JP2013120940A5 - - Google Patents

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Publication number
JP2013120940A5
JP2013120940A5 JP2012264236A JP2012264236A JP2013120940A5 JP 2013120940 A5 JP2013120940 A5 JP 2013120940A5 JP 2012264236 A JP2012264236 A JP 2012264236A JP 2012264236 A JP2012264236 A JP 2012264236A JP 2013120940 A5 JP2013120940 A5 JP 2013120940A5
Authority
JP
Japan
Prior art keywords
die
light guide
conductive pad
packaging
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012264236A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013120940A (ja
Filing date
Publication date
Priority claimed from US13/314,023 external-priority patent/US8577190B2/en
Application filed filed Critical
Publication of JP2013120940A publication Critical patent/JP2013120940A/ja
Publication of JP2013120940A5 publication Critical patent/JP2013120940A5/ja
Withdrawn legal-status Critical Current

Links

JP2012264236A 2011-12-07 2012-12-03 オプトカプラ Withdrawn JP2013120940A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/314,023 2011-12-07
US13/314,023 US8577190B2 (en) 2010-03-23 2011-12-07 Optocoupler

Publications (2)

Publication Number Publication Date
JP2013120940A JP2013120940A (ja) 2013-06-17
JP2013120940A5 true JP2013120940A5 (enExample) 2015-12-24

Family

ID=48549382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012264236A Withdrawn JP2013120940A (ja) 2011-12-07 2012-12-03 オプトカプラ

Country Status (2)

Country Link
JP (1) JP2013120940A (enExample)
CN (1) CN103151419A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6445947B2 (ja) * 2015-09-04 2018-12-26 株式会社東芝 光結合装置
US10074639B2 (en) * 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
US10367502B2 (en) * 2017-04-25 2019-07-30 Avago Technologies International Sales Pte. Limited Isolation device with half duplex channel
CN107799512B (zh) * 2017-11-28 2024-09-13 无锡豪帮高科股份有限公司 一种立体封装集成光耦电路的结构及其方法
CN108155106A (zh) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 一种长爬电光电耦合器的制备工艺
CN108091613B (zh) * 2017-12-25 2020-01-24 无锡少小科技有限公司 调节光电耦合器放大功率的方法
WO2020027721A1 (en) * 2018-07-31 2020-02-06 Ams Sensors Asia Pte. Ltd. Package including portions of a lead frame as electrically conductive leads
CN117529821A (zh) 2021-06-14 2024-02-06 罗姆股份有限公司 绝缘组件
JP7585170B2 (ja) 2021-09-21 2024-11-18 株式会社東芝 半導体装置
CN114141887A (zh) * 2021-11-22 2022-03-04 纽威仕微电子（无锡）有限公司 一种光电转换电路封装工艺

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