CN114373626A - Preparation method of high-frequency and high-efficiency integrated inductor - Google Patents
Preparation method of high-frequency and high-efficiency integrated inductor Download PDFInfo
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- CN114373626A CN114373626A CN202111543589.6A CN202111543589A CN114373626A CN 114373626 A CN114373626 A CN 114373626A CN 202111543589 A CN202111543589 A CN 202111543589A CN 114373626 A CN114373626 A CN 114373626A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Soft Magnetic Materials (AREA)
Abstract
The invention provides a preparation method of a high-frequency and high-efficiency integrated inductor, and relates to the technical field of integrated inductor processing. The method for preparing the inductor comprises the steps of compounding a metal magnetic material and a bonding agent to prepare magnetic slurry, injecting the slurry into a mold with a coil, filling the coil winding in the middle of the mold with the slurry, solidifying the bonding agent, demolding the inductor, and then performing subsequent processing. The invention overcomes the defects of the prior art, adopts non-pressure forming, can completely avoid the interlayer short circuit of the coil, has high production efficiency, does not need a large-scale press, and is suitable for preparing various integrally formed inductors and traditional wound inductors with complex shapes.
Description
Technical Field
The invention relates to the technical field of integrated inductor processing, in particular to a preparation method of a high-frequency and high-efficiency integrated inductor.
Background
The inductor can convert the electric energy into magnetic energy in a circuit and store the magnetic energy, and is also called a choke, a reactor and a dynamic reactor. The inductor mainly plays roles of oscillation, filtering, delaying, trapping and the like in a circuit, also has functions of screening signals, filtering noise, stabilizing current and inhibiting electromagnetic wave interference, and often forms an LC circuit together with a capacitor, and the inductor mainly has the function of isolating and filtering alternating current signals or forms a resonance circuit together with the capacitor, a resistor and the like.
The traditional inductor generally comprises a framework (coil support), a winding (conductive coil), a shielding case, packaging materials, a magnetic core and the like, has high magnetic leakage, needs the shielding case, is low in space utilization rate and relatively large in size, and is not suitable for miniaturization.
Integrated into one piece inductor is with the winding as for the magnetic powder middle part, and integrative die-casting shaping, winding are single circle or multiturn, because the coil buries in the magnetic powder middle part, the magnetic field that the coil produced during the circular telegram just can form closed circuit inside the inductance, and the magnetic leakage is very few, integrated into one piece inductance commonly used term high-end electronic product, for example: computer motherboard, video card, industrial computer, server, cell-phone, panel computer and automotive electronics. However, enameled wires are mostly used in coils used in the existing integrally formed inductor, each layer is in an insulated state, and magnetic powder particles easily puncture an insulating layer of the enameled wires in the pressing process, and short circuit can be caused between each layer of coils due to overlarge pressure. In order to prevent short circuit, the molding pressure of the existing integrally molded inductor is lower, and the magnetic density of the inductor is difficult to improve within 700 MPa.
The patent No. CN105590747B, "a power component and its manufacturing method", discloses a tape casting method for manufacturing a power inductor, which uses alloy powders with different particle sizes as a substrate and an inner electric material to manufacture components, respectively, so as to solve the contradiction between the thin outer middle film thickness and the too small magnetic permeability when using fe-si-cr alloy powder as a magnetic core material to manufacture a laminated component. The patent uses a tape made of magnetic material by casting and then laminates the tape together. This method is only applicable to micro devices, e.g. 2.0mm 1.6mm 1.0mm as mentioned in the patent.
CN106158245B patent number "a power inductor using injection molding package" discloses a power inductor using injection molding package, which includes a coil winding, a soft magnetic ferrite center pillar inserted in the middle of the coil winding, and magnetic powder glue encapsulating the coil winding and the soft magnetic ferrite center pillar by injection molding. Wherein the material of the soft magnetic ferrite center post comprises manganese zinc and nickel zinc ferrite. The magnetic metal powder material comprises carbonyl iron, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, iron-nickel-molybdenum alloy and amorphous alloy, and the magnetic permeability is not less than 5 and not more than 20. The inductor is formed by compounding a ferrite center pillar and magnetic metal glue.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a high-frequency and high-efficiency integrated inductor preparation method, which adopts an injection molding process, has no pressure forming, can completely avoid the interlayer short circuit of a coil, has high production efficiency, does not need a large-scale press, and is suitable for preparing various integrated inductors and traditional wound inductors with complex shapes.
In order to achieve the above purpose, the technical scheme of the invention is realized by the following technical scheme:
a preparation method of a high-frequency and high-efficiency integrated inductor comprises the following steps:
(1) designing a coil: designing the size and the number of turns of the coil according to the inductance value, the size of the inductor and application conditions, placing the coil in the middle of the mold to be in a suspended state, and ensuring that the coil is surrounded in the middle of the magnetic powder after the magnetic powder is injected into the mold;
(2) preparing a soft magnetic material: dividing the soft magnetic alloy into coarse powder, medium powder and fine powder according to particle size, mixing and stirring the soft magnetic alloy with different particle sizes and carbonyl iron with the particle size of 5 mu m uniformly to prepare mixed powder for later use, and increasing the stacking density in a mode of matching different particle sizes;
(3) preliminary mixing: adding the mixed powder into a silane coupling agent solution, adding a catalyst, uniformly mixing, and drying to obtain mixed magnetic powder for later use, wherein the Si-O bond and the long alkyl chain of the coupling agent can firmly combine the metal surface with the subsequently mixed resin, and the catalyst can accelerate the hydrolysis of the silane coupling agent, so that the production efficiency is improved;
(4) and (3) secondary mixing: adding the primary mixture into a resin solution, stirring, and then removing bubbles in vacuum to prepare magnetic slurry for later use;
(5) injection molding and forming: injecting the magnetic slurry into a die with the coil placed in the step (1), slightly vibrating the die, reducing holes in a device, improving the density, scraping redundant slurry, heating the die and a sample together, baking the sample at low temperature to volatilize a solvent, raising the temperature to bake at high temperature until the glue is completely cured, and demolding to obtain a finished product.
Preferably, in the step (2), the three particle sizes D50 of the coarse powder, the medium powder and the fine powder of the soft magnetic alloy are respectively: 50-60 μm, 25-30 μm, 7-10 μm.
Preferably, in the step (2), the contents of the coarse powder, the medium powder, the fine powder and the carbonyl iron of the soft magnetic alloy are respectively as follows: 0 wt% -10 wt%, 50 wt% -90 wt%, 2 wt% -30 wt% and 1 wt% -40 wt%.
Preferably, the solvent of the silane coupling agent solution in the step (3) is one or more of water, ethanol and acetone, the mass concentration of the coupling agent is 20 wt%, and the catalyst is acid or alkali, including phosphoric acid, acetic acid, sodium hydroxide and ammonia water.
Preferably, in the step (3), the addition amount of the silane coupling agent solution and the mixed powder is 2 wt% to 10 wt%, and the addition amount of the catalyst is 0.1 wt%.
Preferably, the temperature for drying in the step (3) is 60 ℃.
Preferably, in the step (4), the resin solution is any one of epoxy resin or organic silicon resin dissolved in a solvent, wherein the solvent is a 4: 1 mixture of isopropanol and butyl acetate.
Preferably, the amount of the resin solution in the step (4) is 8 wt% to 15 wt% of the total weight of the magnetic powder, and the solid content of the resin solvent is 25 wt% to 30 wt%.
Preferably, the temperature for baking the sample at the low temperature in the step (5) is 60 ℃, and the temperature for baking the sample at the high temperature is 180 ℃.
The invention provides a preparation method of a high-frequency and high-efficiency integrated inductor, which has the advantages that compared with the prior art:
(1) according to the method, magnetic powder is mixed with glue solution to prepare slurry, and the slurry is injected into a mold, so that the obtained sample is good in consistency, the preparation process is simple, the production energy consumption is very small, no pollution is caused to the environment, and the production efficiency can be improved by more than 50% compared with the traditional compression molding;
(2) in the preparation process, pressure is not required to be applied, no stress is generated in the device, the magnetic performance is not influenced, the problem of short circuit between coil layers of the molded inductor is solved, the inner coil is not extruded, the step of detecting the short circuit of the coil can be omitted, the efficiency of actual production and processing is improved, the production steps are simplified, the economic benefit is improved, and the die is not subjected to high mechanical strength and has long service life;
(3) the inductance performance of the technical scheme is superior to that of the traditional compression molding inductance.
Drawings
FIG. 1 is a schematic perspective view of a sample;
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
preparation of an inductor:
1. selecting an enameled coil with the diameter of 0.12mm, wherein the coil has 10.5 turns, and placing the coil in the middle of a die to be in a suspended state;
2. the domestic gas atomization nanocrystalline magnetically soft alloy powder is divided into three granularities of coarse powder, medium powder and fine powder, and D50 is respectively as follows: 50 μm, 25 μm, 7 μm, the proportion of the three powders being 10 wt%, 59 wt%, 30 wt%, the amount of the further 5 μm carbonyl iron being 1 wt%;
3. uniformly mixing the four powders, adding 2 wt% of silane coupling agent solution, adding 0.1 wt% of phosphoric acid serving as a catalyst, uniformly mixing, and drying at 60 ℃;
4. dissolving and diluting the epoxy resin, wherein the solvent is 4: 1, the amount of the resin solution is 8 wt% of the total weight of the magnetic powder, and the solid content of the resin solvent is 25 wt%. And mixing the resin solvent with the magnetic powder, and removing bubbles in vacuum to obtain magnetic slurry.
5. Injecting the magnetic slurry into a mold with a coil, slightly vibrating the mold, scraping off the redundant slurry by using a scraper, heating the mold and the sample together, baking the sample at a low temperature of 60 ℃ until the solvent is volatilized, recovering the solvent, raising the temperature to 180 ℃ for baking until the glue is completely cured, and finally demolding to obtain a finished product, wherein the size of the finished product is 4.0mm 3.0 mm.
The inductance value measured with the WK3260B impedance analyzer was 0.9. mu.H, the direct current resistance was 11 m.OMEGA., the temperature-rising current was 5.6A, and the saturation current was 5.6A. The efficiency of the inductor under the condition of 1MHz is tested by adopting a 5V-1V voltage reduction circuit, and when the load current is 5A, the efficiency reaches 91.2 percent.
Example 2:
preparation of an inductor:
1. selecting an enameled coil with the diameter of 0.12mm, wherein the coil has 10.5 turns, and placing the coil in the middle of a die to be in a suspended state;
2. the domestic gas atomization nanocrystalline magnetically soft alloy powder is divided into three granularities of coarse powder, medium powder and fine powder, and D50 is respectively as follows: 50 μm, 25 μm, 7 μm, the proportion of the three powders being 5 wt%, 40 wt%, 15 wt%, the amount of the 5 μm carbonyl iron being additionally 40 wt%;
3. uniformly mixing the four powders, adding 2 wt% of silane coupling agent solution, adding 0.1 wt% of phosphoric acid serving as a catalyst, uniformly mixing, and drying at 60 ℃;
4. dissolving and diluting the epoxy resin, wherein the solvent is 4: 1, mixing a resin solution with 13 wt% of the total weight of the magnetic powder and a resin solvent with a solid content of 25 wt%, and removing bubbles in vacuum to obtain magnetic slurry;
5. injecting the magnetic slurry into a mold with a coil, slightly vibrating the mold, scraping the redundant slurry by using a scraper, heating the mold and the sample together, baking the sample at a low temperature of 60 ℃ until the solvent is volatilized, recovering the solvent, raising the temperature to 180 ℃ for baking until the glue is completely cured, and finally demolding to obtain a finished product, wherein the size of the finished product is 4.0mm 3.0 mm.
The inductance value measured with the WK3260B impedance analyzer was 0.85. mu.H, the direct current resistance was 11 m.OMEGA., the temperature-rising current was 5.4A, and the saturation current was 5.8A. The efficiency of the inductor under the condition of 1MHz is tested by adopting a 5V-1V voltage reduction circuit, and when the load current is 5A, the efficiency reaches 90.4 percent.
Example 3:
preparation of an inductor:
1. selecting an enameled coil with the diameter of 0.12mm, wherein the coil has 10.5 turns, and placing the coil in the middle of a die to be in a suspended state;
2. the domestic gas atomization nanocrystalline magnetically soft alloy powder is divided into three granularities of coarse powder, medium powder and fine powder, and D50 is respectively as follows: 60 μm, 30 μm, 10 μm, the proportion of the three powders being 6 wt%, 64 wt%, 10 wt%, the amount of the additional 5 μm carbonyl iron being 20 wt%;
3. uniformly mixing the four powders, adding 7.5 wt% of silane coupling agent solution, adding 0.1 wt% of phosphoric acid serving as a catalyst, uniformly mixing the four powders, and drying at 60 ℃;
4. dissolving and diluting the epoxy resin, wherein the solvent is 4: 1, mixing a resin solution with 13 wt% of the total weight of the magnetic powder and a resin solvent with a solid content of 25 wt%, and removing bubbles in vacuum to obtain magnetic slurry;
5. injecting the magnetic slurry into a mold with a coil, slightly vibrating the mold, scraping the redundant slurry by using a scraper, heating the mold and the sample together, baking the sample at a low temperature of 60 ℃ until the solvent is volatilized, recovering the solvent, raising the temperature to 180 ℃ for baking until the glue is completely cured, and finally demolding to obtain a finished product, wherein the size of the finished product is 4.0mm 3.0 mm.
The inductance value measured with the WK3260B impedance analyzer was 1.1. mu.H, the direct current resistance was 11 m.OMEGA., the temperature-rising current was 5.7A, and the saturation current was 5.8A. The efficiency of the inductor under the condition of 1MHz is tested by adopting a 5V-1V voltage reduction circuit, and when the load current is 5A, the efficiency reaches 93.4 percent.
Example 4:
preparation of an inductor:
the scheme of the embodiment is the same as that of the embodiment 3, except that: the adhesive is organic silicon resin, the amount of the organic silicon resin solution is 13 wt% of the total weight of the magnetic powder, and the solid content is 25 wt%.
The inductance value measured with the WK3260B impedance analyzer was 1.0. mu.H, the direct current resistance was 11 m.OMEGA., the temperature-rising current was 5.9A, and the saturation current was 5.8A. The efficiency of the inductor under the condition of 1MHz is tested by adopting a 5V-1V voltage reduction circuit, and when the load current is 5A, the efficiency reaches 93.6 percent.
Comparative example 1:
preparing an integrated inductor by using traditional compression molding:
1. selecting an enameled coil with the diameter of 0.12mm, wherein the coil has 10.5 turns;
2. using domestic gas atomized nanocrystalline magnetically soft alloy powder, wherein the particle size is normal distribution, D50 is 30 μm, and 20 wt% of 5 μm carbonyl iron powder is added;
3. after the two powders are uniformly mixed, adding 7.5 wt% of silane coupling agent solution, adding 0.1 wt% of phosphoric acid as a catalyst, wherein the mass concentration of the coupling agent is 20 wt%, and drying at 60 ℃ after uniform mixing;
4. dissolving and diluting epoxy resin, selecting a 4: 1 mixture of isopropanol and butyl acetate as a solvent, wherein the amount of the resin solution is 13 wt% of the total weight of the magnetic powder, the solid content of the resin solvent is 25 wt%, mixing the resin solvent and the magnetic powder, heating the slurry to a semi-dry state, granulating by using a 100-mesh screen, placing a coil in the middle of the magnetic powder, and performing compression molding under the pressure of 600MPa to obtain a finished product with the size of 4.0mm 3.0 mm.
And (3) detection:
the inductance values, direct current resistances, temperature rise currents, and saturation currents of the above examples 1 to 4 and comparative examples were measured using a WK3260B impedance analyzer; the efficiency of each group of inductors under the condition of 1MHz is tested by adopting a voltage reduction circuit of 5V-1V, when the load current is 5A, the efficiency is recorded, and the specific results are shown in the following table:
as can be seen from the above table, the inductor prepared by the present application can improve the inductance performance compared to the conventional preparation process.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A preparation method of a high-frequency and high-efficiency integrated inductor is characterized by comprising the following steps:
(1) designing a coil: designing the size and the number of turns of the coil according to the inductance value, the size of the inductor and application conditions, and placing the coil in the middle of the mold to be in a suspended state;
(2) preparing a soft magnetic material: dividing the soft magnetic alloy into coarse powder, medium powder and fine powder according to the particle size, and mixing and stirring the soft magnetic alloy with different particle sizes and carbonyl iron with the particle size of 5 mu m uniformly to prepare mixed powder for later use;
(3) preliminary mixing: adding the mixed powder into a silane coupling agent solution, adding a catalyst, uniformly mixing, and drying to obtain mixed magnetic powder for later use;
(4) and (3) secondary mixing: adding the primary mixture into a resin solution, stirring, and then removing bubbles in vacuum to prepare magnetic slurry for later use;
(5) injection molding and forming: and (2) injecting the magnetic slurry into the die with the coil placed in the step (1), slightly vibrating the die, scraping off redundant slurry, heating the die and the sample together, baking the sample at low temperature to volatilize the solvent, raising the temperature to bake at high temperature until the glue is completely cured, and demolding to obtain a finished product.
2. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: the three particle sizes D50 of the coarse powder, the medium powder and the fine powder of the soft magnetic alloy in the step (2) are respectively as follows: 50-60 μm, 25-30 μm, 7-10 μm.
3. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: the contents of coarse powder, medium powder, fine powder and carbonyl iron of the soft magnetic alloy in the step (2) are respectively as follows: 0 wt% -10 wt%, 50 wt% -90 wt%, 2 wt% -30 wt% and 1 wt% -40 wt%.
4. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: in the step (3), the solvent of the silane coupling agent solution is one or more of water, ethanol and acetone, the mass concentration of the coupling agent is 20 wt%, and the catalyst is acid or alkali, including phosphoric acid, acetic acid, sodium hydroxide and ammonia water.
5. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: in the step (3), the addition amount of the silane coupling agent solution and the mixed powder is 2-10 wt%, and the addition amount of the catalyst is 0.1 wt%.
6. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: the drying temperature in the step (3) is 60 ℃.
7. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: in the step (4), the resin solution is any one of epoxy resin or organic silicon resin dissolved in a solvent, wherein the solvent is a 4: 1 mixture of isopropanol and butyl acetate.
8. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: the amount of the resin solution in the step (4) is 8 wt% -15 wt% of the total weight of the magnetic powder, and the solid content of the resin solvent is 25 wt% -30 wt%.
9. The method for preparing the high-frequency and high-efficiency integrated inductor according to claim 1, wherein the method comprises the following steps: the temperature for baking the sample at the low temperature in the step (5) is 60 ℃, and the temperature for baking the sample at the high temperature is 180 ℃.
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