JP2013157541A5 - - Google Patents

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Publication number
JP2013157541A5
JP2013157541A5 JP2012018538A JP2012018538A JP2013157541A5 JP 2013157541 A5 JP2013157541 A5 JP 2013157541A5 JP 2012018538 A JP2012018538 A JP 2012018538A JP 2012018538 A JP2012018538 A JP 2012018538A JP 2013157541 A5 JP2013157541 A5 JP 2013157541A5
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JP
Japan
Prior art keywords
retainer ring
radial grooves
shows
radial
outer retainer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012018538A
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Japanese (ja)
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JP2013157541A (en
JP5964064B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012018538A external-priority patent/JP5964064B2/en
Priority to JP2012018538A priority Critical patent/JP5964064B2/en
Priority to TW102100196A priority patent/TWI639485B/en
Priority to TW107108374A priority patent/TWI674171B/en
Priority to US13/752,659 priority patent/US9662764B2/en
Priority to KR1020130010473A priority patent/KR101879462B1/en
Publication of JP2013157541A publication Critical patent/JP2013157541A/en
Publication of JP2013157541A5 publication Critical patent/JP2013157541A5/ja
Priority to JP2016022084A priority patent/JP6092439B2/en
Publication of JP5964064B2 publication Critical patent/JP5964064B2/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

図14(a)乃至図14(c)は、インナーリテーナリング20とアウターリテーナリング30の下面に設けられたそれぞれラジアル溝20c,30bのさらに他の例を示す図である。図14(a)は、ラジアル溝30bの本数がラジアル溝20cの本数と同じ例を示し、図14(b)は、ラジアル溝30bの本数がラジアル溝20cの本数よりも少ない例を示し、図14(c)は、ラジアル溝20cの本数がラジアル溝30bの本数よりも少ない例を示している。この例においても、ラジアル溝20c,30bは、インナーリテーナリング20およびアウターリテーナリング30の半径方向に対して傾斜しているが、傾斜の方向が図13(a)乃至図13(c)に示す例と反対となっている。すなわち、インナーリテーナリング20およびアウターリテーナリング30が回転するに従って研磨液がアウターリテーナリング30およびインナーリテーナリング20の内側から外側に流出するように、ラジアル溝20c,30bは、インナーリテーナリング20およびアウターリテーナリング30の回転方向(矢印で示す)に対して後方に傾斜している。 14 (a) to 14 (c) are diagrams showing still other examples of the radial grooves 20c and 30b provided on the lower surfaces of the inner retainer ring 20 and the outer retainer ring 30, respectively. 14A shows an example in which the number of radial grooves 30b is the same as the number of radial grooves 20c, and FIG. 14B shows an example in which the number of radial grooves 30b is smaller than the number of radial grooves 20c. 14 (c) shows an example in which the number of radial grooves 20c is smaller than the number of radial grooves 30b. Also in this example, the radial grooves 20c and 30b are inclined with respect to the radial direction of the inner retainer ring 20 and the outer retainer ring 30, but the inclination directions are shown in FIGS. 13 (a) to 13 (c). It is the opposite of the example. That is, the radial grooves 20c and 30b are formed in the inner retainer ring 20 and the outer retainer ring 20 so that the polishing liquid flows out from the inner side of the outer retainer ring 30 and the inner retainer ring 20 as the inner retainer ring 20 and the outer retainer ring 30 rotate. The retainer ring 30 is inclined backward with respect to the rotation direction (indicated by an arrow).

JP2012018538A 2012-01-31 2012-01-31 Substrate holding apparatus, polishing apparatus, and polishing method Active JP5964064B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012018538A JP5964064B2 (en) 2012-01-31 2012-01-31 Substrate holding apparatus, polishing apparatus, and polishing method
TW102100196A TWI639485B (en) 2012-01-31 2013-01-04 Substrate holding device, polishing device, and polishing method
TW107108374A TWI674171B (en) 2012-01-31 2013-01-04 Substrate holding device, polishing device, and polishing method
US13/752,659 US9662764B2 (en) 2012-01-31 2013-01-29 Substrate holder, polishing apparatus, and polishing method
KR1020130010473A KR101879462B1 (en) 2012-01-31 2013-01-30 Substrate holding apparatus, grinding apparatus and grinding method
JP2016022084A JP6092439B2 (en) 2012-01-31 2016-02-08 Substrate holding apparatus, polishing apparatus, and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012018538A JP5964064B2 (en) 2012-01-31 2012-01-31 Substrate holding apparatus, polishing apparatus, and polishing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016022084A Division JP6092439B2 (en) 2012-01-31 2016-02-08 Substrate holding apparatus, polishing apparatus, and polishing method

Publications (3)

Publication Number Publication Date
JP2013157541A JP2013157541A (en) 2013-08-15
JP2013157541A5 true JP2013157541A5 (en) 2015-03-05
JP5964064B2 JP5964064B2 (en) 2016-08-03

Family

ID=49052425

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012018538A Active JP5964064B2 (en) 2012-01-31 2012-01-31 Substrate holding apparatus, polishing apparatus, and polishing method
JP2016022084A Active JP6092439B2 (en) 2012-01-31 2016-02-08 Substrate holding apparatus, polishing apparatus, and polishing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016022084A Active JP6092439B2 (en) 2012-01-31 2016-02-08 Substrate holding apparatus, polishing apparatus, and polishing method

Country Status (1)

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JP (2) JP5964064B2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6232297B2 (en) * 2014-01-21 2017-11-15 株式会社荏原製作所 Substrate holding device and polishing device
JP6463303B2 (en) * 2016-05-13 2019-01-30 株式会社荏原製作所 Elastic film, substrate holding device, substrate polishing device, substrate adsorption determination method and pressure control method in substrate holding device
SG10202002713PA (en) * 2015-08-18 2020-05-28 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
SG10201606197XA (en) * 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
US10464185B2 (en) * 2016-03-15 2019-11-05 Ebara Corporation Substrate polishing method, top ring, and substrate polishing apparatus
JP6705362B2 (en) * 2016-10-25 2020-06-03 信越半導体株式会社 Polishing head and polishing device
KR101841364B1 (en) 2016-11-04 2018-03-22 주식회사 씨티에스 CMP Carrier and CMP Apparotus consisting the same
JP2018133393A (en) 2017-02-14 2018-08-23 東芝メモリ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
JP2023014497A (en) * 2021-07-19 2023-01-31 株式会社荏原製作所 Top ring of polishing device and polishing device

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
JPS6125767A (en) * 1984-07-13 1986-02-04 Nec Corp Work holding mechanism in surface polishing machine
JPS6125768A (en) * 1984-07-13 1986-02-04 Nec Corp Work holding mechanism for surface polishing machine
JPH06143126A (en) * 1992-11-09 1994-05-24 Mitsubishi Materials Corp Polishing device
JP3795198B2 (en) * 1997-09-10 2006-07-12 株式会社荏原製作所 Substrate holding device and polishing apparatus provided with the substrate holding device
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
JP4056205B2 (en) * 1999-10-15 2008-03-05 株式会社荏原製作所 Polishing apparatus and method
JP2002270556A (en) * 2001-03-09 2002-09-20 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
JP2003282505A (en) * 2002-03-26 2003-10-03 Fujikoshi Mach Corp Wafer polishing equipment
JP2008302464A (en) * 2007-06-07 2008-12-18 Renesas Technology Corp Polishing device and manufacturing method of semiconductor device using it
JP2008307674A (en) * 2007-06-18 2008-12-25 Tokyo Seimitsu Co Ltd Split pressurizing type retainer ring
JP5199691B2 (en) * 2008-02-13 2013-05-15 株式会社荏原製作所 Polishing equipment
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
JP2011124302A (en) * 2009-12-09 2011-06-23 Lapmaster Sft Corp Low center of gravity airbag type polishing head

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