead l bent along the lead receiving groove 123 can be additionally bent. Specifically, an additional bending process can be performed by raising the outer cylinder 141 and bending the lead 1 protruding outward from the lead receiving groove 123 with the outer cylinder 141.

  In addition to the deformation of the clinch pin 100, various changes can be made. For example, in the above embodiment, the clinch pin 100 is gripped by suction. However, the grip mode of the clinch pin 100 is not limited to adsorption. Specifically, the gripping may be performed using a chuck capable of opening and closing the claws with air pressure. Further, the same deformation can be made with respect to the grip mode of the surface-mounted component Ps or the lead component Pl.

  In the above-described embodiment, the case where the present invention is applied to the component mounting apparatus 1 that can mount both the surface mount component Ps and the lead component Pl to the substrate S has been described. However, for example, the present invention can be applied to the component mounting apparatus 1 that does not mount the surface mount component Ps on the substrate S.

  Moreover, in the said embodiment, the electronic component P was attached toward the downward direction from the upper direction of the perpendicular direction, in other words, the component attachment direction D faced the perpendicular downward direction. However, the component mounting direction D is not limited to this, and may be, for example, a direction facing vertically upward.

  In the above embodiment, the attachment of the electronic component P and the arrangement of the clinch pin 100 are executed by the common attachment head 61. However, a mechanism for arranging the clinch pins 100 may be provided separately from the attachment head 61 for attaching the electronic component P.

DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus 3 ... Backup part 31 ... Backup plate 35 ... Elevating mechanism 4l ... Lead component supply part 4s ... Surface mount component supply part 6 ... Head unit 61 ... Mounting head 82 ... Stocker 91 ... Display 92 ... Input device 100 ... Clinch pin 120 ... Lead receiving member 123 ... Lead receiving groove 190 ... Rotation restricting member 200 ... Control unit 261 ... Pin placement program 262 ... Mounting program D ... Part mounting direction L ... Working position Pl ... Lead component l ... Lead Ps ... Surface mount component S ... Substrate Sb ... Back side of substrate Sf ... Front side of substrate Wa ... Mounting location Wb ... Location of placement h ... Insertion hole

Claims (8)

A board fixing means for fixing the board in which the insertion hole for inserting the lead of the lead part is formed with respect to the mounting position of the lead part at a working position;
Component supply means for supplying the lead component;
The lead component supplied from the component supply means is transported to the mounting location on the substrate fixed at the working position, and the lead of the lead component is inserted into the insertion hole of the mounting location of the substrate. On the other hand, a work head that performs component mounting processing to be inserted from the main surface side,
A support member that removably supports a clinch device that bends the lead by contacting the lead protruding from the other main surface of the substrate inserted into the insertion hole in the component mounting process;
A housing member for housing the clinch instrument,
The clinch instrument and the support member are configured so that the arrangement location of the clinch instrument can be changed according to the attachment location of the lead component,
The work head transports the clinching instrument from the housing member to the arrangement location, and executes the clinching instrument arrangement process in which the clinch instrument is arranged at the arrangement location corresponding to the attachment location before the component attachment processing is started. And
In the clinching instrument arrangement process, the angle at which the clinching instrument is arranged is controlled based on the result of obtaining the angle at which the clinching instrument is arranged at the arrangement location from the data indicating the angle at which the lead component is attached to the attachment location. A component mounting device characterized by: A board fixing means for fixing the board in which the insertion hole for inserting the lead of the lead part is formed with respect to the mounting position of the lead part at a working position;
Component supply means for supplying the lead component;
The lead component supplied from the component supply means is transported to the mounting location on the substrate fixed at the working position, and the lead of the lead component is inserted into the insertion hole of the mounting location of the substrate. On the other hand, a work head that performs component mounting processing to be inserted from the main surface side,
A support member that removably supports a clinch device that bends the lead by contacting the lead protruding from the other main surface of the substrate inserted into the insertion hole in the component mounting process;
A housing member that houses the clinch instrument, and a lifting mechanism that lifts and lowers the support member ;
With
The clinch instrument and the support member are configured so that the arrangement location of the clinch instrument can be changed according to the attachment location of the lead component,
The work head transports the clinching instrument from the housing member to the arrangement location, and executes the clinching instrument arrangement process in which the clinch instrument is arranged at the arrangement location corresponding to the attachment location before the component attachment processing is started. And
At the time of execution of the component mounting process, the clinch device arranged on the support member positioned at the initial height by the lifting mechanism supports the substrate at the component mounting height at the working position from below,
Said When performing a clinching tool arrangement process, the working head, which carries the clinch device from the receiving member from the initial height by the lifting mechanism to the support member is raised on the side of the component mounting height A featured component mounting device. Wherein the substrate is provided with a plurality of attachment points, in the clinch device placement process, according to claim 1 or 2, wherein the clinch device are arranged in each of a plurality of said arrangement place corresponding to the plurality of attachment points The component mounting device described in 1. The component mounting apparatus according to any one of claims 1 to 3, wherein a surface mount component is further mounted on the substrate fixed at the work position. A user interface that allows a user to designate the lead component from among a plurality of components that are attached to the board is further provided. In the clinch instrument placement process, the attachment location of the lead component that is set by the user in the user interface is provided. The component attachment device according to claim 4 , wherein the clinching instrument is disposed at the corresponding arrangement location. Based on the result of obtaining the position of the arrangement place where the clinch instrument is arranged from the data indicating the position of the attachment place where the lead component is attached, the position where the clinch instrument is arranged in the clinch instrument arrangement process is controlled. The component mounting apparatus according to any one of claims 1 to 5 . Further comprising a substrate conveying means for conveying the substrate to the working position, the substrate fixing means, according to any one of claims 1 to 6 wherein the substrate conveying means for fixing the substrate was conveyed to the working position The component mounting apparatus according to claim 1, wherein the clinch instrument placement processing is executed before the substrate transport means transports the substrate to the working position. A board fixing step of fixing a board in which an insertion hole for inserting a lead of the lead part is formed at an attachment position of the lead part at a work position;
The lead component supplied to a component supply position is transported by a work head to the attachment location on the substrate fixed at the work position, and the lead of the lead component is transferred by the work head to the difference between the attachment locations. A component mounting step of bending the lead by bringing a clinch instrument into contact with the lead protruding from the other main surface of the substrate by inserting it into the insertion hole from the one main surface side of the substrate;
A clinch instrument arrangement in which the arrangement location is changeable according to the attachment location of the lead component, and the clinch device is transported to the arrangement location by the working head and arranged at the arrangement location according to the attachment location. Perform the process before the start of the component mounting process ,
In the clinch instrument placement step, the angle at which the clinch instrument is disposed is controlled based on the result of obtaining the angle at which the clinch instrument is disposed at the placement location from data indicating the angle at which the lead component is attached to the attachment location. A component mounting method characterized by:

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