JP2013145964A5 - - Google Patents
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- JP2013145964A5 JP2013145964A5 JP2012005433A JP2012005433A JP2013145964A5 JP 2013145964 A5 JP2013145964 A5 JP 2013145964A5 JP 2012005433 A JP2012005433 A JP 2012005433A JP 2012005433 A JP2012005433 A JP 2012005433A JP 2013145964 A5 JP2013145964 A5 JP 2013145964A5
- Authority
- JP
- Japan
- Prior art keywords
- cover body
- metal cover
- connection electrode
- electrode
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000003566 sealing material Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000004744 fabric Substances 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 230000000149 penetrating Effects 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
Claims (2)
第１面及びその反対側の第２面を含むシート状のセラミック生地に、個々のセラミックベース板の領域を特定するブレイクラインと、当該領域の角部に前記第１面から前記第２面に貫通する貫通孔と、前記ブレイクラインの内側で前記第１面に前記第１面から突出した突起部とを形成した後に焼成して、シート状のセラミック母基板を形成する工程と、
金属ペーストを塗布し且つ焼成して、前記突起部の内側に圧電振動片に電気的に接続する接続電極、前記第２面に外部電極、及び前記接続電極から外部電極に伸びる配線電極を形成する工程と、
前記圧電振動片を前記接続電極に載置する工程と、
前記セラミック母基板に封止材を塗布する工程と、
前記金属カバー体を前記突起部に沿って配置し、前記金属カバー体と前記突起部とを前記封止材で封止する工程と、
を備える圧電デバイスの製造方法。
A method for manufacturing a surface-mount type piezoelectric device having a metallic metal cover body having a wall surface extending from a ceiling surface,
In the sheet-like ceramic fabric including the first surface and the second surface on the opposite side, a break line for specifying the region of each ceramic base plate, and the corner of the region from the first surface to the second surface Forming a sheet-shaped ceramic mother substrate by firing after forming a through-hole penetrating and a protrusion protruding from the first surface on the first surface inside the break line;
A metal paste is applied and baked to form a connection electrode that is electrically connected to the piezoelectric vibrating piece inside the protrusion, an external electrode on the second surface, and a wiring electrode that extends from the connection electrode to the external electrode. Process,
Placing the piezoelectric vibrating piece on the connection electrode;
Applying a sealing material to the ceramic mother substrate;
Arranging the metal cover body along the protrusion, and sealing the metal cover body and the protrusion with the sealing material;
A method for manufacturing a piezoelectric device comprising:
第１面及びその反対側の第２面を含むシート状のセラミック生地に、個々のセラミックベース板の領域を特定するブレイクラインと、当該領域の角部に前記第１面から前記第２面に貫通する貫通孔と、前記ブレイクラインの内側で前記第１面に前記第１面から凹むように形成された所定幅の環状溝と、を形成した後に焼成して、シート状のセラミック母基板を形成する工程と、
金属ペーストを塗布し且つ焼成して、前記環状溝の内側に圧電振動片に電気的に接続する接続電極、前記第２面に外部電極、及び前記接続電極から外部電極に伸びる配線電極を形成する工程と、
前記圧電振動片を前記接続電極に載置する工程と、
前記セラミック母基板に封止材を塗布する工程と、
前記金属カバー体の端部が前記環状溝に入るように配置し、前記金属カバー体の端部と前記環状溝と封止材で封止する工程と、
を備える圧電デバイスの製造方法。 A method for manufacturing a surface-mount type piezoelectric device having a metallic metal cover body having a wall surface extending from a ceiling surface,
In the sheet-like ceramic fabric including the first surface and the second surface on the opposite side, a break line for specifying the region of each ceramic base plate, and the corner of the region from the first surface to the second surface A sheet-shaped ceramic mother substrate is formed by firing after forming a through-hole penetrating and an annular groove having a predetermined width formed in the first surface so as to be recessed from the first surface inside the break line. Forming, and
A metal paste is applied and baked to form a connection electrode that is electrically connected to the piezoelectric vibrating piece inside the annular groove, an external electrode on the second surface, and a wiring electrode that extends from the connection electrode to the external electrode. Process,
Placing the piezoelectric vibrating piece on the connection electrode;
Applying a sealing material to the ceramic mother substrate;
Arranging the end of the metal cover body so as to enter the annular groove, and sealing with the end of the metal cover body, the annular groove and a sealing material;
A method for manufacturing a piezoelectric device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012005433A JP2013145964A (en) | 2012-01-13 | 2012-01-13 | Piezoelectric device and manufacturing method of piezoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012005433A JP2013145964A (en) | 2012-01-13 | 2012-01-13 | Piezoelectric device and manufacturing method of piezoelectric device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013145964A JP2013145964A (en) | 2013-07-25 |
| JP2013145964A5 true JP2013145964A5 (en) | 2015-02-12 |
Family
ID=49041556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012005433A Pending JP2013145964A (en) | 2012-01-13 | 2012-01-13 | Piezoelectric device and manufacturing method of piezoelectric device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013145964A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016111047A1 (en) * | 2015-01-08 | 2016-07-14 | 株式会社村田製作所 | Piezoelectric oscillation member and production method for same |
| WO2017208747A1 (en) * | 2016-05-31 | 2017-12-07 | 株式会社村田製作所 | Aggregate substrate for mounting piezoelectric vibration element thereon, manufacturing method therefor, and manufacturing method for piezoelectric vibrator |
| WO2018047876A1 (en) | 2016-09-08 | 2018-03-15 | 株式会社村田製作所 | Crystal oscillator and method for manufacturing same |
| WO2018070221A1 (en) * | 2016-10-11 | 2018-04-19 | 株式会社村田製作所 | Piezoelectric oscillator and production method for same |
| WO2022269970A1 (en) * | 2021-06-23 | 2022-12-29 | 株式会社村田製作所 | Piezoelectric oscillator and method for producing piezoelectric oscillator |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0141224Y2 (en) * | 1980-02-04 | 1989-12-06 | ||
| JPH06132766A (en) * | 1992-10-20 | 1994-05-13 | Rohm Co Ltd | Piezoelectric oscillator |
| JP2007173975A (en) * | 2005-12-19 | 2007-07-05 | Nippon Dempa Kogyo Co Ltd | Crystal device |
| JP2008060991A (en) * | 2006-08-31 | 2008-03-13 | Kyocera Kinseki Corp | Piezoelectric device |
| JP2009302311A (en) * | 2008-06-13 | 2009-12-24 | Yamaha Corp | Package for semiconductor device, semiconductor device, and microphone package |
| JP2011009808A (en) * | 2009-06-23 | 2011-01-13 | Nippon Dempa Kogyo Co Ltd | Crystal vibrator |
| JP2011066651A (en) * | 2009-09-17 | 2011-03-31 | Kyocera Kinseki Corp | Piezoelectric device |
| JP2011147054A (en) * | 2010-01-18 | 2011-07-28 | Seiko Epson Corp | Electronic apparatus, and method of manufacturing the same |
-
2012
- 2012-01-13 JP JP2012005433A patent/JP2013145964A/en active Pending
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