JP2013120940A - オプトカプラ - Google Patents

オプトカプラ Download PDF

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Publication number
JP2013120940A
JP2013120940A JP2012264236A JP2012264236A JP2013120940A JP 2013120940 A JP2013120940 A JP 2013120940A JP 2012264236 A JP2012264236 A JP 2012264236A JP 2012264236 A JP2012264236 A JP 2012264236A JP 2013120940 A JP2013120940 A JP 2013120940A
Authority
JP
Japan
Prior art keywords
die
light guide
optical
limiting element
optical transmitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012264236A
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English (en)
Japanese (ja)
Other versions
JP2013120940A5 (enExample
Inventor
Siew Gary Tay Thiam
シアム・シュー・ゲーリー・タイ
Maasi Gopinath
ゴピナス・マーシ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies ECBU IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/314,023 external-priority patent/US8577190B2/en
Application filed by Avago Technologies ECBU IP Singapore Pte Ltd filed Critical Avago Technologies ECBU IP Singapore Pte Ltd
Publication of JP2013120940A publication Critical patent/JP2013120940A/ja
Publication of JP2013120940A5 publication Critical patent/JP2013120940A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
JP2012264236A 2011-12-07 2012-12-03 オプトカプラ Withdrawn JP2013120940A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/314,023 US8577190B2 (en) 2010-03-23 2011-12-07 Optocoupler
US13/314,023 2011-12-07

Publications (2)

Publication Number Publication Date
JP2013120940A true JP2013120940A (ja) 2013-06-17
JP2013120940A5 JP2013120940A5 (enExample) 2015-12-24

Family

ID=48549382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012264236A Withdrawn JP2013120940A (ja) 2011-12-07 2012-12-03 オプトカプラ

Country Status (2)

Country Link
JP (1) JP2013120940A (enExample)
CN (1) CN103151419A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799512A (zh) * 2017-11-28 2018-03-13 无锡豪帮高科股份有限公司 一种立体封装集成光耦电路的结构及其方法
DE112022003053T5 (de) 2021-06-14 2024-04-04 Rohm Co., Ltd. Isolationsmodul
US12094862B2 (en) 2021-09-21 2024-09-17 Kabushiki Kaisha Toshiba Semiconductor device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6445947B2 (ja) 2015-09-04 2018-12-26 株式会社東芝 光結合装置
US10074639B2 (en) * 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
US10367502B2 (en) * 2017-04-25 2019-07-30 Avago Technologies International Sales Pte. Limited Isolation device with half duplex channel
CN108155106A (zh) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 一种长爬电光电耦合器的制备工艺
CN108091613B (zh) * 2017-12-25 2020-01-24 无锡少小科技有限公司 调节光电耦合器放大功率的方法
DE112019003834T5 (de) * 2018-07-31 2021-05-06 Ams Sensors Asia Pte. Ltd. GEHÄUSE EINSCHLIEßLICH PORTIONS OF A LEAD FRAME ALS ELEKTRISCH STROMZUFÜHRUNGEN
CN114141887A (zh) * 2021-11-22 2022-03-04 纽威仕微电子（无锡）有限公司 一种光电转换电路封装工艺

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799512A (zh) * 2017-11-28 2018-03-13 无锡豪帮高科股份有限公司 一种立体封装集成光耦电路的结构及其方法
DE112022003053T5 (de) 2021-06-14 2024-04-04 Rohm Co., Ltd. Isolationsmodul
US12094862B2 (en) 2021-09-21 2024-09-17 Kabushiki Kaisha Toshiba Semiconductor device

Also Published As

Publication number Publication date
CN103151419A (zh) 2013-06-12

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