JP2013211465A - Groove processing tool, groove processing method of thin-film solar cell using the same, and groove processing device - Google Patents
Groove processing tool, groove processing method of thin-film solar cell using the same, and groove processing device Download PDFInfo
- Publication number
- JP2013211465A JP2013211465A JP2012081865A JP2012081865A JP2013211465A JP 2013211465 A JP2013211465 A JP 2013211465A JP 2012081865 A JP2012081865 A JP 2012081865A JP 2012081865 A JP2012081865 A JP 2012081865A JP 2013211465 A JP2013211465 A JP 2013211465A
- Authority
- JP
- Japan
- Prior art keywords
- groove processing
- solar cell
- thin film
- film solar
- cutting edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 52
- 238000003672 processing method Methods 0.000 title claims description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 description 32
- 239000010410 layer Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- 230000031700 light absorption Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 5
- 229910052951 chalcopyrite Inorganic materials 0.000 description 3
- -1 chalcopyrite compound Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 238000000224 chemical solution deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/28—Grooving workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
本発明は、薄膜太陽電池を製造する際に用いる溝加工ツールおよび溝加工ツールを用いた溝加工方法ならびに溝加工装置に関する。 The present invention relates to a grooving tool, a grooving method using the grooving tool, and a grooving apparatus used when manufacturing a thin-film solar cell.
薄膜太陽電池においては、基板上に複数のユニットセルを直列接続した集積型構造が一般的である。薄膜太陽電池の一例として、カルコパイライト化合物半導体を光吸収層として用いるカルコパイライト化合物系薄膜太陽電池の製造方法について説明する。なお、カルコパイライト化合物とは、ＣＩＧＳ（Ｃｕ（Ｉｎ，Ｇａ）Ｓｅ２）の他に、ＣＩＧＳＳ（Ｃｕ（Ｉｎ，Ｇａ）（Ｓｅ，Ｓ）２）、ＣＩＳ（ＣｕＩｎＳ２）等が含まれる。 In a thin film solar cell, an integrated structure in which a plurality of unit cells are connected in series on a substrate is generally used. As an example of the thin film solar cell, a method for producing a chalcopyrite compound thin film solar cell using a chalcopyrite compound semiconductor as a light absorption layer will be described. The chalcopyrite compound includes CIGS (Cu (In, Ga) (Se, S) 2), CIS (CuInS2) and the like in addition to CIGS (Cu (In, Ga) Se2).
図７は、ＣＩＧＳ薄膜太陽電池の製造工程を示す模式図である。まず、図７（ａ）に示すように、ソーダライムガラス（ＳＬＧ）等からなる絶縁基板１上に、プラス側の下部電極となるＭｏ電極層２をスパッタリング法によって形成した後、光吸収層形成前の薄膜太陽電池基板に対してスクライブ加工により下部電極分離用の溝Ｓを形成する。 FIG. 7 is a schematic diagram showing a manufacturing process of a CIGS thin film solar cell. First, as shown in FIG. 7A, a Mo electrode layer 2 serving as a plus-side lower electrode is formed on an insulating substrate 1 made of soda lime glass (SLG) or the like by sputtering, and then a light absorption layer is formed. A groove S for lower electrode separation is formed on the previous thin film solar cell substrate by scribing.
その後、図７（ｂ）に示すように、Ｍｏ電極層２上に、化合物半導体（ＣＩＧＳ）薄膜
からなる光吸収層３を蒸着法、スパッタリング法等によって形成し、その上に、ヘテロ接
合のためのＺｎＳ薄膜等からなるバッファ層４をＣＢＤ法（ケミカルバスデポジション法
）により形成し、その上に、ＺｎＯ薄膜からなる絶縁層５を形成する。そして、透明電極
層形成前の薄膜太陽電池基板に対して、下部電極分離用の溝Ｓから横方向に所定距離はな
れた位置に、スクライブ加工によりＭｏ電極層２にまで到達する電極間コンタクト用の溝
Ｍ１を形成する。
After that, as shown in FIG. 7B, a light absorption layer 3 made of a compound semiconductor (CIGS) thin film is formed on the Mo electrode layer 2 by vapor deposition, sputtering, or the like, and on that, for heterojunction. A buffer layer 4 made of a ZnS thin film is formed by a CBD method (chemical bath deposition method), and an insulating layer 5 made of a ZnO thin film is formed thereon. And for the inter-electrode contact that reaches the Mo electrode layer 2 by scribing at a position that is a predetermined distance in the lateral direction from the groove S for separating the lower electrode with respect to the thin film solar cell substrate before forming the transparent electrode layer A groove M1 is formed.
続いて、図７（ｃ）に示すように、絶縁層５の上からＺｎＯ：Ａｌ薄膜からなる上部電
極としての透明電極層６を形成し、光電変換を利用した発電に必要な各機能層を備えた太
陽電池基板とし、スクライブ加工により下部のＭｏ電極層２にまで到達する電極分離用の
溝Ｍ２を形成する。
Subsequently, as shown in FIG. 7C, a transparent electrode layer 6 as an upper electrode made of a ZnO: Al thin film is formed on the insulating layer 5, and each functional layer necessary for power generation using photoelectric conversion is formed. An electrode separation groove M2 reaching the lower Mo electrode layer 2 is formed by scribing, using the solar cell substrate provided.
上述した集積型薄膜太陽電池を製造する工程において、電極分離用の溝Ｍ１およびＭ２
をスクライブにより溝加工する技術として、レーザスクライブ法とメカニカルスクライブ
法が用いられてきた。
In the process of manufacturing the integrated thin film solar cell described above, grooves M1 and M2 for electrode separation are used.
Laser scribing and mechanical scribing methods have been used as a technique for grooving a metal by scribing.
レーザスクライブ法は、例えば特許文献１で開示されているように、アークランプ等の
連続放電ランプによってＮｄ：ＹＡＧ結晶を励起して発信したレーザ光を照射することに
より電極分離用の溝を形成する。この方法は、光吸収層形成後の薄膜太陽電池基板に対し
て溝を形成する場合、スクライブ時にレーザ光の熱によって光吸収層３の光電変換特性が
劣化するおそれがあった。
In the laser scribing method, as disclosed in, for example, Patent Document 1, a groove for electrode separation is formed by irradiating laser light emitted by exciting an Nd: YAG crystal with a continuous discharge lamp such as an arc lamp. . In this method, when a groove is formed on the thin-film solar cell substrate after the light absorption layer is formed, the photoelectric conversion characteristics of the light absorption layer 3 may be deteriorated by the heat of the laser light during scribing.
メカニカルスクライブ法は、例えば特許文献２および３で開示されているように、先端
が先細り状となった金属針（ニードル）等の溝加工ツールの刃先を、所定の圧力をかけて
基板に押しつけながら移動させることによって、電極分離用の溝を加工する技術である。
For example, as disclosed in Patent Documents 2 and 3, the mechanical scribing method is performed by pressing a cutting edge of a groove processing tool such as a metal needle (needle) having a tapered tip against a substrate while applying a predetermined pressure. This is a technique for processing a groove for electrode separation by moving the electrode.
特許文献２および３に開示されているようなメカニカルスクライブ法では、溝加工ツー
ルの刃先の形状を先細りの針状にしてあるが、厳密には、薄膜太陽電池に圧接される部分
は接触面積を広くするために平らとなるように先端が略水平にカットされている。すなわ
ち、図８に示すように、先端部分が先細りの円錐台形状にしてある。このような形状の溝加工ツール８’を、薄膜太陽電池基板の溝を形成すべき薄膜（上下両電極や光吸収層等の各種機能層）に押しつけながら、スクライブ予定ラインに沿ってＹ方向へ相対的に移動させることで、溝加工を行うようにしている。
先端部分が先細りの円錐台形状の溝加工ツールを用いることにより、比較的安定して溝加工を行うことができる。その一方で、薄膜が不規則に大きく剥がれてしまい、除去する必要のない部分まで除去してしまうことがあり、太陽電池の性能および歩留まりが低下するといった問題点があった。
In the mechanical scribing method as disclosed in Patent Documents 2 and 3, the shape of the cutting edge of the grooving tool is tapered, but strictly speaking, the portion to be pressed against the thin film solar cell has a contact area. The tip is cut substantially horizontally so that it is flat for widening. That is, as shown in FIG. 8, the tip portion has a tapered truncated cone shape. While pressing the groove processing tool 8 ′ having such a shape against the thin film (various functional layers such as the upper and lower electrodes and the light absorption layer) on which the groove of the thin film solar cell substrate is to be formed, the Y direction along the planned scribe line Groove processing is performed by relatively moving.
By using a frustoconical grooving tool with a tapered tip, grooving can be performed relatively stably. On the other hand, there is a problem that the thin film is peeled off irregularly and even parts that do not need to be removed may be removed, resulting in a decrease in the performance and yield of the solar cell.
そこで、本発明は、薄膜太陽電池基板における光吸収層や電極膜等の各種機能層に溝を加工する際に、歩留まりよく、また、光電変換効率等の製品としての性能を低下を抑制して加工することのできる薄膜太陽電池の溝加工ツールおよびこの溝加工ツールを用いた溝加工方法ならびに溝加工装置を提供することを目的とする。 Therefore, the present invention has a good yield when processing grooves in various functional layers such as a light absorption layer and an electrode film in a thin film solar cell substrate, and suppresses a decrease in performance as a product such as photoelectric conversion efficiency. An object of the present invention is to provide a groove processing tool for a thin film solar cell that can be processed, a groove processing method and a groove processing apparatus using the groove processing tool.
上記課題を解決するためになされた本発明の薄膜太陽電池用の溝加工ツールは、
棒状のボディと、ボディの先端に形成された円錐台状の刃先領域とからなり、刃先領域は、底面と底面からボディに向かって延びる側面とを有し、底面と側面とによって形成される角部が刃先をなし、底面からボディに向かって細くなるように形成されている。
また、上記課題を解決するためになされた本発明にかかる薄膜太陽電池の溝加工方法は、薄膜太陽電池基板のスクライブ予定ラインに沿って、溝加工ツールの刃先で押圧しながら、太陽電池基板と溝加工ツールを相対的に移動させて太陽電池基板の薄膜にスクライブラインを形成する集積型薄膜太陽電池の溝加工方法であって、本発明の溝加工ツールを用いて、溝加工ツールの底面を薄膜太陽電池基板の表面に押圧して溝加工を行う。
さらに、上記課題を解決するためになされた本発明にかかる薄膜太陽電池の溝加工装置は、本発明の溝加工ツールと、太陽電池基板が載置されるテーブルと、溝加工ツールの底面を前記太陽電池基板の表面に押圧した状態でスクライブさせるスクライブヘッドを備える。
The groove processing tool for a thin-film solar cell of the present invention made to solve the above problems is
It consists of a rod-shaped body and a frustoconical cutting edge region formed at the tip of the body, the cutting edge region having a bottom surface and a side surface extending from the bottom surface toward the body, and an angle formed by the bottom surface and the side surface The part has a cutting edge and is formed so as to become narrower from the bottom toward the body.
Moreover, the groove processing method of the thin film solar cell according to the present invention made to solve the above-mentioned problems is performed by pressing the cutting edge of the groove processing tool along the scribe line of the thin film solar cell substrate with the solar cell substrate. A groove processing method for an integrated thin-film solar cell in which a scribe line is formed on a thin film of a solar cell substrate by relatively moving a groove processing tool, and the bottom surface of the groove processing tool is formed using the groove processing tool of the present invention. Groove processing is performed by pressing the surface of the thin film solar cell substrate.
Furthermore, the groove processing apparatus for a thin-film solar cell according to the present invention, which has been made to solve the above problems, includes the groove processing tool of the present invention, a table on which a solar cell substrate is placed, and the bottom surface of the groove processing tool. A scribing head is provided that scribes the solar cell substrate while being pressed against the surface.
本発明の溝加工ツールによれば、刃先領域は、薄膜太陽電池基板に押圧される底面からボディに向かって細くなるように形成されているので、基板から除去された薄膜がボディ側にスムーズに排出されるため、除去された薄膜による影響を受けることなく、膜はがれの少ないスクライブラインを形成することができる。 According to the grooving tool of the present invention, the cutting edge region is formed so as to become narrower from the bottom surface pressed against the thin film solar cell substrate toward the body, so that the thin film removed from the substrate is smoothly moved to the body side. Since it is discharged, a scribe line with little film peeling can be formed without being affected by the removed thin film.
（その他の課題を解決するための手段及び効果）
溝加工ツールは、底面の幅が底面の幅が３０μｍ以上、１００μｍ以下であるようにするのが好ましい。
(Means and effects for solving other problems)
It is preferable that the groove processing tool has a bottom surface width of 30 μm or more and 100 μm or less.
溝加工ツールは、底面と前後面とによって形成される刃先の角度が６５°以上、８５°以下であるようにするのが好ましい。 In the grooving tool, it is preferable that the angle of the cutting edge formed by the bottom surface and the front and back surfaces is 65 ° or more and 85 ° or less.
溝加工ツールが、超硬合金、または、ダイヤモンドで形成されているのが好ましい。
これにより、ツールの寿命が長く、変形も少ないことから、長期間にわたって精度よく
スクライブ加工することができる。
The grooving tool is preferably made of cemented carbide or diamond.
As a result, since the tool has a long life and little deformation, it can be accurately scribed over a long period of time.
以下において、本発明の詳細を、その実施の形態を示す図面に基づいて詳細に説明する
。
図１は本発明にかかる溝加工ツールを用いた集積型薄膜太陽電池用スクライブ装置の実
施形態を示す斜視図である。スクライブ装置は、水平方向（Ｙ方向）に移動可能で、かつ
、水平面内で９０度および角度θ回転可能なテーブル１８を備えており、テーブル１８は
実質的に太陽電池基板Ｗの保持手段を形成する。
Hereinafter, details of the present invention will be described in detail with reference to the drawings illustrating embodiments thereof.
FIG. 1 is a perspective view showing an embodiment of an integrated thin film solar cell scribing apparatus using a groove processing tool according to the present invention. The scribing device includes a table 18 that can move in the horizontal direction (Y direction) and that can rotate 90 degrees and an angle θ in a horizontal plane. The table 18 substantially forms a holding means for the solar cell substrate W. To do.
テーブル１８を挟んで設けてある両側の支持柱２０，２０と、Ｘ方向に延びるガイドバ
ー２１とで構成されるブリッジ１９は、テーブル１８上を跨ぐように設けてある。ホルダ
支持体２３は、ガイドバー２１に形成したガイド２２に沿って移動可能に取り付けられ、
モータ２４の回転によりＸ方向に移動する。
A bridge 19 composed of support pillars 20, 20 on both sides of the table 18 and guide bars 21 extending in the X direction is provided so as to straddle the table 18. The holder support 23 is movably attached along the guide 22 formed on the guide bar 21,
It moves in the X direction by the rotation of the motor 24.
ホルダ支持体２３には、スクライブヘッド７が設けられており、スクライブヘッド７の
下部には、テーブル１８上に載置される太陽電池基板Ｗの薄膜表面をスクライブ加工する
溝加工ツール８を保持するホルダ９が設けられている。
A scribe head 7 is provided on the holder support 23, and a groove processing tool 8 for scribing the thin film surface of the solar cell substrate W placed on the table 18 is held below the scribe head 7. A holder 9 is provided.
また、Ｘ方向およびＹ方向に移動することが可能な台座１２，１３にカメラ１０、１１
がそれぞれ設けられている。台座１２、１３は支持台１３上でＸ方向に延設されたガイド
１５に沿って移動する。カメラ１０、１１は、手動操作で上下動することができ、撮像の
焦点を調整することができる。カメラ１０、１１で撮影された画像はモニタ１６、１７に
表示される。
Further, the cameras 10 and 11 are mounted on the pedestals 12 and 13 that can move in the X and Y directions.
Are provided. The pedestals 12 and 13 move on the support base 13 along a guide 15 extending in the X direction. The cameras 10 and 11 can be moved up and down by manual operation, and the focus of imaging can be adjusted. Images taken by the cameras 10 and 11 are displayed on the monitors 16 and 17.
テーブル１８上に載置された太陽電池基板Ｗの表面には、位置を特定するためのアライ
メントマークが設けられており、カメラ１０、１１によりアライメントマークを撮像する
ことにより、太陽電池基板Ｗの位置を調整する。具体的には、テーブル１８に支持された
太陽電池基板Ｗ表面のアライメントマークを、カメラ１０、１１により撮像してアライメ
ントマークの位置を特定する。特定されたアライメントマークの位置に基づいて、太陽電
池基板Ｗ表面の載置時の方向ズレを検出し、テーブル１８を所定角度回転させることでズ
レを修正する。
An alignment mark for specifying the position is provided on the surface of the solar cell substrate W placed on the table 18, and the position of the solar cell substrate W is obtained by imaging the alignment mark with the cameras 10 and 11. Adjust. Specifically, the alignment marks on the surface of the solar cell substrate W supported by the table 18 are imaged by the cameras 10 and 11, and the position of the alignment mark is specified. Based on the position of the specified alignment mark, a deviation in direction when the surface of the solar cell substrate W is placed is detected, and the deviation is corrected by rotating the table 18 by a predetermined angle.
そして、テーブル１８をＹ方向に所定ピッチで移動するごとに、スクライブヘッド７を
下降させて溝形成ツール８の刃先を太陽電池基板Ｗの表面に押しつけた状態でＸ方向に移
動させ、太陽電池基板Ｗの表面をＸ方向に沿ってスクライブ加工する。太陽電池基板Ｗの
表面をＹ方向に沿ってスクライブ加工する場合は、テーブル１８を９０度回転させて、上
記と同様の動作を行う。
Each time the table 18 is moved at a predetermined pitch in the Y direction, the scribe head 7 is lowered and moved in the X direction with the cutting edge of the groove forming tool 8 pressed against the surface of the solar cell substrate W. The surface of W is scribed along the X direction. When the surface of the solar cell substrate W is scribed along the Y direction, the table 18 is rotated 90 degrees and the same operation as described above is performed.
図２、図３および図４は、本発明において用いる溝加工ツール８を示す模式図である。図２は下方から見た斜視図であり、図３は溝加工ツール８の底面を底面側から見た拡大図であり、図４は溝加工ツール８の刃先領域を側面側から見た拡大図である。この溝形成ツール８は、実質的にスクライブヘッド７への取付部となる円柱状のボディ８１と、その先端部に一体的に形成された刃先領域８２とからなり、超硬合金またはダイヤモンド等の硬質材料で造られている。刃先領域８２は、円形の底面８３と、底面８３の外縁からボディ８１に向かって立ち上がった側面８４とからなる。底面８３と側面８４とによって形成される角部が刃先８５となる。 2, 3 and 4 are schematic views showing a grooving tool 8 used in the present invention. 2 is a perspective view seen from below, FIG. 3 is an enlarged view of the bottom surface of the grooving tool 8 seen from the bottom side, and FIG. 4 is an enlarged view of the cutting edge region of the grooving tool 8 seen from the side. It is. The groove forming tool 8 is composed of a cylindrical body 81 that is substantially a mounting portion to the scribe head 7 and a cutting edge region 82 that is integrally formed at the tip thereof, and is made of cemented carbide or diamond. Made of hard material. The blade edge region 82 includes a circular bottom surface 83 and a side surface 84 rising from the outer edge of the bottom surface 83 toward the body 81. A corner formed by the bottom surface 83 and the side surface 84 is the blade edge 85.
底面８３の幅Ｗは５０〜８０μｍが好ましいが、要求されるスクライブの溝幅に合わせて３０〜１００μｍとすることができる。また、刃先領域８２の有効高さ、すなわ刃先領域の側面８４の高さＨは１０μｍ〜２３０μｍ程度が好ましい。また、底面８３と側面８４とによって形成される角部の角度は、６５°〜８５°が好ましい。さらに、円柱状のボディ８１の直径は２〜４mm程度がよい。なお、溝形成ツール８のボディ８１は円柱状に限らず、断面四角形や多角形で形成することも可能である。 The width W of the bottom surface 83 is preferably 50 to 80 μm, but can be 30 to 100 μm according to the required groove width of the scribe. Further, the effective height of the cutting edge region 82, that is, the height H of the side surface 84 of the cutting edge region is preferably about 10 μm to 230 μm. The angle of the corner formed by the bottom surface 83 and the side surface 84 is preferably 65 ° to 85 °. Furthermore, the diameter of the cylindrical body 81 is preferably about 2 to 4 mm. Note that the body 81 of the groove forming tool 8 is not limited to a columnar shape, and may be formed with a square or polygonal cross section.
上述した溝加工ツール８を用いて加工を行う場合は、刃先領域８２の底面８３をツールの移動方向に沿った状態で、かつ、太陽電池基板Ｗの表面に対して平行な状態でスクライブヘッド７に取り付ける。 When machining using the above-described grooving tool 8, the scribe head 7 in a state where the bottom surface 83 of the cutting edge region 82 is along the moving direction of the tool and parallel to the surface of the solar cell substrate W. Attach to.
本発明によれば、刃先領域８２は、薄膜太陽電池基板Ｗに押圧される底面８３からボディ８１に向かって細くなるように形成されているので、基板から除去された薄膜がボディ側にスムーズに排出されるため、除去された薄膜による影響を受けることなく、膜はがれの少ないスクライブラインを形成することができる。 According to the present invention, the cutting edge region 82 is formed so as to become narrower from the bottom surface 83 pressed against the thin film solar cell substrate W toward the body 81, so that the thin film removed from the substrate smoothly moves toward the body side. Since it is discharged, a scribe line with little film peeling can be formed without being affected by the removed thin film.
図５は従来からの加工ツールにより形成されたスクライブラインと、本発明の溝加工ツ
ールにより形成されたスクライブラインとを比較した画像データである。図５（ａ）は従来の溝加工ツールを用いて形成したスクライブラインを示し、図５（ｂ）は本発明の溝加工ツールを用いて形成したスクライブラインを示す。本発明の溝加工ツールを用いて形成したスクライブした場合には、従来例に比べて、明らかに一定の幅できれいなスクライブラインを形成することができた。
FIG. 5 shows image data comparing a scribe line formed by a conventional processing tool and a scribe line formed by the groove processing tool of the present invention. FIG. 5A shows a scribe line formed using a conventional groove processing tool, and FIG. 5B shows a scribe line formed using the groove processing tool of the present invention. In the case of scribing using the groove processing tool of the present invention, a clear scribe line having a clearly constant width could be formed as compared with the conventional example.
なお、上記実施例では、スクライブヘッド７をＸ方向に移動させることでスクライブ加
工を実行したが、スクライブヘッド７と、太陽電池基板Ｗとが相対的に移動できれば足り
ることから、太陽電池基板Ｗが固定された状態でスクライブヘッド７をＸ方向またはＹ方
向に移動させてもよいし、スクライブヘッド７を移動させることなく、太陽電池基板Ｗの
みをＸ方向またはＹ方向に移動させてもよい。
In addition, in the said Example, although the scribe process was performed by moving the scribe head 7 to a X direction, since it is sufficient if the scribe head 7 and the solar cell substrate W can move relatively, the solar cell substrate W is sufficient. The scribe head 7 may be moved in the X direction or Y direction in a fixed state, or only the solar cell substrate W may be moved in the X direction or Y direction without moving the scribe head 7.
以上、本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施例の
構造のみに特定されるものではない。その目的を達成し、請求の範囲を逸脱しない範囲内で適宜修正
、変更することが可能である。
As mentioned above, although the typical Example of this invention was described, this invention is not necessarily limited only to the structure of said Example. The object can be achieved and modified as appropriate within the scope of the claims.
本発明は、薄膜太陽電池の製造に用いることのできる溝加工ツール、溝加工方法および溝加工装置に適用することができる。 The present invention can be applied to a grooving tool, a grooving method, and a grooving apparatus that can be used for manufacturing a thin film solar cell.
Ｗ 太陽電池基板
７ スクライブヘッド
８ 溝加工ツール
８１ ボディ
８２ 刃先領域
８３ 刃先領域の底面
８４ 刃先領域の側面
８５ 刃先
W Solar cell substrate 7 Scribe head 8 Grooving tool 81 Body 82 Cutting edge region 83 Bottom surface of cutting edge region 84 Side surface 85 of cutting edge region Cutting edge
Claims (6)
刃先領域は、底面と底面からボディに向かって延びる側面とを有し、
底面と側面とによって形成される角部が刃先をなし、
底面からボディに向かって細くなるように形成されている薄膜太陽電池の溝加工ツール。 It consists of a rod-shaped body and a frustoconical cutting edge region formed at the tip of the body,
The cutting edge region has a bottom surface and a side surface extending from the bottom surface toward the body,
The corner formed by the bottom and side surfaces forms a cutting edge,
A thin film solar cell grooving tool that is formed so as to become thinner from the bottom toward the body.
溝加工ツール。 The grooving tool according to claim 1, wherein the grooving tool is formed of cemented carbide or diamond.
請求項１〜４のいずれかに記載の溝加工ツールの底面を前記薄膜太陽電池の薄膜の表面に押圧して、前記溝加工を行うことを特徴とする薄膜太陽電池の溝加工方法。 A thin film solar that forms a scribe line in the thin film of the thin film solar cell by moving the thin film solar cell and the groove processing tool relative to each other while pressing with a cutting edge of the groove processing tool along a scribe line of the thin film solar cell A groove processing method for a battery,
A groove processing method for a thin film solar cell, wherein the groove processing is performed by pressing the bottom surface of the groove processing tool according to any one of claims 1 to 4 against the surface of the thin film of the thin film solar cell.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012081865A JP5804999B2 (en) | 2012-03-30 | 2012-03-30 | Groove machining tool, groove machining method and groove machining apparatus for thin-film solar cell using the same |
| TW102108199A TWI498295B (en) | 2012-03-30 | 2013-03-08 | A trench processing tool and a method for processing a trough of a thin-film solar cell and a trench processing apparatus |
| KR1020130030249A KR101512705B1 (en) | 2012-03-30 | 2013-03-21 | Groove processing tool, and groove processing method and groove processing apparatus for thin film solar cell using the same |
| CN201310105510.0A CN103367535B (en) | 2012-03-30 | 2013-03-28 | Groove machining tool, method and the grooving apparatus of thin film solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012081865A JP5804999B2 (en) | 2012-03-30 | 2012-03-30 | Groove machining tool, groove machining method and groove machining apparatus for thin-film solar cell using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013211465A true JP2013211465A (en) | 2013-10-10 |
| JP5804999B2 JP5804999B2 (en) | 2015-11-04 |
Family
ID=49368481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012081865A Expired - Fee Related JP5804999B2 (en) | 2012-03-30 | 2012-03-30 | Groove machining tool, groove machining method and groove machining apparatus for thin-film solar cell using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5804999B2 (en) |
| KR (1) | KR101512705B1 (en) |
| CN (1) | CN103367535B (en) |
| TW (1) | TWI498295B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015195347A (en) * | 2014-03-28 | 2015-11-05 | 三星ダイヤモンド工業株式会社 | Groove processing tool and scribe apparatus with the groove processing tool |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104952971B (en) * | 2014-03-28 | 2017-09-19 | 三星钻石工业股份有限公司 | Groove processing instrument and the scoring device for being provided with the groove processing instrument |
| JP6332618B2 (en) * | 2014-04-24 | 2018-05-30 | 三星ダイヤモンド工業株式会社 | Scribing cutter wheel and scribing device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4083390A (en) * | 1972-09-22 | 1978-04-11 | R.E. Ingham & Co., Limited | Grooving of sheet material |
| JPH03161209A (en) * | 1989-11-17 | 1991-07-11 | Fujitsu Ltd | Working of taper hole and working device thereof |
| JP2004115356A (en) * | 2002-09-26 | 2004-04-15 | Honda Motor Co Ltd | Mechanical scribing apparatus |
| JP2007130737A (en) * | 2005-11-14 | 2007-05-31 | Honda Motor Co Ltd | Reamer, drill and machining method |
| JP2007245278A (en) * | 2006-03-15 | 2007-09-27 | Mitsubishi Materials Kobe Tools Corp | End mill |
| JP2009119543A (en) * | 2007-11-13 | 2009-06-04 | Toshiba Corp | Fine machining tool, manufacturing method of the fine machining tool, precision device, and manufacturing method of the precision device |
| JP2009255189A (en) * | 2008-04-14 | 2009-11-05 | Sodick Co Ltd | Tool changing system of machining center |
| JP2010199242A (en) * | 2009-02-24 | 2010-09-09 | Mitsuboshi Diamond Industrial Co Ltd | Method for manufacturing integrated thin-film solar cell |
| JP2010245255A (en) * | 2009-04-06 | 2010-10-28 | Shiraitekku:Kk | Film deposition scribing device for solar cell panel |
| WO2011001962A1 (en) * | 2009-06-29 | 2011-01-06 | 京セラ株式会社 | Method for manufacturing photoelectric conversion elements, device for manufacturing photoelectric conversion elements, and photoelectric conversion element |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315809A (en) * | 1999-03-04 | 2000-11-14 | Matsushita Electric Ind Co Ltd | Fabrication of integrated thin film solar cell and patterning system |
| JP2002033498A (en) * | 2000-07-17 | 2002-01-31 | Matsushita Electric Ind Co Ltd | Manufacturing method for integrated thin-film solar cell and patterning apparatus |
| KR100633488B1 (en) * | 2001-11-08 | 2006-10-13 | 샤프 가부시키가이샤 | Method and device for parting glass substrate, and liquid crystal panel manufacturing device |
| KR20050115793A (en) * | 2004-06-05 | 2005-12-08 | 주식회사 대흥케미칼 | Multi-cutting bite for machine tool |
| JP5308892B2 (en) * | 2009-04-01 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | Integrated thin film solar cell manufacturing equipment |
| TWI451587B (en) * | 2010-01-08 | 2014-09-01 | Mitsuboshi Diamond Ind Co Ltd | Groove machining tool for use with a thin-film solar cell |
| JP5369011B2 (en) * | 2010-01-27 | 2013-12-18 | 三星ダイヤモンド工業株式会社 | Grooving tool and method for grooving thin film solar cell using the same |
-
2012
- 2012-03-30 JP JP2012081865A patent/JP5804999B2/en not_active Expired - Fee Related
-
2013
- 2013-03-08 TW TW102108199A patent/TWI498295B/en active
- 2013-03-21 KR KR1020130030249A patent/KR101512705B1/en not_active IP Right Cessation
- 2013-03-28 CN CN201310105510.0A patent/CN103367535B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4083390A (en) * | 1972-09-22 | 1978-04-11 | R.E. Ingham & Co., Limited | Grooving of sheet material |
| JPH03161209A (en) * | 1989-11-17 | 1991-07-11 | Fujitsu Ltd | Working of taper hole and working device thereof |
| JP2004115356A (en) * | 2002-09-26 | 2004-04-15 | Honda Motor Co Ltd | Mechanical scribing apparatus |
| JP2007130737A (en) * | 2005-11-14 | 2007-05-31 | Honda Motor Co Ltd | Reamer, drill and machining method |
| JP2007245278A (en) * | 2006-03-15 | 2007-09-27 | Mitsubishi Materials Kobe Tools Corp | End mill |
| JP2009119543A (en) * | 2007-11-13 | 2009-06-04 | Toshiba Corp | Fine machining tool, manufacturing method of the fine machining tool, precision device, and manufacturing method of the precision device |
| JP2009255189A (en) * | 2008-04-14 | 2009-11-05 | Sodick Co Ltd | Tool changing system of machining center |
| JP2010199242A (en) * | 2009-02-24 | 2010-09-09 | Mitsuboshi Diamond Industrial Co Ltd | Method for manufacturing integrated thin-film solar cell |
| JP2010245255A (en) * | 2009-04-06 | 2010-10-28 | Shiraitekku:Kk | Film deposition scribing device for solar cell panel |
| WO2011001962A1 (en) * | 2009-06-29 | 2011-01-06 | 京セラ株式会社 | Method for manufacturing photoelectric conversion elements, device for manufacturing photoelectric conversion elements, and photoelectric conversion element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015195347A (en) * | 2014-03-28 | 2015-11-05 | 三星ダイヤモンド工業株式会社 | Groove processing tool and scribe apparatus with the groove processing tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103367535A (en) | 2013-10-23 |
| TW201339114A (en) | 2013-10-01 |
| TWI498295B (en) | 2015-09-01 |
| KR101512705B1 (en) | 2015-04-16 |
| CN103367535B (en) | 2016-05-25 |
| KR20130111328A (en) | 2013-10-10 |
| JP5804999B2 (en) | 2015-11-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI501415B (en) | A trench processing tool, a trench processing method and a cutting device using a thin film solar cell | |
| JP5369099B2 (en) | Thin-film solar cell scribing device | |
| TWI472050B (en) | Production of integrated thin film solar cells | |
| TW201101525A (en) | Method for manufacturing integrated thin-film solar cell | |
| WO2010103947A1 (en) | Grooving tool for thin film solar cell | |
| JP5357580B2 (en) | Grooving tool and method of grooving thin film solar cell using the same | |
| JP5804999B2 (en) | Groove machining tool, groove machining method and groove machining apparatus for thin-film solar cell using the same | |
| JP5369011B2 (en) | Grooving tool and method for grooving thin film solar cell using the same | |
| JP2020107795A (en) | Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same | |
| JP2020107800A (en) | Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same | |
| JP2020107799A (en) | Grooving tool, and thin film solar cell grooving method and grooving device using the same | |
| JP2020107796A (en) | Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same | |
| JP2020107797A (en) | Grooving tool, and thin film solar cell grooving method and grooving device using the same | |
| JP2020107798A (en) | Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same | |
| JP2015126205A (en) | Grooving tool and scribe device with grooving tool attached thereto | |
| JP2015192112A (en) | Groove processing tool and scribe apparatus with the groove processing tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140728 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150417 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150512 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150710 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150825 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150901 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5804999 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |