JP2013161939A - Sheet material, manufacturing method of sheet material, inductor component, wiring board, and magnetic material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure electric reliability of a conductor pattern when the conductor pattern is formed on a magnetic material layer.SOLUTION: A sheet material 220a is formed by forming a resin layer 223a on a surface of a magnetic material layer 222a and forming a metal foil 224a on the resin layer 223a. The magnetic material layer 222a has a first insulation material 225 and magnetic material particles 226. The resin layer 223a is formed by a second insulation material. The magnetic material layer 222a contains the magnetic material particles 226 thereby allowing irregularities 226a formed according to shapes of the magnetic material particles 226 to easily occur on a surface of the magnetic material layer 222a. A conductor pattern may be formed on a smooth surface of the resin layer 223a by burying the irregularities 226a with the resin layer 223a formed on the surface of the magnetic material layer 222a. Electric reliability of the conductor pattern is secured with the structure.

Description

  The present invention relates to a sheet material, a sheet material manufacturing method, an inductor component, a wiring board, and a magnetic material.

  Low voltage microprocessors with low driving voltage and low power consumption are used in electronic devices typified by mobile phones and notebook computers. By using a low-voltage microprocessor, heat generation from the electronic device can be suppressed, and the electronic device can be operated for a long time with a battery having a small capacity.

  If the wiring between the power source and the microprocessor is long, the impedance of the wiring tends to increase, and power supply failure tends to occur. For this reason, various techniques for suppressing an increase in wiring impedance have been proposed. For example, there is a method of forming an inductor inside a wiring board having a plurality of layers of conductor circuits. In this method, a large inductor formation region is required to obtain a desired inductance. However, when the conductor circuits are formed with high density or the number of layers of the conductor circuits is small, it is difficult to secure a sufficient area for forming the inductor. For this reason, it may be difficult to ensure sufficient performance of the inductor.

  Therefore, Patent Document 1 discloses a chip inductor including a magnetic particle-containing insulator such as a synthetic resin containing magnetic particles and an inductor wiring. The technique disclosed in Patent Document 1 forms a magnetic particle-containing insulator in which magnetic particles are uniformly dispersed in a synthetic resin or the like by setting the particle size of the magnetic particles to a plurality of different sizes. Make it possible. By using this technique, it is possible to ensure inductance even in a small area.

JP 2006-269134 A

  In the magnetic particle-containing insulator (magnetic layer) disclosed in Patent Document 1, irregularities are likely to occur on the surface according to the shape of the magnetic particles. For this reason, it is difficult to form a conductor pattern for the inductor on the surface, and there is a problem that it is difficult to ensure adhesion and electrical reliability.

  The present invention has been made under the above-described circumstances, and an object thereof is to make it possible to easily form a conductor pattern for an inductor on a magnetic layer.

In order to achieve the above object, the sheet material according to the first aspect of the present invention comprises:
A sheet material comprising a magnetic layer containing magnetic particles and a first insulating material,
A resin layer made of the second insulating material is provided on at least one surface of the magnetic layer.

  The magnetic layer is preferably thicker than the resin layer.

  It is preferable to have a metal foil on the surface of the resin layer.

  It is preferable that the surface in contact with the resin layer of the metal foil is roughened.

  The average particle diameter of the magnetic particles is preferably in the range of 0.5 to 50 μm.

  The glass transition temperature (Tg) of the first insulating material is preferably 130 ° C. or higher.

  The volume content of the magnetic particles in the magnetic layer is preferably in the range of 30% by volume to 70% by volume.

  The magnetic particles are iron, soft magnetic iron alloy, nickel, soft magnetic nickel alloy, cobalt, soft magnetic cobalt alloy, soft magnetic iron (Fe) -silicon (Si) alloy, soft magnetic iron (Fe) -nitrogen (N ) Alloy, soft magnetic iron (Fe) -carbon (C) alloy, soft magnetic iron (Fe) -boron (B) alloy, soft magnetic iron (Fe) -phosphorus (P) alloy, soft magnetic iron ( It is preferably composed of at least one of an Fe) -aluminum (Al) alloy and a soft magnetic iron (Fe) -aluminum (Al) -silicon (Si) alloy.

  The first insulating material is epoxy resin, phenol resin, polybenzoxazole resin, polyphenylene resin, polybenzocyclobutene resin, polyarylene ether resin, polysiloxane resin, polyurethane resin, polyester resin, polyester urethane resin, fluorine resin, polyolefin It is preferably composed of at least one of resin, polycycloolefin resin, cyanate resin, polyphenylene ether resin and polystyrene resin.

  It is preferable that the second insulating material and the first insulating material are the same material.

  The surface of the magnetic layer preferably has an uneven shape.

  The resin layer preferably contains an inorganic filler.

  The resin layer is composed of a resin in which at least two components of a component that is relatively soluble and a component that is relatively difficult to dissolve in a solution used for the roughening treatment are mixed. preferable.

  The linear expansion coefficient of the resin layer is preferably smaller than the linear expansion coefficient of the magnetic layer.

The manufacturing method of the sheet material according to the second aspect of the present invention,
A method for producing a sheet material comprising a magnetic layer containing magnetic particles and a first insulating material,
Mixing the magnetic particles and the first insulating material to produce the magnetic layer;
Providing a resin layer made of a second insulating material on at least one surface of the magnetic layer;
including.

  It is preferable to make the thickness of the magnetic layer thicker than the thickness of the resin layer.

The inductor component according to the third aspect of the present invention is:
An inductor component having an interlayer insulating layer and an inductor conductive pattern thereon,
The interlayer insulating layer includes a magnetic layer containing magnetic particles and a first insulating material, and a resin layer provided on at least one surface of the magnetic layer and made of a second insulating material.

The thickness of the magnetic layer is preferably thicker than the thickness of the resin layer.
It is preferable that the surface of the resin layer in contact with the conductor pattern is roughened.

A wiring board according to a fourth aspect of the present invention is:
A core substrate having an opening formed on at least one surface; an inductor component housed in the opening; and a filling resin filling the opening to fix the inductor component. A wiring board,
The inductor component has an interlayer insulating layer and an inductor conductor pattern thereon,
The interlayer insulating layer includes a magnetic layer including magnetic particles and a first insulating material, and a resin layer provided on at least one surface of the magnetic layer and made of a second insulating material.

  The thickness of the magnetic layer is preferably thicker than the thickness of the resin layer.

The magnetic material according to the fifth aspect of the present invention is:
Having magnetic particles and an insulating material,
The linear expansion coefficient in the cured state is 40 ppm / K or less.

  The sheet material according to the present invention includes a resin layer on at least one side of a magnetic layer containing magnetic particles. For this reason, compared with the case where a conductor pattern is directly formed on a magnetic body layer, a conductor pattern can be formed on the surface of a flat resin layer. Thereby, it becomes possible to ensure the adhesiveness and electrical reliability of the conductor pattern.

It is sectional drawing of the wiring board which concerns on embodiment of this invention. It is sectional drawing which shows the example of the inductor components which concern on embodiment of this invention. It is sectional drawing which shows the example of the sheet material which concerns on embodiment of this invention. It is a flowchart which shows the manufacturing method of the sheet material which concerns on embodiment of this invention. It is a figure for demonstrating the process of forming a magnetic paste in the manufacturing method shown in FIG. It is a figure for demonstrating the process of hardening a magnetic body paste in the manufacturing method shown in FIG. FIG. 5 is a diagram for explaining a step of providing a resin layer on a magnetic layer (cured magnetic paste) in the manufacturing method shown in FIG. 4. In the manufacturing method shown in FIG. 4, it is a figure for demonstrating the process of laminating | stacking the roughened metal foil on the resin layer. It is a flowchart which shows the manufacturing method of the inductor component which concerns on embodiment of this invention. FIG. 7 is a cross-sectional view showing a support in the manufacturing method shown in FIG. 6. In the manufacturing method shown in FIG. 6, it is a figure for demonstrating the process of forming an insulated substrate and a conductor layer on a support body. FIG. 7 is a diagram for explaining a step of forming a first conductor pattern on an insulating substrate in the manufacturing method shown in FIG. 6. In the manufacturing method shown in FIG. 6, it is a figure for demonstrating the process of laminating | stacking a sheet | seat material on the 1st conductor pattern. It is a figure which shows the state by which the sheet | seat material was laminated | stacked on the 1st conductor pattern. FIG. 11 is a diagram for explaining a step after the step of FIG. 10 in the manufacturing method shown in FIG. 6. FIG. 13 is a diagram for explaining a step after the step of FIG. 12 in the manufacturing method shown in FIG. 6. FIG. 7 is a diagram for explaining a step of forming a second conductor pattern on the second resin layer in the manufacturing method shown in FIG. 6. In the manufacturing method shown in FIG. 6, it is a figure for demonstrating the process of laminating | stacking a sheet material on a 2nd conductor pattern. FIG. 7 is a diagram for explaining a step of forming a third conductor layer on the third resin layer in the manufacturing method shown in FIG. 6. FIG. 7 is a diagram for explaining a step of forming a third conductor pattern on the third resin layer in the manufacturing method shown in FIG. 6. In the manufacturing method shown in FIG. 6, it is a figure for demonstrating the process of removing a support body. It is sectional drawing which shows the other example of the sheet material which concerns on embodiment of this invention. It is a flowchart which shows the manufacturing method of the other example of a sheet | seat material. It is a figure for demonstrating the process of forming a magnetic paste in the manufacturing method shown to FIG. 19B. It is a figure for demonstrating the process of hardening a magnetic body paste in the manufacturing method shown to FIG. 19B. It is a figure for demonstrating the process of providing a resin layer on a magnetic body layer (hardened magnetic body paste) in the manufacturing method shown to FIG. 19B. It is a flowchart which shows the manufacturing method of the wiring board which concerns on embodiment of this invention. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of preparing a board | substrate (core board | substrate). In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of forming a through hole in a board | substrate. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of forming a through-hole conductor and a conductor layer in a board | substrate. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of patterning a conductor layer. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of forming a cavity. FIG. 26 is a diagram for explaining a process following the process of FIG. 25. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of arrange | positioning inductor components in a cavity. It is a figure for demonstrating the state by which the inductor components are arrange | positioned in the cavity. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of arrange | positioning an insulating layer on an inductor component. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of filling an insulator with the clearance gap between a core board | substrate and an inductor component. It is a figure for demonstrating the state with which the insulator was filled in the clearance gap between a core board | substrate and an inductor component. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of forming an insulating layer on a core board | substrate and an inductor component. In the manufacturing method shown in FIG. 20, it is a figure for demonstrating the process of forming a via hole. FIG. 33 is a diagram for explaining a process following the process in FIG. 32. It is a figure for demonstrating the process following the process of FIG. It is a figure for demonstrating the process following the process of FIG. FIG. 36 is a diagram for explaining a process following the process of FIG. 35. It is sectional drawing which shows the 2nd example of the inductor component which concerns on embodiment of this invention. It is a flowchart which shows the manufacturing method of the 2nd example of the inductor component which concerns on embodiment of this invention. FIG. 38B is a cross-sectional view showing a support in the manufacturing method shown in FIG. 37B. FIG. 38B is a diagram for describing a step of forming an insulating substrate and a conductor layer on a support in the manufacturing method shown in FIG. 37B. FIG. 38B is a diagram for describing a step of forming the first conductor pattern on the insulating substrate in the manufacturing method shown in FIG. 37B. FIG. 38B is a diagram for describing a step of applying a magnetic paste on the insulating substrate and the first conductor pattern in the manufacturing method shown in FIG. 37B. FIG. 38B is a diagram for describing a process of stacking an insulating layer on a magnetic layer (a layer obtained by curing a magnetic paste) in the manufacturing method illustrated in FIG. 37B. FIG. 38B is a diagram for describing a step of forming a via hole in the manufacturing method illustrated in FIG. 37B. FIG. 38B is a diagram for describing a step of forming a via conductor and a conductor layer in the manufacturing method illustrated in FIG. 37B. FIG. 38B is a diagram for describing a step of forming a second conductor pattern on the insulating layer in the manufacturing method illustrated in FIG. 37B. FIG. 38B is a diagram for describing a step of applying a magnetic paste on the insulating layer and the second conductor pattern in the manufacturing method shown in FIG. 37B. FIG. 38B is a diagram for describing a step of laminating an insulating layer and a metal foil on a magnetic layer (a layer obtained by curing a magnetic paste) in the manufacturing method illustrated in FIG. 37B. FIG. 38B is a diagram for describing a step of forming a conductor layer on the insulating layer in the manufacturing method illustrated in FIG. 37B. FIG. 38B is a diagram for describing a step of forming a third conductor pattern on the insulating layer in the manufacturing method illustrated in FIG. 37B. It is a figure for demonstrating the process of removing a support body in the manufacturing method shown to FIG. 37B. It is sectional drawing which shows the 3rd example of the inductor component which concerns on embodiment of this invention. It is a perspective view which shows the shape of the conductor pattern of an inductor component. It is sectional drawing which shows the 4th example of the inductor component which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the figure, arrows Z1 and Z2 indicate the stacking direction of the wiring boards (or the thickness direction of the wiring boards) corresponding to the normal direction of the main surface (front and back surfaces) of the wiring boards. On the other hand, arrows X1 and X2 and Y1 and Y2 respectively indicate directions orthogonal to the stacking direction (or sides of each layer). The main surface of the wiring board is an XY plane. The side surface of the wiring board is an XZ plane or a YZ plane.

  The conductor layer is a layer composed of one or more conductor patterns. The conductor layer may include a conductor pattern that constitutes an electric circuit, for example, a wiring (including a ground), a pad, a land, or the like, or a planar conductor pattern that does not constitute an electric circuit.

  In addition to wet plating such as electrolytic plating, plating includes dry plating such as PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition).

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the wiring board 10 according to the present embodiment includes a substrate 100 (insulating substrate), a first buildup part B1, a second buildup part B2, an inductor component 200, a solder resist 11, 12 and. The wiring board 10 of this embodiment is a rectangular wiring board. However, the wiring board 10 may be a flexible wiring board. Hereinafter, one of the front and back surfaces (two main surfaces) of the substrate 100 is referred to as a first surface F1, and the other is referred to as a second surface F2. Of the front and back surfaces (two main surfaces) of the inductor component 200, a surface facing the same direction as the first surface F1 is referred to as a third surface F3, and the other is referred to as a fourth surface F4.

  The first buildup portion B1 is formed on the first surface F1 side of the substrate 100, and the second buildup portion B2 is formed on the second surface F2 side of the substrate 100. The first buildup part B1 is composed of an insulating layer 101 (interlayer insulating layer) and a conductor layer 110, and the second buildup part B2 is composed of an insulating layer 102 (interlayer insulating layer), a conductor layer 120, Consists of The inductor component 200 is built in the wiring board 10. Solder resists 11 and 12 are formed on the first buildup part B1 and the second buildup part B2, respectively.

The substrate 100 has an insulating property and becomes a core substrate of the wiring board 10. A conductor layer 301 is formed on the first surface F1 of the substrate 100, and a conductor layer 302 is formed on the second surface F2 of the substrate 100. A cavity (opening) R10 is formed in the substrate 100. The inductor component 200 is accommodated in the cavity R10. The cavity R <b> 10 includes a through hole that penetrates the substrate 100. The opening shapes at both ends (the first surface F1 side and the second surface F2 side) of the cavity R10 are substantially rectangular. The shape of the inductor component 200 is, for example, a rectangular plate, and the shape of the main surface of the inductor component 200 is, for example, a substantially rectangular shape. In the present embodiment, the inductor component 200 has a planar shape (for example, a similar shape having substantially the same size) corresponding to the cavity R10.
Note that the cavity R10 may not penetrate the substrate 100. That is, the cavity R10 may have a bottomed shape with a depth smaller than the thickness of the substrate 100.

In the present embodiment, substantially the entire inductor component 200 is accommodated in the cavity R10. However, the present invention is not limited to this, and only part of the inductor component 200 may be disposed in the cavity R10. In this embodiment, the insulator 101a is filled in the gap R1 between the inductor component 200 and the substrate 100 in the cavity R10. In the present embodiment, the insulator 101a is made of an insulating material (specifically resin) that constitutes the upper insulating layer 101 (specifically, resin insulating layer) (see FIG. 29B). The insulator 101a has a larger thermal expansion coefficient than either the substrate 100 or the inductor component 200. The insulator 101a completely covers the periphery of the inductor component 200. Thereby, the inductor component 200 is protected by the insulator 101a (resin) and is fixed at a predetermined position.
Note that the insulator 101a may be formed of a material different from that of the upper insulating layer 101.

  The insulating layer 101 (first insulating layer) is formed on the first surface F1 of the substrate 100 and the third surface F3 of the inductor component 200, and the insulating layer 102 (second insulating layer) is the second surface of the substrate 100. It is formed on F 2 and on the fourth surface F 4 of the inductor component 200. An opening on one side (first surface F1 side) of the cavity R10 (through hole) is closed by the insulating layer 101, and an opening on the other side (second surface F2 side) of the cavity R10 (through hole) is formed by the insulating layer 102. It is blocked. In the present embodiment, the conductor layers 110 and 120 are the outermost layers. However, the present invention is not limited to this, and more interlayer insulating layers and conductor layers may be stacked.

  The conductor layer 110 is the outermost conductor layer on the first surface F1 side, and the conductor layer 120 is the outermost conductor layer on the second surface F2 side. Solder resists 11 and 12 are formed on the conductor layers 110 and 120, respectively. However, openings 11a and 12a are formed in the solder resists 11 and 12, respectively. For this reason, the predetermined part (part located in the opening part 11a) of the conductor layer 110 is exposed without being covered with the solder resist 11, and becomes the pad P1. Moreover, the predetermined site | part (site located in the opening part 12a) of the conductor layer 120 becomes the pad P2. The pad P1 becomes an external connection terminal for electrical connection with, for example, another wiring board, and the pad P2 becomes an external connection terminal for mounting an electronic component, for example. However, the application of the pads P1 and P2 is not limited to this and is arbitrary.

  In the present embodiment, the pads P1 and P2 have a corrosion resistant layer made of, for example, a Ni / Au film on the surface thereof. The corrosion resistant layer can be formed by electrolytic plating or sputtering. Moreover, you may form the corrosion-resistant layer which consists of an organic protective film by performing OSP (Organic Solderability Preservative) process. The corrosion resistant layer is not an essential component and may be omitted if not necessary.

  Through hole 300a is formed in substrate 100 (core substrate), and through hole conductor 300b is formed by filling conductor (for example, copper plating) in through hole 300a. In the present embodiment, the through-hole conductor 300b has an hourglass shape (a drum shape). Each of the conductor layers 301 and 302 includes a land of the through-hole conductor 300b.

  Holes 311 a and 312 a (each via hole) are formed in the insulating layer 101, and a hole 322 a (via hole) is formed in the insulating layer 102. By filling the holes 311a, 312a, and 322a with conductors (for example, copper plating), the conductors in the holes become via conductors 311b, 312b, and 322b (respectively filled conductors). The hole 311a reaches the third conductor pattern 207 of the inductor component 200, and the via conductor 311b is electrically connected to the third conductor pattern 207 of the inductor component 200 from the first surface F1 side of the substrate 100.

  The conductor layer 301 on the first surface F1 of the substrate 100 and the conductor layer 110 on the insulating layer 101 are electrically connected to each other via the via conductor 312b, and the conductor layer 302 on the second surface F2 of the substrate 100. The conductor layer 120 on the insulating layer 102 is electrically connected to each other through the via conductor 322b. Further, the conductor layer 301 on the first surface F1 of the substrate 100 and the conductor layer 302 on the second surface F2 of the substrate 100 are electrically connected to each other through the through-hole conductor 300b. The via conductors 312b and 322b and the through-hole conductor 300b are all filled conductors, and these are stacked in the Z direction to form a filled stack.

  The substrate 100 is made of, for example, a glass cloth (core material) impregnated with an epoxy resin (hereinafter referred to as “glass epoxy”). The core material is a material having a smaller coefficient of thermal expansion than the main material (in the present embodiment, epoxy resin). As a core material, it is thought that inorganic materials, such as glass fiber (for example, glass cloth or glass nonwoven fabric), an aramid fiber (for example, aramid nonwoven fabric), or a silica filler, are preferable, for example. However, the material of the substrate 100 is basically arbitrary. For example, instead of an epoxy resin, a polyester resin, a bismaleimide triazine resin (BT resin), an imide resin (polyimide), a phenol resin, an allylated phenylene ether resin (A-PPE resin), or the like may be used. The substrate 100 may be composed of a plurality of layers made of different materials.

  In this embodiment, each of the insulating layers 101 and 102 is formed by impregnating a core material with resin. The insulating layers 101 and 102 are made of glass epoxy, for example. However, the present invention is not limited to this. For example, the insulating layers 101 and 102 may be made of a resin that does not contain a core material. In addition, the material of the insulating layers 101 and 102 is basically arbitrary. For example, instead of an epoxy resin, a polyester resin, a bismaleimide triazine resin (BT resin), an imide resin (polyimide), a phenol resin, an allylated phenylene ether resin (A-PPE resin), or the like may be used. Each insulating layer may be composed of a plurality of layers made of different materials.

  The conductor layer 110 is composed of copper foil (lower layer) and copper plating (upper layer), and the conductor layer 120 is composed of copper foil (lower layer) and copper plating (upper layer). The conductor layers 110 and 120 have, for example, wirings and lands that form an electric circuit (for example, an electric circuit including the inductor component 200), and a solid pattern for increasing the strength of the wiring board 10.

  The material of each conductor layer and each via conductor is arbitrary as long as it is a conductor, and may be metal or nonmetal. Each conductor layer and each via conductor may be composed of a plurality of layers made of different materials.

  Next, the configuration of the inductor component 200 according to the embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view of the inductor component 200 according to the present embodiment.

  The inductor component 200 includes a support layer 201, a first conductor pattern 202, a first magnetic layer 222a, a first resin layer 223a, a second conductor pattern 206, a via conductor 205b, Magnetic layer 222b, second resin layer 223b, and third conductor pattern 207.

  A first conductor pattern 202 is formed on the support layer 201. On the first conductor pattern 202, a first magnetic layer 222a is formed. The first magnetic layer 222a includes magnetic particles and a first insulating material. A first resin layer 223a made of a second insulating material is formed on the first magnetic layer 222a. A second conductor pattern 206 is formed on the first resin layer 223a. The first conductor pattern 202 and the second conductor pattern 206 are electrically connected by a via conductor 205b. The via conductor 205b penetrates the magnetic layer 222a and the resin layer 223a.

  On the second conductor pattern 206, a second magnetic layer 222b is formed. The second magnetic layer 222b includes magnetic particles and a first insulating material. A second resin layer 223b made of a second insulating material is formed on the second magnetic layer 222b. A third conductor pattern 207 is formed on the second resin layer 223b. The upper surface of the second resin layer 223b and the upper surface of the third conductor pattern 207 form the third surface F3 of the inductor component 200.

  In the present embodiment, an epoxy resin is used as the material for the support layer 201. Moreover, it is preferable that the 1st insulating material and the 2nd insulating material are the same materials, and the epoxy resin is each employ | adopted.

  In the present embodiment, the insulating materials constituting the support layer 201, the magnetic layers 222a and 222b, and the resin layers 223a and 223b are basically arbitrary. The material of the support layer 201, the first insulating material, and the second insulating material are, for example, epoxy resin, polyester resin, bismaleimide triazine resin (BT resin), imide resin (polyimide), phenol resin, or allylated phenylene ether resin (A -PPE resin) and the like can be used. Each insulating layer may be composed of a plurality of layers made of different materials.

  In the present embodiment, the inductor component 200 is formed using a plurality of sheet materials 220a and 220b including a magnetic layer (see FIGS. 10 and 15 described later). FIG. 3 shows the structure of the sheet material 220a. However, in this embodiment, the sheet material 220b also has the same structure as the sheet material 220a. However, the present invention is not limited to this, and the inductor component may be manufactured using a plurality of sheet materials having different structures.

  As shown in FIG. 3, the sheet material 220a includes a magnetic layer 222a, a resin layer 223a, and a metal foil 224a. The magnetic layer 222a is made of a magnetic material. Specifically, the magnetic layer 222 a is composed of a first insulating material 225 and magnetic particles 226. The resin layer 223a is formed on the magnetic layer 222a, and the metal foil 224a is formed on the resin layer 223a. Hereinafter, one of the front and back surfaces (two main surfaces) of the metal foil 224a is referred to as a fifth surface F5, and the other is referred to as a sixth surface F6. In the present embodiment, the sixth surface F6 of the metal foil (copper foil) 224a is in contact with the resin layer 223a.

  The glass transition temperature (Tg) of the first insulating material 225 is preferably 130 ° C. or higher. If the glass transition temperature of the first insulating material 225 is 130 ° C. or higher, the magnetic material layer 200 is heated when the inductor component 200 is heated in the wiring board 10 as compared with the case where the glass transition temperature is less than 130 ° C. 222a and 222b are not easily deformed.

  The first insulating material 225 may basically be an insulating material, but is preferably made of a heat resistant resin. Specifically, for example, epoxy resin, phenol resin, polybenzoxazole resin, polyphenylene resin, polybenzocyclobutene resin, polyarylene ether resin, polysiloxane resin, polyurethane resin, polyester resin, polyester urethane resin, fluorine resin, polyolefin resin , Polycycloolefin resin, cyanate resin, polyphenylene ether resin and polystyrene resin, or a mixture thereof.

  The average particle diameter d1 (average particle diameter) of the magnetic particles 226 is, for example, in the range of 0.5 to 50 μm. The average particle diameter of the magnetic particles 226 is calculated by measuring the particle diameter of 100 magnetic particles 226 with a scanning electron microscope (SEM) photograph and averaging the measured particle diameters. When the average particle diameter of the magnetic particles 226 is 0.5 μm or more, aggregation is less likely than when the average particle diameter is less than 0.5 μm. This facilitates uniform dispersion of the magnetic particles 226 in the magnetic layer 222a. When the average particle diameter of the magnetic particles 226 is 50 μm or less, the friction between the particles becomes smaller than when the average particle diameter exceeds 50 μm. This makes it easy to configure the magnetic layer 222a to have a uniform thickness.

  The volume content of the magnetic particles 226 in the magnetic layer 222a is preferably in the range of 30% by volume to 70% by volume. When the volume content is 30% by volume or more, the magnetic properties are improved as compared with the case where the volume content is less than 30% by volume. When the volume content is 70% by volume or less, the friction between the particles becomes smaller than when the volume content exceeds 70% by volume. This makes it easy to configure the magnetic layer 222a to have a uniform thickness.

  The magnetic substance constituting the magnetic particles 226 is arbitrary as long as it is a soft magnetic substance. For example, iron, soft magnetic iron alloy, nickel, soft magnetic nickel alloy, cobalt, soft magnetic cobalt alloy, soft magnetic iron (Fe)- Silicon (Si) alloy, soft magnetic iron (Fe) -nitrogen (N) alloy, soft magnetic iron (Fe) -carbon (C) alloy, soft magnetic iron (Fe) -boron (B) alloy, soft Examples of the magnetic iron (Fe) -phosphorus (P) alloy, soft magnetic iron (Fe) -aluminum (Al) alloy, and soft magnetic iron (Fe) -aluminum (Al) -silicon (Si) alloy.

  The thickness d2 of the magnetic layer 222a is preferably thicker than the thickness d3 of the resin layer 223a. Thereby, a sufficient amount of magnetic particles 226 can be contained in the magnetic layer 222a, and the magnetic characteristics are improved. Specifically, the thickness d2 of the magnetic layer 222a is, for example, in the range of 20 to 100 μm, and the thickness d3 of the resin layer 223a is, for example, in the range of 10 to 60 μm.

  The resin layer 223a is made of a second insulating material. The second insulating material may be basically an insulating material, but is preferably a heat resistant resin. Specifically, for example, epoxy resin, phenol resin, polybenzoxazole resin, polyphenylene resin, polybenzocyclobutene resin, polyarylene ether resin, polysiloxane resin, polyurethane resin, polyester resin, polyester urethane resin, fluorine resin, polyolefin resin , Polycycloolefin resin, cyanate resin, polyphenylene ether resin and polystyrene resin, or a mixture thereof.

  The second insulating material and the first insulating material are preferably the same material. Thereby, the adhesion between the magnetic layer 222a and the resin layer 223a is improved. The linear expansion coefficient of the resin layer 223a is preferably smaller than the linear expansion coefficient of the magnetic layer 222a. Thereby, the possibility that the magnetic layer 222a is thermally deformed is reduced. Furthermore, the magnetic material constituting the magnetic layer 222a preferably has a linear expansion coefficient of 40 ppm / K or less in a cured state. Such a magnetic material is easy to be widely used for electrical components that require magnetic characteristics, such as the inductor component 200.

  The resin layer 223a may contain an inorganic filler. Thereby, it becomes easy to make the linear expansion coefficient of the resin layer 223a smaller than the linear expansion coefficient of the magnetic layer 222a. Examples of the inorganic filler include glass fiber, glass particles, calcium carbonate, sodium carbonate, barium sulfate, aluminum hydroxide, alumina, silica, diatomaceous earth, mica, and talc.

  The surface of the magnetic layer 222a may have irregularities 226a as shown in FIG. When the magnetic layer 222 a contains the magnetic particles 226, irregularities 226 a corresponding to the shape of the magnetic particles 226 are easily generated on the surface of the magnetic layer 222 a. By filling the unevenness 226a with the resin layer 223a formed on the surface of the magnetic layer 222a, a conductor pattern can be formed on the smooth surface of the resin layer 223a. Thereby, it is thought that the adhesiveness and electrical reliability of a conductor pattern are ensured. Therefore, when the sheet material 220a is used for the inductor component 200, the performance of the inductor component 200 in the wiring board 10 can be ensured.

  As shown in FIG. 3, the sheet material 220a has a metal foil 224a on the surface of the resin layer 223a. Thereby, it is considered that it is easier to form a conductor pattern on the surface of the resin layer 223a. The metal foil 224a is, for example, a copper foil. The sixth surface F6 (surface in contact with the resin layer 223a) of the metal foil 224a is preferably roughened. Thereby, in the manufacturing process of the inductor component 200, it is considered that the metal foil 224a is hardly peeled off from the resin layer 223a.

  Next, with reference to FIG. 4 etc., the manufacturing method of the sheet | seat material 220a is demonstrated. FIG. 4 is a flowchart showing a method for manufacturing the sheet material 220a according to the present embodiment.

  In step S <b> 11, the magnetic particles 226 are mixed with the first insulating material 225 to produce the magnetic paste 221. Any mixing method may be used as long as the magnetic particles 226 can be dispersed substantially uniformly in the first insulating material 225. For example, the particles are mixed by a planetary mixer.

  Subsequently, in step S12, the produced magnetic paste 221 is applied to the surface of the support substrate 440 as shown in FIG. 5A.

  Subsequently, in step S13, the magnetic layer 222a is formed. Specifically, as shown in FIG. 5B, the first insulating material 225 is heated and semi-cured, for example. Thereby, the magnetic layer 222a is formed.

  Subsequently, in step S14, the resin layer 223a is laminated. Specifically, as shown in FIG. 5C, the second insulating material in a fluidized state is applied on the magnetic layer 222a and heated to semi-cur the second insulating material. Thereby, the resin layer 223a is formed.

  Subsequently, in step S15, the metal foil 224a is laminated. Specifically, as shown in FIG. 5D, one surface (for example, the sixth surface F6) of the metal foil 224a is roughened, and is crimped so that the roughened surface is in contact with the surface of the resin layer 223a. In order to roughen the surface of the metal foil 224a such as copper foil, for example, a copper surface roughening agent (sulfuric acid-hydrogen peroxide-based etching agent or the like) can be used. Good. Thereby, the metal foil 224a is laminated.

  Subsequently, in step S16, the support substrate 440 is removed. As a result, the sheet material 220a shown in FIG. 3 is completed.

  A method for manufacturing the inductor component 200 using the sheet material 220a manufactured in this way will be described with reference to FIG. FIG. 6 is a flowchart showing a schematic content and procedure of a method for manufacturing the inductor component 200 according to the present embodiment.

  In step S21, an insulating layer (insulating substrate) and a first conductor pattern are formed on the support.

  First, as shown in FIG. 7, a support 400 is prepared. The support 400 is made of an insulator. A copper foil 410 is formed on one surface (for example, the surface F10) of the support 400.

Subsequently, as shown in FIG. 8, for example, a resin layer having a metal foil is laminated on the copper foil 410 of the support 400 in which the copper foil 410 is formed on one surface (for example, the surface F <b> 10). Subsequently, for example, copper plating is formed by performing electroplating using a metal foil as a seed layer using a plating solution. Then, the resin layer is cured by heating. Thereby, an insulating layer (insulating substrate) 201 made of a cured resin layer and a conductor layer 202a made of a metal foil and copper plating are formed.
The insulating layer 201 may include a core material such as glass cloth.

  Subsequently, the conductor layer 202a is patterned using, for example, an etching resist and an etching solution. Specifically, the conductor layer 202a is covered with an etching resist having a pattern corresponding to the first conductor pattern 202, and a portion of the conductor layer 202a that is not covered with the etching resist (a portion exposed at the opening of the etching resist) is covered. And removed by etching. As a result, the first conductor pattern 202 is formed on the support layer 201 as shown in FIG. Note that the etching is not limited to wet, and may be dry.

  Subsequently, the sheet material 220a is laminated in step S22 of FIG. Specifically, as shown in FIG. 10, a sheet material 220a having a magnetic layer 222a, a resin layer 223a, and a metal foil (for example, copper foil) 224a is laminated on the first conductor pattern 202 by pressing. . As a result, the semi-cured magnetic material forming the magnetic layer 222a enters the portion where the first conductor pattern 202 is not formed. Then, the magnetic layer 222a and the resin layer 223a are heat cured. As a result, as shown in FIG. 11, the magnetic layer 222a, the resin layer 223a, and the metal foil 224a are laminated in this order on the support layer 201 and the first conductor pattern 202.

  Subsequently, in step S23 of FIG. 6, the via conductor 205b and the second conductor pattern 206 are formed. Specifically, as shown in FIG. 12, holes 205a (via holes) are formed in the magnetic layer 222a, the resin layer 223a, and the metal foil 224a by, for example, a laser. The hole 205a penetrates the magnetic layer 222a, the resin layer 223a, and the metal foil 224a. The hole 205 a reaches the first conductor pattern 202 of the inductor component 200. Then, desmear is performed as needed.

  Subsequently, an electroless plating film of, for example, copper is formed on the metal foil 224a and in the hole 205a by, for example, chemical plating. Prior to the electroless plating, a catalyst made of palladium or the like is adsorbed on the surface of the hole 205a by, for example, immersion.

  Subsequently, for example, copper electroplating is formed on the electroless plating film. Specifically, copper as a material to be plated is connected to the anode, and an electroless plating film as a material to be plated is connected to the cathode, and immersed in a plating solution. And a direct current voltage is applied between both electrodes, and an electric current is sent, and copper is deposited on the surface of an electroless plating film. As a result, as shown in FIG. 13, the hole 205a is filled with electrolytic plating, and a via conductor 205b made of, for example, copper plating is formed. Then, a conductor layer 206a is formed on the resin layer 223a.

  Subsequently, the conductor layer 206a is patterned using, for example, an etching resist and an etching solution. Specifically, the conductor layer 206a is covered with an etching resist having a pattern corresponding to the conductor pattern 206, and a portion of the conductor layer 206a that is not covered with the etching resist (a portion exposed at the opening of the etching resist) is etched. Remove. Thereby, as shown in FIG. 14, the 2nd conductor pattern 206 is formed on the resin layer 223a. Note that the etching is not limited to wet, and may be dry.

  Subsequently, in step S24 of FIG. 6, the sheet material 220b is laminated. Specifically, as shown in FIG. 15, a sheet material 220b having a magnetic layer 222b, a resin layer 223b, and a metal foil (for example, copper foil) 224b is laminated on the second conductor pattern 206 by pressing. Is done. As a result, the uncured magnetic material forming the magnetic layer 222b enters the portion where the second conductor pattern 206 is not formed. Then, the magnetic layer 222b and the resin layer 223b are heat cured. As a result, as shown in FIG. 15, the magnetic layer 222b, the resin layer 223b, and the metal foil 224b are laminated on the resin layer 223a and the second conductor pattern 206.

  In the magnetic material of this embodiment, since the magnetic particles are isotropically contained in the resin, the value of the linear expansion coefficient (CTE) does not change greatly in the X direction, the Y direction, and the Z direction. Preferably, the CTE value of the magnetic layer 222a and the magnetic layer 222b is 30 ppm / K or less.

  Subsequently, in step S25 of FIG. 6, the third conductor pattern 207 is formed.

  Specifically, for example, copper electroless plating and electrolytic plating are formed on the metal foil 224b in the same manner as described above. Thereby, as shown in FIG. 16, the conductor layer 207a is formed on the resin layer 223b.

  Subsequently, the conductor layer 207a is patterned using, for example, an etching resist and an etching solution. Specifically, the conductor layer 207a is covered with an etching resist having a pattern corresponding to the third conductor pattern 207, and a portion of the conductor layer 207a that is not covered with the etching resist (a portion exposed at the opening of the etching resist) is formed. And removed by etching. Thereby, as shown in FIG. 17, the 3rd conductor pattern 207 is formed on the resin layer 223b. The third conductor pattern 207 is connected to the second conductor pattern 206 by a via conductor (not shown). Note that the etching is not limited to wet, and may be dry.

  Subsequently, in step S26 of FIG. 6, the support 400 and the copper foil 410 are removed.

  As shown in FIG. 18, the support body 400 is removed. Subsequently, the copper foil 410 is removed by etching, for example. Thereby, the inductor component 200 shown in FIG. 2 is completed.

  Thus, in this embodiment, the inductor component 200 is manufactured using the sheet materials 220a and 220b having the metal foils (copper foils) 224a and 224b. However, the present invention is not limited to this, and it is also possible to use a sheet material without metal foil for manufacturing the inductor component. FIG. 19A shows a cross-sectional view of a sheet material 230 without a metal foil.

  As shown in FIG. 19A, the sheet material 230 is formed by forming a resin layer 227 on the surface of the magnetic layer 222c. The magnetic layer 222c includes a first insulating material 225c and magnetic particles 226c. The resin layer 227 is composed of two types of resins.

  As shown in FIG. 19A, in the resin layer 227, two resins of a resin component 228 that is relatively easy to dissolve and a resin component 229 that is relatively difficult to dissolve in the solution used for the roughening treatment are mixed. It is made of resin. Resins that are relatively soluble in the solution used for the roughening treatment are thermoplastic resins such as polyethylene resin, polypropylene resin, polyester resin, polystyrene resin, acrylic resin, polyamide, and polyethylene terephthalate. Resins that are relatively difficult to dissolve with respect to the solution used for the roughening treatment are epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and novolac type epoxy resin.

In the inductor component manufacturing process using the sheet material shown in FIG. 19A, the surface of the resin layer 227 is roughened using a solution such as a permanganic acid solution. At this time, the surface of the resin layer 227 is roughened by dissolving the resin component 228 described above.
Thereafter, it is considered that a conductor pattern can be easily formed on the surface of the resin layer 227 using, for example, a semi-additive method.

  Thus, even the sheet material 230 that does not have a metal foil such as a copper foil on the surface can be used for manufacturing inductor components.

  Next, a method for manufacturing the sheet material 230 will be described with reference to FIG. 19B and the like. FIG. 19B is a flowchart showing a method for manufacturing the sheet material 230 according to another example of the present embodiment.

  In step S11, similarly to the case of FIG. 4, the magnetic particles 226c are mixed with the first insulating material 225c to produce the magnetic paste 221c. Any mixing method may be used as long as the magnetic particles 226c can be dispersed substantially uniformly in the first insulating material 225c. For example, the magnetic particles 226c are mixed by a planetary mixer.

  Subsequently, in step S12, as shown in FIG. 19C, the produced magnetic paste 221c is applied to the surface of the support substrate 440c.

  Subsequently, in step S13, the magnetic layer 222c is formed. Specifically, as shown in FIG. 19D, the first insulating material 225c is semi-cured. Thereby, the magnetic layer 222c is formed.

  Subsequently, in step S28, a resin component 228 that is relatively soluble in the solution used for the roughening treatment and a resin component 229 that is relatively difficult to dissolve are mixed. Any mixing method may be used as long as the resin 228 and the resin 229 can be mixed substantially uniformly. For example, the mixing is performed by a heating kneader (kneader).

  Subsequently, in step S29, a resin layer 227 is formed. Specifically, as shown in FIG. 19E, the mixed resins 228 and 229 are applied on the magnetic layer 222c and cured by heating. Thereby, the resin layer 227 is formed.

  Subsequently, in step S16, the support substrate 440 is removed as in the case of FIG. As a result, the sheet material 230 shown in FIG. 19A is completed.

  Next, with reference to FIG. 20 etc., the manufacturing method of the wiring board 10 is demonstrated. FIG. 20 is a flowchart showing a schematic content and procedure of the method for manufacturing the wiring board 10 according to the present embodiment.

  In step S31, as shown in FIG. 21, a double-sided copper-clad laminate 1000 is prepared as a starting material. The double-sided copper clad laminate 1000 includes a substrate 100 (core substrate), a copper foil 1001 formed on the first surface F1 of the substrate 100, a copper foil 1002 formed on the second surface F2 of the substrate 100, Consists of In the present embodiment, at this stage, the substrate 100 is made of a glass epoxy that is completely cured.

  Subsequently, in step S32 of FIG. 20, the through-hole conductor 300b and the conductor layers 301 and 302 are formed.

Specifically, as shown in FIG. 22, a hole 1003 is formed by irradiating the double-sided copper-clad laminate 1000 with a laser from the first surface F1 side using, for example, a CO ₂ laser, and a laser is emitted from the second surface F2 side. Is formed on the double-sided copper-clad laminate 1000 to form a hole 1004. The hole 1003 and the hole 1004 are formed at substantially the same position in the XY plane and are finally connected to form a through hole 300a penetrating the double-sided copper-clad laminate 1000. The laser irradiation on the first surface F1 and the laser irradiation on the second surface F2 may be performed simultaneously or one surface at a time. After the through hole 300a is formed, it is preferable to perform desmearing on the through hole 300a. Further, the surface of the copper foils 1001 and 1002 may be blackened prior to laser irradiation in order to increase the absorption efficiency of laser light. The through hole 300a may be formed by a method other than laser, such as drilling or etching. However, fine processing is easy with laser processing. In particular, when the through hole 300a has a diameter (maximum diameter) of 100 μm or less, drilling becomes difficult, and laser processing is effective.

  Subsequently, as shown in FIG. 23, for example, a copper plating 1005 is formed on the copper foils 1001 and 1002 and in the through holes 300a by, for example, a panel plating method. Specifically, first, electroless plating is performed, and then plating 1005 is formed by performing electrolytic plating using the electroless plating film as a seed layer using a plating solution. Thereby, the through hole 300a is filled with the plating 1005, and the through hole conductor 300b is formed.

  Subsequently, the conductive layers formed on the first surface F1 and the second surface F2 of the substrate 100 are patterned using, for example, an etching resist and an etching solution. Specifically, each conductor layer is covered with an etching resist having a pattern corresponding to the conductor layers 301 and 302, and a portion of each conductor layer that is not covered with the etching resist (part exposed at the opening of the etching resist) Remove by etching. Thereby, as shown in FIG. 24, conductor layers 301 and 302 are formed on the first surface F1 and the second surface F2 of the substrate 100, respectively. Note that the etching is not limited to wet, and may be dry.

  Subsequently, in step S33 of FIG. 20, the cavity R10 is formed in the substrate 100 (core substrate). In the present embodiment, the cavity R10 is formed by irradiating the substrate 100 with a laser. Specifically, for example, by irradiating a laser so as to draw a quadrangle, a region corresponding to the cavity R10 in the substrate 100 is cut out from the surrounding portion. The laser irradiation angle is set to be substantially perpendicular to the first surface F1 of the substrate 100, for example. Thereby, as shown in FIG. 25, cavity R10 is formed. In this embodiment, since the cavity R10 is formed by a laser, the cavity R10 can be easily obtained. The cavity R10 is a space for accommodating the inductor component 200.

  Subsequently, the inductor component 200 is disposed in the cavity R10 of the substrate 100 in step S34 of FIG.

  Specifically, as shown in FIG. 26, a carrier 1006 made of, for example, PET (polyethylene terephthalate) is provided on one side of the substrate 100 (for example, the second surface F2). Thereby, one opening of the cavity R10 (through hole) is closed by the carrier 1006. In this embodiment, the carrier 1006 is made of an adhesive sheet (for example, a tape) and has adhesiveness on the substrate 100 side. The carrier 1006 is bonded to the substrate 100 by lamination, for example.

  Subsequently, as shown in FIG. 27, the inductor component 200 is inserted into the cavity R10 from the opposite side (Z1 side) to the opening where the cavity R10 (through hole) is blocked. The inductor component 200 is inserted into the cavity R10 by a component mounting machine, for example. For example, the inductor component 200 is held by a vacuum chuck or the like, conveyed to the upper side (Z1 side) of the cavity R10, and then descends along the vertical direction, and is inserted into the cavity R10. Thereby, as shown in FIG. 28, the inductor component 200 is arrange | positioned on the carrier 1006 (adhesive sheet). Note that it is preferable to use an alignment mark when positioning the inductor component 200. By doing so, it is considered that the alignment accuracy between the inductor component 200 and the cavity R10 can be improved.

Subsequently, in step S35 of FIG. 20, as shown in FIG. 29A, in the semi-cured state, the first side of the substrate 100 on the opposite side (Z1 side) to the opening where the cavity R10 (through hole) is blocked is formed. An insulating layer 101 (first interlayer insulating layer) is disposed on the surface F1 and the third surface F3 of the inductor component 200. The insulating layer 101 is made of, for example, an epoxy resin. Note that the insulating layer 101 may include a core material such as glass cloth.
Subsequently, as shown in FIG. 29B, by pressing the insulating layer 101 in a semi-cured state, the resin flows out from the insulating layer 101 and flows into the cavity R10. As a result, as shown in FIG. 30, the insulator 101a (resin constituting the insulating layer 101) is filled in the gap R1 between the substrate 100 and the inductor component 200 in the cavity R10. At this time, if the gap between the substrate 100 and the inductor component 200 is narrow, even if the fixing of the inductor component 200 is weak, the resin flows into the cavity R10, so that the displacement of the inductor component 200 and an undesirable inclination are unlikely to occur. . The insulator 101a has a larger thermal expansion coefficient than both the substrate 100 and the inductor component 200.

  When the insulator 101a is filled in the cavity R10, the filling resin (insulator 101a) and the inductor component 200 are temporarily welded. Specifically, the holding resin has a degree of holding power that can support the inductor component 200 on the filled resin by heating. As a result, the inductor component 200 supported by the carrier 1006 is supported by the filling resin. Thereafter, the carrier 1006 is removed.

  At this stage, the insulator 101a (filling resin) and the insulating layer 101 are only semi-cured and are not completely cured. However, the invention is not limited to this. For example, the insulator 101a and the insulating layer 101 may be completely cured at this stage.

  Subsequently, build-up is performed on the second surface F2 side of the substrate 100 in step S36 of FIG.

  Specifically, as illustrated in FIG. 31, the insulating layer 102 (second interlayer insulating layer) is disposed on the second surface F <b> 2 of the substrate 100. The insulating layer 102 is made of, for example, an epoxy resin. Subsequently, the insulating layer 102 is bonded to the substrate 100 and the inductor component 200 in a semi-cured state by, for example, pressing, and then heated to cure each of the insulating layers 101 and 102. In this embodiment, since the resin filled in the cavity R10 is cured after removing the adhesive sheet (carrier 1006), the insulating layers 101 and 102 can be cured simultaneously. Then, by simultaneously curing the insulating layers 101 and 102 on both sides, warpage of the substrate 100 is suppressed, so that the substrate 100 can be easily thinned.

  In step S37 of FIG. 20, a via conductor and a conductor layer are formed.

  Specifically, as shown in FIG. 32, holes 311a and 312a (via holes) are formed in the insulating layer 101, for example, by laser, and holes 322a (via holes) are formed in the insulating layer 102. Each of the holes 311 a and 312 a penetrates the insulating layer 101, and the hole 322 a penetrates the insulating layer 102. The hole 311a reaches the third conductor pattern 207 of the inductor component 200, and each of the holes 312a and 322a reaches the through-hole conductor 300b. Then, desmear is performed as needed.

  Subsequently, as shown in FIG. 33, for example, copper electroless plating films 1007 and 1008 are formed on the surfaces of the insulating layers 101 and 102 including the sidewalls of the holes 311a, 312a and 322a by, for example, chemical plating. Prior to electroless plating, a catalyst made of palladium or the like is adsorbed on the surfaces of the insulating layers 101 and 102, for example, by dipping.

  Subsequently, as shown in FIG. 34, a plating resist 1009 having an opening 1009a is formed on the main surface (on the electroless plating film 1007) on the first surface F1 side by the lithography technique or printing, and the second surface. A plating resist 1010 having an opening 1010a is formed on the main surface on the F2 side (on the electroless plating film 1008). The openings 1009a and 1010a have patterns corresponding to the conductor layers 110 and 120 (FIG. 1), respectively.

  Subsequently, as shown in FIG. 35, for example, copper electrolytic plating 1011 and 1012 are formed in the openings 1009a and 1010a of the plating resists 1009 and 1010, for example, by pattern plating. Specifically, copper that is a material to be plated is connected to the anode, and electroless plating films 1007 and 1008 that are materials to be plated are connected to the cathode and immersed in a plating solution. Then, a direct current voltage is applied between the two electrodes to pass a current, and copper is deposited on the surfaces of the electroless plating films 1007 and 1008. As a result, the holes 311a and 312a and the hole 322a are filled with the electrolytic plating 1011 and 1012, respectively, and via conductors 311b, 312b and 322b made of, for example, copper plating are formed.

  Thereafter, the plating resists 1009 and 1010 are removed by, for example, a predetermined stripping solution, and then unnecessary electroless plating films 1007 and 1008 are removed, thereby forming the conductor layers 110 and 120 as shown in FIG. The

  The seed layer for electrolytic plating is not limited to the electroless plating film, and a sputtered film or the like may be used as the seed layer instead of the electroless plating films 1007 and 1008.

  Subsequently, in step S38 of FIG. 20, a solder resist 11 having an opening 11a and a solder resist 12 having an opening 12a are formed on the insulating layers 101 and 102, respectively (see FIG. 1). The conductor layers 110 and 120 are covered with solder resists 11 and 12 except for predetermined portions (pads P1 and P2 and lands, etc.) located in the openings 11a and 12a, respectively. The solder resists 11 and 12 can be formed by, for example, screen printing, spray coating, roll coating, or lamination.

  Subsequently, by electroplating or sputtering, the corrosion resistance made of, for example, a Ni / Au film on the conductor layers 110 and 120, specifically on the surfaces of the pads P1 and P2 (see FIG. 1) not covered with the solder resists 11 and 12, respectively. Form a layer. Moreover, you may form the corrosion-resistant layer which consists of an organic protective film by performing OSP process.

  Thus, the first buildup part B1 composed of the insulating layer 101 and the conductor layer 110 is formed on the first surface F1 of the substrate 100, and the insulating layer 102 and the conductor layer 120 are formed on the second surface F2 of the substrate 100. A second buildup part B2 composed of As a result, the wiring board 10 (FIG. 1) of this embodiment is completed. Thereafter, if necessary, an electrical test (inductance, Q value, insulation, etc.) of the inductor component 200 is performed.

  The manufacturing method of this embodiment is suitable for manufacturing the wiring board 10. With such a manufacturing method, it is considered that a good wiring board 10 can be obtained at low cost.

  The wiring board 10 of this embodiment can be electrically connected to, for example, an electronic component or another wiring board. For example, an electronic component (for example, an IC chip) can be mounted on the pad P2 of the wiring board 10 by solder or the like. Further, the wiring board 10 can be mounted on another wiring board (for example, a mother board) by the pad P1. The wiring board 10 of this embodiment can be used as a circuit board of a mobile phone, for example.

  Next, the inductor component 210 of the 2nd example of embodiment which concerns on this invention is demonstrated with reference to FIG. 37A. FIG. 37A is a cross-sectional view showing the inductor component 210 of the second example according to the present embodiment.

  The configuration of the inductor component 210 is similar to the inductor component 200 described above. That is, the first conductor pattern 212 is formed on the insulating substrate 211. On the first conductor pattern 212, a first magnetic layer 222d containing magnetic particles and a first insulating material is formed. A first insulating layer 213 made of a second insulating material is formed on the first magnetic layer 222d. A second conductor pattern 216 is formed on the first insulating layer 213. The first conductor pattern 212 and the second conductor pattern 216 are electrically connected by a via conductor 215b that penetrates the magnetic layer 222d and the resin layer 213.

  On the second conductor pattern 216, a second magnetic layer 222e containing magnetic particles and a first insulating material is formed. A second insulating layer 217 made of a second insulating material is formed on the second magnetic layer 222e. A third conductor pattern 219 is formed on the second insulating layer 217.

  Thus, the configuration of the inductor component 210 is similar to the inductor component 200, but the manufacturing method is different. A method for manufacturing the inductor component 210 will be described with reference to FIG. 37B and the like. FIG. 37B is a flowchart showing a schematic content and procedure of a manufacturing method of the inductor component 210 of the second example according to the present embodiment.

  In step S41, an insulating layer (insulating substrate) 211 and a conductor layer 212a are formed on the support 420. Specifically, as shown in FIG. 38, a support body 420 is prepared as a base for manufacturing the inductor component 210. The support body 420 is an insulator in which a copper foil 430 is formed on one surface F11.

  Subsequently, as shown in FIG. 39, for example, a prepreg having a metal foil is laminated on the copper foil 430 of the support 420 having the copper foil 430 formed on one surface F11. Subsequently, for example, copper plating is formed by performing electroplating using a metal foil as a seed layer using a plating solution. Then, the prepreg is cured by heating. Thereby, an insulating layer (insulating substrate) 211 made of a cured prepreg, and a conductor layer 212a made of a prepreg metal foil and copper plating are formed.

  Subsequently, in step S42 in FIG. 37B, the conductor layer 212a is patterned using, for example, an etching resist and an etching solution. Specifically, the conductor layer 212a is covered with an etching resist having a pattern corresponding to the first conductor pattern 212, and a portion of the conductor layer 212a that is not covered with the etching resist (a portion exposed at the opening of the etching resist) is formed. And removed by etching. Thereby, as shown in FIG. 40, the first conductor pattern 212 is formed on the insulating substrate 211. Note that the etching is not limited to wet, and may be dry.

  Subsequently, in step S43 of FIG. 37B, the magnetic paste 221d is applied. Specifically, as shown in FIG. 41, a magnetic paste 221d is applied onto the first conductor pattern 212. Thereby, the uncured magnetic paste 221d enters a portion where the first conductor pattern 212 is not formed. The magnetic paste 221d can be applied by, for example, screen printing, spray coating, roll coating, or lamination. Thereafter, the magnetic paste 221d is heat-cured to form the first magnetic layer 222d.

Subsequently, in step S44 of FIG. 37B, the insulating layer 213 is stacked and pressed. Specifically, as shown in FIG. 42, for example, an insulating layer 213 having a metal foil 214 is laminated on the first magnetic layer 222d. The insulating layer 213 is made of, for example, an epoxy resin. Then, the insulating layer 213 having the metal foil 214 is pressed and pressed against the first magnetic layer 222d. Thereafter, the insulating layer 213 is cured by heating.
At this time, the metal foil 214 may be omitted. In that case, a conductor pattern is formed on the insulating layer 213 by, for example, a semi-additive method.

  Subsequently, in step S45 of FIG. 37B, the via conductor 215b and the conductor layer 216a are formed. Specifically, as shown in FIG. 43, holes 215a (via holes) are formed in the first magnetic layer 222d, the insulating layer 213, and the metal foil 214 by, for example, a laser. The hole 215a passes through the first magnetic layer 222d, the insulating layer 213, and the metal foil 214. The hole 215a reaches the first conductor pattern 212 of the inductor component 210. Then, desmear is performed as needed.

  Subsequently, an electroless plating film of, for example, copper is formed on the metal foil 214 and in the hole 215a by, for example, a chemical plating method. Prior to electroless plating, a catalyst made of palladium or the like is adsorbed on the surface of the hole 215a, for example, by dipping.

  Subsequently, for example, copper electroplating is formed on the electroless plating film. Specifically, copper as a material to be plated is connected to the anode, and an electroless plating film as a material to be plated is connected to the cathode, and immersed in a plating solution. And a direct current voltage is applied between both electrodes, and an electric current is sent, and copper is deposited on the surface of an electroless plating film. As a result, as shown in FIG. 44, the hole 215a is filled with electrolytic plating, and a via conductor 215b made of, for example, copper plating is formed. Then, a conductor layer 216a is formed on the insulating layer 213.

  Subsequently, in step S46 of FIG. 37B, the conductor layer 216a is patterned using, for example, an etching resist and an etching solution. Specifically, the conductor layer 216a is covered with an etching resist having a pattern corresponding to the second conductor pattern 216, and a portion of the conductor layer 216a that is not covered with the etching resist (a portion exposed at the opening of the etching resist) is covered. And removed by etching. Thereby, as shown in FIG. 45, the second conductor pattern 216 is formed on the insulating layer 213. Note that the etching is not limited to wet, and may be dry.

  Subsequently, in step S47 in FIG. 37B, the magnetic paste 221e is applied again. Specifically, as shown in FIG. 46, the magnetic paste 221e is applied on the second conductor pattern 216. Thereby, the uncured magnetic paste 221e enters a portion where the second conductor pattern 216 is not formed. The magnetic paste 221e can be applied by, for example, screen printing, spray coating, roll coating, or lamination. Thereafter, the magnetic paste 221e is heat-cured to form the second magnetic layer 222e.

  Subsequently, in step S48 of FIG. 37B, the insulating layer 217 is again laminated and pressed. Specifically, as shown in FIG. 47, for example, an insulating layer 217 having a metal foil 218 is stacked on the second magnetic layer 222e. Then, the insulating layer 217 having the metal foil 218 is pressed and pressed against the second magnetic layer 222e. Thereafter, the insulating layer 217 is cured by heating.

  Subsequently, the conductor layer 219a is formed in step S49 of FIG. 37B. Specifically, for example, an electroless plating film of copper is formed on the metal foil 218 by, for example, chemical plating. Subsequently, for example, copper electroplating is formed on the electroless plating film by pattern plating, for example. Specifically, copper as a material to be plated is connected to the anode, and an electroless plating film as a material to be plated is connected to the cathode, and immersed in a plating solution. And a direct current voltage is applied between both electrodes, and an electric current is sent, and copper is deposited on the surface of an electroless plating film. As a result, a conductor layer 219a is formed on the insulating layer 217 as shown in FIG.

  Subsequently, in step S50 of FIG. 37B, the conductive layer 219a is patterned using, for example, an etching resist and an etching solution. Specifically, the conductor layer 219a is covered with an etching resist having a pattern corresponding to the third conductor pattern 219, and a portion of the conductor layer 219a that is not covered with the etching resist (a portion exposed at the opening of the etching resist) is covered. And removed by etching. As a result, a third conductor pattern 219 is formed on the insulating layer 217 as shown in FIG. Note that the etching is not limited to wet, and may be dry.

  Subsequently, in step S51 of FIG. 37B, the support body 420 and the copper foil 430 are removed.

  Specifically, as shown in FIG. 50, the support 420 is removed. Subsequently, the copper foil 430 is removed by etching, for example. In this way, the inductor component 210 shown in FIG. 37A is manufactured.

  Next, an inductor component of a third example of the embodiment according to the invention will be described with reference to FIG. FIG. 51 is a cross-sectional view showing a third example of the inductor component 250 according to the present embodiment.

  As shown in FIG. 51, the inductor component 250 is configured around a core 252. The core 252 is made of, for example, an epoxy resin and a core material such as a glass cloth. The planar shape of the core 252 is, for example, a rectangle. The core 252 has two through holes, that is, a via hole 252a and a center hole 257a. A first conductor pattern 254 and a second conductor pattern 253 are formed on both surfaces of the core 252. The first conductor pattern 254 and the second conductor pattern 253 are electrically connected by a via conductor 252 b that penetrates the core 252.

  On the first conductor pattern 254 and the second conductor pattern 253, a magnetic layer 256 and a magnetic layer 255 made of the magnetic material 221 are respectively formed. The core hole 257a is also filled with the magnetic material 221 to form the core magnetic body 257b. The first conductor pattern 254, the second conductor pattern 253, and the via conductor 252b are all made of copper.

  51 are T1 = 30 μm, T2 = 20 μm, T3 = 60 μm, T4 = 20 μm, T5 = 30 μm, φ1 = 700 μm, and φ2 = 500 μm. These dimensions may be changed as appropriate.

  The shapes of the conductor patterns 253 and 254 of the inductor component 250 will be described with reference to FIG. FIG. 52 is a perspective view showing the shapes of the conductor patterns 253 and 254 of the inductor component 250.

  As shown in FIG. 52, the outer shapes of the conductor patterns 253 and 254 of the inductor component 250 are substantially rectangular. A through hole corresponding to the center hole 257a is provided at the center of the conductor patterns 253 and 254. The via conductor 252b is formed at the protruding end of the conductor pattern 254.

  With respect to the inductor component 250 having such a configuration, the inductor characteristics were measured at a frequency of 50 MHz. As a result of the measurement, the inductance (L) was 8.97 nH, the Q value was 45.57, and the inductor characteristic was excellent.

  Next, a fourth inductor component according to the embodiment of the present invention will be described with reference to FIG. FIG. 53 is a cross-sectional view showing a fourth inductor component 260 according to the present embodiment.

  As shown in FIG. 53, the inductor component 260 is configured with a core 262 as a center. The core 262 has a two-layer structure of an insulator, for example, an insulating layer 263 made of an epoxy resin and a magnetic layer 264 made of a magnetic material 221. The planar shape of the core 262 is, for example, a rectangle. A via hole 262a is formed in the core 262. A first conductor pattern 266 and a second conductor pattern 265 are formed on both surfaces of the core 262.

  The first conductor pattern 266 and the second conductor pattern 265 are electrically connected by a via conductor 262 b that penetrates the core 262. On the first conductor pattern 266 and the second conductor pattern 265, a magnetic layer 268 and a magnetic layer 267 made of the magnetic material 221 are respectively formed. The first conductor pattern 266, the second conductor pattern 265, and the via conductor 262b are all made of copper.

  53 are T1 = 30 μm, T2 = 20 μm, T4 = 20 μm, T5 = 30 μm, T6 = 30 μm, T7 = 50 μm, and φ3 = 300 μm. These dimensions may be changed as appropriate.

  With respect to the inductor component 260 having such a configuration, the inductor characteristics were measured at a frequency of 50 MHz. As a result of the measurement, the inductance (L) was 9.31 nH, the Q value was 46.32, and the inductor characteristic was excellent.

  For comparison, inductor characteristics were measured at a frequency of 50 MHz for a so-called air-core type inductor component that did not use any magnetic material. In FIG. 51 showing the inductor component 250, the air-core type inductor component does not have the center hole 257a in the core 252 and does not have the magnetic layer 256, the magnetic layer 255, and the core magnetic body 257b. As a result of the measurement, the inductance (L) was 4.73 nH, and the Q value was 26.44.

  As a result, it has been clarified that the inductor components 250 and 260 exhibit excellent magnetic characteristics by using the magnetic material 221 and have excellent inductor characteristics.

  The present invention is not limited to the above embodiment. For example, the seed layer for electrolytic plating is not limited to the electroless plating film, and a sputtered film or the like may be used as the seed layer instead of the electroless plating film.

  Regarding the other points, the sheet materials 220a, 220b, 230, the inductor components 200, 210, 250, 260, the configuration of the wiring board 10 and the magnetic material, and the types, performances, dimensions, materials, shapes, and layers of the components. The number or arrangement can be arbitrarily changed without departing from the spirit of the present invention.

  Moreover, the material of each conductor pattern is not limited to the above, and can be changed according to the application. For example, a metal material other than copper or a non-metal conductor material may be used as the conductor pattern material.

  The embodiment of the present invention has been described above. However, various modifications and combinations required for design reasons and other factors are not limited to the invention described in the “claims” or the “mode for carrying out the invention”. It should be understood that it is included in the scope of the invention corresponding to the specific examples described in the above.

  The sheet material according to the present invention is suitable for manufacturing a thin inductor component. The method for manufacturing a sheet material according to the present invention is suitable for manufacturing such a sheet material. The inductor component according to the present invention is suitable for being incorporated in a wiring board. The wiring board according to the present invention is suitable for realizing a circuit board such as a mobile phone. The magnetic material according to the present invention is suitable for manufacturing a thin inductor component.

DESCRIPTION OF SYMBOLS 10 Wiring board 11,12 Solder resist layer 100 Base material 101,102 Insulating layer 110,120 Conductor layer 200,210,250,260 Inductor component 201,211 Insulating layer (insulating substrate)
202, 212 First conductor pattern 202a, 212a First conductor layer 213 First insulating layer 205a, 215a, 252a, 262a, 311a, 312a, 322a Via hole 205b, 215b, 252b, 262b, 311b, 312b, 322b Via Conductor 206, 216 Second conductor pattern 206a, 216a Second conductor layer 207, 219 Third conductor pattern 207a, 219a Third conductor layer 213, 223a, 223b Resin layer 214, 218, 224a, 224b Metal foil 217 Second insulating layer 220a, 220b, 230 Sheet material 221, 221c, 221d, 221e Magnetic paste 222a, 222b, 222c, 222d, 222e, 255, 256, 264, 267, 268 Magnetic layer 225, 225c First insulation material 226, 226c Magnetic particles 226a Concavities and convexities 252, 262 Cores 253, 254, 265, 266 Conductor pattern 257a Core through hole 300a Through hole 300b Through hole conductor 301 Third conductor layer 302 Fourth conductor layer 400, 420 Supports 410, 430 Copper foil F1 1st surface F2 2nd surface F3 3rd surface F4 4th surface F5 5th surface F6 6th surface F10, F11 surface R1 clearance R10 cavity (through-hole)

Claims (22)

A sheet material comprising a magnetic layer containing magnetic particles and a first insulating material,
A sheet material provided with a resin layer made of a second insulating material on at least one surface of the magnetic layer.   The sheet material according to claim 1, wherein a thickness of the magnetic layer is thicker than a thickness of the resin layer.   The sheet | seat material of Claim 1 or 2 which has metal foil on the surface of the said resin layer.   The sheet | seat material of Claim 3 with which the surface which contact | connects the said resin layer of the said metal foil is roughened.   The sheet material according to any one of claims 1 to 4, wherein an average particle diameter of the magnetic particles is in a range of 0.5 to 50 µm.   The sheet material according to any one of claims 1 to 5, wherein a glass transition temperature (Tg) of the first insulating material is 130 ° C or higher.   The sheet material according to any one of claims 1 to 6, wherein a volume content of the magnetic particles in the magnetic layer is in a range of 30 vol% to 70 vol%.   The magnetic particles are iron, soft magnetic iron alloy, nickel, soft magnetic nickel alloy, cobalt, soft magnetic cobalt alloy, soft magnetic iron (Fe) -silicon (Si) alloy, soft magnetic iron (Fe) -nitrogen (N ) Alloy, soft magnetic iron (Fe) -carbon (C) alloy, soft magnetic iron (Fe) -boron (B) alloy, soft magnetic iron (Fe) -phosphorus (P) alloy, soft magnetic iron ( The structure according to any one of claims 1 to 7, wherein the alloy is composed of at least one of an Fe) -aluminum (Al) alloy and a soft magnetic iron (Fe) -aluminum (Al) -silicon (Si) alloy. The sheet material described.   The first insulating material is epoxy resin, phenol resin, polybenzoxazole resin, polyphenylene resin, polybenzocyclobutene resin, polyarylene ether resin, polysiloxane resin, polyurethane resin, polyester resin, polyester urethane resin, fluorine resin, polyolefin The sheet | seat material of any one of Claims 1 thru | or 8 comprised from any one or more of resin, polycycloolefin resin, cyanate resin, polyphenylene ether resin, and polystyrene resin.   The sheet material according to any one of claims 1 to 9, wherein the second insulating material and the first insulating material are the same material.   The sheet material according to claim 1, wherein the surface of the magnetic layer has an uneven shape.   The sheet material according to claim 1, wherein the resin layer contains an inorganic filler.   The resin layer is composed of a resin in which at least two components, a component that is relatively soluble and a component that is relatively difficult to dissolve, are mixed in a solution used for the roughening treatment. The sheet material according to any one of 1 to 12.   The sheet material according to any one of claims 1 to 13, wherein a linear expansion coefficient of the resin layer is smaller than a linear expansion coefficient of the magnetic layer. A method for producing a sheet material comprising a magnetic layer containing magnetic particles and a first insulating material,
Mixing the magnetic particles and the first insulating material to produce the magnetic layer;
Providing a resin layer made of a second insulating material on at least one surface of the magnetic layer;
The manufacturing method of the sheet material containing.   The method for producing a sheet material according to claim 15, wherein the thickness of the magnetic layer is made thicker than the thickness of the resin layer. An inductor component having an interlayer insulating layer and an inductor conductive pattern thereon,
The interlayer insulating layer is an inductor component comprising a magnetic layer containing magnetic particles and a first insulating material, and a resin layer provided on at least one surface of the magnetic layer and made of a second insulating material.   The inductor component according to claim 17, wherein a thickness of the magnetic layer is greater than a thickness of the resin layer.   The inductor component according to claim 17 or 18, wherein a surface of the resin layer in contact with the conductor pattern is roughened. A core substrate having an opening formed on at least one surface; an inductor component housed in the opening; and a filling resin filling the opening to fix the inductor component. A wiring board,
The inductor component has an interlayer insulating layer and an inductor conductor pattern thereon,
The interlayer insulating layer is a wiring board comprising a magnetic layer containing magnetic particles and a first insulating material, and a resin layer provided on at least one surface of the magnetic layer and made of a second insulating material.   The thickness of the said magnetic body layer is a wiring board of Claim 20 thicker than the thickness of the said resin layer. Having magnetic particles and an insulating material,
The linear expansion coefficient in the cured state is 40 ppm / K or less.
Magnetic material.

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