JP2013166371A5 - - Google Patents
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- Publication number
- JP2013166371A5 JP2013166371A5 JP2013013074A JP2013013074A JP2013166371A5 JP 2013166371 A5 JP2013166371 A5 JP 2013166371A5 JP 2013013074 A JP2013013074 A JP 2013013074A JP 2013013074 A JP2013013074 A JP 2013013074A JP 2013166371 A5 JP2013166371 A5 JP 2013166371A5
- Authority
- JP
- Japan
- Prior art keywords
- coating member
- liquid coating
- sacrificial mold
- sacrificial
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 claims 30
- 239000011248 coating agent Substances 0.000 claims 29
- 239000007788 liquid Substances 0.000 claims 22
- 238000000034 method Methods 0.000 claims 11
- 238000000059 patterning Methods 0.000 claims 5
- 239000002904 solvent Substances 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 2
- 239000004416 thermosoftening plastic Substances 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/397,809 | 2012-02-16 | ||
| US13/397,809 US9308726B2 (en) | 2012-02-16 | 2012-02-16 | Printhead fluid paths formed with sacrificial material patterned using additive manufacturing processes |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013166371A JP2013166371A (ja) | 2013-08-29 |
| JP2013166371A5 true JP2013166371A5 (enExample) | 2016-03-17 |
| JP5956353B2 JP5956353B2 (ja) | 2016-07-27 |
Family
ID=48957359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013013074A Expired - Fee Related JP5956353B2 (ja) | 2012-02-16 | 2013-01-28 | 加法製造工程を用いて犠牲部材をパターニングして形成したプリントヘッド流体経路 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9308726B2 (enExample) |
| JP (1) | JP5956353B2 (enExample) |
| KR (1) | KR101942585B1 (enExample) |
| CN (1) | CN103252999B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6068684B2 (ja) | 2013-02-28 | 2017-01-25 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 流体流れ構造の成形 |
| US9656469B2 (en) | 2013-02-28 | 2017-05-23 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure with saw cut channel |
| US9498593B2 (en) | 2013-06-17 | 2016-11-22 | MetaMason, Inc. | Customized medical devices and apparel |
| CN105934346B (zh) * | 2014-01-29 | 2017-09-08 | 惠普发展公司,有限责任合伙企业 | 流体引导组件 |
| US9102099B1 (en) | 2014-02-05 | 2015-08-11 | MetaMason, Inc. | Methods for additive manufacturing processes incorporating active deposition |
| CN106103102B (zh) * | 2014-03-31 | 2017-10-31 | 惠普发展公司,有限责任合伙企业 | 印刷电路板流体喷射装置 |
| US9550358B2 (en) | 2014-05-13 | 2017-01-24 | Xerox Corporation | Printhead with narrow aspect ratio |
| KR101988874B1 (ko) * | 2014-10-23 | 2019-06-14 | 페이스북, 인크. | 3차원으로 제조되는 구조체용 기반-구조 전도성 트레이스 및 인터커넥트의 제조 |
| US9561654B2 (en) * | 2014-11-26 | 2017-02-07 | Illinois Tool Works Inc. | Laminated nozzle with thick plate |
| US9849480B2 (en) * | 2014-11-26 | 2017-12-26 | Illinois Tool Works Inc. | Laminated nozzle with thick plate |
| CN108292131A (zh) * | 2015-09-30 | 2018-07-17 | 瑞尼斯豪公司 | 对工件制造中的包括增材制造机器的机器链的控制或与之相关的改进 |
| CN105617457B (zh) * | 2015-12-27 | 2018-12-11 | 华南理工大学 | 一种利用3d反模技术制备微球支架的方法 |
| TWI607032B (zh) * | 2017-01-18 | 2017-12-01 | 美樺興業股份有限公司 | 聚對二甲苯的三維多孔性結構 |
| US11351598B2 (en) * | 2017-03-05 | 2022-06-07 | Raytheon Company | Metal additive manufacturing by sequential deposition and molten state |
| US11491749B2 (en) * | 2019-12-03 | 2022-11-08 | GM Global Technology Operations LLC | Methods for forming composite components with sealed bi-material interfaces |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU8282691A (en) * | 1990-07-20 | 1992-02-18 | McGrew, Steven P. | Embossing tool |
| JPH09248911A (ja) * | 1996-03-15 | 1997-09-22 | Canon Inc | 液体噴射記録ヘッド及びその製造方法、並びに記録装置 |
| KR20020015430A (ko) * | 2000-08-22 | 2002-02-28 | 윤종용 | 잉크젯 프린터 헤드의 제조방법 |
| JP2002144584A (ja) * | 2000-11-07 | 2002-05-21 | Sony Corp | プリンタ、プリンタヘッド及びプリンタヘッドの製造方法 |
| JP2003053700A (ja) * | 2001-08-17 | 2003-02-26 | Fuji Xerox Co Ltd | シリコン結晶異方性エッチング方法、インク流路板製造方法、インク流路板、インクジェットプリントヘッドおよびインクジェットプリンタ |
| JP4280574B2 (ja) * | 2002-07-10 | 2009-06-17 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| JP3862625B2 (ja) * | 2002-07-10 | 2006-12-27 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| US6993840B2 (en) * | 2002-07-18 | 2006-02-07 | Canon Kabushiki Kaisha | Manufacturing method of liquid jet head |
| ITTO20021099A1 (it) * | 2002-12-19 | 2004-06-20 | Olivetti I Jet Spa | Processo di rivestimento protettivo di microcircuiti idraulici rispetto a liquidi aggressivi. particolarmente per una testina di stampa a getto d'inchiostro. |
| KR100853054B1 (ko) * | 2003-10-07 | 2008-08-19 | 히다치 가세고교 가부시끼가이샤 | 방사선 경화성 조성물, 그 보존방법, 경화막 형성방법,패턴 형성방법, 패턴 사용방법, 전자부품 및 광도파로 |
| CN100510961C (zh) * | 2003-10-07 | 2009-07-08 | 日立化成工业株式会社 | 放射线固化性组合物、其保存方法、固化膜形成方法、图案形成方法、图案使用方法、电子元件及光波导 |
| KR100641358B1 (ko) * | 2004-09-23 | 2006-11-01 | 삼성전자주식회사 | 광경화성 수지 조성물을 사용한 잉크젯 프린트 헤드의제조방법 |
| US7691280B2 (en) * | 2005-03-25 | 2010-04-06 | E. I. Du Pont De Nemours And Company | Ink jet printing of etchants and modifiers |
| JP2007062237A (ja) * | 2005-09-01 | 2007-03-15 | Ricoh Co Ltd | 液体吐出ヘッド、液体吐出ヘッドの製造方法、記録液カートリッジ、画像形成装置 |
| KR100723415B1 (ko) * | 2005-12-08 | 2007-05-30 | 삼성전자주식회사 | 잉크젯 프린트헤드의 제조방법 |
| US7735225B2 (en) * | 2007-03-30 | 2010-06-15 | Xerox Corporation | Method of manufacturing a cast-in place ink feed structure using encapsulant |
-
2012
- 2012-02-16 US US13/397,809 patent/US9308726B2/en active Active
-
2013
- 2013-01-28 JP JP2013013074A patent/JP5956353B2/ja not_active Expired - Fee Related
- 2013-02-04 CN CN201310042082.1A patent/CN103252999B/zh not_active Expired - Fee Related
- 2013-02-15 KR KR1020130016580A patent/KR101942585B1/ko not_active Expired - Fee Related
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