JP2010021519A - Flat frame member for lead frame, lead frame and method of manufacturing same, package body, package, semiconductor device, and microphone package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further reduce costs by downsizing the whole package with a simple structure. <P>SOLUTION: There is provided the method for manufacturing a lead frame for semiconductor device provided with: a main frame part 11 the part of which is embedded in a box-shaped mold resin body comprising a bottom wall part on which a semiconductor chip is mounted and a peripheral wall part that is erected from the peripheral part of the bottom wall part and which is exposed on the top end surface of the peripheral wall part; a plurality of connecting arm parts 12 suspended from the main frame part 11; and a shield plate part 13 that extends from a lower end of the connecting arm part 12 and is embedded within the bottom wall part. The lead frame is manufactured by press-molding a metal plate to form the shield plate part 13 continuously in the shape of a plane inside the main frame part 11 via the connecting arm part 12 and by pressing down the shield plate part 13 while holding the main frame part 11 and deforming the connecting arm part 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor device in which a semiconductor chip is housed in a box-shaped package body in which at least a part of a lead frame is embedded in a mold resin body and covered with a lid, and a flat frame member for a lead frame The present invention relates to a lead frame and a manufacturing method thereof, a package body in which the lead frame is embedded, a package, a semiconductor device, and a microphone package configured using the semiconductor device.

2. Description of the Related Art Some semiconductor devices such as a silicon microphone and a pressure sensor include a microphone chip and the like housed in a pre-mold type hollow package obtained by molding a resin on a lead frame.
Conventionally, as a semiconductor device using this pre-mold type package, there is one disclosed in Patent Document 1. In this semiconductor device, a semiconductor chip is mounted on a shield plate portion (stage portion) disposed in the center portion of the lead frame, and a mold resin body is integrally provided from the back side of the shield plate portion to the periphery of the shield plate portion. In this mold resin body, an intermediate portion of the suspension lead protruding from the shield plate portion is disposed on the upper surface of the peripheral wall portion protruding from the shield plate portion. On the other hand, the lid that covers the mold resin body is formed in a metal cup shape, and its peripheral portion is joined and covered with the peripheral wall portion of the mold resin body, thereby forming a space around the semiconductor chip. The metal lid and the exposed portion of the suspension lead are electrically connected.
Then, the tip of the suspension lead and the tip of the lead arranged at the outer side position of the shield plate are respectively exposed on the back surface of the mold resin body and connected to the circuit of the substrate when mounted on the substrate. It is like that.
Patent Documents 2 to 5 also describe semiconductor devices using pre-mold type packages.
On the other hand, the semiconductor device described in Patent Document 6 has a configuration in which a semiconductor chip (microphone chip) is mounted on the surface of a flat circuit board, and a metal case (lid body) is covered and fixed thereon. .

JP 2007-66967 A JP-A-8-255862 JP 2000-353759 A JP 2005-5353 A Japanese Patent Laid-Open No. 2005-26425 US Pat. No. 6,781,231

  In the semiconductor device described in Patent Document 1, the shield plate portion of the lead frame and the metal lid are connected to each other at the exposed portion of the suspension lead, so that the periphery of the semiconductor chip is surrounded by the metal portion to improve the shielding performance. This is a simple method in which a resin is molded into a lead frame and integrated, so that it can be manufactured at low cost. However, the suspension lead is raised, the middle part is exposed on the upper surface of the peripheral wall part of the mold resin part, and then turned downward again so that the part on the tip side is folded back, and the tip part is placed on the back surface of the mold resin part. Since the structure is exposed, a complicated bending process is required for the lead.

  On the other hand, when the package body is made flat as in the semiconductor device described in Patent Document 6, it is conceivable that when the semiconductor chip is fixed by die bonding, the adhesive flows out to cover the inner end of the lead portion. For this reason, it is necessary to ensure a sufficiently large distance between the chip mounting portion and the inner end portion of the lead portion so that the adhesive does not reach, and the downsizing is impaired.

  The present invention has been made in view of such circumstances, and an object of the present invention is to reduce the overall size with a simple structure and to further reduce costs.

In order to achieve such an object, the present invention provides a flat frame member for a lead frame, a lead frame and a manufacturing method thereof, a package body, a package, a semiconductor device, and a microphone package.
First, a flat frame member for a lead frame of the present invention is a flat frame member for forming a lead frame embedded from a peripheral wall portion to a bottom wall portion of a box-shaped mold resin body in a package body for a semiconductor device, A main frame portion exposed at the upper end surface of the peripheral wall portion of the mold resin body, and a shield plate portion connected in a planar shape to the main frame portion via a connecting arm portion, are provided on the main frame portion. A bent portion that protrudes outward so as to bend a part thereof, a support arm portion that protrudes inward of the main frame portion from the inside of the concave portion formed inside the bent portion, and the support arm The terminal part connected to the front-end | tip of the part is formed.

In this flat frame member, a three-dimensional lead frame can be formed by pressing down the shield plate portion with respect to the main frame portion and bending the support arm portion by pressing. This is a process that simply deforms the connecting arm portion and the support arm portion so as to hang down, and can be easily manufactured.
In this case, the connecting arm portion only hangs in one direction from the main frame portion toward the shield plate portion, and is not folded back as in the prior art example. Therefore, even if the outer shape determined by the arrangement of the main frame portion is kept small, it is possible to form a relatively large shield plate portion with respect to the main frame portion. Since the semiconductor chip is mounted above the shield plate portion, it is possible to secure a large mounting space for the semiconductor chip, and to increase the internal volume while reducing the outer shape.
In the pressing process, the main frame part can be held and the shield plate part can be pushed down. In this case, the main frame part can maintain a flat surface, and a flat body can be used as a lid to cover the main frame part. Can be used.
Then, after molding the molded resin body on the lead frame and cutting from the bent part of the main frame part, the terminal part connected to the support arm part is separated and independent from the main frame part to be insulated. Can do.

  In the flat frame member according to the present invention, a plurality of the connecting arm portions are provided, and the bent portions are arranged at both ends of the connecting arm portions, and the bent portions on the main frame portion side in each connecting arm portion and the The portions to be bent on the shield plate portion side may be arranged on lines parallel to each other.

Moreover, the flat frame member of this invention WHEREIN: The said connection arm part is good also as what is arrange | positioned along with the opposing edge part of the said main frame part and the said shield board part.
Further, the connecting arm portion is provided at a line-symmetrical position via the shield plate portion, and each connecting arm portion includes a connection portion to the shield plate portion and the main frame portion, and the opposite edge portions thereof. However, it may be provided at a position shifted from the mutually facing position.

  When the connecting arm part is arranged on both sides of the shield plate part in a straight line, the connecting arm part will be bent and deformed along with the bending deformation. Since the portions to be bent on the shield plate side are arranged on lines parallel to each other, the shield plate portion can be pushed down only by bending deformation of the portions to be bent.

  In the present invention, a flat frame continuous molded body in which a plurality of flat frame members for the lead frame are formed in a connected state may be used. In the flat frame continuous molded body, the main frame portion is the lead frame. For each row of each flat frame member formed to be disposed at one end of the frame and forming a row in an adjacent state, a support frame portion is formed that connects the main frame portion along the row, The bent portion is projected in a direction perpendicular to the length direction of the row with respect to the main frame.

  In this flat frame continuous molded body, the main frame portion and the shield plate portion are bent at the connecting arm portion between them, so that a distance required for bending is required between the main frame portion and the shield plate portion. Since the part is provided at one end of the lead frame, it is not necessary to allow for the unfolded portion required for bending at the other end. In addition, it is possible to form a large package size compared to the area of the entire flat frame continuous molded body.

  The lead frame for a semiconductor device of the present invention is a lead frame for a semiconductor device manufactured using the flat frame member for the lead frame, wherein the connecting arm portion and the support arm portion are bent and deformed, and the shield plate The portion and the terminal portion are pushed down with respect to the main frame portion.

The lead frame is molded with a resin, accommodates a semiconductor chip, and then the periphery is cut by dicing or the like to form a semiconductor device. At that time, by cutting the outside of the main frame part, the bent part protruding from the main frame part is cut off, and the support arm part connected to the bent part can be separated and independent from the main frame part. In addition, since the support arm portion is bent and deformed and inclined downward, when it is cut at the downward gradient portion, it is embedded in the mold resin, and the terminal connected to the support arm portion Insulation between the portion and the lid can be ensured.
In addition, it is also possible to arrange | position the main frame part over the perimeter of a surrounding wall part, and the wide contact area with respect to a cover body can be ensured. In this case, since the area of the shield plate portion is smaller than that of the main frame portion, the bottom wall portion of the mold resin body in which the shield plate portion is embedded is smaller than the upper end surface of the peripheral wall portion where the main frame portion is disposed. Therefore, the installation area when mounted on the substrate is reduced, and accordingly, high-density mounting can be realized.

  In the lead frame for a semiconductor device according to the present invention, the connecting arm portion may be bent and deformed along with the bending.

  In the lead frame for a semiconductor device manufactured using the lead frame flat frame member in which the portions to be bent are arranged on lines parallel to each other, the connecting arm portion is bent and deformed by the portions to be bent. In this state, the intermediate portion between the bent portions is disposed to be inclined, the support arm portion is bent and deformed, and the shield plate portion and the terminal portion are pushed down with respect to the main frame portion. It is said that it is said.

In the present invention, a lead frame continuous molded body manufactured using the flat frame continuous molded body may be used. In the lead frame continuous molded body, the connecting arm portion and the support arm portion are bent and deformed. The shield plate part and the terminal part are pressed down with respect to the main frame part.
The lead frame continuous molded body is molded with resin, accommodates a semiconductor chip, and is then cut into a direction along the row and a direction orthogonal thereto by dicing or the like to form individual semiconductor devices. At that time, in the cutting in the direction along the row, by cutting the outside of the main frame portion, the bent portions protruding from the main frame portion are cut off, and the support connected to the bent portion is supported. The arm portion can be separated and independent from the main frame portion.

A method for manufacturing a lead frame for a semiconductor device according to the present invention is a method for manufacturing a lead frame for a semiconductor device using the flat frame member for the lead frame, wherein the connecting arm portion and the main frame portion The shield plate part and the terminal part are pushed down while the support arm part is deformed.
In the method for manufacturing a lead frame for a semiconductor device according to the present invention, when the connecting arm portion is deformed, the connecting arm portion may be expanded and deformed together with the bending deformation.

  In the method for manufacturing a lead frame for a semiconductor device using a flat frame member for a lead frame in which the portions to be bent are arranged on lines parallel to each other, the connecting arm portion is connected to the main frame portion. The shield plate portion is pushed down by inclining the intermediate portion while bending the bent portion, and the terminal portion is pushed down while bending the support arm portion.

  Further, in the present invention, a continuous package body formed by molding a resin into the lead frame continuous molded body to form a package body including the bottom plate portion and the peripheral wall portion in a continuous state is preferable. In the molded body, the main frame portion is exposed on the upper end surface of the peripheral wall portion, and at least a part of the upper surface of the terminal portion is exposed on the upper surface of the bottom plate portion, and on the lower surface of the bottom plate portion. The terminal portions and the lower surfaces of the shield plate portions are at least partially exposed.

  The present invention is a method of manufacturing a package body for a semiconductor device using the flat frame member for a lead frame, wherein the shield arm while deforming the connecting arm portion and the support arm portion with respect to the main frame portion. After pressing down the plate portion and the terminal portion, the mold resin body is molded with the upper surface of the main frame portion and both surfaces of the terminal portion exposed at least partially, and protrudes from the periphery of the mold resin body It cut | disconnects so that the bending part of the said main frame part may be isolate | separated.

  In the method of manufacturing a package body for a semiconductor device according to the present invention, when the connecting arm portion is deformed, the connecting arm portion may be extended and deformed together with the bending deformation.

  In the method of manufacturing a package body for a semiconductor device using a flat frame member for a lead frame in which the portions to be bent are arranged on lines parallel to each other, the portions to be bent of the connecting arm portion are bent. By tilting the intermediate part while deforming, the shield plate part is pushed down with respect to the main frame part, and the terminal part is pushed down while bending and deforming the support arm part. Forming the mold resin body with the upper surface and both surfaces of the terminal portion exposed at least partly, and cutting the bent portion of the main frame portion protruding from the periphery of the mold resin body; Features.

  In the present invention, in the method of manufacturing a package body for a semiconductor device by cutting the package body continuous molded body, when the outer peripheral edge of the peripheral wall portion is cut, the bent portion in the support arm portion And a step of cutting in the length direction of the row via the connecting portion.

  In the package body for a semiconductor device of the present invention, at least a part of the lead frame is embedded in a box-shaped mold resin body having a bottom wall portion on which a semiconductor chip is mounted and a peripheral wall portion standing from the peripheral edge portion of the bottom wall portion. The lead frame extends from the main frame part exposed at the upper end surface of the peripheral wall part, the connecting arm part hanging from the main frame part through the inside of the peripheral wall part, and extending from the lower end of the connecting arm part. A package body for a semiconductor device, comprising a shield plate portion embedded in a bottom wall portion, wherein the lead frame has the connecting arm portion bent and deformed from the main frame portion toward the shield plate portion. And a part of the main frame portion is divided at the peripheral wall portion, and a support arm portion that hangs down through the inside of the peripheral wall portion while being divided. The connected to the lower end of the support arm a and the terminal portion is formed, the terminal unit is characterized by being exposed by at least a part on both sides of the bottom wall portion.

  Since the main frame portion of the lead frame is exposed on the upper end surface of the peripheral wall portion of the package body, the lid body, the main frame portion, and the main frame portion are covered with a cover body made of a conductive material. The internal space is enclosed by the frame portion, the connecting arm portion, and the shield plate portion, and the internal space can be shielded from the external magnetic field by grounding the terminal portion of the shield plate portion. In this case, it is also possible to arrange the main frame portion over substantially the entire circumference of the peripheral wall portion, and a wide contact area with the lid can be ensured.

  The package body for a semiconductor device according to the present invention includes a box-shaped mold resin body having a bottom wall portion on which a semiconductor chip is mounted and a peripheral wall portion erected from the peripheral edge portion of the bottom wall portion. A main frame portion embedded in the lead frame and exposed at the upper end surface of the peripheral wall portion; a plurality of connecting arm portions whose upper ends are connected to the main frame portion and hang down through the peripheral wall portion; A package body for a semiconductor device comprising a shield plate portion extending from a lower end of an arm portion and embedded in the bottom wall portion, wherein the lead frame is bent and deformed at both ends of the connection arm portion. As a result, the intermediate portion is inclined and the bent portions on the main frame portion side and the shield plate portion side of each connecting arm portion are bent. A support arm portion that is arranged on a line parallel to each other, a part of the main frame portion is divided at the peripheral wall portion, and a support arm portion that hangs down from the divided portion via the inside of the peripheral wall portion; and the support arm And a terminal part connected to the lower end of the part, the terminal part being arranged in a notch part formed in the shield plate part, and being exposed at least partly on both surfaces of the bottom wall part. And

  In the package body for a semiconductor device of the present invention, the connection portion may be arranged side by side at an edge of the main frame portion facing the shield plate portion.

  In the present invention, in the package body for a semiconductor device using a lead frame in which the bent portions are arranged on a line parallel to each other, the connecting arm portion is connected to the wire through the shield plate portion. The connecting arm portions are provided at symmetrical positions, and the connection portions to the shield plate portion and the main frame portion are provided at positions that are opposite edge portions of these connecting arm portions and deviated from the mutually facing positions. The intermediate part which connects between both connection parts is arrange | positioned by inclining by being bent and deformed by the both ends.

  In the present invention, in the method of manufacturing a semiconductor device using the package body continuous molded body, a semiconductor chip is mounted on each bottom plate portion of the package body continuous molded body, and on the upper surface of the peripheral wall section. A method of manufacturing a semiconductor device by cutting an outer peripheral edge of the peripheral wall portion after fixing the lid through a conductive adhesive, and the support arm when cutting the outer peripheral edge of the peripheral wall portion A step of cutting in a length direction of the row via a connection portion to the bent portion in the portion.

According to another aspect of the present invention, there is provided a package for a semiconductor device, wherein the package body for the semiconductor device and a lid fixed to an upper end surface of the peripheral wall portion of the package body for the semiconductor device so as to cover an internal space surrounded by the peripheral wall portion. And the lid is made of a conductive material.
Since the main frame portion of the lead frame is exposed on the upper end surface of the peripheral wall portion of the package body, the lid body and the main frame are covered by covering the main frame portion with a cover made of a conductive material. The internal space is enclosed by the portion, the connecting arm portion, and the shield plate portion, and the internal space can be shielded from the external magnetic field by grounding the terminal portion of the shield plate portion.

  The semiconductor device according to the present invention is characterized in that a semiconductor chip is mounted on the bottom wall portion of the semiconductor device package so as to be disposed above the shield plate portion.

 The microphone package of the present invention is a microphone package configured using the semiconductor device, wherein the semiconductor chip is a microphone chip, and an acoustic hole communicating with an internal space is provided in either the lid or the package body. It is formed.

  In the microphone package of the present invention, a part of the shield plate portion is exposed to the bottom plate portion of the package body from a window hole portion formed in the mold resin body, and a plurality of the shield plate portions penetrates the exposed portion. It is good also as the said acoustic hole being comprised by these small holes.

  According to the present invention, the lead frame is press-molded and the resin is molded, and the connecting arm portion only hangs in one direction from the main frame portion to the shield plate portion. Even if it is suppressed, it is possible to form a relatively large shield plate portion, and it is possible to reduce the overall size while ensuring a large storage volume of the semiconductor chip, thereby enabling high-density mounting. Also, after molding the molded resin body on the lead frame, cutting from the bent part of the main frame part may isolate the terminal part connected to the support arm part from the main frame part and insulate it. it can. Then, by fixing a conductive lid to the main frame exposed at the upper end surface of the peripheral wall, the internal space can be shielded from an external magnetic field, and in this case, the lid and the terminal are securely connected. Can be insulated.

1 is a plan view showing a first embodiment of a lead frame according to the present invention. FIG. 2 is a rear view of the lead frame shown in FIG. 1. It is sectional drawing which follows the AA line of FIG. It is an expanded sectional view which shows the state which installed the lead frame shown in FIG. 1 in the injection mold, and is equivalent to the cross section which follows the BB line of FIG. It is a top view which shows the state which integrally molded the mold resin body with the injection mold shown in FIG. FIG. 6 is a plan view of a package body obtained by cutting a connection frame portion and the like of a lead frame from the state shown in FIG. 5. It is a longitudinal cross-sectional view of the semiconductor device which accommodates a semiconductor chip in the package main body of FIG. 6, and fixes a cover body, and is equivalent to the cross section along CC line of FIG. FIG. 2 is a perspective view showing an entire semiconductor device manufactured by the lead frame of FIG. 1. It is a top view which shows 2nd Embodiment of the lead frame which concerns on this invention. It is sectional drawing which follows the DD line | wire of FIG. FIG. 11 is a plan view of a package body formed by integrally molding a mold resin body on the lead frame shown in FIG. 10. It is a fragmentary sectional view which follows the EE line of FIG. It is the top view of the principal part which showed the 2 types of modification of a connection arm part (a) (b). It is a fragmentary sectional view which shows the modification of the embedding structure to the mold resin body of a support arm part. FIG. 15 is a partial cross-sectional view similar to FIG. 14 illustrating another modification example of the structure in which the support arm portion is embedded in the molded resin body. It is a top view which shows 3rd Embodiment of the lead frame which concerns on this invention. It is a top view which shows 4th Embodiment of the lead frame which concerns on this invention. FIG. 18 is a rear view of the lead frame shown in FIG. 17. It is an expanded sectional view which shows the state which installed the lead frame shown in FIG. 17 in the injection mold, and is equivalent to the cross section which follows the FF line | wire of FIG. FIG. 20 is a longitudinal sectional view of a semiconductor device in which a semiconductor chip is housed in a package body manufactured from the state shown in FIG. 19 and a lid is fixed. It is a longitudinal cross-sectional view of the semiconductor device which has the lead frame of 5th Embodiment concerning this invention. It is a top view of the part of the acoustic hole of FIG. It is a longitudinal cross-sectional view which shows the state which has arrange | positioned the lead frame in the injection mold in order to form the package main body shown in FIG. It is a longitudinal cross-sectional view which shows the example of the metal mold | die used when pushing down the shield board part of a lead frame. It is a top view which shows 6th Embodiment of the lead frame which concerns on this invention. FIG. 26 is a rear view of the lead frame shown in FIG. 25. 25 shows a mold for press-molding the lead frame shown in FIG. 25, (a) is a plan view of the upper mold, and (b) is an upper mold and a lower mold corresponding to a cross section taken along the line GG of (a). FIG. 6C is a cross-sectional view of the upper die and the lower die corresponding to a cross section taken along the line H-H in FIG. FIG. 26 is a development view showing a flat frame member before bending of the lead frame shown in FIG. 25. It is an expanded sectional view which shows the state which installed the lead frame of FIG. 25 in the injection mold, and is equivalent to the cross section which follows the JJ line | wire of FIG. FIG. 30 is a plan view showing a state in which a mold resin body is integrally molded by the injection mold shown in FIG. 29. FIG. 31 is a plan view of a package main body obtained by cutting a connection frame portion and the like of a lead frame from the state shown in FIG. 30. FIG. 32 is a longitudinal sectional view of a semiconductor device in which a semiconductor chip is housed in the package body of FIG. 31 and a lid is fixed, and corresponds to a cross section taken along the line KK of FIG. 31. FIG. 26 is a perspective view showing an entire semiconductor device manufactured by the lead frame of FIG. 25. It is a top view which shows 7th Embodiment of the lead frame which concerns on this invention. It is a top view which shows 8th Embodiment of the lead frame which concerns on this invention. FIG. 36 is a rear view of the lead frame shown in FIG. 35. It is a top view which shows the lead frame of 9th Embodiment which concerns on this invention. It is sectional drawing which follows the LL line | wire of FIG. FIG. 38 is a development view showing a flat frame member before bending of the lead frame shown in FIG. 37. It is a top view of the flat frame continuous molding which expand | deploys and shows the lead frame continuous molding in 10th Embodiment which concerns on this invention. It is a reverse view of the expand | deployed flat frame continuous molded object in FIG. It is a top view which shows one lead frame. 43 is a rear view of the lead frame of FIG. 42. FIG. It is a side view which follows the MM line | wire of FIG. FIG. 43 is a plan view showing a state in which a mold resin is integrally formed with the lead frame of FIG. 42. 46 shows the longitudinal section of FIG. 45, (a) is a 46A-46A line, (b) is a 46B-46B line, and (c) is a longitudinal section along the 46C-46C line. 45 is a longitudinal sectional view taken along the line 47A-47A, FIG. 45B is a 47B-47B line, and FIG. 45C is a 47C-47C line. It is a top view which shows a cover body continuous molded object. It is a longitudinal cross-sectional view which shows the press metal mold | die for bending the flat frame continuous molded body of FIG. 40 to a lead frame continuous molded body, A right half is a bending part of a connection arm part, A left half is a bending part of a support arm part. Is shown. It is a longitudinal cross-sectional view which shows the state which has arrange | positioned the lead frame continuous molded object obtained from the flat frame continuous molded object of FIG. 40 in an injection mold, and is equivalent to the cross section along the 47A-47A line | wire of FIG. FIG. 53 is a longitudinal sectional view of the semiconductor device and corresponds to a section taken along line NN in FIG. 52. FIG. 52 is a plan view showing the package body with the cover of the semiconductor device in FIG. 51 removed. FIG. 52 is a rear view of the semiconductor device of FIG. 51. FIG. 52 is a side view of the semiconductor device of FIG. 51, corresponding to the state of arrows QQ in FIG. 52, with the lid body facing upward. FIG. 52 is a side view of the semiconductor device of FIG. 51 and corresponds to a view taken along the line RR in FIG. 52. FIG. 52 is a side view of the semiconductor device of FIG. 51 and corresponds to the view taken along the line S-S in FIG. 52.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 8 show a first embodiment. The semiconductor device 1 of this embodiment is a surface-mount type microphone package, and as shown in FIGS. 6 and 7, two chips of a microphone chip 2 and a circuit chip 3 are accommodated as semiconductor chips. The package 4 includes a lead frame 5, a package body 7 formed of a box-shaped mold resin body 6 integrally formed with the lead frame 5, and a lid body 8 that closes the upper portion of the package body 7. It is said that.

  The lead frame 5 is continuously formed by press working on a strip-shaped metal plate in one row or a plurality of rows with one unit shown in FIG. In this specification, the unit shown in FIG. 1 is referred to as a lead frame, and in the following, the vertical direction in FIG. 1 is referred to as the vertical direction, and the horizontal direction is referred to as the horizontal direction. Further, in FIG. 1, reference numeral 9 indicates a connection frame portion connected to the outer frame portion 10 formed by punching the lead frame 5.

The lead frame 5 is cantilevered by a main frame portion 11 having a rectangular frame shape as a whole, and a shield plate portion 13 and a support arm portion 14 connected to the inside of the main frame portion 11 by a plurality of connecting arm portions 12. It is comprised from the several terminal part 15 connected with the state.
The main frame portion 11 is formed in a rectangular frame shape by a pair of horizontal frame portions 16 and a vertical frame portion 17 connecting both ends of the horizontal frame portions 16, and two main frame portions 11 are provided on the outer side portions of both the horizontal frame portions 16. Connection frame portions 9 are provided, and three connection frame portions 9 are provided on the outer portions of both vertical frame portions 17.

  Further, two connecting arm portions 12 are connected to the inner side portions of both horizontal frame portions 16, and one connecting arm portion 12 is connected to the inner side portion of the center position of both vertical frame portions 17. The shield plate part 13 is connected via the. In this case, each connecting arm portion 12 is provided in a linear shape in plan view along the facing direction of the opposing edge portions of the main frame portion 11 and the shield plate portion 13, and 2 in the horizontal frame portion 16. The connecting arm portions 12 of each piece and the connecting arm portions 12 of the vertical frame portion 17 are arranged so as to be line-symmetric with respect to each other via the shield plate portion 13.

  Further, the right vertical frame portion 17 is connected to terminal portions 15 via support arm portions 14 on both the upper and lower sides with the central connecting arm portion 12 interposed therebetween, and the left vertical frame portion 17 is connected to the right vertical frame portion 17 on the right side. The terminal portion 15 is connected to a position corresponding to one of the terminal portions 15 via one support arm portion 14. At the base end portion of each support arm portion 14, a part of each vertical frame portion 17 projects outward to form a concave portion 18 directed inward, and inside the bent portion 19, The support arm portions 14 are connected so as to divide the concave portion 18 in half.

  Further, each terminal portion 15 provided at a position extending inward from the main frame portion 11 by the support arm portion 14 is disposed in a notch portion 20 formed on the outer peripheral portion of the shield plate portion 13. In this case, as shown in FIG. 1, two terminal portions 15 are arranged on the right side and one on the left side, which are a power source terminal portion, an output terminal portion, and a gain terminal portion. Further, the shield plate portion 13 has its own terminal portion for external ground connection on the back surface of the left vertical frame portion 17 where the terminal portion 15 is not provided and at a position corresponding to one terminal portion 15 on the right side. 21 is formed. The terminal portion 21 integrated with the shield plate portion 13 is formed by half-etching the shield plate portion 13 at a portion other than the terminal portion 21 and is formed so as to protrude from the back surface of the shield plate portion 13. . FIG. 2 shows the back surface of the lead frame 5, and in FIG. 2, the hatched area is shown as a half-etched portion. Further, as will be described later, these terminal portions 15 and 21 are internal terminals whose front side is exposed to the inside of the package body, and whose rear side is an external terminal exposed to the outside of the package body.

  The lead frame 5 having such an outer shape is arranged in a state in which the shield plate portion 13 is pushed down with respect to the main frame portion 11 by deforming each of the connecting arm portions 12 and the support arm portions 14. Yes. In this case, since the connecting arm portion 12 is provided on any of these four sides between the rectangular main frame portion 11 and the shield plate portion 13, the connecting arm portion 12 is deformed with bending and stretching. As shown by the thin line in FIG. 1, the connecting arm portion 12 is bent in the vicinity of the connection portion to the main frame portion 11 and in the vicinity of the connection portion to the shield plate portion 13, and a linear intermediate portion therebetween. Is deformed to be stretched in the length direction.

  On the other hand, since the support arm portion 14 is connected to the vertical frame portion 17 of the main frame portion 11 in a cantilever state, the support arm portion 14 is bent and deformed, and each terminal portion 15 at the tip portion is arranged on the same plane as the shield plate portion 13. Has been. FIGS. 1 and 2 show a state after bending deformation, and the terminal portion 15 connected to the support arm portion 14 is arranged near the outlet of the notch portion 20, but in the unfolded state before deformation, FIG. As shown by the chain line in FIG. 1 and FIG.

  In the present specification, the three-dimensional state after the connection arm portion 12 and the support arm portion 14 are deformed is referred to as a lead frame, and the main frame portion before the connection arm portion 12 and the support arm portion 14 are deformed. 11 is a flat frame member that is extended in the same plane as that of FIG.

  Moreover, in the connection part of the main frame part 11 and the support arm part 14, although the bending part 19 continuing from the main frame part 11 is arrange | positioned on the same plane as the main frame part 11, the support arm part 14 is It is bent at the base end portion disposed in the concave portion 18, and is disposed at a position where the vertical frame portion 17 extends in the concave portion 18 and is slightly pushed down with respect to the upper surface of the main frame portion 11 ( 4 to 7).

  And the package main body 7 is comprised by shape | molding the mold resin body 6 integrally with the lead frame 5 processed in this way. As shown in FIGS. 6 and 7, the mold resin body 6 includes a bottom wall portion 31 formed in a rectangular plate shape having a length in which the microphone chip 2 and the control circuit chip 3 can be arranged, and the bottom wall portion. It is formed in a box shape including a square cylindrical peripheral wall portion 32 erected from the peripheral portion of 31.

  The bottom wall portion 31 embeds the remaining portions of the shield plate portion 13 and the terminal portion 15 in a state in which the back surface of the terminal portions 15 and 21 in the lead frame 5 is exposed. In this case, the terminal portions 15 and 21 are exposed so as to slightly protrude from the back surface of the bottom wall portion 31. Further, the bottom wall portion 31 is formed so as to cover the upper surfaces of the shield plate portion 13 and the terminal portion 15, but an opening 33 for exposing a part of the upper surface of each of the terminal portions 15 and 21 is provided. Four are formed in accordance with the positions of the terminal portions 15 and 21.

  The microphone chip 2 and the control circuit chip 3 are fixed on the bottom wall portion 31 by die bonding, and the terminal portions 15 facing the opening 33 of the bottom wall portion 31 of the mold resin body 6, 21 is connected by a bonding wire 34. In the microphone chip 2, a diaphragm electrode and a fixed electrode that vibrate in response to pressure fluctuations such as sound are disposed to face each other, and a change in electrostatic capacitance accompanying vibration of the diaphragm electrode is detected. The control circuit chip 3 includes a power supply circuit to the microphone chip 2, an output signal amplifier from the microphone chip 2, and the like.

  On the other hand, the peripheral wall portion 32 is formed in a rectangular tube shape as a whole, but as shown in FIG. 7, the peripheral wall portion 32 faces upward from the peripheral portion of the bottom wall portion 31 in which the shield plate portion 13 of the lead frame 5 is embedded. The outer flange portion 35 is integrally formed at the upper end portion thereof. The connecting arm portion 12 and the support arm portion 14 of the lead frame 5 are embedded in the peripheral wall portion 32, and the upper surface of the main frame portion 11 is exposed on the upper surface of the flange portion 35 of the peripheral wall portion 32. . Further, in the main frame portion 11, the vicinity of the bent portion 19 is cut away as described later, and the support arm portion 14 connected to the bent portion 19 is slightly below the main frame portion 11. An end surface embedded and cut in the flange portion 35 is exposed on the outer surface of the flange portion 35.

  The lid body 8 that covers the package body 7 configured in this way is formed in the same rectangular shape as the outer shape of the upper end surface of the flange portion 35 of the peripheral wall portion 32 of the package body 7 by a conductive metal material such as copper. An acoustic hole 41 is formed in a penetrating state so as to communicate with the outside the internal space formed when the package body 7 is covered. The lid body 8 is adhered to the upper end surface of the flange portion 35 via a conductive adhesive, thereby covering the internal space 42 surrounded by the peripheral wall portion, and the internal space 42 from the acoustic hole 41 to the outside. The main frame portion 11 of the lead frame 5 exposed to the upper surface of the flange portion 35 is in an electrically connected state. Therefore, in this package 4, the main frame portion 11, the connecting arm portion 12, and the shield plate portion 13 of the lead frame 5 are continuously connected from the lid body 8 to the lead frame 5, and the lid body 8 and the lead frame 5 are disposed in the internal space. The three terminal portions 15 are arranged so as to surround 42 and are arranged in the cutout portion 20 of the shield plate portion 13, respectively, and are provided independently of the shield plate portion 13.

Next, a method for manufacturing the semiconductor device 1 configured as described above will be described.
First, the hatched region in FIG. 2 is half-etched to about half the plate thickness by masking and etching necessary portions of the strip-shaped metal plate to be the lead frame 5. Then, by punching by press working, the outer shape is punched, and a flat frame member connected to the outer frame portion 10 by the connection frame portion 8 is formed. Thereafter, the shield plate portion 13 was pushed down with respect to the main frame portion 11 by drawing while deforming each connecting arm portion 12 that is continuous in a plane between the main frame portion 11 and the shield plate portion 13. Place in state. In this drawing process, as shown in FIG. 3, the press die is indicated by a chain line, and the main frame portion 11 is sandwiched between the holding dies 43 and 44, and the shield plate portion 13 is movable with the upper punch die 45 and the lower punch die 46. And the shield plate portion 13 is pushed down from above, and the connecting arm portion 12 is bent and deformed. That is, the connecting arm portion 12 is stretched in the length direction along with bending deformation.

  At the same time, the support arm portion 14 is bent and deformed so that the terminal portion 15 is arranged on the same plane as the shield plate portion 13 in the cutout portion 20 of the shield plate portion 13. The process to the support arm part 14 is a bending process, and the terminal part 15 has a position at the back of the notch 20 when it is unfolded in a planar shape (position indicated by a chain line in FIG. 1). , The terminal portion 15 is supported so that it can slide along with the deformation of the support arm portion 14.

  Next, the lead frame 5 thus press-molded is placed in an injection mold, and resin is injection-molded so as to embed the lead frame 5 to mold the molded resin body 6. FIG. 4 shows a state in which the lead frame 5 after press molding is arranged in an injection mold, and a cavity 53 into which mold resin is injected is formed between the upper mold 51 and the lower mold 52. . In this injection molding, a concave portion 54 for fitting the terminal portions 15 and 21 is formed on the cavity surface of the lower mold 52 so that the terminal portions 15 and 21 do not move. As described above, the shield plate portion 13 is in a state in which the terminal portions 15 and 21 protrude from the half-etched surface because the portions other than the terminal portion 21 for external ground connection are half-etched. The recess 54 is formed to a depth slightly smaller than the protruding height from the half-etched surface to the back surfaces of the terminal portions 15 and 21, and the shield plate is in a state where the back surfaces of the terminal portions 15 and 21 are in contact with the bottom surface of the recess 54. The half-etched surface of the part 13 is slightly lifted from the cavity surface of the lower mold 52. The planar dimension of the recess 54 is set slightly larger than the terminal parts 15 and 21 so as to allow the dimensional tolerance of the terminal parts 15 and 21. Further, the protrusions 55 of the upper mold 51 which are the openings 33 of the mold resin body 6 are in contact with the surface sides of the terminal portions 15 and 21.

  On the other hand, the upper surface of the main frame portion 11 and the upper surface of the bent portion 19 continuing to the main frame portion 11 are brought into contact with the cavity surface of the upper mold 51. Then, the upper mold 51 and the lower mold 52 are in a state where the upper surface of the main frame portion 11 and the upper surface of the bent portion 19 are in contact with the upper die 51 and the back surfaces of the terminal portions 15 and 21 are in contact with the lower die 52. When the mold is clamped, the connecting arm portion 12 and the support arm portion 14 are arranged in the cavity 53 so as to be slightly bent, and a pressing force is generated on the contact surfaces to the upper die 51 and the lower die 52. The upper surface of the main frame portion 11 is in close contact with the upper mold 51.

  Then, the semiconductor chips 2 and 3 are fixed by die bonding on the bottom wall portion 31 of the package body 7 in which the mold resin body 6 is integrally formed on the lead frame 5 in this way, and the opening 33 of the bottom wall portion 31 is fixed. After the exposed terminal portions 15 and 21 are connected to each other by wire bonding, a conductive adhesive is applied to the upper end surface of the peripheral wall portion 32, and a cover 8 that has been separately manufactured is put on and bonded. . In this state, the package body 7 is connected to the adjacent lead frame via the connection frame portion 9 so that a plurality of the package bodies 7 are connected vertically and horizontally, and the lid 8 is also connected to the lead frame. 5 are connected to each other at the same pitch as the package main body 7 by the connection frame portion 56 (see FIG. 8) similar to the above, and these are bonded together.

  After this bonding, the connection frame portion 9 of the lead frame 5 and the connection frame portion 56 of the lid body 8 protruding from the mold resin body 6 and the bent portion 19 of the main frame portion 11 of the lead frame 5 are cut. Then, it is divided into individual packages 4. FIG. 5 shows the package body 7 before the lid body 8 is fixed. In FIG. 5, the cutting line P is shown by a one-dot chain line. In this case, in the state before the division, the portion of the bent portion 19 protrudes outward from the main frame portion 11, and the support arm portion 14 is bent and deformed in the concave portion 18 inside the bent portion 19, Mold resin penetrates into the recess 18. Therefore, the entire mold resin is cut.

  The semiconductor device 1 manufactured in this way is a so-called surface mount type as shown in FIG. 7, and the terminal portions 15 and 21 are exposed in a slightly protruding state on the bottom surface. , 21 are mounted by soldering to the substrate S as indicated by chain lines. In this mounted state, the shield plate portion 13 embedded in the bottom wall portion 31 is disposed below the semiconductor chips 2 and 3, and the shield plate portion 13 is connected via the connecting arm portion 12 and the main frame portion 11. Since the lid 8 is connected and the lid 8 covers the upper side of the semiconductor chips 2 and 3, the semiconductor chips 2 and 3 are surrounded by the shield plate portion 13, the lid 8 and the like. The semiconductor chips 2 and 3 can be shielded from an external magnetic field by bringing the terminal portion 21 integral with the shield plate portion 13 into a grounded state via a substrate. In this case, the main frame portion 11 exposed on the upper surface of the flange portion 35 has the horizontal frame portion 16 and the vertical frame portion 17 exposed on almost the entire surface including the corner portions except for the cut off bent portion 19. And since it arrange | positions over the perimeter of the flange part 35 largely, a contact area with the cover body 8 is ensured large, and it can be set as an electrical connection state reliably.

Further, since the terminal portions 15 and 21 protrude from the bottom surface of the package body 7, only the terminal portions 15 and 21 come into contact with the substrate S as shown by a chain line in FIG. It is possible to prevent the occurrence of mounting defects due to the inclusion of foreign matter between 31 and the substrate S.
Further, since the bottom wall portion 31 is formed smaller than the outer shape of the flange portion 35 at the upper end of the peripheral wall portion 32, the mounting area on the substrate can be reduced, and interference with other circuits on the substrate is reduced. And can enable high-density mounting.

On the other hand, FIGS. 9 to 12 show a second embodiment of the present invention. In these drawings, parts common to those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. In the lead frame 61 in this semiconductor device, a slit 62 is formed at the connecting portion between the connecting arm portion 12 and the shield plate portion 13 provided at the center position of the vertical frame portion 17 so as to extend the connecting arm portion 12. Has been. Accordingly, the distal end of the connecting arm portion 12 is disposed at a position entering the inner side from the side edge of the shield plate portion 13, and when the press processing is performed so as to push the shield plate portion 13 down against the main frame portion 11, As shown in FIG. 10, the connecting arm portion 12 is bent so as to be raised between the two slits 62, and is disposed obliquely to the main frame portion 11. The mold resin body 64 of the package body 63 has a triangular plate-like rib projecting inward from the upper end of the peripheral wall portion 32 to the upper surface of the bottom wall portion 31 so as to bury the obliquely arranged connecting arm portion 12. 65 is formed. The rib 65 is disposed between the mounting positions of the two semiconductor chips 2 and 3 indicated by a two-dot chain line in FIG. 11 so as not to interfere with the semiconductor chips 2 and 3.
By configuring the lead frame 61 in this manner, the length of the connecting arm portion 12 is longer than that of the first embodiment, and the elongation deformation generated in the connecting arm portion 12 at the time of pressing is reduced accordingly. Processing is facilitated.

  Moreover, about the connection arm part of a lead frame, you may form the middle position of the length as shown in FIG. The connecting arm portion 71 shown in FIG. 13 (a) is formed with a slightly wider portion in the middle of its length, and a circular hole 72 larger than the width of the other portion of the connecting arm portion 71 is formed at the center thereof. It is. Therefore, when the connecting arm portion 71 is pulled by drawing, the wide portion 73 is deformed so as to extend the hole 72 in an elliptical shape as indicated by a chain line. The deformation of the wide portion 73 causes some elongation deformation, but the bending deformation is larger, and a part of the tensile stress is absorbed by the bending deformation and is easily deformed. On the other hand, the connecting arm portion 75 shown in FIG. 13B is bent in a waveform so that the middle position of the length meanders left and right, and the bent portion 76 is bent as indicated by a chain line during drawing. By being stretched with deformation, the deformation becomes easy.

  On the other hand, in the first embodiment, the support arm portion in the lead frame is bent so as to be disposed slightly below the surface of the main frame portion within the range of the thickness of the flange portion, as shown in FIG. The flange portion 81 is formed thickly so as to protrude from the intermediate position in the height direction of the peripheral wall portion 32, and the intermediate position of the peripheral wall portion 32 so that the support arm portion 14 is also disposed in the thick flange portion 81. You may make it bend with. In the example shown in FIG. 14, the package body is formed by cutting the thick flange portion 81 integrally with the support arm portion 14 from the position indicated by the arrow. Further, as shown in FIG. 15, the inclination angle of the support arm portion 14 may be made smaller than that of the connecting arm portion 12, and the support arm portion 14 may be arranged obliquely between the bent portion 19 and the terminal portion 15. In this case, the peripheral wall portion 82 is gradually formed thicker upward, and the support arm portion 14 is cut together with the resin at the upper portion of the peripheral wall portion 82 as indicated by the arrow at the cutting position.

  FIG. 16 shows a third embodiment of the present invention, which is an example in which the support structure of the terminal portion in the lead frame is changed. In each of the above-described embodiments, the terminal portion independent of the shield plate portion is supported in a cantilever state from the main frame portion via the support arm portion. However, in this lead frame 85, the support arm portion is eliminated and the shield plate portion 13 is removed. In the cutout portion 20, the terminal portion 15 is connected to the shield plate portion 13 via a plurality of bridge portions 86. Then, after the resin is molded, the bridge portion 86 is cut by means such as laser cutting, so that the terminal portion 15 is separated from the shield plate portion 13 and made independent. In each of the above-described embodiments, the support arm portion is bent and deformed during press molding, so that the terminal portion moves in the concave portion of the shield plate portion. Therefore, the terminal portion is disposed in the shield plate portion and the concave portion of the shield plate portion. Although it was necessary to design the relative positional relationship between the three terminal portions in consideration of the amount of movement during press molding, in the case of the embodiment of FIG. 16, the relative positional relationship between the terminal portions is the press molding. Since it does not change before and after, the design is easy.

  17 to 20 show a fourth embodiment of the present invention. In the first embodiment and the like, the acoustic hole is formed in the lid, but in the fourth embodiment, the acoustic hole is formed in the package body. That is, as shown in FIGS. 17 and 18, the lead frame 91 is provided with a lower hole 92 for an acoustic hole so as to penetrate the shield plate portion 13. The configuration having the main frame portion 11, the connecting arm portion 12, the terminal portions 15, 21 and the like is the same as that of the first embodiment. As in the first embodiment, the back surface of the shield plate 13 is half-etched, and the portions other than the terminal portion 21 are formed thin. However, as shown in FIG. Then, half etching is performed so as to surround the lower hole 92, leaving a plurality of protrusions 93. Therefore, these protrusions 93 have the same thickness as the terminal portion 21.

  And after this lead frame 91 is press-molded, it is placed in an injection mold shown in FIG. In this injection mold, a pin 95 having a slightly smaller diameter than the lower hole 92 of the lead frame 91 is provided in the lower mold 94 in a protruding state, and the upper mold 96 has a hole 97 into which the tip of the pin 95 is inserted. And a counterbore part 98 having a diameter slightly larger than that of the hole 97, and when the pins 94 are inserted into the hole 97 by fastening the molds 94 and 96, the counterbore part around the pin 95. 98 forms a cylindrical void. By installing a lead frame 91 on this injection mold and injecting resin, acoustic holes 100 formed by pins 95 are formed in the bottom wall portion 31 of the mold resin body 99 as shown in FIG. A cylindrical wall 101 surrounding the acoustic hole 100 is formed on the upper surface of the bottom wall portion 31. The cylindrical wall 101 dams the adhesive when the semiconductor chips 2 and 3 are fixed by die bonding, and prevents the adhesive from flowing into the acoustic hole 100. In addition, a lid 104 that constitutes the package 103 in combination with the package main body 102 has no holes. The lid 104 is formed of a conductive metal material. As the semiconductor device 105, the lid 104 is electrically connected to the main frame portion 11 of the lead frame 91, so that the same as in the first embodiment. The internal space 42 is shielded.

  Moreover, when providing an acoustic hole in the package body as in the fourth embodiment, the structure as in the fifth embodiment shown in FIGS. 21 to 23 may be adopted. In the package 111 of the semiconductor device 110, a part of the mold resin body 115 covering the shield plate part 114 of the lead frame 113 is drawn out into a circle in a part of the package body 112 as shown in FIGS. 21 and 22. As a result, a part of the shield plate 114 is exposed in a circular shape from the window hole portion 116, and a plurality of small holes 117 are formed in the exposed portion in a through state, and the acoustic holes 118 are formed by the small holes 117. Is formed. A cylindrical wall 119 is formed so as to surround the acoustic hole 118.

When the package body 112 is manufactured, the small holes 117 of the acoustic holes 118 can be formed when the lead frame 113 is half-etched. That is, the lead frame 113 is half-etched in the same manner as in each of the above embodiments. At that time, the lead hole 113 is masked with small holes for etching in the portion of the acoustic hole forming region. Small holes 117 can be formed. Then, when the molding resin body 115 is injection-molded on the lead frame 113, as shown in FIG. 23, the formation portion of the acoustic hole 118 is sandwiched between the circular protrusions 123 formed on the upper mold 121 and the lower mold 122. By injection molding, the small hole 117 is closed. Further, an arc-shaped groove 124 is formed in the upper mold 121 adjacent to the circular protrusion 123. As a result, as shown in FIGS. 21 and 22, a part of the shield plate portion 114 is exposed in a circular shape, and an acoustic hole 118 in which a plurality of small holes 117 penetrates is formed in the exposed portion. A cylindrical wall 119 surrounding the hole 118 is formed. The cylindrical wall 119 is formed in an arc shape so as to surround about half of the acoustic hole 118 between the acoustic hole 118 and the mounting region of the semiconductor chip if the adhesive of the semiconductor chip 2 can be blocked. Also good.
With the acoustic hole 118 having such a structure, the acoustic hole 118 can be formed efficiently in the etching process which is a part of the manufacturing process, and the acoustic hole 118 is formed by the plurality of small holes 117. As a result, the individual small holes 107 are reduced in size, so that foreign matters such as dust can be prevented from entering the internal space 42, and generation of noise can also be suppressed.

FIG. 24 shows another example of a press die used when the shield plate portion is pushed down. In the press die shown by the chain line in FIG. 3 of the first embodiment, the movable die is movable with the upper die and the lower die each having a divided structure and the main frame portion 11 being sandwiched between the holding dies 43 and 44. The connecting arm portion 12 is deformed by pushing down the shield plate portion 13 with 45 and 46, but in the example shown in FIG. 24, the inclined surfaces 133 are provided on the upper die 131 and the lower die 132, respectively. It forms, and it is set as the structure deform | transformed so that the connection arm part 12 may be pinched | interposed in the part of the inclined surface 133 of these both types 131 and 132. In this case, in order to allow the connecting arm portion 12 to stretch and deform smoothly on the mold surface, the slight protrusions 134 are formed only on portions corresponding to the bent portions at both ends of the connecting arm portion 12 on the inclined surfaces 133 of both molds 131 and 132. Is formed so that a gap is formed between the connecting portion 12 and the intermediate portion of the inclined surface 133. Note that the support arm portion connecting the terminal portions is also bent at the same time.
In the press die shown in FIG. 3 of the first embodiment, it is necessary to drive the punch dies 45 and 46 independently in the upper die and the lower die. In the press die shown in FIG. Since the whole is driven simultaneously, the mold structure can be simplified.
In the drawing process of the present invention, the connecting arm part and the supporting arm part may be processed simultaneously, or only the supporting arm part is bent first, and then the connecting arm part is drawn. Also good. In that case, in order to reduce the error between the two processes, an embossing process for adjustment may be provided after bending and drawing.

  By the way, when the connecting arm portion is bent and deformed as in the lead frames of the respective embodiments so far, the connecting arm portion may be broken depending on the material, the plate thickness, the processing size, etc. of the lead frame. . In the following sixth to ninth embodiments, the connecting arm portion is processed only by bending deformation without extending and deforming.

25 to 33 show a sixth embodiment. The semiconductor device 201 of this embodiment is also a surface-mount type microphone package, and as shown in FIGS. 31 and 32, two chips of a microphone chip 2 and a circuit chip 3 are accommodated as semiconductor chips. The package 204 includes a lead frame 205, a package main body 207 formed of a box-shaped mold resin body 206 integrally formed with the lead frame 205, and a lid 208 that closes the upper portion of the package main body 207. It is said that.

  The lead frame 205 is formed continuously on a band-shaped metal plate by pressing in a single row or a plurality of rows with the unit shown in FIG. 25 as one unit. In FIG. The connection frame portion in a connected state is shown in the outer frame portion 210 formed by punching the lead frame 205.

The lead frame 205 is cantilevered by a main frame portion 211 having a rectangular shape as a whole, a shield plate portion 213 and a support arm portion 214 connected to the inside of the main frame portion 211 by a plurality of connecting arm portions 212. It is comprised from the several terminal part 215 connected to the state.
The main frame portion 211 is formed in a rectangular frame shape by a pair of horizontal frame portions 216 and a vertical frame portion 217 that connects both ends of the horizontal frame portions 216, and two main frame portions 211 are provided on the outer side portions of both the horizontal frame portions 216. Connection frame portions 209 are provided, and three connection frame portions 209 are provided on the outer side portions of both vertical frame portions 217.

  In addition, one connecting arm portion 212 is provided between each horizontal frame portion 216 and the shield plate portion 213, and each of the connection portions 212a and 212b to the horizontal frame portion 216 and the shield plate portion 213, It is comprised by the intermediate part 212c which connects between these connection parts 212a and 212b. In this case, both the connecting portions 212a and 212b are provided at the opposing edge portions of the horizontal frame portion 216 and the shield plate portion 213 so as to protrude along these opposing directions, but do not oppose each other. Is provided at a position shifted in the length direction of the opposing edge. The intermediate portion 212c that connects the connection portions 212a and 212b is in a direction orthogonal to the facing direction of the horizontal frame portion 216 and the shield plate portion 213 in a plan view, in other words, in a direction parallel to the facing edge portion. The connecting arm portion 212 is formed in a crank shape by the connection portions 212a and 212b and the intermediate portion 212c therebetween.

  The two connecting arm portions 212 provided one by one in each horizontal frame portion 216 are formed so as to be line symmetric from the center line indicated by X in FIG. 25 in the shield plate portion 213 disposed therebetween. Yes. That is, the cranks are reversed in both the connecting arm portions 212, and in both the connecting arm portions 212, the connecting portions 212a to the horizontal frame portions 216 are arranged at positions on the left side of the horizontal frame portions 216 shown in FIG. The connection part 212b with respect to the shield plate part 213 is arranged at a position on the right side of FIG.

  Further, the right vertical frame portion 217 is connected to terminal portions 215 via support arm portions 214 on both upper and lower sides across the center line X of the shield plate portion 213, and the left vertical frame portion 217 is connected to the right vertical frame portion 217. The terminal portion 215 is connected to a position corresponding to one of the terminal portions 215 via one support arm portion 214. At the base end portion of each support arm portion 214, a part of each vertical frame portion 217 projects outward to form a concave portion 218 directed inward, and inside the bent portion 219, The support arm portions 214 are connected so as to divide the concave portion 218 in half.

  In addition, each terminal portion 215 provided at a position extending inward from the main frame portion 211 by the support arm portion 214 is disposed in a notch portion 220 formed on the outer peripheral portion of the shield plate portion 213. In this case, as shown in FIG. 25, two terminal parts 215 are arranged on the right side and one terminal part on the left side, which are a power supply terminal part, an output terminal part, and a gain terminal part. The shield plate 213 has a terminal portion for connecting to its own external ground on the back surface of the left vertical frame portion 217 where the terminal portion 215 is not provided and corresponding to the right terminal portion 215. 221 is formed. As will be described later, these terminal portions 215 and 221 are internal terminals whose front side is exposed to the inside of the package body, and whose back side is external terminals that are exposed to the outside of the package body.

  Each terminal portion 215, 221 is half-etched on the back surface side of the support arm portion 214 or the back surface side of the shield plate portion 213, so that the portions other than the terminal portions 215, 221 are half-etched. It is formed so as to protrude from the back surface of 213. FIG. 26 shows the back surface of the lead frame 205, and in FIG. 26, the hatched area is a half-etched portion.

The lead frame 205 having such an outer shape is arranged in a state where the shield plate portion 213 is pushed down with respect to the main frame portion 211 by deforming each of the connecting arm portions 212 and the support arm portions 214. Yes. As shown by the thin line in FIG. 25, the connecting arm portion 212 has both ends of the intermediate portion 212c as bent portions 212d and 212e, and the intermediate portion 212c is arranged obliquely as shown in FIG. It is transformed into a state. In this case, the line Y ₁ connecting the bent portions 212 d on the side frame portion 216 side and the line Y ₂ connecting the bent portions 212 e on the shield plate portion 213 side in both the connecting arm portions 212 are the center line X of the shield plate portion 213. Perpendicular to each other and parallel to each other.

  On the other hand, since the support arm portion 214 is connected to the vertical frame portion 217 of the main frame portion 211 in a cantilever state, the support arm portion 214 is bent and deformed, and each terminal portion 215 at the distal end portion is arranged on the same plane as the shield plate portion 213. Has been. 25 and 26 show the state after the bending deformation, and FIG. 28 shows the lead frame in the unfolded state before the bending deformation. As can be seen by comparing these figures, the shield plate part 213 is arranged on the right side of the region surrounded by the main frame part 211 as shown in FIG. 25, the terminal portion 215 connected to the support arm portion 214 is in the vicinity of the outlet of the notch 220 after the bending deformation shown in FIGS. Although it is disposed, the terminal portion 215 on the right side is disposed at the back of the notch portion 220 as shown in FIG. 28 in anticipation of movement of the shield plate portion 213 during deformation in the unfolded state before deformation. . The terminal portion 215 on the left side moves in the same direction as the cutout portion 220 of the shield plate portion 213 due to bending deformation. Therefore, the relative positional relationship with the cutout portion 220 does not change even in a state before deployment, and the cutout portion as shown in FIG. It is arranged in the vicinity of the exit of the part 220.

  As in the first embodiment, in this embodiment, the three-dimensional state after the connection arm portion 212 and the support arm portion 214 are deformed is referred to as a lead frame, and the connection arm portion 212 and the support arm. The state extending in the same plane as the main frame portion 211 before deforming the portion 214 is referred to as a flat frame member. Also, in the flat frame member of FIG. 28, the same reference numerals as those in FIG. 25 are assigned to the portions to be bent corresponding to the bent portions 212d and 212e in FIG.

  Further, in the connection portion between the main frame portion 211 and the support arm portion 214, the bent portion 219 continuous from the main frame portion 211 is disposed on the same plane as the main frame portion 211, but the support arm portion 214 is It is bent at the base end portion disposed in the concave portion 218, and is disposed at a position where the longitudinal frame portion 217 extends within the concave portion 218 slightly downward with respect to the upper surface of the main frame portion 211 (see FIG. (See FIGS. 29 to 32).

  Then, the package body 207 is configured by integrally molding the molded resin body 206 to the lead frame 205 processed in this way. As shown in FIGS. 31 and 32, the mold resin body 206 includes a bottom wall portion 231 formed in a rectangular plate shape with a length that allows the microphone chip 2 and the control circuit chip 3 to be arranged, and the bottom wall portion. It is formed in a box shape provided with a rectangular tube-shaped peripheral wall portion 232 erected from the peripheral edge portion of 231.

  The bottom wall portion 231 embeds the remaining portions of the shield plate portion 213 and the terminal portion 215 in the state where the back surface of each of the terminal portions 215 and 221 in the lead frame 205 is exposed. In this case, the terminal portions 215 and 221 are exposed so as to slightly protrude from the back surface of the bottom wall portion 231. Further, the bottom wall portion 231 is formed so as to cover the upper surfaces of the shield plate portion 213 and the terminal portion 215, but the opening portions 233 for exposing part of the upper surfaces of the terminal portions 215 and 221 are provided. Four are formed in accordance with the positions of the terminal portions 215 and 221.

  The microphone chip 2 and the control circuit chip 3 are fixed on the bottom wall portion 231 by die bonding, and the terminal portions 215 and 215 facing the opening 233 of the bottom wall portion 231 of the mold resin body 206 are provided. 221 is connected by a bonding wire 234.

  On the other hand, the peripheral wall portion 232 is formed in a rectangular tube shape as a whole. As shown in FIG. 32, the peripheral wall portion 232 faces upward from the peripheral portion of the bottom wall portion 231 in which the shield plate portion 213 of the lead frame 205 is embedded. And an outward flange portion 235 is integrally formed at the upper end portion thereof. The connection arm portion 212 and the support arm portion 214 of the lead frame 205 are embedded in the peripheral wall portion 232, and the upper surface of the main frame portion 211 is exposed on the upper surface of the flange portion 235 of the peripheral wall portion 232. . Further, in the main frame portion 211, the vicinity of the bent portion 219 is cut out as will be described later, and the support arm portion 214 connected to the bent portion 219 is slightly below the main frame portion 211. An end surface embedded and cut in the flange portion 235 is exposed on the outer surface of the flange portion 235.

  The lid 208 that covers the package main body 207 configured in this way is formed in the same rectangular shape as the outer shape of the upper end surface of the flange portion 235 of the peripheral wall portion 232 of the package main body 207 by a conductive metal material such as copper. An acoustic hole 241 that communicates the internal space formed when the package body 207 is covered with the outside is formed in a penetrating state. The lid 208 is adhered to the upper end surface of the flange portion 235 via a conductive adhesive, thereby covering the internal space 242 surrounded by the peripheral wall portion, and the internal space 242 by the acoustic hole 241. The main frame portion 211 of the lead frame 205 exposed on the upper surface of the flange portion 235 is in an electrically connected state. Therefore, in this package 204, the main frame portion 211, the connecting arm portion 212, and the shield plate portion 213 of the lead frame 205 are continuously connected from the lid 208 to the internal space. The three terminal portions 215 that are disposed so as to surround the 242 and are disposed in the notch 220 of the shield plate portion 213 are provided independently of the shield plate portion 213.

Next, a method for manufacturing the semiconductor device 201 configured as described above will be described.
First, the hatched regions in FIGS. 25 and 26 are half-etched to about half the plate thickness by masking and etching necessary portions of the strip-shaped metal plate to be the lead frame 205. Then, by punching by press working, the outer shape is punched to form a flat frame member 205a connected to the outer frame portion 210 by the connection frame portion 208 as shown in FIG. Thereafter, the shield plate portion 213 is placed in a state of being pushed down with respect to the main frame portion 211 while bending the connecting arm portions 212 that are continuous in a plane between the main frame portion 211 and the shield plate portion 213. .

  In this pressing, as shown in FIG. 27, the inclined surfaces 243a and 243b for bending the connecting arm portion 212 and the supporting arm portion 214 to push down the shield plate portion 213 are connected to the upper die 243. The lower mold 244 is formed with inclined surfaces 244a and 244b corresponding to the inclined surfaces 243a and 243b of the upper mold 243, and is formed between the inclined surfaces. The flat frame member 205a is deformed so as to sandwich the flat frame member 205a. In this case, a slight protrusion 245 is formed at a portion corresponding to the bent portion of the upper mold 243 so that the connecting arm portion 212 and the support arm portion 214 can be smoothly deformed on the mold surface. The intermediate surfaces of the inclined surfaces 243a and 243b are formed so that a gap is formed between the connection arm portion 212 and the support arm portion 214. In this pressing, the two connecting arm portions 212 arranged symmetrically with respect to the center line X between the shield plate portion 213 and the main frame portion 211 are connected to the main frame portion 211 and the shield plate portion 213. As described above, the connecting portion 212a is disposed on the left side in FIG. 25 with respect to the main frame portion 211 and on the right side with respect to the shield plate portion 213. The bent portion 212d is deformed while being swung like a pendulum. Accordingly, the shield plate portion 213 is moved from the right side position shown in FIG. 28 to the center position surrounded by the main frame portion 211 as shown in FIG.

At the same time, the support arm portion 214 is also bent and deformed, and the terminal portion 215 is arranged on the same plane as the shield plate portion 213 in the cutout portion 220 of the shield plate portion 213. In the processing to the support arm portion 214, among the terminal portions 215 connected to the support arm portion 214, the terminal portion 215 arranged on the right side in FIG. After being deformed from the position behind the notch 220 when deployed (see FIG. 28), it moves to the vicinity of the exit of the notch 220 (see FIG. 25), and the left terminal 215 is the same as the shield plate 213. Will move like so.
The protrusions 245 described above are supported so as to be slidable on the surface of the press die without hindering such movement during the press molding in the shield plate part 213 and the terminal part 215.

  Next, the lead frame 205 press-molded in this way is placed in an injection mold, and a resin is injection-molded so as to embed the lead frame 205 to mold the mold resin body 206. FIG. 29 shows a state in which the lead frame 205 after press molding is arranged in an injection mold, and a cavity 253 into which mold resin is injected is formed between the upper mold 251 and the lower mold 252. . In this injection molding, a concave portion 254 for fitting the terminal portion 215 is formed on the cavity surface of the lower mold 252 so that the terminal portions 215 and 221 do not move. As described above, the terminal portions 215 and 221 are formed so as to protrude from other portions by half etching, and the concave portion 254 is formed to a depth slightly smaller than the protruding height of the terminal portions 215 and 221. With the bottom surfaces of the terminal portions 215 and 221 in contact with the bottom surface, the other portions of the shield plate portion 213 and the support arm portion 214 are slightly lifted from the cavity surface of the lower mold 252. The planar dimension of the recess 254 is set slightly larger than the terminal parts 215 and 221 so as to allow the dimensional tolerance of the terminal parts 215 and 221. Further, the protruding portion 255 of the upper mold 251 that becomes the opening 233 of the mold resin body 206 is in contact with the surface side of the terminal portions 215 and 221.

  On the other hand, the upper surface of the main frame portion 211 and the upper surface of the bent portion 219 continuous with the main frame portion 211 are brought into contact with the cavity surface of the upper mold 251. The upper die 251 and the lower die 252 are in a state where the upper surface of the main frame portion 211 and the upper surface of the bent portion 219 are in contact with the upper die 251 and the back surfaces of the terminal portions 215 and 221 are in contact with the lower die 252. By clamping the mold, the connecting arm portion 212 and the support arm portion 214 are disposed in the cavity 253 so as to be slightly bent, and a pressing force is generated on the contact surfaces to the upper die 251 and the lower die 252. The upper surface of the main frame portion 211 is in close contact with the upper mold 251.

  Then, the semiconductor chips 2 and 3 are fixed by die bonding on the bottom wall portion 231 of the package body 207 in which the mold resin body 206 is integrally formed on the lead frame 205 in this way, and the opening 233 of the bottom wall portion 231 is fixed. After the exposed terminal portions 215 and 221 are connected to each other by wire bonding, a conductive adhesive is applied to the upper end surface of the peripheral wall portion 232, and a cover 208 that has been separately manufactured is put on and bonded. . In this state, the package body 207 is connected to the adjacent lead frame via the connection frame portion 209 so that a plurality of the package bodies 207 are connected vertically and horizontally, and the lid 208 is also connected to the lead frame. A plurality of connection frames 256 (see FIG. 33) similar to 205 are connected at the same pitch as the package body 207, and these are bonded together.

  After this bonding, the connection frame portion 209 of the lead frame 205 and the connection frame portion 256 of the lid 208 that protrude from the mold resin body 206 and the bent portion 219 of the main frame portion 211 of the lead frame 205 are cut. (Shown by the cutting line P in FIG. 30), and divided into individual packages 204. In the state before the division, the bent portion 219 protrudes outward from the main frame portion 211, and the support arm portion 214 is bent and deformed in the recessed portion 218 inside the bent portion 219. The mold resin penetrates into 214. Therefore, the entire mold resin is cut.

  The semiconductor device 201 manufactured in this way is a surface-mount type, and as shown in FIG. 32, the terminal portions 215 and 221 are exposed on the bottom surface so as to slightly protrude. Mounting is performed by soldering to the substrate S as indicated by a chain line. In this mounted state, the shield plate portion 213 embedded in the bottom wall portion 231 is disposed below the semiconductor chips 2 and 3, and the shield plate portion 213 is connected to the shield arm portion 213 via the connecting arm portion 212 and the main frame portion 211. Since the lid 208 is connected and the lid 208 covers the upper side of the semiconductor chips 2 and 3, the semiconductor chips 2 and 3 are surrounded by the shield plate 213, the lid 208, and the like. The semiconductor chips 2 and 3 can be shielded from an external magnetic field by bringing the terminal part 221 integrated with the shield plate part 213 into a grounded state via a substrate. In this case, the main frame portion 211 exposed on the upper surface of the flange portion 235 has the horizontal frame portion 216 and the vertical frame portion 217 exposed on almost the entire surface including the corner portions except for the cut-off bent portion 219. And since it arrange | positions over the perimeter of the flange part 235, a large contact area with the cover body 208 is ensured, and it can be set as an electrical connection state reliably.

Further, since the terminal portions 215 and 221 protrude from the bottom surface of the package main body 207, only the terminal portions 215 and 221 come into contact with the substrate S as shown by a chain line in FIG. It is possible to prevent the occurrence of mounting defects due to the inclusion of foreign matter between 231 and the substrate S.
Further, since the bottom wall portion 231 is formed smaller than the outer shape of the flange portion 235 at the upper end of the peripheral wall portion 232, the mounting area on the substrate can be reduced, and interference with other circuits on the substrate is reduced. And can enable high-density mounting.

  The support arm portion in the lead frame is bent at the middle position of the peripheral wall portion as shown in FIG. 14 or between the bent portion and the terminal portion with a small inclination angle as shown in FIG. It is good also as the shape arrange | positioned diagonally.

  FIG. 34 shows a seventh embodiment of the present invention, which is an example in which the support structure of the terminal portion in the lead frame is changed. In the sixth embodiment described above, the terminal portion independent from the shield plate portion is supported in a cantilever state from the main frame portion via the support arm portion. However, in this lead frame 285, the support arm portion is eliminated, and the shield plate portion is removed. In the notch 220 of 213, the terminal part 215 is connected to the shield plate part 213 via a plurality of bridge parts 286. Then, after the resin is molded, the bridge portion 286 is cut by means such as laser cutting, so that the terminal portion 215 is separated from the shield plate portion 213 and independent. In the sixth embodiment, since the connecting arm portion and the supporting arm portion are bent and deformed during press molding, the terminal portion moves in the recess portion of the shield plate portion, and therefore, in the shield plate portion and the recess portion of the shield plate portion. Although it was necessary to design the relative positional relationship with the three terminal portions to be arranged in consideration of the movement during press molding, in the case of the embodiment of FIG. 34, each terminal portion with respect to the shield plate portion Since the relative positional relationship does not change before and after the press molding, the design is easy.

  FIGS. 35 and 36 show an eighth embodiment of the present invention. In the sixth embodiment, an acoustic hole is formed in the lid, but in the eighth embodiment, an acoustic hole is formed in the package body. That is, as shown in FIGS. 35 and 36, the lead frame 91 is provided with a lower hole 92 for an acoustic hole so as to penetrate the shield plate portion 13. The configuration having the main frame portion 11, the connecting arm portion 12, the terminal portions 15, 21 and the like is the same as that of the sixth embodiment. Similarly to the sixth embodiment, the back surface of the shield plate portion 13 is half-etched and the portions other than the terminal portion 21 are formed thin. However, around the lower hole 92, Is half-etched so as to surround the plurality of protrusions 93. Therefore, these protrusions 93 have the same thickness as the terminal portion 21.

And after this lead frame 91 is press-molded, it is placed in an injection mold similar to that shown in FIG. 19 in the fourth embodiment, and resin is injected, so that the bottom wall portion of the mold resin body An acoustic hole similar to that shown in FIG. 20 is formed, and a cylindrical wall surrounding the acoustic hole is formed on the upper surface of the bottom wall portion. Moreover, a thing without a hole is used for a cover body.
Further, as shown in FIG. 21, the acoustic hole may be formed by a plurality of small holes desired from the window hole.

37 to 39 show a ninth embodiment of the lead frame. In this lead frame 295, two connecting arm portions 296 that connect the main frame portion 211 and the shield plate portion 213 are arranged in parallel on one side edge portion of the rectangular shield plate portion 213, By being bent and deformed at both end portions, the intermediate portion is arranged to be inclined in the same direction. Specifically, both connecting arm portions 296 are linearly provided along the opposing direction between the vertical frame portion 217 and the shield plate portion 213 of the main frame portion 211, and the vertical frame portion 217. mutual line Y ₂ connecting to what bent portion 296e on the side of the bent portion 296d if the line Y ₁ and connects, and shield plate 213 side is perpendicular to the center line X of the shield plate 213 are arranged in parallel.
Therefore, these connecting arm 296, the flat frame members 295a shown in FIG. 39, folded by a line _{Y 1} connecting to what bent portion 296d of the main frame portion 211 side of the two joining arms 296 so as to swing about By being deformed, the shield plate portion 213 is disposed in a state of being pushed down with respect to the main frame portion 211. In addition, a slit 297 is formed in a connection portion on the shield plate portion 213 side in both the connecting arm portions 296, and the connecting arm portion 296 is formed so as to enter the shield plate portion 213 by the amount of the slit 297.
In the sixth embodiment, etc., the shield plate portion 213 is supported on both sides by a pair of connecting arm portions 296 provided at line-symmetric positions via the shield plate portion 213. As in the embodiment, the connecting arm portion 296 may be arranged side by side on one side of the shield plate portion 213 so that the shield plate portion 213 is supported in a cantilever state. The bent portions on the main frame portion side and the bent portions on the shield plate portion side of the portions are arranged on lines parallel to each other.

  By the way, since the main frame portion is disposed on the upper end surface of the peripheral wall portion with respect to the shield plate portion disposed on the bottom plate portion, it is necessary to bend and form the connecting arm portion connecting them. The distance between the main frame portion and the shield plate portion needs to be increased by the developed length of the bent connecting arm. If the main frame portion is formed so as to surround the shield plate portion as in the embodiments described so far, a large frame flat frame member is required, resulting in a large loss and a poor yield, which may hinder cost reduction. Become. In the following tenth embodiment, the main frame portion is disposed at one end portion of the package body, and the connecting arm portion is disposed only on one end portion side, thereby reducing the space required for deployment. .

  The semiconductor device 301 of the tenth embodiment is also a surface-mount type microphone package, and as shown in FIGS. 51 to 56, two chips of the microphone chip 2 and the control circuit chip 3 are housed as semiconductor chips. The package 304 includes a package body 307 formed by integrally forming a box-shaped mold resin body 306 on the lead frame 305, and a lid 308 that closes the top of the package body 307.

The lead frame 305 is formed in a state in which a plurality of pieces are arranged by processing a strip-shaped metal plate made of a conductive material such as a copper material, processed as described later, and assembled as a semiconductor device. As shown in 51, they are separated individually.
FIG. 40 shows a flat frame continuous molded body in a developed state of a lead frame continuous molded body 312 formed by arranging lead frames 305 in the outer frame portion 311 at a constant pitch, and FIG. 41 shows the back surface thereof. Yes. In this flat frame continuous molded body and also in a lead frame continuous molded body after bending, which will be described later, the components and the like of the respective parts are denoted by the same reference numerals. Therefore, for example, the reference numeral 312 may be referred to as a flat frame continuous molded body or a lead frame continuous molded body. Further, in this specification, one unit is referred to as a lead frame, and in the following, the vertical direction in FIG. 40 is referred to as a vertical direction, and the horizontal direction is referred to as a horizontal direction. In FIG. 40, reference numeral 313 indicates a guide hole for inserting a guide pin of a mold when the lid 308 is attached as will be described later. In the illustrated example, the reference numeral 313 indicates the vertical direction of the outer frame portion 311. They are arranged at a constant pitch at both ends (only the guide holes at one end are shown in the figure).

Each lead frame 305 includes a flat shield plate portion 321 disposed below the microphone chip 2 and the control circuit chip 3 as shown in FIG. 42 and FIG. 43, and the shield plate portion. For example, three terminal portions 322 to 324 for power supply, output, and gain arranged around the 321 are arranged at intervals from each other, and are integrated with the shield plate 321 via a connecting arm portion 325. The main frame portion 326 is formed in parallel with one end portion of the shield plate portion 321, and the main frame portion 326, the shield plate portion 321, and the terminal portions 322 to 324 form a vertically long rectangular shape as a whole. Is arranged.
The shield plate portion 321 has a rectangular shape in which one end portion is cut out in a rectangular shape at one end and the other end portion is cut out in a rectangular shape at each of the two end portions. 322 to 324 are arranged.
Each terminal part 322 to 324 is formed in a rectangular shape smaller than each notch part 327 of the shield plate part 321, so that a certain interval is provided between the terminal part 322 to 324 and the shield plate part 321. Has been placed.

  The main frame portion 326 is disposed along one side of the shield plate portion 321 at a distance from the end of the shield plate portion 321. In this case, the main frame portion 326 is provided in a range of the length of a portion excluding the notch portion 327 at the one end portion of the shield plate portion 321, and the main frame portion is provided at a portion facing the notch portion 327. A bent portion 328 that projects outward from 326 in a bent state is formed continuously at one end of the main frame portion 326. Then, connection arm portions 325 are formed at the end portion of the bent portion 328 and the other end portion of the main frame portion 326 in parallel with both side portions of the shield plate portion 321, respectively, and the distal end portion of each connection arm portion 325 is shielded. The plate portion 321 is connected to substantially the center position on both sides. Further, in the adjacent lead frame 305, a connecting arm portion (connecting arm portion disposed on the left side in FIG. 42) 325 extending from the main frame portion 326 and a connecting arm portion (right side in FIG. 42) extending from the bent portion 328. In the example shown in the drawing, two short bridge portions 329 are connected to each other in the longitudinal direction with respect to the connecting arm portion 325 arranged in the portion.

  In this way, the bent portion 28 continues to the main frame portion 326, and both the connecting arm portions 325 extending from the main frame portion 326 and the bent portion 328 are connected to each other between the adjacent lead frames 305. Thus, as shown in FIG. 40, the conductive frame 326, the bent portion 328, and the connecting arm portion 325 arranged on one end side of each lead frame 305 are connected in a row, and both ends thereof are connected to the outer frame portion 311. It is connected. The connected conductive frame 326, the bent portion 328, and the connecting arm portion 325 constitute a support frame portion 331 that supports one end portion of each lead frame 305 in a connected state along the row and is supported by the outer frame portion 311. The Specifically, a shield plate portion 321 of each lead frame 305 is connected to one side of the support frame portion 331 via a connecting arm portion 325, and one terminal portion belonging to the lead frame 305. 324 is connected via a support arm portion 332, and on the opposite side, two terminal portions 322 and 323 belonging to other adjacent lead frames 305 are connected via a support arm portion 333.

In this case, one of these two terminal portions 322 and 323 (terminal portion 322) is connected to the main frame portion 326, and the other one (terminal portion 323) is connected to the bent portion 328. Therefore, one terminal portion 322 belonging to the lead frame 305 of another row is connected to the main frame portion 326 of the support frame portion 331, and the bent portion 328 belongs to its own lead frame 305 on both sides thereof. The terminal portions 324 and the terminal portions 323 belonging to the lead frames 305 in other rows are connected one by one.
The regions hatched in FIGS. 40 and 42 are regions that are locally half-etched on the surface side of the lead frame 305, and in the support arm portion 332 and the support arm portion 333 connected to the bent portion 328. The inner side portions of both terminal portions 322 and 323 arranged in both cutout portions 327 of the shield plate portion 321 at the end portion on the side opposite to the support frame portion 331 and the connection portion to the bent portion 328 have a plate thickness, respectively. By being half-etched to about half, the concave portions 334 and 335 are formed lower than the other surfaces.

  On the other hand, most of the shield plate portion 321 is half-etched on the back surface of the lead frame continuous molded body 312 as shown in FIG. 41 and FIG. 43 by hatching. That is, in a state where the corners of the shield plate 321 corresponding to the three terminal portions 322 to 324 are left in a rectangular shape, the other portion is a concave portion 336 that is half-etched to about half the plate thickness, The remaining corners have a rectangular shape that is substantially the same shape as the three terminal portions 322 to 324, and the surfaces of the corner portions of the terminal portions 322 to 324 and the shield plate portion 321 are external connection surfaces 337 to 340. These four external connection surfaces 337 to 340 are arranged in the vicinity of the four corners of the entire lead frame 305. It should be noted that the surface of each terminal portion 322 to 324 (in the both terminal portions 322 and 323 disposed at both notches 327 of the shield plate portion 321 at the end opposite to the support frame portion 331, the concave portion on the inner side portion thereof. The surface of the shield plate 321 corresponding to the arrangement of the terminal portions 322 to 324 is the internal connection surfaces 341 to 344 connected to the microphone chip 2 or the control circuit chip 3.

  As shown in FIG. 44, the lead frame continuous molded body 312 includes a connecting arm portion 325, a supporting arm portion 332, and a supporting arm portion 333 that are bent at both ends, and the supporting frame portion 331 has an outer frame portion. The connecting arm portion 325, the support arm portion 332, and the support arm portion 333 are arranged on the same plane as that of the H. 311 so as to be inclined downward toward the tip, and the shield plate connected to the tips is provided. The part 321 and the terminal parts 322 to 324 are arranged on the same plane at a position lower than the support frame part 331.

As shown by the chain line in FIGS. 40 and 41, the integrally formed mold resin molded body 350 in which the mold resin bodies 306 are connected to each other is formed on the lead frame continuous molded body 312 processed in this way. .
The microphone chip 2 and the control circuit chip 3 are mounted on the molded resin molded body 350, and the lid body 308 is fixed on the molded chip 350, and the molded resin body 306 is integrated with each lead frame 305 by being divided individually. The package main body 307 and the lid 308 constitute a semiconductor device 301 that houses the microphone chip 2 and the control circuit chip 3. In the present invention, a state in which the molded resin molded body 350 is integrally formed with the lead frame continuous molded body 312 is referred to as a package body continuous molded body 351, and a plurality of package bodies 307 are formed in a mutually connected state. Is done.

The structure of the package body 307 divided into one piece will be described with reference to FIGS. 45 to 47. The mold resin body 306 of the package body 307 has a length that allows the microphone chip 2 and the control circuit chip 3 to be arranged. A bottom plate portion 3052 formed in a rectangular plate shape and a peripheral wall portion 353 erected from the peripheral edge portion of the bottom plate portion 352 are provided.
The bottom plate portion 352 has, on its rear surface, the terminal portions 322 to 324 and the shield plate portion in a state where the terminal portions 322 to 324 of the lead frame 305 and the external connection surfaces 337 to 340 of the shield plate portion 321 are exposed. The remaining part of 321 is buried (see FIG. 53). Further, on the surface side of the bottom plate portion 352, a rising wall 354 having a slight height is formed in a rib shape along the vertical direction so as to partition one side portion from the other portion. In the right side portion, the internal connection surfaces 342 and 343 of the terminal portions 323 and 324 at both the upper and lower end portions and a part of the shield plate portion 321 are exposed, and on the left surface from the rising wall 354, In the upper half from the center of the direction, except for the internal connection surface 344 of the shield plate portion 321, the other portions are buried, but in the lower half from the central portion, the internal connection surface 341 of the terminal portion 322 and the shield The lower half of the plate portion 321 is exposed, and a rising wall 355 having a slight height is formed so as to partition between the exposed internal connection surface 341 and the surface of the shield plate portion 321. ing. The heights of the rising walls 354 and 355 are lower than the heights of the microphone chip 2 and the control circuit chip 3, but are larger than the coating thickness of a die bonding material to be described later, and are die bonded from below the microphone chip 2 and the control circuit chip 3. The height is set so that the material cannot get over even if it protrudes. Further, a shelf portion 356 higher than the rising wall 355 is formed at a lateral position of the exposed portion of the lower half of the shield plate portion 321, and is formed continuously with the rising wall 355 and integrally with the inner side surface of the peripheral wall portion 353. Yes.

  A region where most of the upper half shield plate portion 321 of the bottom plate portion 352 is embedded in the resin is a region where the microphone chip 2 is mounted, and a portion of the lower half shield plate portion 321 is exposed. This area is an area where the control circuit chip 3 is mounted. Accordingly, the resin is entirely molded in the region where the microphone chip 2 is mounted, but the shield plate portion 321 is partially exposed in the region where the control circuit chip 3 is mounted. The control circuit chip 3 is fixed on the 321. Further, the shelf portion 356 formed close to the area where the control circuit chip 3 is mounted so as to raise a part of the bottom plate portion 352 and reduce the volume of the internal space surrounded by the peripheral wall portion 353. It is functioning.

  On the bottom plate portion 352, the microphone chip 2 and the control circuit chip 3 are fixed by die bond materials 357 and 358, respectively, and the terminal portions 322 to 324 and the shield plate exposed at the four corners of the bottom plate portion 352. It is connected to each internal connection surface 341-344 of the part 321 by the bonding wire 359 (refer FIG.51 and FIG.52). In this case, the die bond material 357 for fixing the microphone chip 2 is made of an insulating resin, while the die bond material 358 for fixing the control circuit chip 3 is made of a conductive resin.

On the other hand, the peripheral wall portion 353 is formed in a rectangular tube shape as a whole, and is erected upward from the peripheral edge portion of the bottom plate portion 352 in which the shield plate portion 321 of the lead frame 305 is embedded. In the peripheral wall portion 353, the connecting arm portion 325 bent at both ends and inclined, and the supporting arm portion 332 and the supporting arm portion 333 of each of the terminal portions 322 to 324 are respectively embedded, and the main frame portion The surface of 326 is exposed on the upper end surface of the peripheral wall portion 353.
Note that, as the molded resin molded body 350, the surface of the bent portion 328 continuous to the main frame portion 326 is also exposed outside the peripheral wall portion 353, but is cut by dicing as described later.

  Similarly to the lead frame 305, the lid body 308 covering the package body 307 thus configured is also formed in a state in which a plurality of the lid bodies 308 are arranged by processing a strip metal plate made of a conductive metal material such as a copper material. As described later, after being combined with the package main body 307, they are separated individually. FIG. 48 shows a continuous molded body 361 in which lid bodies 308 are formed at a constant pitch. In the continuous molded body 361, the lids 308 are connected to the outer frame part 362 or between adjacent lids 308 by the connection frame part 363, and are arranged vertically and horizontally at the same pitch as the lead frame 305. Similarly to the lead frame continuous molded body 312 shown in FIG. 40 and the like, the guide holes 313 into which the guide pins are inserted are arranged at both sides of the outer frame portion 362 at the same pitch as the lead frame continuous molded body 312. .

Each lid body 308 is formed in a rectangular flat plate covering the upper end surface of the peripheral wall portion 353 of the package main body 307, and an acoustic hole 364 is formed in a penetrating state at a substantially central position. When the lid 308 is overlaid on the package main body 307, the peripheral edge abuts against the upper end surface of the peripheral wall 353 of the package main body 307, and the bottom plate portion 352 of the package main body 307 and the lid 308 face each other. An internal space 365 surrounded by the bottom plate portion 352, the peripheral wall portion 353, and the lid 308 of the package body 307 is a semiconductor chip storage space, and the internal space 365 is in communication with the outside through the acoustic hole 364 of the lid 308. It is the composition which is done.
In this case, the package body 307 and the lid body 308 are configured such that the lower surface of the lid body 308 is fixed to the upper end surface of the peripheral wall portion 353 of the package body 307 by the conductive adhesive 366. The main frame portion 326 of the lead frame 305 exposed at the upper end surface of the peripheral wall portion 353 is brought into electrical connection with the lid 308 through the conductive adhesive 366. Therefore, the package 304 formed by fixing the lid body 308 to the package body 307 is in an electrically connected state between the lid body 308 and the shield plate portion 321 of the lead frame 305, and the microphone chip 2 in the internal space 365 and The control circuit chip 3 is surrounded.

Next, a method for manufacturing the semiconductor device 301 configured as described above will be described.
First, by masking the necessary portions of the strip-shaped metal plate to be the lead frame continuous molded body 312 and performing an etching process, the front side hatching region shown in FIG. 40 and the rear side hatching region shown in FIG. Half-etch to about half the thickness. Then, an outer shape is formed by etching, and a lead frame (flat frame continuous molded body) 305 in an unfolded state is formed inside the outer frame portion 311. In this state, as shown in FIGS. 40 and 41, a support frame portion 331 in which a main frame portion 326, a bent portion 328, and a connecting arm portion 325 are continuous is formed in a horizontal row inside the outer frame portion 311. An unfolded lead frame 305 is formed in a state where one end thereof is supported by the support frame portion 331. Further, the guide hole 313 of the outer frame portion 311 is also formed during the etching process.

  Thereafter, the connecting arm portion 325 and the supporting arm portion 332 and the supporting arm portion 333 of each of the terminal portions 322 to 324 are bent and deformed by pressing, whereby the shield plate portion 321 and the terminal portions 322 to 324 with respect to the supporting frame portion 331. Is in a state of being pushed down. This press working is performed using a press die as shown in FIG. In FIG. 49, the bent portion of the connecting arm portion 325 is shown in the right half, and the bent portion of the support arm portion 333 is shown in the left half. That is, inclined surfaces 371a, 371b, 372a, and 372b are formed on the upper die 371 and the lower die 372, respectively, and both end portions are bent while sandwiching the connecting arm portion 325 or the support arm portion 333 by these inclined surfaces. In this case, a slight protrusion 373 is formed at a portion corresponding to the bent portion of the upper mold 371 so that the connecting arm 325 and the support arm 333 can be smoothly deformed on the mold surface. The intermediate surfaces of the inclined surfaces 371a and 372a are formed so that a gap is formed between the connecting arm portion 325 or the supporting arm portion 333 and the upper die 371. Similarly, in the case of the support arm portion 332, it is bent while being sandwiched between the upper die 371 and the lower die 372.

The press work of the connecting arm part 325, the support arm part 332, and the support arm part 333 is a bending process, and the tip positions of the connecting arm part 325 and the support arm part 333 are each slid toward the base end part after being bent and deformed. Therefore, the shield plate part 321 and the support arm part 332 at the tip of the connecting arm part 325 or the terminal parts 322 to 324 at the tip of the support arm part 333 are supported so as to be slidable on the mold surface.
The state in which the outer shape is formed and bent by the etching process and the press process is the state shown in FIGS. 42 and 43. In this state, the lead frames 305 are arranged vertically and horizontally at a constant pitch. It is formed in the state.

Subsequently, the continuous molded body 312 of the lead frame 305 molded in this way is placed in an injection mold, and a resin is injection molded so as to embed each lead frame 305, thereby molding a molded resin body 306.
FIG. 50 shows a state in which one lead frame 305 after press molding is arranged in an injection mold, and a cavity 383 into which mold resin is injected is formed between an upper mold 381 and a lower mold 382. Has been. In this case, as described above, the molded resin molded body 350 (see FIGS. 40 and 41) is molded in a state where the adjacent lead frames 5 in the continuous molded body 312 are connected together, and injection is performed. The molding die has a wide cavity 383 so that the upper frame 381 and the lower die 382 sandwich the outer frame portion 311 of the lead frame continuous molded body 312 without any gap and collectively cover the entire lead frame 305 inside. Is formed.
Further, in a state where the lead frame 305 is disposed and clamped in the injection mold, the shield plate portion 321 and the four external connection surfaces 337 to 340 of the terminal portions 322 to 324 are formed in the cavity of the lower die 382. The upper connecting surfaces 381, 341 to 344 on the surface side of the shield plate portion 321, the exposed portions of the shield plate portion 321, and the upper surfaces of the main frame portion 326 and the bent portion 328 in the support frame portion 331 are in contact with the surface. The state is in contact with the cavity surface. In this case, when the molds 381 and 382 are in contact with both surfaces of the external connection surfaces 337 to 340 and the internal connection surfaces 341 to 344 of the shield plate portion 321 and the terminal portions 322 to 324, the shield plate portion 321 and the terminal portions are provided. 322 to 324 are held between the molds 381 and 382, the external connection surfaces 337 to 340 of the shield plate portion 321 and the terminal portions 322 to 324, the main frame portion 326, and the bent portion. The connecting arm portion 325, the support arm portion 332, and the support arm portion 333 are arranged in a slightly bent state so that the upper surface of 328 is in press contact with the mold.

When each lead frame 305 is thus placed in the injection mold and molded with resin, a molded resin molded body 350 in which the peripheral wall portion 353 is continuous is molded integrally with each lead frame 305. It becomes. Thereafter, the microphone chip 2 and the control circuit chip 3 are fixed to each bottom plate portion 352 of the molded resin molded body 350 by die bond materials 357 and 358, and the terminal portions 322 to 324 and the shield plate exposed at the four corners of the bottom plate portion 352. Each of the internal connection surfaces 341 to 344 of the part 321 is connected by a bonding wire 359.
On the other hand, the lid 308 is also formed by etching the strip-shaped metal plate to form the outer shape, and as shown in FIG. 48, the lid is connected to each other by the connection frame portion 363 in the outer frame portion 362. A continuous molded body 361 of the body 308 is formed. Further, the guide hole 313 of the outer frame portion 362 is also formed by the etching process at this time. The guide holes 313 are formed at the same position as the guide holes 313 of the lead frame 305 at the same pitch.

In this way, after the package body continuous molded body 351 and the lid continuous molded body 361 in which the mold resin molded body 350 is integrated with the lead frame 305 are respectively manufactured, the peripheral portions of the lid bodies 308 are formed on the mold resin molded body 350. Is fixed to the upper end surface of the peripheral wall portion 353 with a conductive adhesive 366. At this time, the pin is inserted into the guide holes 313 of the outer frame portions 311 and 362 of the lid continuous molded body 361 and the lead frame continuous molded body 312 so that they are aligned. In this state, each lead frame 305 is connected to the adjacent lead frame 305 for each column by the support frame portion 331, and these are collectively packaged by the mold resin molded body 350 covering them. A plurality of main bodies 307 are connected in the vertical and horizontal directions, and the cover body 308 is connected at the same pitch as the lead frame 305 by the connection frame portion 363 in the same manner as the lead frame 305.
Therefore, the lead frame continuous molded body 312, the molded resin molded body 350, and the lid continuous molded body 361 are cut into individual semiconductor devices 301 while being simultaneously cut by dicing.

  In this dicing process, as shown in FIG. 40 and FIG. 41, a cutting line P having a predetermined width, the main frame portion 326 in the support frame portion 331 arranged in a horizontal row in the direction along the row of the lead frames 305. Of the main frame portion 326 and the bent portion 328 and a width from the outer edge of the bent portion 328 along the row. By this cutting, the base end portion of the support arm portion 333 belonging to the lead frame 305 of the adjacent row connected to the main frame portion 326 is separated, and the bent portion 328 and the main frame portion 326 are separated, The support arm portion 332 integrated with the bent portion 328 is also cut, and the terminal portion 324 connected to the support arm portion 332 is separated from the main frame portion 326 to be in an independent state.

In this case, since the surface in the vicinity of the connection portion to the bent portion 328 in the support arm portion 332 is half-etched to form a concave portion 334, the concave portion 334 is filled with resin, and approaches the connection portion. Even if dicing is performed at the position, the cutting edge of the support arm portion 332 can be reliably embedded in the mold resin body 306.
When the concave portion 334 is not provided, the bent portion of the support arm portion 332 inside the bent portion 328 is cut. The closer the cutting position is to the bent portion 328, the more the cutting edge of the support arm portion 332 is cut. The mold resin body 306 is easily exposed on the surface, and may be exposed in a burr shape with a slight dimensional error. In order to avoid this, it is only necessary to lengthen the support arm portion 332 by further separating the bent portion 328 from the main frame portion 326 and cut the midway position of the support arm portion 332. This increases material loss. In the lead frame 305 of this embodiment, since the concave portion 334 is formed, the support arm portion 332 is cut at a position close to the bent portion 328 as indicated by the arrow in FIG. 47C, for example. It is possible to reduce the waste of materials.

On the other hand, in the dicing process in the direction orthogonal to the row of the lead frames 305, cutting is performed between the connecting arm portions 325 connected to each other by the adjacent lead frames 305, and the connecting arm portions 325 are separated. Formed in individual packages 304.
Then, the outer edge of the peripheral wall portion 353 of the package 304 is formed by both dicing processes along the row direction and the orthogonal direction thereof, and the package 304 having a rectangular shape in plan view can be obtained.

  The semiconductor device 301 manufactured in this way is a surface-mount type, and by soldering the terminal portions 322 to 324 and the external connection surfaces 337 to 340 of the shield plate portion 321 exposed on the back surface thereof to the substrate. Implemented. In this case, as shown in FIGS. 51 and 52, in the semiconductor device 301, a shield plate portion 321 embedded in the bottom plate portion 352 is disposed below the microphone chip 2 and the control circuit chip 3, and this shield plate portion. The microphone chip 2 is connected to the internal connection surface 344 of the reference numeral 321, and the main frame portion 326 integrated with the shield plate portion 321 via the connecting arm portion 325 is covered with the conductive adhesive 366 on the upper end surface of the peripheral wall portion 353. The lid 308 is connected to 308 and covers the microphone chip 2 and the control circuit chip 3. Therefore, the microphone chip 2 and the control circuit chip 3 are surrounded by the shield plate portion 321 and the cover 308, and the external connection surface 340 of the shield plate portion 321 is grounded via the substrate. Thus, the microphone chip 2 and the control circuit chip 3 can be shielded from the external magnetic field.

In this semiconductor device 301, the connecting arm portion 325 that connects the main frame portion 326 exposed to the upper end surface of the peripheral wall portion 353 and the shield plate portion 321 is bent, so that before the connecting arm portion 325 is bent. In the expanded state, the distance between the main frame portion 326 and the shield plate portion 321 is expanded to a dimension corresponding to the expanded length of the connecting arm portion 325, and the connecting arm portion 325 is bent. Thus, the shield plate portion 321 approaches the main frame portion 326 in plan view. In this semiconductor device 301, the main frame portion 326 is provided only at one end portion of the package body 307 and is not formed at the other end portion. Therefore, the shield plate portion 321 can be formed widely up to the vicinity of the support frame 331 in the adjacent row, and this wide shield plate portion 321 enhances the shielding effect and leads to the lead. A package having a larger package size than the entire area of the continuous frame molded body 312 can be formed.
Further, as described above, the concave portion 334 is formed in the vicinity of the connecting portion to the bent portion 328 in the support arm portion 332, the dicing position is arranged close to the bent portion 328, and the connecting arm portion 325 is adjacent to the bent portion 328. The use efficiency of the material can also be increased because the pitch is reduced by the lead frame 305 being connected.
That is, the semiconductor device 301 can reduce the cost because the area of the entire lead frame continuous molded body 312 is less wasteful and the use efficiency of the material is high.

  Also in the tenth embodiment, the acoustic hole may be formed in the bottom plate portion of the package body instead of the lid, and in that case, a cylindrical wall is provided so as to surround the periphery of the through hole with the mold resin. Therefore, it is preferable that the die bond material does not flow into the through hole.

In addition, various modifications can be made without departing from the spirit of the present invention, and the present invention is not limited to the structure described in the above embodiment.
For example, in the above-described embodiment, an example in which the semiconductor device is applied to a microphone package has been shown. Is possible. In this case, in the microphone of the above-described embodiment, a communication hole that communicates the internal space such as the acoustic hole and the outside is necessary. However, depending on the type of sensor, the communication hole may be unnecessary, In some cases, two communication holes are required.
Further, even when applied to a microphone package, when the continuous molded body shown in the tenth embodiment is used, each package is divided into one with the same specifications. A microphone having directivity can be obtained by making the four microphone chips different in sensitivity and separately forming these four in a connected state as one unit.

In addition, the terminal portion has a configuration of four terminals in each embodiment, and is provided for, for example, a power source, an output, a gain, and a ground, but at least a power source, an output, and a ground terminal If there is a part. In that case, two grounding terminal portions may be provided. Further, depending on the semiconductor chip housed inside, the number of terminals may be larger than that of the embodiment. The number of semiconductor chips is not necessarily limited to two.
Moreover, although the terminal part for external ground connection in a shield board part was formed by carrying out half etching of the circumference | surroundings, you may form it by embossing, coining, etc.
In addition, the outer shape of the lead frame is formed by etching, but may be punched by a press. In addition, the position where the internal connection surface of the shield plate part is exposed to the inside is arranged evenly with the other terminal parts as shown in the figure. However, as long as it is on the shield plate part, it may not be the position shown in the figure. Good.
On the other hand, the terminal part connected to the support arm part is formed to have the same thickness from the support arm part to the terminal part in the above embodiment, but the back surface of the support arm part is half-etched to be thinner than the terminal part. May be. In that case, you may make it locally half-etch the connection part with a terminal part instead of the whole support arm part.
Further, the external connection surfaces of the shield plate part and each terminal part have a four-terminal configuration in each embodiment, and are provided for power supply, output, gain, and ground, for example. There should be a connection surface for output, output, and ground. In that case, two ground connection surfaces may be provided. Further, depending on the semiconductor chip housed inside, the number of terminals may be larger than that of the embodiment. The number of semiconductor chips is not necessarily limited to two.
Further, in the example shown in FIG. 4, the concave portion 54 for fitting the terminal portion 15 is formed in the injection mold for molding the molded resin body, but it may be molded with a mold having no concave portion.
Further, in the example shown in FIG. 5, the concave portion 54 for fitting the terminal portion 15 is formed in the injection mold for molding the mold resin body, but the molding may be performed with a mold having no concave portion.

Furthermore, in the press die shown in FIG. 3 and the like of the first embodiment, the upper die is integrated, and the entire lead frame is sandwiched at the lowered position while the connecting arm portion and the support frame portion are bent and formed. However, if the shield plate part can be pushed down with respect to the main frame part, the punching mold for forming the connecting arm part etc. is driven independently of the holding mold for holding the main frame part. It is good also as composition to do.
Further, in the bending process of the present invention, the connecting arm part and the supporting arm part may be processed simultaneously, or only the supporting arm part is bent first, and then the connecting arm part is bent. Also good. In that case, in order to reduce the error between the two processes, an embossing process for adjustment may be provided after the two bending processes.
Further, the lid body is not limited to a flat plate shape but may be slightly drawn.
In addition, the conductive adhesive is applied to the package body and the lid body is bonded, but an adhesive sheet may be attached to the package body to bond the lid body.
In addition, the conductive adhesive is applied to the package body and the lid body is bonded, but an adhesive sheet may be attached to the package body to bond the lid body.
Furthermore, when fixing the lid continuous molded body to the package body continuous molded body via a conductive adhesive, apply the conductive adhesive to the upper end surface of the package body continuous molded body with the peripheral wall facing upward. It is good also as a method of stacking a lid continuous molding, and conversely, a lid continuous molding is arranged in an inverted state, a conductive adhesive is applied to the periphery of each lid, and an inverted state is placed on the lid. It is good also as a method of piling up a package body continuous fabrication object. In the latter case, the conductive adhesive can be reliably prevented from dripping from the peripheral wall portion to the bottom plate portion.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 2 ... Microphone chip (semiconductor chip), 3 ... Control circuit chip (semiconductor chip), 4 ... Package, 5 ... Lead frame, 6 ... Mold resin body, 7 ... Package main body, 8 ... Cover body, 9 Connection frame portion 11 Main frame portion 12 Connection arm portion 13 Shield plate portion 14 Support arm portion 15 Terminal portion 16 Horizontal frame portion 17 Vertical frame portion 18 Recessed portion DESCRIPTION OF SYMBOLS 19 ... Bending part, 20 ... Recessed part, 21 ... Terminal part, 31 ... Bottom wall part, 32 ... Peripheral wall part, 33 ... Opening part, 35 ... Flange part, 41 ... Acoustic hole, 42 ... Internal space, 56 ... Connection frame part , 61 ... Lead frame, 62 ... Slit, 63 ... Package body, 64 ... Mold resin body, 65 ... Rib, 71 ... Connection arm part, 72 ... Hole, 73 ... Wide part, 75 ... Connection arm part, 76 ... Bending , 81 ... Flange part, 82 ... Peripheral wall part, 85 ... Lead frame, 86 ... Bridge part, 91 ... Lead frame, 92 ... Lower hole, 93 ... Projection part, 99 ... Mold resin body, 100 ... Acoustic hole, 101 ... Tube Wall 102, package body 103, package 104, lid body 105, semiconductor device 110, semiconductor device 111, package 112, package body 113, lead frame 114, shield plate 115, mold Resin body, 116 ... window hole, 117 ... small hole, 118 ... acoustic hole, 119 ... wall,
DESCRIPTION OF SYMBOLS 201 ... Semiconductor device, 204 ... Package, 205 ... Lead frame, 205a ... Flat frame member, 206 ... Mold resin body, 207 ... Package main body, 208 ... Cover body, 209 ... Connection frame part, 211 ... Main frame part, 212 ... Connecting arm part, 212d, 212e ... bent part, 213 ... shield plate part, 214 ... support arm part, 215 ... terminal part, 216 ... horizontal frame part, 217 ... vertical frame part, 218 ... concave part, 219 ... bent part, 220 ... notch part, 221 ... terminal part, 231 ... bottom wall part, 232 ... peripheral wall part, 233 ... opening part, 234 ... bonding wire, 235 ... flange part, 241 ... acoustic hole, 242 ... internal space, 256 ... connection frame part 285 ... Lead frame, 286 ... Bridge part, 291 ... Lead frame, 292 ... Pilot hole, 293 ... Projection , 295 ... lead frame, 295a ... flat frame members, 296 ... connecting arm portion, 297 ... slits, 296D, 296E ... bent portion,
DESCRIPTION OF SYMBOLS 301 ... Semiconductor device 304 ... Package, 305 ... Lead frame, 306 ... Mold resin body, 307 ... Package main body, 308 ... Lid body, 311 ... Outer frame part, 312 ... Lead frame continuous molded body (flat frame continuous molded body) 313: Guide hole, 321: Shield plate part, 322 to 324 ... Terminal part, 325 ... Connection arm part, 326 ... Main frame part, 328 ... Bending part, 329 ... Bridge part, 331 ... Support frame part, 332 ... Support Arm part, 333 ... support arm part, 334 to 336 ... concave part, 337 to 340 ... external connection surface, 341 to 344 ... internal connection surface, 350 ... mold resin molding, 351 ... package body continuous molding, 352 ... bottom plate Part, 353 ... peripheral wall part, 354, 355 ... rise wall, 356 ... shelf part, 361 ... lid continuous molded body, 362 ... outer frame part 363 ... connecting frame portion, 364 ... sound hole, 365 ... internal space, 366 ... conductive adhesive,
P ... Cutting line

Claims (26)

A flat frame member for forming a lead frame embedded from a peripheral wall portion to a bottom wall portion of a box-shaped mold resin body in a package body for a semiconductor device,
A main frame portion exposed at an upper end surface of the peripheral wall portion in the mold resin body;
A shield plate portion connected to the main frame portion in a planar shape via a connecting arm portion; and
A bent portion that projects outwardly so that a part of the main frame portion is bent, and a support arm portion that protrudes inward of the main frame portion from a concave portion formed inside the bent portion And a flat frame member for a lead frame, wherein a terminal portion connected to the tip of the support arm portion is formed. A plurality of the connecting arm portions are provided,
Bending portions are arranged at both ends of the connecting arm portions, and the bending portions on the main frame portion side and the bending portions on the shield plate portion side in each connecting arm portion are respectively on lines parallel to each other. The flat frame member for a lead frame according to claim 1, wherein the flat frame member is disposed.   3. The flat frame member for a lead frame according to claim 2, wherein the connecting arm portion is arranged side by side at an opposite edge portion between the main frame portion and the shield plate portion.   The connecting arm portion is provided at a line-symmetrical position via the shield plate portion, and each connecting arm portion has a connection portion to the shield plate portion and the main frame portion as an opposing edge portion thereof. 4. The flat frame member for a lead frame according to claim 3, wherein the flat frame member is provided at a position shifted from a mutually opposed position. A flat frame continuous molded body in which a plurality of flat frame members for a lead frame according to claim 1 are formed in a connected state,
The main frame portion is formed so as to be disposed at one end of the lead frame, and the main frame portion is connected along the row for each row of each flat frame member forming a row in an adjacent state. A flat frame continuous molded body, wherein a support frame portion is formed, and the bent portion projects in a direction perpendicular to a length direction of the row with respect to the main frame.   2. A lead frame for a semiconductor device manufactured using the flat frame member for a lead frame according to claim 1, wherein the connecting arm portion and the support arm portion are bent and deformed, and the shield plate portion and the terminal portion are the main frame. A lead frame for a semiconductor device, wherein the lead frame is pushed down with respect to a frame portion.   7. The lead frame for a semiconductor device according to claim 6, wherein the connecting arm portion is extended and deformed together with the bending.   5. A lead frame for a semiconductor device manufactured using the flat frame member for a lead frame according to claim 2, wherein the connecting arm portion is bent and deformed at the planned bending portion. An intermediate portion between the bent portions is disposed to be inclined, the support arm portion is bent and deformed, and the shield plate portion and the terminal portion are pressed down with respect to the main frame portion. A lead frame for a semiconductor device.   6. A lead frame continuous molded body manufactured using the flat frame continuous molded body according to claim 5, wherein the connecting arm portion and the support arm portion are bent and deformed, and the shield plate portion and the terminal portion are the main frame. A lead frame continuous molded body, wherein the lead frame is in a state of being pressed down with respect to the portion. A method of manufacturing a lead frame for a semiconductor device using the flat frame member for a lead frame according to claim 1,
A method of manufacturing a lead frame for a semiconductor device, wherein the shield plate part and the terminal part are pushed down while the connecting arm part and the support arm part are deformed with respect to the main frame part.   11. The method of manufacturing a lead frame for a semiconductor device according to claim 10, wherein when the connecting arm portion is deformed, the connecting arm portion is bent and deformed together with bending deformation. A method for manufacturing a lead frame for a semiconductor device using the flat frame member for a lead frame according to any one of claims 2 to 4,
The terminal portion is pressed down while the shield plate portion is bent down and the support arm portion is bent and deformed by inclining the intermediate portion while bending the bending portion of the connecting arm portion with respect to the main frame portion. A method of manufacturing a lead frame for a semiconductor device, wherein the lead frame is depressed.   A package body continuous molded body obtained by molding resin in the lead frame continuous molded body according to claim 9 and forming a package body having the bottom plate portion and the peripheral wall portion in a continuous state, and on the upper end surface of the peripheral wall portion. The main frame portion is exposed, at least a part of the upper surface of the terminal portion is exposed on the upper surface of the bottom plate portion, and at least one of the lower surfaces of the terminal portion and the shield plate portion is exposed on the lower surface of the bottom plate portion. A continuous molded body of a package body, wherein each part is exposed. A method of manufacturing a package body for a semiconductor device using the flat frame member for a lead frame according to claim 2,
After pressing down the shield plate part and the terminal part while deforming the connecting arm part and the support arm part with respect to the main frame part, at least a part of the upper surface of the main frame part and both surfaces of the terminal part are provided. A method of manufacturing a package body for a semiconductor device, wherein the mold resin body is molded in an exposed state, and is cut so as to separate a bent portion of the main frame portion protruding from a peripheral edge of the mold resin body.   15. The method of manufacturing a package body for a semiconductor device according to claim 14, wherein when the connecting arm portion is deformed, the connecting arm portion is bent and deformed together with bending deformation. A method for manufacturing a package body for a semiconductor device using the flat frame member for a lead frame according to any one of claims 2 to 4,
By tilting the intermediate portion while bending and deforming the planned bending portion of the connecting arm portion, the shield plate portion is pushed down with respect to the main frame portion, and the terminal while the support arm portion is bent and deformed. The mold resin body is molded with the upper surface of the main frame part and both surfaces of the terminal part exposed at least partially, and the main frame part protruding from the periphery of the mold resin body A method of manufacturing a package body for a semiconductor device, wherein the bent portion is cut so as to be separated.   14. A method of manufacturing a package body for a semiconductor device by cutting the package body continuous molded body according to claim 13, wherein a connection portion to the bent portion in the support arm portion when the outer peripheral edge of the peripheral wall portion is cut. A method of manufacturing a package body for a semiconductor device, comprising a step of cutting in the length direction of the row via a line. At least a part of a lead frame is embedded in a box-shaped mold resin body having a bottom wall portion on which a semiconductor chip is mounted and a peripheral wall portion erected from a peripheral edge portion of the bottom wall portion, and the lead frame includes the peripheral wall A main frame part exposed at the upper end surface of the part, a connecting arm part hanging from the main frame part via the inside of the peripheral wall part, and a shield plate part extending from the lower end of the connecting arm part and embedded in the bottom wall part A package body for a semiconductor device comprising:
In the lead frame, the connecting arm portion is bent and deformed from the main frame portion toward the shield plate portion, and a part of the main frame portion is divided at the peripheral wall portion, and the lead frame is divided A support arm part hanging down from within the peripheral wall part, and a terminal part connected to the lower end of the support arm part are formed,
The package body for a semiconductor device, wherein the terminal portion is exposed at least partially on both surfaces of the bottom wall portion. At least a part of a lead frame is embedded in a box-shaped mold resin body having a bottom wall portion on which a semiconductor chip is mounted and a peripheral wall portion erected from a peripheral edge portion of the bottom wall portion, and the lead frame includes the peripheral wall A main frame part exposed at the upper end surface of the part, a plurality of connecting arm parts that are connected to the main frame part and that hang down via the peripheral wall part, and extend from the lower ends of the connecting arm parts into the bottom wall part A package body for a semiconductor device having an embedded shield plate portion,
The lead frame is bent and deformed at both ends of the connecting arm portion so that the intermediate portion is inclined, and the bent portions on the main frame portion side in each connecting arm portion and the shield plate The bent parts on the part side are arranged on lines parallel to each other,
A part of the main frame part is divided at the peripheral wall part, and a support arm part that hangs down through the peripheral wall part from the part and a terminal part connected to the lower end of the support arm part are formed. ,
The package body for a semiconductor device, wherein the terminal portion is disposed in a notch portion formed in the shield plate portion, and is exposed at least partially on both surfaces of the bottom wall portion.   The package body for a semiconductor device according to claim 19, wherein the connection portion is arranged side by side at an edge of the main frame portion facing the shield plate portion.   The connecting arm portion is provided at a line-symmetrical position via the shield plate portion, and each connecting arm portion has a connection portion to the shield plate portion and the main frame portion as an opposing edge portion thereof. The intermediate portion that is provided at a position deviated from the mutually opposed position and that is connected between the two connection portions is bent and deformed at both ends thereof, and is arranged to be inclined. Item 20. A package body for a semiconductor device according to Item 19.   The semiconductor chip is mounted on each bottom plate portion of the package body continuous molded body according to claim 13, and the lid is fixed to the upper surface of the peripheral wall portion with a conductive adhesive, and then the outer peripheral edge of the peripheral wall portion And cutting the outer peripheral edge of the peripheral wall portion in the length direction of the row via the connecting portion to the bent portion in the support arm portion. A method for manufacturing a semiconductor device, comprising the step of: The semiconductor device package main body according to any one of claims 18 to 21, and an upper end surface of the peripheral wall portion of the semiconductor device package main body fixed to cover an internal space surrounded by the peripheral wall portion. With a lid,
A package for a semiconductor device, wherein the lid is made of a conductive material.   24. The semiconductor device according to claim 23, wherein a semiconductor chip is mounted on the bottom wall portion of the package for a semiconductor device so as to be disposed above the shield plate portion. A microphone package configured using the semiconductor device according to claim 24,
The microphone package, wherein the semiconductor chip is a microphone chip, and an acoustic hole communicating with an internal space is formed in either the lid or the package body. In the bottom plate portion of the package body, a part of the shield plate portion is exposed from the window hole portion formed in the mold resin body, and a plurality of small holes penetrating the shield plate portion are formed in the exposed portion, 26. The microphone package according to claim 25, wherein the acoustic hole is constituted by the small holes.

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