JP2010040655A - Package body for semiconductor device and method of manufacturing the same, package, semiconductor device, and microphone package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a semiconductor device that stabilizes the posture of a lead frame during injection molding and is formed with accurate position relationship between the lead frame and a mold resin body while made compact. <P>SOLUTION: The lead frame has projections 17 and 19, disposed to be partially embedded in a peripheral wall portion of the mold resin body, integrally with a stage portion 11, and both top and reverse surfaces of a metal plate 51 which is thick enough to include the projections are etched halfway along the thickness to form, on the top surface, an upper surface of the stage portion and an internal connection surface 23 of a terminal portion 13 which are lower than upper end surfaces of the projections and, on the reverse surface, a lower surface 30 of the stage portion which is hollowed from the external connection surface of the terminal portion. Then the lead frame is sandwiched between metal mold surfaces of an injection molding metal mold in a state wherein the upper end surfaces of the projections, the internal connection surface, and the external connection surface are brought into contact with the metal mold surfaces, and a resin is injected in the sandwiched state to form the mold resin body integrally with the lead frame. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor device in which a semiconductor chip is mounted on a package body in which at least a part of a lead frame is embedded in a mold resin body and covered with a lid, the package body, a manufacturing method thereof, and a package The present invention relates to a semiconductor device, and a microphone package configured using the semiconductor device.

A semiconductor device such as a silicon microphone or a pressure sensor has a structure in which a semiconductor chip is housed in a hollow internal space by covering a package body on which a semiconductor chip is mounted with a lid. For example, a microphone package disclosed in Patent Document 1 covers a surface of a flat circuit board on which a microphone chip is mounted with a drawn metal case (lid body) to form a hollow internal space including the microphone chip. ing.
As such a semiconductor device, there is a semiconductor device in which a microphone chip or the like is housed in a pre-mold type hollow package in which a resin is molded on a lead frame because of cost reduction. For example, in a semiconductor device disclosed in Patent Document 2, a package body is formed by molding a resin on a lead frame that is bent by press working.
In this pre-mold type semiconductor package, from the demand for further miniaturization and cost reduction, the metal plate that will be the lead frame is half-etched halfway through the plate thickness to form the terminal surface etc. in the remaining part Techniques for reducing the overall thickness have been proposed.

As a semiconductor package formed by such a half-etched lead frame, for example, in the technique described in Patent Document 3, in the package formation region surrounded by the thick frame portion of the lead frame, the internal connection surface of the surface of the lead frame and Except for the external connection surface on the back side, approximately 1/3 of the plate thickness is half-etched into a concave shape, a solder resist is embedded in the concave portion, and after mounting a semiconductor chip, the whole is covered with a mold resin to form a package Has been.
Also, in the techniques described in Patent Documents 4 and 5, the vicinity of the external connection surface on the back surface of the lead frame is half-etched into a concave shape to a depth of about half the plate thickness, and a mold resin is embedded in the concave portion formed by this half-etching. In addition, a peripheral wall portion is formed of mold resin on the peripheral portion of the surface of the lead frame in order to form a space for housing the semiconductor chip. In this case, a thick portion is left in the vicinity of the peripheral wall portion of the lead frame, and the thick portion can be held between injection molds.
US Pat. No. 6,781,231 JP-A-6-188358 JP 2001-94026 A JP 2001-77277 A Japanese Patent Laid-Open No. 2005-26425

  In recent years, the proportion of packages in the cost of semiconductor devices has increased, and pre-molded packages in which resin is molded into a half-etched lead frame can produce lead frames without drawing or bending. The package cost can be reduced.

  However, because the half-etched lead frame has irregularities on both sides, it has a small area in contact with the surface of the injection mold during resin molding, and is a thin plate. It is difficult to keep close. For this reason, there is a gap between the internal connection surface and the external connection surface, the resin enters, and the connection surface that should be exposed is partially buried in the mold resin. There is a risk that the relative positional relationship between the two will shift. In particular, as shown in Patent Documents 4 and 5, when a peripheral wall portion is formed of a mold resin on a lead frame, the mold and the lead frame do not contact with each other at the peripheral wall portion. The posture is difficult to stabilize, and conversely, if the contact surface with the mold is formed around the peripheral wall portion, downsizing is impaired.

  The present invention has been made in view of such circumstances, and while maintaining downsizing, stabilizes the posture of the lead frame during injection molding and accurately forms the relative positional relationship between the lead frame and the mold resin body. For the purpose.

In order to achieve such an object, the present invention provides a package body for a semiconductor device and a manufacturing method thereof, a package, a semiconductor device, and a microphone package.
First, a package body for a semiconductor device according to the present invention includes a stage part on which a semiconductor chip is mounted, a lead frame having a plurality of terminal parts arranged at intervals from the stage part, and at least a part of the stage part. An inner connection surface of the terminal portion facing the surface of the lead frame and the back surface of the lead frame, comprising a bottom plate portion to be embedded and a molded resin body having a peripheral wall portion standing from the peripheral edge portion of the bottom plate portion The external connection surface of the terminal portion directed to the semiconductor device is exposed from the mold resin body, and the semiconductor chip is mounted on the internal connection surface in a connected state and covered with a lid, The lead frame is formed with a protruding part that is partially embedded in the peripheral wall part, and is integrally formed with the stage part. Surface is characterized by being exposed on the upper end face of the projecting peripheral wall portion from the upper surface of the stage portion.

  That is, the protrusion of the lead frame is disposed in the peripheral wall portion of the mold resin body, and the upper end surface thereof is exposed. Therefore, when the lead frame is placed in the injection mold, the lead frame may be clamped by bringing the mold into contact with the upper end surface of the protrusion and the back surface of the lead frame, and is the largest of the lead frames. Since the thick portion is sandwiched, it can be firmly and stably held, and a package body having a high positional accuracy between the lead frame and the mold resin body can be obtained.

  In the package body for a semiconductor device according to the present invention, the internal connection surface is formed at a position protruding from an upper surface of the stage portion and lower than the projection portion, and the terminal is provided inside the peripheral wall portion of the mold resin body. It is good also as a structure by which the shelf part which embeds a part of part and makes the said internal connection surface into an exposed state is integrally formed.

  The internal connection surface of the terminal portion is a portion that is wire-bonded to the semiconductor chip, and accurate positional accuracy is required to securely fix the wire. By forming the portion of the internal connection surface to be relatively thick, it can be easily held by the injection mold, the posture during injection can be stabilized, and the internal connection surface can be reliably exposed. Moreover, since the internal connection surface can be arranged at a position higher than the bottom plate portion, die bonding does not adhere to the internal connection surface when bonding the semiconductor chip, and the bonding wire between the semiconductor chip and the semiconductor chip is shortened. Thus, wire bonding work can be facilitated, and short circuit or the like hardly occurs, and reliability can be improved.

  And the manufacturing method of such a package body for a semiconductor device is such that the front and back surfaces of the metal plate having the thickness including the protrusion are etched to the middle of the thickness so that the surface is lower than the upper end surface of the protrusion. After producing a lead frame in which the upper surface of the stage portion and the inner connection surface of the terminal portion, the lower surface of the stage portion in a state of being recessed from the external connection surface of the terminal portion (concave surface in the embodiment) on the back surface, respectively, The lead frame is sandwiched between the mold surfaces with the upper end surface of the projection, the internal connection surface, and the external connection surface in contact with the mold surface of the injection mold, and the resin is injected in this sandwiched state. The mold resin body is integrally formed on the lead frame.

  The lead frame is manufactured by so-called half-etching, and can be manufactured without drawing or bending press work, so that the cost can be reduced and the distortion that occurs during the press work is not generated. As described above, the package main body can be manufactured with high positional accuracy because it is easily sandwiched by the injection mold by the thick protrusions.

According to another aspect of the present invention, there is provided a package for a semiconductor device, comprising: the package body for a semiconductor device; and a lid that covers the surface of the package body for the semiconductor device in a state where an internal space is formed.
In this case, since the peripheral wall portion is formed on the package main body, the lid body only needs to be fixed to the upper end surface of the peripheral wall portion, and a flat plate can be used without drawing or the like. Can be manufactured.

In the package for a semiconductor device according to the present invention, the lid may be formed of a conductive material.
The package body has the upper end surface of the lead frame protrusion exposed at the upper end of the peripheral wall portion, and the cover body is fixed to the upper end surface of the protrusion so that the inner space is formed from the cover by the protrusion and the stage portion. The semiconductor chip can be stored in a magnetically shielded state.

  The semiconductor device according to the present invention is characterized in that a semiconductor chip is mounted on a bottom plate portion of the package body in the semiconductor device package, and the semiconductor chip is connected to the internal connection surface.

  In the microphone package of the present invention configured using the semiconductor device, the semiconductor chip is a microphone chip, and an acoustic hole communicating with the internal space is formed in either the lid or the package body. It is characterized by being.

In the microphone package of the present invention, a part of the lead frame is exposed to the package body from a window hole formed in the mold resin body, and a plurality of small holes penetrating the lead frame are formed in the exposed part. The acoustic holes may be formed by these small holes.
The small hole in the window hole can be formed by etching the lead frame, and can be processed with the same equipment as the half etching process, which is economical.

  According to the present invention, the protrusion is provided integrally with the stage portion of the lead frame, and the upper end surface of the protrusion is exposed on the upper end surface of the peripheral wall portion of the mold resin body. Since the mold resin body is formed by sandwiching the thick part between the back surface of the lead frame, the lead frame can be held firmly and stably, and the positional accuracy between the lead frame and the mold resin body It can be a good package body. In addition, by forming the concavo-convex shape of the lead frame by half-etching, it can be manufactured without drawing or bending press work, so it is possible to reduce costs and to generate distortion during press work It is possible to manufacture a package body with high positional accuracy.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 8 show a first embodiment. The semiconductor device 1 of the first embodiment is a microphone package, and as shown in FIG. 6 as a whole, two chips of a microphone chip 2 and a circuit chip 3 are accommodated as semiconductor chips. The package 4 includes a lead frame 5, a package body 7 formed of a box-shaped mold resin body 6 integrally formed with the lead frame 5, and a lid body 8 that closes the upper portion of the package body 7. It is said that.

  The lead frame 5 is formed continuously on a strip-shaped metal plate in a single row or in a plurality of rows with one unit shown in FIG. 2 by etching and pressing as described later. . In this specification, the unit shown in FIG. 2 is referred to as a lead frame, and in the following, the vertical direction in FIG. 2 is referred to as the vertical direction, and the horizontal direction is referred to as the horizontal direction. In the figure, reference numeral 9 denotes a connection frame portion that connects each lead frame 5 to an adjacent lead frame 5 or an outer frame portion (not shown).

In the lead frame 5, a stage portion 11 having a relatively large area and three terminal portions 12 to 14 for power supply, output, and gain arranged around the stage portion 11 are spaced from each other. Each is connected to the adjacent lead frame 5 or the outer frame portion by the connection frame portion 9.
In this case, the lead frame 5 is formed in a rectangular shape as a whole, and the stage portion 11 is disposed near one corner portion in the rectangular shape, and the main body portion 16 that forms two sides of the corner portion is separated from the main body portion 16. Two projecting portions 17 and 18 are integrally formed, and the tips of these projecting portions 17 and 18 are arranged at approximately the center positions of the other two sides, respectively. And the terminal parts 12-14 are arrange | positioned at the three corners made into the space by this stage part 11, respectively.

  Further, thick projections 19 to 21 projecting from the upper surface of the stage unit 11 are provided on the peripheral part of the stage unit 11 and on the peripheral part of the lead frame 5 except for the three terminal units 12 to 14. Is formed in a rib shape along the periphery. In other words, the projecting portions 19 to 21 are formed in the L-shaped projecting portion 19 formed along two sides constituting the corner portion in the main body portion 16 of the stage 11 and the tips of the projecting portions 17 and 18. It is comprised from the straight-shaped projection part 20 and 21 formed in the part along the edge | side, respectively. These protrusions 19 to 21 are arranged in a peripheral wall portion of the mold resin body 6 to be described later, and the upper end surfaces of the protrusions 19 to 21 are formed as flat surfaces having the same height.

In addition, the peripheral wall part in the mold resin body is formed in a rectangular frame shape so as to connect the projecting parts 19 to 21 with a slightly larger width dimension than the projecting parts 19 to 21. A range A surrounded by a two-dot chain line indicates the formation region.
Moreover, as shown in FIG. 3, each terminal part 12-14 is formed thicker than the stage part 11, although it is lower than the projection parts 19-21, all are formed in planar view rectangular shape, and the one side Is set to be larger than the width dimension of the projecting portions 19 to 21 of the stage portion 11. Moreover, the corner | angular part of the stage part 11 corresponding to these terminal parts 12-14 also protrudes with the same height as each terminal parts 12-14. And the corner | angular part of each terminal part 12-14 and the corner | angular part of the stage part 11 are arrange | positioned so that it may protrude inward rather than the formation area A of a surrounding wall part, as shown to Fig.2 (a), The protrusion The upper end surfaces of the inner corner portions of the respective terminal portions 12 to 14 serving as portions are internal connection surfaces 22 to 24 for semiconductor chips 2 and 3 described later, and the upper end surfaces of the corner portions of the stage portion 11 are ground internal connection surfaces 25. It is said that.

  On the other hand, as shown in FIG. 2B, the back surface of the lead frame 5 has three terminal portions 12 to 14 and one corner portion of the stage portion 11 corresponding to the arrangement of these terminal portions as described later. And external connection surfaces 26 to 29 when mounted on the board, and portions other than these external connection surfaces 26 to 29 are concave surfaces 30 recessed from the external connection surfaces 26 to 29. Accordingly, the external connection surfaces 26 to 29 are arranged to protrude in a rectangular shape having substantially the same size at the four corners of the lead frame 5.

  And the package main body 7 is comprised by shape | molding the mold resin body 6 integrally with the lead frame 5 processed in this way as shown in FIG. As shown in FIGS. 5 and 6, the mold resin body 6 includes a bottom plate portion 31 formed in a rectangular plate shape having a length in which the microphone chip 2 and the control circuit chip 3 can be arranged, and a peripheral edge of the bottom plate portion 31. It is formed in the box shape provided with the square-tube-shaped surrounding wall part 32 standingly arranged from the part.

The bottom plate portion 31 has a relatively wide range of front and back surfaces of the stage portion 11 embedded in the center of the lead frame 5. Moreover, as shown in the formation area A of FIG. 2, the peripheral wall portion 32 is embedded in the outer portions of the projecting portions 19 to 21 in the stage portion 11 and the inner connection surfaces 22 to 24 of the terminal portions 12 to 14. It is said.
Further, shelf portions 35 and 36 slightly lower than the peripheral wall portion 32 are formed on the inner side of the peripheral wall portion 32 so as to protrude from the upper surface of the bottom plate portion 31, and the inner portions of the terminal portions 12 to 14 are formed on the shelf portions 35 and 36. The connection surfaces 22 to 24 and the ground internal connection surface 25 of the stage portion 11 are exposed. In this case, the shelf portions 35 and 36 are disposed at two locations on the upper and lower end portions of the bottom plate portion 31. On the other hand, two upper portions of the shelf portion 35 disposed on the upper side in FIG. The internal connection surfaces 22 and 23 of the terminal portions 12 and 13 are exposed, and the internal connection surface 24 of the remaining one terminal portion 14 and the ground internal connection surface 25 are exposed on the upper surface of the other shelf 36. Yes.
On the other hand, on the back surface side of the mold resin body 6, the concave surface 30 of the stage portion 11 is buried, and as shown in FIG. 4B, the external connection surface 29 of the stage portion 11 and the terminal portions 12 to 14. The external connection surfaces 26 to 28 are exposed at the four corners.

  As shown in FIG. 6, the microphone chip 2 and the control circuit chip 3 are fixed by the die bond 37 on the bottom plate portion 31 of the package body 7 formed in this way, and are exposed on the shelf portions 35 and 36. The terminal portions 12 to 14 are connected to the internal connection surfaces 22 to 24 and the ground internal connection surface 25 by bonding wires 38. In the microphone chip 2, a diaphragm electrode and a fixed electrode that vibrate in response to pressure fluctuations such as sound are disposed to face each other, and a change in electrostatic capacitance accompanying vibration of the diaphragm electrode is detected. The control circuit chip 3 includes a power supply circuit to the microphone chip 2, an output signal amplifier from the microphone chip 2, and the like.

On the other hand, the lid body 8 that covers the package body 7 is formed of a conductive metal material such as a copper material into a rectangular flat plate covering the upper end surface of the peripheral wall portion 32, and the acoustic hole 41 is formed in a penetrating state at the center. Has been. When the lid 8 is put on the package body 7, the internal space 42 surrounded by the peripheral wall portion 32 of the package body 7 is closed as shown in FIG. It is the structure made into the state made to communicate with.
In this case, the package body 7 and the lid body 8 are fixed by the conductive adhesive 43, and the protruding portion of the lead frame 5 exposed at the upper end surface of the peripheral wall portion 32 of the package body 7. The upper end surfaces 19 to 21 are electrically connected to the lid 8 via the conductive adhesive 43. Therefore, the package 4 formed by fixing the lid body 8 to the package body 7 is in an electrically connected state between the lid body 8 and the stage portion 11 of the lead frame 5, and the semiconductor chips 2 and 3 in the internal space 42. Is in a state of surrounding.

Next, a method for manufacturing the semiconductor device 1 configured as described above will be described.
First, a belt-shaped metal plate 51 having a thickness including the protrusions 19 to 21 of the lead frame 5 is prepared, and this metal plate 51 is masked and etched to the middle of the plate thickness, so-called half-etching treatment is performed. An uneven shape is formed.

  As shown in FIG. 7A, the masking is performed by using the first resist covering the regions to be the internal connection surfaces 22 to 24 and the ground internal connection surfaces 25 of the terminal portions 12 to 14 as shown in FIG. The layer 52 and the second resist layer 53 that covers the region to be the protrusions 19 to 21 have a two-stage configuration in which the second resist layer 53 is formed thicker than the first resist layer 52. Then, the region surrounded by the resist layers 52 and 53 is etched to the middle of the plate thickness as shown in FIG. 7B, and then the second layer 53 applied to the region to be the protrusions 19 to 21 is formed. After ashing the resist layers 52 and 53 so that the pattern remains, etching is performed again to form the terminal portions 12 to 14 (internal connection surfaces 22 to 24) and the ground internal connection surface 25 as shown in FIG. Then, the upper surface of the stage part 11, the upper surface of the terminal parts 12-14, and the upper end surface of the projection parts 19-21 are formed in step shape. On the other hand, on the back surface, masking is performed so as to cover the regions to be the external connection surfaces 26 to 29, and etching is performed as indicated by a chain line in FIG.

The etching depth of each part is, for example, 1/4 of the original plate thickness from the upper end surface of the protrusions 19 to 21 to the internal connection surfaces 22 to 24 of the terminal parts 12 to 14 and the internal connection surface 25 for the ground. A distance from the upper end surface of 19 to 21 to the upper surface of the stage unit 11 is set to 2/3 of the original plate thickness. Further, on the back surface, the depth from the external connection surfaces 26 to 29 to the concave surface 30 of the stage portion 11 is set to a depth of 1/4 of the original plate thickness.
In this way, after providing the concave and convex shapes on both the front and back surfaces, the outer shape is punched out by pressing, and the lead frame 5 connected by the connection frame portion 9 is formed. At this time, as necessary, the surfaces are flattened by pressing the internal connection surfaces 22 to 24 of the terminal portions 12 to 14 with a press.

Next, the lead frame 5 is placed in an injection mold, and a resin is injection-molded so as to embed the lead frame 5 to mold the mold resin body 6.
FIG. 8 shows a state in which the lead frame 5 after press molding is disposed in an injection mold, and a cavity 56 into which mold resin is injected is formed between the upper mold 54 and the lower mold 55. . On the surface of the lead frame 5, on the shelf portion of the mold resin body 6, the internal connection surfaces 22 to 24 of the terminal portions 12 to 14, the ground internal connection surface 25 of the stage portion 11, and the upper end surface of the peripheral wall portion 32. The upper end surfaces of the protrusions 19 to 21 are exposed, and the external connection surfaces 26 to 29 are exposed on the back surface. These exposed surfaces are the internal connection surfaces 22 to 24, the ground internal The upper surface 54 of the connection surface 25 and the projections 19 to 21 are formed by abutting the upper mold 54 during injection molding, and the outer connection surfaces 26 to 29 are formed by the contact of the flat surface of the lower mold 55.

  In this case, the upper end surfaces of the protrusions 19 to 21 on the surface of the lead frame 5, the internal connection surfaces 22 to 24 of the terminal portions 12 to 14, the ground internal connection surface 25, and the external connection surfaces 26 to 29 on the back surface are gold. By contacting the molds 54 and 55, the lead frame 5 is sandwiched from both sides in the cavity 56. At this time, the projecting portions 19 to 21 have a thickness 12 times as large as the thickness of the stage portion 11, and the molds 54 and 55 hold the thick projecting portions 19 to 21 therebetween. Therefore, it can hold | maintain firmly and each part is positioned correctly. Moreover, the roughness by the etching of the internal connection surfaces 22-25 can be planarized by pinching with this metal mold | die.

And after arrange | positioning the lead frame 5 in a metal mold | die in this way and shape | molding the mold resin body 6 integrally, a plating film is applied to the internal connection surfaces 22-24, the internal connection surface 25 for grounds, etc. as needed. The semiconductor chips 2 and 3 are fixed by die bonding 37 on the bottom plate portion 31 of the package body 7, and the internal connection surfaces 22 to 24 of the terminal portions 12 to 14 exposed on the shelf portions 35 and 36 and A connection state is established by wire bonding to the internal connection surface 25 for ground. In this case, as described above, since the lead frame 5 is held so as not to move on the mold surface during the injection molding of the mold resin body 6, the surface of the mold resin body 6, the internal connection surfaces 22 to 24, and the ground are used. The height positional relationship with the surface of the internal connection surface 25 is accurately finished, and the wire bonding operation can be performed smoothly without any trouble.
Further, the internal connection surfaces 22 to 24 and the ground internal connection surface 25 of the terminal portions 12 to 14 are exposed on the upper surfaces of the shelf portions 35 and 36 higher than the bottom plate portion 31 to which the semiconductor chips 2 and 3 are bonded. Therefore, when the semiconductor chips 2 and 3 are bonded, the die bond 37 does not adhere to the internal connection surfaces 22 to 24 and the ground internal connection surface 25, and the length of the bonding wire 38 between the semiconductor chips 2 and 3. Can be shortened to facilitate the work.

Next, after this wire bonding operation, a conductive adhesive 43 is applied to the upper end surface of the peripheral wall portion 32, and a cover 8 that has been separately manufactured is put on and adhered. In this state, the package body 7 is connected to the adjacent lead frame via the connection frame portion 9 so that a plurality of the package bodies 7 are connected vertically and horizontally, and the lid 8 is also connected to the lead frame. 5 are connected to each other at the same pitch as that of the package body 7 by a connection frame portion (not shown) similar to 5 and are bonded together.
Then, after this bonding, the connection frame portion 9 of the lead frame 5 and the connection frame portion of the lid 8 protruding from the mold resin body 6 are collectively cut and divided into individual packages 4.

The semiconductor device 1 manufactured in this way is mounted by soldering the terminal portions 12 to 14 exposed on the bottom surface and the external connection surfaces 26 to 29 of the stage portion 11 to the substrate.
In addition, as shown in FIG. 6, the semiconductor device 1 includes a stage portion 11 embedded in the bottom plate portion 31 disposed below the semiconductor chips 2 and 3, and a plurality of peripheral portions of the stage portion 11. The formed protrusions 19 to 21 are arranged so as to surround the sides of the semiconductor chips 2 and 3. The lid body 8 is connected to the upper end surfaces of the projecting portions 19 to 21 via the conductive adhesive 43, and the lid body 8 covers the semiconductor chips 2 and 3. Therefore, the semiconductor chips 2 and 3 are surrounded by the stage portion 11, the projections 19 to 21 and the lid body 8, and the external connection surface 28 of the stage portion 11 is grounded through the substrate. Thus, the semiconductor chips 2 and 3 can be shielded from an external magnetic field.

On the other hand, FIGS. 9 to 13 show a second embodiment of the present invention. In these drawings, parts common to those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
In the first embodiment described above, the acoustic hole is formed in the lid, but in the semiconductor device 61 of the second embodiment, the acoustic hole 63 is formed in the package body 62. That is, as shown in FIG. 10, the lead frame 64 used in the semiconductor device 61 is acoustically so as to penetrate through the vicinity of one terminal portion 14 in the main body portion 16 of the stage portion 65. A pilot hole 66 for holes is provided. The mold resin body 67 in which the lead frame 64 is embedded is, as shown in FIGS. 9 and 12, an acoustic hole 63 slightly smaller than the lower hole 66 in the shelf portion 36 where the lower hole 66 is disposed. Is formed in a penetrating state, and a ring-shaped recess 68 surrounding the acoustic hole 63 is formed on the back surface. On the other hand, as the lid 70 constituting the package 69 in combination with the package body 62, a flat plate having no holes is used as shown in FIG.

  When manufacturing the package main body 62 of the semiconductor device 61 configured as described above, first, as in the first embodiment, the metal plate having the thickness including the protrusions 19 to 21 of the lead frame 64 is half-etched to obtain the surface. About, after forming the stage part 65, the terminal parts 12-14, and the projection parts 19-21 in two steps, about the back surface, after forming the concave surface 29 which hollowed other than the external connection surfaces 26-29, The outer shape is punched out by pressing, and as shown in FIG. 10, a lead frame 64 connected by the connection frame portion 9 is formed.

  Next, the lead frame 64 is set in an injection mold shown in FIG. In this injection mold, a pin 72 having a slightly smaller diameter than the lower hole 66 of the lead frame 64 is provided on the lower mold 71 in a protruding state, and the pin 72 is surrounded by a ring with a slight interval. A convex portion 73 is formed concentrically, and a hole 75 into which the tip end portion of the pin 72 is inserted is formed in the upper mold 74. In this case, the height of the ring convex portion 73 is formed to be the same as the depth of the concave portion 29 of the lead frame 64, and when the pins 71 are inserted into the holes 75 by tightening the dies 71 and 74, the ring convex portion is formed. The upper end surface of the portion 73 comes into contact with the concave surface 29 around the lower hole 66 of the lead frame 64.

By installing a lead frame 64 in this injection mold and injecting resin, the acoustic hole 63 is penetrated into the shelf 36 of the mold resin body 67 by pins 72 as shown in FIGS. The ring-shaped concave portion 68 is formed on the back surface so as to surround the acoustic hole 63 by the ring-shaped convex portion 73.
In the package main body 62, the semiconductor chips 2 and 3 are mounted on the bottom plate portion 31, but since the acoustic holes 63 are formed in the shelf portion 36, a die bond 37 for bonding the semiconductor chips 2 and 3 is used. Can be prevented by the walls of the shelf 36 and flowing into the acoustic hole 63. Further, when the mold resin body 67 is formed, the ring-shaped convex portion 73 of the injection mold supports the thin stage portion 65 of the lead frame 64 from below, so that vibration or deformation occurs due to the pressure during injection. This can be prevented.

  Moreover, when providing an acoustic hole in the package body as in the second embodiment, the structure as in the third embodiment shown in FIGS. 14 to 17 may be adopted. In the package 82 of the semiconductor device 81, a circular window hole 85 is drawn out from the shelf 36 of the mold resin body 84 in the package body 83 as shown in FIGS. A part of the stage portion 87 of the frame 86 is exposed in a circular shape, and a plurality of small holes 88 are formed through the exposed portion, and an acoustic hole 89 is formed by the small holes 88. .

  When the package body 83 is manufactured, the small holes 88 of the acoustic holes 89 can be formed when the lead frame 86 is half-etched. In other words, the lead frame 86 is half-etched in a multi-stage manner as in the first and second embodiments, and at that time, etching is performed by masking small holes in the acoustic hole forming region. Thereby, the small hole 88 of the penetration state can be formed. Then, when the molding resin body 84 is injection-molded on the lead frame 86, as shown in FIG. 17, the portion where the acoustic hole 89 is formed is sandwiched between the circular protrusions 93 formed on the upper die 91 and the lower die 92. By injection molding, the small hole 88 is closed. As a result, as shown in FIGS. 15 and 16, a part of the stage portion 87 is exposed in a circular shape at the shelf portion 36, and an acoustic hole 89 in which a plurality of small holes 88 penetrate is formed in the exposed portion. The

  With the acoustic hole 89 having such a structure, the acoustic hole 89 can be formed efficiently in the etching process which is a part of the manufacturing process, and the acoustic hole 89 is formed by the plurality of small holes 88. As a result, the individual small holes 88 become smaller, and foreign matters such as dust can be prevented from entering the internal space, and the generation of noise can also be suppressed.

In addition, this invention is not limited to the thing of the structure of the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above embodiment, an example in which the semiconductor device is applied to a microphone package has been described. However, the present invention can be applied to a pressure sensor, an acceleration sensor, a magnetic sensor, a flow rate sensor, a wind pressure sensor, and the like in addition to the microphone. In this case, in the microphone of the above-described embodiment, a communication hole that communicates the internal space such as the acoustic hole and the outside is necessary. However, depending on the type of sensor, the communication hole may be unnecessary, In some cases, two communication holes are required.

In addition, the external connection surfaces of the stage unit and each terminal unit have a four-terminal configuration in each embodiment, and are provided for, for example, power supply, output, gain, and ground, but at least for power supply There should be a connection surface for output and ground. In that case, two ground connection surfaces may be provided. Further, depending on the semiconductor chip housed inside, the number of terminals may be larger than that of the embodiment. The number of semiconductor chips is not necessarily limited to two.
Furthermore, a recess may be formed so that the external connection surface is fitted to an injection mold for molding the mold resin body, and the external connection surface may be formed to protrude from the back surface of the mold resin body. The back surface of the mold resin body can be mounted in a state where it is floated from the surface of the substrate. In addition, the conductive adhesive is applied to the package body and the lid body is bonded, but an adhesive sheet may be attached to the package body to bond the lid body.

The package main body of 1st Embodiment of this invention is shown, (a) is the perspective view seen from upper direction, (b) is the perspective view seen from the downward direction. The lead frame used for the package main body of FIG. 1 is shown, (a) is a top view, (b) is the back view. It is arrow sectional drawing which follows the BB line of FIG. The state which integrally molded the mold resin body to the lead frame shown in FIG. 2 is shown, (a) is a top view, (b) is the back view. (A) is a top view of the package main body of 1st Embodiment, (b) shows the back view. It is a longitudinal cross-sectional view which shows the semiconductor device formed by accommodating a semiconductor chip in the package main body of 1st Embodiment, and fixing a cover body, and is equivalent to the cross section in alignment with the BB line of FIG. FIG. 3 is a longitudinal sectional view showing a state in which the surface side of the lead frame shown in FIG. 2 is half-etched in order of steps (a), (b), and (c). It is a longitudinal cross-sectional view which shows the state which has arrange | positioned the lead frame shown in FIG. 2 in the injection mold, and is equivalent to the cross section which follows the BB line of FIG. The package main body of 2nd Embodiment of this invention is shown, (a) is the perspective view seen from upper direction, (b) is the perspective view seen from the downward direction. FIG. 10 shows a lead frame used in the package body of FIG. 9, wherein (a) is a plan view and (b) is a back view thereof. It is arrow sectional drawing which follows the CC line of FIG. It is a longitudinal cross-sectional view which shows the semiconductor device formed by accommodating a semiconductor chip in the package main body of 2nd Embodiment, and adhere | attaching a cover body, and is corresponded in the cross section along CC line of FIG. It is a longitudinal cross-sectional view which shows the state which has arrange | positioned the lead frame shown in FIG. 10 in the injection mold, and is equivalent to the cross section which follows the CC line of FIG. The lead frame used for the package main body of 3rd Embodiment of this invention is shown, (a) is a top view, (b) is the back view. The package main body of 3rd Embodiment is shown, (a) is a top view, (b) is the back view. It is a longitudinal cross-sectional view which shows the semiconductor device which accommodates a semiconductor chip in the package main body of 3rd Embodiment, and fixes a cover body, and is equivalent to the cross section which follows the DD line | wire of FIG. It is a longitudinal cross-sectional view which shows the state which has arrange | positioned the lead frame shown in FIG. 14 in the injection mold, and is equivalent to the cross section which follows the DD line | wire of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 2 ... Microphone chip, 3 ... Control circuit chip, 4 ... Package, 5 ... Lead frame, 6 ... Mold resin body, 7 ... Package main body, 8 ... Cover body, 9 ... Connection frame part, 11 ... Stage Part, 12-14 ... terminal part, 15 ... connection part, 16 ... main body part, 17, 18 ... projecting part, 19-21 ... projection part, 22-24 ... internal connection surface, 25 ... internal connection surface for ground, 26 ˜29 ... external connection surface, 30 ... concave surface, 31 ... bottom plate portion, 32 ... circumferential wall portion, 35,36 ... shelf portion, 37 ... die bond, 38 ... bonding wire, 41 ... acoustic hole, 42 ... internal space, 43 ... Conductive adhesive, 51 ... metal plate, 52, 53 ... resist layer, 54 ... upper die, 55 ... lower die, 56 ... cavity, 61 ... semiconductor device, 62 ... package body, 63 ... acoustic hole, 64 ... lead frame , 65 ... Cottage portion, 66 ... lower hole, 67 ... mold resin body, 68 ... ring-shaped recess, 69 ... package, 70 ... lid, 71 ... lower mold, 72 ... pin, 73 ... ring-shaped projection, 74 ... upper mold, 75 ... Hole, 81 ... Semiconductor device, 82 ... Package, 83 ... Package body, 84 ... Mold resin body, 85 ... Window hole, 86 ... Lead frame, 87 ... Stage part, 88 ... Small hole, 89 ... Sound hole, 91 ... Upper die, 92 ... Lower die, 93 ... Circular protrusion

Claims (8)

A lead frame having a stage portion on which a semiconductor chip is mounted, a plurality of terminal portions arranged at intervals from the stage portion, a bottom plate portion in which at least a part of the stage portion is embedded, and a periphery of the bottom plate portion And an external connection surface of the terminal portion directed to the back surface of the lead frame, and an internal connection surface of the terminal portion directed to the surface of the lead frame. A semiconductor device package body that is exposed from the mold resin body and is connected to the internal connection surface in a connected state and covered with a lid body,
In the lead frame, a protrusion portion that is partially embedded in the peripheral wall portion is formed integrally with the stage portion, and an upper end surface of the protrusion portion protrudes from an upper surface of the stage portion, and is above the peripheral wall portion. A package body for a semiconductor device, wherein the package body is exposed at an end face.   The internal connection surface protrudes from the upper surface of the stage portion and is formed at a position lower than the projection portion, and embeds a part of the terminal portion inside the peripheral wall portion of the mold resin body and 2. The package body for a semiconductor device according to claim 1, wherein a shelf portion that exposes the connection surface is integrally formed. A method of manufacturing a package body for a semiconductor device according to claim 1 or 2,
By etching both the front and back surfaces of the metal plate having a thickness including the protrusion partway through the thickness, the upper surface of the stage part lower than the upper end surface of the protrusion part, the internal connection surface of the terminal part, and the back surface After manufacturing the lead frame in which the lower surface of the stage portion is depressed from the external connection surface of the terminal portion, the upper end surface of the protrusion, the internal connection surface, and the outside are formed on the mold surface of the injection mold. The semiconductor device is characterized in that the lead frame is sandwiched between mold surfaces in a state where the connection surfaces are in contact with each other, and resin is injected in the sandwiched state to integrally form the mold resin body on the lead frame. Manufacturing method for package body.   A package for a semiconductor device according to claim 1, comprising: a package body for a semiconductor device according to claim 1; and a lid that covers the surface of the package body for a semiconductor device in a state where an internal space is formed.   The package for a semiconductor device according to claim 4, wherein the lid is made of a conductive material. 6. The semiconductor device according to claim 4, wherein a semiconductor chip is mounted on a bottom plate portion of the package body in the package for a semiconductor device, and the semiconductor chip is connected to the internal connection surface. A microphone package configured using the semiconductor device according to claim 6,
The microphone package, wherein the semiconductor chip is a microphone chip, and an acoustic hole communicating with the internal space is formed in either the lid or the package body.   In the package body, a part of the lead frame is exposed from a window hole formed in the mold resin body, and a plurality of small holes penetrating the lead frame are formed in the exposed part. The microphone package according to claim 7, wherein the acoustic hole is configured.

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