JP2014187081A5 - - Google Patents

Claims (10)

A metal member;
A white resist disposed on and in contact with the metal member;
Ri bonding surface Do an insulating member, a light emitting element disposed via a bonding member on the white resist,
A wire for electrically connecting the light emitting element and the metal member;
A frame body made of a light reflective member and disposed so as to surround the light emitting element,
The light emitting device , wherein the white resist includes an opening that opens a connection region between the metal member and the wire, and the opening is covered with the frame . The light emitting device according to claim 1, wherein the light emitting element includes a semiconductor layer on a light transmitting substrate.   The light emitting device according to claim 1, wherein the metal member is a metal layer disposed on an insulating substrate.   The light emitting device according to claim 1, wherein the white resist has a thickness of 5 μm to 50 μm.   The light emitting device according to claim 1, wherein the metal member has a thickness of 5 μm to 100 μm.   The light emitting device according to claim 1, wherein at least a surface of the metal member is Ag.   The light emitting device according to claim 1, wherein the white resist is formed so as to correspond to the entire bonding surface of the light emitting element.   7. The metal member is exposed by opening a part of the white resist near the center of the joint surface between the white resist and the light emitting element. 8. 2. The light emitting device according to item 1.   The light emitting device according to claim 1, wherein the white resist is laminated in two or more layers.   10. The light emitting device according to claim 1, wherein an entire surface of the metal member located inside the frame body is covered with the white resist in a plan view.