JP2013120940A5

JP2013120940A5 -

Info

Publication number: JP2013120940A5
Application number: JP2012264236A
Authority: JP
Filing date: 2012-12-03
Publication date: 2015-12-24

Claims

Packaging for optoelectronic devices,
A body composed of a first part and a second part;
A first optical transmitter die disposed in the first portion of the body and configured to emit light;
A first optical receiver die disposed in the first portion of the body and configured to receive a portion of the light emitted by the first optical transmitter die;
A conductive pad between the first portion and the second portion of the body, the conductive pad being on a second side opposite the first side and the first side; A conductive pad, wherein at least one of the first optical transmitter die and the first optical receiver die is attached to the first side of the conductive pad;
A first light guide configured to transmit light from the first optical transmitter die to the first optical receiver die;
A limiting element configured to limit the first light guide to the first portion of the body;
A mounting layer sandwiched between the second side of the conductive pad and the limiting element to attach the limiting element to the conductive pad;
Packaging comprising an opaque encapsulant encapsulating the first light guide and the limiting element.

The packaging of claim 1 wherein the limiting element is an insulating tape.

Packaging according to claim 1 or 2, wherein the limiting element is reflective.

The packaging according to any of claims 1 to 3, wherein the limiting element is larger than the first light guide.

The packaging according to any of claims 1-4, wherein the limiting element is coupled to the conductive pad to define a surface for receiving the first light guide.

Three materials comprising an isolation layer in which one of the first optical transmitter die and the first optical receiver die is directly attached to the conductive pad and the other is sandwiched between two fixed layers The packaging of any of claims 1-5, attached to the conductive pad through a layer.

The packaging of any of claims 1-6, comprising a second optical transmitter die and a second optical receiver die disposed adjacent to the first side of the conductive pad.

The packaging of claim 7, wherein the second optical transmitter die and the second optical receiver die are encapsulated within the first light guide.

8. The packaging of claim 7, further comprising a second light guide encapsulating the second light transmitter die and the second light receiver die, wherein the second light guide is defined by the limiting element. Packaging limited to the first portion of the body.

The packaging of claim 9, wherein the first light guide and the second light guide are optically separated.

A second light guide enclosing the second optical transmitter die and the second optical receiver die;
8. The packaging of claim 7, further comprising a second restricting element configured to limit the second light guide to the first portion of the body.

The packaging of claim 1, wherein the first optical transmitter die is attached to the conductive pad and the first optical receiver die is attached to another conductive pad.

The packaging according to any of the preceding claims, wherein the packaging forms part of an optocoupler.

13. Packaging according to any of claims 1 to 10, wherein the limiting element is made from one of Mylar, polyimide and Melinex.

An optocoupler,
A body composed of a first part and a second part;
A first optical transmitter die disposed in the first portion of the body and configured to emit light;
A first optical receiver die disposed in the first portion of the body and configured to receive light emitted by the first optical transmitter die;
A plurality of conductive leads, wherein at least one lead of the plurality of lead wires is attached to at least one of the first optical transmitter die and the first optical receiver die. The conductive pad is between the first portion and the second portion of the body, and the conductive pad is on the first side and on the opposite side of the first side. A plurality of conductive leads having a second side;
A mounting layer;
A tape attached to the second side of the conductive pad via the mounting layer such that the mounting layer is sandwiched between the tape and the conductive pad When,
A light guide encapsulating the first optical transmitter die and the first optical receiver die so as to transmit light from the first transmitter die to the first optical receiver die A configured light guide;
An opaque encapsulant encapsulating the first light guide and the tape;
At least one of the first optical transmitter die and the first optical receiver die is attached to the first side of the conductive pad;
The tape is an optocoupler configured to limit the light guide to the first portion of the body.

The optocoupler of claim 15, wherein the tape is a dielectric film.

The optocoupler of claim 15 or 16, wherein the tape is reflective.

Three material layers comprising one of the first optical transmitter die and the first optical receiver die attached directly to the conductive pad and the other being an isolation layer sandwiched between two fixed layers The optocoupler of claim 15, wherein the optocoupler is attached to the conductive pad via

The optocoupler of any of claims 15-18, wherein the tape is made from one of Mylar, polyimide, and Melinex.

An optoelectronic device,
A body composed of a first part and a second part;
An optical transmitter die disposed in the first portion of the body and configured to emit light;
An optical receiver die disposed in the first portion of the body and configured to receive light emitted by the optical transmitter die;
A plurality of conductive leads, wherein the optical transmitter die and the optical receiver die are attached to at least one conductive lead of the plurality of conductive leads, the at least one A plurality of conductive leads between the first portion and the second portion of the body;
A light guide encapsulating the light transmitter die and the light receiver die, the light guide configured to transmit light from the light transmitter die to the light receiver die;
An insulating tape attached to the at least one conductive lead, the insulating tape configured to limit the light guide to the first portion of the body;
An optoelectronic device comprising an attachment layer sandwiched between the at least one conductive lead and the insulating tape for attaching the insulating tape to the at least one conductive lead.