JP2013140876A - 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 - Google Patents

電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 Download PDF

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Publication number
JP2013140876A
JP2013140876A JP2012000502A JP2012000502A JP2013140876A JP 2013140876 A JP2013140876 A JP 2013140876A JP 2012000502 A JP2012000502 A JP 2012000502A JP 2012000502 A JP2012000502 A JP 2012000502A JP 2013140876 A JP2013140876 A JP 2013140876A
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JP
Japan
Prior art keywords
metal lid
electronic device
metallized layer
ceramic substrate
piezoelectric
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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JP2012000502A
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English (en)
Japanese (ja)
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JP2013140876A5 (https=
Inventor
Hideo Miyasaka
英男 宮坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2012000502A priority Critical patent/JP2013140876A/ja
Publication of JP2013140876A publication Critical patent/JP2013140876A/ja
Publication of JP2013140876A5 publication Critical patent/JP2013140876A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012000502A 2012-01-05 2012-01-05 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 Withdrawn JP2013140876A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012000502A JP2013140876A (ja) 2012-01-05 2012-01-05 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012000502A JP2013140876A (ja) 2012-01-05 2012-01-05 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器

Publications (2)

Publication Number Publication Date
JP2013140876A true JP2013140876A (ja) 2013-07-18
JP2013140876A5 JP2013140876A5 (https=) 2015-01-29

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JP2012000502A Withdrawn JP2013140876A (ja) 2012-01-05 2012-01-05 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器

Country Status (1)

Country Link
JP (1) JP2013140876A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018113716A (ja) * 2018-03-12 2018-07-19 セイコーエプソン株式会社 電子デバイス、電子デバイス用回路基板、電子機器、移動体
JP2020036179A (ja) * 2018-08-30 2020-03-05 日本電波工業株式会社 圧電デバイス
JP7652160B2 (ja) 2022-09-08 2025-03-27 株式会社村田製作所 電子部品パッケージ及び電子部品パッケージの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179373A (ja) * 2002-11-27 2004-06-24 Kinseki Ltd 電子部品パッケ−ジとその封止方法
JP2011066651A (ja) * 2009-09-17 2011-03-31 Kyocera Kinseki Corp 圧電デバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179373A (ja) * 2002-11-27 2004-06-24 Kinseki Ltd 電子部品パッケ−ジとその封止方法
JP2011066651A (ja) * 2009-09-17 2011-03-31 Kyocera Kinseki Corp 圧電デバイス

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018113716A (ja) * 2018-03-12 2018-07-19 セイコーエプソン株式会社 電子デバイス、電子デバイス用回路基板、電子機器、移動体
JP2020036179A (ja) * 2018-08-30 2020-03-05 日本電波工業株式会社 圧電デバイス
JP7652160B2 (ja) 2022-09-08 2025-03-27 株式会社村田製作所 電子部品パッケージ及び電子部品パッケージの製造方法

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