CN103151419A - 光耦合器 - Google Patents

光耦合器 Download PDF

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Publication number
CN103151419A
CN103151419A CN2012105237828A CN201210523782A CN103151419A CN 103151419 A CN103151419 A CN 103151419A CN 2012105237828 A CN2012105237828 A CN 2012105237828A CN 201210523782 A CN201210523782 A CN 201210523782A CN 103151419 A CN103151419 A CN 103151419A
Authority
CN
China
Prior art keywords
nude film
optical
photoconduction
launcher
limiting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012105237828A
Other languages
English (en)
Chinese (zh)
Inventor
添修·加里·郑
戈皮纳特·马西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Fiber IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/314,023 external-priority patent/US8577190B2/en
Application filed by Avago Technologies Fiber IP Singapore Pte Ltd filed Critical Avago Technologies Fiber IP Singapore Pte Ltd
Publication of CN103151419A publication Critical patent/CN103151419A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
CN2012105237828A 2011-12-07 2012-12-07 光耦合器 Pending CN103151419A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/314,023 2011-12-07
US13/314,023 US8577190B2 (en) 2010-03-23 2011-12-07 Optocoupler

Publications (1)

Publication Number Publication Date
CN103151419A true CN103151419A (zh) 2013-06-12

Family

ID=48549382

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012105237828A Pending CN103151419A (zh) 2011-12-07 2012-12-07 光耦合器

Country Status (2)

Country Link
JP (1) JP2013120940A (enExample)
CN (1) CN103151419A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106501905A (zh) * 2015-09-04 2017-03-15 株式会社东芝 光耦合装置
CN108091613A (zh) * 2017-12-25 2018-05-29 无锡少小科技有限公司 调节光电耦合器放大功率的方法
CN108155106A (zh) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 一种长爬电光电耦合器的制备工艺
CN108736979A (zh) * 2017-04-25 2018-11-02 安华高科技通用Ip(新加坡)公司 隔离装置及隔离系统
CN109952657A (zh) * 2016-12-30 2019-06-28 德州仪器公司 具有封装结构空腔的隔离器集成电路和制造方法
CN112514180A (zh) * 2018-07-31 2021-03-16 ams传感器亚洲私人有限公司 包括作为导电引线的引线框架的部分的封装
CN114141887A (zh) * 2021-11-22 2022-03-04 纽威仕微电子（无锡）有限公司 一种光电转换电路封装工艺

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799512B (zh) * 2017-11-28 2024-09-13 无锡豪帮高科股份有限公司 一种立体封装集成光耦电路的结构及其方法
JPWO2022264980A1 (enExample) 2021-06-14 2022-12-22
JP7585170B2 (ja) 2021-09-21 2024-11-18 株式会社東芝 半導体装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10008626B2 (en) 2015-09-04 2018-06-26 Kabushiki Kaisha Toshiba Optical coupling device
CN106501905A (zh) * 2015-09-04 2017-03-15 株式会社东芝 光耦合装置
CN106501905B (zh) * 2015-09-04 2018-11-09 株式会社东芝 光耦合装置
CN109952657A (zh) * 2016-12-30 2019-06-28 德州仪器公司 具有封装结构空腔的隔离器集成电路和制造方法
CN109952657B (zh) * 2016-12-30 2023-01-13 德州仪器公司 具有封装结构空腔的隔离器集成电路和制造方法
CN108736979A (zh) * 2017-04-25 2018-11-02 安华高科技通用Ip(新加坡)公司 隔离装置及隔离系统
CN108736979B (zh) * 2017-04-25 2021-09-03 安华高科技股份有限公司 隔离装置及隔离系统
CN108155106A (zh) * 2017-12-22 2018-06-12 珠海市大鹏电子科技有限公司 一种长爬电光电耦合器的制备工艺
CN108091613A (zh) * 2017-12-25 2018-05-29 无锡少小科技有限公司 调节光电耦合器放大功率的方法
CN108091613B (zh) * 2017-12-25 2020-01-24 无锡少小科技有限公司 调节光电耦合器放大功率的方法
CN112514180A (zh) * 2018-07-31 2021-03-16 ams传感器亚洲私人有限公司 包括作为导电引线的引线框架的部分的封装
CN112514180B (zh) * 2018-07-31 2024-04-30 ams传感器亚洲私人有限公司 包括作为导电引线的引线框架的部分的封装
CN114141887A (zh) * 2021-11-22 2022-03-04 纽威仕微电子（无锡）有限公司 一种光电转换电路封装工艺

Also Published As

Publication number Publication date
JP2013120940A (ja) 2013-06-17

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130612