JPH06132766A - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPH06132766A JPH06132766A JP28133592A JP28133592A JPH06132766A JP H06132766 A JPH06132766 A JP H06132766A JP 28133592 A JP28133592 A JP 28133592A JP 28133592 A JP28133592 A JP 28133592A JP H06132766 A JPH06132766 A JP H06132766A
- Authority
- JP
- Japan
- Prior art keywords
- base substrate
- piezoelectric
- ceramic element
- oscillator
- metal cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、圧電セラミック素子を
備えた圧電発振子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric oscillator provided with a piezoelectric ceramic element.
【０００２】[0002]
【従来の技術】圧電発振子として、本出願人が先に出願
したものがある。この発振子は、低背型面実装セラミッ
ク発振子であり、図９に示すような構造である。この発
振子は、セラミックベース基板３０と、ベース基板３０
の両端部に形成された端子電極３１，３２と、ベース基
板３０上にて端子電極３１，３２にそれぞれ導電ペース
ト３３，３４を介して接続された圧電セラミック素子３
５と、ベース基板３０上に取付けられ、セラミック素子
３５を防護する金属キャップ（導電性キャップ）３６と
を備える。2. Description of the Related Art As a piezoelectric oscillator, there is one previously filed by the present applicant. This oscillator is a low-profile surface-mount ceramic oscillator and has a structure as shown in FIG. This oscillator includes a ceramic base substrate 30 and a base substrate 30.
Of the piezoelectric ceramic element 3 connected to the terminal electrodes 31 and 32 formed on both ends of the base substrate 30 via conductive pastes 33 and 34, respectively, on the base substrate 30.
5 and a metal cap (conductive cap) 36 mounted on the base substrate 30 and protecting the ceramic element 35.
【０００３】このような構造の発振子では、端子電極３
１，３２上に直接接合された金属キャップ３６によって
端子電極３１，３２が短絡するという問題があるため、
ベース基板３０と金属キャップ３６をガラスフリットに
よって融着したり、金属キャップ３６の内側に絶縁層を
設けた上で、ベース基板３０と金属キャップ３６を接着
剤等によって接着したりすることが行われている。In the resonator having such a structure, the terminal electrode 3
Since there is a problem that the terminal electrodes 31 and 32 are short-circuited by the metal cap 36 directly bonded on the terminals 1 and 32,
The base substrate 30 and the metal cap 36 are fused by a glass frit, or an insulating layer is provided inside the metal cap 36 and then the base substrate 30 and the metal cap 36 are adhered by an adhesive or the like. ing.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、圧電セ
ラミック素子のキュリー点は通常４００℃前後である
が、ガラスフリットで融着する場合には融着温度が３５
０℃前後と高温になるため、融着時の熱によりセラミッ
ク素子の圧電特性が著しく劣化してしまう。一方、接着
剤で接着する場合、金属キャップの絶縁層と接着剤層と
の界面の気密性が不十分であるため、水分等が内部に浸
入し易く、経時により圧電特性が劣化する。However, the Curie point of a piezoelectric ceramic element is usually around 400 ° C., but when fusing with a glass frit, the fusing temperature is 35.
Since the temperature is as high as about 0 ° C., the heat generated during the fusion significantly deteriorates the piezoelectric characteristics of the ceramic element. On the other hand, in the case of bonding with an adhesive, the airtightness of the interface between the insulating layer of the metal cap and the adhesive layer is insufficient, so that water or the like easily enters the inside, and the piezoelectric characteristics deteriorate with time.
【０００５】従って、本発明の目的は、金属キャップに
よる端子電極の短絡を防止し、なお且つ圧電セラミック
素子の加熱や気密性の不良による圧電特性の劣化を抑え
た圧電発振子を提供することにある。Therefore, an object of the present invention is to provide a piezoelectric oscillator in which the short circuit of the terminal electrode due to the metal cap is prevented and the deterioration of the piezoelectric characteristic due to the heating of the piezoelectric ceramic element and the poor airtightness is suppressed. is there.
【０００６】[0006]
【課題を解決するための手段】前記目的を達成するため
に、本発明の圧電発振子は、ベース基板と、ベース基板
上に設けられた圧電セラミック素子と、セラミック素子
に電気的に接続され、外部に導出された端子電極と、ベ
ース基板上に取付けられ、セラミック素子を覆う導電性
キャップとを備える圧電発振子であって、前記ベース基
板と導電性キャップとの間に絶縁板を介在させたことを
特徴とする。In order to achieve the above-mentioned object, a piezoelectric oscillator of the present invention comprises a base substrate, a piezoelectric ceramic element provided on the base substrate, and electrically connected to the ceramic element. A piezoelectric oscillator comprising a terminal electrode led out to the outside and a conductive cap mounted on a base substrate and covering a ceramic element, wherein an insulating plate is interposed between the base substrate and the conductive cap. It is characterized by
【０００７】本発明の発振子では、導電性キャップ（一
般には金属キャップ）が絶縁板を介してベース基板に接
合される構成であるため、導電性キャップが端子電極に
直接接触せず、導電性キャップによる端子電極の短絡が
防止される。又、導電性キャップとベース基板とを絶縁
板を介して接合する構造のため、前記従来のようにガラ
スフリットによる融着を用いる必要がなくなり、金属キ
ャップをベース基板に接合する際に圧電セラミック素子
が高温に晒されることはない。しかも、絶縁板によって
ベース基板の導電性キャップ接合部分が平坦化されるた
め、導電性キャップとベース基板との気密性が良好にな
る。従って、圧電セラミック素子の加熱や気密性の不良
による圧電特性の劣化は起こらない。In the resonator of the present invention, since the conductive cap (generally a metal cap) is bonded to the base substrate via the insulating plate, the conductive cap does not come into direct contact with the terminal electrode and the conductive cap A short circuit of the terminal electrode due to the cap is prevented. In addition, since the conductive cap and the base substrate are joined together via the insulating plate, it is not necessary to use the fusion with the glass frit as in the conventional case, and the piezoelectric ceramic element is joined when the metal cap is joined to the base substrate. Is not exposed to high temperatures. Moreover, since the conductive plate joint portion of the base substrate is flattened by the insulating plate, the airtightness between the conductive cap and the base substrate is improved. Therefore, the piezoelectric characteristics are not deteriorated due to heating of the piezoelectric ceramic element or defective airtightness.
【０００８】なお、絶縁板は、導電性キャップと端子電
極との絶縁性が十分確保できる材質であれば特定される
ものではない。例えば、絶縁板の材料としては、セラミ
ック、又はベース基板と同じ材料を使用すればよい。
又、絶縁板は、ベース基板の導電性キャップ接合部分に
別個に設けてもよいし、或いはベース基板に一体形成し
ても構わない。例えば、ベース基板の導電性キャップ接
合部分の形状に応じたグリーンシートを焼成し、これを
ベース基板の導電性キャップ接合部分に融着したり、エ
ポキシ接着剤等で接着したりする。It should be noted that the insulating plate is not specified as long as it is a material that can ensure sufficient insulation between the conductive cap and the terminal electrode. For example, as the material for the insulating plate, ceramic or the same material as the base substrate may be used.
Further, the insulating plate may be separately provided at the conductive cap joining portion of the base substrate, or may be integrally formed with the base substrate. For example, a green sheet corresponding to the shape of the conductive cap joint portion of the base substrate is fired, and the green sheet is fused to the conductive cap joint portion of the base substrate or bonded with an epoxy adhesive or the like.
【０００９】[0009]
【実施例】以下、本発明の圧電発振子を実施例に基づい
て説明する。その一実施例に係る発振子の平面図を図１
に、底面図を図２に、図１の線Ａ−Ａにおける断面図を
図３に、図１の線Ｂ−Ｂにおける断面図を図４に示す。
この発振子１の構成は、基本的には図９に示すものと大
差がない。即ち、ベース基板（例えばセラミック積層基
板）１０の両端部に端子電極１１，１２が周回状に形成
され、ベース基板１０上にて端子電極１１，１２にそれ
ぞれ導電ペースト１３，１４を介して圧電セラミック素
子１５が接続され、ベース基板１０上にセラミック素子
１５を防護する金属キャップ１６が取付けられている。EXAMPLES The piezoelectric oscillator of the present invention will be described below based on examples. FIG. 1 is a plan view of the oscillator according to the embodiment.
2 is a bottom view, FIG. 3 is a sectional view taken along line AA of FIG. 1, and FIG. 4 is a sectional view taken along line BB of FIG.
The structure of the oscillator 1 is basically not much different from that shown in FIG. That is, the terminal electrodes 11 and 12 are formed on both ends of the base substrate (for example, a ceramic laminated substrate) 10 in a circular shape, and the piezoelectric ceramics are formed on the terminal electrodes 11 and 12 on the base substrate 10 via conductive pastes 13 and 14, respectively. The element 15 is connected, and a metal cap 16 for protecting the ceramic element 15 is mounted on the base substrate 10.
【００１０】ところで、本発明では、図３から分かるよ
うに、金属キャップ１６が絶縁板１７を介してベース基
板１０に接合されていることが特徴である。即ち、ベー
ス基板１０上の金属キャップ１６の接合部分（ベース基
板１０上の外周部分）には、環状の絶縁板１７が設けら
れている。この絶縁板１７は、端子電極１１，１２上に
も設けられているため、端子電極１１，１２上にて、金
属キャップ１６は絶縁板１７を介することになる。By the way, the present invention is characterized in that the metal cap 16 is joined to the base substrate 10 via the insulating plate 17, as can be seen from FIG. That is, a ring-shaped insulating plate 17 is provided at the joint portion of the metal cap 16 on the base substrate 10 (outer peripheral portion on the base substrate 10). Since the insulating plate 17 is also provided on the terminal electrodes 11 and 12, the metal cap 16 is provided on the terminal electrodes 11 and 12 via the insulating plate 17.
【００１１】この絶縁板１７により、金属キャップ１６
は端子電極１１，１２に直接接触せず、金属キャップ１
６による端子電極１１，１２の短絡が防止される。しか
も、絶縁板１７によって、ベース基板１０の導電性キャ
ップ接合部分が平面になるため、即ちベース基板１０上
における端子電極１１，１２の段差等の凹凸が平坦化さ
れるため、金属キャップ１６とベース基板１０との気密
性が良くなる。その上、ガラスフリットのような高温融
着を必要としないため、金属キャップ１６をベース基板
１０（即ち絶縁板１７）上に接合する際にセラミック素
子１５が高温の影響を受けることがない。従って、圧電
セラミック素子の加熱や気密性の不良による圧電特性の
劣化は生じない。With this insulating plate 17, the metal cap 16
Does not directly contact the terminal electrodes 11 and 12, and the metal cap 1
The short circuit of the terminal electrodes 11 and 12 due to 6 is prevented. In addition, since the conductive cap joint portion of the base substrate 10 becomes a flat surface by the insulating plate 17, that is, unevenness such as steps of the terminal electrodes 11 and 12 on the base substrate 10 is flattened, the metal cap 16 and the base are Airtightness with the substrate 10 is improved. Moreover, since high temperature fusion such as glass frit is not required, the ceramic element 15 is not affected by the high temperature when the metal cap 16 is bonded onto the base substrate 10 (that is, the insulating plate 17). Therefore, the piezoelectric characteristics are not deteriorated due to heating of the piezoelectric ceramic element or defective airtightness.
【００１２】次に、コンデンサ内蔵型圧電発振子の例を
図５〜図８に示す。この発振子２は３端子を有する面実
装セラミック発振子である以外は、上記実施例のものと
構造的にほぼ同様である。図６及び図７において、ベー
ス基板２０の両端部に端子電極２１，２２が、中央部に
端子電極２８が形成されている。この発振子２において
も、金属キャップ２６は、ベース基板２０の金属キャッ
プ接合部分に設けられた絶縁板２７に接合されている。
勿論、作用効果は上記実施例と同等である。Next, an example of a piezoelectric oscillator with a built-in capacitor is shown in FIGS. This oscillator 2 is structurally almost the same as that of the above-mentioned embodiment except that it is a surface-mounted ceramic oscillator having three terminals. 6 and 7, the terminal electrodes 21 and 22 are formed at both ends of the base substrate 20, and the terminal electrode 28 is formed at the center. Also in this oscillator 2, the metal cap 26 is bonded to the insulating plate 27 provided at the metal cap bonding portion of the base substrate 20.
Of course, the function and effect are the same as those of the above embodiment.
【００１３】[0013]
【発明の効果】本発明の圧電発振子は、以上説明したよ
うにベース基板と導電性キャップ（金属キャップ）との
間に絶縁板を介在させたため、下記の効果を有する。 （１）金属キャップと端子電極との間に絶縁板が介在す
ることになるため、金属キャップによる端子電極の短絡
を防止することができる。 （２）ガラスフリットの融着によって金属キャップをベ
ース基板上に接合する必要はなく、ガラスフリットの融
着温度よりも低温で金属キャップをベース基板に接合す
ることができるため、金属キャップの接合時に圧電セラ
ミック素子が高温に晒されず、圧電特性の劣化を最小限
に抑えることができる。 （３）ベース基板上における端子電極の段差等の凹凸が
絶縁板によって平坦化されるため、金属キャップとベー
ス基板との気密性が良好になり、水分の浸入等による圧
電特性の劣化を防ぐことができる。 （４）絶縁板を高くして、圧電セラミック素子と端子電
極を接続する導電ペーストと金属キャップとの間隔を大
きくすることができるため、導電ペーストが金属キャッ
プに接触しないようにでき、わざわざ金属キャップの内
側に絶縁層を設ける必要がなくなり、製造コストを低減
することができる。 （５）コンデンサ内蔵型面実装セラミック発振子にも適
用可能である。The piezoelectric oscillator of the present invention has the following effects because the insulating plate is interposed between the base substrate and the conductive cap (metal cap) as described above. (1) Since the insulating plate is interposed between the metal cap and the terminal electrode, short circuit of the terminal electrode due to the metal cap can be prevented. (2) It is not necessary to bond the metal cap to the base substrate by fusing the glass frit, and the metal cap can be bonded to the base substrate at a temperature lower than the fusing temperature of the glass frit. The piezoelectric ceramic element is not exposed to high temperatures, and deterioration of piezoelectric characteristics can be minimized. (3) Since unevenness such as stepped portions of the terminal electrode on the base substrate is flattened by the insulating plate, airtightness between the metal cap and the base substrate is improved, and deterioration of piezoelectric characteristics due to infiltration of moisture is prevented. You can (4) Since the insulating plate can be raised to increase the distance between the conductive paste connecting the piezoelectric ceramic element and the terminal electrode and the metal cap, it is possible to prevent the conductive paste from coming into contact with the metal cap. It is not necessary to provide an insulating layer on the inner side of, and the manufacturing cost can be reduced. (5) It is also applicable to a surface-mounted ceramic oscillator with a built-in capacitor.
【図１】本発明の一実施例に係る発振子の平面図であ
る。FIG. 1 is a plan view of an oscillator according to an embodiment of the present invention.
【図２】図１に示す発振子の底面図である。FIG. 2 is a bottom view of the oscillator shown in FIG.
【図３】図１に示す発振子の線Ａ−Ａにおける断面図で
ある。3 is a cross-sectional view of the resonator shown in FIG. 1 taken along the line AA.
【図４】図１に示す発振子の線Ｂ−Ｂにおける断面図で
ある。4 is a cross-sectional view of the resonator shown in FIG. 1 taken along the line BB.
【図５】本発明の別実施例に係る発振子の平面図であ
る。FIG. 5 is a plan view of an oscillator according to another embodiment of the present invention.
【図６】図５に示す発振子の底面図である。6 is a bottom view of the oscillator shown in FIG.
【図７】図５に示す発振子の線Ｃ−Ｃにおける断面図で
ある。7 is a cross-sectional view of the oscillator taken along line C-C shown in FIG.
【図８】図５に示す発振子の線Ｄ−Ｄにおける断面図で
ある。8 is a cross-sectional view of the oscillator taken along line D-D shown in FIG.
【図９】従来例に係る発振子の要部断面図である。FIG. 9 is a cross-sectional view of a main part of an oscillator according to a conventional example.
１，２ 圧電発振子 １０，２０ ベース基板（セラミック積層基
板） １１，１２ 端子電極 １５，２５ 圧電セラミック素子 １６，２６ 金属キャップ（導電性キャップ） １７，２７ 絶縁板 ２１，２２，２８ 端子電極1, 2 Piezoelectric oscillator 10, 20 Base substrate (ceramic laminated substrate) 11, 12 Terminal electrode 15, 25 Piezoelectric ceramic element 16, 26 Metal cap (conductive cap) 17, 27 Insulation plate 21, 22, 28 Terminal electrode
Claims (1)
圧電セラミック素子と、セラミック素子に電気的に接続
され、外部に導出された端子電極と、ベース基板上に取
付けられ、セラミック素子を覆う導電性キャップとを備
える圧電発振子であって、 前記ベース基板と導電性キャップとの間に絶縁板を介在
させたことを特徴とする圧電発振子。1. A base substrate, a piezoelectric ceramic element provided on the base substrate, a terminal electrode electrically connected to the ceramic element and led out to the outside, and mounted on the base substrate to cover the ceramic element. A piezoelectric oscillator comprising a conductive cap, wherein an insulating plate is interposed between the base substrate and the conductive cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28133592A JPH06132766A (en) | 1992-10-20 | 1992-10-20 | Piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28133592A JPH06132766A (en) | 1992-10-20 | 1992-10-20 | Piezoelectric oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06132766A true JPH06132766A (en) | 1994-05-13 |
Family
ID=17637676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28133592A Pending JPH06132766A (en) | 1992-10-20 | 1992-10-20 | Piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06132766A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6489558B1 (en) * | 1999-08-18 | 2002-12-03 | Murata Manufacturing Co., Ltd. | Conductive cap, electronic component, and method of forming insulating film of conductive cap |
| JP2013145964A (en) * | 2012-01-13 | 2013-07-25 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device and manufacturing method of piezoelectric device |
| US9370104B2 (en) | 2013-07-16 | 2016-06-14 | Seiko Instruments Inc. | Lid body portion and electronic device package using the lid body portion and electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5121547A (en) * | 1974-08-19 | 1976-02-20 | Koike Sanso Kogyo Kk | Gasusetsudanniokeru piashingusochi |
| JPH0260250B2 (en) * | 1984-08-22 | 1990-12-14 | Mitsubishi Heavy Ind Ltd |
-
1992
- 1992-10-20 JP JP28133592A patent/JPH06132766A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5121547A (en) * | 1974-08-19 | 1976-02-20 | Koike Sanso Kogyo Kk | Gasusetsudanniokeru piashingusochi |
| JPH0260250B2 (en) * | 1984-08-22 | 1990-12-14 | Mitsubishi Heavy Ind Ltd |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6489558B1 (en) * | 1999-08-18 | 2002-12-03 | Murata Manufacturing Co., Ltd. | Conductive cap, electronic component, and method of forming insulating film of conductive cap |
| KR100451021B1 (en) * | 1999-08-18 | 2004-10-02 | 가부시키가이샤 무라타 세이사쿠쇼 | Conductive cap, electronic component, and method of forming insulating film of conductive cap |
| US6800189B2 (en) | 1999-08-18 | 2004-10-05 | Murata Manufacturing Co., Ltd. | Method of forming insulating film of conductive cap by anodizing or electrodeposition |
| US6866893B2 (en) * | 1999-08-18 | 2005-03-15 | Murata Manufacturing Co., Ltd. | Conductive cap, electronic component, and method of forming insulating film of conductive cap |
| JP2013145964A (en) * | 2012-01-13 | 2013-07-25 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device and manufacturing method of piezoelectric device |
| US9370104B2 (en) | 2013-07-16 | 2016-06-14 | Seiko Instruments Inc. | Lid body portion and electronic device package using the lid body portion and electronic device |
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