JP2013157541A5 - - Google Patents
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- Publication number
- JP2013157541A5 JP2013157541A5 JP2012018538A JP2012018538A JP2013157541A5 JP 2013157541 A5 JP2013157541 A5 JP 2013157541A5 JP 2012018538 A JP2012018538 A JP 2012018538A JP 2012018538 A JP2012018538 A JP 2012018538A JP 2013157541 A5 JP2013157541 A5 JP 2013157541A5
- Authority
- JP
- Japan
- Prior art keywords
- retainer ring
- radial grooves
- shows
- radial
- outer retainer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Description
図14(a)乃至図14(c)は、インナーリテーナリング20とアウターリテーナリング30の下面に設けられたそれぞれラジアル溝20c,30bのさらに他の例を示す図である。図14(a)は、ラジアル溝30bの本数がラジアル溝20cの本数と同じ例を示し、図14(b)は、ラジアル溝30bの本数がラジアル溝20cの本数よりも少ない例を示し、図14(c)は、ラジアル溝20cの本数がラジアル溝30bの本数よりも少ない例を示している。この例においても、ラジアル溝20c,30bは、インナーリテーナリング20およびアウターリテーナリング30の半径方向に対して傾斜しているが、傾斜の方向が図13(a)乃至図13(c)に示す例と反対となっている。すなわち、インナーリテーナリング20およびアウターリテーナリング30が回転するに従って研磨液がアウターリテーナリング30およびインナーリテーナリング20の内側から外側に流出するように、ラジアル溝20c,30bは、インナーリテーナリング20およびアウターリテーナリング30の回転方向(矢印で示す)に対して後方に傾斜している。 14 (a) to 14 (c) are diagrams showing still other examples of the radial grooves 20c and 30b provided on the lower surfaces of the inner retainer ring 20 and the outer retainer ring 30, respectively. 14A shows an example in which the number of radial grooves 30b is the same as the number of radial grooves 20c, and FIG. 14B shows an example in which the number of radial grooves 30b is smaller than the number of radial grooves 20c. 14 (c) shows an example in which the number of radial grooves 20c is smaller than the number of radial grooves 30b. Also in this example, the radial grooves 20c and 30b are inclined with respect to the radial direction of the inner retainer ring 20 and the outer retainer ring 30, but the inclination directions are shown in FIGS. 13 (a) to 13 (c). It is the opposite of the example. That is, the radial grooves 20c and 30b are formed in the inner retainer ring 20 and the outer retainer ring 20 so that the polishing liquid flows out from the inner side of the outer retainer ring 30 and the inner retainer ring 20 as the inner retainer ring 20 and the outer retainer ring 30 rotate. The retainer ring 30 is inclined backward with respect to the rotation direction (indicated by an arrow).
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012018538A JP5964064B2 (en) | 2012-01-31 | 2012-01-31 | Substrate holding apparatus, polishing apparatus, and polishing method |
TW102100196A TWI639485B (en) | 2012-01-31 | 2013-01-04 | Substrate holding device, polishing device, and polishing method |
TW107108374A TWI674171B (en) | 2012-01-31 | 2013-01-04 | Substrate holding device, polishing device, and polishing method |
US13/752,659 US9662764B2 (en) | 2012-01-31 | 2013-01-29 | Substrate holder, polishing apparatus, and polishing method |
KR1020130010473A KR101879462B1 (en) | 2012-01-31 | 2013-01-30 | Substrate holding apparatus, grinding apparatus and grinding method |
JP2016022084A JP6092439B2 (en) | 2012-01-31 | 2016-02-08 | Substrate holding apparatus, polishing apparatus, and polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012018538A JP5964064B2 (en) | 2012-01-31 | 2012-01-31 | Substrate holding apparatus, polishing apparatus, and polishing method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016022084A Division JP6092439B2 (en) | 2012-01-31 | 2016-02-08 | Substrate holding apparatus, polishing apparatus, and polishing method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013157541A JP2013157541A (en) | 2013-08-15 |
JP2013157541A5 true JP2013157541A5 (en) | 2015-03-05 |
JP5964064B2 JP5964064B2 (en) | 2016-08-03 |
Family
ID=49052425
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012018538A Active JP5964064B2 (en) | 2012-01-31 | 2012-01-31 | Substrate holding apparatus, polishing apparatus, and polishing method |
JP2016022084A Active JP6092439B2 (en) | 2012-01-31 | 2016-02-08 | Substrate holding apparatus, polishing apparatus, and polishing method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016022084A Active JP6092439B2 (en) | 2012-01-31 | 2016-02-08 | Substrate holding apparatus, polishing apparatus, and polishing method |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP5964064B2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6232297B2 (en) * | 2014-01-21 | 2017-11-15 | 株式会社荏原製作所 | Substrate holding device and polishing device |
JP6463303B2 (en) * | 2016-05-13 | 2019-01-30 | 株式会社荏原製作所 | Elastic film, substrate holding device, substrate polishing device, substrate adsorption determination method and pressure control method in substrate holding device |
SG10202002713PA (en) * | 2015-08-18 | 2020-05-28 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
SG10201606197XA (en) * | 2015-08-18 | 2017-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
US10464185B2 (en) * | 2016-03-15 | 2019-11-05 | Ebara Corporation | Substrate polishing method, top ring, and substrate polishing apparatus |
JP6705362B2 (en) * | 2016-10-25 | 2020-06-03 | 信越半導体株式会社 | Polishing head and polishing device |
KR101841364B1 (en) | 2016-11-04 | 2018-03-22 | 주식회사 씨티에스 | CMP Carrier and CMP Apparotus consisting the same |
JP2018133393A (en) | 2017-02-14 | 2018-08-23 | 東芝メモリ株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
JP2023014497A (en) * | 2021-07-19 | 2023-01-31 | 株式会社荏原製作所 | Top ring of polishing device and polishing device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6125767A (en) * | 1984-07-13 | 1986-02-04 | Nec Corp | Work holding mechanism in surface polishing machine |
JPS6125768A (en) * | 1984-07-13 | 1986-02-04 | Nec Corp | Work holding mechanism for surface polishing machine |
JPH06143126A (en) * | 1992-11-09 | 1994-05-24 | Mitsubishi Materials Corp | Polishing device |
JP3795198B2 (en) * | 1997-09-10 | 2006-07-12 | 株式会社荏原製作所 | Substrate holding device and polishing apparatus provided with the substrate holding device |
US6113468A (en) * | 1999-04-06 | 2000-09-05 | Speedfam-Ipec Corporation | Wafer planarization carrier having floating pad load ring |
JP4056205B2 (en) * | 1999-10-15 | 2008-03-05 | 株式会社荏原製作所 | Polishing apparatus and method |
JP2002270556A (en) * | 2001-03-09 | 2002-09-20 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus |
JP2003282505A (en) * | 2002-03-26 | 2003-10-03 | Fujikoshi Mach Corp | Wafer polishing equipment |
JP2008302464A (en) * | 2007-06-07 | 2008-12-18 | Renesas Technology Corp | Polishing device and manufacturing method of semiconductor device using it |
JP2008307674A (en) * | 2007-06-18 | 2008-12-25 | Tokyo Seimitsu Co Ltd | Split pressurizing type retainer ring |
JP5199691B2 (en) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | Polishing equipment |
US7749052B2 (en) * | 2008-09-08 | 2010-07-06 | Applied Materials, Inc. | Carrier head using flexure restraints for retaining ring alignment |
JP2011124302A (en) * | 2009-12-09 | 2011-06-23 | Lapmaster Sft Corp | Low center of gravity airbag type polishing head |
-
2012
- 2012-01-31 JP JP2012018538A patent/JP5964064B2/en active Active
-
2016
- 2016-02-08 JP JP2016022084A patent/JP6092439B2/en active Active
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