JP2013179191A - Electronic component supply device and electronic component packaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently supply electronic components to holding positions.SOLUTION: An electronic component supply device supplies electronic components to holding areas, and has: a first stacker unit which holds a plurality of trays on which the electronic components are stored; a second stacker unit which holds a plurality of trays on which the electronic components are stored; a first tray conveyance part which moves the trays of the first stacker unit to a first supply position; a second tray conveyance part which moves the trays of the second stacker unit to a second supply position; and a control part which controls operations of the respective parts, in which the control part alternately supplies the trays to the first supply position and the second supply position.

Description

  The present invention relates to an electronic component supply device that supplies an electronic component to a holding position and an electronic component mounting apparatus that uses the electronic component supply device.

  An electronic component mounting apparatus for mounting an electronic component on a substrate has a head including a nozzle, holds the electronic component with the nozzle, and mounts the electronic component on the substrate. The electronic component mounting device picks up the components in the electronic component supply device by moving the head nozzle in a direction perpendicular to the surface of the substrate, and then moves the head relatively in a direction parallel to the surface of the substrate. When the picked-up component arrives at the mounting position, the picked electronic component is mounted on the substrate by moving the nozzle of the head in a direction orthogonal to the surface of the substrate and bringing it closer to the substrate.

  Here, as an electronic component supply device, there is a so-called tray feeder that stores an electronic component in a tray and moves the tray to supply the electronic component to a supply position where the nozzle holds the electronic component. For example, in Patent Document 1, a plurality of pallets are selected at the same time, and each pallet is introduced to a pickup position so that the pallets do not overlap each other, and an electronic component mounted on each pallet is picked up. There is described a component supply device that can face the mounting device main body in a possible state.

JP 2004-104147 A

  By using the apparatus described in Patent Document 1, it is possible to hold the electronic component of the other tray even when there is no electronic component in one tray. Here, the apparatus described in Patent Document 1 once collects the tray at the supply position when the tray is replaced, moves the rack, and then transports the other tray to the supply position. For this reason, in the apparatus described in Patent Document 1, the movement of the rack and the movement of the tray for pulling out from two locations are complicated. In addition, the mechanism of the apparatus becomes complicated. The apparatus described in Patent Document 1 is a mechanism that moves trays held in different stages of a rack and holds electronic components of the respective trays. For this reason, an apparatus for mounting an electronic component supplied by the apparatus described in Patent Document 1 needs to include a head that can hold the electronic component from two trays having a step, which is There are constraints on this.

  The present invention has been made in view of the above, and an object thereof is to provide an electronic component supply device and an electronic component mounting device that can efficiently supply electronic components to a holding position.

  In order to solve the above-described problems and achieve the object, the present invention is an electronic component supply device that supplies electronic components to a holding region, and includes a first stacker unit that holds a plurality of trays in which electronic components are stored, and A second stacker unit that holds a plurality of trays in which electronic components are stored, a first tray transport unit that moves the tray of the first stacker unit to a first supply position, and the tray of the second stacker unit. A second tray transport unit that moves to the second supply position; and a control unit that controls the operation of each unit, wherein the control unit alternately places the tray at the first supply position and the second supply position. It can be supplied.

  Here, the total area of the first supply position and the second supply position is preferably smaller than twice the area of the tray.

  Further, it is preferable that the second supply position partially overlaps the first supply position.

  Moreover, it is preferable that the said tray conveyance part overlaps a part of passage area of the said tray conveyed by the said 2nd tray conveyance part.

  Moreover, it is preferable that the said 1st tray conveyance part inclines the direction which conveys the said tray with respect to the direction in which the said 2nd tray conveyance part conveys the said tray.

  In the first tray transport section, a line orthogonal to the side of the tray that has moved to the first supply position and that is far from the first stacker unit is inclined with respect to the direction in which the tray is transported. It is preferable.

  The first tray transport unit preferably includes a tray rotation mechanism that rotates the tray while transporting the tray from the first stacker unit to the first supply position.

  Moreover, it is preferable that a 1st tray conveyance part hold | maintains the said tray different from the said tray which the said 2nd tray conveyance part is holding, while the said 2nd tray conveyance part is holding the said tray. .

  In addition, the first stacker unit is moved while holding the first stacker unit, and the first stacker holding and transporting mechanism that switches the tray at the band position where the first tray transporting unit holds the tray, and the second stacker unit are held. It is preferable to further include a second stacker holding and transporting mechanism that moves the second tray transporting unit and switches the tray in a band position that holds the tray.

  The first supply position and the second supply position are preferably in the same plane.

  In order to solve the above-described problems and achieve the object, the present invention is an electronic component mounting apparatus, which is the electronic component supply apparatus according to any one of the above, and supplied from the electronic component supply apparatus to the holding region A nozzle for holding the electronic component to be driven, a nozzle driving unit for driving the nozzle up and down and rotating and supplying air pressure for driving the nozzle to the nozzle, and a head support for supporting the nozzle and the nozzle driving unit An electronic component at a holding position of the electronic component supply device is held by a nozzle of the head main body, and the nozzle is moved by the head moving mechanism. Is moved to the mounting position of the board, and the electronic component held by the nozzle is mounted on the board.

  Here, the head main body holds the electronic component of the tray at the first supply position with the nozzle and mounts it on the substrate, and the electronic component of the tray at the second supply position is mounted on the nozzle. And is preferably mounted on the substrate.

  According to the present invention, tray replacement can be performed efficiently, and electronic components can be efficiently supplied to the holding position.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a perspective view showing a schematic configuration of the electronic component mounting apparatus. FIG. 3 is a perspective view showing a schematic configuration of the electronic component supply apparatus shown in FIG. FIG. 4 is another perspective view showing a schematic configuration of the electronic component supply apparatus shown in FIG. FIG. 5 is a front view showing a schematic configuration of the electronic component supply apparatus shown in FIG. FIG. 6 is a top view illustrating a schematic configuration of the electronic component supply apparatus. FIG. 7 is a partial perspective view showing a schematic configuration of the second tray transport unit. FIG. 8 is a partial perspective view showing a schematic configuration of the second tray transport unit. FIG. 9 is a partial perspective view illustrating a schematic configuration of the first tray conveyance unit. FIG. 10 is a top view illustrating a schematic configuration of the tray detection sensor. FIG. 11 is an explanatory diagram for explaining the operation of the electronic component supply apparatus. FIG. 12 is a top view illustrating a schematic configuration of a fixing portion of the tray holding mechanism. FIG. 13 is an explanatory diagram for explaining the operation of the tray holding mechanism. FIG. 14 is a schematic diagram illustrating a schematic configuration of a rear-side component supply unit. FIG. 15 is a schematic diagram illustrating a schematic configuration of a head of the electronic component mounting apparatus. FIG. 16 is a schematic diagram illustrating a schematic configuration of a head of the electronic component mounting apparatus. FIG. 17 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 18 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 19 is a flowchart illustrating an example of the operation of the electronic component supply apparatus. FIG. 20 is a flowchart illustrating an example of the operation of the electronic component supply apparatus.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Hereinafter, embodiments of an electronic component mounting apparatus, an electronic component mounting system, and an electronic component mounting method according to the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus.

  An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. The unit 19, the control device 20, the operation unit 40, and the display unit 42 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side with the board conveyance unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  FIG. 2 is a perspective view illustrating a schematic configuration of a housing of the electronic component mounting apparatus. As shown in FIG. 2, the housing 11 includes a main body 11a and covers 11bf and 11br. The main body 11 a is a box that accommodates each part constituting the electronic component mounting apparatus 10. The main body 11a includes a cover 11bf, a front-side component supply unit 14f, an operation unit 40, and a display unit 42 on the front side, and a cover 11br on the rear side. A rear-side component supply unit 14r is also arranged on the rear side of the main body 11a. Moreover, the electronic component mounting apparatus 10 may arrange the sub 40 and the display unit 42 along the rear side. The main body 11a is formed with two openings 11c on two side surfaces for carrying the substrate 8 into the apparatus and discharging it.

  The operation unit 40 of the present embodiment includes a keyboard 40a and buttons 40b. The display unit 42 of the present embodiment is a device that displays an image such as a liquid crystal panel.

  The cover 11bf is an enclosure provided in a part on the front side of the main body 11a, and is disposed on the upper side in the vertical direction. The cover 11br is an enclosure provided in a part on the rear side of the main body 11a, and is disposed on the upper side in the vertical direction. The covers 11bf and 11br are shaped to cover a part of the front surface or the back surface and a part of the upper surface of the main body 11a and have a cross section of L. As shown in FIG. 4, the cover 11b can be opened and closed with respect to the main body 11a. When the covers 11bf and 11br are in the open state, it is possible to perform operations on the respective parts disposed inside the main body 11a. The covers 11bf and 11br have their upper ends connected to the main body 11a, and rotate with the connecting portion as a fulcrum.

  Returning to FIG. 1, the description of the electronic component mounting apparatus 10 will be continued. The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at the predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8, and can supply them to the head 15, that is, they can be held (sucked or gripped) by the head 15. The electronic component supply apparatus which supplies to a holding position in a state is provided.

  The front-side component supply unit 14f includes an electronic component supply device 100 that supplies a tray in which electronic components are stored to a holding position in a state where the tray can be supplied to the head. Note that the front-side component supply unit 14f according to the present embodiment includes one electronic component supply device 100, and the one electronic component supply device 100 serves as the component supply unit 14f.

  Hereinafter, the electronic component supply apparatus 100 will be described with reference to FIGS. 3 to 13. FIG. 3 is a perspective view showing a schematic configuration of the electronic component supply apparatus shown in FIG. FIG. 4 is another perspective view showing a schematic configuration of the electronic component supply apparatus shown in FIG. FIG. 5 is a front view showing a schematic configuration of the electronic component supply apparatus shown in FIG. FIG. 6 is a top view illustrating a schematic configuration of the electronic component supply apparatus. FIG. 7 is a partial perspective view showing a schematic configuration of the second tray transport unit. FIG. 8 is a partial perspective view showing a schematic configuration of the second tray transport unit. FIG. 9 is a partial perspective view illustrating a schematic configuration of the first tray conveyance unit. FIG. 10 is a top view illustrating a schematic configuration of the tray detection sensor. FIG. 11 is an explanatory diagram for explaining the operation of the electronic component supply apparatus. FIG. 12 is a top view illustrating a schematic configuration of a fixing portion of the tray holding mechanism. FIG. 13 is an explanatory diagram for explaining the operation of the tray holding mechanism.

  As shown in FIGS. 3 to 5, the electronic component supply apparatus 100 includes a housing 102, a first stacker holding and transporting mechanism 104, a second stacker holding and transporting mechanism 106, and a tray transporting mechanism 108. The housing 102 is a box that houses the first stacker holding and transporting mechanism 104 and the second stacker holding and transporting mechanism 106 inside. The housing 102 is provided with a door 102a that can be opened and closed. By opening the door 102a, the first stacker holding and transporting mechanism 104 and the second stacker holding and transporting mechanism 106 can be exposed, and the first stacker can be exposed. The holding / conveying mechanism 104 and the second stacker holding / conveying mechanism 106 are ready to work. The casing 102 has a tray transport mechanism 108 coupled to the surface opposite to the surface on which the door 102a is provided.

  The first stacker holding and transporting mechanism 104 and the second stacker holding and transporting mechanism 106 are disposed inside the housing 102. As shown in FIG. 6, the first stacker holding / conveying mechanism 104 is loaded with the first stacker unit 110a, and the second stacker holding / conveying mechanism 106 is loaded with the second stacker unit 110b. The first stacker unit 110a and the second stacker unit 110b are detachable from the first stacker holding and transporting mechanism 104 and the second stacker holding and transporting mechanism 106. Therefore, the first stacker unit 110a and the second stacker unit 110b loaded in the first stacker holding transport mechanism 104 and the second stacker holding transport mechanism 106 are removed, and another first stacker unit 110a and second stacker unit 110b are removed. It can also be installed. Each of the first stacker unit 110a and the second stacker unit 110b holds a plurality of stacked trays. Each tray stores a plurality of electronic components.

  The first stacker holding and transporting mechanism 104 and the second stacker holding and transporting mechanism 106 include a mechanism that holds the first stacker unit 110a and the second stacker unit 110b, and a mechanism that moves the stacker vertically. The first stacker holding / conveying mechanism 104 and the second stacker holding / conveying mechanism 106 are removed from the first stacker unit 110a and the second stacker unit 110b by moving the first stacker unit 110a and the second stacker unit 110b in the vertical direction. The tray can be switched.

  Next, the tray transport mechanism 108 includes a first tray transport unit 112 and a second tray transport unit 114. The first tray transport unit 112 is a mechanism for transporting the tray held by the first stacker unit 110 a held by the first stacker holding and transporting mechanism 104. The first tray transport unit 112 takes out the tray held by the first stacker unit 110 a from the first stacker unit 110 a and moves it to the component supply area 116. Further, the first tray transport unit 112 moves the tray moved to the component supply area 116 and returns it to the first stacker unit 110a. The second tray transport unit 114 takes out the tray held by the second stacker unit 110 b from the second stacker unit 110 b and moves it to the component supply area 116. Further, the second tray transport unit 114 moves the tray moved to the component supply area 116 and returns it to the second stacker unit 110b.

Here, the first tray conveying unit 112 moves the tray to the position of the tray T ₁ is a region in FIG. 6 of the left component supply region 116 (first supply position). Second tray conveying unit 114 moves the tray to the position of the tray T ₂ is a region in FIG. 6 on the right side of the component supply region 116 (second supply position). Here, the first tray conveying unit 112 the position of the tray _{T 1} is an area for carrying the trays of the first stacker unit 110a (first supply position), the second tray conveying unit 114 of the second stacker unit 110b tray the position of the tray T ₂ is an area for carrying the (second supply position), the partial region is overlapped. Further, the tray transport mechanism 108 supplies the tray to the component supply area 116 alternately by the first tray transport unit 112 and the second tray transport unit 114. Thus, the tray transfer mechanism 108, the tray _{T 1} and the tray _{T 2} is not supplied to the component supply region 116 simultaneously. The tray transport operation by the tray transport mechanism 108 will be described later.

  Each part of the 1st tray conveyance part 112 and the 2nd tray conveyance part 114 is demonstrated. The second tray transport unit 114 will be described with reference to FIGS. The second transport tray 114 includes a tray holding mechanism 140, a drawer mechanism 142, a rail guide 144, and a chuck guide 146.

  The tray holding mechanism 140 is a tray chuck unit that holds the tray held by the second stacker unit 110b with a detachable mechanism. The tray holding mechanism 140 includes connecting portions 150 and 152, a guide 154 that guides the connecting portions 150 and 152, and a chuck moving mechanism 156. The tray holding mechanism 140 also includes a drive unit that moves the coupling units 152 and 154 along the guide 154.

  The connecting parts 150 and 152 are connected to the tray connecting part 190 of the tray held by the second stacker unit 110b. The connecting portion 150 and the connecting portion 152 are linearly arranged along the guide 154, and contact ends 150a and 152a that are in contact with the tray connecting portion 190 are formed at end portions on the side away from each other. The contact end 150a and the tray connecting portion 190 are such that the contact end 150a has a convex shape, the tray connecting portion 190 has a concave shape, and the concave and convex shapes of the end faces substantially coincide. The contact end 152a and the tray connecting portion 190 have a convex shape at the contact end 152a, a concave shape at the tray connecting portion 190, and the concave and convex shapes of the end faces substantially coincide. The connecting portions 150 and 152 move along the guide 154, and the contact ends 150a and 152a engage with the tray connecting portion 190, thereby connecting to the tray. The guide 154 is a rod-shaped member, and the coupling portions 150 and 152 are coupled so as to be movable along the axis of the rod.

  The tray holding mechanism 140 moves the connecting portions 150 and 152 in the direction away from each other along the guide 154 by the driving portion, thereby connecting the connecting portions 150 and 152 and the tray connecting portion 190 to hold the tray. . The tray holding mechanism 140 moves the connecting portions 150 and 152 along the guides 154 in the drive unit so that the connecting portions 150 and 152 are separated from the tray connecting portion 190 and the tray is opened. As described above, by configuring the two connecting portions 150 and 152 to be connected to the tray connecting portion 190 from the center side, the center of the tray and the center of the tray holding mechanism 140 can be easily aligned.

  The chuck moving mechanism 156 has a movable part 156a and a fixed part 156b. The chuck moving mechanism 156 is a mechanism for moving the movable portion 156a relative to the fixed portion 156b. The fixing portion 156b is fixed to the drawer mechanism 142. The movable portion 156a supports the connecting portions 150 and 152 and the guide 154. That is, the chuck moving mechanism 156 moves the connecting portions 150 and 152 and the guide 154 with respect to the drawer one term 142. Here, the fixing portion 156b is a linear motion guide and is a rod-shaped member. The movable part 156a moves along the fixed part 156b. Accordingly, the chuck moving mechanism 156 moves the connecting portions 150 and 152 and the guide 154 in one direction (which will be described later, the X direction in FIG. 6 and a direction orthogonal to the moving direction of the pulling mechanism 142). The chuck moving mechanism 156 moves the trays connected to the connecting portions 150 and 152 by moving the connecting portions 150 and 152 and the guide 154. In addition, the tray holding mechanism 140 is provided with a roller 159 that comes into contact with a chuck guide 146, which will be described later, at the end of the fixed portion 156b.

The drawer mechanism 142 is a mechanism for transporting the tray held by the tray holding mechanism 140 from the second stacker unit 110b to the component supply area 116, and is a mechanism for transporting the tray of the component supply device 116 to the second stacker unit 110b. . The drawer mechanism 142 moves along the rail guide 144. The drawer mechanism 142 includes a drawer base 160 that moves along the rail guide 144 and a drawer movable part 162 that moves relative to the drawer base 160. The drawer base 160 is a member that moves in the direction of the arrow 124 along the rail guide 144. The drawer movable unit 162 is a mechanism that moves the tray holding mechanism 140 in the direction of the arrow 164 on the drawer base 160. Drawer mechanism 142, while moving the drawer base 160 in the arrow 124 direction, the tray T ₂ can be moved to the tip side of the component supply area 116 by moving the drawer movable portion 162.

Rail guide 144, the transport direction of the tray T _2, i.e. is arranged along the direction of arrow 124. The chuck guide 146 is disposed along the rail guide 144 and regulates the position of the tray by regulating the position of the movable part 156a relative to the fixed part 156b of the tray holding mechanism 140. Specifically, the position of the tray and the tray holding mechanism 140 is regulated so that the tray moves in the direction of the arrow 126 as it goes toward the component supply region 116. The chuck guide 146 includes a first guide 146a and a second guide 146b. The first guide 146a regulates the position of the tray holding mechanism 140 so that the tray moves in the direction of the arrow 126 as it goes to the component supply region 116. The second guide 146 b regulates the position of the tray holding mechanism 140 so that the tray does not move in the direction opposite to the arrow 126 when leaving the component supply area 116. The second tray transport unit 114 is configured as described above.

  Next, the first tray transport unit 112 includes a tray holding mechanism 130, a drawer mechanism 132, a rail guide 134, and a chuck guide 136. The first tray transport unit 112 has the same configuration as each part of the second tray transport unit 114 except for the direction of the tray holding mechanism 130 and the rail guide 134. The same components as those of the second tray transport unit 114 are denoted by the same reference numerals, and the description thereof is omitted. Hereinafter, configurations unique to the first tray transport unit 112 will be described.

The tray holding mechanism 130 includes connecting portions 150 and 152, a guide 154 that guides the connecting portions 150 and 152, a chuck moving mechanism 170, and a roller 159. The chuck moving mechanism 170 has a movable part 170a and a fixed part 170b. In the chuck moving mechanism 170, the movable portion 170a rotates in the arrow 122 direction, that is, in the θ direction (around the Z axis) with respect to the fixed portion 170b. The chuck guide 136 includes a first guide 136a and a second guide 136b, and regulates the position of the movable portion 170a of the chuck moving mechanism 170 in the X direction. The rail guide 134 is inclined with respect to the rail guide 144. Specifically, it is inclined at a predetermined angle with respect to the Y direction. The first tray transport unit 112 holds the tray by the tray holding mechanism 130 and moves it in the direction of the arrow 120 while rotating it in the direction of the arrow 122, whereby the tray of the first stacker unit 110 a is moved to the tray T in the component supply area 116. It can be moved to position ₁ .

  In the tray transport mechanism 108, the tray detection sensor 180 is disposed on the moving path of the first tray transport unit 112, and the tray detection sensor 180 is disposed on the moving path of the second tray transport unit 114. The tray detection sensor 180 is a sensor that detects that the tray moved by the first tray transport unit 112 and the second tray transport unit 114 has reached a predetermined position on the first stacker unit 110a and the second stacker unit 110b side. is there. As the tray detection sensor 180, an optical sensor that detects whether or not there is an object at the measurement position can be used.

Next, the operation of the tray transport mechanism 108 will be described with reference to FIGS. Tray transporting mechanism 108, as shown in step S11, the standby position P1 of the second stacker holding transport mechanism 106 trays _{T 2} is arranged, the tray _{T 1} is disposed at the standby position P2 of the first stacker holding transport mechanism 104 ing.

Tray transporting mechanism 108, from the state shown in step S11, to convey toward the component feed area 116 of the tray _{T 2} in the standby position _{P 1} of the second stacker holding transport mechanism 106 in the second tray conveying section 114. Tray transporting mechanism 108, when the conveyed toward the component supply region 116 in the second tray conveying unit 114, as shown in step S12, along the movement path, the tray T ₂ is moved, as shown in step S13 To the component supply area 116 (the first supply position of the component supply area 116). Tray T ₂ which is moved to the component supply region 116 is an electronic component that is housed is held by the head 15, is mounted on a substrate.

Thereafter, when the mounting of the electronic components stored in the tray T ₂ is completed, the tray transport mechanism 108 performs an operation of returning the tray T ₂ to the standby position 180 by the second tray transport unit 114. Thus, the tray transport mechanism 108, as shown in step S14, it is possible to move the tray _{T 2} to the standby position _{P 1.}

Tray transporting mechanism 108, from the state shown in step S14, to convey toward the component feed area 116 trays _{T 1} in the standby position _{P 2} of the first stacker holding transport mechanism 104 in the first tray conveying unit 112. Tray transporting mechanism 108, when the conveyed toward the component supply region 116 in first tray conveying unit 112, as shown in step S15, along the movement path, the tray T ₁ is being moved, as shown in step S16 To the component supply area 116 (second supply position of the component supply area 116). Tray T ₁ which is moved to the component supply region 116 is an electronic component that is housed is held by the head 15, is mounted on a substrate.

Thereafter, when the mounting of electronic components housed in the tray T ₁ is finished, the tray transport mechanism 108 performs an operation of returning the tray T ₁ to the standby position 182 in the first tray conveying unit 112. Thus, the tray transport mechanism 108, as shown in step S11, it is possible to move the tray _{T 2} to the standby position _{P 1.}

  In this way, the tray transport mechanism 108 can alternately supply the tray of the first stacker unit 110a and the tray of the second stacker unit 110b to the component supply region 116 by repeating the processing from step S11 to step S16. it can. The electronic component supply apparatus 100 supplies the component to the component supply region 116 by moving the first stacker unit 110a and the second stacker unit 110b with the first stacker holding / conveying mechanism 104 and the second stacker holding / conveying mechanism 106. Different trays can be used each time.

  Next, the chuck mechanism 170 of the first tray transport unit 112 will be described. The fixing portion 170b of the chuck mechanism 170 has a base portion 172 and two linear motion guide shafts 174 and 176 disposed on the base portion. The linear motion guide shaft 174 and the linear motion guide shaft 176 are arranged at different angles. The movable portion 170a of the chuck mechanism 170 is connected to both of the two linear motion guide shafts 174 and 176, and the respective parts move along the linear motion guides 174 and 176, respectively. Further, the connecting portion between the movable portion 170a and the linear motion guide shafts 174 and 176 is a rotatable rotary joint.

  As shown in step S21 to step S22, step S22 to step S23, and step S23 to step S24 shown in FIG. 13, the chuck mechanism 170 moves the movable portion 170a in the direction of the arrow Xa with respect to the fixed portion 170b. While the 170a moves in the arrow Xa direction with respect to the fixed portion 170b, the tip end in the arrow Xa direction moves in the arrow Ya direction. That is, the movable part 170a rotates. Here, FIG. 13 shows the fixed portion 170 b at a fixed position with respect to the reference line 189. As described above, the chuck mechanism 170 is configured such that the two linear motion guide shafts 174 and 176 are provided on the fixed portion 170b, thereby rotating the movable portion 170a in one direction.

  The electronic component supply apparatus 100 is configured as described above. The electronic component supply apparatus 100 supplies a tray to a component supply region 116 that partially overlaps from two stacker units by the tray transport mechanism 108 (in the component supply region of the tray supplied from each of the two stacker units). By making the total area smaller than twice that of the tray), electronic components can be supplied efficiently. Specifically, when a plurality of trays are supplied into the component supply area 116 so that they do not overlap, the tray arrangement area will be widened, so there will be no area where the head does not reach. It cannot be used effectively. Further, if the operating range of the head is widened so that the entire area of the tray can be held, the size of the entire apparatus becomes large, so that the mounting efficiency and the apparatus cost are deteriorated. On the other hand, the electronic component supply apparatus 100 can minimize the waiting time for tray replacement without increasing the apparatus size. By making the tray regions arranged in the component supply region 116 overlap, the distance between the tray and the substrate at the time of mounting can be shortened, and the mounting efficiency can be improved.

  Further, the electronic component supply apparatus 100 is configured to move the first stacker unit 110a and the second stacker unit 110b separately, so that the other stacker unit can be supplied while the tray of one stacker unit is being supplied to the component supply region. The tray position of the stacker unit can be changed. Accordingly, the tray can be collected by one stacker unit, and the tray can be supplied by the other stacker unit. Thereby, the tray replacement time can be shortened.

  In addition, when the electronic component supply apparatus 100 moves the tray to the component supply region 116 by the first tray conveyance unit 112, the electronic component supply device 100 moves the tray in a direction orthogonal to the movement direction. The area where the trays conveyed by the second tray conveyance unit 114 overlap can be increased. Thereby, the component supply area | region 116 can be made narrower. The size of the electronic component mounting apparatus in the Y direction can be further reduced. In addition, the electronic component supply apparatus 100 is configured so that the path for transporting the tray by the first tray transport unit 112 and the path for transporting the tray by the second tray transport unit 114 partially overlap each other. It can be downsized.

  Further, the electronic component supply apparatus 100 is conveyed by the first tray conveyance unit 112 and the second tray conveyance unit 114 by inclining the tray movement path of the first tray conveyance unit 112 with respect to the Y axis. The area where trays overlap can be increased. Further, in the electronic component supply apparatus 100, the line perpendicular to the side of the tray far from the first stacker unit of the tray that the first tray transport unit has moved to the first supply position is inclined with respect to the direction in which the tray is transported. As a result, it is possible to increase the area where the trays conveyed by the first tray conveyance unit 112 and the second tray conveyance unit 114 overlap. In addition, the electronic component supply apparatus 100 rotates the tray in the θ direction by the first tray transport unit 114, so that even if the same tray is used for the first stacker unit 110 a and the second stacker unit 110 b, The parts can be oriented in the same direction.

  In addition, the electronic component supply apparatus 100 rotates the tray by the first tray transport unit 112 and translates the tray in parallel by the second tray transport unit 114 (moves in two orthogonal directions without changing the direction of the tray). However, the present invention is not limited to this. The electronic component supply apparatus 100 may rotate both trays during movement, or may translate both trays during movement.

  The description of each part of the electronic component mounting apparatus 10 will be continued. As shown in FIG. 14, the rear-side component supply unit 14r includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 70 and a plurality of electronic component supply devices 70a. A plurality of component supply devices 70 and 70 a shown in FIG. 14 are held by a support base (bank) 72. Further, the support base 72 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 70 and 70a.

  The component supply unit 14r is equipped with an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and the lead type electronic component held by the electronic component holding tape The lead is cut at the holding position (second holding position), and a plurality of electronic component supply devices 70 are mounted so that the lead-type electronic component at the holding position can be held by the suction nozzle or the grip nozzle provided in the head. In addition, the component supply unit 14r is mounted with an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body, and a holding position (first position) of the mounted electronic component held by the electronic component holding tape. The electronic component supply device 70a is provided that can be peeled off from the tape main body at one holding position and can be held by the suction nozzle or gripping nozzle provided in the head. The component supply unit 14 may install a stick feeder or a tray feeder in the rear bank 46 as the other electronic component supply device 70a.

  The electronic component supply device 70 is a radial feeder, and supplies electronic components to a holding position (suction position, gripping position). The electronic components supplied to the holding position by each component supply device 70 are mounted on the substrate 8 by the head 15. The component supply device 70 supplies a radial lead type electronic component to the head 15 using an electronic component holding tape configured by attaching leads of a plurality of radial lead type electronic components to the tape. The component supply device 70 holds an electronic component holding tape, feeds the held electronic component holding tape, and holds a radial lead type electronic component held by the nozzle of the head 15 (suction position) , Gripping position, holding position). The component supply device 70 cuts and separates the lead of the radial lead type electronic component moved to the holding region, so that the radial lead type electronic component with the lead fixed by the tape can be held in a predetermined position. The radial lead type electronic component can be held (adsorbed and gripped) by the nozzle of the head 15. The component supply device 70 will be described later. The plurality of component supply apparatuses 70 may supply different types of electronic components or separate electronic components.

  The electronic component supply device 70a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 70 a is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic component can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 70a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder, a tape feeder, or a bulk feeder can be used.

  The component supply unit 14 includes a plurality of component supply devices 70, 70 a held on a support base 72, a plurality of types of component supply devices 70, different types of electronic components to be mounted, mechanisms for holding electronic components, or supply mechanisms. 70a. The component supply unit 14 may include a plurality of the same type of component supply devices 70 and 70a. The component supply unit 14 is preferably configured to be detachable from the apparatus main body.

  The head 15 is an electronic component held by the component supply unit 14f (lead-type electronic component held by the bowl feeder unit or an electronic component held by the component supply unit 14r (radial lead held by the electronic component supply device 70). A mechanism for holding (sucking or gripping) a mold electronic component (lead type electronic component, insertion type electronic component) with a nozzle and mounting the held electronic component on the substrate 8 moved to a predetermined position by the substrate transport unit 12 When the component supply unit 14r includes the electronic component supply device 70a, the head 15 mounts (mounts) a chip electronic component (mounted electronic component) held by the electronic component supply device 70a on the substrate 8. The structure of the head 15 will be described later, and the chip electronic component (mounted electronic component) is the shape of the substrate. A lead-free electronic component that does not have a lead that is inserted into the inserted hole (through hole), and the mounted electronic component is exemplified by SOP, QFP, etc. The chip-type electronic component has a lead. It is mounted on the board without being inserted into the insertion hole.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIGS. 1 and 2, that is, on a plane parallel to the surface of the substrate 8. Part 24. The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices of the component supply units 14f and 14r on the substrate 8 at predetermined positions (mounting position, mounting position). It becomes a transfer means to transfer to. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and includes a camera for photographing the vicinity of the nozzles of the head 15 and an illumination unit for illuminating the photographing region. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image so that it is adsorbed by the nozzle. Recognize the shape of the electronic component and the holding state of the electronic component by the nozzle. The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18, and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation, and includes a keyboard 40a and buttons 40b. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker, and includes a display device such as a liquid crystal monitor. The display unit 42 displays various images based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of the present embodiment has one head, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two X-axis drive units are provided, and the two heads can be moved independently by moving the two heads in the XY directions, respectively. Since the electronic component mounting apparatus 10 includes two heads, electronic components can be alternately mounted on one substrate 8. Thus, by alternately mounting electronic components with two heads, while one head is mounting the electronic component on the substrate 8, the other head holds the electronic component in the component supply device. be able to. Thereby, the time when an electronic component is not mounted on the board | substrate 8 can be shortened more, and an electronic component can be mounted efficiently. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can more efficiently mount electronic components on the substrate by moving the two substrates alternately to the electronic component mounting position by the two substrate transfer units 12 and mounting the components alternately by the two heads 15. can do.

  Next, the configuration of the head 15 will be described with reference to FIGS. 15 and 16. FIG. 15 is a schematic diagram illustrating a schematic configuration of a head of the electronic component mounting apparatus. FIG. 16 is a schematic diagram illustrating a schematic configuration of a head of the electronic component mounting apparatus. FIG. 15 also shows various control units that control the electronic component mounting apparatus 10 and one component supply device 70 of the component supply unit 14r. As shown in FIGS. 15 and 16, the head 15 includes a head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (component state detection unit, state detection). Part) 38.

  As illustrated in FIG. 15, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  In the electronic component supply device 70, the main body of the electronic component 80 is exposed upward on the electronic component holding tape. The electronic component supply apparatus 70 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the component mounting apparatus 70 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape. The configuration of the electronic component supply device 70 will be described later. Similarly, in the case of the electronic component supply device 70a, the predetermined position is a holding region for holding the electronic component 80 in which the nozzles of the head 15 are held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. In the head main body 30 of the present embodiment, six nozzles 32 are arranged in a row as shown in FIG. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 16, the suction nozzle which each adsorbs and hold | maintains an electronic component is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 33 at the tip, and sucks air from the opening 33 to suck and hold the electronic component 80 at the tip. The nozzle 32 has a shaft 32 a that is formed with an opening 33 and is connected to a tip portion that sucks the electronic component 80. The shaft 32a is a rod-like member that supports the tip, and is arranged extending in the Z-axis direction. The shaft 32 a has an air pipe (pipe) that connects the opening 33 and the suction mechanism of the nozzle drive unit 34 therein.

  The nozzle drive unit 34 moves the nozzle 32 in the Z-axis direction and sucks the electronic component 80 through the opening 33 of the nozzle 32. Here, the Z axis is an axis orthogonal to the XY plane. The Z axis is a direction orthogonal to the surface of the substrate. In addition, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction when mounting electronic components. That is, the θ direction is a direction parallel to the circumferential direction of a circle centering on the Z axis, which is an axis parallel to the direction in which the Z-axis drive unit moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32.

  As the mechanism for moving the nozzle 32 in the Z-axis direction, the nozzle driving unit 34 includes, for example, a mechanism having a linear motion linear motor in which the Z-axis direction is the driving direction. The nozzle driving unit 34 moves the opening 33 at the tip of the nozzle 32 in the Z-axis direction by moving the shaft 32a of the nozzle 32 in the Z-axis direction with a linear motion linear motor. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to the shaft 32a as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle drive unit 34 transmits the driving force output from the motor to the shaft 32a by a transmission element, and rotates the shaft 32a in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 33 of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 33 of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 switches whether to suck air from the opening 33 by sucking air from the air pipe with a pump and switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks air from the opening 33 to suck (hold) the electronic component 80 into the opening 33, and closes the electromagnetic valve and does not suck air from the opening 33 to suck into the opening 33. The electronic component 80 that has been opened is opened, that is, a state in which the electronic component 80 is not picked up by the opening 33 (not held).

  The head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component. Similarly to the suction nozzle, the gripping nozzle can open and close the movable body with respect to the fixed piece by sucking and releasing air, thereby opening and closing the main body of the electronic component from above. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. Further, the height sensor 37 detects the height of the facing part, specifically, the electronic component by processing the distance from the facing part using its own position at the time of measurement and the position of the substrate. . The process of detecting the height of the electronic component based on the measurement result of the distance to the electronic component may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 15, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 70 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a. The shape recognition processing by the laser recognition device 38 will be described later.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 15, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, ROM, and RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls control operations by the head control unit 62 and the component supply control unit 64.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the suction (holding) / release operation of the electronic components of the nozzle 32 and the rotation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, a distance sensor). Controls movement and movement in the Z-axis direction.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each of the component supply devices 70, 70a, 100, or may control all the component supply devices 70, 70a, 100 by one. For example, the component supply control unit 64 controls tray replacement operation and movement operation by the electronic component supply apparatus 100. The component supply control unit 64 controls the electronic component holding tape drawing operation (moving operation), lead cutting operation, and radial lead type electronic component holding operation by the component supply device 70. Further, the electronic component holding tape is pulled out (moved) by the component supply device 70a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

  Next, the operation of each part of the electronic component mounting apparatus will be described. Note that the operation of each part of the electronic component described below can be executed by controlling the operation of each part based on the control device 20.

  FIG. 17 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The outline of the entire processing operation of the electronic component mounting apparatus 10 will be described with reference to FIG. Note that the processing shown in FIG. 17 is executed by the control device 20 controlling each unit. The electronic component mounting apparatus 10 reads a production program as step S52. The production program is created by a dedicated production program creation device, or created by the control device 20 based on various input data.

  After reading the production program in step S52, the electronic component mounting apparatus 10 detects the state of the apparatus in step S54. Specifically, the configuration of the component supply units 14f and 14r, the type of electronic component being filled, the type of nozzle prepared, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and when preparation is completed, the board is loaded as step S56. The electronic component mounting apparatus 10 carries in a board | substrate at step S56, and if a board | substrate is arrange | positioned in the position which mounts an electronic component, it will mount an electronic component on a board | substrate as step S58. The electronic component mounting apparatus 10 will carry out a board | substrate as step S60, if mounting of an electronic component is completed by step S58. When the electronic component mounting apparatus 10 carries out the board in step S60, it is determined in step S62 whether production is finished. If the electronic component mounting apparatus 10 determines that the production is not finished (No) in step S62, the electronic component mounting apparatus 10 proceeds to step S56, and executes the processing from step S56 to step S60. That is, processing for mounting electronic components on the board is executed based on the production program. If the electronic component mounting apparatus 10 determines that the production is finished (Yes) in step S62, the electronic component mounting apparatus 10 finishes this process.

  The electronic component mounting apparatus 10 can manufacture a board on which the electronic component is mounted by reading the production program and performing various settings as described above, and then mounting the electronic component on the board. In addition, the electronic component mounting apparatus 10 mounts a lead-type electronic component having a main body and leads connected to the main body on the substrate as an electronic component, specifically, a hole (insertion hole) formed on the substrate. ) Can be mounted on the substrate.

  FIG. 18 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. Note that the processing operation shown in FIG. 18 is an operation from the loading of the substrate to the completion of the mounting of the electronic component on the substrate. Further, the processing operation shown in FIG. 18 is executed by the control unit 60 controlling the operation of each unit.

  The control part 60 carries in a board | substrate as step S102. Specifically, the control unit 60 transports the substrate on which the electronic component is to be mounted to a predetermined position by the substrate transport unit 12. If the board | substrate is carried in by step S102, the control part 60 will carry out holding movement as step S104. Here, the holding movement (suction movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding area of the component supply unit 14.

  After performing the holding movement in step S104, the control unit 60 lowers the nozzle 32 as step S106. That is, the control unit 60 moves the nozzle 32 downward to a position where the electronic component 80 can be held (sucked and gripped). After lowering the nozzle 32 in step S106, the control unit 60 holds the component with the nozzle 32 as step S108 and raises the nozzle 32 as step S110. When the control unit 60 raises the nozzle to a predetermined position in step S110, specifically, moves the electronic component 80 to the measurement position of the laser recognition device 38, the electronic component sucked by the nozzle 32 is step S112. Detect the shape. When detecting the shape of the electronic component in step S112, the control unit 60 raises the nozzle in step S114. Note that, as described above, the control unit 60 detects the part shape in step S112, and when it is determined that the held electronic part cannot be mounted, the electronic part is discarded and the electronic part is adsorbed again. When the control unit 60 raises the nozzle to a predetermined position, in step S116, the controller 60 moves the electronic component sucked by the nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8. In step S118, the nozzle 32 is lowered. In step S120, component mounting (component mounting), that is, a processing operation for releasing the electronic component 80 from the nozzle 32 is performed. In step S122, the nozzle 32 is raised. That is, the control unit 60 performs the mounting process described above in the processing operation from step S112 to step S120.

  When the nozzle is raised in step S122, the control unit 60 determines in step S124 whether the mounting of all the components is complete, that is, whether the mounting process of the electronic component to be mounted on the substrate 8 is completed. If the control unit 60 determines in step S124 that the mounting of all the components has not been completed (No), that is, it is determined that the electronic components to be mounted remain, the process proceeds to step S104, and the next electronic component is placed on the substrate 8. Execute the processing operation to be installed. In this way, the control unit 60 repeats the above processing operation until the mounting of all components on the board is completed. If the control unit 60 determines in step S124 that all parts have been mounted (Yes), the process ends.

  The electronic component mounting apparatus 10 can mount the electronic component on the substrate by executing the processing operation shown in FIG. 18, and can produce the substrate on which the electronic component is mounted.

  Next, the operation of the electronic component supply apparatus 100 will be described with reference to FIGS. 19 and 20. FIG. 19 is a flowchart illustrating an example of the operation of the electronic component supply apparatus. FIG. 20 is a flowchart illustrating an example of the operation of the electronic component supply apparatus. First, the operation of supplying the tray to the supply position (first supply position and second supply position) will be described with reference to FIG. 19 and 20 can be realized by processing by the component supply control unit 64.

  In step S202, the component supply control unit 64 moves the tray of the second stacker unit from the standby position to the supply position. Here, the standby position is a position where the stacker unit is arranged, and the supply position is a component supply area. After supplying the tray to the supply position in step S202, the component supply control unit 64 determines whether to replace the tray in step S204. If the component supply control unit 64 determines in step S204 that the tray is not replaced (No), the component supply control unit 64 proceeds to step S204. The component supply control unit 64 repeats the determination in step S204 until the tray is replaced.

  If it is determined in step S204 that the tray is to be replaced (Yes), the component supply control unit 64 starts moving the tray in the supply position toward the standby position of the second stacker unit in step S206.

  After starting the movement of the tray in step S206, the component supply control unit 64 determines whether the tray detection sensor has detected the tray in step s208. That is, it is determined whether the tray detection sensor on the tray transport path has detected passage of the tray. If the component supply control unit 64 determines that the tray detection sensor does not detect the tray (No), the component supply control unit 64 proceeds to step S208.

  If it is determined in step S208 that the tray detection sensor has detected the tray (Yes), the component supply control unit 64 moves the tray of the first stacker unit from the standby position to the supply position in step S210, and ends this process. .

  The component supply control unit 64 can supply the trays alternately by performing the same control even when the trays are supplied from the first stacker unit to the supply position. In addition, when the tray detection sensor detects the tray, the component supply control unit 64 can suppress the trays supplied from the two stacker units from colliding by starting the movement of the tray of the other stacker unit. . Moreover, since the movement of the tray of the other stacker unit can be started before the tray is stored in the stacker unit, the tray can be efficiently moved.

  Next, the operation of the stacker holding and transporting mechanism will be described with reference to FIG. In step S220, the component supply control unit 64 determines whether there is a tray at a standby position (a position where the tray is conveyed by the tray conveyance unit). If the component supply control unit 64 determines that there is a tray, the process proceeds to step S220.

  If the component supply control unit 64 determines in step S220 that there is no tray (No), that is, the tray has been moved to the component supply region, in step S222, whether the tray is in the standby position, that is, the tray returns to the standby position. Judge whether you have been.

  If the component supply control unit 64 determines in step S222 that there is no tray (No), that is, the tray is not returned, the process proceeds to step S222. If it is determined in step S222 that there is a tray (Yes), the component supply control unit 64 determines in step S224 whether there is a tray that holds an electronic component. That is, the component supply control unit 64 determines whether there is a tray in the stacker unit that has not been moved to the component supply area.

  If it is determined in step S224 that there is a tray (Yes), the component supply control unit 64 moves the position of the stacker unit in step S226, that is, moves the tray that has not been moved to the component supply area to the standby position. The process proceeds to step S220. If it is determined in step S224 that there is no tray (No), the component supply control unit 64 notifies a stacker unit replacement request in step S228, and ends this process.

  The electronic component supply apparatus 100 can mount the electronic components of the stacker unit tray on the substrate by sequentially moving the stacker unit tray to the standby position as described above. Further, the stacker unit can be quickly replaced by notifying the stacker unit replacement request.

  Here, the electronic component mounting apparatus 10 of the above-described embodiment includes a tray feeder electronic component supply device 100 as the component supply unit 14f, and the radial feeder electronic component supply device 70 and the mountable electronic component as the component supply unit 14r. However, the present invention is not limited to this. The electronic component mounting apparatus 10 can have various combinations of component supply units. For example, the electronic component supply apparatus 100 may be installed in both the front and rear component supply units. Various electronic component supply devices can be used for the rear-side component supply unit. Further, the electronic component supply device of one of the front and rear component supply units may be an electronic component supply device (chip component feeder) 70a. That is, one of the front and rear component supply units supplies lead-type electronic components (electronic components inserted into the board), and the other supplies leadless electronic components (electronic components mounted on the board). It may be. In addition, the electronic component mounting device supplies the holding position in the state where the lead of the axial type electronic component held on the tape as an electronic component supply device is cut out so as to be short under the substrate as described above and bent into a U-shape. An axial feeder can also be used.

  Further, when the head 15 of this embodiment includes a plurality of nozzles so that more types of electronic components can be mounted by one head, the automatic nozzle changer (replacement in this embodiment) is performed. Each nozzle can be replaced with various suction nozzles and gripping nozzles during mounting production using a head holding operation realized by a combination of a nozzle holding mechanism and a head body. The electronic component mounting apparatus 10 is based on component conditions such as the size, weight, whether the upper surface of the component body has a suckable plane, and whether the component body can be gripped. A suction nozzle having an appropriate suction hole diameter or a gripping nozzle having a gripping member having an appropriate shape is designated for each part and stored in the production program. The electronic component mounting apparatus 10 switches the nozzle to be mounted on the head or determines the nozzle that holds the electronic component in the head based on the correspondence between the electronic component and the nozzle stored in the production program. .

  The electronic component supply apparatus 100 may include three or more combinations of a stacker holding and conveying mechanism, a tray conveying unit, and a stacker unit.

8 Substrate, 10 Electronic component mounting apparatus, 11 Housing, 11a Main body, 11b, 11bf, 11br Cover, 11c Opening, 12 Substrate transport unit, 14, 14f, 14r Component supply unit, 15 Head, 16 XY moving mechanism, 17 VCS Unit, 18 Replacement nozzle holding mechanism, 19 Component storage unit, 20 Control device, 22 X-axis drive unit, 24 Y-axis drive unit, 30 Head body, 31 Head support, 32 nozzles, 34 Nozzle drive unit, 38 Laser recognition device , 40 operation unit, 42 display unit, 60 control unit, 62 head control unit, 64 component supply control unit, 70, 70a, 100 electronic component supply device, 80 electronic component, 102 housing, 102a door, 104 first stacker holding Transport mechanism, 106 Second stacker holding and transport mechanism, 108 Tray transport mechanism, 110a First stacker unit, 110 b Second stacker unit, 112 First tray transport unit, 114 Second tray transport unit, 116 Component supply area, 120, 122, 124, 126, 164 Arrow, 130, 140 Tray holding mechanism, 132, 142 Drawer mechanism, 134 144 Rail guide, 136, 146 Chuck guide, 150, 152 Connecting part, 150a, 152a Contact end, 154 guide, 156, 170 Chuck moving mechanism, 156a, 170a Movable part, 156b, 170b Fixed part (guide part), 159 Roller, 160 drawer base, 162 drawer movable part, 172 base, 174, 176 linear motion guide shaft, 180 tray detection sensor, 190 tray coupling part, T ₁ , T ₂ tray, P ₁ , P ₂ standby position

Claims (12)

An electronic component supply device for supplying an electronic component to a holding area,
A first stacker unit for holding a plurality of trays containing electronic components;
A second stacker unit for holding a plurality of trays containing electronic components;
A first tray transport unit that moves the tray of the first stacker unit to a first supply position;
A second tray transport unit that moves the tray of the second stacker unit to a second supply position;
A control unit for controlling the operation of each unit,
The electronic part supply apparatus according to claim 1, wherein the control unit can alternately supply a tray to the first supply position and the second supply position.   2. The electronic component supply apparatus according to claim 1, wherein a total area of the first supply position and the second supply position is smaller than twice the area of the tray.   The electronic component supply apparatus according to claim 2, wherein the second supply position partially overlaps the first supply position.   4. The first tray transport unit according to claim 1, wherein a passing area of the tray to be transported overlaps a part of a passing area of the tray to be transported by the second tray transport unit. The electronic component supply apparatus according to Item.   5. The first tray transport unit according to claim 1, wherein a direction in which the tray is transported is inclined with respect to a direction in which the second tray transport unit transports the tray. The electronic component supply apparatus according to Item.   The first tray transport unit is configured such that a line orthogonal to the side of the tray that has moved to the first supply position and that is far from the first stacker unit is inclined with respect to the direction in which the tray is transported. The electronic component supply apparatus according to claim 1, wherein the electronic component supply apparatus is characterized in that:   The electronic apparatus according to claim 6, wherein the first tray transport unit includes a tray rotation mechanism that rotates the tray while transporting the tray from the first stacker unit to the first supply position. Parts supply device.   The first tray transfer unit can hold the tray different from the tray held by the second tray transfer unit while the second tray transfer unit holds the tray. The electronic component supply apparatus according to any one of 1 to 7. A first stacker holding and transporting mechanism for moving the first stacker unit while holding and switching a tray at a band position where the first tray transporting unit holds the tray;
2. A second stacker holding and conveying mechanism that moves the second stacker unit while holding the second stacker unit and switches a tray at a band position where the second tray conveying unit holds the tray. The electronic component supply device according to any one of 1 to 8.   The electronic component supply apparatus according to any one of claims 1 to 9, wherein the first supply position and the second supply position are on the same plane. The electronic component supply device according to any one of claims 1 to 10,
A nozzle that holds an electronic component supplied from the electronic component supply device to the holding region, a nozzle drive unit that drives the nozzle up and down and rotates and supplies air pressure that drives the nozzle to the nozzle, the nozzle, and the nozzle A head body having a head support for supporting the nozzle drive unit;
A head moving mechanism for moving the head body,
The electronic component at the holding position of the electronic component supply device is held by the nozzle of the head main body, the head moving mechanism moves the nozzle to the mounting position of the substrate, and the electronic component held by the nozzle is An electronic component mounting apparatus which is mounted on a substrate.   The head main body holds the electronic component of the tray at the first supply position with the nozzle and mounts it on the substrate, and holds the electronic component of the tray at the second supply position with the nozzle. The electronic component mounting apparatus according to claim 11, wherein the electronic component mounting apparatus is mounted on the substrate.

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