JP2013120940A5 - - Google Patents
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- Publication number
- JP2013120940A5 JP2013120940A5 JP2012264236A JP2012264236A JP2013120940A5 JP 2013120940 A5 JP2013120940 A5 JP 2013120940A5 JP 2012264236 A JP2012264236 A JP 2012264236A JP 2012264236 A JP2012264236 A JP 2012264236A JP 2013120940 A5 JP2013120940 A5 JP 2013120940A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- light guide
- conductive pad
- packaging
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 claims 34
- 238000004806 packaging method and process Methods 0.000 claims 17
- 230000005693 optoelectronics Effects 0.000 claims 3
- 229920002799 BoPET Polymers 0.000 claims 2
- 239000005041 Mylar™ Substances 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 239000008393 encapsulating agent Substances 0.000 claims 2
- 238000002955 isolation Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/314,023 US8577190B2 (en) | 2010-03-23 | 2011-12-07 | Optocoupler |
| US13/314,023 | 2011-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013120940A JP2013120940A (ja) | 2013-06-17 |
| JP2013120940A5 true JP2013120940A5 (enExample) | 2015-12-24 |
Family
ID=48549382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012264236A Withdrawn JP2013120940A (ja) | 2011-12-07 | 2012-12-03 | オプトカプラ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2013120940A (enExample) |
| CN (1) | CN103151419A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6445947B2 (ja) | 2015-09-04 | 2018-12-26 | 株式会社東芝 | 光結合装置 |
| US10074639B2 (en) * | 2016-12-30 | 2018-09-11 | Texas Instruments Incorporated | Isolator integrated circuits with package structure cavity and fabrication methods |
| US10367502B2 (en) * | 2017-04-25 | 2019-07-30 | Avago Technologies International Sales Pte. Limited | Isolation device with half duplex channel |
| CN107799512B (zh) * | 2017-11-28 | 2024-09-13 | 无锡豪帮高科股份有限公司 | 一种立体封装集成光耦电路的结构及其方法 |
| CN108155106A (zh) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | 一种长爬电光电耦合器的制备工艺 |
| CN108091613B (zh) * | 2017-12-25 | 2020-01-24 | 无锡少小科技有限公司 | 调节光电耦合器放大功率的方法 |
| DE112019003834T5 (de) * | 2018-07-31 | 2021-05-06 | Ams Sensors Asia Pte. Ltd. | GEHÄUSE EINSCHLIEßLICH PORTIONS OF A LEAD FRAME ALS ELEKTRISCH STROMZUFÜHRUNGEN |
| DE112022003053T5 (de) | 2021-06-14 | 2024-04-04 | Rohm Co., Ltd. | Isolationsmodul |
| JP7585170B2 (ja) | 2021-09-21 | 2024-11-18 | 株式会社東芝 | 半導体装置 |
| CN114141887A (zh) * | 2021-11-22 | 2022-03-04 | 纽威仕微电子（无锡）有限公司 | 一种光电转换电路封装工艺 |
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2012
- 2012-12-03 JP JP2012264236A patent/JP2013120940A/ja not_active Withdrawn
- 2012-12-07 CN CN2012105237828A patent/CN103151419A/zh active Pending