WO2017208747A1 - Aggregate substrate for mounting piezoelectric vibration element thereon, manufacturing method therefor, and manufacturing method for piezoelectric vibrator - Google Patents

Abstract

The present invention comprises: preparing an aggregate substrate (10); and forming through-holes (20) and an electrode layer (400) in the aggregate substrate, wherein the electrode layer includes via electrodes respectively provided in the through-holes, back surface electrodes electrically connected to the via electrodes, a first wiring path and a second wiring path, the via electrodes have first and second via electrodes disposed in a first direction, the first wiring path includes a first extraction electrode provided in a first unit region and leading to a central part of a long side that touches a second unit region, and a second extraction electrode provided in the second unit region and leading to a central part of a long side that touches the first unit region, the first and second via electrodes are electrically insulated from via electrodes disposed in a second direction in a substrate disposition region, and by connecting the first extraction electrode and the second extraction electrode to each other by the central parts of the long sides, the back surface electrode electrically connected to the first via electrode and the back surface electrode electrically connected to the second via electrode are electrically connected to each other.

Description

Aggregate substrate for mounting piezoelectric vibration element, manufacturing method thereof, and manufacturing method of piezoelectric vibrator

The present invention relates to a collective substrate for mounting a piezoelectric vibration element, a manufacturing method thereof, and a manufacturing method of a piezoelectric vibrator.

2. Description of the Related Art Piezoelectric vibrators used for oscillators and bandpass filters are known (see Patent Documents 1 and 2). For example, in Patent Document 1, as a method for manufacturing a substrate for mounting a piezoelectric vibration element in a piezoelectric vibrator, a multi-piece wiring substrate in which a plurality of rectangular individual substrates are generated is the length of each individual substrate. A method is disclosed in which a connection conductor for connecting each electrode across the side and the short side and an annular common conductor frame formed on the outer periphery of the mother board are provided, and an electrolytic plating method is applied to the wiring board.

JP 2000-165004 A JP 2012-222537 A

However, the manufacturing method disclosed in Patent Document 1 has a problem that migration may occur particularly on the short side where the distance between the terminals is short because the end face of the connecting conductor is exposed when the wiring board is cut. On the other hand, according to the electroless plating method, plating can be performed without providing a power supply wiring, and therefore, occurrence of migration can be avoided. However, since the electroless plating method has a slower plating reaction speed than the electrolytic plating method, the processing time becomes longer and the control of the processing becomes complicated. Moreover, since the film thickness of the plated electrode layer to be formed is thinner than that of the electrolytic plating method, the underlying electrode diffuses into the plated electrode layer, and the reliability of electrode conduction is poor.

The present invention has been made in view of such circumstances, and an assembly substrate for mounting a piezoelectric vibration element that improves the reliability of electrodes formed on the substrate, a method for manufacturing the same, and a method for manufacturing a piezoelectric vibrator The purpose is to provide.

According to one aspect of the present invention, there is provided a method of manufacturing a collective substrate for mounting a piezoelectric vibration element, comprising: (a) a substrate arrangement region composed of a plurality of unit regions arranged in a grid pattern in a first direction and a second direction orthogonal to each other; And a peripheral region located outside the substrate arrangement region, and each unit region has a rectangular shape having a long side extending along the first direction and a short side extending along the second direction. Preparing a substrate, (b) forming a through-hole penetrating the front and back surfaces of the collective substrate at the intersection where the boundary lines defining a plurality of unit regions intersect, and (c) electroplating the collective substrate The electrode layer is provided corresponding to the four corners of the unit region on the back surface of the collective substrate and the via electrode provided in the through hole at the intersecting position. Provided at four corners A plurality of via electrodes in the first direction so as to form a back surface electrode electrically connected to the first electrode and a group of via electrodes provided in the substrate arrangement region and electrically connected in the first direction. And a second wiring path that is provided in the peripheral region and electrically connects the group of via electrodes in the second direction, and the plurality of unit regions are arranged in the second direction. A first unit region and a second unit region adjacent to each other, and the plurality of via electrodes are arranged side by side in a first direction on a boundary line between the first unit region and the second unit region An electrode and a second via electrode, wherein the first wiring path is provided in the first unit region and extends to a central portion of a long side contacting the second unit region in the first unit region; A long side provided in the unit area and in contact with the first unit area in the second unit area A first lead electrode and a second via electrode, each of which is electrically connected to each other only in the peripheral region with the other via electrodes arranged side by side in the second direction. In (c), the first extraction electrode and the second extraction electrode are connected to each other at the central portion of the long side, thereby forming the first Electrically connecting the back electrode electrically connected to the via electrode and the back electrode electrically connected to the second via electrode to each other.

According to the above method, each electrode can be electrically connected by the extraction electrode that connects the central part of the long-side boundary line without providing the extraction electrode on the short-side boundary line of each unit region. . For this reason, the occurrence of migration due to the presence of the extraction electrode can be suppressed on the short side of each unit region, and the cut surface of the extraction electrode and the inside of the through hole can be suppressed on the long side of each unit region. Since the distance from the cut surface of the via electrode provided in the is long, the risk of occurrence of migration is reduced. Therefore, the reliability of electrical connection can be improved.

A collective substrate for mounting a piezoelectric vibration element according to one aspect of the present invention includes a plurality of unit regions arranged in a lattice pattern in a first direction and a second direction orthogonal to each other, and each unit region is in a first direction. A rectangular shape having a long side extending along the short side and a short side extending along the second direction, provided in the substrate arrangement region, a peripheral region located outside the substrate arrangement region, and the substrate arrangement region and the peripheral region The electrode layer is a via provided in a through-hole penetrating the front surface and the back surface of the collective substrate at the intersection where the boundary lines defining the plurality of unit regions intersect. An electrode, a back electrode provided corresponding to the four corners of the unit region on the back surface of the collective substrate, and electrically connected to a via electrode provided in the four corners, provided in the substrate placement region, Electrically connected in the first direction A plurality of via electrodes electrically connected in the first direction so as to form a group of via electrodes extending in the first direction and a peripheral region, and the group of via electrodes electrically connected in the second direction. A plurality of unit regions having a first unit region and a second unit region adjacent to each other in the second direction, and the plurality of via electrodes are connected to the first unit region. A first via electrode and a second via electrode arranged in a first direction on a boundary line between the second unit regions, the first wiring path being provided in the first unit region and the first unit region A first extraction electrode reaching the central portion of the long side in contact with the second unit region, and a second extraction electrode provided in the second unit region and reaching the central portion of the long side in contact with the first unit region in the second unit region Each of the first via electrode and the second via electrode in the second direction Other via electrodes arranged side by side are electrically insulated from each other in the substrate arrangement region so as to be electrically connected to each other only in the peripheral region, and the first extraction electrode and the second extraction electrode are respectively long. By being connected to each other at the central portion of the side, the back electrode electrically connected to the first via electrode and the back electrode electrically connected to the second via electrode are electrically connected to each other.

According to the above configuration, the boundary line on the short side of each unit region does not have an extraction electrode, and the electrodes are electrically connected by the extraction electrode that connects the center of the boundary line on the long side. For this reason, the occurrence of migration due to the presence of the extraction electrode can be suppressed on the short side of each unit region, and the cut surface of the extraction electrode and the inside of the through hole can be suppressed on the long side of each unit region. Since the distance from the cut surface of the via electrode provided in the is long, the risk of occurrence of migration is reduced. Therefore, the reliability of electrical connection can be improved.

According to the present invention, it is possible to provide a collective substrate for mounting a piezoelectric vibration element in which reliability of an electrode formed on the substrate is improved, a method for manufacturing the same, and a method for manufacturing a piezoelectric vibrator.

FIG. 1 is an exploded perspective view of the piezoelectric vibrator according to the first embodiment of the present invention. FIG. 2 is a plan view of the first surface of the substrate according to the first embodiment of the present invention. FIG. 3 is a plan view of the second surface of the substrate according to the first embodiment of the present invention. FIG. 4 is a flowchart showing the method for manufacturing the aggregate substrate according to the first embodiment of the present invention. FIG. 5 is a diagram showing the procedure of the method for manufacturing the aggregate substrate according to the first embodiment of the present invention. FIG. 6A is a diagram illustrating the procedure of the method for manufacturing the aggregate substrate according to the first embodiment of the present invention. FIG. 6B is a diagram illustrating the procedure of the method for manufacturing the aggregate substrate according to the first embodiment of the present invention. FIG. 6C is a diagram illustrating a procedure of the manufacturing method of the collective substrate according to the first embodiment of the present invention. FIG. 6D is a diagram illustrating a procedure of the manufacturing method of the collective substrate according to the first embodiment of the present invention. FIG. 6E is a diagram illustrating a procedure of the manufacturing method of the collective substrate according to the first embodiment of the present invention. FIG. 7 is a plan view of the first surface of the collective substrate according to the first embodiment of the present invention. FIG. 8 is a plan view of the second surface of the collective substrate according to the first embodiment of the present invention. FIG. 9 is a flowchart showing the method for manufacturing the piezoelectric vibrator according to the first embodiment of the invention. FIG. 10 is a plan view of the first surface of the collective substrate according to the modification of the first embodiment of the present invention. FIG. 11 is a plan view of the first surface of the collective substrate according to the second embodiment of the present invention. FIG. 12 is a plan view of the second surface of the collective substrate according to the second embodiment of the present invention.

Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are exemplary, the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as being limited to the embodiments.

== First Embodiment ==
<Piezoelectric vibrator>
The piezoelectric vibrator 1 according to this embodiment will be described with reference to FIGS. FIG. 1 is an exploded perspective view of the piezoelectric vibrator according to the first embodiment of the present invention, FIG. 2 is a plan view of the first surface of the substrate according to the first embodiment of the present invention, and FIG. FIG. 3 is a plan view of a second surface of the substrate according to the first embodiment of the present invention.

As shown in FIG. 1, the piezoelectric vibrator 1 according to the present embodiment includes a piezoelectric vibration element 100, a lid member 200, and a substrate 300. The lid member 200 and the substrate 300 are part of the structure of a holder (case or package) for housing the piezoelectric vibration element 100.

The piezoelectric vibration element 100 is also referred to as a “first excitation electrode 120 and a second excitation electrode 130” (hereinafter referred to as “excitation electrodes 120”), and excitation electrodes (Excitation Electrodes) 120 and 130 provided on the front and back surfaces of the piezoelectric substrate 110. .). The first excitation electrode 120 is provided on the first surface 112 that is the main surface of the piezoelectric substrate 110, and the second excitation electrode 130 is provided on the second surface 114 that is the main surface facing the first surface 112 of the piezoelectric substrate 110. Is provided.

The piezoelectric substrate 110 is formed from a given piezoelectric material, and the material is not particularly limited. In the example shown in FIG. 1, the piezoelectric substrate 110 has a trigonal crystal system and is made of a quartz material having a predetermined crystal orientation. That is, the piezoelectric vibrating element 100 may be a quartz vibrating element (Quartz Crystal Resonator) having a quartz piece (Quartz Crystal Element) made of a quartz material. The piezoelectric substrate 110 is, for example, an AT-cut crystal piece. The AT-cut crystal piece is 35 degrees 15 minutes ± 1 in the direction from the Y-axis to the Z-axis around the X-axis among the X-axis, Y-axis, and Z-axis which are crystal axes of the artificial quartz. When the axes rotated for 30 minutes are defined as the Y ′ axis and the Z ′ axis, respectively, they are planes specified by the X axis and the Z ′ axis (hereinafter referred to as “XZ ′ planes”. The same applies to the surface.) The surface parallel to the main surface is cut out. The X axis, the Y ′ axis, and the Z ′ axis are orthogonal to each other. In the example shown in FIG. 1, the piezoelectric substrate 110, which is an AT-cut crystal piece, has a long side parallel to the Z ′ axis, a short side parallel to the X axis, and a side in the thickness direction parallel to the Y ′ axis. And has a substantially rectangular shape in plan view of the XZ ′ plane. A piezoelectric vibration element using an AT-cut crystal piece has high frequency stability over a wide temperature range, and can be manufactured with excellent temporal change characteristics. In addition, the piezoelectric vibration element using the AT-cut crystal piece includes a thickness shear vibration mode (Thickness Shear Mode) as a main vibration. Hereinafter, each configuration of the piezoelectric vibrator 1 will be described with reference to the AT cut axial direction.

The piezoelectric substrate is not limited to the above configuration, and for example, an AT cut crystal piece having a long side parallel to the X axis and a short side parallel to the Z ′ axis may be applied. Alternatively, as long as the main vibration includes the thickness shear vibration mode, a crystal piece having a different cut (for example, a BT cut) other than the AT cut may be used. The material of the piezoelectric substrate is not limited to quartz, and other piezoelectric materials such as piezoelectric ceramic (for example, PZT) and zinc oxide may be used. Further, the piezoelectric vibration element may be, for example, a MEMS (Micro Electro Mechanical Systems), and specifically, Si-MEMS in which a MEMS is formed on a silicon substrate may be used. Further, the piezoelectric vibrating _element, AlN, LiTaO _{3, LiNbO} 3, a given piezoelectric material such as PZT may be a piezoelectric MEMS used.

The first excitation electrode 120 is formed at the center of the first surface 112 of the rectangular piezoelectric substrate 110, and the second excitation electrode 130 is formed at the center of the second surface 114 of the piezoelectric substrate 110. The first excitation electrode 120 and the second excitation electrode 130 are disposed as a pair of electrodes so that substantially the whole overlaps when the XZ ′ plane is viewed in plan.

The piezoelectric substrate 110 has a connection electrode 124 electrically connected to the first excitation electrode 120 via the extraction electrode 122, and a connection electrode 134 electrically connected to the second excitation electrode 130 via the extraction electrode 132. And are formed. Specifically, the extraction electrode 122 is extracted from the first excitation electrode 120 toward the short side on the Z′-axis negative direction side on the first surface 112, and further passes through the side surface on the X-axis negative direction side of the piezoelectric substrate 110. , Connected to the connection electrode 124 formed on the second surface 114. On the other hand, the extraction electrode 132 is extracted from the second excitation electrode 130 toward the short side of the Z′-axis negative direction on the second surface 114 and connected to the connection electrode 134 formed on the second surface 114. The pair of connection electrodes 124 and 134 is disposed along the short side of the Z′-axis negative direction, and is electrically held and mechanically held by the substrate 300 via the conductive holding members 340 and 342. The arrangement and pattern shape of the connection electrodes 124 and 134 and the extraction electrodes 122 and 132 are not limited, and can be appropriately changed in consideration of electrical connection with other members.

In each of the electrodes including the first excitation electrode 120 and the second excitation electrode 130, for example, a chromium (Cr) layer is formed on the surface of the piezoelectric substrate 110 to increase the bonding force, and a gold layer is formed on the underlying surface of the chromium layer. It is configured by forming an (Au) layer. The material is not limited.

The lid member 200 has a recess that opens to face the first surface 302 (front surface) of the substrate 300. In the present embodiment, the lid member 200 only needs to have a shape capable of accommodating the piezoelectric vibration element 100 in the internal space when mounted on the substrate 300, and the shape is not particularly limited. . The material of the lid member 200 is not particularly limited, but may be made of a conductive material such as metal. According to this, a shield function can be added by electrically connecting the lid member 200 to the ground potential. Alternatively, the lid member 200 may have a composite structure of an insulating material or a conductive material / insulating material.

The substrate 300 supports the piezoelectric vibration element 100 so that it can be excited. In the example shown in FIG. 1, the piezoelectric vibration element 100 is supported on the first surface 302 (front surface) of the substrate 300 via the conductive holding members 340 and 342 so as to be excited.

In the example shown in FIG. 1, the substrate 300 has a long side parallel to the Z′-axis, a short side parallel to the X-axis, and a side in the thickness direction parallel to the Y′-axis. It has a substantially rectangular shape in plan view. The substrate 300 is made of, for example, a single layer of insulating ceramic. As another embodiment, the substrate 300 may be formed by stacking and firing a plurality of insulating ceramic sheets. Alternatively, the substrate 300 is made of a glass material (for example, silicate glass or a material mainly composed of materials other than silicate and having a glass transition phenomenon due to a temperature rise), a crystal material (for example, an AT-cut crystal) or You may form with the glass epoxy resin etc. which impregnated the epoxy resin to the glass fiber. The substrate 300 is preferably made of a heat resistant material. The substrate 300 may be a single layer or a plurality of layers. In the case of a plurality of layers, the substrate 300 may include an insulating layer formed on the outermost layer of the first surface 302. The substrate 300 may have a flat plate shape, or may have a concave shape opened in a direction facing the lid member 200. Details of the manufacturing method of the substrate 300 will be described later.

As shown in FIG. 2, an electrode pattern 310 composed of a plurality of electrodes is formed on the first surface 302 (front surface) of the substrate 300. The electrode pattern 310 includes connection electrodes 320 and 322, extraction electrodes 320 a and 322 a that are extracted from the connection electrodes 320 and 322 toward the outer edge of the first surface 302, and long sides of the first surface 302 from the extraction electrodes 320 a and 322 a. And lead electrodes 350 and 352 and dummy electrodes 324 and 326 which are led out toward the head.

The connection electrode 320 of the piezoelectric vibration element 100 is connected to the connection electrode 320 that transmits the excitation signal via the conductive holding member 340, while the connection electrode 322 that transmits the excitation signal is connected to the conductive holding member 342. The connection electrode 134 of the piezoelectric vibration element 100 is connected via For example, the conductive holding members 340 and 342 are formed by thermally curing a conductive adhesive. The extraction electrode 320 a is extracted from the connection electrode 320 to the vicinity of the via electrode 330 provided at any one corner of the substrate 300. The extraction electrode 322 a is extracted along the Z′-axis direction from the connection electrode 322 toward the via electrode 332 provided at the corner of the substrate 300 at the diagonal position of the via electrode 330. The extraction electrode 350 is extracted from the extraction electrode 320a (electrically connected to the connection electrode 320) toward the Z′-axis positive direction side to the vicinity of the center in the Z′-axis direction, and the long side on the X-axis negative direction side It is pulled out to touch the center of The extraction electrode 352 is extracted from the vicinity of the central portion in the Z′-axis direction of the extraction electrode 322a (electrically connected to the connection electrode 322) so as to be in contact with the central portion of the long side on the X-axis positive direction side. . The extraction electrodes 350 and 352 are electrodes (first wiring paths) for an electrolytic plating method to be described later.

In this embodiment, dummy electrodes 324 and 326 (or floating electrodes) are formed on the remaining corners (corners other than the corners where the extraction electrodes 320a and 322a electrically connected to the connection electrodes 320 and 322 are disposed). Is called). The dummy electrodes 324 and 326 are electrodes that are not electrically connected to either the first excitation electrode 120 or the second excitation electrode 130 and are formed of the same conductive material as the other electrodes. The dummy electrode may be connected to a terminal provided on a mounting substrate (not shown) on which the piezoelectric vibrator 1 is mounted. By forming such a dummy electrode, it becomes easy to apply a conductive material for forming the external electrode.

Via electrodes 330, 332, 334, and 336 are formed on end surfaces of the respective corners of the substrate 300 (see FIG. 1). In the example shown in FIG. 1, the extraction electrode 320a is connected to a via electrode 330 formed at a corner on the X-axis negative direction and the Z′-axis negative direction side, and the extraction electrode 322a is connected to the X-axis positive direction and the Z′-axis positive direction. It is connected to a via electrode 332 formed at a corner on the direction side. The dummy electrodes 324 and 326 are connected to the via electrodes 334 and 336 at the remaining corners, respectively.

In the example shown in FIG. 1, the corner portion of the substrate 300 has a cut-out side surface that is formed by cutting a part of the corner portion into a cylindrical curved surface shape (also referred to as a castellation shape). 332, 334, and 336 are continuously formed over such a cut-out side surface and the second surface 304 (back surface). The side surface corresponds to an inner wall of a through hole described later (see FIG. 7). Note that the shape of the corner of the substrate 300 (that is, the inner wall of the through hole) is not limited to this, and the shape of the notch may be a flat shape.

As shown in FIG. 3, an electrode pattern 312 composed of a plurality of electrodes is formed on the second surface 304 (back surface) of the substrate 300. The electrode pattern 312 includes a plurality of external electrodes (back surface electrodes) 360, 362, 364, 366.

The external electrodes 360, 362, 364, 366 are formed in the vicinity of each corner on the second surface 304 of the substrate 300, are each drawn out toward the corner, and are via electrodes formed on the end surfaces of the corner. 330, 332, 334, 336 are electrically connected. As a result, the external electrodes 360, 362, 364, and 366 can be electrically connected to the electrodes on the first surface 302 side of the substrate 300 via the via electrodes 330, 332, 334, and 336.

Specifically, the external electrode 360 is disposed at the corners on the X-axis negative direction and the Z′-axis negative direction side, and the external electrode 362 is disposed at the corners on the X-axis positive direction and the Z′-axis positive direction side, The first surface 302 of the substrate 300 is electrically connected to the first excitation electrode 120 and the second excitation electrode 130 via the connection electrodes 320 and 322. The external electrodes 364 are disposed at corners on the X-axis negative direction and the Z′-axis positive direction side, and the external electrodes 366 are disposed at corners on the X-axis positive direction and the Z′-axis negative direction side. The first surface 302 is electrically connected to the dummy electrodes 324 and 326. That is, the external electrodes 364 and 366 are not electrically connected to the first excitation electrode 120 and the second excitation electrode 130 of the piezoelectric vibration element 100, and are, for example, grounding electrodes to which a ground potential is supplied from the outside. Also good. When the lid member 200 is made of a conductive material, the lid member 200 can be added with a shielding function by electrically connecting the lid member 200 to the external electrodes 364 and 366 that are grounding electrodes. In addition, by forming external electrodes at all corners, the processing step for electrically connecting the piezoelectric vibrator 1 to another member is facilitated.

In addition, each structure of the connection electrode of the board | substrate 300, an extraction electrode, and an external electrode is not limited to the above-mentioned example, It can apply in various deformation | transformation. For example, in the example shown in FIG. 1, the piezoelectric vibration element 100 has one end (the end on the side where the conductive holding members 340 and 342 are disposed) as a fixed end and the other end as a free end. The connection electrodes 320 and 322 are arranged on different sides on the first surface 302 of the substrate 300, such that one is formed on the Z′-axis positive direction side and the other is formed on the Z′-axis negative direction side. Also good. In such a configuration, the piezoelectric vibration element 100 is supported by the substrate 300 at both one end and the other end in the longitudinal direction. Further, the external electrode is not limited to a rectangular shape, and may be another shape such as a circle or a polygon.

By joining both the lid member 200 and the substrate 300 through the bonding material 250, the piezoelectric vibration element 100 is hermetically sealed in an internal space (cavity) surrounded by the recess of the lid member 200 and the substrate 300. Stopped. In this case, it is preferable that the pressure in the internal space is a vacuum state lower than the atmospheric pressure, thereby reducing a change with time due to oxidation of the first excitation electrode 120 and the second excitation electrode 130.

The bonding material 250 is provided over the entire circumference of the lid member 200 and the substrate 300, and is interposed between the side wall portion of the lid member 200 and the first surface 302 of the substrate 300. The bonding material 250 may be made of an insulating material. The insulating material may be a glass adhesive material such as low-melting glass (for example, lead borate or tin phosphate) or a resin adhesive. According to these insulating materials, the cost is lower than that of metal bonding, the heating temperature can be suppressed, and the manufacturing process can be simplified.

With the above configuration, in the piezoelectric vibrator 1, an alternating electric field is applied between the pair of first excitation electrode 120 and second excitation electrode 130 in the piezoelectric vibration element 100 via the external electrodes 360 and 362 of the substrate 300. The Accordingly, the piezoelectric substrate 110 vibrates in vibration modes including the thickness shear vibration mode, and resonance characteristics associated with the vibration are obtained.

<Aggregate substrate for mounting piezoelectric vibration element and method for manufacturing the same>
Next, the collective substrate and the manufacturing method thereof according to the first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 4 is a flowchart showing a manufacturing method of the collective substrate according to the first embodiment of the present invention, and FIGS. 5 and 6A to 6E show the manufacture of the collective substrate according to the first embodiment of the present invention. FIG. 7 is a plan view of the first surface of the collective substrate according to the first embodiment of the present invention, and FIG. 8 is a plan view of the collective substrate according to the first embodiment of the present invention. It is a top view of 2 surfaces. 6A to 6E are cross-sectional views in the same direction as the cross-sectional view taken along the line VI-VI in FIG. 5 for each process.

First, the collective substrate 10 is prepared (S10 in FIG. 4). The collective substrate 10 is a substrate for forming a plurality of individual substrates. Each of the plurality of individual substrates can be applied as a substrate 300 for mounting the piezoelectric vibration element 100 in the piezoelectric vibrator 1 described above. The material of the collective substrate 10 can be the same material as the substrate 300 described above. As shown in FIG. 5, the collective substrate 10 has a substantially rectangular shape having sides parallel to the X axis and the Z ′ axis, and has sides in the thickness direction parallel to the Y ′ axis. Further, the collective substrate 10 has a first surface 12 (front surface) parallel to the XZ ′ surface on the Y′-axis positive direction side and a second surface 14 (back surface) parallel to the XZ ′ surface on the Y′-axis negative direction side. Have. The collective substrate 10 has a substrate placement region Rin at the center in the plan view of the XZ ′ plane, and has a peripheral region Rout at the outer edge of the substrate placement region Rin (see FIG. 5).

A plurality of (for example, M × N (M, N: natural numbers)) individual substrates P _1,1 , P _1,2 ,..., P _{M, N} (hereinafter, these pieces) A plurality of unit regions corresponding to a region where P _{m, n} (m = 1, 2,..., M; n = 1, 2,..., N) is formed as a single substrate. r _1,1 , r _1,2 ,..., r _{M, N} (hereinafter, these unit areas are collectively referred to as rm _{, n} (m = 1, 2,..., M; n = 1, 2). , ..., N))). Each of the unit regions rm _{, n} has a substantially rectangular shape having a long side parallel to the Z ′ axis (first direction) and a short side parallel to the X axis (second direction). Are arranged in a grid in the direction and the X-axis direction. Here, in this specification, a mode in which the long side and the short side of the unit region are parallel to the corresponding axes will be described as an example, but the present invention is not limited to this, and the unit region As long as each side extends along the axis, it is not limited to a mode in which the sides are strictly parallel to the axis. This also applies to the relationship between each side and axis of the piezoelectric substrate 110, the substrate 300, and the collective substrate 10 already described. 5 to 12, the case where there are nine unit areas (M = 3; N = 3) will be described as an example for convenience of explanation. However, the number of unit areas is not limited to this. The peripheral region Rout is a region where the individual substrates P _{m, n} are not formed.

Next, as shown in FIGS. 5 and 6A, a plurality of through holes 20 _1,1 , 20 _1,2 ,..., 20 penetrating from the first surface 12 to the second surface 14 are formed in the collective substrate 10. _{M + 1, N + 1} (hereinafter, these through holes are collectively referred to as 20 _{k, l} (k = 1, 2,..., M + 1; l = 1, 2,..., N + 1)). (S20 in FIG. 4). The through holes 20 _{k, l} are formed in the substrate arrangement region Rin of the collective substrate 10 at intersections where the boundary lines defining the unit regions rm _{, n} intersect, and in the Z′-axis direction and the X-axis direction. Arranged in a grid. That is, the through hole _{20 k, l} is being formed at the four corners of each unit region, four unit regions adjacent (e.g., to the through hole _{20 2,2,} unit regions _r 1, _{1, r 1, 2,} r _2,1 , r _2,2 ). The shape of the through hole is not particularly limited, but may be a substantially cylindrical shape, for example.

Next, as shown in FIG. 6B, the conductive paste 30 is screen-printed on the first surface 12 and the second surface 14 of the collective substrate 10 and the inside of the through holes _{20k, l} (S30 in FIG. 4). Thereby, the foundation | substrate of the electrode layer 400 with which the aggregate substrate 10 is provided is formed. Further, in the through holes 20 _{k, l} formed in the collective substrate 10, the conductive paste 30 (hereinafter simply referred to as via electrode) corresponding to the via electrodes 330, 332, 334, 336 formed on the side surface of the substrate 300 described above. (Referred to as FIG. 6B). By providing the via electrode in the through holes 20 _{k, l} , the conductive paste 30 formed on the first surface 12 of the collective substrate 10 and the conductive paste 30 formed on the second surface 14 become the through holes 20 _{k. , L} are electrically connected via via electrodes. The material of the conductive paste is not particularly limited. For example, silver (Ag), silver palladium (AgPd), or the like can be used. Note that the method for forming the electrode layer is not limited to the paste method by screen printing, and an etching resist method, a photoresist method, or the like may be used. Details of the arrangement of the conductive paste will be described later.

Next, as shown in FIG. 6C, a part of the conductive paste filled in the through holes of the collective substrate 10 is sucked to form a cylindrical conductive paste in the through holes of the collective substrate 10 (FIG. 4). S40). A conductive paste having a through hole 22 at the center in the through hole 20 of the collective substrate 10 penetrates from the first surface 12 to the second surface 14 of the collective substrate 10, so that the subsequent electrolytic plating method (S 60 in FIG. 4). The surface of the through hole 22 of the conductive paste can also be plated.

Next, the conductive paste is fired (S50 in FIG. 4). Thereby, a sintered electrode layer is formed.

Next, as shown in FIG. 6D, the collective substrate 10 is subjected to an electrolytic plating method to form a plating electrode layer 50 on the conductive paste (S60 in FIG. 4). In the electrolytic plating method, the collective substrate 10 is immersed in a plating solution 42 provided in the plating tank 40, and a probe 44 or the like is brought into contact with a later-described wiring path formed in the peripheral region Rout of the collective substrate 10 to apply a voltage. Including that. Thus, the upper plating electrode layer 50 is formed on the surface of the underlying conductive paste 30 formed on the collective substrate 10, and the conductive paste 30 is covered with the plating electrode layer 50 (see FIG. 6E). The material of the plating electrode layer is not particularly limited. For example, nickel (Ni) and gold (Au) may be formed in this order. In this case, the electrode layer 400 formed on the collective substrate 10 has, for example, a three-layer structure of Ag, Ni, and Au.

Next, the arrangement of the electrode layers 400 formed on the collective substrate 10 will be described in detail with reference to FIGS. 7 and 8. In the substrate arrangement region Rin on the first surface 12 side of the collective substrate 10, an electrode layer corresponding to the electrode pattern 310 formed on the first surface 302 of the substrate 300 described above (hereinafter, referred to as “unit layer rm _{, n”)} Simply referred to as an electrode pattern) is formed continuously in a lattice pattern (see FIGS. 2 and 7). Further, in the substrate arrangement region Rin on the second surface 14 side of the collective substrate 10, an electrode layer (corresponding to the electrode pattern 312 formed on the second surface 304 of the substrate 300 described above is provided for each unit region rm _{, n.} Hereinafter, the electrode pattern is also simply formed in a lattice pattern (see FIGS. 3 and 8). In the present embodiment, an electrode layer corresponding to the wiring path for the electrolytic plating method is formed in the peripheral region Rout on the first surface 12 side of the collective substrate 10 (see FIG. 7).

In the following, of the electrode layers formed on the aggregate substrate 10 before being separated into individual substrates P _{m, n} , the state after being separated (corresponding to the substrate 300 shown in FIG. 1). For convenience of explanation, the electrode layer corresponding to the electrode pattern will be described using the reference numerals used in the description in the state after being separated into pieces, and the subscripts indicating the unit regions. For example, the electrode layer formed in the unit region r _{i, j} (i = 1, 2,..., M; j = 1, 2,..., N) (corresponding to the individual substrate P _{i, j} ). Of these, the electrode layer corresponding to the connection electrode 320 shown in FIG. 2 is referred to as connection electrode 320 _{i, j} .

First, the first surface 12 of the collective substrate 10 will be described. Focusing on each unit region, through holes 20 _{i, j} , 20 _{i + 1, j + 1} , 20 _{i + 1, j} , 20 _{i, j + 1} are formed at the four corners of the unit region r _{i, j} . Each through hole has a via electrode formed therein, and the unit region r _{i, j} has a lead electrode or a dummy electrode electrically connected to the corresponding via electrode among the via electrodes at the four corners. Is formed.

Specifically, the unit region _{r i,} the _j, the through-hole _{20 i,} the extraction electrode 320a _i, which is electrically connected to the via electrodes of _j, and _j, the unit region _{r i,} the center of XZ' surface of _j through holes _{20 i, j} through hole ₂₀ of the opposite side to the _{i + 1, j + 1} of the lead electrode 322a _i, which is electrically connected to the via _electrode, and a _j is provided as a reference. Each extraction electrode 320 a _{i, j} , 322 a _{i, j} is extracted until reaching the connection electrodes 320, 322 (see FIG. 2) for mounting the piezoelectric vibration element 100. The extraction electrode 320a _{i, j} is electrically connected to the extraction electrode 350 _{i, j} reaching the center of one long side of the unit region r _{i, j} , and the extraction electrode 322a _{i, j} has a unit The extraction electrodes 352 _{i, j} reaching the center of the other long side of the region r _{i, j} are electrically connected. The extraction electrode 350 _{i, j} and the extraction electrode 352 _{i, j} are portions extending in the X-axis direction.

Further, the unit region r _{i, j} is electrically connected to the dummy electrode 324 _{i, j} electrically connected to the via electrode of the through hole 20 _{i + 1, j and} the via electrode of the through hole 20 _{i, j + 1.} Dummy electrodes 326 _{i, j} are provided. Each dummy electrode 324 _{i, j} , 326 _{i, j} is provided near the corresponding corner.

In the collective substrate 10, the configuration of the unit regions described above is such that each unit region has the same direction in the first direction (Z′-axis direction in FIG. 7) and the second direction (X-axis direction in FIG. 7). Arranged in a grid pattern.

When attention is paid to each through hole, for example, the through hole 20 _{i, j} has four unit regions r _{i, j} , r _{i−1, j−1} , r _{i−1, j} , r _{i, j} adjacent to each other. _-1 is formed at an intersecting position where the boundary lines dividing _-1 intersect, and each of the four unit regions is surrounded by electrodes (surface via surrounding electrodes). Specifically, with respect to the via electrode formed in the through hole 20 _{i, j} , the extraction electrode 320a _{i, j} (first portion) of the unit region r _{i, j} and the extraction electrode 320a _{i, j} The extraction electrodes 322a _{i-1, j-1} (second portion) of the unit regions r _{i−1, j-1 and} the dummy electrodes 324 _i−1 of the unit regions r _{i−1, j} that are opposed to each other with the via electrode interposed therebetween. _{, J} (third portion) and the dummy electrodes 326 _{i, j-1} (fourth portion) of the unit region r _{i, j-1} facing the dummy electrode 324 _{i−1, j} across the via electrode. Provided and electrically connected to each other (see FIG. 7).

Next, attention is focused on the unit region r _{i, j} (first unit region) and the unit region r _{i, j-1} (second unit region) adjacent in the X-axis direction (second direction). Unit region _{r i,} in _j, the connection electrode _{320 i, j} and the extraction electrode 320a _i, lead electrodes _{350 i} electrically connected through a _{j, j} (first extraction electrode), the unit region _{r i, j} Are drawn in the Z′-axis positive direction toward the central part of the long side in contact with the unit region r _{i, j−1} , bent into an L shape, and drawn in the X-axis negative direction. Also, the unit region _{r i,} the unit area adjacent to the X-axis negative direction side of the _{j r i,} in _j-1, the connection electrode _{322 i, j-1} and the extraction electrode _{322a i, j-1} electrically via The extraction electrode 352 _{i, j-1} (second extraction electrode) to be connected is formed by being extracted toward the central portion of the long side in contact with the unit region r _{i, j} in the unit region r _{i, j−1} . . That is, the extraction electrode 350 _{i, j} and the extraction electrode 352 _{i, j-1} are formed to be connected to each other at the center of the boundary line between the unit region r _{i, j} and the unit region r _{i, j-1.} (See FIG. 7).

The construction described above, the via electrode (first via electrode) provided in the through-hole _{20 i,} in _j, the extraction electrode 320a _{i, j,} the connection electrode _{320 i, j,} the extraction electrode _{350 i, j,} the extraction electrode 352 _It is electrically connected to a via electrode (second via electrode) provided in the through hole 20 _{i + 1, j} through _{i, j-1} and extraction electrode 322a _{i, j-1} . The dummy electrodes 324 _{i, j} , 326 _{i, j−1} are also electrically connected to the via electrodes provided in the through holes 20 _{i + 1, j} , 20 _{i, j} , respectively. In this way, via electrodes (a group of via electrodes) provided in the through holes 20 _{1, j} , 20 _{2, j} ,..., 20 _{M + 1, j} arranged in the Z′-axis direction are aggregated substrates. extraction electrode ₃₅₀ 1 provided on the first surface 12 on the _{10, j, 350 2, j} , ···, 350 M, j and the lead electrodes _{352 1, j-1, 352} 2, j-1, ·· .., 352 _{M, j−1} (first wiring path) and are electrically connected to each other across the unit region in the substrate placement region Rin, and the electrode group 60 _h (h = 1, 2,..., N + 1) ) (60 _j in FIG. 7). The via electrodes provided in the through holes 20 _{i, 1} , 20 _{i, 2} ,..., 20 _{i, N + 1} arranged side by side in the X-axis direction (second direction) are connected to the substrate arrangement region Rin ( Including the front surface and the back surface)) is not electrically connected. For example, a via electrode provided in the through-hole _{20 i,} in _j, the through-hole _{20 i, j-1} and the through-hole _{20 i,} the via electrodes provided in the _{j + 1,} to each other in the circuit-board placement region Rin electric Is electrically insulated.

In the present embodiment, the dummy electrodes 324 _{i−1, j} and the dummy electrodes 326 _{i, j−1} are the extraction electrodes 320 a _{i, j} and the extraction electrodes 322 a _{i−1 with} respect to the through holes 20 _{i, j} . _{, J−1} , the area of the XZ ′ plane in plan view may be smaller.

An electrode layer for electrically connecting the electrode groups 60 _h to each other is formed in the peripheral region Rout on the first surface 12 side of the collective substrate 10. The electrode layer includes a wiring path 32 (second wiring path) and a wiring path 34. In the present embodiment, the wiring path 32 is formed in a frame shape over the entire circumference in the peripheral region Rout on the first surface 12 side. Specifically, the wiring path 32 formed on the side on the negative side of the Z′-axis has through- holes 20 _1,1 , 20 _1,2 ,... Arranged on the negative side of the Z′-axis on the first surface 12. .., 201, the wiring path 32 electrically connected to the via electrode provided in _{N + 1} and formed on the side on the Z′-axis positive direction side is on the Z′-axis positive direction side on the first surface 12. , 20 _{M + 1, N + 1} are electrically connected to via electrodes provided in the arranged through holes 20 _{M + 1,1} , 20 _{M + 1} , _{2 ,.} Thereby, the electrode groups 60 _h arranged in the X-axis direction are electrically connected to the wiring path 32 at both ends thereof. That is, the electrode groups 60 _h are not electrically connected to each other in the substrate arrangement region Rin, but are electrically connected to each other via the wiring path 32 in the peripheral region Rout. Of the electrode layers formed in the substrate arrangement region Rin, the electrode layers arranged at the end on the X axis positive direction side or the negative direction side are respectively formed on the sides on the X axis positive direction side or the negative direction side. Connected to the wiring path 32. Therefore, all the electrode layers formed on the first surface 12 of the collective substrate 10 are electrically connected. The wiring path 34 is a wiring path for applying a voltage to the wiring path 32 in the electrolytic plating method (S60 in FIG. 4). Specifically, the wiring path 34 has a predetermined region (that is, a contact surface of a probe or the like) at corners of the first surface 12 of the collective substrate 10 (for example, both corners on the X axis positive direction side). Further, the wiring path 34 is drawn and formed so as to be connected to a part of the wiring path 34 (for example, the central part in the X-axis direction among the wiring paths 32 formed on both sides on the Z′-axis positive / negative direction side). Thereby, in the electroplating method (S60 in FIG. 4), by bringing a probe or the like into contact with the wiring path 34, a voltage is applied to all the conductive pastes, and a plating process can be performed. Note that by wiring path 34 is connected to the central portion in the X-axis direction of the wiring path 32, the distance from the contact surface of the probe to the electrode group 60 _h becomes more uniform, the plating unevenness in the plating process reduced Is done.

In the present embodiment, the wiring path 32 is formed in a frame shape (for example, a rectangular frame shape) over the entire circumference of the first surface 12 in the peripheral region Rout of the collective substrate 10. The arrangement of the path is not limited to this, and any electrode group 60 _h may be formed so as to be electrically connected by the wiring path. For example, the wiring path may be formed only on both sides of the Z′-axis positive direction side and the negative direction side in the peripheral region Rout.

Next, the second surface 14 of the collective substrate 10 will be described. When attention is paid to each unit region, for example, the external electrodes 360 _{i, j} , 362 _{i, j} , 364 _{i, j} , 366 _{i, j} (back electrodes) formed at the four corners of the unit region r _{i, j} are respectively The through- holes 20 _{i, j} , 20 _{i + 1, j + 1} , 20 _{i + 1, j} , 20 _{i, j + 1} formed at the four corners are electrically connected to via electrodes. Further, when attention is paid to each through hole, for example, the through hole 20 _{i, j} has four regions r _{i, j} , r _{i−1, j−1} , r _{i−1, j} , r _{i, j−} adjacent to each other. _One boundary line is formed at an intersecting position, and is surrounded by external electrodes (backside electrodes) included in the four regions. Specifically, through holes _{20 i,} against the via electrodes formed in _j, the unit region _{r i,} the external electrodes _{360 i} of _j, and _j, the unit region _{r i-1, j-1} of the outer electrode and _{362 i-1, j-1} , and the external electrodes _{364 i-1, j} of the unit region _{r i-1, j,} the unit region _{r i,} the external electrodes ₃₆₆ of the _{j-1 i, j-1} and the electrical (See FIG. 8).

In this way, all the external electrodes formed on the second surface 14 of the collective substrate 10 are electrically connected to the via electrodes provided in any one of the through holes 20 _{k and l} , respectively. In addition, as described above, the via electrodes provided in the through holes 20 _{1, j} , 20 _{2, j} ,..., 20 _{M + 1, j} arranged in the Z′-axis direction (first direction) 10 are electrically connected to each other through the respective electrodes on the first surface 12 (see FIG. 7). Accordingly, on the second surface 14, as with the first surface 12, the external electrodes 360 _{i, j} , 362 electrically connected to the via electrodes (first via electrodes) provided in the through holes 20 _{i, j} . _{i-1, j-} 1,364 _{i-1, j} , 366 _{i, j-1} (back surface electrode) and via electrodes (second via electrodes) provided in the through holes 20 _{i + 1, j} The connected external electrodes 360 _{i + 1, j} , 362 _{i, j−1} , 364 _{i, j} , 366 _{i + 1, j−1} (back electrode) are electrically connected to each other.

Due to the arrangement of the electrode layers described above, all the electrode layers formed in the first surface 12, the second surface 14, and the through holes _{20k, l} of the collective substrate 10 are electrically connected.

The collective substrate 10 manufactured by the above-described manufacturing method includes a substrate placement region Rin having a plurality of unit regions rm _{, n} , a peripheral region Rout located outside the substrate placement region Rin, the substrate placement region Rin, and the peripheral region. And an electrode layer 400 provided on Rout. Electrode layer 400 includes a plurality of unit regions r _m, the through hole 20 k formed at the intersection of the boundary of _n, and via electrodes provided in _l, the unit region r _m of the second surface of the collective substrate 10 _{, N} provided at the four corners and externally connected to the corresponding via electrode 360, 362, 364, 366 (back surface electrode) and the substrate placement region Rin, Lead electrodes 350 _{m, n} , 352 _{m, n} (first wiring paths) that are electrically connected in the Z′-axis direction to form the electrode group 60 _h and the peripheral region Rout, and the electrode group 60 _{h is connected} to the X-axis A wiring path 32 (second wiring path) electrically connected in the direction. Also, the unit region _{r i, j} (first unit area) leading electrode provided on the _{350 i, j} and the unit region _{r i, j-1} lead electrode ₃₅₂ provided on the (second unit area) _{i, j −1} are connected at the central part of the long side in contact with the other unit region, respectively, so that the external electrode electrically connected to the via electrode 20 _{i, j} (first via electrode) and the via electrode 20 An external electrode electrically connected to _{i + 1, j} (second via electrode) is electrically connected to each other. The plurality of via electrodes arranged in the X-axis direction are electrically insulated from each other in the substrate arrangement region Rin.

The collective substrate 10 manufactured by the above-described manufacturing method has an extraction electrode that connects the center of the long side boundary line without providing the extraction electrode on the short side boundary line in each unit region rm _{, n} . Thus, the electrodes can be electrically connected. Thereby, compared with the case where the extraction electrode is provided also on the short side, the end surface of the extraction electrode after cutting of the collective substrate 10 (that is, the exposed portion of Ag when the conductive paste is Ag) and the through electrode are provided in the through hole. The distance from the end face of the formed via electrode (that is, the exposed portion of Ag when the conductive paste is Ag) can be increased, and the risk of occurrence of migration is reduced.

In addition, by electrically connecting the electrode layers with the extraction electrode, it is not necessary to surround the power supply wiring for each unit region, and the number of individual substrates to be collected per collective substrate is increased.

In addition, by applying the electroplating method, a thicker plating electrode layer is formed in a shorter processing time than when the electroless plating method is applied, and diffusion of the underlying electrode to the plating electrode layer is suppressed. The reliability of electrode conduction is improved. Furthermore, it is possible to form an electrode layer excellent in oxidation resistance and sulfidation resistance at a lower cost than in the case where the electrode layer is formed only by baking a metal such as Ag or Au without plating.

Furthermore, in the present embodiment, extraction electrodes 350 and 352 are formed on the first surface 12 (mounting surface of the piezoelectric vibration element) of the collective substrate 10. That is, when an individual substrate obtained from the collective substrate 10 is applied to a piezoelectric vibrator and the piezoelectric vibrator is mounted on a mounting substrate, the extraction electrodes 350 and 352 remain on the surface opposite to the mounting surface of the substrate. It will be. Therefore, as disclosed in Patent Document 1, the surface wiring of the mounting substrate at the time of mounting the piezoelectric vibrator is compared with the configuration in which the extraction electrode is formed on the second surface (the mounting surface on the mounting substrate) of the collective substrate. Generation | occurrence | production of the short circuit with an extraction electrode can be suppressed. Thereby, the freedom degree of design, such as a piezoelectric vibrator on a mounting board, improves.

<Method for manufacturing piezoelectric vibrator>
Next, a manufacturing method of the piezoelectric vibrator 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 9. Here, FIG. 9 is a flowchart showing a method of manufacturing the piezoelectric vibrator 1 according to the first embodiment of the present invention.

First, by dividing the assembled board 10 to the electrode layer 400 is formed a unit area _{r m,} each _n, obtained plurality of individual substrates _{P m,} the _n (S100 in FIG. 9). Specifically, the collective substrate 10 is cut by dicing or the like to obtain the individual substrates P _{m, n} and the peripheral region Rout is processed and removed.

Next, the piezoelectric vibration element 100 is mounted on the first surface 302 of the obtained arbitrary individual substrate (hereinafter described as the above-described substrate 300) (S200 in FIG. 9). For example, the piezoelectric vibration element 100 is supported on the first surface 302 (front surface) of the substrate 300 via the conductive holding members 340 and 342 so as to be excited (see FIG. 1).

Next, the lid member 200 is joined to the first surface 302 of the substrate 300 via the joining material 250, and the piezoelectric vibration element 100 is hermetically sealed in an internal space (cavity) surrounded by the lid member 200 and the substrate 300. (S300 in FIG. 9). Thereby, the piezoelectric vibrator 1 is manufactured.

== Modification of First Embodiment ==
Next, with reference to FIG. 10, a modified example of the collective substrate (collective substrate 10A) according to the first embodiment will be described. In the following modified examples and embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.

FIG. 10 is a plan view of the first surface 12A of the collective substrate 10A according to a modification of the first embodiment of the present invention. In this embodiment, the collective substrate 10A includes an electrode layer 400A. The electrode layer 400A has dummy electrodes 324 _{m, n} , 326 _{m, n} in each unit region rm _{, n} compared to the electrode layer 400 formed on the first surface 12 of the collective substrate 10 shown in FIG. There is no difference.

Even in such a configuration, the same effect as in the first embodiment described above can be obtained.

== Second Embodiment ==
Next, with reference to FIG.11 and FIG.12, the collective substrate (collective substrate 10B) which concerns on 2nd Embodiment of this invention is demonstrated.

FIG. 11 is a plan view of the first surface 12B of the collective substrate 10B according to the second embodiment of the present invention, and FIG. 12 is a plan view of the second surface 14B of the collective substrate 10B according to the second embodiment of the present invention. FIG. In the present embodiment, as shown in FIG. 12, the second substrate 14 </ b> B (back surface) of the collective substrate 10 </ b> B is assembled at a point where a plurality of via electrodes arranged in the Z′-axis direction are electrically connected. Different from the substrate 10.

As shown in FIG. 12, the collective substrate 10B includes an electrode layer 400B. In the electrode layer 400B, external electrodes 370, 372, 374, 376, lead electrodes 380, 382, and wiring paths 36, 38 are formed on the second surface 14B (back surface) of the collective substrate 10B. The structures of the external electrodes 370, 372, 374, 376 and the wiring paths 36, 38 are the same as those of the external electrodes 360, 362, 364, 366 shown in FIG. 8 and the wiring paths 32, 34 shown in FIG. Therefore, detailed description is omitted.

Similar to the first surface 12 of the collective substrate 10, the unit region r _{i, j} (first unit region) and the unit region r _{i, j-1} (second unit region) adjacent in the X-axis direction (second direction). Pay attention to. In the unit region r _{i, j} , the extraction electrode 380 _{i, j} (first extraction electrode) electrically connected to the external electrode 374 _{i, j} is extracted in the negative direction of the Z′-axis, and then the unit region r _{i. , J} is drawn out toward the center of the long side in contact with the unit region r _{i, j−1} . Also, the unit region _{r i,} the unit area adjacent to the X-axis negative direction side of the _{j r i,} in _j-1, the external electrodes _{376 i, j-1} electrically connected to the lead electrode _{382 i, j-1} The (second extraction electrode) is formed by being extracted toward the central portion of the long side contacting the unit region r _{i, j} in the unit region r _{i, j-1} after being extracted in the positive direction of the Z ′ axis. . That is, the extraction electrode 380 _{i, j} and the extraction electrode 382 _{i, j−1} are formed to be connected to each other at the center of the boundary line between the unit region r _{i, j} and the unit region r _{i, j−1.} (See FIG. 12).

With the above-described configuration, the via electrodes (first via electrodes) provided in the through holes 20 _{i, j} are the external electrodes 376 _{i, j−1} , the extraction electrodes 382 _{i, j−1} , and the extraction electrodes 380 _{i, j.} Are electrically connected to via electrodes (second via electrodes) provided in the through holes 20 _{i + 1, j} through the external electrodes 374 _{i, j} . In this way, via electrodes (a group of via electrodes) provided in the through holes 20 _{1, j} , 20 _{2, j} ,..., 20 _{M + 1, j} arranged in the Z′-axis direction are aggregated substrates. 380 _{M, j} and extraction electrodes 382 _{1, j−1} , 382 _{2, j−1} ,... Provided on the second surface 14 _</ b> B of 10 _< / _b > B. .., 382 _{M, j−1} (first wiring path) and are electrically connected to each other across the unit region in the substrate placement region Rin, and the electrode group 62 _h (h = 1, 2,..., N + 1) ) (62 _j in FIG. 12).

As for the electrodes formed on the first surface 12B of the collective substrate 10B, all the electrodes are electrically connected to the via electrodes provided in the corresponding through holes as already described. Accordingly, all the electrode layers 400B formed on the collective substrate 10B are electrically connected. In the present embodiment, since the plurality of via electrodes are electrically connected via the wiring path formed on the second surface 14B, the plurality of via electrodes are formed on the first surface 12B of the collective substrate 10B. There is no need for electrical connection. Therefore, as shown in FIG. 11, the electrode layer 400B formed on the first surface 12B of the collective substrate 10B may not have the extraction electrodes 350 _{m, n} , 352 _{m, n} shown in FIG. .

With the above-described configuration, the same effect as that of the above-described collective substrate 10 can be obtained also in this embodiment. In the present embodiment, the extraction electrodes 380 and 382 are formed on the second surface 14B of the collective substrate 10B. The extraction electrodes are divided into individual substrates, and then the back surface of each individual substrate (the mounting surface on the mounting substrate). ) Will remain in the surrounding area. Therefore, compared to the configuration in which the extraction electrode is formed on the diagonal line so as to block the entire mounting surface of the individual substrate as disclosed in Patent Document 1, the occurrence of a short circuit between the surface wiring of the mounting substrate and the extraction electrode is reduced. Risk is reduced. In the present embodiment, the configuration is shown in which the external electrodes 374 and 376 (dummy electrodes) are electrically connected via the extraction electrodes 380 and 382 on the second surface 14B of the collective substrate 10B. The external electrodes 370 and 372 (that is, external electrodes electrically connected to the connection electrodes 320 and 322) may be electrically connected via the extraction electrode. Also in the present embodiment, as in the collective substrate 10A shown in FIG. 10, the first surface 12B may not have the dummy electrodes 324 _{m, n} , 326 _{m, n} .

The exemplary embodiments of the present invention have been described above. Collective substrate 10,10A the piezoelectric vibrating element mounting method of 10B, the unit region _{r i,} lead electrodes provided on the _{j 350} i, j, _{380 i,} and _j, the unit region _{r i,} in _j-1 The provided extraction electrodes 352 _{i, j−1} , 382 _{i, j−1} are connected to each other at the center of the long side, thereby forming the unit regions r _{i, j} , r _{i, j−. And} electrically connecting via electrodes arranged side by side in the long side direction on the boundary line between the two. As a result, the occurrence of migration due to the presence of the extraction electrode can be suppressed on the short side of each unit region, and the cut surface of the extraction electrode and the inside of the through hole can be suppressed on the long side of each unit region. Since the distance from the cut surface of the via electrode provided in the is long, the risk of occurrence of migration is reduced. Therefore, the reliability of electrical connection can be improved.

In addition, the manufacturing method of the collective substrates 10 and 10A for mounting the piezoelectric vibration elements is such that the extraction electrodes 350 _{i, j} , 352 _{i, j-1} are connected to the first surfaces 12 and 12A of the collective substrates 10 and 10A (mounting of the piezoelectric vibration elements). Surface). As a result, compared to the method of forming the extraction electrode on the second surfaces 14 and 14A (the mounting surface on the mounting substrate) of the collective substrate, the short-circuit between the surface wiring of the mounting substrate and the extraction electrode when the piezoelectric vibrator is mounted Occurrence can be suppressed.

In addition, the manufacturing method of the collective substrates 10 and 10A for mounting the piezoelectric vibration elements includes forming surface via peripheral electrodes corresponding to the via electrodes 20k _{and l} on the first surfaces 12 and 12A of the collective substrates 10 and 10A. Including.

In addition, the method for manufacturing the collective substrates 10 and 10A for mounting the piezoelectric vibration element includes the extraction electrodes 320a and 322a provided in the unit regions where the surface via peripheral electrodes are opposed to each other with the via electrode interposed therebetween. 322a includes being connected to connection electrodes 320 and 322 for connecting the piezoelectric vibration element. The configuration of the surface via surrounding electrode is not limited to this.

Further, in the method of manufacturing the collective substrates 10 and 10A for mounting the piezoelectric vibration elements, the surface via peripheral electrodes are provided in other unit regions facing each other with the via electrodes interposed therebetween, and the area is smaller than the extraction electrodes 320a and 322a. Including having dummy electrodes 324 and 326. The configuration of the surface via surrounding electrode is not limited to this.

Further, the electrode layers 400, 400A, 400B formed on the aggregate substrates 10, 10A, 10B may contain Ag as a main component.

The piezoelectric vibrator 1 is manufactured by dividing the collective substrates 10, 10 </ b> A, and 10 </ b> B to obtain a plurality of individual substrates, mounting the piezoelectric vibration element 100 on the obtained substrate 300, and the substrate 300. It includes joining the lid member 200 to the substrate 300 so as to seal the piezoelectric vibration element 100 above. In addition, the manufacturing method of a piezoelectric vibrator is not restricted to this.

Also, a set of piezoelectric vibrating element mounting substrate 10, 10A, 10B is provided a unit region _{r i,} lead electrodes provided on the _{j 350} i, j, _{380 i,} and _j, the unit region _{r i,} in _j-1 The extracted electrodes 352 _{i, j−1} , 382 _{i, j−1} are connected to each other at the central part of the long side, so that the unit regions r _{i, j} , r _{i, j−} Via electrodes arranged side by side in the long side direction on the boundary line between ₁ are electrically connected. As a result, the occurrence of migration due to the presence of the extraction electrode can be suppressed on the short side of each unit region, and the cut surface of the extraction electrode and the inside of the through hole can be suppressed on the long side of each unit region. Since the distance from the cut surface of the via electrode provided in the is long, the risk of occurrence of migration is reduced. Therefore, the reliability of electrical connection can be improved.

Further, in the collective substrates 10 and 10A for mounting the piezoelectric vibration elements, the extraction electrodes 350 _{i, j} , 352 _{i, j-1} are provided on the first surfaces 12 and 12A (mounting surfaces of the piezoelectric vibration elements) of the collective substrates 10 and 10A. It is formed. As a result, compared to the method of forming the extraction electrode on the second surfaces 14 and 14A (the mounting surface on the mounting substrate) of the collective substrate, the short-circuit between the surface wiring of the mounting substrate and the extraction electrode when the piezoelectric vibrator is mounted. Occurrence can be suppressed.

In addition, in the collective substrates 10 and 10A for mounting the piezoelectric vibration elements, surface via peripheral electrodes corresponding to the via electrodes 20k _{and l} may be formed on the first surfaces 12 and 12A of the collective substrates 10 and 10A.

In addition, the collective substrates 10 and 10A for mounting the piezoelectric vibration element have extraction electrodes 320a and 322a provided in unit regions where the surface via peripheral electrodes face each other with the via electrode interposed therebetween, and the extraction electrodes 320a and 322a are You may connect with the connection electrodes 320 and 322 which connect a piezoelectric vibration element. The configuration of the surface via surrounding electrode is not limited to this.

The collective substrates 10 and 10A for mounting the piezoelectric resonator elements have dummy electrodes 324 having surface via peripheral electrodes provided in other unit regions facing each other with the via electrodes interposed therebetween, and having a smaller area than the extraction electrodes 320a and 322a. , 326 may be included. The configuration of the surface via surrounding electrode is not limited to this.

Each embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention. The present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof. That is, those in which the person skilled in the art appropriately changes the design of each embodiment is also included in the scope of the present invention as long as the features of the present invention are included. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate. In addition, each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.

DESCRIPTION OF SYMBOLS 1 Piezoelectric vibrator 100 Piezoelectric vibration element 110 Piezoelectric substrate 120,130 Excitation electrode 122,132 Extraction electrode 124,134 Connection electrode 200 Lid member 250 Bonding material 300 Substrate 310,312 Electrode pattern 320,322 Connection electrode 320a, 322a, 350, 352, 380, 382 Lead electrode 324, 326 Dummy electrode 330, 332, 334, 336 Via electrode 340, 342 Conductive holding member 360, 362, 364, 366, 370, 372, 374, 376 External electrode 400, 400A, 400B Electrode layer 10, 10A, 10B Collective substrate 20, 22 Through hole 30 Conductive paste 32, 34, 36, 38 Wiring path 40 Plating tank 42 Plating solution 44 Probe 50 Plating electrode layer 60, 62 Electrode group

Claims (13)

1. (A) including a substrate placement area composed of a plurality of unit areas arranged in a grid pattern in a first direction and a second direction orthogonal to each other, and a peripheral area located outside the substrate placement area, and each of the units Providing a collective substrate, wherein the region has a rectangular shape having a long side extending along the first direction and a short side extending along the second direction;
   (B) forming a through-hole penetrating the front surface and the back surface of the collective substrate at a crossing position where boundary lines defining a plurality of unit regions intersect;
   (C) performing a process including electroplating on the collective substrate to form an electrode layer;
   The electrode layer is provided corresponding to the four corners of the unit region on the back surface of the collective substrate and the via electrode provided in the through hole at the intersecting position, and provided at the four corners. A plurality of the back electrodes electrically connected to the via electrodes and a group of via electrodes provided in the substrate arrangement region and extending in an electrically connected manner in the first direction. A first wiring path that electrically connects via electrodes in the first direction; and a second wiring path that is provided in the peripheral region and electrically connects the group of via electrodes in the second direction. ,
   The plurality of unit regions have a first unit region and a second unit region adjacent to each other in the second direction,
   The plurality of via electrodes include a first via electrode and a second via electrode arranged side by side in the first direction on a boundary line between the first unit region and the second unit region,
   The first wiring path is provided in the first unit region and provided in the second unit region, and a first extraction electrode that reaches a central portion of a long side that contacts the second unit region in the first unit region. And a second extraction electrode reaching the center of the long side in contact with the first unit region in the second unit region,
   The first via electrode and the second via electrode are each disposed in the substrate arrangement region so as to be electrically connected to another via electrode arranged in the second direction only in the peripheral region. Are electrically isolated from each other,
   In the above (c),
   The back electrode and the second via electrode electrically connected to the first via electrode by forming the first lead electrode and the second lead electrode by connecting each other at the center of the long side. A method of manufacturing a collective substrate for mounting a piezoelectric vibration element, comprising electrically connecting the back electrodes electrically connected to each other.
2. 2. The method of manufacturing a collective substrate for mounting a piezoelectric vibration element according to claim 1, wherein the first lead electrode and the second lead electrode are provided on the surface of the collective substrate.
3. 3. The method of manufacturing a collective substrate for mounting a piezoelectric vibration element according to claim 2, wherein the electrode layer further includes a surface via surrounding electrode provided corresponding to the via electrode on the surface of the collective substrate.
4. The surface via surrounding electrode has first and second portions provided in unit regions facing each other with the via electrode interposed therebetween,
   The method for manufacturing a collective substrate for mounting a piezoelectric vibration element according to claim 3, wherein the first and second portions are connected to a connection electrode for connecting the piezoelectric vibration element.
5. The surface via peripheral electrode has third and fourth portions provided in other unit regions facing each other with the via electrode interposed therebetween,
   5. The method for manufacturing a collective substrate for mounting a piezoelectric vibration element according to claim 4, wherein the third and fourth portions have a smaller area than the first and second portions.
6. The method for manufacturing a collective substrate for mounting a piezoelectric vibration element according to any one of claims 1 to 5, wherein the electrode layer contains Ag as a main component.
7. A method for manufacturing a collective substrate for mounting a piezoelectric vibration element according to any one of claims 1 to 6,
   After (c), dividing the collective substrate to obtain a plurality of individual substrates for mounting piezoelectric vibration elements from the plurality of unit regions,
   Mounting a piezoelectric vibration element on the individual substrate;
   A method for manufacturing a piezoelectric vibrator, comprising: joining a lid member to the individual substrate so as to seal the piezoelectric vibration element on the individual substrate.
8. Composed of a plurality of unit regions arranged in a grid in a first direction and a second direction orthogonal to each other, each unit region has a long side extending along the first direction and a short side extending along the second direction. A substrate arrangement region having a rectangular shape with sides;
   A peripheral region located outside the substrate placement region;
   An assembly substrate comprising the substrate placement region and the electrode layer provided in the peripheral region,
   The electrode layer includes a via electrode provided in a through-hole penetrating a front surface and a back surface of the collective substrate at a crossing position where boundaries defining the plurality of unit regions intersect, and the back surface of the collective substrate on the back surface A back electrode provided corresponding to the four corners of the unit region and electrically connected to the via electrode provided in the four corners; provided in the substrate placement region; and in the first direction. A plurality of the via electrodes electrically connected in the first direction so as to form a group of via electrodes that are electrically connected and extended; A second wiring path that electrically connects the via electrode in the second direction,
   The plurality of unit regions have a first unit region and a second unit region adjacent to each other in the second direction,
   The plurality of via electrodes include a first via electrode and a second via electrode arranged side by side in the first direction on a boundary line between the first unit region and the second unit region,
   The first wiring path is provided in the first unit region and provided in the second unit region, and a first extraction electrode that reaches a central portion of a long side that contacts the second unit region in the first unit region. And a second extraction electrode reaching the center of the long side in contact with the first unit region in the second unit region,
   The first via electrode and the second via electrode are each disposed in the substrate arrangement region so as to be electrically connected to another via electrode arranged in the second direction only in the peripheral region. Are electrically isolated from each other,
   The first extraction electrode and the second extraction electrode are connected to each other at the center part of the long side, so that the back electrode electrically connected to the first via electrode and the second via electrode are electrically connected to each other. A collective substrate for mounting a piezoelectric vibration element, wherein the back electrodes connected to each other are electrically connected to each other.
9. 9. The collective substrate for mounting a piezoelectric vibration element according to claim 8, wherein the first lead electrode and the second lead electrode are provided on the surface of the collective substrate.
10. 10. The collective substrate for mounting a piezoelectric vibration element according to claim 9, wherein the electrode layer further includes a surface via surrounding electrode provided corresponding to the via electrode on the surface of the collective substrate.
11. The surface via surrounding electrode has first and second portions provided in unit regions facing each other with the via electrode interposed therebetween,
    The collective substrate for mounting a piezoelectric vibration element according to claim 10, wherein the first and second portions are connected to a connection electrode that connects the piezoelectric vibration element.
12. The surface via peripheral electrode has third and fourth portions provided in other unit regions facing each other with the via electrode interposed therebetween,
    The collective substrate for mounting a piezoelectric vibration element according to claim 11, wherein the third and fourth portions have a smaller area than the first and second portions.
13. The assembly substrate for mounting a piezoelectric vibration element according to any one of claims 8 to 12, wherein the electrode layer contains Ag as a main component.

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