CN109786060A - Integral mold voltage inductance soft magnetism powder and preparation method thereof - Google Patents
Integral mold voltage inductance soft magnetism powder and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a kind of Integral mold voltage inductance soft magnetism powders and preparation method thereof, the soft magnetism powder uses partial size to be prepared for metal soft magnetic alloy powder, resin system, passivator and the lubricant of 16-80um, the weight of passivator is the 0.05%~2% of metal soft magnetic alloy powder weight, the weight of lubricant is the 0.1%~5% of metal soft magnetic alloy powder weight, and the weight of resin system is the 0.5%~8% of metal soft magnetic alloy powder weight；Advantage is that have good high and low temperature resistance.
Description
Technical field
The present invention relates to a kind of soft magnetism powders, more particularly, to a kind of Integral mold voltage inductance soft magnetism powder and its preparation side
Method.
Background technique
A kind of molding inductance that Integral mold voltage inductance uses integral forming process to be prepared, main material includes soft magnetism
Coil and electrode pin are placed in soft magnetism powder and are pressed by powder, coil and electrode pin, obtain after then solidifying
It is molded inductance, coil is located at the inside of the inductance green body of soft magnetism powder formation, and electrode pin is drawn out to outside out of inductance green body.
Integral mold voltage inductance has many advantages, such as that magnetic circuit closure, electromagnetism interference, packing density are high and especially suitable for SMT technique, in electricity
It is used in sub-circuit mainly as energy storage or filtering device.Currently, Integral mold voltage inductance has been widely used in industrial control mainboard, has shown
Card, tablet computer, laptop, mobile unit, distribution power-supply system, DC/DC converter, LED street lamp equipment, communication apparatus
With the electronics industry field such as Medical Devices.
In order to adapt to downstream electronic industry requirement, electronic component is sent out towards small size, high-power and high frequency direction
Exhibition.And high-power small size makes the power density of electronic component become larger, therefore the heat accumulation under operating condition leads to element
Temperature increases, and excessively high temperature influences element manipulation efficiency, and reduces the mechanical strength of component body.
Integral mold voltage inductance coil is located at the inside of the inductance green body of soft magnetism powder formation, and high-temperature stability is by two sides
Face is rung, first is that the temperature tolerance of coil enameled wire, second is that the temperature tolerance of soft magnetism powder.Soft magnetism powder is the base of Integral mold voltage inductance
Body material, the performance of Integral mold voltage inductance depend primarily on soft magnetism powdery row material characteristic used.In general, in soft magnetism powder formulation
The high temperature resistance of resin is worst.If the high temperature resistance of resin is bad, Integral mold voltage inductance high temperature resistance is also bad, because
The high-temperature stability of this Integral mold voltage inductance depends primarily on the high-temperature stability of resin system in soft magnetism powder composition.
A kind of high temperature resistant injection molding of high magnetic applications range is disclosed in the Chinese patent of Publication No. CN107936558A
The preparation method of the preparation method of bonded magnetic material, the high temperature resistant injection molding adhesion magnetic material of the high magnetic applications range is logical
It crosses and nanometer ferrite base, graphene, copper powder, carbon black, nanometer silicon carbide and high molecular material is added in formula.Although using
The magnetic material of this method preparation has high-temperature stability, but the substances such as graphene used in it, copper powder, carbon black all have
Good electric conductivity, and be integrally formed molding inductance and height is required to matrix insulating properties, thus it is unable to satisfy Integral mold voltage inductance
Conduction needs are not used to prepare Integral mold voltage inductance.
A kind of preparation side of high-temperature-resmetalt metalt soft magnetic powder core is disclosed in the Chinese patent of Publication No. CN103456479A
Method, this method first mix ceramic powders in reduced iron powder, and magnetic powder is then passivated processing, and bonding is added
Compression moulding after agent, lubricant, finally annealing obtains soft magnetic-powder core between 250~500 DEG C.The preparation method is by adding
Add ceramic powders and made annealing treatment at 250~500 DEG C of high temperature, to reach the use temperature for improving ferrocart core, improves iron
The purpose of the loss of powder core.And there is Integral mold voltage inductance coil to be embedded in the unique texture inside magnetic powder, the paint of coil
Envelope curve film layer is difficult to bear 250~500 DEG C of high temperature, therefore ceramic powders and the high temperature anneal can not be applied to Integral mold piezoelectricity
The high temperature resistance in sense field is promoted.
On the other hand, special service condition has special requirement to the resistance to temperature difference impact property of element, such as automotive field and
Aerospace field etc. will appear the big use condition of high-low temperature difference.In addition, compared with high latitude area and polar region use environment pair
The resistance to low temperature of Integral mold voltage inductance claims.The above reason requires Integral mold voltage inductance that should have excellent high-low temperature resistant
Characteristic.
Summary of the invention
The first technical problem to be solved by the present invention is to provide a kind of Integral mold voltage inductance with high-low temperature resistant characteristic
With soft magnetism powder.
The present invention solves technical solution used by one of above-mentioned technical problem are as follows: a kind of Integral mold voltage inductance soft magnet powder
Body uses partial size to be prepared for metal soft magnetic alloy powder, resin system, passivator and the lubricant of 16-80um, described
The weight of passivator is the 0.05%~2% of the metal soft magnetic alloy powder weight, and the weight of the lubricant is institute
The 0.1%~5% of the metal soft magnetic alloy powder weight stated, the weight of the resin system are the metal soft magnetic alloy
The 0.5%~8% of powder weight.
The resin system includes the first resin Composition and the second resin Composition, the weight of first resin Composition
It is the 70%~100% of the resin system weight, the second resin Composition weight is the resin system weight
0%~30%；First resin Composition includes resin component A of the glass transition temperature more than or equal to 180 DEG C, glass
Change transition temperature be more than or equal to 155 DEG C and the resin component B less than 180 DEG C, glass transition temperature be more than or equal to 125 DEG C and small
In the resin component D and glass of 155 DEG C of resin component C, glass transition temperature more than or equal to 100 DEG C and less than 125 DEG C
Change transition temperature and is more than or equal to 75 DEG C and the resin component E less than 100 DEG C；The weight of the resin component A is described the
The 10%~30% of one resin Composition weight；The weight of the resin component B is the first resin Composition weight
50%~80%；The weight of the resin component C is the 0%~30% of the first resin Composition weight；The tree
The weight of rouge ingredient D is the 0%~20% of the first resin Composition weight；The weight of the resin component E is described
The first resin Composition weight 0%~20%；Second resin Composition includes that glass transition temperature is more than or equal to 0 DEG C
And the resin component G of resin component F and glass transition temperature less than 0 DEG C less than 75 DEG C；The weight of the resin component F
Amount is the 50%~100% of the second resin Composition weight；The weight of the resin component G is second resin
The 0%~50% of composition weight.In the product, the glass transition temperature of the first resin Composition is not less than 75 DEG C, and first
Resin Composition is dominant in the accounting in resin system, accounting >=70%, is conducive to resin system and protects under 155 DEG C of hot environments
Hold its performance；Resin component B of the glass transition temperature between 155 DEG C~180 DEG C is in the first resin in first resin Composition
Weight is dominant in component, weight accounting range 50%~80%, is conducive to resin system and protects at 155 DEG C and under the conditions of used above
Its performance is held, the resin component B of glass transition temperature >=180 DEG C accounts for the first resin Composition weight in the first resin Composition
10%~30%, the high-temperature behavior of resin system is further ensured, glass transition temperature is less than 155 in the first resin Composition
DEG C the addition of resin component C, D, E ensure that resin system at normal temperature there is preferable toughness, 50%~100% vitrifying
Transition temperature is more than or equal to 0 DEG C and the tree of resin component F and 0%~50% glass transition temperature less than 0 DEG C less than 75 DEG C
The addition of rouge ingredient G makes resin system still have certain toughness under the conditions of -55 DEG C of low temperature, and is unlikely to embrittlement or intensity change
Small, resin system of the invention uses various kinds of resin collocation mode as a result, is deployed by special ratios, comprehensive every kind of resin at
The advantages of dividing, the disadvantage of various resins respectively is avoided, is conducive to resin system and keeps its mechanical property under high temperature and cryogenic conditions
Can, guarantee that Integral mold voltage inductance has preferable high-low temperature resistant characteristic with soft magnetism powder.
The resin component A is phenolic resin and glass transition temperature of the glass transition temperature more than or equal to 180 DEG C
Degree is more than or equal to the mixture of any one or two kinds in 180 DEG C of epoxy resin；The resin component B is vitrifying
Transition temperature is more than or equal to 155 DEG C and the phenolic resin less than 180 DEG C and glass transition temperature are more than or equal to 155 DEG C and are less than
The mixture of any one or two kinds in 180 DEG C of epoxy resin；The resin component C is that glass transition temperature is big
In being equal to 125 DEG C and organic siliconresin less than 155 DEG C, glass transition temperature are more than or equal to 125 DEG C and not less than 155 DEG C
Saturated polyester resin, glass transition temperature are more than or equal to 125 DEG C and phenolic resin and glass transition temperature less than 155 DEG C
In epoxy resin more than or equal to 125 DEG C and less than 155 DEG C any one or at least two conjunction object；The resin at
Point D is glass transition temperature is more than or equal to 100 DEG C and the organic siliconresin less than 125 DEG C, glass transition temperature are greater than etc.
Unsaturated polyester resin, glass transition temperature in 100 DEG C and less than 125 DEG C are more than or equal to 100 DEG C and the phenol less than 125 DEG C
Urea formaldehyde and glass transition temperature be more than or equal in 100 DEG C and the epoxy resin less than 125 DEG C any one or at least
Two kinds of conjunction object；The resin component E is that glass transition temperature is more than or equal to 75 DEG C and the organosilicon tree less than 100 DEG C
Rouge, glass transition temperature are more than or equal to 75 DEG C and the unsaturated polyester resin less than 100 DEG C, glass transition temperature is greater than etc.
Phenolic resin and glass transition temperature in 75 DEG C and less than 100 DEG C are more than or equal to 75 DEG C and the epoxy resin less than 100 DEG C
In any one or at least two conjunction object；The resin component F is that glass transition temperature is more than or equal to 0 DEG C and small
It is greater than in polypropylene, the glass transition temperature of 75 DEG C of polyethylene, glass transition temperature more than or equal to 0 DEG C and less than 75 DEG C
Polyvinyl chloride and glass transition temperature equal to 0 DEG C and less than 75 DEG C are more than or equal to 0 DEG C and the polymethyl less than 75 DEG C
In acid esters any one or at least two conjunction object；The resin component G is that glass transition temperature is poly- less than 0 DEG C
The polypropylene of ethylene, glass transition temperature less than 0 DEG C, polyvinyl chloride of the glass transition temperature less than 0 DEG C and vitrifying turn
In polymethyl methacrylate of the temperature less than 0 DEG C any one or at least two conjunction object.In the product, resin at
Phenolic resin or epoxy resin of the A using glass transition temperature more than or equal to 180 DEG C is divided to compound, resin component B is adopted
With glass transition temperature higher than 155 DEG C phenolic resin or epoxy resin compound, phenolic resin have it is heat-resisting, it is resistance to combustion and
The high feature of heat distortion temperature after solidification, epoxy resin have the characteristics that adhesion strength is strong, cohesive force is big, shrinking percentage is small and heat-resisting,
Therefore the service life of soft magnetism powder at high temperature, and phenolic resin and epoxy can be promoted using phenolic resin and epoxy resin
Resin further enhances the service performance of soft magnetism powder, resin component there are also the excellent and corrosion resistant feature of water-fast, insulating properties
C, except phenolic resin and epoxy resin are also comprising organic siliconresin and unsaturated polyester resin, the Si- of organic siliconresin in D, E
O key has higher bond energy (363kJ/mol), so more stable, heat resistance and high temperature resistance are very high, generally its heat
Stability boundary is up to 200~250 DEG C, and the mechanical property after organic siliconresin solidifies is not high, and cured strength is than phenolic aldehyde tree
Rouge and epoxy resin are low, therefore resin component C, D, E proportion in the first resin are less, ask 0%~30%, 0% respectively
~20%, 0%~20%.The temperature tolerance of soft magnetism powder not only can be improved in this way, but also can guarantee strong after inductance press curing
Degree.
The metal soft magnetic alloy powder include iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron dust and
One or more of reduced iron powder；The passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；Institute
The lubricant stated includes one or more of zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate.It should
In product, metal soft magnetic alloy powder itself has high-low temperature resistant characteristic, and passivation is occurring for passivator instead with soft magnetic metal powder
Ying Houhui forms the oxide passivation layer of one layer of iron on metal soft magnetic alloy powder surface, has characteristic resistant to high temperature；It is passivated simultaneously
Layer has excellent insulating properties, and insulating properties reduces the degree that the loss of inductance internal vortex occurs, it is suppressed that the temperature on inductance surface
Degree rises, zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate decomposition temperature with higher, main
Decomposition temperature meets the application demand at a temperature of -55 DEG C~155 DEG C at 400 DEG C or more.
Compared with prior art, the advantages of molding inductance of the invention soft magnetism powder, is to have by using itself resistance to
The metal soft magnetic alloy powder of property at high and low temperature is as main magnetisable material, by the addition of 0.05%~2% passivator, in gold
Belong to the passivation layer that soft-magnetic alloy powder Surface Creation has high temperature resistant and high-insulativity, especially resin system, using a variety of trees
The advantages of rouge collocation mode, is deployed by special ratios, comprehensive every kind of resin, avoids the disadvantage of various resins respectively, is conducive to
Resin keeps its mechanical property under high temperature and cryogenic conditions, thereby guarantees that Integral mold voltage inductance soft magnetism powder tool of the invention
There is high-low temperature resistant characteristic.
The second technical problem to be solved by the present invention is to provide a kind of preparation side of Integral mold voltage inductance soft magnetism powder
Method has high-low temperature resistant characteristic using the molding inductance soft magnetism powder that the preparation method is prepared.
The present invention solves technical solution used by the two of above-mentioned technical problem are as follows: a kind of Integral mold voltage inductance soft magnet powder
The preparation method of body, the Integral mold voltage inductance with soft magnetism powder include partial size be 16-80um metal soft magnetic alloy powder,
Resin system, passivator and lubricant, the weight of the passivator are the metal soft magnetic alloy powder weight
0.05%~2%, the weight of the lubricant is the 0.1%~5% of the metal soft magnetic alloy powder weight, described
The weight of resin system is the 0.5%~8% of the metal soft magnetic alloy powder weight, specific preparation process are as follows:
(1) metal soft magnetic alloy powder, resin system, passivator and the lubrication of corresponding weight are weighed respectively according to the proportion
Agent；
(2) passivator is dissolved and obtains passivator solution in a solvent, in passivator solution, passivator and solvent
Weight proportion be 1:20~1:200, the solvent of the passivator solution is any one in water, alcohol and acetone；
(3) passivator solution is mixed with metal soft magnetic alloy powder, by mixed passivator solution and soft magnetic metal
Alloy powder is maintained at 40 degree and is stirred after being heated up to 40 degree, mixing time >=30 minute then raise the temperature to 50 DEG C
~200 DEG C, so that the solvent in passivator solution is volatilized completely and obtain the first dry powder；
(4) resin system is dissolved and obtains resin system solution in a solvent, in resin system solution, resinite
The weight proportion of system and solvent is 1:5~1:20, and the solvent of the resin system solution is any in water, alcohol and acetone
It is a kind of；
(5) it is stirred after mixing first powder with the resin system solution, mixing time >=40min, with
It is heated to 50~80 DEG C afterwards the solvent in the resin system solution volatilizees, obtains the second powder that partial size is 100-700um
End；
(6) lubricant and second powder are mixed and stirred for uniformly, obtaining Integral mold voltage inductance with soft
Magnetic powder body.
The resin system includes the first resin Composition and the second resin Composition, the weight of first resin Composition
It is the 70%~100% of the resin system weight, the second resin Composition weight is the resin system weight
0%~30%；First resin Composition includes resin component A of the glass transition temperature more than or equal to 180 DEG C, glass
Change transition temperature be more than or equal to 155 DEG C and the resin component B less than 180 DEG C, glass transition temperature be more than or equal to 125 DEG C and small
In the resin component D and glass of 155 DEG C of resin component C, glass transition temperature more than or equal to 100 DEG C and less than 125 DEG C
Change transition temperature and is more than or equal to 75 DEG C and the resin component E less than 100 DEG C；The weight of the resin component A is described the
The 10%~30% of one resin Composition weight；The weight of the resin component B is the first resin Composition weight
50%~80%；The weight of the resin component C is the 0%~30% of the first resin Composition weight；The tree
The weight of rouge ingredient D is the 0%~20% of the first resin Composition weight；The weight of the resin component E is described
The first resin Composition weight 0%~20%；Second resin Composition includes that glass transition temperature is more than or equal to 0 DEG C
And the resin component G of resin component F and glass transition temperature less than 0 DEG C less than 75 DEG C；The weight of the resin component F
Amount is the 50%~100% of the second resin Composition weight；The weight of the resin component G is second resin
The 0%~50% of composition weight.
The resin component A is phenolic resin and glass transition temperature of the glass transition temperature more than or equal to 180 DEG C
Degree is more than or equal to the mixture of any one or two kinds in 180 DEG C of epoxy resin；The resin component B is vitrifying
Transition temperature is more than or equal to 155 DEG C and the phenolic resin less than 180 DEG C and glass transition temperature are more than or equal to 155 DEG C and are less than
The mixture of any one or two kinds in 180 DEG C of epoxy resin；The resin component C is that glass transition temperature is big
In being equal to 125 DEG C and organic siliconresin less than 155 DEG C, glass transition temperature are more than or equal to 125 DEG C and not less than 155 DEG C
Saturated polyester resin, glass transition temperature are more than or equal to 125 DEG C and phenolic resin and glass transition temperature less than 155 DEG C
In epoxy resin more than or equal to 125 DEG C and less than 155 DEG C any one or at least two conjunction object；The resin at
Point D is glass transition temperature is more than or equal to 100 DEG C and the organic siliconresin less than 125 DEG C, glass transition temperature are greater than etc.
Unsaturated polyester resin, glass transition temperature in 100 DEG C and less than 125 DEG C are more than or equal to 100 DEG C and the phenol less than 125 DEG C
Urea formaldehyde and glass transition temperature be more than or equal in 100 DEG C and the epoxy resin less than 125 DEG C any one or at least
Two kinds of conjunction object；The resin component E is that glass transition temperature is more than or equal to 75 DEG C and the organosilicon tree less than 100 DEG C
Rouge, glass transition temperature are more than or equal to 75 DEG C and the unsaturated polyester resin less than 100 DEG C, glass transition temperature is greater than etc.
Phenolic resin and glass transition temperature in 75 DEG C and less than 100 DEG C are more than or equal to 75 DEG C and the epoxy resin less than 100 DEG C
In any one or at least two conjunction object；The resin component F is that glass transition temperature is more than or equal to 0 DEG C and small
It is greater than in polypropylene, the glass transition temperature of 75 DEG C of polyethylene, glass transition temperature more than or equal to 0 DEG C and less than 75 DEG C
Polyvinyl chloride and glass transition temperature equal to 0 DEG C and less than 75 DEG C are more than or equal to 0 DEG C and the polymethyl less than 75 DEG C
In acid esters any one or at least two conjunction object；The resin component G is that glass transition temperature is poly- less than 0 DEG C
The polypropylene of ethylene, glass transition temperature less than 0 DEG C, polyvinyl chloride of the glass transition temperature less than 0 DEG C and vitrifying turn
In polymethyl methacrylate of the temperature less than 0 DEG C any one or at least two conjunction object.
The metal soft magnetic alloy powder include iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron dust and
One or more of reduced iron powder；The passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；Institute
The lubricant stated includes one or more of zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate.
Compared with prior art, the advantages of Integral mold voltage inductance of the invention soft magnetism raw powder's production technology, is to pass through
The addition of 0.05%~2% passivator, it is ensured that there is high temperature resistant and high-insulativity in metal soft magnetic alloy powder Surface Creation
Passivation layer, the weight proportion of passivator and solvent is 1:20~1:200, it is ensured that passivator is filled with metal soft magnetic alloy powder
Divide mixing, the passivating process of homogeneous reaction, the mixing time of 30min under the conditions of 40 DEG C, guarantee has suitable reaction temperature
And the reaction time, to form fine and close uniform passivation tunic, with soft magnetic metal powder meeting after passivation reaction is occurring for passivator
The oxide passivation layer of one layer of iron is formed on soft magnetic metal powder surface, has characteristic resistant to high temperature, while passivation layer is with excellent
Insulating properties, insulating properties reduces the degree that the loss of inductance internal vortex occurs, it is suppressed that the temperature on inductance surface rises, resin
The weight proportion of system and solvent is 1:5~1:20, it is ensured that resin is completely dissolved in a solvent, abundant with soft-magnetic alloy powder
It contacts and attachment is coated on magnetically soft alloy surface, resin system uses various kinds of resin collocation mode, passes through special ratios tune
The advantages of matching, integrating every kind of resin, the disadvantage of various resins respectively is avoided, is conducive to resin and is kept under high temperature and cryogenic conditions
Its mechanical property, meanwhile, it is good that the second powder that partial size is 100-700um ensure that soft-magnetic alloy powder has in pressing process
Good mobility, can guarantee the implementation of subsequent production process, and thus Integral mold voltage inductance prepared by preparation method of the present invention is used
Soft magnetism powder has good high-low temperature resistant characteristic.
Specific embodiment
The invention discloses a kind of Integral mold voltage inductance soft magnetism powders, with reference to embodiments to Integral mold of the invention
Voltage inductance is described in further detail with soft magnetism powder.
Embodiment one: a kind of Integral mold voltage inductance soft magnetism powder uses partial size for the metal soft magnetic alloy powder of 16-80um
End, resin system, passivator and lubricant are prepared, and the weight of passivator is metal soft magnetic alloy powder weight
0.05%, the weight of lubricant is the 0.1% of metal soft magnetic alloy powder weight, and the weight of resin system is metal soft magnetic alloy
The 0.5% of powder weight.
In the present embodiment, resin system includes the first resin Composition and the second resin Composition, the weight of the first resin Composition
It is the 70% of resin system weight, the second resin Composition weight is the 30% of resin system weight；First resin Composition includes glass
Resin component A of the glass transition temperature more than or equal to 180 DEG C, glass transition temperature are more than or equal to 155 DEG C and less than 180 DEG C
Resin component C, the glass transition temperature of resin component B, glass transition temperature more than or equal to 125 DEG C and less than 155 DEG C are big
In being equal to 100 DEG C and resin component D less than 125 DEG C and glass transition temperature is more than or equal to 75 DEG C and less than 100 DEG C
Resin component E；The weight of resin component A is the 10% of the first resin Composition weight；The weight of resin component B is the first resin group
Divide the 50% of weight；The weight of resin component C is the 10% of the first resin Composition weight；The weight of resin component D is the first tree
The 10% of rouge composition weight；The weight of resin component E is the 20% of the first resin Composition weight；Second resin Composition includes glass
Change transition temperature and is more than or equal to 0 DEG C and the resin component of resin component F and glass transition temperature less than 0 DEG C less than 75 DEG C
G；The weight of resin component F is the 50% of the second resin Composition weight；The weight of resin component G is the second resin Composition weight
50%.
In the present embodiment, resin component A is that phenolic resin of the glass transition temperature more than or equal to 180 DEG C and vitrifying turn
Temperature is more than or equal to the mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component B turns for vitrifying
Temperature is more than or equal to 155 DEG C and the phenolic resin less than 180 DEG C and glass transition temperature are more than or equal to 155 DEG C and are less than
The mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component C is more than or equal to for glass transition temperature
125 DEG C and the organic siliconresin less than 155 DEG C, glass transition temperature are more than or equal to 125 DEG C and the unsaturation less than 155 DEG C is poly-
Ester resin, glass transition temperature are more than or equal to 125 DEG C and the phenolic resin less than 155 DEG C and glass transition temperature is greater than etc.
In epoxy resin in 125 DEG C and less than 155 DEG C any one or at least two conjunction object；Resin component D is vitrifying
Transition temperature is more than or equal to 100 DEG C and the organic siliconresin less than 125 DEG C, glass transition temperature are more than or equal to 100 DEG C and small
In the phenolic resin and glass of 125 DEG C of unsaturated polyester resins, glass transition temperature more than or equal to 100 DEG C and less than 125 DEG C
Glass transition temperature is more than or equal to the conjunction object of any one or at least two in 100 DEG C and the epoxy resin less than 125 DEG C；
Resin component E is that glass transition temperature is more than or equal to 75 DEG C and the organic siliconresin less than 100 DEG C, glass transition temperature are big
Unsaturated polyester resin, glass transition temperature in being equal to 75 DEG C and less than 100 DEG C are more than or equal to 75 DEG C and less than 100 DEG C
Phenolic resin and glass transition temperature be more than or equal in 75 DEG C and the epoxy resin less than 100 DEG C any one or at least
Two kinds of conjunction object；Resin component F is that glass transition temperature is more than or equal to 0 DEG C and the polyethylene less than 75 DEG C, glass transition
Temperature is more than or equal to 0 DEG C and the polypropylene less than 75 DEG C, glass transition temperature are more than or equal to 0 DEG C and the polychlorostyrene second less than 75 DEG C
Alkene and glass transition temperature are more than or equal to any one or at least two in 0 DEG C and the polymethacrylates less than 75 DEG C
The conjunction object of kind；Resin component G is poly- third of polyethylene of the glass transition temperature less than 0 DEG C, glass transition temperature less than 0 DEG C
In the polymethyl methacrylate of the polyvinyl chloride of alkene, glass transition temperature less than 0 DEG C and glass transition temperature less than 0 DEG C
Any one or at least two conjunction object.
In the present embodiment, metal soft magnetic alloy powder includes iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron
One or more of powder and reduced iron powder；Passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；Lubrication
Agent includes one or more of zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate.
Embodiment two: a kind of Integral mold voltage inductance soft magnetism powder uses partial size for the metal soft magnetic alloy powder of 16-80um
End, resin system, passivator and lubricant are prepared, and the weight of passivator is the 2% of metal soft magnetic alloy powder weight, profit
The weight of lubrication prescription is the 5% of metal soft magnetic alloy powder weight, and the weight of resin system is metal soft magnetic alloy powder weight
8%.
In the present embodiment, resin system includes the first resin Composition and the second resin Composition, the weight of the first resin Composition
It is the 100% of resin system weight, the second resin Composition weight is the 0% of resin system weight；First resin Composition includes glass
Resin component A of the glass transition temperature more than or equal to 180 DEG C, glass transition temperature are more than or equal to 155 DEG C and less than 180 DEG C
Resin component C, the glass transition temperature of resin component B, glass transition temperature more than or equal to 125 DEG C and less than 155 DEG C are big
In being equal to 100 DEG C and resin component D less than 125 DEG C and glass transition temperature is more than or equal to 75 DEG C and less than 100 DEG C
Resin component E；The weight of resin component A is the 10%~30% of the first resin Composition weight；The weight of resin component B is first
The 80% of resin Composition weight；The weight of resin component C is the 0% of the first resin Composition weight；The weight of resin component D is the
The 20% of one resin Composition weight；The weight of resin component E is the 0% of the first resin Composition weight；Second resin Composition includes
Glass transition temperature is more than or equal to 0 DEG C and the resin of resin component F and glass transition temperature less than 0 DEG C less than 75 DEG C
Ingredient G；The weight of resin component F is the 100% of the second resin Composition weight；The weight of resin component G is the second resin Composition
The 0% of weight.
In the present embodiment, resin component A is that phenolic resin of the glass transition temperature more than or equal to 180 DEG C and vitrifying turn
Temperature is more than or equal to the mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component B turns for vitrifying
Temperature is more than or equal to 155 DEG C and the phenolic resin less than 180 DEG C and glass transition temperature are more than or equal to 155 DEG C and are less than
The mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component C is more than or equal to for glass transition temperature
125 DEG C and the organic siliconresin less than 155 DEG C, glass transition temperature are more than or equal to 125 DEG C and the unsaturation less than 155 DEG C is poly-
Ester resin, glass transition temperature are more than or equal to 125 DEG C and the phenolic resin less than 155 DEG C and glass transition temperature is greater than etc.
In epoxy resin in 125 DEG C and less than 155 DEG C any one or at least two conjunction object；Resin component D is vitrifying
Transition temperature is more than or equal to 100 DEG C and the organic siliconresin less than 125 DEG C, glass transition temperature are more than or equal to 100 DEG C and small
In the phenolic resin and glass of 125 DEG C of unsaturated polyester resins, glass transition temperature more than or equal to 100 DEG C and less than 125 DEG C
Glass transition temperature is more than or equal to the conjunction object of any one or at least two in 100 DEG C and the epoxy resin less than 125 DEG C；
Resin component E is that glass transition temperature is more than or equal to 75 DEG C and the organic siliconresin less than 100 DEG C, glass transition temperature are big
Unsaturated polyester resin, glass transition temperature in being equal to 75 DEG C and less than 100 DEG C are more than or equal to 75 DEG C and less than 100 DEG C
Phenolic resin and glass transition temperature be more than or equal in 75 DEG C and the epoxy resin less than 100 DEG C any one or at least
Two kinds of conjunction object；Resin component F is that glass transition temperature is more than or equal to 0 DEG C and the polyethylene less than 75 DEG C, glass transition
Temperature is more than or equal to 0 DEG C and the polypropylene less than 75 DEG C, glass transition temperature are more than or equal to 0 DEG C and the polychlorostyrene second less than 75 DEG C
Alkene and glass transition temperature are more than or equal to any one or at least two in 0 DEG C and the polymethacrylates less than 75 DEG C
The conjunction object of kind；Resin component G is poly- third of polyethylene of the glass transition temperature less than 0 DEG C, glass transition temperature less than 0 DEG C
In the polymethyl methacrylate of the polyvinyl chloride of alkene, glass transition temperature less than 0 DEG C and glass transition temperature less than 0 DEG C
Any one or at least two conjunction object.
In the present embodiment, metal soft magnetic alloy powder includes iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron
One or more of powder and reduced iron powder；Passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；Lubrication
Agent includes one or more of zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate.
The invention also discloses a kind of Integral mold voltage inductance soft magnetism raw powder's production technologies, with reference to embodiments to this
The Integral mold voltage inductance of invention is described in further detail with soft magnetism raw powder's production technology.
Embodiment one: a kind of Integral mold voltage inductance soft magnetism raw powder's production technology, Integral mold voltage inductance soft magnetism powder
Metal soft magnetic alloy powder, resin system, passivator and the lubricant for being 16um including partial size, the weight of passivator are that metal is soft
The 0.05% of magnetic alloy powder weight, the weight of lubricant are the 0.1% of metal soft magnetic alloy powder weight, the weight of resin system
Amount is the 0.5% of metal soft magnetic alloy powder weight, specific preparation process are as follows:
(1) metal soft magnetic alloy powder, resin system, passivator and the lubrication of corresponding weight are weighed respectively according to the proportion
Agent；
(2) passivator is dissolved and obtains passivator solution in a solvent, in passivator solution, the weight of passivator and solvent
Proportion is 1:20~1:200, and the solvent of passivator solution is any one in water, alcohol and acetone；
(3) passivator solution is mixed with metal soft magnetic alloy powder, by mixed passivator solution and soft magnetic metal
Alloy powder is maintained at 40 degree and is stirred after being heated up to 40 degree, mixing time >=30 minute then raise the temperature to 50 DEG C
~200 DEG C, so that the solvent in passivator solution is volatilized completely and obtain the first dry powder；
(4) resin system dissolution is obtained into resin system solution in a solvent, in resin system solution, resin system and molten
The weight proportion of agent is 1:5~1:20, and the solvent of resin system solution is any one in water, alcohol and acetone；
(5) it is stirred after mixing the first powder with resin system solution, mixing time >=40min, then it is heated to 50~
80 DEG C volatilize the solvent in resin system solution, obtain the second powder that partial size is 100-700um；
(6) lubricant and the second powder are mixed and stirred for uniformly, obtaining Integral mold voltage inductance soft magnetism powder.
In the present embodiment, resin system includes the first resin Composition and the second resin Composition, the weight of the first resin Composition
It is the 70% of resin system weight, the second resin Composition weight is the 30% of resin system weight；First resin Composition includes glass
Resin component A of the glass transition temperature more than or equal to 180 DEG C, glass transition temperature are more than or equal to 155 DEG C and less than 180 DEG C
Resin component C, the glass transition temperature of resin component B, glass transition temperature more than or equal to 125 DEG C and less than 155 DEG C are big
In being equal to 100 DEG C and resin component D less than 125 DEG C and glass transition temperature is more than or equal to 75 DEG C and less than 100 DEG C
Resin component E；The weight of resin component A is the 10% of the first resin Composition weight；The weight of resin component B is the first resin group
Divide the 50% of weight；The weight of resin component C is the 10% of the first resin Composition weight；The weight of resin component D is the first tree
The 20% of rouge composition weight；The weight of resin component E is the 10% of the first resin Composition weight；Second resin Composition includes glass
Change transition temperature and is more than or equal to 0 DEG C and the resin component of resin component F and glass transition temperature less than 0 DEG C less than 75 DEG C
G；The weight of resin component F is the 50% of the second resin Composition weight；The weight of resin component G is the second resin Composition weight
50%.
In the present embodiment, resin component A is that phenolic resin of the glass transition temperature more than or equal to 180 DEG C and vitrifying turn
Temperature is more than or equal to the mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component B turns for vitrifying
Temperature is more than or equal to 155 DEG C and the phenolic resin less than 180 DEG C and glass transition temperature are more than or equal to 155 DEG C and are less than
The mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component C is more than or equal to for glass transition temperature
125 DEG C and the organic siliconresin less than 155 DEG C, glass transition temperature are more than or equal to 125 DEG C and the unsaturation less than 155 DEG C is poly-
Ester resin, glass transition temperature are more than or equal to 125 DEG C and the phenolic resin less than 155 DEG C and glass transition temperature is greater than etc.
In epoxy resin in 125 DEG C and less than 155 DEG C any one or at least two conjunction object；Resin component D is vitrifying
Transition temperature is more than or equal to 100 DEG C and the organic siliconresin less than 125 DEG C, glass transition temperature are more than or equal to 100 DEG C and small
In the phenolic resin and glass of 125 DEG C of unsaturated polyester resins, glass transition temperature more than or equal to 100 DEG C and less than 125 DEG C
Glass transition temperature is more than or equal to the conjunction object of any one or at least two in 100 DEG C and the epoxy resin less than 125 DEG C；
Resin component E is that glass transition temperature is more than or equal to 75 DEG C and the organic siliconresin less than 100 DEG C, glass transition temperature are big
Unsaturated polyester resin, glass transition temperature in being equal to 75 DEG C and less than 100 DEG C are more than or equal to 75 DEG C and less than 100 DEG C
Phenolic resin and glass transition temperature be more than or equal in 75 DEG C and the epoxy resin less than 100 DEG C any one or at least
Two kinds of conjunction object；Resin component F is that glass transition temperature is more than or equal to 0 DEG C and the polyethylene less than 75 DEG C, glass transition
Temperature is more than or equal to 0 DEG C and the polypropylene less than 75 DEG C, glass transition temperature are more than or equal to 0 DEG C and the polychlorostyrene second less than 75 DEG C
Alkene and glass transition temperature are more than or equal to any one or at least two in 0 DEG C and the polymethacrylates less than 75 DEG C
The conjunction object of kind；Resin component G is poly- third of polyethylene of the glass transition temperature less than 0 DEG C, glass transition temperature less than 0 DEG C
In the polymethyl methacrylate of the polyvinyl chloride of alkene, glass transition temperature less than 0 DEG C and glass transition temperature less than 0 DEG C
Any one or at least two conjunction object.
In the present embodiment, metal soft magnetic alloy powder includes iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron
One or more of powder and reduced iron powder；Passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；Lubrication
Agent includes one or more of zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate.
Embodiment two: a kind of Integral mold voltage inductance soft magnetism raw powder's production technology, Integral mold voltage inductance soft magnetism powder
Metal soft magnetic alloy powder, resin system, passivator and the lubricant for being 80um including partial size, the weight of passivator are that metal is soft
The 2% of magnetic alloy powder weight, the weight of lubricant are the 5% of metal soft magnetic alloy powder weight, and the weight of resin system is
The 8% of metal soft magnetic alloy powder weight, specific preparation process are as follows:
(1) metal soft magnetic alloy powder, resin system, passivator and the lubrication of corresponding weight are weighed respectively according to the proportion
Agent；
(2) passivator is dissolved and obtains passivator solution in a solvent, in passivator solution, the weight of passivator and solvent
Proportion is 1:20~1:200, and the solvent of passivator solution is any one in water, alcohol and acetone；
(3) passivator solution is mixed with metal soft magnetic alloy powder, by mixed passivator solution and soft magnetic metal
Alloy powder is maintained at 40 degree and is stirred after being heated up to 40 degree, mixing time >=30 minute then raise the temperature to 50 DEG C
~200 DEG C, so that the solvent in passivator solution is volatilized completely and obtain the first dry powder；
(4) resin system dissolution is obtained into resin system solution in a solvent, in resin system solution, resin system and molten
The weight proportion of agent is 1:5~1:20, and the solvent of resin system solution is any one in water, alcohol and acetone；
(5) it is stirred after mixing the first powder with resin system solution, mixing time >=40min, then it is heated to 50~
80 DEG C volatilize the solvent in resin system solution, obtain the second powder that partial size is 100-700um；
(6) lubricant and the second powder are mixed and stirred for uniformly, obtaining Integral mold voltage inductance soft magnetism powder.
In the present embodiment, resin system includes the first resin Composition and the second resin Composition, the weight of the first resin Composition
It is the 70%~100% of resin system weight, the second resin Composition weight is the 0%~30% of resin system weight；First tree
Rouge component includes resin component A of the glass transition temperature more than or equal to 180 DEG C, glass transition temperature more than or equal to 155 DEG C
And resin component B, the glass transition temperature less than 180 DEG C are more than or equal to 125 DEG C and resin component C, glass less than 155 DEG C
Change transition temperature be more than or equal to 100 DEG C and the resin component D less than 125 DEG C and glass transition temperature be more than or equal to 75 DEG C and
Resin component E less than 100 DEG C；The weight of resin component A is the 30% of the first resin Composition weight；The weight of resin component B
It is the 50% of the first resin Composition weight；The weight of resin component C is the 0% of the first resin Composition weight；The weight of resin component D
Amount is the 10% of the first resin Composition weight；The weight of resin component E is the 10% of the first resin Composition weight；Second resin group
It point include that glass transition temperature is more than or equal to 0 DEG C and the resin component F less than 75 DEG C and glass transition temperature less than 0 DEG C
Resin component G；The weight of resin component F is the 100% of the second resin Composition weight；The weight of resin component is the second resin
The 0% of composition weight.
In the present embodiment, resin component A is that phenolic resin of the glass transition temperature more than or equal to 180 DEG C and vitrifying turn
Temperature is more than or equal to the mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component B turns for vitrifying
Temperature is more than or equal to 155 DEG C and the phenolic resin less than 180 DEG C and glass transition temperature are more than or equal to 155 DEG C and are less than
The mixture of any one or two kinds in 180 DEG C of epoxy resin；Resin component C is more than or equal to for glass transition temperature
125 DEG C and the organic siliconresin less than 155 DEG C, glass transition temperature are more than or equal to 125 DEG C and the unsaturation less than 155 DEG C is poly-
Ester resin, glass transition temperature are more than or equal to 125 DEG C and the phenolic resin less than 155 DEG C and glass transition temperature is greater than etc.
In epoxy resin in 125 DEG C and less than 155 DEG C any one or at least two conjunction object；Resin component D is vitrifying
Transition temperature is more than or equal to 100 DEG C and the organic siliconresin less than 125 DEG C, glass transition temperature are more than or equal to 100 DEG C and small
In the phenolic resin and glass of 125 DEG C of unsaturated polyester resins, glass transition temperature more than or equal to 100 DEG C and less than 125 DEG C
Glass transition temperature is more than or equal to the conjunction object of any one or at least two in 100 DEG C and the epoxy resin less than 125 DEG C；
Resin component E is that glass transition temperature is more than or equal to 75 DEG C and the organic siliconresin less than 100 DEG C, glass transition temperature are big
Unsaturated polyester resin, glass transition temperature in being equal to 75 DEG C and less than 100 DEG C are more than or equal to 75 DEG C and less than 100 DEG C
Phenolic resin and glass transition temperature be more than or equal in 75 DEG C and the epoxy resin less than 100 DEG C any one or at least
Two kinds of conjunction object；Resin component F is that glass transition temperature is more than or equal to 0 DEG C and the polyethylene less than 75 DEG C, glass transition
Temperature is more than or equal to 0 DEG C and the polypropylene less than 75 DEG C, glass transition temperature are more than or equal to 0 DEG C and the polychlorostyrene second less than 75 DEG C
Alkene and glass transition temperature are more than or equal to any one or at least two in 0 DEG C and the polymethacrylates less than 75 DEG C
The conjunction object of kind；Resin component G is poly- third of polyethylene of the glass transition temperature less than 0 DEG C, glass transition temperature less than 0 DEG C
In the polymethyl methacrylate of the polyvinyl chloride of alkene, glass transition temperature less than 0 DEG C and glass transition temperature less than 0 DEG C
Any one or at least two conjunction object.
In the present embodiment, metal soft magnetic alloy powder includes iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron
One or more of powder and reduced iron powder；Passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；Lubrication
Agent includes one or more of zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate.
Integral mold voltage inductance is prepared with soft magnet powder body using Integral mold voltage inductance of the invention, and the one of preparation is molded
The high-temperature behavior and cryogenic property of inductance are detected, and wherein the hot test testing result of Integral mold voltage inductance is as shown in table 1,
The hot test testing result of Integral mold voltage inductance is as shown in table 2.
Table 1
Table 2
Analytical table 1 it is found that the Integral mold voltage inductance prepared using Integral mold voltage inductance of the invention soft magnet powder body,
After 155 DEG C of hot tests (time 500H), each performance parameter decaying is smaller, has excellent high temperature resistance.Analytical table 2 can
Know: the Integral mold voltage inductance prepared using Integral mold voltage inductance soft magnet powder body of the invention, after -55 DEG C of low-temperature tests (when
Between be 500H), the decaying of each performance parameter is smaller, has excellent resistance to low temperature.
Claims (8)
1. a kind of Integral mold voltage inductance soft magnetism powder, it is characterised in that use partial size for the metal soft magnetic alloy powder of 16-80um
End, resin system, passivator and lubricant are prepared, and the weight of the passivator is the metal soft magnetic alloy powder
The 0.05%~2% of weight, the weight of the lubricant are the 0.1%~5% of the metal soft magnetic alloy powder weight,
The weight of the resin system is the 0.5%~8% of the metal soft magnetic alloy powder weight.
2. a kind of Integral mold voltage inductance soft magnetism powder according to claim 1, it is characterised in that the resin system
Including the first resin Composition and the second resin Composition, the weight of first resin Composition is the resin system weight
70%~100%, the second resin Composition weight is the 0%~30% of the resin system weight；
First resin Composition includes resin component A of the glass transition temperature more than or equal to 180 DEG C, glass transition temperature
Degree is more than or equal to 155 DEG C and the resin component B less than 180 DEG C, glass transition temperature more than or equal to 125 DEG C and less than 155 DEG C
Resin component C, glass transition temperature be more than or equal to 100 DEG C and resin component D and glass transition temperature less than 125 DEG C
Degree is more than or equal to 75 DEG C and the resin component E less than 100 DEG C；The weight of the resin component A is the first resin group
Divide the 10%~30% of weight；The weight of the resin component B is the 50%~80% of the first resin Composition weight；
The weight of the resin component C is the 0%~30% of the first resin Composition weight；The weight of the resin component D
Amount is the 0%~20% of the first resin Composition weight；The weight of the resin component E is the first resin group
Divide the 0%~20% of weight；
Second resin Composition include glass transition temperature be more than or equal to 0 DEG C and the resin component F less than 75 DEG C and
Resin component G of the glass transition temperature less than 0 DEG C；The weight of the resin component F is the second resin Composition weight
The 50%~100% of amount；The weight of the resin component G is the 0%~50% of the second resin Composition weight.
3. a kind of Integral mold voltage inductance soft magnetism powder according to claim 2, it is characterised in that the resin component A
Phenolic resin and glass transition temperature for glass transition temperature more than or equal to 180 DEG C are more than or equal to 180 DEG C of asphalt mixtures modified by epoxy resin
The mixture of any one or two kinds in rouge；The resin component B be glass transition temperature be more than or equal to 155 DEG C and
Phenolic resin and glass transition temperature less than 180 DEG C is any more than or equal to 155 DEG C and in the epoxy resin less than 180 DEG C
One or two kinds of mixture；The resin component C is that glass transition temperature is more than or equal to 125 DEG C and less than 155 DEG C
Organic siliconresin, glass transition temperature is more than or equal to 125 DEG C and the unsaturated polyester resin less than 155 DEG C, vitrifying turns
Temperature is more than or equal to 125 DEG C and the phenolic resin less than 155 DEG C and glass transition temperature are more than or equal to 125 DEG C and are less than
In 155 DEG C of epoxy resin any one or at least two conjunction object；The resin component D is glass transition temperature
Organic siliconresin, glass transition temperature more than or equal to 100 DEG C and less than 125 DEG C are more than or equal to 100 DEG C and less than 125 DEG C
Unsaturated polyester resin, glass transition temperature are more than or equal to 100 DEG C and phenolic resin and glass transition temperature less than 125 DEG C
Degree is more than or equal to the conjunction object of any one or at least two in 100 DEG C and the epoxy resin less than 125 DEG C；The resin
Ingredient E is glass transition temperature is more than or equal to 75 DEG C and the organic siliconresin less than 100 DEG C, glass transition temperature is greater than etc.
Unsaturated polyester resin, glass transition temperature in 75 DEG C and less than 100 DEG C are more than or equal to 75 DEG C and the phenolic aldehyde less than 100 DEG C
Resin and glass transition temperature are more than or equal to any one or at least two in 75 DEG C and the epoxy resin less than 100 DEG C
Conjunction object；The resin component F is that glass transition temperature is more than or equal to 0 DEG C and the polyethylene less than 75 DEG C, vitrifying turn
Temperature is more than or equal to 0 DEG C and the polypropylene less than 75 DEG C, glass transition temperature are more than or equal to 0 DEG C and the polychlorostyrene less than 75 DEG C
Ethylene and glass transition temperature be more than or equal in 0 DEG C and the polymethacrylates less than 75 DEG C any one or at least
Two kinds of conjunction object；The resin component G is polyethylene of the glass transition temperature less than 0 DEG C, glass transition temperature less than 0
DEG C the polymethyl of the polyvinyl chloride of polypropylene, glass transition temperature less than 0 DEG C and glass transition temperature less than 0 DEG C
In sour methyl esters any one or at least two conjunction object.
4. a kind of Integral mold voltage inductance soft magnetism powder according to claim 1, it is characterised in that the soft magnetic metal
Alloy powder includes one or more of iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron dust and reduced iron powder；
The passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；The lubricant include zinc stearate,
One or more of lithium stearate, barium stearate, magnesium stearate and calcium stearate.
5. a kind of Integral mold voltage inductance soft magnetism raw powder's production technology, it is characterised in that the Integral mold voltage inductance soft magnetism
Powder includes metal soft magnetic alloy powder, resin system, passivator and the lubricant that partial size is 16-80um, the passivator
Weight be the 0.05%~2% of the metal soft magnetic alloy powder weight, the weight of the lubricant is the gold
Belong to the 0.1%~5% of soft-magnetic alloy powder weight, the weight of the resin system is the metal soft magnetic alloy powder weight
The 0.5%~8% of amount, specific preparation process are as follows:
(1) metal soft magnetic alloy powder, resin system, passivator and the lubricant of corresponding weight are weighed respectively according to the proportion；
(2) passivator is dissolved and obtains passivator solution in a solvent, in passivator solution, the weight of passivator and solvent
Amount proportion is 1:20~1:200, and the solvent of the passivator solution is any one in water, alcohol and acetone；
(3) passivator solution is mixed with metal soft magnetic alloy powder, by mixed passivator solution and metal soft magnetic alloy
Powder is maintained at 40 degree and is stirred after being heated up to 40 degree, mixing time >=30 minute then raise the temperature to 50 DEG C~200
DEG C, so that the solvent in passivator solution is volatilized completely and obtains the first dry powder；
(4) the described resin system dissolution is obtained into resin system solution in a solvent, in resin system solution, resin system and
The weight proportion of solvent is 1:5~1:20, and the solvent of the resin system solution is any one in water, alcohol and acetone
Kind；
(5) it stirs after mixing first powder with the resin system solution, mixing time >=40min, then adds
Heat volatilizees the solvent in the resin system solution to 50~80 DEG C, obtains the second powder that partial size is 100-700um；
(6) it is mixed and stirred for the lubricant and second powder uniformly, to obtain Integral mold voltage inductance soft magnet powder
Body.
6. a kind of Integral mold voltage inductance soft magnetism raw powder's production technology according to claim 5, it is characterised in that described
Resin system include the first resin Composition and the second resin Composition, the weight of first resin Composition is the resin
The 70%~100% of system weight, the second resin Composition weight are the 0%~30% of the resin system weight；
First resin Composition includes resin component A of the glass transition temperature more than or equal to 180 DEG C, glass transition temperature
Degree is more than or equal to 155 DEG C and the resin component B less than 180 DEG C, glass transition temperature more than or equal to 125 DEG C and less than 155 DEG C
Resin component C, glass transition temperature be more than or equal to 100 DEG C and resin component D and glass transition temperature less than 125 DEG C
Degree is more than or equal to 75 DEG C and the resin component E less than 100 DEG C；The weight of the resin component A is the first resin group
Divide the 10%~30% of weight；The weight of the resin component B is the 50%~80% of the first resin Composition weight；
The weight of the resin component C is the 0%~30% of the first resin Composition weight；The weight of the resin component D
Amount is the 0%~20% of the first resin Composition weight；The weight of the resin component E is the first resin group
Divide the 0%~20% of weight；
Second resin Composition include glass transition temperature be more than or equal to 0 DEG C and the resin component F less than 75 DEG C and
Resin component G of the glass transition temperature less than 0 DEG C；The weight of the resin component F is the second resin Composition weight
The 50%~100% of amount；The weight of the resin component G is the 0%~50% of the second resin Composition weight.
7. a kind of Integral mold voltage inductance soft magnetism raw powder's production technology according to claim 6, it is characterised in that described
Resin component A be glass transition temperature more than or equal to 180 DEG C phenolic resin and glass transition temperature be more than or equal to 180
DEG C epoxy resin in any one or two kinds mixture；The resin component B is greater than for glass transition temperature
Phenolic resin and glass transition temperature equal to 155 DEG C and less than 180 DEG C are more than or equal to 155 DEG C and the epoxy less than 180 DEG C
The mixture of any one or two kinds in resin；The resin component C is that glass transition temperature is more than or equal to 125 DEG C
And organic siliconresin, the glass transition temperature less than 155 DEG C are more than or equal to 125 DEG C and the unsaturated polyester (UP) tree less than 155 DEG C
Rouge, glass transition temperature are more than or equal to 125 DEG C and the phenolic resin less than 155 DEG C and glass transition temperature are more than or equal to
In 125 DEG C and the epoxy resin less than 155 DEG C any one or at least two conjunction object；The resin component D is glass
Glass transition temperature is more than or equal to 100 DEG C and the organic siliconresin less than 125 DEG C, glass transition temperature are more than or equal to 100 DEG C
And unsaturated polyester resin, the glass transition temperature less than 125 DEG C are more than or equal to 100 DEG C and the phenolic resin less than 125 DEG C
With glass transition temperature be more than or equal in 100 DEG C and epoxy resin less than 125 DEG C any one or at least two
Close object；The resin component E is that glass transition temperature is more than or equal to 75 DEG C and the organic siliconresin less than 100 DEG C, glass
Change transition temperature more than or equal to 75 DEG C and the unsaturated polyester resin less than 100 DEG C, glass transition temperature are more than or equal to 75 DEG C
And phenolic resin and glass transition temperature the appointing more than or equal to 75 DEG C and in the epoxy resin less than 100 DEG C less than 100 DEG C
It anticipates a kind of or at least two conjunction objects；The resin component F is that glass transition temperature is more than or equal to 0 DEG C and less than 75 DEG C
Polyethylene, glass transition temperature is more than or equal to 0 DEG C and the polypropylene less than 75 DEG C, glass transition temperature is more than or equal to 0
DEG C and the polyvinyl chloride less than 75 DEG C and glass transition temperature be more than or equal in 0 DEG C and the polymethacrylates less than 75 DEG C
Any one or at least two conjunction object；The resin component G be polyethylene of the glass transition temperature less than 0 DEG C,
The polyvinyl chloride and glass transition temperature of polypropylene of the glass transition temperature less than 0 DEG C, glass transition temperature less than 0 DEG C
In polymethyl methacrylate less than 0 DEG C any one or at least two conjunction object.
8. a kind of Integral mold voltage inductance soft magnetism raw powder's production technology according to claim 5, it is characterised in that described
Metal soft magnetic alloy powder include in iron silicon powder, iron aluminum silicon powder, iron silicochromium powder, iron nickel powder, carbonyl iron dust and reduced iron powder
It is one or more of；The passivator includes one or more of nitric acid, boric acid, phosphoric acid and sulfuric acid；The lubricant packet
Containing one or more of zinc stearate, lithium stearate, barium stearate, magnesium stearate and calcium stearate.
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