JP2013160650A - Base unit of semiconductor testing device and semiconductor testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform stably connector fitting operation without increasing sizes of connectors in a base unit including the connectors having a floating structure.SOLUTION: The base unit of a semiconductor testing device includes a vibration surface on which a plurality of connectors having the floating structure are arranged and a vibrator for vibrating the vibration surface on a plane vertical to a fitting direction of the connectors. The vibration surface can be constituted as a floating structure from a base unit body. A vertical vibrator for vibrating the vibration surface in the same direction as the fitting direction of the connectors is also allowed to be included in the base unit.

Description

  The present invention relates to a base unit of a semiconductor test apparatus, and more particularly to a connector fitting assist mechanism in the base unit.

  The manufacturing process of a semiconductor device is divided into a pre-process for forming a large number of integrated circuits on a wafer and a post-process for cutting and packaging individual chips. In each of the pre-process and post-process, it is necessary to test whether or not it operates normally, and a semiconductor test apparatus is used to perform this test.

  During the test, the terminal part of the device under test (DUT) is electrically connected to the terminal part on the semiconductor test equipment side, and the DUT responds to the test signal from the semiconductor test equipment by the DUT response. Judge the quality of the.

  In the pre-process test, a DUT wafer is placed on a prober, and the test signals of the probe card are brought into contact with pads formed on the wafer to exchange electrical signals with the semiconductor test apparatus. In a post-process test, an electrical signal is exchanged with a semiconductor test apparatus by bringing a test pin of a performance board into contact with a semiconductor package supplied by a handler.

  In any of the test processes, a test head containing a plurality of pin electronics cards generates a test signal and receives a response signal from the DUT. Further, the electrical connection between the test head and the performance board or between the test head and the probe card is made through a base unit having a built-in harness.

  FIG. 17A is a diagram schematically showing a structure in the vicinity of a base unit of a semiconductor test apparatus used for a post-process test. The DUT in the post-process test is the semiconductor package 90. As shown in the figure, the base unit 500 is connected to the test head 600 and the performance board 80.

  The performance board 80 includes an IC holder 82 on which the semiconductor package 90 supplied by the handler 800 is mounted, and a test pin 83. The test pin 83 is brought into contact with the mounted semiconductor package 90.

  The test head 600 includes a back board 610 and houses a plurality of detachable pin electronics cards 620. The back board 610 supplies operation power and control signals to the pin electronics card 620, and the pin electronics card 620 generates a test signal and receives a response signal from the DUT.

  Electrical connection between the back board 610 and the pin electronics card 620 is performed by fitting a pin electronics card connection connector 611 provided in the back board 610 and a test head connection connector 621 provided in the pin electronics card 620. It is.

  The base unit 500 includes a plurality of harnesses 530 that connect the pin electronics card 620 and the performance board 80. Electrical connection between harness 530 and pin electronics card 620 is performed by fitting pin electronics card connector 520 wired to harness 530 and base unit connection connector 622 included in pin electronics card 620. It is.

  FIG. 17B is a view of the line A of FIG. 17A viewed from the lower side, that is, the test head 600 viewed from the lower surface, and FIG. 17C is the view of the line A of FIG. FIG. 5 is a view of the base unit 500 as viewed from above.

  As shown in these drawings, the base unit connection connector 622 of the pin electronics card 620 and the pin electronics card connection connector 520 on the base unit 500 side are respectively arranged and fitted in corresponding positions on the opposing surfaces. It is like that.

  The electrical connection between the harness 530 and the performance board 80 is performed by fitting the performance board connection connector 510 wired to the harness 530 and the base unit connection connector 81 included in the performance board 80. .

  FIG. 17D is a view of the line B in FIG. 17A viewed from the lower side, that is, the base unit 500 viewed from the lower surface, and FIG. 17D is a view of the line B in FIG. That is, the performance board 80 is viewed from above.

  As shown in these figures, the performance board connection connector 510 on the base unit 500 side and the base unit connection connector 81 of the performance board 80 are respectively arranged at corresponding positions on the opposing surfaces so as to be fitted together. It has become.

  FIG. 18A is a diagram schematically showing the structure in the vicinity of the base unit of the semiconductor test apparatus used for the test in the previous process. The DUT in the pre-process test is the wafer 92. As shown in the figure, the base unit 540 is connected to the test head 630 and the probe card 70. The probe card 70 includes test pins 74, and the test pins 74 are brought into contact with a wafer 92 placed on the wafer stage 73.

  The test head 630 includes a backboard 640 and houses a plurality of detachable pin electronics cards 650. The electrical connection between the backboard 640 and the pin electronics card 650 is performed by fitting the pin electronics card connection connector 641 provided in the backboard 640 and the test head connection connector 651 provided in the pin electronics card 650. It is.

  The base unit 540 includes a plurality of harnesses 570 that connect the pin electronics card 650 and the probe card 70. The electrical connection between the harness 570 and the pin electronics card 650 is similar to that of the semiconductor test apparatus used for the subsequent process test described above, and the pin electronics card connection connector 560 wired to the harness 570 and the pin electronics card 650. This is performed by fitting the base unit connection connector 652 included in the connector.

  The electrical connection between the harness 570 and the probe card 70 is performed by fitting the probe card connection connector 550 wired to the harness 570 and the base unit connection connector 71 included in the probe card 70. .

  18B is a view of the line C in FIG. 18A viewed from the lower side, that is, the base unit 540 as viewed from the lower surface. FIG. 18C is a view of the line C in FIG. FIG. 5 is a view of the probe card 70 as viewed from above.

  As shown in these drawings, the probe card connection connector 550 on the base unit 540 side and the base unit connection connector 71 of the probe card 70 are radially arranged and fitted in corresponding positions on the opposing surfaces. It is like that.

  The base unit 500, the base unit 540, the probe card 70, and the performance board 80 transmit a large amount of test signals from the pin electronics card 620 and the pin electronics card 650 to the DUT. It has a role to adapt to. Therefore, the base unit 500, the base unit 540, the probe card 70, and the performance board 80 have a replaceable structure, and a large number of connectors are attached and detached at the time of replacement.

  FIG. 19 is a diagram illustrating a fitting structure between the probe card connecting connector 550 on the base unit 540 side and the base unit connecting connector 71 of the probe card 70.

  Although only six sets of the paired connection connectors are shown in this figure, in reality, a large number of connection connectors are arranged as shown in FIGS. 18 (b) and 18 (c). It should be noted that other connection connectors have a similar fitting structure between a pair of connection connectors.

  As shown in this figure, a probe card connection connector 550 having a large number of plugs 551 is attached to the bottom surface of the base unit 540. The probe card connection connector 550 is not fixed and has a floating structure. A base unit connector 71 having a number of jacks 72 is attached to the upper surface of the probe card 70. The base unit connection connector 71 is not a floating structure, but is fixed to the upper surface of the probe card 70.

  At the time of connector fitting, the probe card 70 is pushed up by the operation of a cylinder (not shown) and the probe card 70 and the base unit 540 come close to each other, and each plug 551 of the probe card connecting connector 550 is connected to the base unit connecting connector 71. Inserted into the corresponding jack. The connector may be connected by pushing down the base unit 540.

  The probe card connecting connector 550 may be provided with a jack, and the base unit connecting connector 71 may be provided with a plug. The floating structure is a connector on the harness side, that is, the base unit 500, 540 side. Therefore, in pin electronics card connection connectors 520 and 560 and base unit connection connectors 622 and 652, pin electronics card connection connectors 520 and 560 have a floating structure.

  Here, the reason why the connector has a floating structure will be described. When a large number of connectors are mated simultaneously, there may be a connector that cannot be mated with a fixed structure due to the mounting dimension tolerance of the connector or the dimensional tolerance of the connector itself. In such a case, by allowing one connector to move in the tolerance generating direction as a floating structure, it becomes possible to absorb and fit the dimensional tolerance. This is because a large number of connectors can be fitted simultaneously.

  20A and 20B are diagrams for explaining the floating structure of the connector. FIG. 20A is a view of the probe card connection connector 550 viewed from the plug direction (lower surface), and FIG. It is the figure which looked at the connector 550 for probe card connection.

  As shown in this figure, the probe card connector 550 is attached to the bottom surface of the base unit 540 through screws, pins, etc., through holes provided at both ends. Since the hole is wider than a screw or the like, it can move freely about several millimeters in the X-axis and Y-axis directions. In addition, slight movement occurs in the Z direction.

  FIG. 21 is a diagram showing a structure of a base unit connection connector 71 having a jack 72. As shown in the figure, the jack 72 has a structure including a tapered plug guiding section 72a for guiding the plug and a fitting section 72b at the back thereof.

  FIG. 22 shows a state where the probe card connection connector 550 having a floating structure and the base unit connection connector 71 are fitted. The probe card 70 is pushed up by a cylinder mechanism or the like (not shown), and as shown in FIG. 22A, the probe card connection connector 550 and the base unit connection connector 71 approach each other, and the tip of the plug 551 and the jack 72 are connected. The plug guiding section 72a comes into contact.

  At this time, as shown in FIG. 22 (b), even if the probe card connection connector 550 and the base unit connection connector 71 are slightly shifted, the probe card connection connector 550 has a floating structure. Guided by the tapered surface of the guiding section 72 a, the plug 551 moves in a direction where it is located at the center of the jack 72. For this reason, as shown in FIG.22 (c), the plug 551 and the jack 72 fit normally.

  Further, the probe card 70 is pushed up, and the probe card connecting connector 550 and the base unit connecting connector 71 approach each other, so that the plug 551 advances through the fitting section 72b of the jack 72, and as shown in FIG. The mating operation is completed. The same operation is performed for connector fitting between the test heads 600 and 630 and the base units 500 and 540 and between the base unit 500 and the performance board 80.

JP 2010-169399 A

  Since one of the connectors has a floating structure, even if the plug 551 of the probe card connecting connector 550 and the jack 72 of the base unit connecting connector 71 are misaligned as shown in FIG. The connecting connector 550 slides and can be normally fitted.

  However, in the semiconductor test apparatus, since a large number of connectors are simultaneously fitted, the pressing force of the probe card 70, such as the pushing-up operation, is often several hundred kilograms, and the jack 72 that first contacts the plug 551 is invited. A large force concentrates on the section 72a.

  At this time, the pressing force transmitted to the probe card connecting connector 550 via the plug 551 acts in a direction to press the probe card connecting connector 550 against the base unit 540, and therefore hinders the floating operation of the probe card connecting connector 550. It will be. For this reason, sliding for fitting is not performed smoothly, and a further force is applied to the contact portion between the inclined plug 551 and the lead-in section 72 a of the jack 72.

  In order to prevent damage at this time, both the plug-side connector and the jack-side connector need to have sufficient mechanical strength. For this reason, both the plug-side connector and the jack-side connector must be made thicker and larger.

  In a semiconductor test apparatus, since many connectors are used, if the size of the connector increases, it becomes difficult to increase the density of the connector, and a sufficient test signal cannot be given to the DUT. In addition, the semiconductor test apparatus itself The size of will also increase. If an increase in the size of the semiconductor test apparatus itself is avoided, the number of connectors is limited, and again, a sufficient test signal cannot be supplied to the DUT.

  Accordingly, an object of the present invention is to enable a stable connector fitting operation without increasing the size of a connector in a base unit including a connector having a floating structure.

In order to solve the above problems, a first aspect of the present invention is a base unit of a semiconductor test apparatus, in which a vibration surface on which a plurality of floating structure connectors are arranged, and the vibration surface is fitted in the connector fitting direction. And a vibrator that vibrates on a vertical plane.
The vibration surface may have a floating structure with respect to the base unit main body.
In addition to the vibrator, an upper and lower vibrator that vibrates the vibration surface in the same direction as the fitting direction of the connector may be further provided.
Alternatively, the vibrator is arranged to be inclined with respect to the vibration surface, and the vibration surface is vibrated in the same direction as the fitting direction of the connector in addition to a surface perpendicular to the fitting direction of the connector. May be.
In order to solve the above problems, a second aspect of the present invention is a semiconductor test apparatus including the above-described base unit.
At this time, it is possible to provide a control unit that vibrates the vibrator when mated with a mating connector to be mated with the connector.
The pair connector can be disposed on any of a test head, a performance board, and a probe card.
The control unit starts vibration of the vibrator when the distance between the connector and the pair connector reaches a first distance, and vibrates the vibrator when the distance between the connector and the pair connector reaches a second distance. Can be terminated.
At this time, either one of the connector and the pair connector includes a plug, the other includes a tapered jack, and the first distance is a distance between the plug tip and the jack inlet, The second distance may be a distance when the plug tip passes through a tapered inlet.

  According to the present invention, in a base unit provided with a connector having a floating structure, a stable connector fitting operation can be performed without increasing the size of the connector.

It is a figure explaining the base unit which concerns on this embodiment. It is a figure which shows the case where this invention is applied to the base unit of the semiconductor test apparatus used for the test of a pre-process. It is a figure which illustrates typically the fitting operation of the connector of this embodiment. It is a flowchart explaining the fitting operation | movement of the connector of this embodiment. It is a figure which shows the base unit of the semiconductor test apparatus used for the test of the post process which added the vertical vibrator. It is a figure which shows the base unit of the semiconductor test apparatus used for the test of the front process which added the upper and lower vibrator. It is a figure which illustrates typically the fitting operation | movement of the connector in the base unit which added the vertical vibrator. It is a flowchart explaining the fitting operation | movement of the connector in the base unit which added the upper and lower vibrator. It is a figure which shows the base unit which has arrange | positioned the vibrator | oscillator and the upper and lower vibrators to all the sides of a vibration surface. It is a figure which shows the base unit of the semiconductor test apparatus used for the test of the post process which has arrange | positioned one vibrator | oscillator to one side of a vibration surface. It is a figure which shows the base unit of the semiconductor test apparatus used for the test of the previous process which has arrange | positioned one vibrator | oscillator in the vibration surface. It is a figure which shows the example of arrangement | positioning of the vibrator | oscillator in the case of applying a vibration to the circumferential direction using two vibrator | oscillators in the base unit of the semiconductor test apparatus used for the test of a front process. It is a figure which shows the example of arrangement | positioning of an oblique vibrator in the case of applying a vibration to a triaxial direction using two oblique vibrators. It is a figure which shows the example of arrangement | positioning of an oblique vibrator in the case of applying a vibration to a triaxial direction using one oblique vibrator. It is the figure which showed the example of arrangement | positioning of the vibrator | oscillator in the base unit of the semiconductor test apparatus used for the test of a pre-process. It is the figure which showed the example of arrangement | positioning of the vibrator | oscillator for giving a vibration uniformly in the circumferential direction in the base unit of the semiconductor test apparatus used for the test of a pre-process. It is a figure which shows typically the structure of the base unit vicinity of the semiconductor test apparatus used for the test of a post process. It is a figure which shows typically the structure of the base unit vicinity of the semiconductor test apparatus used for the test of a pre-process. It is a figure explaining the fitting structure of a connector. It is a figure explaining the floating structure of a connector. It is a figure explaining the connector by the side of a jack. It is a figure explaining the fitting operation | movement of the connector of a floating structure. It is a figure explaining the state by which sliding for fitting is not performed smoothly by pressing force.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram illustrating a base unit 10 according to the present embodiment. In this example, the present invention is applied to a base unit 10 of a semiconductor test apparatus used for a post-process test. FIG. 1A shows a bottom surface of the base unit 10 facing the performance board. FIG. 1B is a cross-sectional view as viewed from the A direction in FIG. 1A, and FIG. 1C is a cross-sectional view as viewed from the B direction in FIG. In the following description, parts other than the base unit will be described with the same reference numerals as those used in the description of the prior art.

  As shown in this figure, the base unit 10 of this embodiment is provided with a floating vibration surface 20 inside the bottom surface 11, and a floating structure performance board connector 21 is attached to the vibration surface 20. The vibrator 30 is attached to the side surface of the vibration surface 20 so as to vibrate on the same surface as the sliding surface of the connector 21 for connecting the performance board, that is, a surface perpendicular to the direction in which the plug and the jack are fitted. It has become.

  In this example, as shown in FIG. 1B and FIG. 1C, the vibration surface 20 and the bottom surface 11 are engaged with the concave shape and the convex shape so that the floating structure of the vibration surface 20 is realized. However, it is sufficient if the vibration surface 20 is vibrated by the vibrator 30, and a floating structure may be realized by screwing / pinning with play, cushioning material, or other mechanisms. Further, the base unit 10 main body may be vibrated by the vibrator 30 without providing the vibration surface 20.

  As the vibrator 30, an ultrasonic vibrator using a piezoelectric element, a rotary motor, a linear motor, or the like can be used, and the vibration operation is controlled by a control unit of a semiconductor test apparatus (not shown). In the example of this figure, the vibrators 30 are attached to two places on the bottom surface 11 in the vertical direction and the horizontal direction. However, as will be described later, the number and attachment places of the vibrators 30 are not limited thereto.

  In the present embodiment, the vibrating surface 20 is vibrated by the vibrator 30 when the performance board connecting connector 21 of the base unit 10 and the base unit connecting connector of the performance board are fitted. It is known that frictional force is reduced by applying vibration (stress wave) in the sliding direction of the sliding body. This vibration causes friction between the connector 21 for connecting the performance board having the floating structure and the vibration surface 20. Power is reduced. As a result, the performance board connecting connector 21 slides smoothly with respect to the vibration surface 20, and a stable fitting operation can be realized.

  For this reason, since it is not necessary to give the performance board connecting connector 21 mechanical strength more than necessary, an increase in the size of the performance board connecting connector 21 can be prevented.

  The intensity and frequency of vibration given by the vibrator 30 are set according to the size and weight of the base unit 10, the number of vibrators 30, the attachment location, the connector shape, and the like. In addition, the size of the vibrator 30 to be used, the vibration method, and the like can be selected in accordance with the required strength and frequency of vibration. In general, increasing the vibration amplitude or increasing the frequency can increase the influence of the vibration on the frictional force. Decreasing the vibration amplitude or lowering the frequency to reduce the vibrational frictional force. The effect can be weakened. In the case where a plurality of vibrators 30 are provided, the vibration strengths of the vibrators 30 may be different or individually operated.

  The same applies to the upper surface of the base unit 10, that is, the surface to which the test head connection connector is attached. A floating structure vibration surface is provided inside the upper surface, and the floating structure pin electronics card connection connector is provided on the vibration surface. Install it.

  FIG. 2 is a diagram showing a case where the present invention is applied to a base unit 40 of a semiconductor test apparatus used for a pre-process test. As shown in the figure, the base unit 40 is provided with a floating vibration surface 50 inside a bottom surface 41, and a floating structure probe card connection connector 51 is attached to the vibration surface 50. In this case as well, the vibrator 30 is attached to the side surface of the vibration surface 50 at two vertical and horizontal positions, and the same surface as the sliding surface of the probe card connector 51, that is, the plug and the jack are fitted. It vibrates in a plane perpendicular to the direction. Since the vibration of the vibration surface 50 is a combination of the vibrations of the two vibrators 30, it vibrates in various directions.

  FIG. 3 is a diagram schematically illustrating the fitting operation between the plug 52 of the probe card connection connector 51 and the jack 72 of the base unit connection connector 71 of the probe card 70. FIG. 4 is a flowchart for explaining the connection operation between the probe card 70 and the base unit 40.

  As shown in FIG. 3A, the distance between the base unit 40 and the probe card 70 is measured by the sensor 98 and notified to a control unit of a semiconductor test apparatus (not shown). The sensor 98 may calculate the distance between the base unit 40 and the probe card 70 by measuring the moving distance of the probe card 70 or the base unit 40.

  When the connection operation between the probe card 70 and the base unit 40 is started, a cylinder or the like (not shown) is operated by the control of the control unit, the probe card 70 is pushed up, and both approach from the state shown in FIG. The movement is started (FIG. 4: S101). Note that an operation of pushing down the base unit 40 may be performed.

  When it is determined by the measured distance between the base unit 40 and the probe card 70 that the tip of the plug 52 has reached the plug guiding section 72a of the jack 72 as shown in FIG. 3B (S102: Yes), The control unit turns on the vibration operation of the vibrator 30 (S103).

  Thereby, since the frictional force between the probe card connecting connector 51 and the vibration surface 50 is reduced, the floating sliding operation of the probe card connecting connector 51 is not hindered. Accordingly, the plug 52 is smoothly guided by the taper of the plug guiding section 72a, and the probe card connecting connector 51 slides so that the plug 52 and the jack 72 are aligned.

  When the movement by the cylinder or the like further proceeds, and it is determined that the tip of the plug 52 has passed through the plug lead-in section 72a of the jack 72 (S104: Yes), as shown in FIG. 3C, the probe card connector 51 Since sliding becomes unnecessary, the control unit turns off the vibration operation of the vibrator 30 (S105). However, on / off of the vibration operation of the vibrator 30 may be switching of vibration intensity.

  Then, when the movement by the cylinder or the like further proceeds, and it is determined that the plug 52 fits in the fitting section 72b of the jack 72 and the fitting is completed as shown in FIG. 3 (d) (S106: Yes), the control unit. Terminates the push-up operation of the probe card 70 (S107).

  FIG. 5 shows the base unit 10 of the semiconductor test apparatus used for the pre-process test in which the vertical vibrator 31 is added in order to apply the vibration in the vertical direction, that is, the fitting direction of the connector to the vibration surface 20. In general, in semiconductor test equipment, the contact pressure of the connector is high to ensure the reliability of electrical contact, so the force that inserts the plug into the jack is greater than the force required to pull in the floating structure connector. Is strong. The vibration in the vertical direction by the vertical vibrator 31 is intended to reduce the friction force when the plug is inserted into the jack and to reduce the connector fitting pressing force. FIG. 6 shows a case where the vertical vibrator 31 for vertical vibration is added to the base unit 40 of the semiconductor test apparatus used for the test in the previous process.

  FIG. 7 is a diagram schematically illustrating a fitting operation between the plug 52 of the probe card connection connector 51 and the jack 72 of the base unit connection connector 71 of the probe card 70 in the base unit 40 to which the upper and lower vibrators 31 are added. It is. FIG. 8 is a flowchart for explaining the connection operation between the probe card 70 and the base unit 40 in the base unit 40 to which the upper and lower vibrators 31 are added.

  When the connection operation between the probe card 70 and the base unit 40 is started, a cylinder or the like (not shown) is operated by the control of the control unit, the probe card 70 is pushed up, and both approach from the state shown in FIG. The movement is started (FIG. 8: S201).

  When it is determined by the measured distance between the base unit 40 and the probe card 70 that the tip of the plug 52 has reached the plug lead-in section 72a of the jack 72 as shown in FIG. 7B (S202: Yes), The control unit turns on the horizontal vibration operation of the vibrator 30 and the vertical vibration operation of the upper and lower vibrator 31 (S203).

  Thereby, since the frictional force between the probe card connecting connector 51 and the vibration surface 50 is reduced, the floating sliding operation of the probe card connecting connector 51 is not hindered. Accordingly, the plug 52 is smoothly guided by the taper of the plug guiding section 72a, and the probe card connecting connector 51 slides so that the plug 52 and the jack 72 are aligned.

  When the movement by the cylinder or the like further progresses, and it is determined that the tip of the plug 52 has passed through the plug guide section 72a of the jack 72 (S204: Yes), as shown in FIG. 7C, the probe card connector 51 Since sliding is unnecessary, the control unit turns off the lateral vibration operation of the vibrator 30 (S205). However, the vertical vibration operation of the vertical vibrator 31 is continued. For this reason, the frictional force between the plug 52 and the jack 72 is reduced, and the fitting operation proceeds smoothly.

  Then, when the movement by the cylinder or the like further proceeds, and it is determined that the plug 52 is fitted in the fitting section 72b of the jack 72 and the fitting is completed as shown in FIG. 7D (S206: Yes), the control unit. Turns off the vertical vibration operation of the vertical vibrator 31 (S207). Then, the push-up operation of the probe card 70 is terminated (S208). Note that the on / off of the vibration operation of the vibrator 30 and the upper and lower vibrators 31 may be switching of vibration intensity.

  Below, the modification of this embodiment is demonstrated. FIG. 9A shows the base unit 10 of the semiconductor test apparatus used for a post-process test in which the vibrator 30 and the upper and lower vibrators 31 are arranged on all sides of the vibration surface 20, and FIG. 3 shows a base unit 40 of a semiconductor test apparatus used for a post-process test in which 30 and upper and lower vibrators 31 are arranged on all sides of a vibration surface 50. The object is to effectively apply vibration to the entire vibration surfaces 20 and 50 by providing a plurality of vibrators 30 on all sides of the vibration surfaces 20 and 50.

  FIG. 10 shows the base unit 10 of the semiconductor test apparatus used for a post-process test in which one vibrator 30 is arranged on one side of the vibration surface 20 in order to minimize the number of vibrators 30. FIG. 11A similarly shows a base unit 40 of a semiconductor test apparatus used for a test in a previous process in which one vibrator 30 is arranged on one side of the vibration surface 20 in order to minimize the number of vibrators 30. ing. As shown in FIG. 11B, an ear part 50a may be provided at the center of one side of the vibration surface 20, and the vibrator 30 may be arranged so that vibration is transmitted in the circumferential direction with respect to the ear part 50a.

  FIG. 12 shows an arrangement example of the vibrator 30 in the case where vibration is applied in the circumferential direction using two vibrators 30 in the base unit 40 of the semiconductor test apparatus used for the test in the previous process. FIG. 12 (a) shows a case where it is arranged in the vicinity of the diagonal portion of the bottom surface 41, and FIG. The case where the vibrator 30 is arranged so as to be transmitted to the line is shown.

  In FIG. 13A, an ear portion 50b inclined at 45 degrees obliquely is provided on the vibration surface 50 at two locations, the center of the X axis side and the center of the Y axis side, and the oblique vibration inclined at 45 degrees obliquely to the ear portion 50b. The case where the vibration of the child 33 is applied is shown. In this case, the two oblique vibrators 33 can simultaneously generate lateral vibration in the X-axis and Y-axis directions on the same plane as the vibration surface 50 and vertical vibration in the Z-axis direction orthogonal to the vibration surface 50. . In FIG. 13 (b), instead of the ear portion 50b, an inclined portion 50c of 45 degrees is formed at the end of the adjacent side of the vibration surface 50, and the oblique vibration in which the two inclined portions 50c are inclined by 45 degrees. The case where the vibration of the child 33 is applied is shown. Also in this case, the two oblique vibrators 33 can simultaneously generate lateral vibrations in the X-axis and Y-axis directions on the same plane as the vibration surface 50 and vertical vibrations in the Z-axis direction orthogonal to the vibration surface 50. it can.

  FIG. 14 shows a case where an inclined portion 50d having an inclination of 45 degrees is formed at one corner of the vibration surface 50, and the vibration of the oblique vibrator 34 inclined to 45 degrees is applied to the inclined portion 50d. In this case, it is possible to simultaneously generate the horizontal vibration in the X-axis and Y-axis directions on the same plane as the vibration surface 50 and the vertical vibration in the Z-axis direction orthogonal to the vibration surface 50 by one oblique vibrator 34. it can.

  FIG. 15 shows an arrangement example of the vibrators 30 in the base unit 40 of the semiconductor test apparatus used for the test in the previous process. FIG. 15A shows a case where the vibrator 30 is arranged at three ear portions provided every 120 degrees so that vibration is applied in the circumferential direction, and FIG. 15B shows the circumferential direction. FIG. 15C shows a case where the four vibrators 30 are arranged at four corners so that vibration is applied in the circumferential direction. The case where the vibrator | oscillator 30 is arrange | positioned to the ear | edge part is shown.

  FIG. 16 shows an example of the arrangement of the vibrators 30 for applying uniform vibration in the circumferential direction in the base unit 40 of the semiconductor test apparatus used for the test in the previous process. FIG. 16A shows a case where eight vibrators 30 are arranged at eight ear portions provided every 45 degrees, and FIG. 16B further shows a vertical vibrator 31 for applying vertical vibrations. Is shown at 8 ears.

DESCRIPTION OF SYMBOLS 10 ... Base unit, 11 ... Bottom surface, 20 ... Vibration surface, 21 ... Connector for performance board connection, 30 ... Vibrator, 31 ... Vertical vibrator, 33 ... Oblique vibrator, 34 ... Oblique vibrator, 40 ... Base unit, 41 ... bottom surface, 50 ... vibrating surface, 50a ... ear part, 50b ... ear part, 50c ... inclined part, 50d ... inclined part, 51 ... connector for probe card connection, 52 ... plug, 70 ... probe card, 71 ... base unit Connector for connection, 72... Jack, 72 a .. Plug insertion section, 72 b .. Fitting section, 73 .. Wafer stage, 74 .. Test pin, 80 .. Performance board, 81. Test pin 90 ... Semiconductor package 92 ... Wafer 98 ... Sensor 500 ... Base unit 510 ... Performer Sboard connection connector, 520 ... Pin electronics card connection connector, 530 ... Harness, 540 ... Base unit, 550 ... Probe card connection connector, 551 ... Plug, 560 ... Pin electronics card connection connector, 570 ... Harness, 600 ... Test head, 610 ... Back board, 611 ... Connector for pin electronics card, 620 ... Pin electronics card, 621 ... Connector for test head, 622 ... Connector for base unit connection, 630 ... Test head, 640 ... Back board, 641 ... Pin electronics card connector, 650 ... Pin electronics card, 651 ... Test head connector, 652 ... Base unit connector, 800 ... Handler

Claims (9)

A base unit for semiconductor test equipment,
A vibrating surface on which a plurality of floating connectors are arranged;
A vibrator that vibrates the vibration surface in a plane perpendicular to the fitting direction of the connector;
A base unit characterized by comprising   The base unit according to claim 1, wherein the vibration surface has a floating structure with respect to the base unit main body.   The base unit according to claim 1, further comprising an upper and lower vibrator that vibrates the vibration surface in the same direction as a fitting direction of the connector in addition to the vibrator.   The vibrator is arranged to be inclined with respect to the vibration surface, and the vibration surface is vibrated in the same direction as the fitting direction of the connector in addition to a surface perpendicular to the fitting direction of the connector. The base unit according to claim 1 or 2.   A semiconductor test apparatus comprising the base unit according to claim 1.   The semiconductor test apparatus according to claim 5, further comprising a control unit that vibrates the vibrator when mated with a mating connector to be mated with the connector.   The semiconductor test apparatus according to claim 6, wherein the pair connector is disposed on any one of a test head, a performance board, and a probe card.   The control unit starts vibration of the vibrator when the distance between the connector and the pair connector reaches a first distance, and vibrates the vibrator when the distance between the connector and the pair connector reaches a second distance. 8. The semiconductor test apparatus according to claim 6, wherein the semiconductor test apparatus is terminated. Either one of the connector and the pair connector includes a plug, and the other includes a jack with a tapered inlet.
The first distance is a distance between the plug tip and the jack inlet, and the second distance is a distance when the plug tip passes through the tapered inlet. Item 9. The semiconductor test apparatus according to Item 8.