JP2013191802A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 160
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 174
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims description 43
- 238000005108 dry cleaning Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 58
- 239000007789 gas Substances 0.000 description 45
- 238000011835 investigation Methods 0.000 description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 239000001307 helium Substances 0.000 description 13
- 229910052734 helium Inorganic materials 0.000 description 13
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 238000001816 cooling Methods 0.000 description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 10
- 229920005591 polysilicon Polymers 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000010453 quartz Substances 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 238000002955 isolation Methods 0.000 description 6
- 230000001186 cumulative effect Effects 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- XUIMIQQOPSSXEZ-NJFSPNSNSA-N silicon-30 atom Chemical compound [30Si] XUIMIQQOPSSXEZ-NJFSPNSNSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
- H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】チャンバ2の中に設置され、第1の温度T1を有する静電チャック3の上に、第1の温度T1よりも低い第2の温度T2の雰囲気中に保持されていた基板Wを載置する工程と、静電チャック3に電圧を印加し、静電チャック3の上に基板Wを固定する工程と、基板Wを載置した後に、静電チャック3を第1の温度T1及び第2の温度T2よりも高い第3の温度T3に昇温する工程と、昇温する工程の後、基板Wを処理する工程とを含む半導体装置の製造方法による。
【選択図】図8
Description
本実施形態では、図1に示した半導体製造装置1を用いることにより、半導体装置としてMOSトランジスタを製造する。
Claims (9)
- チャンバの中に設置され、第1の温度を有する静電チャックの上に、前記第1の温度よりも低い第2の温度の雰囲気中に保持されていた基板を載置する工程と、
前記静電チャックに電圧を印加し、前記静電チャックの上に前記基板を固定する工程と、
前記基板を載置した後に、前記静電チャックを前記第1の温度及び前記第2の温度よりも高い第3の温度に昇温する工程と、
前記昇温する工程の後、前記基板を処理する工程と、
を含むことを特徴とする半導体装置の製造方法。 - 前記基板を複数用意して、複数の前記基板の各々に対して順に前記基板を載置する工程、前記基板を固定する工程、前記昇温する工程、及び前記処理する工程を行うことを特徴とする請求項1に記載の半導体装置の製造方法。
- 一の前記基板を処理する工程の後、次の前記基板を載置する工程の前に、
前記一の前記基板を前記チャンバの外へ搬出する工程と、
前記静電チャックの温度を前記第1の温度にする工程とを含むことを特徴とする請求項2に記載の半導体装置の製造方法。 - 前記一の前記基板の搬出後、次の前記基板を載置する工程の前に、前記チャンバ内をクリーニングすることを特徴とする請求項3に記載の半導体装置の製造方法。
- 前記クリーニングはドライクリーニングであることを特徴とする請求項4に記載の半導体装置の製造方法。
- 前記第1の温度と前記第2の温度との温度差が20℃以下であることを特徴とする請求項1乃至請求項5のいずれか1項に記載の半導体装置の製造方法。
- 前記基板を処理する工程は、前記基板をエッチングする工程であることを特徴とする請求項1乃至請求項6のいずれか1項に記載の半導体装置の製造方法。
- 前記基板を処理する工程は、CVD法又はスパッタリング法により前記基板上に成膜をする工程であることを特徴とする請求項1乃至請求項7のいずれか1項に記載の半導体装置の製造方法。
- 前記半導体基板を固定する工程において、前記静電チャックに前記電圧を常時印加することを特徴とする請求項1乃至請求項8のいずれか1項に記載の半導体装置の製造方法。
Priority Applications (2)
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JP2012058582A JP2013191802A (ja) | 2012-03-15 | 2012-03-15 | 半導体装置の製造方法 |
US13/747,046 US8835327B2 (en) | 2012-03-15 | 2013-01-22 | Method of manufacturing semiconductor device |
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JP2012058582A JP2013191802A (ja) | 2012-03-15 | 2012-03-15 | 半導体装置の製造方法 |
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JP2012058582A Pending JP2013191802A (ja) | 2012-03-15 | 2012-03-15 | 半導体装置の製造方法 |
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JP (1) | JP2013191802A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015041669A (ja) * | 2013-08-21 | 2015-03-02 | 住友電気工業株式会社 | 半導体装置の製造方法 |
KR20190133606A (ko) | 2018-05-23 | 2019-12-03 | 도쿄엘렉트론가부시키가이샤 | 서셉터의 드라이 클리닝 방법 및 기판 처리 장치 |
JP7453149B2 (ja) | 2018-02-23 | 2024-03-19 | ラム リサーチ コーポレーション | セラミックベースプレートを備えるマルチプレート静電チャック |
US11967517B2 (en) | 2019-02-12 | 2024-04-23 | Lam Research Corporation | Electrostatic chuck with ceramic monolithic body |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6094813B2 (ja) * | 2013-09-02 | 2017-03-15 | パナソニックIpマネジメント株式会社 | プラズマ処理装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11111829A (ja) * | 1997-10-06 | 1999-04-23 | Ulvac Corp | 静電吸着ホットプレート、真空処理装置、及び真空処理方法 |
JP2000012664A (ja) * | 1998-06-18 | 2000-01-14 | Ngk Insulators Ltd | 静電チャックのパーティクル発生低減方法及び半導体製造装置 |
JP2000021964A (ja) * | 1998-07-06 | 2000-01-21 | Ngk Insulators Ltd | 静電チャックのパーティクル発生低減方法および半導体製造装置 |
JP2002134599A (ja) * | 2000-10-24 | 2002-05-10 | Ngk Insulators Ltd | 静電吸着装置 |
JP2008277746A (ja) * | 2007-03-30 | 2008-11-13 | Hitachi High-Technologies Corp | プラズマ処理装置及びプラズマ処理方法 |
JP2010245127A (ja) * | 2009-04-01 | 2010-10-28 | Tokyo Electron Ltd | 基板交換方法及び基板処理装置 |
Family Cites Families (6)
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JPH05304196A (ja) | 1992-04-27 | 1993-11-16 | Mitsubishi Electric Corp | ウエハ搬送装置 |
JP2000260855A (ja) | 1999-03-10 | 2000-09-22 | Mitsubishi Electric Corp | ウェハ処理装置 |
US6236555B1 (en) * | 1999-04-19 | 2001-05-22 | Applied Materials, Inc. | Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle |
US6589611B1 (en) * | 2002-08-22 | 2003-07-08 | Micron Technology, Inc. | Deposition and chamber treatment methods |
JP2005038947A (ja) | 2003-07-16 | 2005-02-10 | Seiko Epson Corp | 成膜装置、成膜方法および半導体装置の製造方法 |
US20100014208A1 (en) * | 2008-07-10 | 2010-01-21 | Canon Anleva Corporation | Substrate holder |
-
2012
- 2012-03-15 JP JP2012058582A patent/JP2013191802A/ja active Pending
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2013
- 2013-01-22 US US13/747,046 patent/US8835327B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11111829A (ja) * | 1997-10-06 | 1999-04-23 | Ulvac Corp | 静電吸着ホットプレート、真空処理装置、及び真空処理方法 |
JP2000012664A (ja) * | 1998-06-18 | 2000-01-14 | Ngk Insulators Ltd | 静電チャックのパーティクル発生低減方法及び半導体製造装置 |
JP2000021964A (ja) * | 1998-07-06 | 2000-01-21 | Ngk Insulators Ltd | 静電チャックのパーティクル発生低減方法および半導体製造装置 |
JP2002134599A (ja) * | 2000-10-24 | 2002-05-10 | Ngk Insulators Ltd | 静電吸着装置 |
JP2008277746A (ja) * | 2007-03-30 | 2008-11-13 | Hitachi High-Technologies Corp | プラズマ処理装置及びプラズマ処理方法 |
JP2010245127A (ja) * | 2009-04-01 | 2010-10-28 | Tokyo Electron Ltd | 基板交換方法及び基板処理装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015041669A (ja) * | 2013-08-21 | 2015-03-02 | 住友電気工業株式会社 | 半導体装置の製造方法 |
JP7453149B2 (ja) | 2018-02-23 | 2024-03-19 | ラム リサーチ コーポレーション | セラミックベースプレートを備えるマルチプレート静電チャック |
KR20190133606A (ko) | 2018-05-23 | 2019-12-03 | 도쿄엘렉트론가부시키가이샤 | 서셉터의 드라이 클리닝 방법 및 기판 처리 장치 |
US11479852B2 (en) | 2018-05-23 | 2022-10-25 | Tokyo Electron Limited | Method for dry cleaning a susceptor and substrate processing apparatus |
US11967517B2 (en) | 2019-02-12 | 2024-04-23 | Lam Research Corporation | Electrostatic chuck with ceramic monolithic body |
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US8835327B2 (en) | 2014-09-16 |
US20130244405A1 (en) | 2013-09-19 |
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