JP2013157541A5 - - Google Patents
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- JP2013157541A5 JP2013157541A5 JP2012018538A JP2012018538A JP2013157541A5 JP 2013157541 A5 JP2013157541 A5 JP 2013157541A5 JP 2012018538 A JP2012018538 A JP 2012018538A JP 2012018538 A JP2012018538 A JP 2012018538A JP 2013157541 A5 JP2013157541 A5 JP 2013157541A5
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- JP
- Japan
- Prior art keywords
- retainer ring
- radial grooves
- shows
- radial
- outer retainer
- Prior art date
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- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012018538A JP5964064B2 (ja) | 2012-01-31 | 2012-01-31 | 基板保持装置、研磨装置、および研磨方法 |
| TW107108374A TWI674171B (zh) | 2012-01-31 | 2013-01-04 | 基板保持裝置、研磨裝置、及研磨方法 |
| TW102100196A TWI639485B (zh) | 2012-01-31 | 2013-01-04 | Substrate holding device, polishing device, and polishing method |
| US13/752,659 US9662764B2 (en) | 2012-01-31 | 2013-01-29 | Substrate holder, polishing apparatus, and polishing method |
| KR1020130010473A KR101879462B1 (ko) | 2012-01-31 | 2013-01-30 | 기판 유지 장치, 연마 장치 및 연마 방법 |
| JP2016022084A JP6092439B2 (ja) | 2012-01-31 | 2016-02-08 | 基板保持装置、研磨装置、および研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012018538A JP5964064B2 (ja) | 2012-01-31 | 2012-01-31 | 基板保持装置、研磨装置、および研磨方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016022084A Division JP6092439B2 (ja) | 2012-01-31 | 2016-02-08 | 基板保持装置、研磨装置、および研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013157541A JP2013157541A (ja) | 2013-08-15 |
| JP2013157541A5 true JP2013157541A5 (es) | 2015-03-05 |
| JP5964064B2 JP5964064B2 (ja) | 2016-08-03 |
Family
ID=49052425
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012018538A Active JP5964064B2 (ja) | 2012-01-31 | 2012-01-31 | 基板保持装置、研磨装置、および研磨方法 |
| JP2016022084A Active JP6092439B2 (ja) | 2012-01-31 | 2016-02-08 | 基板保持装置、研磨装置、および研磨方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016022084A Active JP6092439B2 (ja) | 2012-01-31 | 2016-02-08 | 基板保持装置、研磨装置、および研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP5964064B2 (es) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6232297B2 (ja) * | 2014-01-21 | 2017-11-15 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
| SG10202002713PA (en) * | 2015-08-18 | 2020-05-28 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| JP6463303B2 (ja) * | 2016-05-13 | 2019-01-30 | 株式会社荏原製作所 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
| SG10201606197XA (en) | 2015-08-18 | 2017-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| JP7157521B2 (ja) * | 2016-03-15 | 2022-10-20 | 株式会社荏原製作所 | 基板研磨方法、トップリングおよび基板研磨装置 |
| JP6705362B2 (ja) * | 2016-10-25 | 2020-06-03 | 信越半導体株式会社 | 研磨ヘッドおよび研磨装置 |
| KR101841364B1 (ko) | 2016-11-04 | 2018-03-22 | 주식회사 씨티에스 | 씨엠피 해드 및 이를 포함하는 씨엠피 장치 |
| JP2018133393A (ja) | 2017-02-14 | 2018-08-23 | 東芝メモリ株式会社 | 半導体製造装置および半導体装置の製造方法 |
| JP2023014497A (ja) * | 2021-07-19 | 2023-01-31 | 株式会社荏原製作所 | 研磨装置のトップリング及び研磨装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6125767A (ja) * | 1984-07-13 | 1986-02-04 | Nec Corp | 平面研摩装置の被加工物保持機構 |
| JPS6125768A (ja) * | 1984-07-13 | 1986-02-04 | Nec Corp | 平面研摩装置の被加工物保持機構 |
| JPH06143126A (ja) * | 1992-11-09 | 1994-05-24 | Mitsubishi Materials Corp | 研磨装置 |
| JP3795198B2 (ja) * | 1997-09-10 | 2006-07-12 | 株式会社荏原製作所 | 基板保持装置及び該基板保持装置を備えたポリッシング装置 |
| US6113468A (en) * | 1999-04-06 | 2000-09-05 | Speedfam-Ipec Corporation | Wafer planarization carrier having floating pad load ring |
| JP4056205B2 (ja) * | 1999-10-15 | 2008-03-05 | 株式会社荏原製作所 | ポリッシング装置および方法 |
| JP2002270556A (ja) * | 2001-03-09 | 2002-09-20 | Tokyo Seimitsu Co Ltd | ウェーハ研磨装置 |
| JP2003282505A (ja) * | 2002-03-26 | 2003-10-03 | Fujikoshi Mach Corp | ウエーハの研磨装置 |
| JP2008302464A (ja) * | 2007-06-07 | 2008-12-18 | Renesas Technology Corp | 研磨装置およびそれを用いた半導体装置の製造方法 |
| JP2008307674A (ja) * | 2007-06-18 | 2008-12-25 | Tokyo Seimitsu Co Ltd | 分割加圧型リテーナリング |
| JP5199691B2 (ja) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
| US7749052B2 (en) * | 2008-09-08 | 2010-07-06 | Applied Materials, Inc. | Carrier head using flexure restraints for retaining ring alignment |
| JP2011124302A (ja) * | 2009-12-09 | 2011-06-23 | Lapmaster Sft Corp | 低重心エアバック式研磨ヘッド |
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2012
- 2012-01-31 JP JP2012018538A patent/JP5964064B2/ja active Active
-
2016
- 2016-02-08 JP JP2016022084A patent/JP6092439B2/ja active Active