JP2013211441A5 - - Google Patents
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- Publication number
- JP2013211441A5 JP2013211441A5 JP2012081254A JP2012081254A JP2013211441A5 JP 2013211441 A5 JP2013211441 A5 JP 2013211441A5 JP 2012081254 A JP2012081254 A JP 2012081254A JP 2012081254 A JP2012081254 A JP 2012081254A JP 2013211441 A5 JP2013211441 A5 JP 2013211441A5
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- base substrate
- package
- metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 58
- 239000002184 metal Substances 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 230000003197 catalytic Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012081254A JP2013211441A (ja) | 2012-03-30 | 2012-03-30 | パッケージ、パッケージの製造方法、電子デバイスおよび電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012081254A JP2013211441A (ja) | 2012-03-30 | 2012-03-30 | パッケージ、パッケージの製造方法、電子デバイスおよび電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013211441A JP2013211441A (ja) | 2013-10-10 |
JP2013211441A5 true JP2013211441A5 (th) | 2015-05-14 |
Family
ID=49529026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012081254A Pending JP2013211441A (ja) | 2012-03-30 | 2012-03-30 | パッケージ、パッケージの製造方法、電子デバイスおよび電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2013211441A (th) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101856108B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
KR101856109B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
KR101856107B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
KR101856106B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
US10529646B2 (en) | 2015-04-24 | 2020-01-07 | Amosense Co., Ltd. | Methods of manufacturing a ceramic substrate and ceramic substrates |
KR102563421B1 (ko) * | 2016-07-19 | 2023-08-07 | 주식회사 아모센스 | 세라믹 기판 제조 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3694887B2 (ja) * | 1999-07-15 | 2005-09-14 | 株式会社大真空 | 電子部品用パッケージ、およびその製造方法 |
JP2003293143A (ja) * | 2002-04-04 | 2003-10-15 | Murata Mfg Co Ltd | パラジウム触媒洗浄剤とパラジウム触媒の洗浄方法、及び該洗浄剤を使用した電子部品のめっき方法、並びに電子部品 |
JP4012527B2 (ja) * | 2004-07-14 | 2007-11-21 | 日本無線株式会社 | 電子部品の製造方法 |
JP2007318209A (ja) * | 2006-05-23 | 2007-12-06 | Daishinku Corp | 表面実装型圧電振動デバイス、およびその製造方法 |
JP2009190080A (ja) * | 2008-02-18 | 2009-08-27 | Neomax Material:Kk | 銅銀系ろう材および電子部品用パッケージの蓋用クラッド材 |
JP2010242117A (ja) * | 2009-04-01 | 2010-10-28 | Alps Electric Co Ltd | 電気接点およびその製造方法 |
-
2012
- 2012-03-30 JP JP2012081254A patent/JP2013211441A/ja active Pending
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