JP2013149942A - Substrate surface processing system and substrate surface processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate surface processing system which has a compact structure and which is unconstrained by installation space.SOLUTION: A substrate surface processing system comprises: a first processing chamber 1 which includes a first end 11 and a second end 12 on both ends; a second processing chamber 2 which is arranged in parallel with the first processing chamber and which includes a third end 21 and a fourth end 22 on both ends; a third processing chamber 3 which includes a fifth end 31 and a sixth end 32 opposite to each other on both ends, in which the fifth end is integrated with the second end and the fourth end, and which communicates with the first processing chamber and the second processing chamber; a first horizontal transfer part 4 provided in the first processing chamber, for transferring a substrate in a first direction from the first end to the second end; a second horizontal transfer part 5 provided in the second processing chamber, for transferring a substrate in a second direction opposite to the first direction; a direction change part 6 for changing a transfer direction of a substrate provided in the third processing chamber from the first direction to the second direction or from the second direction to the first direction; and a first wet processing module provided at a part in at least one of the first processing chamber through the third processing chamber, for splashing a process liquid.

Description

  The present invention relates to a substrate surface treatment system and a substrate surface treatment method, and more particularly to a compact substrate surface treatment system and a substrate surface treatment method.

A driving element including a plurality of thin film transistors is formed on a substrate for forming an organic light emitting display device or a liquid crystal display device.
For this purpose, a silicon film such as a polysilicon film is formed on the substrate. As the polysilicon film, an amorphous silicon film is formed through a crystallization process such as ELA (excimer laser annealing). The polysilicon film is patterned and used as an active layer of the thin film transistor.

By the way, the amorphous silicon film and / or the polysilicon film have a silicon oxide film on the surface in a natural state.
The silicon oxide film may adversely affect the crystallization process. In addition, it affects the characteristics of the thin film transistor and may act as a contamination source for particles during the process. Therefore, the silicon oxide film must be removed before and / or after the crystallization process.
Moreover, since the polysilicon film formed through the crystallization process has a rough surface roughness, it is necessary to etch the surface to increase the surface uniformity.
For this reason, surface treatment for etching the silicon film must be performed on the surface of the substrate on which the silicon film is formed.

Patent Document 1 discloses a conventional substrate etching equipment, but discloses a method of spraying an etching solution onto a substrate while rotating the substrate. By the way, for example, such a method is suitable for a small substrate size up to 4 generations (730 × 460 mm), but it is used for a large substrate of 5.5 generations (1,300 × 1,500 mm) or more. Have difficulty. That is, a large substrate is difficult to rotate, and even if it can be rotated, the rotational speed decreases to 600 RPM or less, and unevenness occurs after etching. In addition, there is a problem that etching deviation occurs between the central portion and the edge, the liquid collides with the inner wall of the chamber, and further scatters on the substrate, resulting in unevenness of the substrate.
In order to improve this, a system for surface treatment is arranged in an in-line form. In this case, the system for performing the process may be formed too long. This causes a problem that a large amount of space for installing the system is occupied.

  In the case of Patent Document 2, the system is configured in a two-layer structure over the upper side and the lower side. This is because the steps showing the same operation process are arranged equally on the upper side and the lower side, and the amount of processed material Is intended to increase. However, if only one processing step is seen, it can be seen that the system is an inline system showing a single straight path, and the overall length of the system remains unchanged. .

JP 2004-006618 A Korean Published Patent Publication No. 2007-0048036

  The present invention is intended to overcome the above-described problems and / or limitations of the prior art, and the present invention has a more compact structure and a substrate surface processing system and a substrate surface processing method that are not limited in installation space. The purpose is to provide

  In order to achieve the above-described object, the present invention provides a first processing chamber that extends in a horizontal direction with respect to the ground and includes a first end and a second end at both ends, and a horizontal direction with respect to the ground. A second processing chamber extending in parallel with the first processing chamber and including a third end and a fourth end at both ends; and a fifth end and a sixth end facing each other at both ends. The fifth end is integrated with the second end and the fourth end, and communicates with the first processing chamber and the second processing chamber, respectively, and the first processing. A first horizontal moving unit that is installed in the chamber and transfers the substrate from the first end to the second end in a first direction parallel to the ground, and is installed in the second processing chamber and parallel to the ground A second horizontal moving unit configured to transfer the substrate in a second direction opposite to the first direction; and installed in the third processing chamber. At least one of a direction changing unit that changes the substrate transfer direction from the first direction to the second direction, or from the second direction to the first direction, and from the first processing chamber to the third processing chamber. Provided is a substrate surface processing system that includes a first wet processing module that is installed on a part of the substrate and injects at least one processing liquid onto the surface of the substrate.

According to another feature of the invention, the first end and the third end extend in parallel to each other, the second end and the fourth end extend in parallel to each other, and the first end A first gate and a second gate may be installed at one end and the third end, respectively.
According to still another aspect of the present invention, the first wet processing module is disposed in any one of the first processing chamber to the third processing chamber, and the first wet processing module is installed. In other processing chambers, a dry processing module may be disposed to dry-process the substrate surface in a dry state.
According to still another aspect of the present invention, the first wet processing module is disposed in any one of the first processing chamber to the third processing chamber, and the first wet processing module is installed. A second wet processing module for performing wet processing on the surface of the substrate may be disposed in at least one of the other processing chambers.

According to still another aspect of the present invention, the first wet processing module is disposed adjacent to a portion integrated with the second end portion of the fifth end portion of the third processing chamber. Can be.
According to still another aspect of the present invention, the first wet processing module is disposed adjacent to a portion of the fifth end of the third processing chamber that is integrally coupled to the fourth end. Can be done.
According to still another aspect of the present invention, the first wet processing module may be disposed at a portion adjacent to the second end of the third processing chamber.
The first wet processing module may be disposed in a portion of the third processing chamber adjacent to the fourth end.

According to still another aspect of the present invention, the first wet processing module may be installed in conjunction with the direction changing unit.
According to still another aspect of the present invention, the second processing chamber may be disposed under the first processing chamber.
According to still another aspect of the present invention, the first processing chamber may be disposed below the second processing chamber.
According to still another aspect of the present invention, the apparatus further includes an inclination driving unit that is disposed in at least one of the first processing chamber to the third processing chamber and inclines the substrate to incline with respect to the ground. Can do.

According to still another aspect of the present invention, the first wet processing module includes a liquid injection module and an air injection module that are integrally coupled, and the liquid injection module applies the processing liquid to the surface of the substrate. The air injection module may be installed so as to inject liquid cutting air toward the surface of the substrate.
According to still another aspect of the present invention, the first wet processing module may include a liquid ejection module having a plurality of spray nozzles.

  In order to achieve the above-mentioned object, the present invention also provides a first horizontal movement step of horizontally moving the substrate in a first direction, and moving the substrate from the first direction to a second direction opposite to the first direction. A direction changing step of changing the moving direction of the substrate so as to be horizontally moved, a second horizontal moving step of horizontally moving the substrate in the second direction, the first horizontal moving step, the direction changing step, and the There is provided a substrate surface processing method including a first wet processing step of injecting at least one processing liquid onto the substrate during at least one of the second horizontal movement steps.

  The first wet treatment process may be performed in one of the first horizontal movement process, the direction changing process, and the second horizontal movement process, and the first wet processing process may be performed. In another process where the processing process is not performed, a dry processing process may be performed in which a dry process is performed in a state where the surface of the substrate is dried.

  The first wet treatment process may be performed in one of the first horizontal movement process, the direction changing process, and the second horizontal movement process. In another process in which the wet process is not performed, a second wet process in which the surface of the substrate is processed in a wet process may be performed.

According to still another aspect of the present invention, the direction changing step may include raising the substrate in a vertical direction.
According to still another aspect of the present invention, the direction changing step may include lowering the substrate in a vertical direction.
According to still another aspect of the present invention, at least one of the first horizontal movement process, the direction changing process, and the second horizontal movement process is configured to incline the substrate so as to incline with respect to the ground. May be included.

According to still another aspect of the present invention, the tilting of the substrate includes tilting the substrate such that the surface of the substrate is tilted with respect to a direction perpendicular to the first direction or the second direction. But you can.
According to still another aspect of the present invention, the first wet processing step may include providing at least one of the processing liquid and liquid draining air on the surface of the substrate.
According to still another aspect of the present invention, the etching solution and the liquid air are provided simultaneously.

According to the present invention, by implementing a surface treatment system for a substrate having a two-layer structure, the system can be configured more compactly, and the restriction of the space in which equipment is installed can be reduced.
Moreover, application to a large area substrate becomes more useful.
Further, the first liquid and the second liquid can etch the silicon oxide film as well as the surface of the polysilicon film, and the smoothness of the surface of the polysilicon film after the silicon oxide film is etched is further improved.

In addition, by providing the first liquid and the second liquid in different time zones, the etching degree of the first liquid and the second liquid that are etching liquids can be adjusted.
Then, by providing the third liquid between the first liquid and the second liquid, which are other types of etching liquids, it becomes possible to precisely control the etching level via the buffer function, and the first liquid and the second liquid can be controlled. It is possible to prevent a problem that the desired etching rate differs by mixing with the liquid and a decrease in mass productivity due to this.

The present invention also provides the first liquid to the third liquid on the substrate surface by removing at least one of the first liquid to the third liquid from the surface of the substrate through the provision of the liquid cutting air or the tilting process. Thus, at least two liquids can be prevented from being mixed, and the desired etching accuracy can be obtained.
The present invention is more useful when applied to a large substrate.

1 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to an embodiment of the present invention. FIG. 5 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. FIG. 6 is a configuration diagram schematically illustrating a configuration of a substrate surface treatment system according to another embodiment of the present invention. It is the block diagram which illustrated an example of the 1st wet processing module of this invention. It is sectional drawing which illustrated an example of the injection module of this invention. It is the block diagram which illustrated another example of the 1st wet processing module of this invention. It is the fragmentary perspective view which illustrated an example of the spray nozzle of this invention. It is the block diagram which illustrated another example of the 1st wet processing module of this invention. It is the block diagram which illustrated another example of the 1st wet processing module of this invention. It is the fragmentary perspective view which illustrated an example of the inclination drive part of this invention. FIG. 19 is a schematic configuration diagram illustrating a state in which the substrate is tilted by the action of the tilt driving unit of FIG. 18.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is a configuration diagram schematically illustrating the configuration of a substrate surface processing system according to an embodiment of the present invention. As can be seen from FIG. 1, the substrate surface processing system according to an embodiment of the present invention includes a first processing chamber 1, a second processing chamber 2, and a third processing chamber 3.
The first processing chamber 1 is provided in the form of a chamber extending in the horizontal direction with respect to the ground, and includes a first end 11 and a second end 12 at both ends.
A first gate 14 is installed at the first end 11, and the substrate 10 is put into the first processing chamber 1 through a first transfer robot (not shown) through the first gate 14. The The second end portion 12 is provided with a first communication passage 15 and communicates with the third processing chamber 3.

  The first processing chamber 1 is provided with a first horizontal moving unit 4 for transferring the substrate 10 in a first direction X1 horizontal to the ground. The first direction X1 is a direction from the first end portion 11 toward the second end portion 12. According to an embodiment of the present invention, the first horizontal moving unit 4 may include a plurality of first driving rollers 41, but is not necessarily limited thereto, and the substrate 10 is placed in the first direction X1. It can be various linear moving means that can be linearly transferred.

The second processing chamber 2 is also provided in the form of a chamber extending in the horizontal direction with respect to the ground, and includes a third end portion 21 and a fourth end portion 22 at both ends.
A second gate 24 is provided at the third end 21, and the substrate 10 is discharged to the outside of the second processing chamber 2 through the second gate 24. The fourth end portion 22 is provided with a second communication passage 25 and communicates with the third processing chamber 3.

  The second processing chamber 2 is provided with a second horizontal moving unit 5 for transferring the substrate 10 in a second direction X2 horizontal to the ground. The second direction X2 is a direction from the fourth end 22 toward the third end 21 when viewed in FIG. 1 in the direction opposite to the first direction X1. According to an embodiment of the present invention, the second horizontal moving unit 5 may include a plurality of second driving rollers 51, but is not necessarily limited thereto, and the substrate 10 is moved in the second direction X2. It can be various linear moving means that can be linearly transferred.

  The third processing chamber 3 is in the form of a chamber, and includes a fifth end portion 31 and a sixth end portion 32 that are opposed to each other at both ends. The fifth end 31 is coupled to the second end 12 of the first processing chamber 1 and the fourth end 22 of the second processing chamber 2. And it is connected with the 1st processing chamber 1 and the 2nd processing chamber 2 via the 1st communicating path 15 and the 2nd communicating path 25, respectively.

A direction changing unit 6 is installed in the third processing chamber 3. The direction changing unit 6 changes the transfer direction of the substrate 10 from the first direction X1 to the second direction X2.
The direction changing unit 6 includes a plurality of third driving rollers 61, and horizontally moves the substrate 10 in the first direction X1 and / or the second direction X2. The direction changing unit 6 includes a vertical moving unit 62 and moves the third driving roller 61 vertically.

As can be seen from FIG. 1, the third processing chamber 3 extends in a direction perpendicular to the ground, and the fifth end portion 31 and the sixth end portion 32 are each extended in a perpendicular direction. Both sides of the chamber are formed.
In one embodiment of the present invention, the first end 11 of the first processing chamber 1 and the third end 21 of the second processing chamber 2 are extended side by side. The second end 12 of the first processing chamber 1 and the fourth end 22 of the second processing chamber 2 are also extended side by side.

As can be seen from FIG. 1, the first processing chamber 1 is disposed above the second processing chamber 2 and is connected to the upper side of the fifth end 31 of the third processing chamber 3. The third processing chamber 3 is connected to the lower side of the fifth end 31.
However, the present invention is not necessarily limited to this. As can be seen from FIG. 2, the second processing chamber 2 is disposed above the first processing chamber 1, and the fifth end of the third processing chamber 3. The first processing chamber 1 is connected to the lower side of the fifth end 31 of the third processing chamber 3.

  Meanwhile, at least one of the first processing chamber 1 to the third processing chamber 3 as described above may include at least one processing liquid on the surface of the substrate 10 as can be seen from FIGS. 3 to 11. The 1st wet processing module 7 which injects may be installed.

  In the embodiment according to FIG. 3, the first wet processing module 7 is located in one processing chamber 1. At this time, the first wet processing module 7 may be positioned adjacent to the second end 12 of the first processing chamber 1. Therefore, the wet processing can be performed by spraying the processing liquid onto the surface of the substrate 10 before exiting the first processing chamber 1 through the first communication path 15. However, the present invention is not necessarily limited to this, and the first wet processing module 7 may be located in the center of the one processing chamber 1.

  In the embodiment according to FIG. 4, the first wet processing module 7 is located in the second processing chamber 2. At this time, the first wet processing module 7 may be positioned adjacent to the fourth end 22 of the second processing chamber 2. Accordingly, the wet processing can be performed by spraying the processing liquid onto the surface of the substrate 10 that has been carried into the second processing chamber 2 or carried in via the second communication path 25. However, the present invention is not necessarily limited to this, and the first wet processing module 7 may be located in the center of the second processing chamber 2.

  In the embodiment according to FIG. 5, the first wet processing module 7 is located on the upper left side of the third processing chamber 3, and therefore adjacent to the portion of the fifth end 31 coupled to the second end 12. Is located. As a result, the first wet processing module 7 is positioned adjacent to the first communication path 15, and the substrate 10 loaded into the third processing chamber 3 through the first communication path 15. The wet processing can be performed by spraying the processing liquid.

  In the embodiment according to FIG. 6, the first wet processing module 7 is located in the upper center of the third processing chamber 3, but is therefore located in a portion near the second end 12 of the third processing chamber 3. Accordingly, the first wet processing module 7 can perform wet processing by injecting a processing liquid onto the substrate 10 after being carried into the third processing chamber 3 through the first communication path 15. .

  In the embodiment according to FIG. 7, the first wet processing module 7 is located in the lower center of the third processing chamber 3, but is therefore located in a portion near the fourth end 22 of the third processing chamber 3. Accordingly, the first wet processing module 7 injects the processing liquid onto the substrate 10 in a state where the substrate 10 is lowered to the lower portion of the third processing chamber 3, that is, immediately after the direction is changed, to perform wet processing. Processing becomes possible.

  In the embodiment according to FIG. 8, the first wet processing module 7 is located on the lower left side of the third processing chamber 3, and therefore adjacent to the portion of the fifth end 31 coupled to the fourth end 22. Is located. As a result, the first wet processing module 7 is positioned adjacent to the second communication path 25, and the substrate 10 that has escaped from the third processing chamber 3 through the second communication path 25. The wet processing can be performed by spraying the processing liquid.

  In the embodiment according to FIG. 9, the first wet processing module 7 is provided to be interlocked with the driving of the direction changing unit 6. Thereby, while the operation of the vertical moving unit 62 of the direction changing unit 6 is proceeding, that is, while the substrate 10 is being transferred from the upper part to the lower part in the third processing chamber 3, or from the lower part. While being transferred to the upper part, a wet process can be performed by spraying a processing liquid onto the substrate 10.

In the embodiment according to FIG. 10, the first wet processing module 7 is installed in the first processing chamber 1 as shown in FIG. 3, and the second wet processing module 7 ′ is installed in the second processing chamber 2. is there.
The second wet processing module 7 ′ can provide the same processing liquid as the first wet processing module 7 to the substrate 10, and provides a processing liquid different from the first wet processing module 7 to the substrate 10. You can also The second wet processing module 7 ′ may be a module that wet-processes the surface of the substrate 10, such as a rinse unit or a preliminary humidification unit.

  FIG. 10 shows that the first wet processing module 7 is formed in the first processing chamber 1 as shown in FIG. 3, but the present invention is not necessarily limited to this. Also in the embodiment according to FIG. 9, at least one of the first processing chamber 1 to the third processing chamber 3 except the processing chamber where the first wet processing module 7 is installed, A second wet processing module 7 ′ for processing the surface of the substrate 10 by a wet process may be located.

In the embodiment according to FIG. 11, as shown in FIG. 7, the first wet processing module 7 is installed in the third processing chamber 3, and the dry processing module 8 is installed in the first processing chamber 1.
The dry processing module 8 may be a module that processes the surface of the substrate 10 in a dry manner, like a plasma supply unit.

  FIG. 11 shows that the first wet processing module 7 is formed in the third processing chamber 3 as shown in FIG. 7, but the present invention is not necessarily limited to this. 3 to 6, 8 and 9, among the remaining processing chambers of the first processing chamber 1 to the third processing chamber 3 except for the processing chamber in which the first wet processing module 7 is installed. At least one of them may be a dry processing module 8 for processing the surface of the substrate 10 by dry processing. In addition, as shown in FIG. 10, even when the second wet processing module 7 ′ is installed in a processing chamber other than the processing chamber in which the first wet processing module 7 is installed, the second wet processing module 7 The dry processing module 8 may be installed in the processing chamber in which 'is installed, or in other processing chambers other than that.

FIG. 12 illustrates an example of the first wet processing module 7.
The first wet processing module 7 includes an injection module 72, a controller 70, a first storage tank 711, a second storage tank 712 and a third storage tank 713, and an air tank 714.

The substrate 10 before being processed according to the present invention may include various substrates used for displays, but includes a base substrate 101, a silicon film 102, and a silicon oxide film 103.
Although the base substrate 101 may include a glass, plastic, or metal substrate, an insulating film made of an organic material and / or an inorganic material may be further provided on the surface even though it is not shown in the drawing.

  The silicon film 102 can be obtained by forming an amorphous silicon film on the surface of the base substrate 101. Such a silicon film 102 may become a polysilicon film through a crystallization process in a subsequent process. The crystallization process may be a laser crystallization process such as ELA (excimer laser annealing), but is not necessarily limited to this, and various crystallization processes may be used. A polysilicon film obtained by crystallizing the silicon film 102 may be used as an active layer of a thin film transistor of a display. Of course, the amorphous silicon film may also be used as an active layer of a thin film transistor through patterning, doping, and the like.

The silicon oxide film 103 is formed on the surface of the silicon film 102. The silicon oxide film 103 is an oxide film naturally formed by bonding the surface of the silicon film 102 with oxygen or nitrogen in the air, and is generally formed to a thickness of 5 to 1,000 mm.
The substrate 10 as described above is not limited to the substrate in which the silicon film 102 is formed on the base substrate 101 as described above, and various kinds of substrates including silicon films such as a silicon wafer including a silicon film can be used. It goes without saying that a substrate may be applied.
The injection module 72 includes a liquid injection module 72a for selectively providing the first liquid to the third liquid on the surface of the substrate 10, and an air injection module for providing liquid draining air on the surface of the substrate 10. 72b.

  The first liquid is stored in the first storage tank 711, and includes a solution of a component that can etch the silicon oxide film 103 formed on the surface of the silicon film 102. In a preferred embodiment of the present invention, the first liquid may be a solution containing an ozone solution. As the first liquid, an etching rate with respect to the silicon oxide film 103 is lower than that of the second liquid described later. Rather, it can function as a cleaning agent for cleaning organic substances on the surface of the substrate 10. Accordingly, the first liquid can be replaced with a neutral or alkaline cleaning agent.

  Although the second liquid is stored in the second storage tank 712, the silicon oxide film 103 formed on the surface of the silicon film 102 can be etched, and the second liquid has components different from the first liquid. A solution having a higher etching rate with respect to the silicon oxide film than one solution is used. In a preferred embodiment of the present invention, the second liquid may be a solution containing a hydrofluoric acid or ammonium fluoride solution.

  The third liquid is stored in a third storage tank 713, and at least one of the first liquid and the second liquid can be diluted from the surface of the substrate 10, which is a preferred embodiment of the present invention. According to a form, it may contain water, and it is desirable to use deionized pure water (DI water). The third liquid can perform a function as buffer water that stops the action of the first liquid and the second liquid, which are etching liquids, on the surface of the substrate 10.

  The liquid ejecting module 72a provides the first liquid to the third liquid so that each of the first liquid to the third liquid can be pushed and spread on the substrate 10; The first liquid to the third liquid are provided on the surface of the substrate 10 while reciprocating linearly in one direction.

  The liquid ejecting module 72a may be designed to have a function to selectively supply the first liquid to the third liquid to the liquid ejecting module 72a. For this purpose, a separate means (not shown) for discharging the first liquid to the third liquid to the liquid ejecting module 72a may be provided.

  A first on-off valve 715, a second on-off valve 716, and a third on-off valve 717 are interposed between the first storage tank 711, the second storage tank 712, the third storage tank 713, and the liquid injection module 72a. Connected. The first on-off valve 715 to the third on-off valve 717 are connected to the control unit 70, and electronic valves whose opening / closing is controlled by the control unit 70 may be used.

  On the other hand, in FIG. 12, the first storage tank 711, the second storage tank 712, and the third storage tank 713 are all provided, but the present invention is not necessarily limited to this, and is illustrated in the drawing. Even if not, only the first storage tank 711 and the second storage tank 712 are provided, and the first liquid and the second liquid are provided on the surface of the substrate 10 in different time zones as will be described later. Thus, the substrate smoothness can be obtained together with the removal of the silicon oxide film 103.

  You may provide with respect to the board | substrate 10 in order of a 1st liquid, a 3rd liquid, and a 2nd liquid. When the liquid ejecting module 72a operates while reciprocating, the first liquid, the third liquid, the second liquid, the third liquid, and the first liquid are provided in this order.

  The order in which the first to third liquids are provided can be changed depending on the process conditions. For example, the first liquid and the third liquid are provided in the order of the second liquid, the third liquid, and the first liquid. Or in the order of the second liquid and the third liquid. Of course, also in this case, when the liquid ejecting module 72a operates while reciprocating, provision in the reverse order may be repeated.

  In addition, the third liquid may be provided in the order of the first liquid and the second liquid without providing the third liquid. Also in this case, when the liquid ejection module 72a operates while reciprocating, provision in the reverse order may be repeated.

  In this way, the present invention provides the first liquid and the second liquid, which are etching liquids having different etching rates, to the substrate 10 in different time zones, thereby simultaneously cleaning the surface of the substrate 10 and oxidizing the silicon. The degree of etching of the film 103 can be effectively controlled, and the smoothness of the surface of the silicon film 102 from which the silicon oxide film 103 has been removed can be improved.

  In addition, by providing the third liquid to the substrate 10, the first liquid and / or the second liquid remaining on the surface of the substrate 10 has an effect of washing with the third liquid, The problem that the first liquid and the second liquid remaining on the surface of the substrate 10 are mixed and a desired etching rate cannot be obtained can be prevented in advance. As a result, accurate etching rate management can be performed, and the uniformity of quality can be enhanced even when applied to a mass production process.

The provision of the first liquid to the third liquid is not limited to a single reciprocating scan, and at least two liquids among the first liquid to the third liquid are detected in at least two or more scans for each liquid. Including the case where it is selectively provided.
FIG. 12 shows an embodiment in which the first liquid to the third liquid are selectively provided through one liquid ejection module 72a, but the present invention is not necessarily limited to this.

  For example, the liquid ejection module 72a may include three liquid supply modules that are connected to the first storage tank 711 to the third storage tank 713 and are driven independently of each other. These may be coupled to each other so as to operate integrally. In addition, the liquid ejecting module 72a may include two liquid providing modules that are driven independently of each other, and any one of the first storage tank 711, the second storage tank 712, and the third storage tank 713 may be used. It is connected to two storage tanks, but they are connected in different combinations.

  On the other hand, an air injection module 72b is installed in front of and behind the liquid injection module 72a. The air injection module 72 b is also connected to the control unit 70.

  The air injection module 72b is for providing liquid cutting air to the surface of the substrate 10, and is movable in the same direction as the liquid injection module 72a. The liquid ejecting module 72a and the air ejecting module 72b may be configured to perform horizontal driving by separate linear driving means.

  The air injection module 72b is connected to an air tank 714. An air pump (not shown) is provided in or outside the air injection module 72b. The air injection module 72 b is connected to the control unit 70, and intermittently injects liquid-split air by the action of the control unit 70.

A fourth opening / closing valve 718 is further connected between the air injection module 72b and the air tank 714. The fourth opening / closing valve 718 is connected to the control unit 70, and the opening / closing is controlled by the control unit 70. It may be an electronic valve.
The air injection module 72b is provided with an injection nozzle suitable for injecting liquid cutting air, but a nozzle capable of injecting a liquid cutting air curtain may be used.

  The liquid draining air is provided to the substrate 10 in the previous stage, and removes at least one of the first liquid to the third liquid remaining on the surface of the substrate 10 by air pressure. The first to third liquids are not mixed with each other on the surface of the substrate 10, and in particular, the concentration of the etching liquid such as the first liquid and the second liquid is inherently higher on the surface of the substrate 10. It can be prevented that the concentration differs from the intended concentration. Therefore, in particular, the etching rate of the first liquid and the second liquid can be accurately controlled by the liquid cutting air, and the buffering action by the third liquid can be easily controlled.

  In FIG. 12, the air injection module 72b is illustrated as being provided with two, but is not necessarily limited thereto, and may be provided in various numbers depending on the equipment design conditions, etc. At least two of the first liquid to the third liquid can be prevented from being mixed with each other. For example, the air injection module 72b may be disposed only in any one of the front and the rear with the liquid injection module 72a as the center.

  The liquid cutting air may be injected so as to overlap with at least one of the first liquid to the third liquid. At this time, the superimposition means that liquid draining air is sprayed onto the substrate 10 while at least one of the first to third liquids is sprayed and acts on the substrate 10. According to an embodiment of the present invention, the air injection module 72b is operated simultaneously with the liquid injection module 72a, and at least one of the first liquid to the third liquid is injected, and liquid cut air is also injected. To be.

  FIG. 13 shows an example of the injection module 72 described above. In the embodiment according to FIG. 13, the first liquid ejecting module 721 and the second liquid ejecting module 722 are combined to form one liquid ejecting module 72a. The air injection module 72b is arranged.

  The liquid ejecting module 72a includes a first liquid ejecting module 721 and a second liquid ejecting module 722. The first liquid ejecting module 721 and the second liquid ejecting module 722 have two plate-like members, respectively. A liquid injection hole 723 is formed inside each, and a liquid supply pipe 724 is connected to the outside. The liquid supply pipe 724 is connected to an external storage tank (not shown).

  The first liquid and the third liquid may be selectively ejected through the first liquid ejecting module 721, and the second liquid is ejected through the second liquid ejecting module 722. Also good. However, the present invention is not necessarily limited thereto, and the second liquid and the third liquid may be selectively ejected through the first liquid ejecting module 721. The second liquid ejecting module 722 may be The first liquid may be ejected through the above. The first liquid and the second liquid may be selectively ejected through the first liquid ejection module 721, and the third liquid is ejected through the second liquid ejection module 722. May be.

  The air injection module 72b is also formed by joining two plate-like members to each other, and an air injection hole 725 is formed inside each, and an air supply pipe 726 is connected to the outside. Has been. The air supply pipe 726 is connected to an external air tank (not shown).

  The liquid ejecting module 72a and the air ejecting module 72b have a structure extending in a straight line in the width direction of the substrate 10, and are fixed by coupling brackets 727 at both ends thereof. The coupling bracket 727 is configured to adjust the coupling angle of the air injection module 72b, and the injection angle of the liquid cut air via the air injection module 72b may be adjusted.

  Such an injection module 72 can inject the etching liquid, the cleaning liquid, and the liquid cutting air by a single module, so that the entire equipment, particularly the equipment structure of the processing chamber, can be made compact. This is because the equipment of the linear motor that reciprocates the injection module 72 is greatly reduced, and at the same time, the configuration of the pump and valve equipment can be reduced.

FIG. 14 illustrates another embodiment of the first wet processing module 7.
The injection module 72 of the embodiment illustrated in FIG. 14 includes a liquid injection module 72a and an air injection module 72b. The liquid ejection module 72 a is configured in a form including a plurality of spray nozzles 73.

The spray nozzle 73 is disposed along the longitudinal direction of the substrate 10 and is provided to spray any one of the first liquid to the third liquid at a time over the entire area of the substrate 10. The
In this structure, the liquid ejecting module 72a may be fixed and can eject liquid over the entire surface of the substrate 10 at the same time. Of course, at this time, the first to third liquids must be selectively sprayed onto the substrate 10.

And the air injection module 72b can move along the surface of a board | substrate, and can inject liquid cutting air to a board | substrate.
In a state where the spray nozzle 73 is fixed, the substrate 10 can swing while reciprocating forward and backward. At this time, the peristaltic distance of the substrate 10 is equal to or greater than the interval between the spray nozzles 73, and thus the liquid is ejected by being pushed over the entire surface of the substrate 10.

FIG. 15 illustrates an example of the spray nozzle 73.
The spray nozzle 73 according to the embodiment of the present invention illustrated in FIG. 15 includes a first supply pipe 731 and a second supply pipe 732 that connects both ends of the first supply pipe 731 to each other.

First blocks 733 are connected to both ends of the first supply pipe 731. The second supply pipe 732 has a length corresponding to the length of the first supply pipe 731, and a second block 734 is connected to both ends of the second supply pipe 732.
A third supply pipe 735 is connected between the first block 733 at both ends of the first supply pipe 731 and the second block 734 at both ends of the second supply pipe 732, and the first supply pipe 731 and the second block 734 are connected to each other. 2 supply pipes 732 are connected to each other. A fourth supply pipe 736 is connected to one of the second blocks 734 so that the liquid is supplied. The fourth supply pipe 736 may be connected to one of the first blocks 733. The fourth supply pipe 736 is connected to an external storage tank (not shown).

  Thus, by connecting both ends of the first supply pipe 731 to each other by the second supply pipe 732, the liquid is supplied to the first supply pipe 731 relatively uniformly over the entire longitudinal direction thereof, thereby Deviations related to the amount of liquid discharged from each nozzle 737 can also be reduced.

  On the other hand, in FIG. 14, all the spray nozzles 73 are connected to the first storage tank 71 to the third storage tank 713 via the first opening / closing valve 715, the second opening / closing valve 716 and the third opening / closing valve 717. However, the present invention is not necessarily limited to this, and as can be seen from FIG. 16, the first storage tank 711 to the third storage tank 713 are respectively connected to the first spray nozzles 73a to 73a. 3 connected to the spray nozzle 73c. At this time, it is desirable that the first spray nozzle 73a to the third spray nozzle 73c are alternately arranged. In this case, the peristaltic distance of the board | substrate 10 becomes more than the space | interval between the 1st spray nozzle 73a, the 2nd spray nozzle 73b, or the 3rd spray nozzle 73c.

  Although not shown in the drawings, a part of the spray nozzle 73 is part of one of the first storage tank 711, the second storage tank 712, and the third storage tank 713, and the other part. Can be connected to one storage tank among the first storage tank 711, the second storage tank 712, and the third storage tank 713, respectively.

  The embodiment according to FIGS. 14 and 16 described above shows a case where a plurality of rows of spray nozzles 73 are used. As can be seen from FIG. 17, the first storage tank 711 and the second storage tank are provided in one row. 712 and the third storage tank 713 may be included in the first spray nozzle 73a to the third spray nozzle 73c, respectively. At this time, it is desirable that the first spray nozzle 73a to the third spray nozzle 73c are alternately arranged.

  In such a structure, the width of the substrate 10 is further increased in the front-rear direction, so that the substrate 10 can be swung more than the length of the substrate 10, and the liquid can be sufficiently supplied over the entire surface of the substrate 10. it can. However, the present invention is not necessarily limited to this, and in this case, the injection module 72 can perform a reciprocating linear motion along the longitudinal direction of the substrate 10.

  In the embodiment according to FIG. 17, the first storage tank 711, the second storage tank 712, and the third storage tank 713 are respectively connected to the first opening / closing valve 715 in the first spray nozzle 73 a to the third spray nozzle 73 c provided in one row. , The second opening / closing valve 716 and the third opening / closing valve 717 are connected to each other, but the present invention is not necessarily limited thereto, and the first storage tank 711 is provided in a single spray nozzle. , The second storage tank 712 and the third storage tank 713 may be connected via an open / close valve. In this case, the single spray nozzle selectively sprays any one of the first liquid to the third liquid by the operation of the opening / closing valve.

  Although the embodiment illustrated in FIG. 17 does not include an air injection module, in this case, the liquid on the surface can be removed by inclining the substrate 10 by a predetermined angle after the liquid injection. However, the present invention is not necessarily limited to this, and as can be seen from the embodiment according to FIG. 17, the liquid-split air can be jetted onto the surface of the substrate 10 using an air jet module. On the other hand, in the embodiment according to FIGS. 12, 14 and 16, the substrate can be inclined and the liquid on the surface can be removed without the air injection module.

  The first wet processing module 7 including the spray module 72 as described above is not necessarily provided in a single form, and a plurality of the first wet processing modules 7 are sequentially arranged along the traveling direction of the substrate 10. It is also possible to perform a multistage wet process by spraying a treatment liquid onto the surface of the substrate 10. At this time, only a plurality of injection modules 72 may be sequentially positioned, and a plurality of first wet processing modules 7 may be sequentially positioned.

  It goes without saying that the first wet processing module described above may be applied to the second wet processing module in the same manner.

FIG. 18 illustrates an example of the tilt driving unit 9 for tilting the substrate 10.
As can be seen from FIG. 18, the tilt drive unit 9 includes a frame 90. The frame 90 extends in the first direction X1 and is separated from each other in parallel with the first frame 90a and the second frame 90b. The frame 90 extends in the direction Y perpendicular to the first direction X1 and is separated in parallel with each other. 3 frames 90c and a fourth frame 90d. The first frame 90a to the fourth frame 90d are coupled so as to form a substantially square shape. The third frame 90c positioned at one end in the first direction X1 is positioned lower than the other frames so that the substrate is easily carried in.

Support rollers 93 that support the side surfaces of the substrate are installed on the top surfaces of the first frame 90a and the second frame 90b. And the support roller 93 may be installed in the upper surface also to the 4th flame | frame 90d located in the other end of the 1st direction X1.
As can be seen from FIG. 18, a plurality of support rods 92 are arranged at regular intervals on the first frame 90a and the second frame 90b. Each support bar 92 is provided with a plurality of drive rolls 91 spaced apart from each other by a predetermined distance. Both ends of each support bar 92 are embedded in the first frame 90a and the second frame 90b, respectively. Gears are installed at both ends of each support bar 92. At least one of the first frame 90a and the second frame 90b is provided with a helical gear, and the helical gear is rotated by a separate driving unit (not shown). When the helical gear is rotated by the drive unit, this rotational force is transmitted, and the plurality of support rods 92 are rotated, whereby the drive roll 91 is rotated simultaneously.

An elevating part 94 is coupled to the lower surface of the frame 90. The elevating unit 94 includes a device that can reciprocate the frame 90 in the vertical direction. For example, a cylinder device may be used.
The elevating part 94 includes a pair of first elevating parts 94a coupled to the lower part of the first frame 90a and a pair of second elevating parts 94b coupled to the lower part of the second frame 90b.

  The inclination is made possible by adjusting the contraction length of the first elevating part 94a and the second elevating part 94b. That is, if the first elevating part 94a is further reduced than the second elevating part 94b, the substrate 10 may be changed from the first position P1 to the second position P2, as can be seen from FIG. In this case, the substrate 10 is not lowered further by the support roller 93 on the first frame 90a.

  The tilt driving unit 9 as described above may be mounted in at least a part of the processing chambers of all the embodiments of the present invention according to FIGS. 1 to 11. That is, the tilt driving unit 9 can be installed in a part of the first horizontal moving unit 4, or the tilt driving unit 9 can be installed in a part of the second horizontal moving unit 5. And the inclination drive part 9 can be installed in at least one part of the direction change part 6. FIG.

  As described above, when the substrate 10 is tilted by the tilt driving unit 9, not only the remaining liquid on the substrate surface is removed, but also when the substrate 10 is a large area substrate, the handling property can be further improved. When tilting the board, the equipment size in the board width direction can be reduced, the equipment installation space can be further reduced, and when applied to a large area board through adjustment of the tilt angle θ, The handling property can be further improved.

  When rinsing the surface of the substrate 10 with pure water or pre-humidification with the substrate 10 tilted, the liquid on the surface of the substrate 10 is naturally removed, and the progress of subsequent steps is further advantageous.

  When the substrate 10 moves toward the first wet processing module 7, the substrate 10 can be further restored to the first position P1 in FIG. However, at this time, a plurality of position adjusting pins are arranged at the lower part of the substrate 10 and the substrate is naturally placed on the pins, so that the substrate can be immediately adjusted without adjusting the position of the substrate 10. The step of spraying the treatment liquid onto the surface can be performed, and the overall process tact time can be shortened.

The substrate surface treatment system as described above performs substrate surface treatment by the following method.
Referring to the embodiment according to FIG. 3, first, a substrate 10 is loaded into the first processing chamber 1 disposed on the upper side through the first gate 14 using a transfer robot (not shown). It is moved horizontally in the first direction X1 in the processing chamber 1. At this time, although not shown, the first processing chamber 1 has a pre-humidification zone, and the substrate surface can be pre-humidified by spraying pure water on the surface of the substrate 10.

In the embodiment according to FIG. 3, since the first wet processing module 7 exists in the first processing chamber 1, the first wet processing module 7 advances the first wet processing step on the surface of the substrate 10.
Next, the direction of the substrate 10 moved to the third processing chamber 3 through the first communication path 15 is changed through the direction changing module 6 so as to be horizontally movable in the second direction X2. According to the embodiment of the present invention, the substrate 10 moved to the third processing chamber 3 is moved downward by the vertical moving unit 62 and then moved in the second direction X2 by the operation of the third driving roller 61. It is advanced.

  Then, the substrate 10 is moved to the second processing chamber 2 through the second communication path 25. Also in the second processing chamber 2, the second processing chamber 2 is moved in the second direction X <b> 2 and discharged to the outside through the second gate 24. Outside, a transfer robot (not shown) is waiting to receive the processed substrate.

  It goes without saying that the first wet processing step is performed in the second processing chamber 2 in the embodiment according to FIG. 4 and in the third processing chamber 3 in the embodiments according to FIGS.

  As described with reference to FIG. 10, in the first horizontal movement process, the direction changing process, and the second horizontal movement process, the second wet processing module 7 is a process in which the first wet processing process is not performed. The second wet processing step of processing the surface of the substrate 10 by a wet process may be performed.

  In addition, as described with reference to FIG. 11, among the first horizontal movement process, the direction changing process, and the second horizontal movement process, in the process in which the first wet processing process is not performed, the dry processing module 8 A dry processing process may be performed in which the surface of the substrate 10 is dried.

  Although the above-described method has shown the case where the first processing chamber 1 is disposed at the upper portion and the second processing chamber 2 is disposed at the lower portion as shown in FIG. 1, the present invention is not necessarily limited to this. However, as can be seen from FIG. 2, it is needless to say that the same can be applied to the case where the first processing chamber 1 is disposed in the lower portion and the second processing chamber 2 is disposed in the upper portion.

  As described above, according to the substrate surface treatment system and the substrate surface treatment method of the present invention, the surface treatment of the substrate 10 is generally performed in a “U” shape, and the system is configured in-line. Obviously, the system can be configured in a compact manner, and the installation space can be reduced.

  The present invention has been described with reference to an embodiment illustrated in the accompanying drawings, which is illustrative only and various modifications and variations will occur to those of ordinary skill in the art. It will be understood that other equivalent embodiments are possible. Accordingly, the true scope of protection of the present invention is determined solely by the appended claims.

  The compact substrate surface treatment system and substrate surface treatment method of the present invention can be effectively applied to, for example, the technical field related to display substrates.

1: first processing chamber 10: substrate 101: base substrate 102: silicon film 103: silicon oxide film 11: first end portion 12: second end portion 14: first gate 15: first communication path 2: second processing Chamber 21: Third end 22: Fourth end 24: Second gate 25: Second communication path 3: Third processing chamber 31: Fifth end 32: Sixth end 4: First horizontal movement unit 41 : 1st driving roller 5: 2nd horizontal movement part 51: 2nd driving roller 6: Direction change part 61: 3rd driving roller 62: 4th driving roller 7: 1st wet processing module 7 ': 2nd wet processing module 70: Control unit 711: First storage tank 712: Second storage tank 713: Third storage layer 714: Air tank 715: First on-off valve 716: Second on-off valve 717: Third on-off valve 718: Fourth on-off valve 72: Injection module 72a: Liquid Injection module 72b: air injection module 721: first liquid injection module 722: second liquid injection module 723: liquid injection hole 724: liquid supply pipe 725: air injection hole 726: air injection pipe 727: coupling bracket 73 : Spray nozzle 73a: first spray nozzle 73b: second spray nozzle 73c: third spray nozzle 731: first supply pipe 732: second supply pipe 733: first block 734: second block 735: third supply pipe 736 : Fourth supply pipe 737: Nozzle 8: Dry processing module 9: Inclined drive unit 90: Frame 90 a: First frame 90 b: Second frame 90 c: Third frame 90 d: Fourth frame 91: Drive roll 92: Support rod 93 : Support roller 94: Lifting part 94a: First lifting part 94b: Second lifting part P1 The first position P2: second position

Claims (23)

A first processing chamber that extends in a horizontal direction with respect to the ground and includes a first end and a second end at both ends;
A second processing chamber that extends in a horizontal direction with respect to the ground, is disposed in parallel with the first processing chamber, and includes a third end and a fourth end at both ends;
Each end includes a fifth end and a sixth end facing each other, and the fifth end is integrated with the second end and the fourth end, and the first processing chamber and the second end are integrated. A third processing chamber respectively connected to the processing chamber;
A first horizontal moving unit installed in the first processing chamber and transferring a substrate from the first end to the second end in a first direction parallel to the ground;
A second horizontal moving unit installed in the second processing chamber and transporting the substrate in a second direction parallel to the ground and opposite to the first direction;
A direction changing unit that is installed in the third processing chamber and changes the transfer direction of the substrate from the first direction to the second direction or from the second direction to the first direction;
A first wet processing module installed in a part of at least one of the first processing chamber to the third processing chamber and injecting at least one processing liquid onto the surface of the substrate;
A substrate surface treatment system comprising:   The first end and the third end extend in parallel with each other, the second end and the fourth end extend in parallel with each other, and the first end and the third end The substrate surface processing system according to claim 1, wherein a first gate and a second gate are respectively installed.   The first wet processing module is disposed in any one of the first processing chamber to the third processing chamber, and the other processing chamber in which the first wet processing module is not installed includes the substrate. The substrate surface processing system according to claim 1, wherein a dry processing module is disposed to dry-process the surface of the substrate in a dry state.   The first wet processing module is disposed in any one of the first processing chamber to the third processing chamber, and is disposed in at least one of the other processing chambers in which the first wet processing module is not installed. The substrate surface processing system according to claim 1, wherein a second wet processing module for performing wet processing on the surface of the substrate is disposed.   The first wet processing module is disposed adjacent to a portion integrated with the second end portion of the fifth end portion of the third processing chamber. Substrate surface treatment system.   The first wet processing module is disposed adjacent to a portion of the fifth end of the third processing chamber that is integrally coupled to the fourth end. The substrate surface treatment system as described.   The substrate surface processing system according to claim 1, wherein the first wet processing module is disposed in a portion adjacent to the second end of the third processing chamber.   The substrate surface processing system according to claim 1, wherein the first wet processing module is disposed in a portion adjacent to the fourth end of the third processing chamber.   The substrate surface processing system according to claim 1, wherein the first wet processing module is installed so as to be interlocked with the direction changing unit.   10. The substrate surface processing system according to claim 1, wherein the second processing chamber is disposed below the first processing chamber. 11.   10. The substrate surface processing system according to claim 1, wherein the first processing chamber is disposed below the second processing chamber. 11.   10. The apparatus according to claim 1, further comprising an inclination driving unit disposed in at least one of the first processing chamber to the third processing chamber and configured to incline the substrate with respect to the ground. The substrate surface treatment system according to any one of the above.   The first wet processing module includes a liquid injection module and an air injection module that are integrally coupled, and the liquid injection module is installed to inject the processing liquid toward the surface of the substrate, and the air 10. The substrate surface treatment system according to claim 1, wherein the spray module is installed so as to spray liquid cutting air toward the surface of the substrate. 11.   10. The substrate surface treatment system according to claim 1, wherein the first wet processing module includes a liquid ejection module including a plurality of spray nozzles. 11. A first horizontal movement step of horizontally moving the substrate in a first direction;
A direction changing step of changing the moving direction of the substrate so that the substrate is horizontally moved from the first direction to a second direction opposite to the first direction;
A second horizontal movement step of horizontally moving the substrate in the second direction;
A first wet processing step of injecting at least one processing liquid onto the substrate during at least one of the first horizontal movement step, the direction changing step, and the second horizontal movement step. When,
A substrate surface treatment method comprising:   The first wet treatment process is performed in one of the first horizontal movement process, the direction changing process, and the second horizontal movement process, and in the other processes in which the first wet treatment process is not performed. The substrate surface processing method according to claim 15, wherein a dry processing step of performing a dry processing in a state where the surface of the substrate is dried is performed.   The first wet treatment process is performed in one of the first horizontal movement process, the direction changing process, and the second horizontal movement process, and in the other processes in which the first wet treatment process is not performed. The substrate surface claim processing method according to claim 15, wherein a second wet processing step of processing the surface of the substrate by a wet process is performed.   The substrate surface processing method according to claim 15, wherein the direction changing step includes raising the substrate in a vertical direction.   The substrate surface processing method according to claim 15, wherein the direction changing step includes lowering the substrate in a vertical direction.   The at least one of the first horizontal movement step, the direction changing step, and the second horizontal movement step includes inclining the substrate so as to incline with respect to the ground. The substrate surface treatment method according to claim 17.   The tilting of the substrate includes tilting the substrate such that the surface of the substrate is tilted with respect to a direction perpendicular to the first direction or the second direction. Substrate surface treatment method.   18. The method according to claim 15, wherein the first wet processing step includes providing at least one of the processing liquid and liquid draining air to the surface of the substrate. The substrate surface treatment method according to the description.   23. The substrate surface processing method according to claim 22, wherein the etching solution and the liquid air are provided simultaneously.

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