JP2013211441A5 - - Google Patents

Download PDF

Info

Publication number
JP2013211441A5
JP2013211441A5 JP2012081254A JP2012081254A JP2013211441A5 JP 2013211441 A5 JP2013211441 A5 JP 2013211441A5 JP 2012081254 A JP2012081254 A JP 2012081254A JP 2012081254 A JP2012081254 A JP 2012081254A JP 2013211441 A5 JP2013211441 A5 JP 2013211441A5
Authority
JP
Japan
Prior art keywords
metal film
base substrate
package
metal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012081254A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013211441A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012081254A priority Critical patent/JP2013211441A/ja
Priority claimed from JP2012081254A external-priority patent/JP2013211441A/ja
Publication of JP2013211441A publication Critical patent/JP2013211441A/ja
Publication of JP2013211441A5 publication Critical patent/JP2013211441A5/ja
Pending legal-status Critical Current

Links

JP2012081254A 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器 Pending JP2013211441A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012081254A JP2013211441A (ja) 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012081254A JP2013211441A (ja) 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器

Publications (2)

Publication Number Publication Date
JP2013211441A JP2013211441A (ja) 2013-10-10
JP2013211441A5 true JP2013211441A5 (th) 2015-05-14

Family

ID=49529026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012081254A Pending JP2013211441A (ja) 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器

Country Status (1)

Country Link
JP (1) JP2013211441A (th)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101856108B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856109B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856107B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856106B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
US10529646B2 (en) 2015-04-24 2020-01-07 Amosense Co., Ltd. Methods of manufacturing a ceramic substrate and ceramic substrates
KR102563421B1 (ko) * 2016-07-19 2023-08-07 주식회사 아모센스 세라믹 기판 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3694887B2 (ja) * 1999-07-15 2005-09-14 株式会社大真空 電子部品用パッケージ、およびその製造方法
JP2003293143A (ja) * 2002-04-04 2003-10-15 Murata Mfg Co Ltd パラジウム触媒洗浄剤とパラジウム触媒の洗浄方法、及び該洗浄剤を使用した電子部品のめっき方法、並びに電子部品
JP4012527B2 (ja) * 2004-07-14 2007-11-21 日本無線株式会社 電子部品の製造方法
JP2007318209A (ja) * 2006-05-23 2007-12-06 Daishinku Corp 表面実装型圧電振動デバイス、およびその製造方法
JP2009190080A (ja) * 2008-02-18 2009-08-27 Neomax Material:Kk 銅銀系ろう材および電子部品用パッケージの蓋用クラッド材
JP2010242117A (ja) * 2009-04-01 2010-10-28 Alps Electric Co Ltd 電気接点およびその製造方法

Similar Documents

Publication Publication Date Title
JP2013211441A5 (th)
TWI442325B (zh) Semiconductor memory device and manufacturing method thereof
JP2013197382A5 (th)
JP2013069808A5 (th)
JP2012129419A5 (th)
JP2013168419A5 (th)
JP2011249684A5 (th)
JP2012039090A5 (th)
JP6645832B2 (ja) 圧電振動デバイス、及び圧電振動デバイスと回路基板との接合構造
WO2014088966A3 (en) Bonding structure for a microelectronic assembly comprising a high melting point alloy formed by bonding two bond components each comprising a non-low melting point material layer covering a low melting point material layer and corresponding manufacturing method
JP2010245259A5 (th)
WO2015093300A1 (ja) 圧電振動デバイス
TW200638814A (en) Thermal enhanced low profile package structure and method for fabricating the same
WO2008149584A1 (ja) 電子部品装置およびその製造方法
JP2013105840A5 (th)
JP2008537333A5 (th)
JP2010251807A5 (th)
JP2014192386A5 (th)
JP2014500630A5 (th)
JP2013069807A5 (th)
JP2013038330A (ja) 半導体装置の製造方法及び半導体装置
JP2021057914A (ja) 水晶振動デバイス
JP2015139053A (ja) 圧電振動デバイス
JP2012124486A5 (th)
JP5839024B2 (ja) 圧電振動デバイス