JP2013148898A - リソグラフィマスク、リソグラフィ装置及び方法 - Google Patents

リソグラフィマスク、リソグラフィ装置及び方法 Download PDF

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Publication number
JP2013148898A
JP2013148898A JP2013003300A JP2013003300A JP2013148898A JP 2013148898 A JP2013148898 A JP 2013148898A JP 2013003300 A JP2013003300 A JP 2013003300A JP 2013003300 A JP2013003300 A JP 2013003300A JP 2013148898 A JP2013148898 A JP 2013148898A
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JP
Japan
Prior art keywords
absorbing material
radiation
thickness
mask
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013003300A
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English (en)
Japanese (ja)
Inventor
Jozef Maria Finders
フィンデルス，ヨゼフ，マリア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of JP2013148898A publication Critical patent/JP2013148898A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2013003300A 2012-01-17 2013-01-11 リソグラフィマスク、リソグラフィ装置及び方法 Pending JP2013148898A (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201261587587P 2012-01-17 2012-01-17
US61/587,587 2012-01-17
US201261587941P 2012-01-18 2012-01-18
US61/587,941 2012-01-18
US201261589027P 2012-01-20 2012-01-20
US61/589,027 2012-01-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015052908A Division JP6298418B2 (ja) 2012-01-17 2015-03-17 リソグラフィマスク、リソグラフィ装置及び方法

Publications (1)

Publication Number Publication Date
JP2013148898A true JP2013148898A (ja) 2013-08-01

Family

ID=48754783

Family Applications (2)

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JP2013003300A Pending JP2013148898A (ja) 2012-01-17 2013-01-11 リソグラフィマスク、リソグラフィ装置及び方法
JP2015052908A Expired - Fee Related JP6298418B2 (ja) 2012-01-17 2015-03-17 リソグラフィマスク、リソグラフィ装置及び方法

Family Applications After (1)

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JP2015052908A Expired - Fee Related JP6298418B2 (ja) 2012-01-17 2015-03-17 リソグラフィマスク、リソグラフィ装置及び方法

Country Status (6)

Country Link
US (2) US8974989B2 (enExample)
JP (2) JP2013148898A (enExample)
KR (1) KR101538995B1 (enExample)
CN (1) CN103207516B (enExample)
NL (1) NL2010025A (enExample)
TW (1) TWI467319B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8793626B2 (en) * 2012-03-23 2014-07-29 Texas Instruments Incorporated Computational lithography with feature upsizing
CN104570589B (zh) * 2013-10-12 2018-08-07 北大方正集团有限公司 掩模板及利用掩模板进行光刻和测量步进精度的方法
CN104635418B (zh) * 2013-11-07 2018-01-02 北大方正集团有限公司 一种掩模版及一种测量光刻机的版旋转偏差的方法
US10437157B2 (en) 2014-12-09 2019-10-08 Asml Netherlands B.V. Method and apparatus for image analysis
US10607334B2 (en) * 2014-12-09 2020-03-31 Asml Netherlands B.V. Method and apparatus for image analysis
JP2018508048A (ja) * 2015-03-12 2018-03-22 レイヴ リミテッド ライアビリティ カンパニー 間接的表面清浄化装置および方法
CN116909086A (zh) * 2017-02-25 2023-10-20 Asml荷兰有限公司 图案形成装置及其制造方法、设计方法以及计算机程序产品
CN110361936B (zh) * 2018-03-26 2021-03-12 上海微电子装备（集团）股份有限公司 掩模版厚度检测装置、存储机构、传输机构及光刻系统
US11733615B2 (en) 2019-01-03 2023-08-22 Asml Netherlands B.V. Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method
CN110442172B (zh) * 2019-07-24 2021-02-19 昆明理工大学 一种基于嵌入式cps的工业危险品临时存储的实时监控装置
CN113031390B (zh) * 2021-03-15 2024-09-27 广东省大湾区集成电路与系统应用研究院 激光直写及其仿真的方法、装置
US20230280644A1 (en) * 2022-03-03 2023-09-07 International Business Machines Corporation Method of making euv mask with an absorber layer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11143048A (ja) * 1997-11-05 1999-05-28 Nec Corp 位相シフトマスク
JP2002268201A (ja) * 2002-03-11 2002-09-18 Dainippon Printing Co Ltd 位相シフトフォトマスク及び位相シフトフォトマスク用ブランクスの製造方法
JP2007271712A (ja) * 2006-03-30 2007-10-18 Toshiba Corp フォトマスク、露光装置及びパターン形成方法
JP2009122566A (ja) * 2007-11-19 2009-06-04 Dainippon Printing Co Ltd 低反射型フォトマスクブランクスおよびフォトマスク
JP2009139632A (ja) * 2007-12-06 2009-06-25 Elpida Memory Inc マスクパターン補正方法及び露光用マスク

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07199447A (ja) * 1993-12-28 1995-08-04 Sony Corp 単層ハーフトーン方式位相シフトマスク及びその作製方法
TW512424B (en) 2000-05-01 2002-12-01 Asml Masktools Bv Hybrid phase-shift mask
US6593041B2 (en) * 2001-07-31 2003-07-15 Intel Corporation Damascene extreme ultraviolet lithography (EUVL) photomask and method of making
US7029802B2 (en) 2003-06-16 2006-04-18 Taiwan Semiconductor Manufacturing Company Embedded bi-layer structure for attenuated phase shifting mask
US8252487B2 (en) 2003-12-17 2012-08-28 Asml Netherlands B.V. Device manufacturing method and mask for use therein
JP4588368B2 (ja) * 2004-06-15 2010-12-01 富士通セミコンダクター株式会社 露光計測方法及び装置、並びに半導体装置の製造方法
EP1804119A1 (en) 2005-12-27 2007-07-04 Interuniversitair Microelektronica Centrum Method for manufacturing attenuated phase- shift masks and devices obtained therefrom
JP5295553B2 (ja) * 2007-12-07 2013-09-18 株式会社東芝 反射型マスク
JP2009259976A (ja) * 2008-04-15 2009-11-05 Toshiba Corp 露光方法およびそれを用いた半導体デバイスの製造方法
KR100948770B1 (ko) * 2008-06-27 2010-03-24 주식회사 에스앤에스텍 블랭크 마스크, 포토마스크 및 이의 제조 방법
WO2010040696A1 (en) * 2008-10-06 2010-04-15 Asml Netherlands B.V. Lithographic focus and dose measurement using a 2-d target
JP2013003300A (ja) 2011-06-15 2013-01-07 Mitsubishi Rayon Co Ltd マイクロレンズシートの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11143048A (ja) * 1997-11-05 1999-05-28 Nec Corp 位相シフトマスク
JP2002268201A (ja) * 2002-03-11 2002-09-18 Dainippon Printing Co Ltd 位相シフトフォトマスク及び位相シフトフォトマスク用ブランクスの製造方法
JP2007271712A (ja) * 2006-03-30 2007-10-18 Toshiba Corp フォトマスク、露光装置及びパターン形成方法
JP2009122566A (ja) * 2007-11-19 2009-06-04 Dainippon Printing Co Ltd 低反射型フォトマスクブランクスおよびフォトマスク
JP2009139632A (ja) * 2007-12-06 2009-06-25 Elpida Memory Inc マスクパターン補正方法及び露光用マスク

Also Published As

Publication number Publication date
US20150138568A1 (en) 2015-05-21
CN103207516A (zh) 2013-07-17
US20130183611A1 (en) 2013-07-18
CN103207516B (zh) 2016-01-20
TW201333623A (zh) 2013-08-16
JP6298418B2 (ja) 2018-03-20
US9513109B2 (en) 2016-12-06
JP2015121823A (ja) 2015-07-02
US8974989B2 (en) 2015-03-10
NL2010025A (en) 2013-07-18
KR20130084632A (ko) 2013-07-25
KR101538995B1 (ko) 2015-07-23
TWI467319B (zh) 2015-01-01

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