JPS6125767A - Work holding mechanism in surface polishing machine - Google Patents

Work holding mechanism in surface polishing machine

Info

Publication number
JPS6125767A
JPS6125767A JP14539284A JP14539284A JPS6125767A JP S6125767 A JPS6125767 A JP S6125767A JP 14539284 A JP14539284 A JP 14539284A JP 14539284 A JP14539284 A JP 14539284A JP S6125767 A JPS6125767 A JP S6125767A
Authority
JP
Japan
Prior art keywords
polishing
pressboard
workpiece
flange
spline shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14539284A
Other languages
Japanese (ja)
Inventor
Takemi Kamata
鎌田 武美
Tetsuya Yasuda
哲也 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP14539284A priority Critical patent/JPS6125767A/en
Publication of JPS6125767A publication Critical patent/JPS6125767A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To polish a work smoothly by providing an Oldham's coupling between the work holding section having convex face and the supporting section having concave section engagable slidably with the convex section. CONSTITUTION:Semi-spherical member 33 of press board 34 is engaged slidably in the concave section 32a made in the lower end flange 32 of spline shaft 31 to adsorb a material 20 through a hole 35 communicated with a tube 19 to the press board 34. The projection 38 of the flange 32 is engaged with the groove 37 of an intermediate body 37 to enable horizontal sliding of an annular intermediate body 37 while the groove 40 and the projection 41 are engaged in the perpendicular direction to constitute an Oldham's coupling between the flange 32 and the pressboard 34 where the pressboard 34 will rotate along the spline shaft 31. Since slight gap is provided axially in the coupling 42, the pressboard 34 can incline slightly in accordance to the waving of the polishing face 22 while since it can move horizontally, inclination of the pressboard 34 will never cause considerable frictional force resulting in smooth polishing.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、平面研摩装置の被加工物保持機構、特に薄板
の表面を研摩するための平面研摩装置の被加工物保持機
構に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a workpiece holding mechanism for a flat surface polishing apparatus, and particularly to a workpiece holding mechanism for a flat surface polishing apparatus for polishing the surface of a thin plate.

〔従来技術〕[Prior art]

一般に、平面研摩装置の被加工物保持機構は平面研摩装
置の研摩面上の被加工物を保持する保持部を含んで構成
され、研摩面上において被加工物を摺動させて被加工物
の表面を研摩している。
Generally, the workpiece holding mechanism of a flat surface polishing device includes a holding part that holds the workpiece on the polishing surface of the flat surface polishing device, and slides the workpiece on the polishing surface. The surface is polished.

第3図は従来の平面研摩装置の被加工物保持機構の縦断
面図である。第3図において、平面研摩装置の円盤1は
軸2を中心として回転させられる。
FIG. 3 is a longitudinal sectional view of a workpiece holding mechanism of a conventional surface polishing apparatus. In FIG. 3, a disk 1 of a surface polishing device is rotated about an axis 2. In FIG.

一方平面研摩装置のフレーム3にはスリーブ4が回転自
在に取り付けられ、このスリーブ4の軸孔にスプライン
軸5が軸方向には移動自在に、軸回りにはスリーブ4と
一体となって回転するように取り付けられている。フレ
ーム3に設けられたエアシリンダ6に取り付けられたレ
バー7はスプライン軸5に回転自在に係合している。ま
た、フレーム3に設けたモータ8に取り付けた歯車9は
、スリーブ4に設けた歯車10と噛み合っている。
On the other hand, a sleeve 4 is rotatably attached to the frame 3 of the surface polishing device, and a spline shaft 5 is movable in the axial direction in the shaft hole of the sleeve 4, and rotates together with the sleeve 4 around the shaft. It is installed like this. A lever 7 attached to an air cylinder 6 provided on the frame 3 is rotatably engaged with the spline shaft 5. Further, a gear 9 attached to a motor 8 provided on the frame 3 meshes with a gear 10 provided on the sleeve 4.

スプライン軸5の先端に設けた球面状の凹部に半球体1
1が摺動自在に係合している。半球体11に抑圧板12
が固着され、抑圧板12には枠13が設けられている。
A hemisphere 1 is placed in a spherical recess provided at the tip of the spline shaft 5.
1 is slidably engaged. Suppression plate 12 on hemisphere 11
is fixed, and a frame 13 is provided on the suppression plate 12.

枠13に設けられたピン14は、スプライン軸5の先端
部に設けた溝15に係合している。スプライン軸5と枠
13の間に設けられた圧縮ばね16は半球体11をスプ
ライン軸5に押し付けるように作用し、スリーブ軸5が
上昇したときに半球体11が落下するのを防止している
A pin 14 provided on the frame 13 engages with a groove 15 provided at the tip of the spline shaft 5. A compression spring 16 provided between the spline shaft 5 and the frame 13 acts to press the hemisphere 11 against the spline shaft 5, and prevents the hemisphere 11 from falling when the sleeve shaft 5 rises. .

押圧板12に設けられた導通孔17及び半球体11と抑
圧板12の間に設けられた導通孔18はスプライン軸3
1に設けた穴を通る管19を介して真空ポンプ(図示省
略)に連絡され、被加工物である磁気デスクの素材20
を押圧板12に真空吸着するためのものである。また素
材20の位置を決めるために押圧板12にリング21が
固設されている。
A conduction hole 17 provided in the pressing plate 12 and a conduction hole 18 provided between the hemisphere 11 and the suppression plate 12 are connected to the spline shaft 3.
A vacuum pump (not shown) is connected to the material 20 of the magnetic desk, which is the workpiece, through a pipe 19 passing through a hole provided in the
This is for vacuum suctioning the pressure plate 12 to the pressure plate 12. Further, a ring 21 is fixed to the press plate 12 in order to determine the position of the material 20.

この平面研摩装置で素材20の表面を研摩するには、エ
アシリンダ6を作動させて抑圧板12を上昇させ、素材
20を押圧板12の下面のリング21の内側に真空吸着
させる。次に、モータ8により回転させながら抑圧板1
2をエアシリンダ6により下降させ、素材20を円盤1
の研摩面22に押し付ける。また、図には示していない
が研摩面22には研摩液が散布されている。従って、素
材20の下面は、自からの回転及び円盤1の回転による
摺動で研摩される。
To polish the surface of the material 20 with this flat surface polishing device, the air cylinder 6 is operated to raise the suppressing plate 12, and the material 20 is vacuum-adsorbed inside the ring 21 on the lower surface of the pressing plate 12. Next, the suppression plate 1 is rotated by the motor 8.
2 is lowered by the air cylinder 6, and the material 20 is placed in the disk 1.
Press it against the polishing surface 22 of. Further, although not shown in the figure, a polishing liquid is sprinkled on the polishing surface 22. Therefore, the lower surface of the material 20 is polished by its own rotation and sliding movement due to the rotation of the disk 1.

円盤lの研摩面22は、平面になるように加工されてい
るが、実際には僅かであるがうねりが残されている場合
が多い。従って、素材20を研摩面22に常に密着させ
て滑らかに研摩するには、素材20及び押圧板■2を研
摩面22のうねりに従って多少傾くことができるように
する必要がある。この傾きは、半球体11のスプライン
軸伊の球状の凹部との摺動で得られ、しかも半球体11
の球面の中心Cが素材20の下面に位置するように設定
されているので、素材20は中心Cを中心として傾き、
傾いても素材20の下面の位置は変化せずに研摩するこ
とができる。
The polished surface 22 of the disk l is processed to be flat, but in reality, slight undulations are often left. Therefore, in order to keep the material 20 in close contact with the polishing surface 22 and polishing it smoothly, it is necessary to allow the material 20 and the pressing plate 2 to tilt somewhat according to the undulations of the polishing surface 22. This inclination is obtained by sliding the spline axis of the hemisphere 11 with the spherical recess, and the hemisphere 11
Since the center C of the spherical surface of is set to be located on the bottom surface of the material 20, the material 20 is tilted about the center C,
Even if the material 20 is tilted, the lower surface of the material 20 can be polished without changing its position.

なお、管19は弾性を有し、半球体11の多少の傾きは
吸収できる。また、半球体11がスプライン軸5に対し
摺動するため、ビン14と溝15の係合により押圧板1
2及び素材20までモータ8による回転が伝わるように
している。
Note that the tube 19 has elasticity and can absorb some inclination of the hemisphere 11. Also, since the hemisphere 11 slides on the spline shaft 5, the engagement between the pin 14 and the groove 15 causes the press plate 1 to
The rotation by the motor 8 is transmitted to the material 2 and the material 20.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、押圧板12及び素材20の研摩面22のうねり
に対する追従性はあまりよくなかった。この原因の一つ
は、ビン14と溝15の間に大きな摩擦力が生じるため
である。第4図はビン14に作用する力を説明するため
の概略図で、第3図の主要部の右側面図に相当する。第
4図の矢印aに示すようにスプライン軸5が回転してい
れば、素材20と研摩面22との摩擦力に釣合う力すが
ビン14により溝15に加えられる。さらに、研摩面2
2のうねりにより素材20と研摩面22との間に第4図
に示すように右側が開く状態になったとし、ピストン6
により力Pが与えられるとすると、素材20の左端に上
向きに力Pが働く。半球体11の球面の中心Cと素材2
゜の左端までの寸法をd1中心Cからビン14までの高
さをhとし、中心Cのまわりのモーメントの釣d 合を考えるとビン14に#−t−yの力も作用する。実
際にはこの力Pがかなり大きくなるため、ビン14にも
大きな力が作用し、大きな摩擦力が生じていた。
However, the followability of the pressing plate 12 and the polished surface 22 of the material 20 to the undulations was not very good. One of the reasons for this is that a large frictional force is generated between the bottle 14 and the groove 15. FIG. 4 is a schematic diagram for explaining the force acting on the bottle 14, and corresponds to the right side view of the main part of FIG. 3. When the spline shaft 5 is rotating as shown by arrow a in FIG. 4, a force that balances the frictional force between the material 20 and the polishing surface 22 is applied to the groove 15 by the pin 14. Furthermore, the polished surface 2
2, the right side is opened between the material 20 and the polished surface 22 as shown in FIG. 4, and the piston 6
Assuming that force P is applied by , force P acts upward on the left end of the material 20 . Center C of the spherical surface of hemisphere 11 and material 2
The dimension to the left end of d1 is the height from the center C to the bottle 14, and h is the balance of moments around the center C.A force of #-ty also acts on the bottle 14. In reality, this force P becomes quite large, so a large force also acts on the bottle 14, causing a large frictional force.

また第4図において、ビン14は溝15により常に左向
きに押されることとなり、研摩面22のうねりに従って
押圧板12はビン14を中心として振り回わせることと
なり、スプライン軸5に対して相対的にビン14の根元
lは左右に変位し、抑圧板12の回転に変動が生じるこ
ととなるという欠点があった。
In addition, in FIG. 4, the bottle 14 is always pushed leftward by the groove 15, and the pressing plate 12 is swung around the bottle 14 according to the undulations of the polishing surface 22, relative to the spline shaft 5. In addition, the root l of the bottle 14 is displaced from side to side, resulting in fluctuations in the rotation of the suppressing plate 12, which is a drawback.

本発明の目的は、上記欠点を除去し、被加工物の傾きの
研摩面のうねりに対する追従性がよく、また被加工物の
回転変動を少くして円滑に被加工物を研摩することが可
能な平面研摩装置の被加工物保持機構を提供することに
ある。
The purpose of the present invention is to eliminate the above-mentioned drawbacks, to have good followability to the undulations of the polishing surface due to the inclination of the workpiece, and to be able to polish the workpiece smoothly by reducing rotational fluctuations of the workpiece. An object of the present invention is to provide a workpiece holding mechanism for a flat surface polishing apparatus.

〔問題点を解決するための手段〕 本発明は、平面研摩装置の研摩面上の被加工物20を保
持し、この被加工物20の被加工面上の一点を中心とす
る凸球面を有する保持部34と、姿勢を一定に保って設
けられ前記被加工物上の一点を中心とし前記凸球面に摺
動自在に係合する凹球面を有する支持部32と、前記保
持部と前記支持部の間に設けられたオルダム継手42と
を有するものである。
[Means for Solving the Problems] The present invention holds a workpiece 20 on the polishing surface of a flat surface polishing device, and has a convex spherical surface centered at a point on the surface of the workpiece 20. a holding part 34; a supporting part 32 which is provided to maintain a constant posture and has a concave spherical surface that is centered at a point on the workpiece and slidably engages with the convex spherical surface; the holding part and the supporting part. It has an Oldham joint 42 provided between the two.

〔作用〕[Effect]

オルダム継手42を介して保持部を支持部に対して傾動
させることにより、研摩面のうねりに対する追従性を良
くし、かつ被加工物の回転変動を少なくする。
By tilting the holding part with respect to the support part via the Oldham joint 42, the ability to follow the undulations of the polished surface is improved and rotational fluctuations of the workpiece are reduced.

〔実施例の説明〕[Explanation of Examples]

次に、本発明の実施例について図面を参照して説明する
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.

円盤1、軸2、フレーム3、スリーブ4、エアシリンダ
6、レバー7、モータ8、歯車9,10は第3図に示す
ものと同じである。スプライン軸31は、軸方向には摺
動自在に軸回わりKは一体となって回転するようにスリ
ーブ4に取り付けられている。
The disk 1, shaft 2, frame 3, sleeve 4, air cylinder 6, lever 7, motor 8, and gears 9 and 10 are the same as those shown in FIG. The spline shaft 31 is attached to the sleeve 4 so as to be slidable in the axial direction and to rotate integrally around the shaft K.

スプライン軸31の下端のフランジ32(支持部)に設
けた凹球面部32aに半球体33が摺動自在に係合して
いる。半球体33に抑圧板34(保持部)が固着されて
いる。押圧板34の導通孔35は管19と連結され、素
材20を押圧板34に吸着するだめのものである。引張
りばね36は、両端をスプライン軸31と球状体33に
取り付けられ、球状体33をフランジ32に押し付けて
いる。第2図は、この実施例のフランジ32及び引張9
ばね36より上の部分を取り除いた状態の平面図である
A hemisphere 33 is slidably engaged with a concave spherical surface 32a provided on a flange 32 (supporting portion) at the lower end of the spline shaft 31. A suppression plate 34 (holding portion) is fixed to the hemisphere 33. The through hole 35 of the press plate 34 is connected to the pipe 19 and serves to attract the material 20 to the press plate 34. The tension spring 36 has both ends attached to the spline shaft 31 and the spherical body 33, and presses the spherical body 33 against the flange 32. FIG. 2 shows the flange 32 and tension 9 of this embodiment.
FIG. 7 is a plan view with a portion above the spring 36 removed.

フランジ32の周辺部と押圧板34との間には、環状の
中間体37が配置されている。中間体37が水平方向に
摺動し得るようにフランジ32に設けられた凸条部38
に中間体37の溝39が係合している。また中間体37
に設けられ水平方向で溝39と直角な方向の溝40に摺
動自在に抑圧板34に設けられた凸条部41が係合して
いる。従って、フランジ32と中間体37と抑圧板34
とでオルダム継手42を構成し、抑圧板34は、フラン
ジ32及びスプライン軸31に従って回転する。しかも
オルダム継手42の軸方向に若干の隙間43を設けてお
くことにより、押圧板34は研摩面22のうねりに従っ
て微少な範囲内で傾くことができる。さらに、オルダム
継手420機能から抑圧板34けフランジ32に対し水
平方向に移動し得るため、第4図に示すピン14と溝1
5の間に働く力因り は生じず、従って抑圧板34が傾むくときも大きな摩擦
力は生じず、押圧板12及び素材20の研摩面22のう
ねりに対する追従性はよい。
An annular intermediate body 37 is arranged between the periphery of the flange 32 and the press plate 34. A protruding portion 38 provided on the flange 32 so that the intermediate body 37 can slide in the horizontal direction
The groove 39 of the intermediate body 37 is engaged with the groove 39 of the intermediate body 37. Also, intermediate 37
A protruding strip 41 provided on the suppression plate 34 is slidably engaged with a groove 40 provided in the horizontal direction and perpendicular to the groove 39 . Therefore, the flange 32, the intermediate body 37, and the suppressing plate 34
These constitute an Oldham joint 42, and the suppression plate 34 rotates according to the flange 32 and the spline shaft 31. Moreover, by providing a slight gap 43 in the axial direction of the Oldham joint 42, the pressing plate 34 can be tilted within a very small range according to the undulations of the polished surface 22. Furthermore, since the Oldham joint 420 function allows the suppression plate 34 to move horizontally with respect to the flange 32, the pin 14 and groove 1 shown in FIG.
5, no large frictional force is generated even when the pressing plate 34 is tilted, and the pressing plate 12 and the polishing surface 22 of the material 20 can follow the undulations well.

なお、本発明は円盤が固定してあって、フレーム3とと
もに抑圧板34等が軸12を中心として旋回するような
平面研摩装置にも適用できる。
The present invention can also be applied to a flat surface polishing apparatus in which the disc is fixed and the suppressing plate 34 and the like rotate together with the frame 3 about the shaft 12.

また、フランジ32の凹球面と半球体33の凸球面の間
に鋼球等を介在させて、摩擦力を減少させることもでき
る。
Further, a steel ball or the like may be interposed between the concave spherical surface of the flange 32 and the convex spherical surface of the hemisphere 33 to reduce the frictional force.

〔発明の効果〕〔Effect of the invention〕

本発明の平面研摩装置の被加工物保持機構は、以上説明
したように溝とピンの保合の代わりにオルダム継手を設
けることにより、溝とピンとの間の大きな摩擦力を発生
させることなく、保持部が傾き、研摩面のうねりに対す
る被加工物の傾きの追従性をよくすることができる。
As explained above, the workpiece holding mechanism of the surface polishing apparatus of the present invention provides an Oldham joint instead of the groove and pin engagement, thereby eliminating the generation of large frictional force between the groove and the pin. The holding portion is tilted, and the tilt of the workpiece can be better followed with respect to the undulations of the polished surface.

また、保持部が傾くときにピンを中心として揺動するこ
とがなくなり、被加工物の回転速度の変動を非常に小さ
くすることができ、円滑に被加工物を研摩できる効果が
ある。
In addition, when the holding part is tilted, it no longer swings about the pin, making it possible to significantly reduce fluctuations in the rotational speed of the workpiece, which has the effect of smoothly polishing the workpiece.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図はそれぞれ本発明の一実施例の縦断面図
と、フランジ及び圧縮ばねより上部を除いた平面図、第
3図は平面研摩装置の被加工物保持機構の従来の一例の
縦断面図、第4図は第3図に示す一例のピンに作用する
力を説明するだめの模式図である。 1・・・円盤、5,31 スプライン軸、11 、33
・半球体、12 、34  押圧板、14・ピン、15
・溝、2o  素材、37・中間体、38 、41・・
凸条部、39 、40・溝、42・・・オルダム継手 特許出願人  日本電気株式会社 第2図 第4図
Figures 1 and 2 are a longitudinal sectional view and a plan view of an embodiment of the present invention, respectively, with the upper part removed from the flange and compression spring, and Figure 3 is an example of a conventional workpiece holding mechanism for a surface polishing device. FIG. 4 is a schematic diagram for explaining the force acting on the example pin shown in FIG. 3. 1... Disc, 5, 31 Spline shaft, 11, 33
- Hemisphere, 12, 34 Pressing plate, 14 - Pin, 15
・Groove, 2o Material, 37 ・Intermediate, 38, 41...
Convex portions, 39, 40, grooves, 42...Oldham joint patent applicant NEC Corporation Figure 2 Figure 4

Claims (1)

【特許請求の範囲】[Claims] (1)平面研摩装置の研摩面上の被加工物を保持し、こ
の被加工物の被加工面上の一点を中心とする凸球面を有
する保持部と、姿勢を一定に保つて設けられ前記被加工
物上の一点を中心とし、前記凸球面に摺動自在に係合す
る凹球面を有する支持部と、前記保持部と前記支持部の
間に設けられたオルダム継手とを有することを特徴とす
る平面研摩装置の被加工物保持機構。
(1) A holding part that holds a workpiece on the polishing surface of the flat surface polishing apparatus and has a convex spherical surface centered at a point on the surface of the workpiece, and a holding part that is provided to maintain a constant posture. It is characterized by having a support part having a concave spherical surface centered at one point on the workpiece and slidably engaged with the convex spherical surface, and an Oldham joint provided between the holding part and the support part. Workpiece holding mechanism for surface polishing equipment.
JP14539284A 1984-07-13 1984-07-13 Work holding mechanism in surface polishing machine Pending JPS6125767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14539284A JPS6125767A (en) 1984-07-13 1984-07-13 Work holding mechanism in surface polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14539284A JPS6125767A (en) 1984-07-13 1984-07-13 Work holding mechanism in surface polishing machine

Publications (1)

Publication Number Publication Date
JPS6125767A true JPS6125767A (en) 1986-02-04

Family

ID=15384193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14539284A Pending JPS6125767A (en) 1984-07-13 1984-07-13 Work holding mechanism in surface polishing machine

Country Status (1)

Country Link
JP (1) JPS6125767A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6702658B2 (en) * 2000-12-04 2004-03-09 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus utilizing an Oldham's coupling mechanism for the wafer carrier
JP2006524922A (en) * 2003-04-28 2006-11-02 ストラスバウ Wafer carrier pivot mechanism
JP2013157541A (en) * 2012-01-31 2013-08-15 Ebara Corp Substrate holding device, polishing apparatus and polishing method
CN104723188A (en) * 2015-04-15 2015-06-24 山东泰山恒信开关集团有限公司 Finishing equipment for GIS (gas insulated switchgear) equipment parts

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2006524922A (en) * 2003-04-28 2006-11-02 ストラスバウ Wafer carrier pivot mechanism
US7156946B2 (en) 2003-04-28 2007-01-02 Strasbaugh Wafer carrier pivot mechanism
JP2013157541A (en) * 2012-01-31 2013-08-15 Ebara Corp Substrate holding device, polishing apparatus and polishing method
CN104723188A (en) * 2015-04-15 2015-06-24 山东泰山恒信开关集团有限公司 Finishing equipment for GIS (gas insulated switchgear) equipment parts

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