JP3150318U - IC socket - Google Patents

Abstract

An IC socket for stably connecting an IC package to a contact is provided. A socket main body for mounting a plurality of contacts, a frame-shaped cover member provided so as to be movable up and down with respect to the socket main body, and rotatably mounted on the socket main body. In an IC socket for connecting an IC package and a circuit board, the pressure mechanism includes at least two pressure portions for pressing the IC package. It is characterized by that. [Selection] Figure 4

Description

  The present invention relates to a socket in which an electronic component as a semiconductor device such as a semiconductor integrated circuit package (hereinafter referred to as an IC package) is used. In particular, the IC package maintains a predetermined contact pressure state between its conductive pads and contacts. In particular, the present invention relates to an IC package socket provided with a pressurizing mechanism that presses and holds the socket body.

  A semiconductor device mounted on an electronic device or the like is subjected to various tests at a stage before mounting to remove potential defects. The test is performed non-destructively by voltage stress application, high temperature operation, high temperature storage, etc. corresponding to thermal and mechanical environment tests. Of these various tests, a burn-in test is performed as an effective test for removing an initially malfunctioning integrated circuit. The burn-in test performs an operation test for a predetermined time under a high temperature condition.

  A semiconductor device socket used for such a test is generally called an IC socket. For example, as shown in Patent Document 1 and Patent Document 2, a predetermined test voltage is supplied and an object to be inspected is used. It is arranged on a printed wiring board having an input / output unit for sending an abnormality detection signal representing a short circuit or the like from the semiconductor device.

JP-A-10-302925 Japanese Patent Laid-Open No. 2003-59608

  An IC socket 100 according to the related art as shown in FIG. 1 includes a fixed socket body 10 ′, a frame-shaped cover member 20 ′ provided so as to be movable up and down with respect to the socket body 10 ′, and a center. A pedestal 50 ′ having the IC package mounting portion (no reference symbol) provided detachably on the socket body 10 ′, and an IC package as an electronic member mounted on the IC package mounting portion of the pedestal 50 ′ And a plurality of contacts connected to conductive pads of the IC package.

  In the conventional IC socket 100, the pressurizing mechanism 30 'that pressurizes and holds the IC package as the electronic component has a pressurizing lever member, and a pressurizing portion 31 is provided at the tip of the lever member. 'Is provided. When an IC package as an electronic component is mounted on the IC package mounting portion of the pedestal 50 ′, the pressurizing unit 31 ′ of the pressurizing mechanism 30 ′ presses the IC package and connects to the contact so as to be stable. is doing.

  When the pressurizing unit 31 ′ of the pressurizing mechanism 30 ′ presses the IC package, there is a possibility that the pressurizing unit 31 ′ may press in an unstable manner by contacting with the surface between the pressurizing unit 31 ′ and the IC package. The connection between the conductive pad of the IC package and the contact of the IC socket may become unstable. Therefore, it is necessary to develop a new IC socket.

  An object of the present invention is to provide an IC socket for stably connecting an IC package to a contact.

  The IC socket of the present invention is mounted on a socket main body for mounting a plurality of contacts, a frame-shaped cover member provided to be movable up and down with respect to the socket main body, and rotatably mounted on the socket main body. An IC socket for connecting an IC package and a circuit board, wherein the pressurizing mechanism includes at least two pressurizations for pressing the IC package. A portion is formed.

  Compared with the prior art, the IC socket of the present invention has the following advantages, and the pressurizing mechanism is provided with at least two pressurizing sections that press the IC package. Since the IC package is pressed in a stable manner by contact at a point, the IC package is connected to the contact in a stable manner.

It is an assembly perspective view of the IC socket which concerns on a prior art. It is an IC socket assembly perspective view in a state where a pressure mechanism is closed without mounting an IC package according to the present invention. 1 is an IC socket assembly perspective view in a state where a pressure mechanism is opened without mounting an IC package according to the present invention. FIG. FIG. 5 is a perspective view of the IC socket assembly with the IC package according to the present invention mounted and the pressure mechanism closed.

  2 to 4, a preferred embodiment of the IC socket 200 of the present invention will be described with reference to the accompanying drawings. The IC socket 200 according to the embodiment of the present invention is used to connect the IC package 40 to a circuit board (not shown). The socket body 10 is provided with a plurality of contacts, and the socket body 10 is vertically A frame-shaped cover member 20 provided movably, a pedestal 50 having an IC package mounting portion 52 in the center, and a pressurizing mechanism 30 that pressurizes and holds the IC package 40 mounted on the IC package mounting portion 52. Including.

  A plurality of guide grooves 14 are respectively formed in the side wall 11 of the socket body 10, and first corner posts 12 mounted in corresponding fixing holes of a circuit board (not shown) on the bottom walls of the four corners of the socket body 10. Are formed so as to extend downward. Corner holes 13 corresponding to the first corner posts 12 are formed in the top walls of the four corners of the socket body 10, and spring members (not shown) such as coil springs are accommodated in the corner holes 13.

  The pedestal 50 is located above the socket body 10 and has an IC package mounting portion 52 recessed in the center thereof. The IC package mounting portion 52 has through holes 54 penetrating the plurality of contacts. Is done. Of course, the pedestal 50 may be formed so as to be integrated with or separated from the socket body 10.

  The cover member 20 has a frame shape and is provided so as to be movable up and down with respect to the socket body 10. Second corner posts are respectively accommodated in the corners 13 of the socket body 10 at the four corners of the cover member 20. 22 is formed, and a guide piece 24 movable along the guide groove 14 of the socket body 10 is formed on the side wall of the cover member 20 so that the guide piece 24 protrudes from the guide groove 14. Position accurately to move with respect to.

  The pressurizing mechanism 30 is rotatably mounted on the socket body 10 and has a pair disposed so as to face each other. Each pressurizing mechanism 30 has an IC package 40 mounted on the IC package mounting portion 52. Both pressurizing parts 31 for pressurizing are formed, and the both pressurizing parts 31 are provided at the tip of each pressurizing mechanism 30.

  Referring to FIG. 3, the spring member in the corner hole 13 elastically biases the cover member 20 upward and downward. When pressing the cover member 20 downward by an external force, the IC package 40 is mounted on the IC package mounting portion 52 when the pressurizing mechanism 30 is opened. Next, referring to FIG. 4, when the external force is removed, the cover member 20 is restored to the normal state by the spring member, and the pressurizing mechanism 30 pressurizes and holds the IC package 40, that is, is closed. Both pressing portions 31 of the pressing mechanism 30 are in contact with the IC package 40.

  Compared with the prior art, the IC socket 200 according to the present invention is provided with a pressing portion 31 of the pressing mechanism 30 that is branched to the tip, and thus comes into contact with the IC package 40, so that the IC package is stable as a contact. Will be connected.

  Although the present invention has been described in detail with reference to the best embodiment, the embodiment is merely illustrative and is not limited thereto. In addition, the above description is intended to be within the scope of the claims of the present invention, such as modification or change of details that can be made based on the present invention.

200 IC socket 10 Socket body 11 Side wall 12 First corner post 13 Corner hole 14 Guide groove 20 Cover member 22 Second corner post 24 Guide piece 30 Pressure mechanism 31 Pressure part 40 IC package 50 Base 52 IC socket mounting part 54 Through Hole

Claims (3)

A socket body for mounting a plurality of contacts;
A frame-shaped cover member provided to be movable up and down with respect to the socket body;
In the IC socket for connecting the IC package and the circuit board, including a pressurizing mechanism that is rotatably mounted on the socket body and has an open state and a closed state.
The IC socket according to claim 1, wherein at least two pressing portions for pressing the IC package are formed in the pressing mechanism.   The IC according to claim 1, wherein a guide groove is formed on a side wall of the IC socket body, and a guide piece movable along the guide groove is formed on the cover member. socket.   Corner holes for accommodating springs are formed at the four corners of the socket body, and corner posts are formed at the four corners of the cover member so as to be insertable corresponding to the corner holes. The IC socket according to claim 2.

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