JP2009302311A - Package for semiconductor device, semiconductor device, and microphone package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To securely fix a package body and a lid body of a semiconductor device like a microphone package without any gap with simple structure. <P>SOLUTION: A package for the semiconductor includes the package body 7 formed by embedding at least part of a lead frame in a mold resin body 6, and the lid body 8 made of a conductive material fixed to a peripheral edge of the package body 7 in a state wherein a top of a semiconductor chip 2 mounted on the package body 7 is provided. A conductive portion where a part of a stage portion 11 of the lead frame is exposed and a resin portion made of a part of the mold resin body 6 are arranged at the peripheral edge of the package body 7, the lid body 8 is provided with a connection portion brought into contact with the conductive portion in an electric connection state, and a fixation reinforcing means is provided in a fixation portion between those package body 7 and lid body 8, obtained by roughening a surface of the resin portion. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor device configured by mounting a semiconductor chip on a package body and covering it with a lid, and relates to the package, the semiconductor device, and a microphone package configured using the semiconductor device.

Some semiconductor devices have a structure in which a semiconductor chip is housed in a hollow internal space by covering a package body on which a semiconductor chip is mounted with a lid.
For example, the semiconductor devices shown in Patent Document 1 and Patent Document 2 are microphone packages in which a microphone chip is housed in a hollow package. These microphone packages cover a surface of a circuit board on which a microphone chip is mounted with a metal case (cover) to form a hollow internal space including the microphone chip. In this case, a hole for taking sound into the internal space is formed in the lid. The tip of the case is fixed to the surface of the circuit board, and a circuit pattern is formed on the circuit board at the fixing part of the case, and the tip of the case is welded or conductive on the circuit pattern. It is fixed by an adhesive or the like having
JP 2007-60661 A US Pat. No. 6,781,231

  By the way, in the microphone package, sound leakage occurs when a gap is generated at the fixing portion between the tip of the case and the circuit board. Therefore, it is necessary to fix these without gaps, and it is difficult to manage them. In particular, when the circuit pattern is partially formed in the fixing portion, the resin portion of the substrate and the metal portion of the circuit pattern are mixed, and the fixing strength is likely to decrease. In this case, fixing by means such as welding as in the invention described in Patent Document 1 requires a large-scale facility and causes an increase in cost.

  The present invention has been made in view of such circumstances, and an object thereof is to securely fix a package body and a lid of a semiconductor device such as a microphone package with a simple structure without a gap.

In order to achieve such an object, the present invention provides a package for a semiconductor device, a semiconductor device, and a microphone package.
First, a package for a semiconductor device according to the present invention includes a package body in which at least a part of a lead frame is embedded in a mold resin body, and a periphery of the package body in a state of covering an upper portion of a semiconductor chip mounted on the package body. A lid made of a conductive material fixed to the portion, and the lead frame has a stage portion disposed below the semiconductor chip and a terminal portion connected to the semiconductor chip spaced apart from each other. A conductive part that is formed and at least a part of each of the stage part and the terminal part is exposed from a hole part formed in the mold resin body, and a part of the stage part is exposed at a peripheral part of the package body. And a resin portion made of a part of the mold resin body, and the lid body is in electrical connection with the conductive portion. Connecting part is provided, characterized in that the anchoring reinforcement means fixed portions of these package body and the lid are provided.

In the semiconductor device package of the present invention, the connecting portion of the lid is formed in a flange shape, and the surface of the connecting portion and the surface of the peripheral portion of the package body are fixed by an adhesive. In addition, the adhesion reinforcing means is characterized in that the surface of the resin portion is formed to be a rough surface.
By making the surface of the resin part rough, the adhesive is easily adapted to the surface and firmly fixed.
Moreover, it is good also as a structure by which the surface of the said resin part was plasma-treated as the said adhesion reinforcement | strengthening means. The wettability of the surface of the resin part is enhanced by the plasma treatment and is firmly fixed by the adhesive.

  In the package for a semiconductor device of the present invention, the connecting portion of the lid is formed in a flange shape, and the surface of the connecting portion and the surface of the peripheral portion of the package body are fixed by an adhesive. In addition, the adhesion reinforcing means may be configured such that a groove for interposing a part of the adhesive is formed in at least one of the package body or the lid.

In the package for a semiconductor device of the present invention, the connecting portion of the lid is formed in a flange shape, and the surface of the connecting portion and the surface of the peripheral portion of the package body are fixed by an adhesive. The fixing strengthening means may be configured such that a recess for fitting the connecting portion of the lid is formed on the package body.
By fitting the connecting portion of the lid into the concave portion of the package body, the adhesive in the concave portion can be interposed on the entire surface facing the connecting portion without any gap.

Further, in the semiconductor device package of the present invention, the connecting portion of the lid is formed in a flange shape, and the surface of the connecting portion and the surface of the peripheral edge of the package body are fixed by an adhesive. In addition, the fixing strengthening means may be configured such that the connecting portion of the lid is curved so that the longitudinal section thereof protrudes downward.
By making the connection part convex downward, surface tension acts so that the adhesive aggregates toward the top of the convex surface between the convex surface of the connection part and the surface of the package body. Even if this adhesive is used, it can be reliably used for adhesion without protruding.
In this case, it is good also as a structure by which the concave surface which engages the connection part of the said cover body is formed in the surface of the said resin part. By engaging the convex connection portion and the concave surface, the adhesion area can be increased.

In the package for a semiconductor device of the present invention, the connecting portion of the lid is formed in a flange shape, and the surface of the connecting portion and the surface of the peripheral portion of the package body are fixed by an adhesive. And the adhesion reinforcing means has an adhesive in which a peripheral portion of the package body protrudes outward from an outer peripheral surface of the connecting portion of the lid, and the protruding portion is between the outer peripheral surface of the connecting portion of the lid. It is good also as a structure made into the adhesive agent receiving part which receives this fillet.
By adhering not only between the connecting portion and the surface of the package body but also the outer peripheral surface of the connecting portion, the bonding area is increased.

  In the semiconductor device package, a peripheral wall portion is erected on the inner side of the peripheral edge portion of the package body, and an elastic ring that is pressed against the lid body is provided along the circumferential direction on the outer surface of the peripheral wall portion. The internal space of the package can be surely sealed by the elastic ring, and the reliability can be further enhanced by using it together with each fixing reinforcing means.

Furthermore, in the package for a semiconductor device of the present invention, the adhesion reinforcing means has a peripheral wall portion standing on the inner side of the peripheral edge portion of the package body, and a side plate portion of the lid body on the outer surface of the peripheral wall portion. It is set as the structure fitted, The front-end | tip of the side wall part is made into the said connection part, It is characterized by the above-mentioned.
In this semiconductor device package, a strong fixing force is obtained by fitting the peripheral wall portion formed on the package body and the lid.
In that case, it is good also as a structure by which the elastic ring is provided in the outer surface of the said surrounding wall part along the circumferential direction, and a sealing effect can be heightened more by an elastic ring.

  In the package for a semiconductor device of the present invention, the connecting portion of the lid is formed in a flange shape, and the surface of the connecting portion and the surface of the peripheral portion of the package body are fixed by an adhesive. And the fixing reinforcing means includes a peripheral wall portion standing on the inner side of the peripheral edge portion of the package body, and an elastic ring that is pressed against the lid on the outer surface of the peripheral wall portion along the circumferential direction. It is good also as a structure.

  Furthermore, in the package for a semiconductor device according to the present invention, a part is exposed in a recess formed in the outer peripheral surface of the package body, and the fixing reinforcing means is a protrusion that fits into the recess of the package body. It is good also as a structure by which a piece is formed and the inner surface of this protrusion piece is used as the said connection part. The entire package body is configured to be fitted so that the lid is covered.

In the semiconductor device of the present invention, a semiconductor chip is mounted on the package body in the semiconductor device package, and the semiconductor chip is connected from the hole to the internal connection surface of the stage portion and each terminal portion. It is characterized by being.
Furthermore, the microphone package of the present invention is a microphone package configured using the semiconductor device, wherein the semiconductor chip is a microphone chip, and an acoustic communication with an internal space is provided in either the lid or the package body. A hole is formed.

  According to the present invention, even if the conductive portion by the lead frame and the resin portion by the mold resin body are mixed, the lid body and the package body can be securely fixed without any gap by the fixing reinforcing means. Can do. Therefore, by using it for a microphone package, sound leakage can be prevented and a high performance microphone can be obtained.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 8 show an embodiment. The semiconductor device 1 of this embodiment is a microphone package, and as shown in FIGS. 4, 6, and 7, two chips of a microphone chip 2 and a circuit chip 3 are accommodated as semiconductor chips. Further, the package 4 includes a package body 7 composed of a substantially flat plate-like lead frame 5 and a box-shaped mold resin body 6 formed integrally with the lead frame 5, and a lid for closing the upper portion of the package body 7. The body 8 is provided.

  The lead frame 5 is continuously formed by press working on a strip-shaped metal plate in one row or a plurality of rows with one unit shown in FIG. In this specification, the unit shown in FIG. 1 is referred to as a lead frame, and in the following, the vertical direction in FIG. 1 is referred to as the vertical direction, and the horizontal direction is referred to as the horizontal direction. Further, in FIG. 1, reference numeral 9 indicates a connection frame portion connected to the outer frame portion 10 formed by punching the lead frame 5.

In the lead frame 5, a stage portion 11 having a relatively large area and three terminal portions 12 to 14 for power supply, output, and gain arranged around the stage portion 11 are spaced from each other. It is set as the structure arrange | positioned openly, and each is independently connected to the outer frame part 10 by the some connection frame part 9. FIG.
In this case, the lead frame 5 is formed in a rectangular shape as a whole, and the stage portion 11 is disposed at the center of one corner portion of the rectangular shape and is connected to two sides forming the corner portion. Two extensions 16 and 17 are integrally formed from the portion 15, and the ends of these extensions 16 and 17 are connected to substantially the center positions of the other two sides, respectively.

  Terminal portions 12 to 14 are arranged at the remaining three corners surrounded by the stage portion 11 and the outer frame portion 10, respectively. As for these terminal parts 12-14, a part of the surface side is made into the internal connection surface 21-23 with respect to the semiconductor chip mentioned later, and the surface side of the part except this internal connection surface 21-23 is made thin. By being half-etched, the half-etched surface is a low floor surface 24 that is lower than the internal connection surfaces 21 to 23 in the thickness direction. The hatched area in FIG. 1 shows the low floor 24 that has been half-etched.

  In this case, as shown in FIG. 1, the corner portion of the main body portion 15 and the tip portions of the extension portions 16 and 17 in the stage portion 11 are arranged on the entire outer peripheral portion of the lead frame 5. 12 to 14, the half-etched low floor surface 24 is disposed, and the internal connection surfaces 21 to 23 of the terminal portions 12 to 14 are disposed at positions that enter the inner side of the outer peripheral portion of the lead frame 5. ing. That is, in FIG. 1, a region surrounded by two two-dot chain lines indicates a formation region A of the peripheral wall portion of the mold resin body, which will be described later, and the inside of the terminal portions 12 to 14 in the formation region A of the peripheral wall portion. Connection surfaces 21 to 23 are arranged. Further, a part of one extension portion 16 in the stage portion 11 disposed in the formation region A of the peripheral wall portion is an internal connection surface 25 for grounding with respect to the stage portion 11. The outer side of the peripheral wall portion forming area A is a protruding portion forming region in the mold resin body. As described above, the protruding portion forming region includes a corner portion of the main body 15 in the stage portion 11, The front ends of the extension portions 16 and 17 and the low floor surface 24 of the terminal portions 12 to 14 are arranged.

On the other hand, the rear surface of the lead frame 5 is half-etched except for the rectangular portions at the four corners, as shown in FIG. The shape portions are external connection surfaces 26 to 29 when mounted on the substrate as will be described later.
In this case, in the stage part 11, the external connection surface 29 is formed in the rectangular shape in the corner part (upper right corner part of FIG. 2) of the main-body part 15, and each terminal part 12-14 is one of those terminal parts. (Terminal portion disposed in the lower left corner of FIG. 2) 13 has an external connection surface 27 formed in the same rectangular shape as the overall shape, and the other two terminal portions 12 and 14 are connected to the external connection surfaces 26 and 28. The protrusions 30 and 31 protruding in the surface direction are formed, and the back surfaces of the protrusions 30 and 31 are half-etched so as to reduce the plate thickness. The external connection surface 29 of the stage portion 11 and the external connection surfaces 26 to 28 of the terminal portions 12 to 14 are formed in a rectangular shape having substantially the same size, and are arranged at the four corners of the lead frame 5 as a whole. ing. As can be seen from comparison with FIG. 1, the surface sides of the two overhanging portions 30 and 31 in the two terminal portions 12 and 14 are internal connection surfaces 21 and 23.

  In the stage portion 11, in addition to the external connection surface 29, the connection portion to the connection frame portion 9 disposed at substantially the center portion and the central positions of the four sides of the outer frame portion 10 is also connected to the external connection surface 29. The support surfaces 32 and 33 are in contact with the mold when the molded resin body is formed as described later. In FIG. 2, of the three terminal portions 12 to 14, the protruding portion 31 is disposed at the terminal portion (lower right corner portion in FIG. 2) extending to the center portion in the width direction (left-right direction) of the lead frame 5. In the terminal portion 14), a support surface 34 having the same height as the external connection surface 28 is formed on the back surface of the projecting portion 31 in the same manner as the support surfaces 32 and 33 of the stage portion 11. Note that any connection frame portion 9 is set to the original plate thickness without being half-etched.

  Then, by molding the molded resin body 6 integrally with the lead frame 5 processed in this way, a package body 7 is configured as shown in FIG. As shown in FIGS. 3 and 4, the mold resin body 6 includes a bottom plate portion 41 formed in a rectangular plate shape having a length in which the microphone chip 2 and the control circuit chip 3 can be arranged, and the bottom plate portion 41. It is formed in a box shape including a rectangular cylindrical peripheral wall portion 42 standing from the peripheral edge portion and an overhang portion 43 integrally formed around the lower portion of the peripheral wall portion 42.

  The bottom plate portion 41 is embedded in the central portion of the lead frame 5, that is, the entire front and back surfaces of the relatively wide range portion of the stage portion 11 that occupies the region inside the formation region A of the peripheral wall portion in FIG. Yes. Further, the peripheral wall portion 42 is formed in a trapezoidal cross section whose width decreases as it goes upward, and as shown in the formation region A of FIG. A part of the extension portions 16 and 17 (one of which is the internal connection surface 25 of the stage portion 11), the internal connection surfaces 21 to 23 of the terminal portions 12 to 14, and a part of the low floor surface 24. It is said. As shown in FIG. 3, a part of the peripheral wall portion 42 is formed to be slightly low and wide, and the wide portion 44 has an internal connection surface 25 of the stage portion 11 and internal connection surfaces of the terminal portions 12 to 14. Four holes 45 are formed to expose the portions 21 to 23 partially upward.

  Further, the overhanging portion 43 formed on the outer side of the peripheral wall portion 42 is formed on the same flat plate as the bottom plate portion 41, and a portion of an area outside the area indicated by A in FIG. . And the surface of the corner | angular part of the main-body part 15 in the stage part 11 of the lead frame 5 and the front-end | tip part in the two extension parts 16 and 17 is exposed on the upper surface of the overhang | projection part 43, and other terminal parts 12- The surface of 14 is embedded in the overhanging portion 43 with a mold resin by arranging the half-etched low floor surface 24. In this case, the surface of the projecting portion 43 is formed to be flush with the exposed surface of the stage portion 11 and its extensions 16 and 17.

  On the other hand, on the back surface side of the mold resin body 6, most of the lead frame 5 that is half-etched is embedded as described above. As shown in FIG. 5, as shown in FIG. Except that the external connection surfaces 26 to 28 of the terminal portions 12 to 14 are exposed at the four corners, the support surfaces 32, 33 and 34 partially disposed on the stage portion 11 are exposed.

  As shown in FIGS. 4, 6 and 7, the microphone chip 2 and the control circuit chip 3 are fixed on the bottom plate portion 41 of the package body 7 formed in this way by a die bond 46, respectively, and a molded resin body 6 are connected to the internal connection surfaces 21 to 23 of the terminal portions 12 to 14 facing the hole 45 of the peripheral wall portion 42 and the internal connection surface 25 of the stage portion 11 by bonding wires 47. In the microphone chip 2, a diaphragm electrode and a fixed electrode that vibrate in response to pressure fluctuations such as sound are disposed to face each other, and a change in electrostatic capacitance accompanying vibration of the diaphragm electrode is detected. The control circuit chip 3 includes a power supply circuit to the microphone chip 2, an output signal amplifier from the microphone chip 2, and the like.

  On the other hand, the lid body 8 that covers the package body 7 is formed by drawing a conductive metal material such as a copper material by the height of the peripheral wall portion 42 of the package body 7. A side plate portion 52 is formed around the periphery of the plate, and a flange portion 53 is formed in a flange shape at the lower end of the side plate portion 52 in parallel with the top plate portion 51. In addition, an acoustic hole 54 is formed in the top plate portion 51 in a penetrating state. Then, when the lid body 8 is put on the package body 7, the top plate portion 51 closes the internal space 55 surrounded by the peripheral wall portion 42 of the package body 7 as shown in FIG. The acoustic hole 54 communicates with the outside, the side plate portion 52 is disposed outside the peripheral wall portion 42, and the collar portion 53 is overlaid on the protruding portion 43. The package body 7 and the lid body 8 are configured such that the flange portion 53 of the lid body 8 is fixed to the projecting portion 43 of the package body 7 by the conductive adhesive 56, and The exposed stage portion 11 is brought into an electrical connection state with the lid 8 via the conductive adhesive 56. Therefore, the package 4 formed by fixing the lid 8 to the package body 7 is in an electrically connected state between the lid 8 and the stage portion 11 of the lead frame 5, and the semiconductor chips 2 and 3 in the internal space 55. Is in a state of surrounding. In this case, the upper surface of the package body 7, at least the upper surface of the overhanging portion 43, is roughened by blasting. And the upper surface of the overhang | projection part 43 containing the surface of the rough mold resin body 6 and the cover body 8 are adhere | attached with the conductive adhesive 56. FIG.

Next, a method for manufacturing the semiconductor device 1 configured as described above will be described.
First, the hatched region in FIGS. 1 and 2 is half-etched to about half the plate thickness by masking and etching the necessary portions of the band-shaped metal plate. Then, the outer shape is punched out by press working, and the lead frame 5 connected to the outer frame portion 10 by the connection frame portion 9 is formed. The lead frame 5 formed in this way is formed in a substantially flat plate shape, although it has some unevenness in the half-etched portion.
Next, the lead frame 5 is placed in an injection mold, and a resin is injection-molded so as to embed the lead frame 5 to mold the mold resin body 6.

  FIG. 8 shows a state in which the lead frame 5 after press molding is placed in an injection mold, and a cavity 63 into which mold resin is injected is formed between the upper mold 61 and the lower mold 62. . On the surface of the lead frame 5, the internal connection surfaces 21 to 23 of the terminal portions 12 to 14 and the internal connection surface 25 of the stage portion 11 are exposed from the holes 45 of the peripheral wall portion 42 of the mold resin body 6, respectively. On the back surface, the external connection surfaces 26 to 29, the support surfaces 32 and 33 of the stage unit 11, and the support surface 34 of the terminal unit 14 are exposed, respectively. It is formed by contacting the inner surfaces of the molds 61 and 62 of the mold. In this case, since the exposed surfaces are formed on both the front and back surfaces of the lead frame 5, the molds 61 and 62 are in contact with both the front and back surfaces and are supported from both surfaces in the cavity 63. . In particular, in the bottom plate portion 41, a resin portion is also formed on the surface side of the stage portion 11. For this reason, a gap is formed over a wide range between the surface of the stage portion 11 and the inner surface of the upper mold 61. However, a plurality of support surfaces 32 and 33 arranged on the back surface of the stage unit 11 abut on the inner surface of the lower mold 62, and the molds 61 and 62 are in contact with both surfaces in the overhanging portion 43, thereby the stage unit. 11 as a whole is supported from both the front and back sides. Therefore, the lead frame 5 is securely fixed in the molds 61 and 62 so as not to bend or move due to the pressure at the time of injection.

  After the molding resin body 6 is integrally formed on the lead frame 5 in this way, the upper surface of the package body 7 is roughened by subjecting the upper surface of the package body 7 to blasting such as sandblasting. This blasting process may target only the upper surface of the overhanging portion 43 that is a fixed portion with the lid 8 or may target the entire upper surface of the package body 7. When only the upper surface of the overhanging portion 43 is targeted, blasting is performed with the other portions covered by masking.

Next, the semiconductor chips 2 and 3 are fixed to the bottom plate portion 41 of the package body 7 by the die bond 46, and the internal connection surfaces 21 to 23 of the terminal portions 12 to 14 exposed in the hole portions 45 of the peripheral wall portion 42. Then, after connecting to the internal connection surface 25 of the stage portion 11 by wire bonding, a conductive adhesive 56 is applied to the upper surface of the overhanging portion 43, and the lid 8 that has been separately manufactured is put on and adhered. . In this state, the package body 7 is connected to the adjacent lead frame via the connection frame portion 9 so that a plurality of the package bodies 7 are connected vertically and horizontally, and the lid 8 is also connected to the lead frame. 5 are connected to each other at the same pitch as that of the package body 7 by a connection frame portion (not shown) similar to 5 and are bonded together.
Then, after this bonding, the connection frame portion 9 of the lead frame 5 and the connection frame portion of the lid 8 protruding from the mold resin body 6 are collectively cut and divided into individual packages 4.

The semiconductor device 1 manufactured in this way is mounted by soldering the terminal portions 12 to 14 exposed on the bottom surface and the external connection surfaces 26 to 29 of the stage portion 11 to the substrate. In this case, as shown in FIG. 7, in the semiconductor device 1, the stage portion 11 embedded in the bottom plate portion 41 is disposed below the semiconductor chips 2 and 3, and a semiconductor is formed on the internal connection surface 25 of the stage portion 11. The chips 2 and 3 are connected, and the flange portion 53 of the lid body 8 is connected to the extensions 16 and 17 of the stage portion 11 via the conductive adhesive 56, and the lid body 8 is located above the semiconductor chips 2 and 3. Covering. Accordingly, the semiconductor chips 2 and 3 are surrounded by the stage portion 11 and the lid 8, and the external connection surface 29 of the stage portion 11 is grounded via the substrate, whereby the semiconductor chip is formed. 2 and 3 can be shielded from an external magnetic field.
In the case of this embodiment, the extended portions 16 and 17 of the stage portion 11 are conductive portions exposed to the peripheral edge portion of the package body 7, and the flange portion 53 of the lid body 8 is in electrical contact with the conductive portion. To be connected.

  The package body 7 has a peripheral wall portion 42 standing between a bottom plate portion 41 to which the semiconductor chips 2 and 3 are fixed and an overhang portion 43 to which the lid body 8 is fixed, and a hole portion of the peripheral wall portion 42. 45, since the internal connection surfaces 21 to 23 of the terminal portions 12 to 14 and the internal connection surface 25 of the stage portion 11 are exposed, the die bond 46 and the conductive adhesive 56 are blocked by the peripheral wall portion 42. It does not get over the wall and enter the hole 45. Therefore, the chip mounting area in the bottom plate portion 41 and the internal connection surfaces 21 to 23 and 25 can be disposed close to each other, and the area can be reduced accordingly.

Moreover, a hole 45 is provided in the peripheral wall portion 42 to expose the internal connection surfaces 21 to 23 and 25 of the terminal portions 12 to 14 and the stage portion 11, and the lid 8 is also the same as the bottom plate portion 41 outside the peripheral wall portion 42. Since the lead frame 5 itself is formed flat, it is configured to be fixed to the overhanging portion 43 formed on a flat surface. The overall size can be reduced as compared with the product.
Therefore, the semiconductor device 1 can reduce the mounting area on the substrate, reduce interference with other circuits on the substrate, and enable high-density mounting.

  Further, since the mold resin body 6 of the package body 7 is formed by injection molding, the surface thereof is usually finished to a smooth surface. Generally, when a smooth resin surface and a metal surface are mixed in bonding with a metal surface, the adhesive force of the adhesive tends to be smaller on the resin surface. In the package main body 7, since the upper surface of the overhanging portion 43 to which the flange portion 53 of the lid 8 is fixed is formed to be a rough surface, the adhesive force of the conductive adhesive 56 is enhanced. Therefore, in the overhanging portion 43 of the package main body 7, the lid body 8 can be firmly fixed to both the resin portion and the exposed metal portion, and the collar portion 53 and the overhanging portion 43 of the lid body 8 are annularly formed without a gap. It can be fixed to.

In addition, when roughening the surface of the overhang | projection part 43 of the package main body 7, an etching process can also be employ | adopted besides a blast process.
In addition, as means for increasing the adhesive force of the conductive adhesive 56 on the surface of the overhanging portion 43 of the package body 7 in this way, in addition to the roughening method, plasma treatment using oxygen gas or argon gas is used. A method of increasing the wettability of the surface of the package body 7 can also be employed. In the case of this plasma treatment, the effect is diminished if left untreated, but it can be maintained for about 3 days, and the lid body 8 may be adhered between them.
As described above, either the method of roughening the projecting portion 43 of the package body 7 by blasting or etching, or the method of increasing the wettability of the surface by plasma processing increases the fixing force with the lid body 8, It functions as an adhesion reinforcing means for fixing the package body 7 and the lid body 8 without gaps.

9 to 22 show various modifications of the means for strengthening the adhesion between the package body and the lid. In these drawings, the same components as those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted.
In the first modification shown in FIGS. 9 and 10, a groove 102 is formed along the circumferential direction on the upper surface of the mold resin body 6 in the projecting portion 43 of the package body 101, and the upper surface including the groove 102 is formed on the upper surface. The collar portion 53 of the lid 8 is fixed via the conductive adhesive 56. Since the conductive adhesive 56 is stored in the groove 102, a large amount of the conductive adhesive 56 can be used, and the surface area of the mold resin body 6 is increased by the groove 102. The gap can be reliably prevented from occurring at the fixed portion. This groove | channel 102 can be formed by forming a protruding item | line in the formation part of the overhang | projection part 43 in an injection mold.

Moreover, when forming the groove | channel for storing the conductive adhesive 56 in this way, you may make it like the 2nd, 3rd modification shown to Fig.11 (a) (b). In the second modified example shown in FIG. 11A, two grooves 102 are formed in the package body 103, and in the third modified example shown in FIG. 11B, the groove 105 is formed in the flange portion 53 of the lid 104. Forming. When the groove 105 is formed in the lid 104, it can be formed by half etching, coining, embossing, or the like. It suffices if a groove is formed on either the package body or the lid, and a groove may be formed on both.
Further, when the groove 102 is provided in the package body, half-etching, coining, embossing, or the like is performed on the exposed portion (conductive portion) of the stage portion 11 in the overhang portion 43 so as to continue to the groove 102 of the mold resin body 6. A groove may be formed.

Further, in the fourth modified example shown in FIG. 12, a slight protruding wall 108 is formed along the circumferential direction on the outer peripheral edge portion of the projecting portion 43 of the package body 107, so that the peripheral wall portion 42 and the protruding wall 108 are In this configuration, an annular recess 109 is formed therebetween, and the flange portion 53 of the lid 8 is fixed in the recess 109 via a conductive adhesive 56. The recess 109 is set to have a dimension slightly larger than the width of the flange portion 53 of the lid body 8, and the flange portion 53 is fixed in a state of being fitted in the recess 109.
In this fixing strengthening means, a large amount of conductive adhesive 56 can be stored in the recess 109, and not only the surface of the collar portion 53 of the lid body 8 but also the outer peripheral surface 53 a and the inner side facing the protruding wall 108. The corner portion 53b of the inner peripheral surface facing the peripheral wall portion 42 can also be brought into contact with the conductive adhesive 56, so that a wide bonding area can be secured, and bonding can be performed with high adhesive strength without gaps.

  In the fifth modification shown in FIG. 13, the projecting portion 43 of the package body 7 is formed wider than the collar portion 53 of the lid body 8, and the projecting portion 43 is removed from the outer peripheral surface 53 a of the collar portion 53 of the lid body 8. The protruding portion is an adhesive receiving portion 110. That is, since the overhanging portion 43 is wider than the flange portion 53 of the lid body 8, the conductive adhesive 56 interposed between the overhanging portion 43 and the flange portion 53 of the lid body 8 can be protruded to the outside. Since the fillet portion 56a of the conductive adhesive 56 adheres between the adhesive receiving portion 110 and the outer peripheral surface 53a of the collar portion 53 of the lid body 8, it can be adhered firmly and without a gap. It is.

  In the sixth modified example shown in FIG. 14, the flange portion 112 of the lid body 111 is curved so that the longitudinal section thereof protrudes downward, and is electrically conductive with the flat surface of the projecting portion 43 of the package body 7. The adhesive is bonded by the adhesive 56. When the curved collar portion 112 is placed on the flat surface of the overhanging portion 43, the apex of the convex surface 112a of the collar portion 112 and the surface of the overhanging portion 43 are closest to each other, and the gap gradually increases toward the outside. Will open. Therefore, surface tension acts on the conductive adhesive 56 interposed between the flange portion 112 of the lid body 111 and the projecting portion 43 of the package body 7 so as to aggregate toward the apex of the convex surface 112a. The surface tension ensures that the lid 111 and the package body 7 are interposed, and the two can be bonded firmly and without a gap.

  In the seventh modified example shown in FIG. 15, the lid body 111 is formed in a curved shape so that the longitudinal section thereof protrudes downward in the same manner as that shown in FIG. The upper surface is configured to be formed in a concave surface 114 that engages the convex surface 112a of the collar portion 112 of the lid 111. The conductive adhesive 56 is interposed between the convex surface 112a of the flange portion 112 and the concave surface 114 of the overhanging portion 43, and the adhesive area becomes large as it is curved, so that the adhesive is firmly and without gaps. be able to.

  In the eighth modification shown in FIG. 16, a groove portion 132 is formed by half etching on the upper surface of the stage portion 11 exposed at the peripheral edge portion of the package body 131, and the flange portion 53 of the lid body 8 is formed in the groove portion 132. Are engaged and fixed by the conductive adhesive 56. In this case, the depth of the groove portion 132 is set to be higher than the low floor surface 24 of each of the terminal portions 12 to 14, and the overhanging portion 43 of the molded resin body 6 is formed between the low floor surface 24 and the groove portion. The low floor surface 24 is covered with a thickness corresponding to the difference in height from the bottom surface of 132. The lid 8 is firmly bonded by the conductive adhesive 56 from the outer peripheral surface 53 a of the collar portion 53 to the inner corner portion 53 b in the groove portion 132 of the stage portion 11.

  In the ninth modification shown in FIG. 17, the thickness of the overhanging portion 43 of the mold resin body 6 is increased and the stage 11 on the peripheral edge of the package body 133 is also resin, contrary to the eighth modification of FIG. A hole portion 134 reaching the stage portion 11 is formed in the projecting portion 43, and the conductive adhesive 56 is in contact with the surface of the stage portion 11 through the hole portion 134. In this configuration, the portion 11 and the collar portion 53 of the lid body 8 are in an electrically connected state. By adopting this configuration, the conductive adhesive 56 is fixed in a state where it penetrates into the hole portion 134 of the overhanging portion 43, so that the fixing strength can be increased by a so-called anchor effect. In this case, since the protruding portion 43 is formed thick, it is not necessary to form the low floor surface of the terminal portions 12 to 13, and accordingly, the etching process on the upper surface of the lead frame becomes unnecessary. Moreover, since the upper surface position of the overhanging portion 43 is increased, the drawing depth of the lid 8 can be reduced, the occurrence of distortion associated with drawing processing can be reduced, and the dimensional accuracy can be increased. .

In the tenth modification shown in FIG. 18, an elastic ring 120 is provided along the circumferential direction on the outer surface of the peripheral wall portion 42 of the package body 119, and the lid body 8 is covered while the elastic ring 120 is crushed. The flange portion 53 of the lid body 8 is fixed to the shield portion 11 exposed at the projecting portion 43 in an electrically connected state by the conductive adhesive 56.
With this configuration, the elastic ring 120 is interposed between the lid body 8 and the package body 119, so that the sealing performance of the internal space 55 can be further improved, and the occurrence of sound leakage can be reliably prevented. it can. In addition, since the elastic ring 120 also functions as a cushioning material, it is possible to absorb distortion sound, vibration sound transmitted from the lid, and the like, and improve sound quality.

In the eleventh modification shown in FIG. 19, the lid body 135 does not have a collar and has a structure extending to the tip of the side plate 52, as compared with the tenth modification shown in FIG. 18. 43 is formed with a narrow width sufficient to abut the tip (connecting portion) of the side plate portion 52 of the lid body 135. As described above, since the elastic ring 120 is provided on the peripheral wall portion 42 of the package main body 136, the lid 136 can be fixed so as to be spread from the inside, so that the fixing structure by the conductive adhesive 56 is simplified. It becomes possible to do.
In addition, as for the adhesion reinforcement means using this elastic ring 120, the surface is opposed between the lid and the package body including those shown in FIGS. 11 to 15 and FIGS. 20 and 21 described later. If there is a portion to be applied, it can be applied by interposing an elastic ring between the opposing surfaces, and the sealing performance of the internal space can be further enhanced.

  The twelfth modification shown in FIG. 20 is configured such that the side plate portion 120 of the lid 119 is fitted to the peripheral wall portion 118 of the package body 117. That is, the outer surface of the peripheral wall portion 118 of the package body 117 is formed on the convex surface 118a so that the center position in the height direction protrudes outward, while the lid body 119 is formed at the lower end portion of the side plate portion 120. Is slightly bent inward. In this case, the inner dimension E between the lower ends of the opposite side plate portions 120 of the lid 119 is formed smaller than the outer dimension F between the convex surfaces 118 a of the corresponding peripheral wall portions 118 of the package body 117. Therefore, when the cover 119 is put on the package body 117, the side plate 120 is elastically deformed and the lower end thereof is fitted over the convex surface 118a of the peripheral wall 118, and after the fitting, the restoring force is used. The peripheral wall 118 is fixed so as to be compressed from the outside. In this fixed state, the lower end 120a of the side plate portion 120 of the lid 119 is in contact with the upper surface of the overhanging portion 43 of the package main body 117, and the main body portion 15 of the stage portion 11 exposed on the upper surface of the overhanging portion 43 and The extension 16 and the lid 119 are brought into contact with each other. In the example shown in FIG. 18, the lower end 120a of the side plate portion 120 is a connecting portion that comes into electrical connection with the conductive portion (stage portion 11).

  The thirteenth modification shown in FIG. 21 has a configuration in which the side plate portion 123 of the lid body 122 is fitted to the peripheral wall portion 42 of the package body 121 in the same manner as that shown in FIG. The inclination angle of the side plate portion 123 of the lid body 112 is smaller than the inclination angle of the outer surface of the peripheral wall portion 42 of the package main body 121 with respect to the vertical direction, and the opposite side plate portions 123 of the lid body 122 are opposed to each other. The inner dimension G between the lower ends of the peripheral wall portions 42 is configured to be smaller than the outer dimension H at the lower end of the corresponding peripheral wall portion 42. Also in this case, when the lid body 122 is put on the package main body 121, the side plate portion 123 is fitted in a state where the side plate portion 123 is spread out on the outer surface of the peripheral wall portion. After the fitting, like the one shown in FIG. 18, the peripheral wall portion 42 is fixed by pressing from the outside by the restoring force of the lid body 122, and the lower end 123 a of the side plate portion 123 is fixed to the protruding portion 42 of the package body 121. The stage 11 is brought into contact with the upper surface. In the example shown in FIG. 21, the lower end 123a of the side plate portion 123 is a connecting portion that comes into electrical connection with the conductive portion (stage portion 11).

  20 and FIG. 21 is a mechanism in which the package body and the lid are mechanically coupled using the elastic force of the lid, and can be firmly used without using a conductive adhesive. And can be fixed without gaps. Of course, you may make it interpose a conductive adhesive between the front-end | tip of the side-plate part of a cover body, and the stage part of a package main body.

Further, in the fourteenth modification shown in FIG. 22, a recess 126 is formed at each intermediate position of the package main body 125, and a part of the intermediate position is provided at the lower end of each side plate portion 128 of the lid 127. Protruding pieces 129 are formed so as to protrude in the extending direction of the side plate portion 128, and when the lid body 127 is put on the package body 125, the projecting piece 129 of the lid body 127 fits into the recess 126 of the package body 125. It is configured. Also in this case, the inner dimension between the opposing projecting pieces 129 of the lid 127 is set to be smaller than the outer dimension of the corresponding concave portions 126 of the package body 125 and is firmly fitted by the elastic force of the lid 127. It has become so.
In the case of the configuration shown in FIG. 22, the stage portion 11 of the lead frame is exposed on the inner surface of the recess 126 of the package body 125, and the projecting piece 129 of the lid 127 is fitted into the recess 126, thereby 11 and the lid 127 are in an electrically connected state. Therefore, in this case, the protruding piece 129 of the lid 127 is a connecting portion that comes into electrical connection with the conductive portion (stage portion 11).

23 to 29 show other examples of the semiconductor device to which the present invention is applied. In these drawings, parts common to those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
In the first embodiment described above, the acoustic hole is formed in the lid, but in the example of FIGS. 23 to 29, the acoustic hole is formed in the package body. That is, as shown in FIGS. 23 and 24, in the lead frame 71, the main body portion 73 of the stage portion 72 extends longer than that of the first embodiment, so that the main body portion 73 penetrates the main body portion 73. A pilot hole 74 for an acoustic hole is provided.

  Of the three terminal portions, the two terminal portions 13 and 14 arranged at the corners have substantially the same configuration as the corresponding terminal portions in the first embodiment, but the other terminal portions 75 are The lead frame 71 is disposed at a central position in the vertical direction, is formed in a rectangular shape like the terminal portion 13 without a protruding portion, and an internal connection surface 76 is formed in a part thereof. Corresponding to the shape of the terminal portion 75, the stage portion 72 also has one extension portion 17 having the same shape as that of the first embodiment, but other portions adjacent to the terminal portion 75 are also provided. The extension 77 is formed in a straight shape.

  In addition, the back surface of the stage portion 72 is mostly half-etched, but an external connection surface 77 is formed at the center position in the vertical direction corresponding to the terminal portion 75, and the periphery of the lower hole 74 also includes the external connection surface 77. A support surface 78 is formed so as to surround the lower hole 74. Further, since the main body portion 73 of the stage portion 72 extends in the vertical direction, two support surfaces 32 arranged at the center position in the width direction are provided, and are formed integrally with the connection frame portions 9 on both sides. Two support surfaces 33 are also provided.

  Then, after this lead frame 71 is press-molded, it is placed in an injection mold shown in FIG. In this injection mold, a pin 82 having a slightly smaller diameter than the lower hole 74 of the lead frame 71 is provided in the lower mold 81 in a protruding state, and the upper mold 83 has a hole 84 into which the tip of the pin 82 is inserted. And a counterbore 85 having a slightly larger diameter than the hole 84 is formed concentrically. When the pins 81 are inserted into the hole 84 by tightening the dies 81 and 83, the cavity 86 includes the pin 82. A cylindrical void is formed around the counterbore 85.

By installing a lead frame 71 on this injection mold and injecting resin, the bottom plate portion 41 of the mold resin body 91 has acoustic holes formed by pins 82 as shown in FIGS. 92 is formed, and a cylindrical wall 93 surrounding the acoustic hole 92 is formed on the upper surface of the bottom plate portion 41. The cylindrical wall 93 prevents the die bond 46 when the semiconductor chips 2 and 3 are bonded, and prevents the die wall 46 from flowing into the acoustic hole 92. In addition, as the lid 96 that constitutes the package 95 in combination with the package body 94, one having no hole is used as shown in FIG. The lid body 96 is formed of a conductive metal material as in the first embodiment. As the semiconductor device 97, the lid body 96 is electrically connected to the lead frame 71, so that the internal space 55 is formed. Is shielded.
Also in this semiconductor device, each of the above-described fixing strengthening means can be applied.

In addition, this invention is not limited to the thing of the structure of the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above embodiment, an example in which the semiconductor device is applied to a microphone package has been described. However, the present invention can be applied to a pressure sensor, an acceleration sensor, a magnetic sensor, a flow rate sensor, a wind pressure sensor, and the like in addition to the microphone. In this case, in the microphone of the above-described embodiment, a communication hole that communicates the internal space such as the acoustic hole and the outside is necessary. However, depending on the type of sensor, the communication hole may be unnecessary, In some cases, two communication holes are required.

In addition, the external connection surfaces of the stage unit and each terminal unit have a four-terminal configuration in each embodiment, and are provided for, for example, power supply, output, gain, and ground, but at least for power supply There should be a connection surface for output and ground. In that case, two ground connection surfaces may be provided. Further, depending on the semiconductor chip housed inside, the number of terminals may be larger than that of the embodiment. The number of semiconductor chips is not necessarily limited to two.
Further, in each embodiment, the lead frame remains in a substantially flat plate shape, and the uneven shape such as a low floor surface is formed by half etching. However, the uneven shape may be formed by embossing, coining, or the like.
Further, a recess is formed so that the external connection surface is fitted to an injection mold for molding the mold resin body, and the external connection surface and the support surface are formed so as to protrude from the back surface of the mold resin body. In other words, the back surface of the mold resin body can be mounted in a state where it is floated from the surface of the substrate. In addition, the conductive adhesive is applied to the package body and the lid body is bonded, but an adhesive sheet may be attached to the package body to bond the lid body.

It is a top view which shows the lead frame used for one Embodiment of the semiconductor device which concerns on this invention. FIG. 2 is a rear view of the lead frame shown in FIG. 1. It is a perspective view which shows the package main body formed by integrally molding a mold resin body to the lead frame shown in FIG. It is a top view of the package main body shown in FIG. It is a reverse view of the package main body shown in FIG. 5 is a longitudinal sectional view showing a state in which a semiconductor chip is housed in the package main body shown in FIG. 4 together with a lid, and corresponds to a cross section taken along line BB in FIG. 4. FIG. 5 is a longitudinal sectional view of a semiconductor device in which a semiconductor chip is housed in the package body of FIG. 4 and a lid is fixed, and corresponds to a cross section taken along line CC in FIG. 4. It is a longitudinal cross-sectional view which shows the state which has arrange | positioned the lead frame shown in FIG. 1 in the injection mold, and is equivalent to the cross section which follows the BB line of FIG. It is a top view of the package main body shown in order to demonstrate the 1st modification of the adhesion reinforcement | strengthening means based on this invention. It is a longitudinal cross-sectional view which shows the state which fixed the cover body to the package main body shown in FIG. 9, and is equivalent to the cross section which follows the DD line | wire of FIG. It is the longitudinal cross-sectional view of the principal part which shows the 2nd modification of the adhesion reinforcement | strengthening means which concerns on this invention to (a), and a 3rd modification is shown to (b). It is a longitudinal cross-sectional view of the principal part which shows the 4th modification of the adhesion reinforcement | strengthening means which concerns on this invention. It is a longitudinal cross-sectional view of the principal part which shows the 5th modification of the adhesion reinforcement | strengthening means which concerns on this invention. It is a longitudinal cross-sectional view of the principal part which shows the 6th modification of the adhesion reinforcement | strengthening means which concerns on this invention. It is a longitudinal cross-sectional view of the principal part which shows the 7th modification of the adhesion reinforcement | strengthening means which concerns on this invention. It is a longitudinal cross-sectional view of the principal part which shows the 8th modification of the adhesion reinforcement | strengthening means which concerns on this invention, the left half is the part by which the stage part was arrange | positioned in the overhang | projection part, and the right half was arrange | positioned the mold resin body in the overhang | projection part Each part is shown. It is the same longitudinal cross-sectional view as FIG. 16 which shows the 9th modification of the adhesion reinforcement | strengthening means based on this invention. It is a longitudinal cross-sectional view of the principal part which shows the 10th modification of the adhesion reinforcement | strengthening means which concerns on this invention. It is a longitudinal cross-sectional view of the principal part which shows the 11th modification of the adhesion reinforcement | strengthening means which concerns on this invention. It is a whole longitudinal cross-sectional view which shows the 12th modification of the adhesion reinforcement | strengthening means which concerns on this invention. It is a whole longitudinal cross-sectional view which shows the 13th modification of the adhesion reinforcement | strengthening means which concerns on this invention. (A) which shows the 14th modification of the adhesion reinforcement | strengthening means which concerns on this invention is a back view of a package main body, (b) is a perspective view of a cover body. It is a top view which shows the lead frame used for the other example of the semiconductor device which concerns on this invention. FIG. 24 is a rear view of the lead frame shown in FIG. 23. FIG. 24 is a perspective view showing a package body formed by integrally molding a mold resin body on the lead frame shown in FIG. 23. FIG. 26 is a plan view of the package body shown in FIG. 25. FIG. 26 is a rear view of the package body shown in FIG. 25. It is the longitudinal cross-sectional view which showed the state which accommodated the semiconductor chip in the package main body shown in FIG. 25 with the cover body, and is equivalent to the cross section in alignment with the JJ line | wire of FIG. FIG. 25 is a longitudinal sectional view showing a state in which the lead frame shown in FIG. 23 is arranged in an injection mold, and corresponds to a section taken along line JJ in FIG. 26.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 2 ... Microphone chip, 3 ... Control circuit chip, 4 ... Package, 5 ... Lead frame, 6 ... Mold resin body, 7 ... Package main body, 8 ... Cover body, 9 ... Connection frame part, 10 ... Outside Frame part, 11 ... Stage part, 12 to 14 ... Terminal part, 15 ... Body part, 16, 17 ... Extension part, 21 to 23 ... Internal connection surface, 24 ... Low floor surface, 25 ... Internal connection surface, 26 to 29 ... external connection surface, 30, 31 ... projecting part, 32, 33, 34 ... support surface, 41 ... bottom plate part, 42 ... peripheral wall part, 43 ... overhang part, 44 ... wide part, 45 ... hole part, 46 ... die bond, 47 ... Bonding wire, 51 ... Top plate part, 52 ... Side plate part, 53 ... Collar part (connection part), 54 ... Acoustic hole, 55 ... Internal space, 56 ... Conductive adhesive, 61 ... Upper mold, 62 ... Bottom Mold, 63 ... cavity, 71 ... lead frame, 72 Stage part 73 ... Body part 74 ... Lower hole 75 ... Terminal part 76 ... Internal connection surface 77 ... Extension part 78 ... Support surface 81 ... Lower mold 82 ... Pin 83 ... Upper mold 84 ... Hole: 85 ... Counterbore part, 86 ... Cavity, 91 ... Mold resin body, 92 ... Acoustic hole, 93 ... Cylindrical wall, 94 ... Package body, 95 ... Package, 96 ... Lid body, 97 ... Semiconductor device, 101 ... Package body, 102 ... groove, 103 ... package body, 104 ... cover body, 105 ... groove, 107 ... package body, 108 ... projecting wall, 109 ... recess, 110 ... adhesive receiving part, 111 ... cover body, 112 ... collar Part (connection part), 112a ... convex surface, 113 ... package body, 114 ... concave surface, 115 ... package body, 116 ... elastic ring, 117 ... package body, 118 ... peripheral wall, 118a ... convex surface, 119 ... lid 120 ... side plate portion, 120a ... lower end (connection portion), 121 ... package main body, 122 ... lid body, 123 ... side plate portion, 123a ... lower end (connection portion), 125 ... package main body, 126 ... recess, 127 ... lid body , 128 ... side plate part, 129 ... projecting piece (connection part), 131 ... package body, 132 ... groove part, 133 ... package body, 134 ... hole part, 135 ... lid body, 136 ... package body

Claims (15)

A package body in which at least a part of the lead frame is embedded in a mold resin body, and a lid made of a conductive material fixed to the periphery of the package body so as to cover an upper portion of a semiconductor chip mounted on the package body With body,
In the lead frame, a stage portion disposed below the semiconductor chip and a terminal portion connected to the semiconductor chip are formed with a space therebetween, and at least a part of each of the stage portion and the terminal portion. Is exposed from the hole formed in the mold resin body,
A conductive portion from which a part of the stage portion is exposed and a resin portion made of a part of the mold resin body are disposed at the peripheral portion of the package body, and the lid is connected to the conductive portion. A package for a semiconductor device, characterized in that a connection portion that is brought into contact with an electrical connection state is provided, and a fixing reinforcing means is provided at a fixing portion between the package body and the lid. The connection part of the lid is formed in a flange shape, and the surface of the connection part and the surface of the peripheral part of the package body are fixed by an adhesive,
2. The package for a semiconductor device according to claim 1, wherein the adhesion reinforcing means has a structure in which a surface of the resin portion is formed to be a rough surface. The connection part of the lid is formed in a flange shape, and the surface of the connection part and the surface of the peripheral part of the package body are fixed by an adhesive,
2. The package for a semiconductor device according to claim 1, wherein the adhesion reinforcing means has a configuration in which a plasma treatment is performed on a surface of the resin portion. The connection part of the lid is formed in a flange shape, and the surface of the connection part and the surface of the peripheral part of the package body are fixed by an adhesive,
2. The package for a semiconductor device according to claim 1, wherein the fixing strengthening means is configured such that a groove for interposing a part of the adhesive is formed in at least one of the package main body or the lid. The connection part of the lid is formed in a flange shape, and the surface of the connection part and the surface of the peripheral part of the package body are fixed by an adhesive,
2. The package for a semiconductor device according to claim 1, wherein the fixing strengthening means is configured such that a recess for fitting the connection portion of the lid is formed in the package body. The connection part of the lid is formed in a flange shape, and the surface of the connection part and the surface of the peripheral part of the package body are fixed by an adhesive,
2. The package for a semiconductor device according to claim 1, wherein the fixing strengthening means is configured such that the connecting portion of the lid is curved so that the longitudinal section thereof protrudes downward.   The package for a semiconductor device according to claim 6, wherein a concave surface that engages the connecting portion of the lid is formed on a surface of the resin portion. The connection part of the lid is formed in a flange shape, and the surface of the connection part and the surface of the peripheral part of the package body are fixed by an adhesive,
In the fixing strengthening means, the peripheral edge of the package body protrudes outward from the outer peripheral surface of the connecting portion of the lid, and the protruding portion is a fillet of an adhesive between the outer peripheral surface of the connecting portion of the lid. 2. The package for a semiconductor device according to claim 1, wherein the package is an adhesive receiving portion for receiving the semiconductor device.   The peripheral wall portion is erected on the inner side of the peripheral edge portion of the package body, and an elastic ring that is pressed against the lid body is provided on the outer surface of the peripheral wall portion along the circumferential direction. Item 9. The package for a semiconductor device according to any one of Items 1 to 8.   The fixing reinforcing means is configured such that a peripheral wall portion is erected on the inner side of the peripheral edge portion of the package body, and a side plate portion of the lid body is fitted to an outer surface of the peripheral wall portion. The package for a semiconductor device according to claim 1, wherein a tip is the connection portion.   The package for a semiconductor device according to claim 10, wherein an elastic ring that is pressed against the lid body is provided on an outer surface of the peripheral wall portion along a circumferential direction. The connection part of the lid is formed in a flange shape, and the surface of the connection part and the surface of the peripheral part of the package body are fixed by an adhesive,
The fixing reinforcing means is configured such that a peripheral wall portion is erected on the inner side of the peripheral edge portion of the package body, and an elastic ring that is pressed against the lid body is provided along the circumferential direction on the outer surface of the peripheral wall portion. The package for a semiconductor device according to claim 1, wherein:   The stage portion is partially exposed in a recess formed on the outer peripheral surface of the package body, and the fixing reinforcing means is formed with a protruding piece that fits into the recess of the package body on the lid. 2. The package for a semiconductor device according to claim 1, wherein an inner surface of the projecting piece is the connection portion. A semiconductor chip is mounted on the package body in the package for a semiconductor device according to any one of claims 1 to 13, and the semiconductor chip extends from the hole portion to an internal connection surface in the stage portion and each terminal portion. A semiconductor device which is connected. A microphone package configured using the semiconductor device according to claim 14,
The microphone package, wherein the semiconductor chip is a microphone chip, and an acoustic hole communicating with an internal space is formed in either the lid or the package body.

Images