JP2013181824A - Electrical characteristic measurement method, and contact probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical characteristic measurement method which does not apply excessive pressure to an object to be measured by removing a foreign matter or the like on the object to be measured with an inexpensive and easy method, and a contact probe used for the same.SOLUTION: An electrical characteristic measurement method includes a step for applying a pad to a first tip part of a tip of a first probe and a second tip part of a tip of a second probe, a step for forming a cleaning part on the pad by applying press deformation to a first curved part of the first probe and a second curved part of the second probe and making the first tip part and the second tip part slide on the pad while approaching each other, a process for further applying press deformation to the first curved part and the second curved part to bring a first contact part formed on the first probe and a second contact part formed on the second probe into surface contact with the cleaning part, a step for stopping the sliding of the first tip part and the second tip part while maintaining the surface contact, and a step for measuring a predetermined electrical characteristic while maintaining the surface contact.

Description

  The present invention relates to a method for measuring electrical characteristics used in, for example, a semiconductor chip testing process, and a contact probe used for the measurement.

  When measuring electrical characteristics of a semiconductor chip or the like, a pad provided on the surface of the semiconductor chip and an external measuring device are electrically connected using a contact probe. Patent Document 1 discloses a contact probe that includes a coiled spring and has a needle-like tip that moves in a uniaxial direction.

  Patent Documents 2, 3, and 4 disclose a contact probe having a deformed tip shape for the purpose of removing a natural oxide film or foreign matter on the pad. Patent Document 5 discloses a contact probe with a deformed tip shape for the purpose of preventing damage to the object to be measured and positional deviation from the object to be measured.

Japanese Patent Laid-Open No. 7-244072 JP 2009-204530 A Japanese Patent Laid-Open No. 2005-9904 JP 2009-276145 A JP-A-6-174744

  Since the contact probe disclosed in Patent Document 1 has a coiled spring and the like, the number of parts is large, and there are problems in cost reduction and simplification of the manufacturing process. Further, when the tip formed in the needle shape is applied to the object to be measured, an excessive pressure is applied to the object to be measured, and the object to be measured may be damaged. In addition, there is a problem that the contact resistance between the object to be measured and the contact probe increases due to a natural oxide film or foreign matter on the object to be measured.

  The contact probes disclosed in Patent Documents 2 and 3 have problems in reducing the cost and facilitating the manufacturing process because the tip shape is complicated. In the technique disclosed in Patent Document 4, the drive control of the contact probe when the contact probe is brought into contact with the object to be measured is complicated, and stable contact between the contact probe and the object to be measured is difficult. Further, since the removed foreign matters remain on the measured object side, the measured object could not be cleaned.

  In the technique disclosed in Patent Document 5, the drive control of the contact probe when the contact probe is brought into contact with the object to be measured is complicated, the tip shape is complicated, and the cost is reduced and the manufacturing process is facilitated. There was a problem.

  The present invention has been made to solve the above-described problems, and removes foreign matters and the like on an object to be measured without applying excessive pressure to the object to be measured by a low-cost and easy method. It is an object of the present invention to provide a method for measuring electrical characteristics capable of measuring the temperature, and a contact probe used therefor.

  In the electrical characteristic measurement method according to the invention of the present application, the base portion to which the first probe and the second probe are fixed is moved in the direction of the pad to be measured, the first tip portion of the tip of the first probe, A step of applying a second tip portion of the tip of the second probe to the pad; and pressing the base portion toward the pad in a state where the first tip portion and the second tip portion are in contact with the pad, The first bending portion formed on the first probe and the second bending portion formed on the second probe are pressed and deformed, and the first tip portion and the second tip portion slide on the pad while approaching each other. A step of removing a natural oxide film or foreign matter on the pad to form a clean portion on the pad, and pressing the base portion in the direction of the pad so that the first curved portion and the second curved portion The flat surface formed on the first probe with respect to the clean part A step of bringing the first contact portion into contact with the flat second contact portion formed on the second probe, and a slide for stopping the sliding of the first tip portion and the second tip portion while maintaining the surface contact. And a step of measuring predetermined electrical characteristics while maintaining the surface contact after the slide stopping step.

  Another method for measuring electrical characteristics according to the present invention includes a step of moving a base portion to which a probe is fixed in the direction of a pad to be measured, and applying a tip of the tip of the probe to the pad, and the tip The base part is pressed in the direction of the pad in a state where it touches the pad, the curved part formed on the probe is pressed and deformed, and the tip part slides on the pad, so that A step of forming a clean portion on the pad by removing the oxide film or foreign matter, and pressing the base portion in the direction of the pad to further press and deform the curved portion, and a flat surface formed on the probe with respect to the clean portion A step of bringing the contact portion into surface contact, a slide stopping step of stopping the sliding of the tip portion by applying a force in the direction opposite to the slide direction to the tip portion while maintaining the surface contact, and the slide stop After the process , Characterized by comprising a step of measuring predetermined electrical characteristics while maintaining said surface contact, the.

  Another method for measuring electrical characteristics according to the present invention includes a step of moving a base portion to which a probe is fixed in the direction of a pad to be measured, and applying a tip of the tip of the probe to the pad, and the tip The base part is pressed in the direction of the pad in a state where it touches the pad, the curved part formed on the probe is pressed and deformed, and the tip part slides on the pad, so that A step of forming a clean portion on the pad by removing the oxide film or foreign matter, and pressing the base portion in the direction of the pad to further press and deform the curved portion, and a flat surface formed on the probe with respect to the clean portion A surface contact with the contact portion, and when the amount of pressing deformation of the bending portion detected by a strain gauge or a piezoelectric element attached to the bending portion reaches a predetermined value, the surface contact is maintained and the substrate is maintained. To fix the position of the A sliding stop step for stopping the sliding of the tip portion, after the slide stopping step, characterized by comprising a step of measuring predetermined electrical characteristics while maintaining surface contact, the.

  The contact probe according to the invention of the present application has a base portion, and is fixed to the base portion, and has, in order from the base portion side, a first curved portion, a flat first contact portion, and a pointed first tip portion. The first probe is fixed to the base portion so as to face the first probe, and the second curved portion, the flat second contact portion, and the pointed second tip portion are sequentially arranged from the base portion side. A second probe having a first tip portion and a stop means for stopping the movement of the second tip portion, and the first curved portion and the second curved portion are pressed in the direction of the measurement target. Thus, the first tip portion and the second tip portion are pressed and deformed so as to reduce the distance between them.

  Another contact probe according to the invention of the present application is a base part, a probe fixed to the base part, and having a curved part, a flat contact part, and a tip part in order from the base part side, and a pressure of the curved part A fixing rod formed by processing a part of the probe so as to stop the movement of the tip when the amount of deformation exceeds a predetermined value, and a fixing portion that stops the movement of the tip by hitting the fixing rod And.

  According to the present invention, it is possible to remove the foreign matter on the object to be measured without applying excessive pressure to the object to be measured by an easy and low-cost method, and to measure the electrical characteristics of the non-measured object.

It is a perspective view of the contact probe which concerns on Embodiment 1 of this invention. It is a front view of the contact probe which concerns on Embodiment 1 of this invention. It is the front view which expanded the 1st tip part, the 2nd tip part, and those neighborhood. It is a front view which shows the first process of the electrical property measuring method which concerns on Embodiment 1 of this invention. It is a front view which shows that a 1st front-end | tip part and a 2nd front-end | tip part slide on a pad by the press deformation | transformation of a 1st bending part and a 2nd bending part. It is a front view which shows having formed the cleaning part on the pad surface. It is a front view which shows having stopped the slide of the 1st tip part and the 2nd tip part, making the 1st contact part and the 2nd contact part surface-contact with a pad. It is a front view of the contact probe after a slide stop process. It is a top view of the 1st tip part after the slide stop, the 2nd tip part, and those vicinity. It is an expanded view of the contact probe which concerns on Embodiment 1 of this invention. It is a side view which shows having formed the cut | incision, the front-end | tip part, and the stopper. It is a side view which shows having formed the 1st bending part, the 2nd bending part, and the axial part. It is a perspective view which shows having formed the thin part in the curved part. It is a perspective view which shows having formed the through-hole in the curved part. It is a perspective view of the contact probe which concerns on Embodiment 2 of this invention. It is a top view which shows the state which the slide of the 1st front-end | tip part and the 2nd front-end | tip part stopped. It is an expanded view of the contact probe which concerns on Embodiment 2 of this invention. It is a perspective view of the contact probe which concerns on Embodiment 3 of this invention. It is a top view which shows the state which the slide of the 1st front-end | tip part and the 2nd front-end | tip part stopped. It is an expanded view of the contact probe which concerns on Embodiment 3 of this invention. It is a perspective view of the contact probe etc. which concern on Embodiment 4 of this invention. It is a perspective view of the contact probe etc. which concern on Embodiment 5 of this invention. It is a perspective view of the contact probe which concerns on Embodiment 6 of this invention. It is a side view of the contact probe which concerns on Embodiment 6 of this invention. It is a front view which shows having applied the front-end | tip part to the pad. It is a front view which shows having deform | transformed the curved part. It is a front view which shows that the stopper was applied to the fixing rod. It is a top view which shows that the stopper contacted | fixed the fixing rod. It is an expanded view of the contact probe which concerns on Embodiment 6 of this invention. It is a perspective view of the contact probe which concerns on Embodiment 7 of this invention. It is a perspective view which shows the recessed part formed in the contact part. It is a front view which shows that the slide of the front-end | tip part stopped in the state in which the contact part contacted the pad. It is a top view of the recessed part in FIG. 32, and its vicinity. It is sectional drawing which shows that a fixing rod surface-contacted the bottom of the recessed part. It is sectional drawing which shows the modification of the contact probe shown in Embodiment 7 of this invention. It is a perspective view of the contact probe which concerns on Embodiment 8 of this invention. It is a perspective view which shows the modification of the contact probe which concerns on Embodiment 8 of this invention. It is a perspective view of the contact probe etc. which concern on Embodiment 9 of this invention.

Embodiment 1 FIG.
FIG. 1 is a perspective view of a contact probe according to Embodiment 1 of the present invention. The contact probe 10 has a base portion 12. A mounting portion 14 is fixed to the base portion 12. The attachment portion 14 is a portion for attaching the contact probe 10 to an external device. A first probe 16 and a second probe 18 are fixed to the base portion 12.

  The first probe 16 has a shaft portion 16 a fixed to the base portion 12. A shaft portion 16b is connected to the shaft portion 16a. The shaft portion 16a and the shaft portion 16b are each formed in a flat plate shape. A first bending portion 16c is connected to the shaft portion 16b. The first bending portion 16c is curved so as to draw an arc. A cut 16d is formed in a part of the first bending portion 16c. The cut 16d is formed to extend in the width direction of the first curved portion 16c.

  A first contact portion 16e is connected to the first curved portion 16c. The first contact portion 16e is formed in a flat plate shape. The first contact portion 16e is in surface contact with a pad provided on the measurement target semiconductor chip. A first stopper 16f and a first tip portion 16g are connected to the first contact portion 16e. The first stopper 16f is formed to extend substantially perpendicular to the surface of the first contact portion 16e. The first tip 16g is formed so that the tip is sharp. As described above, the first probe 16 includes the shaft portions 16a and 16b, the first curved portion 16c, the flat first contact portion 16e, and the pointed first tip portion 16g in this order from the base portion 12 side. ing.

  The second probe 18 is fixed to the base body 12 so as to face the first probe 16. The second probe 18 has a shaft portion 18 a fixed to the base portion 12. A shaft portion 18b is connected to the shaft portion 18a. The shaft portion 18a and the shaft portion 18b are each formed in a flat plate shape. A second bending portion 18c is connected to the shaft portion 18b. The second bending portion 18c is curved so as to draw an arc. A cut 18d is formed in a part of the second bending portion 18c. The cut 18d is formed so as to extend in the width direction of the second bending portion 18c.

  A second contact portion 18e is connected to the second curved portion 18c. The second contact portion 18e is formed in a flat plate shape. The second contact portion 18e is in surface contact with a pad provided on the semiconductor chip to be measured. A second stopper 18f and a second tip 18g are connected to the second contact portion 18e. The second stopper 18f is formed to extend substantially perpendicular to the surface of the second contact portion 18e. The second tip 18g is formed so that the tip is sharp. Thus, the second probe 18 has the shaft portions 18a and 18b, the second curved portion 18c, the flat second contact portion 18e, and the pointed second tip portion 18g in this order from the base portion 12 side. ing.

  FIG. 2 is a front view of the contact probe according to Embodiment 1 of the present invention. The Z-axis coordinate of the tip of the first tip portion 16g is equal to the Z-axis coordinate of the tip of the second tip portion 18g. FIG. 3 is an enlarged front view of the first tip portion, the second tip portion, and the vicinity thereof. The surface of the first tip portion 16g in the negative Z-axis direction is a first tip surface 16g ′. The surface of the first contact portion 16e in the negative Z-axis direction is a first contact surface 16e ′. The first tip surface 16g ′ is inclined with respect to the first contact surface 16e. The first tip surface 16g ′ forms an angle θ1 with the X axis. The first contact surface 16e ′ forms an angle θ2 with the X axis. The angle θ2 is larger than the angle θ1.

  The surface of the second tip portion 18g in the negative Z-axis direction is a second tip surface 18g ′. The surface of the second contact portion 18e in the negative Z-axis direction is a second contact surface 18e ′. The second tip surface 18g ′ is inclined with respect to the second contact surface 18e ′. The second tip surface 18g ′ forms an angle θ1 with the X axis. The second contact surface 18e ′ forms an angle θ2 with the X axis. The angle θ2 is larger than the angle θ1.

  The areas of the first contact surface 16e ′ and the second contact surface 18e ′ are determined so that a predetermined current can flow through the contact probe 10 within the dimensions of the pads of the semiconductor chip that is the object to be measured. When the pad size is increased to about 15 mm × 15 mm and a current of about several hundred amperes is passed as in the power semiconductor chip, the first contact surface 16e ′ and the second contact surface 18e ′ are each about 5 mm × 3 mm, for example. In this case, the total length (length in the Z-axis direction) of the contact probe 10 is about 35 mm.

  A method for measuring electrical characteristics using the contact probe 10 will be described. FIG. 4 is a front view showing the first step of the electrical characteristic measuring method according to Embodiment 1 of the present invention. The measurement target is the semiconductor chip 100. Pads 102 are formed on the surface of the semiconductor chip 100.

  A probe moving means 50 that is movable in the Z-axis direction is attached to the attachment portion 14. In addition, an electrical connection means 52 is connected to the attachment portion 14. The electrical connection means 52 is, for example, an electrode or a cable. The electrical connection means 52 and the attachment portion 14 are connected by screws, caulking, or the like. It is desirable to ensure electrical connection by using solder or welding in addition to screws and caulking.

  As shown in FIG. 4, the base 12 is moved in the Z-axis negative direction (the direction of the pad 102) by the probe moving means 50, and the first tip portion 16 g and the second tip portion 18 g are applied to the pad 102.

  Next, the base portion 12 is moved in the direction of the pad 102 in a state where the first tip portion 16 g and the second tip portion 18 g are in contact with the pad 102. Then, the first bending portion 16c and the second bending portion 18c are pressed in the direction of the pad 102 and are deformed by pressing. In particular, since the rigidity is reduced in the notches 16d and 18d and in the vicinity thereof, the pressure deformation is increased. Due to this pressing deformation, the distance between the first tip portion 16g and the second tip portion 18g is reduced. That is, the first tip portion 16g and the second tip portion 18g slide on the pad 102 while approaching each other due to this pressing deformation.

  FIG. 5 is a front view showing that the first tip portion and the second tip portion slide on the pad due to the press deformation of the first bending portion and the second bending portion. The natural oxide film 104 and the foreign matter 106 are present on the surface of the pad 102. The surface of the pad 102 can be cleaned by removing these by sliding the first tip portion 16g and the second tip portion 18g. That is, since the first tip portion 16g and the second tip portion 18g are pointed, the natural oxide film 104 and the foreign matter 106 on the pad 102 can be removed by sliding on the pad 102. More specifically, the natural oxide film 104 is scraped off and the foreign matter 106 is scooped by sliding the first tip portion 16g and the second tip portion 18g.

  Further, the base portion 12 is pressed in the direction of the pad 102 to advance the pressure deformation of the first bending portion 16c and the second bending portion 18c. As a result, the first tip portion 16g and the second tip portion 18g are slid to form a clean portion on the surface of the pad 102. FIG. 6 is a front view showing that a cleaning portion is formed on the pad surface. On the surface of the pad 102, a clean portion 102a from which the natural oxide film 104 and the foreign matter 106 have been removed is formed.

  Next, the first bending portion 16c and the second bending portion 18c are further pressed and deformed to bring the first contact portion 16e and the second contact portion 18e into surface contact with the cleaning portion 102a. Next, sliding of the first tip portion 16g and the second tip portion 18g is stopped while bringing the first contact portion 16e and the second contact portion 18e into surface contact with the pad 102. This process is called a slide stop process. The slide stopping process will be described with reference to FIG.

  FIG. 7 is a front view showing that the sliding of the first tip portion and the second tip portion is stopped while the first contact portion and the second contact portion are brought into surface contact with the pad. In the slide stopping step, the first tip portion 16g is applied to the second stopper 18f, and the second tip portion 18g is applied to the first stopper 16f to stop the sliding of the first tip portion 16g and the second tip portion 18g. The timing at which the sliding of the first tip portion 16g and the second tip portion 18g is stopped may be simultaneous with the surface contact of the first contact portion 16e and the second contact portion 18e with the pad 102 or after the surface contact. Good.

  FIG. 8 is a front view of the contact probe after the slide stopping step. FIG. 9 is a plan view of the first tip portion, the second tip portion, and the vicinity thereof after the slide stops. After the slide stopping process, the first contact portion 16e and the second contact portion 18e are pressed against the pad 102 while being in surface contact by the elastic force of the first bending portion 16c and the second bending portion 18c. After the slide stopping step, the position of the base portion 12 in the Z direction may be fixed by the probe moving means 50, or the Z-axis negative direction force may be continuously applied to the base portion 12 by the probe moving means 50. .

  Next, predetermined electrical characteristics are measured while maintaining surface contact of the first contact portion 16e and the second contact portion 18e with the pad 102. The measurement of electrical characteristics is performed by an external device applying a voltage or applying a current to the pad 102 via the electrical connection means 52. After the electrical characteristics are measured, the contact probe 10 is retracted by moving the probe moving means 50 in the positive direction of the Z axis. The electrical characteristic measurement method according to Embodiment 1 of the present invention includes the above-described steps.

  By the way, the contact probe 10 can be easily manufactured from a single plate made entirely of the same material. FIG. 10 is a development view of the contact probe according to Embodiment 1 of the present invention. The contact probe is formed from a single metal plate. The metal plate is preferably beryllium steel having high conductivity and high spring property, but is not particularly limited thereto.

  The contact probe 10 is manufactured by the following process. First, the cuts 16d and 18d, the first tip portion 16g, and the second tip portion 18g are formed. The tip of the first tip 16g and the tip of the second tip 18g are processed to be sharp. These are formed by cutting or the like. Further, the first stopper 16f and the second stopper 18f are formed by bending. FIG. 11 is a side view showing that a cut, a tip, and a stopper are formed.

  Next, the first bending portion 16c, the second bending portion 18c, and the shaft portions 16b and 18b are formed. The first bending portion 16c and the second bending portion 18c are formed in a substantially arc shape by bending. The shaft portions 16b and 18b are bent. FIG. 12 is a side view showing that the first bending portion, the second bending portion, and the shaft portion are formed.

  Next, the attachment portion 14 is formed by bending. Then, the boundary between the first probe 16 and the base portion 12 and the boundary between the second probe 18 and the base portion 12 are bent. As a result, the first probe 16 and the second probe 18 are made to face each other. Thus, the contact probe 10 shown in FIG. 1 is completed.

  In the electrical characteristic measurement method according to Embodiment 1 of the present invention, the clean portion 102a is formed on the surface of the pad 102 by sliding the first tip portion 16g and the second tip portion 18g, and then the first contact portion 16e and the second contact portion 16g. The contact part 18e is brought into surface contact with the cleaning part 102a, and the electrical characteristics of the semiconductor chip 100 are measured. At the time of measurement, the first tip portion 16g and the second tip portion 18g are separated from the pad 102. Therefore, for example, damage to the pad 102 and damage to the semiconductor chip 100 can be suppressed as compared with the case where the electrical characteristics are measured while pushing the needle-like contact probe against the pad and applying excessive pressure to the pad. Therefore, the yield of the semiconductor chip 100 (object to be measured) can be increased.

  In addition, the first tip portion 16g and the second tip portion 18g of the contact probe 10 according to Embodiment 1 of the present invention are formed with a pointed tip. Therefore, the natural oxide and foreign matter on the surface of the pad 102 can be removed by sliding the first tip portion 16g and the second tip portion 18g. And since the 1st contact part 16e and the 2nd contact part 18e are surface-contacted to the clean part 102a which removed the natural oxide and the foreign material, the reliable measurement which reduced contact resistance can be performed.

  In the electrical characteristic measuring method according to Embodiment 1 of the present invention, the first bending portion 16c and the second bending portion 18c are pressed and deformed only by moving the contact probe 10 in one axial direction (Z-axis negative direction). The first tip portion 16g and the second tip portion 18g can be slid. That is, when the contact probe 10 is driven in the vertical direction (Z-axis direction), the first tip portion 16g, the second tip portion 18g, the first contact portion 16e, and the second contact portion 18e are driven in the lateral direction (X-axis direction). Is obtained.

  In addition, since the slide of the first tip portion 16g and the second tip portion 18g is stopped by the second stopper 18f and the first stopper 16f, the slide stop position can be grasped in advance. Therefore, the first contact portion 16e and the second contact portion 18e can be brought into surface contact with a desired position of the pad 102.

  The contact probe 10 can be manufactured simply by subjecting a single metal plate to a process that can be easily completed in a short time, such as punching, cutting, and bending. Therefore, the contact probe 10 can be manufactured at a low cost and a high yield.

  By the way, if the pressure exerted on the pad 102 by the first contact portion 16e and the second contact portion 18e is too low, contact failure occurs. On the other hand, if the pressure exerted on the pad 102 by the first contact portion 16e and the second contact portion 18e is too high, the chip is damaged. Therefore, the pressure exerted on the pad 102 by the first contact portion 16e and the second contact portion 18e needs to be an appropriate value.

  Therefore, in the first embodiment of the present invention, the pressure applied to the semiconductor chip 100 is reduced by making the first bending portion 16c and the second bending portion 18c easy to be pressed and deformed by the notches 16d and 18d. Means other than the notches 16d and 18d may be used to adjust the pressure. For example, you may form a thin part in the 1st curved part 16c and the 2nd curved part 18c. FIG. 13 is a perspective view showing that a thin portion is formed in the curved portion. The thin portion 150 is formed in the first curved portion 16c. Although not shown, a thin portion is also formed in the second curved portion. If the thin portion is formed in this way, the rigidity of this portion is reduced and the pressure deformation can be preferentially advanced.

  Moreover, you may form a through-hole in the 1st bending part 16c and the 2nd bending part 18c in order to adjust the said pressure. FIG. 14 is a perspective view showing that a through hole is formed in the curved portion. The through hole 152 is formed in the thin portion 150. The pressure can be adjusted by adjusting the shape and number of the through holes 152. Note that only the through hole 152 may be formed without forming the thin portion 150.

  The notches 16c and 18c, the thin portion 150, and the through hole 152 may be appropriately combined to adjust the rigidity of the first bending portion 16c and the second bending portion 18c, and the pressure on the pad may be adjusted. A plurality of the cuts 16c and 18c, the thin portion 150, and the through hole 152 may be formed. Further, the cuts 16c and 18c, the thin portion 150, and the through hole 152 are not limited to the outside of the first curved portion 16c and the second curved portion 18c, and may be formed on the inside or on both the outside and inside. Also good.

  Various modifications can be made to the electrical characteristic measurement method, the contact probe manufacturing method, and the contact probe according to the first embodiment of the present invention. For example, the dimensions of the contact probe 10 are not limited to the above values. Alternatively, the electrical characteristics may be measured by applying a plurality of contact probes 10 to one pad 102. The positions of the first stopper 16f and the second stopper 18f are in contact with the first tip 16g and the second tip 18g when the distance between the first tip 16g and the second tip 18g is reduced to a predetermined value. If it forms, it will not specifically limit. The stopper may be formed only on one of the first probe 16 and the second probe 18. One or two tip portions are formed on the first probe 16 and the second probe 18, but the number is arbitrary. Further, the shapes of the first tip portion 16g and the second tip portion 18g are not particularly limited as long as the natural oxide film and the foreign matter can be removed, and may have a file-like surface, for example.

Embodiment 2. FIG.
The electrical characteristic measurement method, the contact probe manufacturing method, and the contact probe according to the second embodiment of the present invention will be described with a focus on differences from the first embodiment. FIG. 15 is a perspective view of a contact probe according to Embodiment 2 of the present invention. The first probe 16 and the second probe 18 face each other while being shifted in the width direction (Y direction). The shaft portions 16 h and 16 i of the first probe 16 are formed wider than the shaft portions 18 a and 18 b of the second probe 18. The first tip 16k is located in the negative Y-axis direction with respect to the first stopper 16j. The second tip 18k is located in the positive Y-axis direction with respect to the second stopper 18j.

  FIG. 16 is a plan view showing a state in which the sliding of the first tip portion and the second tip portion is stopped. The first tip portion 16k hits the second stopper 18j, and the second tip portion 18k hits the first stopper 16j. The first contact portion 16e is shifted by a distance Y1 in the width direction with respect to the second contact portion 18e. FIG. 17 is a developed view of the contact probe according to Embodiment 2 of the present invention. The contact probe according to the second embodiment of the present invention can also be easily manufactured by bending a single metal plate as in the first embodiment.

  Since the first contact portion 16e and the second contact portion 18e are shifted by the distance Y1 in the width direction, the distance between the first contact portion 16e and the second contact portion 18e can be increased. Therefore, heat dissipation of the first contact portion 16e and the second contact portion 18e can be promoted.

Embodiment 3 FIG.
The electrical characteristic measurement method, the contact probe manufacturing method, and the contact probe according to the third embodiment of the present invention will be described with a focus on differences from the first embodiment. FIG. 18 is a perspective view of a contact probe according to Embodiment 3 of the present invention. The first probe 16 and the second probe 18 of the contact probe 200 face each other while being shifted in the width direction (Y direction). The first probe 16 is formed to be folded back on the front side of the base body portion 12, and the second probe 18 is formed to be folded back on the back side of the base body portion 12.

  The first contact portion 16o of the first probe 16 is formed wider than the shaft portion 16b and the first curved portion 16c. The stopper 16p is formed in the positive Y-axis direction with respect to the first tip portion 16q.

  The second contact portion 18o of the second probe 18 is formed wider than the shaft portion 18m and the second curved portion 18n. The second tip portion 18q is connected to the second contact portion 18o, and no stopper is formed.

  FIG. 19 is a plan view showing a state in which the sliding of the first tip portion and the second tip portion is stopped. The second tip 18q is in contact with the stopper 16p. The first contact portion 16o is shifted by a distance Y2 in the width direction with respect to the second contact portion 18o.

  FIG. 20 is a development view of the contact probe according to Embodiment 3 of the present invention. The contact probe according to the third embodiment of the present invention can also be easily manufactured by bending a single metal plate as in the first embodiment. A notch for folding the first probe 16 to the front side of the base portion 12 is formed on the front side of the metal plate, and a notch for folding the second probe 18 to the back side of the base portion 12 is formed on the back side of the metal plate.

  According to the contact probe 200 according to the third embodiment of the present invention, the width of the second contact portion 18o of the first contact portion 16o is larger than the width of the shaft portion or the curved portion, so that the contact area with the pad is increased. can do. When the contact area is increased, heat generation can be suppressed by reducing the current density when a large current is passed through the contact probe 200. Further, since the first contact portion 16o and the second contact portion 18o are shifted by the distance Y2 in the width direction, heat dissipation of the first contact portion 16o and the second contact portion 18o can be promoted.

Embodiment 4 FIG.
The electrical characteristic measurement method and contact probe according to the fourth embodiment of the present invention will be described focusing on the differences from the first embodiment. FIG. 21 is a perspective view of a contact probe and the like according to the fourth embodiment of the present invention. A first through hole 152a and a second through hole 152b are formed in the first bending portion 16c. A strain gauge 250 is attached to a location between the first through hole 152a and the second through hole 152b in the first bending portion 16c. The strain gauge 250 is attached to detect the amount of pressing deformation of the first bending portion 16c.

  A fixing means 252 is connected to the strain gauge 250. The fixing means 252 fixes the position of the base portion 12 when the pressing deformation amount of the first bending portion 16c detected by the strain gauge 250 reaches a predetermined value. In the slide stopping step, when the amount of pressing deformation of the first bending portion 16c detected by the strain gauge 250 reaches a predetermined value, the fixing means 252 controls the probe moving means 50 to fix the position of the base portion 12.

  By the way, when the slide of the first tip portion 16g and the second tip portion 18g is stopped by the first stopper 16f and the second stopper 18f, the probe moving means 50 applies a force in the negative direction of the Z axis to the base portion 12 even after the slide stops. May continue to add. In this case, the pressure deformation of the first bending portion 16c and the second bending portion 18c proceeds excessively, and an excessive pressure is applied to the chip.

  However, this problem can be solved by the electrical characteristic measurement method according to Embodiment 4 of the present invention. That is, since the position of the base portion 12 is fixed by the fixing means 252 when the amount of pressing deformation of the first bending portion 16c reaches a predetermined value, it is prevented that excessive pressure is applied to the chip due to excessive pressing deformation. it can.

  In the contact probe according to Embodiment 4 of the present invention, the strain gauge 250 is provided between the first through hole 152a and the second through hole 152b, but the strain gauge 250 can detect the press deformation of the first bending portion 16c. It can be installed anywhere. For example, a thin thickness part may be formed in the 1st curved part 16c, and a strain gauge may be attached there. Further, a portion that is easily pressed and deformed appropriately may be formed in the first bending portion 16c, and a strain gauge may be provided there.

  The strain gauge 250 may be formed on at least one of the first bending portion 16c and the second bending portion 18c. You may comprise so that an output signal may be synthesize | combined using a some strain gauge. Further, the first stopper 16f and the second stopper 18f may not be formed. A device other than a strain gauge may be used as long as it can detect the pressing deformation amount of the first bending portion.

Embodiment 5 FIG.
The electrical characteristic measurement method and contact probe according to the fifth embodiment of the present invention will be described focusing on the differences from the fourth embodiment. FIG. 22 is a perspective view of a contact probe and the like according to the fifth embodiment of the present invention. The piezoelectric element 300 is attached to a location between the first through hole 152a and the second through hole 152b in the first bending portion 16c.

  A fixing means 302 is connected to the piezoelectric element 300. The fixing means 302 fixes the position of the base portion 12 when the pressing deformation amount of the first bending portion 16c detected by the piezoelectric element 300 reaches a predetermined value. In the slide stopping process, when the amount of pressing deformation of the first bending portion 16c detected by the piezoelectric element 300 reaches a predetermined value, the fixing means 302 controls the probe moving means 50 to fix the position of the base portion 12. As described above, the piezoelectric element 300 and the fixing means 302 can be used to obtain the same effect as that of the electrical characteristic measurement method of the fourth embodiment.

  Further, in the electrical characteristic measurement method according to the fifth embodiment of the present invention, when the first contact portion 16e and the second contact portion 18e are not in contact with the pad, a signal is applied to the piezoelectric element 300 to vibrate the piezoelectric element 300. As a result, the entire contact probe is driven to vibrate. As a result, it is possible to remove the natural oxide film, foreign matters, and the like attached to the first tip portion 16g, the second tip portion 18g, and the vicinity thereof.

  In this way, by providing a step for removing foreign matter and the like, it is possible to prevent the foreign matter and the like removed from the pad from reattaching to the pad. Thereby, the reliability of electrical measurement can be improved. Note that means other than the piezoelectric element may be used as long as the contact probe can be vibrated.

  By the way, in the electrical characteristic measurement methods of Embodiments 1 to 5, all use stop means for stopping the sliding of the first tip portion 16g and the second tip portion 18g. The stopping means in the first to third embodiments are the first stopper 16f and the second stopper 18f. The stopping means in the fourth embodiment is a strain gauge 250 and a fixing means 252. The stopping means in the fifth embodiment is the piezoelectric element 300 and the fixing means 302.

  Any of the stopping means stops the movement of the first tip portion 16g and the second tip portion 18g in a state where the first contact portion 16e and the second contact portion 18e constitute one plane and are in surface contact with the pad. As long as the stopping means has this feature, a configuration other than the stopping means according to the first to fifth embodiments may be adopted.

Embodiment 6 FIG.
The electrical characteristic measurement method, the contact probe manufacturing method, and the contact probe according to the sixth embodiment of the present invention will be described focusing on the differences from the first embodiment. FIG. 23 is a perspective view of a contact probe according to Embodiment 6 of the present invention. The contact probe 400 has a base portion 402. The mounting portion 14 and the probe 404 are connected to the base body portion 402. The probe 404 has a shaft portion 404a, a curved portion 404b, a flat contact portion 404c, and a tip portion 404d in this order from the base portion 402 side.

  A fixed rod 404e and a stopper 404f are formed by deforming (bending) a part of the curved portion 404b. The fixing rod 404e hits the stopper 404f when the amount of pressing deformation of the bending portion 404b exceeds a predetermined value, and stops the movement of the distal end portion 404d. FIG. 24 is a side view of a contact probe according to Embodiment 6 of the present invention.

  A method for measuring electrical characteristics using the contact probe 400 will be described. The basic point is the same as the electrical characteristic measurement method according to the first embodiment. FIG. 25 is a front view showing that the tip is applied to the pad. First, the base portion 402 to which the probe 404 is fixed is moved in the direction of the measurement target pad 102 (Z-axis negative direction), and the tip end portion 404 d is applied to the pad 102.

  The base portion 402 is pressed in the direction of the pad 102 in a state where the tip portion 404d is in contact with the pad 102, and the bending portion 404b formed on the probe 404 is pressed and deformed. FIG. 26 is a front view showing that the bending portion is pressed and deformed. By this pressing deformation, the tip end 404d slides on the pad 102 in the positive direction of the X axis, and the natural oxide film 104, the foreign matter 106, etc. on the pad 102 are removed. As a result, a clean portion 102 a is formed on the pad 102.

  The base portion 402 is pressed in the direction of the pad 102, the curved portion 404b is further pressed and deformed, and the contact portion 404c formed on the probe 404 is brought into surface contact with the clean portion 102a. Next, the slide of the tip 404d is stopped. This process is called a slide stop process.

  In the slide stop step, the slide is stopped by applying the stopper 404f to the fixed rod 404e while maintaining the surface contact between the contact portion 404c and the cleaning portion 102a. Specifically, the stopper 404f connected to the probe 404 so as to slide together with the distal end portion 404d hits the fixing rod 404e that does not slide together with the distal end portion 404d, thereby stopping the sliding of the distal end portion 404d. The slide stop process is performed simultaneously with or after the above-described surface contact.

  FIG. 27 is a front view showing that the stopper is applied to the fixing rod. FIG. 28 is a plan view showing that the stopper has hit the fixing rod. After the slide stopping process, predetermined electrical characteristics are measured while maintaining the surface contact between the contact portion 404c and the pad 102.

  A method for manufacturing the contact probe 400 will be described. FIG. 29 is a developed view of a contact probe according to Embodiment 6 of the present invention. The contact probe can be manufactured only by a process that can be completed easily and in a short time, such as punching, cutting, and bending a single metal plate made of the same material. As the metal plate, beryllium steel having high conductivity and high spring property is preferable, but not particularly limited thereto. The basic manufacturing method has been described in the first embodiment. The fixing rod 404e and the stopper 404f are formed by punching and bending a metal plate.

  According to the electrical characteristic measurement method according to the sixth embodiment of the present invention, the effect similar to that of the first embodiment is achieved by performing a linear sliding motion of the contact probe 400 having one probe 404 in the Z-axis direction. Can be obtained. Since the fixing rod 404e and the stopper 404f are provided as stopping means for stopping the sliding of the tip end portion 404d, it is not necessary to form two probes. Therefore, since the contact probe 400 can be formed by one probe 404, the material cost can be reduced.

  The stopper 404f may be connected anywhere as long as it slides together with the tip 404d. Further, the fixing rod 404e may be connected anywhere as long as it does not slide with the tip end portion 404d.

Embodiment 7 FIG.
The electrical characteristic measurement method, the contact probe manufacturing method, and the contact probe according to the seventh embodiment of the present invention will be described focusing on the differences from the sixth embodiment. FIG. 30 is a perspective view of a contact probe according to Embodiment 7 of the present invention. The fixing rod 500 has a single linear shape. A concave portion 502 is formed in the contact portion 404c. FIG. 31 is a perspective view showing a recess formed in the contact portion.

  A slide stop process in the electrical characteristic measurement method according to Embodiment 7 of the present invention will be described. In the slide stop process, the pressing deformation of the bending portion 404b proceeds, so that the tip of the fixing rod 500 extending from the bending portion 404b hits the bottom of the recess 502 formed in the contact portion 404c that slides together with the tip portion 404d. Thus, the contact portion 404c is fixed by the fixing rod 500, and the sliding of the tip end portion 404d is stopped. FIG. 32 is a front view showing that the sliding of the tip portion is stopped in a state where the contact portion is in surface contact with the pad. FIG. 33 is a plan view of the recess in FIG. 32 and the vicinity thereof.

  FIG. 34 is a cross-sectional view showing that the fixing rod is in surface contact with the bottom of the recess. The sliding of the tip 404d can be reliably stopped by bringing the tip of the fixing rod 500 into surface contact with the bottom of the recess 502 to increase the friction.

  FIG. 35 is a cross-sectional view showing a modification of the contact probe shown in Embodiment 7 of the present invention. An insulating film 512 is formed of an insulating material such as resin on the bottom of the recess 510. Thereby, it is possible to prevent an excessive current from flowing through the fixing rod 500. Moreover, it is good also as not forming a recessed part in a contact part, but forming a resin etc. in the part which a fixed rod contacts, and improving friction.

  By the way, the electrical property measuring method according to the sixth and seventh embodiments stops the sliding of the tip by applying a force in the direction opposite to the sliding direction to the tip while maintaining the surface contact between the contact and the pad. It is characterized by. Various modifications are possible as long as this feature is not lost. That is, there is no particular limitation as long as it has a fixing portion that hits the fixing rod and stops the movement of the tip portion. The fixing portion in the sixth embodiment is a stopper 404f. The fixing portion in the seventh embodiment is a recess 502.

Embodiment 8 FIG.
FIG. 36 is a perspective view of a contact probe according to Embodiment 8 of the present invention. This contact probe is basically the same as the contact probe according to the sixth embodiment, but the shape of the fixing rod 600 is different. The fixed rod 600 is formed with a bent portion 600a along the longitudinal direction. The bent portion 600a is a portion formed by being continuously bent in the longitudinal direction. Since a certain amount of strength is required for the fixing rod, the strength of the fixing rod 600 is increased by forming the bent portion 600a.

  FIG. 37 is a perspective view showing a modification of the contact probe according to Embodiment 8 of the present invention. As shown in FIG. 37, the bent portion 600b may be formed in a V shape. Further, when the shaft portion 404a also needs strength, a bent portion may be formed at this portion.

Embodiment 9 FIG.
FIG. 38 is a perspective view of a contact probe or the like according to Embodiment 9 of the present invention. The contact probe is basically the same as the contact probe 400 according to the sixth embodiment of the present invention, except that a strain gauge 250 is attached to the curved portion 404b. In the slide stopping step, when the amount of pressing deformation of the bending portion 404b detected by the strain gauge 250 reaches a predetermined value, the fixing means 252 controls the probe moving means 50 to fix the position of the base portion 402. Since the slide stopping process using the strain gauge has been described in the fourth embodiment, a detailed description thereof will be omitted.

  Thus, even when the contact probe has only one probe, the slide stopping process can be performed using the strain gauge 250 and the fixing means 252. In this case, the fixing rod 404e and the fixing portion (stopper 404f) are not necessarily formed.

  A piezoelectric element may be used instead of the strain gauge 250. As described in the fifth embodiment, when the piezoelectric element is used, the contact probe can be vibrated to remove foreign matters and the like. As described above, the features described in the first to eighth embodiments may be appropriately combined. In addition, the modifications described in one embodiment can be applied to other embodiments.

  DESCRIPTION OF SYMBOLS 10 Contact probe, 12 Base | substrate part, 14 Attachment part, 16 1st probe, 16a, 16b Shaft part, 16c 1st bending part, 16d Cutting, 16e 1st contact part, 16e '1st contact surface, 16f 1st stopper, 16g first tip, 16g ′ first tip, 18 second probe, 18a, 18b shaft, 18c second curved portion, 18d cut, 18e second contact, 18e ′ second contact, 18f second stopper , 50 probe moving means, 52 electrical connection means, 100 semiconductor chip, 102 pad, 102a clean part, 104 natural oxide, 106 foreign matter, 150 thin part, 152 through hole, 152a first through hole, 152b second through hole 200 Contact Pro , 250 strain gauge, 252 fixing means, 300 piezoelectric element, 302 fixing means, 400 contact probe, 402 base body portion, 404 probe, 404a shaft portion, 404b bending portion, 404c contact portion, 404d tip portion, 404e fixing rod, 404f stopper , 500 fixing rod, 502,510 recess, 512 insulating film, 600 fixing rod, 600a, 600b bent portion

Claims (25)

The base portion on which the first probe and the second probe are fixed is moved in the direction of the pad to be measured, and the first tip portion of the tip of the first probe and the second tip portion of the tip of the second probe are moved. Applying to the pad;
Formed on the first bending portion and the second probe formed on the first probe by pressing the base portion in the direction of the pad with the first tip portion and the second tip portion contacting the pad. The second bent portion is pressed and deformed, and the first tip portion and the second tip portion slide on the pad while approaching each other, thereby removing the natural oxide film or foreign matter on the pad and removing the pad. Forming a clean part in
The base portion is pressed in the direction of the pad to further press and deform the first curved portion and the second curved portion, and the flat first contact portion formed on the first probe with respect to the clean portion and the Bringing the flat second contact portion formed on the second probe into surface contact;
A slide stopping step for stopping sliding of the first tip portion and the second tip portion while maintaining the surface contact;
And a step of measuring a predetermined electrical characteristic while maintaining the surface contact after the slide stopping step.   The electrical property measuring method according to claim 1, wherein, in the slide stopping step, the first tip is applied to a stopper formed on the second probe.   In the slide stopping step, the position of the base portion is fixed when a pressing deformation amount of the first bending portion detected by a strain gauge attached to the first bending portion reaches a predetermined value. The electrical property measuring method according to claim 1.   In the slide stop step, the position of the base portion is fixed when the pressing deformation amount of the first bending portion detected by the piezoelectric element attached to the first bending portion reaches a predetermined value. The electrical property measuring method according to claim 1.   5. The method of measuring electrical characteristics according to claim 4, further comprising a step of vibrating the piezoelectric element to remove foreign matter or the like attached to the first tip portion and the second tip portion. Moving the base part to which the probe is fixed in the direction of the pad to be measured, and applying the tip of the tip of the probe to the pad; and
The base portion is pressed in the direction of the pad in a state where the tip portion is in contact with the pad, the curved portion formed on the probe is pressed and deformed, and the tip portion slides on the pad, thereby the pad Removing the upper natural oxide film or foreign matter and forming a clean part on the pad;
Pressing the base portion in the pad direction, further pressing and deforming the curved portion, and bringing the flat contact portion formed on the probe into surface contact with the clean portion; and
A slide stopping step of stopping the sliding of the tip by exerting a force in the direction opposite to the sliding direction on the tip while maintaining the surface contact;
And a step of measuring a predetermined electrical characteristic while maintaining the surface contact after the slide stopping step.   In the slide stopping step, the stopper connected to the probe so as to slide with the tip portion hits a fixed rod formed by folding back a part of the probe that does not slide with the tip portion, thereby sliding the tip portion. The method for measuring electrical characteristics according to claim 6, wherein:   In the slide stopping step, the distal end of the fixing rod extending from the curved portion hits the bottom of the concave portion formed in the contact portion that slides together with the distal end portion as the pressure deformation of the curved portion proceeds, so that the distal end The electrical property measuring method according to claim 6, wherein sliding of the unit is stopped. Moving the base part to which the probe is fixed in the direction of the pad to be measured, and applying the tip of the tip of the probe to the pad; and
The base portion is pressed in the direction of the pad in a state where the tip portion is in contact with the pad, the curved portion formed on the probe is pressed and deformed, and the tip portion slides on the pad, thereby the pad Removing the upper natural oxide film or foreign matter and forming a clean part on the pad;
Pressing the base portion in the pad direction, further pressing and deforming the curved portion, and bringing the flat contact portion formed on the probe into surface contact with the clean portion; and
When the amount of pressure deformation of the bending portion detected by a strain gauge or a piezoelectric element attached to the bending portion reaches a predetermined value, the position of the base portion is fixed while maintaining the surface contact. A slide stop process for stopping the slide of
And a step of measuring predetermined electrical characteristics while maintaining surface contact after the slide stopping process. A base part;
A first probe fixed to the base portion and having, in order from the base portion side, a first bending portion, a flat first contact portion, and a pointed first tip portion;
A second probe fixed to the base portion so as to face the first probe, and having a second curved portion, a flat second contact portion, and a pointed second tip portion in order from the base portion side; ,
Stop means for stopping the movement of the first tip portion and the second tip portion,
The contact probe, wherein the first bending portion and the second bending portion are pressed and deformed so as to reduce a distance between the first tip portion and the second tip portion by being pressed in a direction of a measurement target. .   The stop means is a stopper formed on the second probe so as to come into contact with the first tip when the distance between the first tip and the second tip is reduced to a predetermined value. The contact probe according to claim 10.   The stopping means includes a first stopper formed on the first probe so as to come into contact with the second tip when the distance between the first tip and the second tip is reduced to a predetermined value; and The contact probe according to claim 10, wherein the contact probe is a second stopper formed on the second probe so as to come into contact with the first tip portion. The stopping means is
A strain gauge attached to the first bending portion;
The contact according to claim 10, further comprising means for fixing a position of the base portion when a pressing deformation amount of the first bending portion detected by the strain gauge reaches a predetermined value. probe. A first through hole and a second through hole are formed in the first curved portion,
The contact probe according to claim 13, wherein the strain gauge is attached to a location sandwiched between the first through hole and the second through hole. The stopping means is
A piezoelectric element attached to the first bending portion;
The contact according to claim 10, further comprising means for fixing a position of the base portion when a pressing deformation amount of the first bending portion detected by the piezoelectric element reaches a predetermined value. probe. A first through hole and a second through hole are formed in the first curved portion,
The contact probe according to claim 15, wherein the piezoelectric element is attached to a location sandwiched between the first through hole and the second through hole.   17. The contact probe according to claim 10, wherein a cut, a thin portion, or a through hole is formed in the first bending portion and the second bending portion.   The contact probe according to any one of claims 10 to 17, wherein the first probe and the second probe face each other while being shifted in the width direction. The base portion, the first probe, and the second probe are all formed from a single metal plate made of the same material,
The first probe is formed by folding back on the front side of the base body part,
The contact probe according to claim 18, wherein the second probe is formed to be folded back on the back side of the base portion. A base part;
A probe that is fixed to the base part and has a curved part, a flat contact part, and a tip part in order from the base part side;
A fixing rod formed by processing a part of the probe so as to stop the movement of the tip when the amount of pressing deformation of the bending portion is equal to or greater than a predetermined value;
A contact probe comprising: a fixing portion that contacts the fixing rod and stops the movement of the tip portion.   21. The contact probe according to claim 20, wherein the fixing portion is a stopper connected to the probe so as to slide with the tip portion. The fixed portion is a recess formed in the contact portion,
21. The contact probe according to claim 20, wherein when the bending deformation of the bending portion proceeds, the movement of the tip portion is stopped by the fixing rod hitting the bottom of the concave portion.   The contact probe according to claim 22, further comprising an insulating film formed on a bottom of the recess.   The contact probe according to any one of claims 20 to 23, wherein the fixing rod has a bent portion along a longitudinal direction of the fixing rod.   The contact probe according to any one of claims 20 to 24, wherein the base portion, the probe, the fixing rod, and the fixing portion are formed of one metal plate made of the same material as a whole. .

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